AU2001282321A1 - Coating removal - Google Patents
Coating removalInfo
- Publication number
- AU2001282321A1 AU2001282321A1 AU2001282321A AU8232101A AU2001282321A1 AU 2001282321 A1 AU2001282321 A1 AU 2001282321A1 AU 2001282321 A AU2001282321 A AU 2001282321A AU 8232101 A AU8232101 A AU 8232101A AU 2001282321 A1 AU2001282321 A1 AU 2001282321A1
- Authority
- AU
- Australia
- Prior art keywords
- coating removal
- removal
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/138—Manufacture of transparent electrodes, e.g. transparent conductive oxides [TCO] or indium tin oxide [ITO] electrodes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB0021747.1A GB0021747D0 (en) | 2000-09-04 | 2000-09-04 | Coating removal |
| GB0021747 | 2000-09-04 | ||
| PCT/GB2001/003789 WO2002021882A1 (en) | 2000-09-04 | 2001-08-22 | Coating removal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001282321A1 true AU2001282321A1 (en) | 2002-03-22 |
Family
ID=9898857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001282321A Abandoned AU2001282321A1 (en) | 2000-09-04 | 2001-08-22 | Coating removal |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6893326B2 (en) |
| EP (1) | EP1338176A1 (en) |
| JP (1) | JP2004508690A (en) |
| AU (1) | AU2001282321A1 (en) |
| GB (1) | GB0021747D0 (en) |
| WO (1) | WO2002021882A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7112121B2 (en) | 2000-08-30 | 2006-09-26 | Micron Technology, Inc. | Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate |
| TW200811169A (en) * | 2006-05-26 | 2008-03-01 | Astrazeneca Ab | Chemical compounds |
| US7923272B2 (en) * | 2007-12-28 | 2011-04-12 | Hwang-Pao Lee | Method of forming a resin cover lens of LED assembly |
| US9352509B1 (en) * | 2013-05-08 | 2016-05-31 | The Boeing Company | Tools and methods for use in removing a coating |
| DE102017219110A1 (en) * | 2017-10-25 | 2019-04-25 | Onsystem Technic Gmbh | masking template |
| CN112534589B (en) * | 2018-04-06 | 2024-10-29 | 迈可晟太阳能有限公司 | Local patterning and metallization of semiconductor structures using laser beams |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS511550B1 (en) * | 1971-02-20 | 1976-01-19 | ||
| JPS5432771A (en) | 1977-08-17 | 1979-03-10 | E Systems Inc | Method of forming thin film pattern on microelectronic engineering body |
| JPS5565072A (en) * | 1978-11-02 | 1980-05-16 | Asaka Shokai:Kk | Harmless sandblasting method |
| US4232059A (en) * | 1979-06-06 | 1980-11-04 | E-Systems, Inc. | Process of defining film patterns on microelectronic substrates by air abrading |
| US4288269A (en) * | 1979-12-21 | 1981-09-08 | Boeing Aerospace Co. | Removal of protective paper tape and maskants |
| JPS57138563A (en) * | 1981-02-17 | 1982-08-26 | Fujitsu Ltd | Method of grinding thin film pattern |
| JPH02107787A (en) | 1988-10-15 | 1990-04-19 | Hitake Seiko Kk | Formation of metal pattern |
| TW587185B (en) * | 1997-06-26 | 2004-05-11 | Du Pont | Multi-domain STN LCD comprising fluorinated polyimide alignment layers |
| US6099388A (en) * | 1997-08-06 | 2000-08-08 | Fritsch; Joseph F | Method and apparatus for repairing a damaged compact disc |
| EP1101572B1 (en) * | 1999-11-15 | 2006-06-14 | Bobby Hu | Method for processing a hand tool |
| US6561872B2 (en) * | 2001-06-11 | 2003-05-13 | General Electric Company | Method and apparatus for stripping coating |
| US6699356B2 (en) * | 2001-08-17 | 2004-03-02 | Applied Materials, Inc. | Method and apparatus for chemical-mechanical jet etching of semiconductor structures |
-
2000
- 2000-09-04 GB GBGB0021747.1A patent/GB0021747D0/en not_active Ceased
-
2001
- 2001-08-22 US US10/363,588 patent/US6893326B2/en not_active Expired - Fee Related
- 2001-08-22 JP JP2002526156A patent/JP2004508690A/en not_active Withdrawn
- 2001-08-22 EP EP01960934A patent/EP1338176A1/en not_active Withdrawn
- 2001-08-22 WO PCT/GB2001/003789 patent/WO2002021882A1/en not_active Ceased
- 2001-08-22 AU AU2001282321A patent/AU2001282321A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| GB0021747D0 (en) | 2000-10-18 |
| JP2004508690A (en) | 2004-03-18 |
| WO2002021882A1 (en) | 2002-03-14 |
| US20040014397A1 (en) | 2004-01-22 |
| EP1338176A1 (en) | 2003-08-27 |
| US6893326B2 (en) | 2005-05-17 |
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