AU2001280684A1 - Vertically integrated chip on chip circuit stack - Google Patents
Vertically integrated chip on chip circuit stackInfo
- Publication number
- AU2001280684A1 AU2001280684A1 AU2001280684A AU8068401A AU2001280684A1 AU 2001280684 A1 AU2001280684 A1 AU 2001280684A1 AU 2001280684 A AU2001280684 A AU 2001280684A AU 8068401 A AU8068401 A AU 8068401A AU 2001280684 A1 AU2001280684 A1 AU 2001280684A1
- Authority
- AU
- Australia
- Prior art keywords
- chip
- vertically integrated
- circuit stack
- integrated chip
- chip circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H10W90/00—
-
- H10W72/5473—
-
- H10W72/5522—
-
- H10W72/5524—
-
- H10W72/884—
-
- H10W74/00—
-
- H10W90/231—
-
- H10W90/291—
-
- H10W90/732—
-
- H10W90/734—
-
- H10W90/736—
-
- H10W90/754—
-
- H10W90/756—
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US62001100A | 2000-07-20 | 2000-07-20 | |
| US09620011 | 2000-07-20 | ||
| PCT/US2001/023018 WO2002009181A1 (en) | 2000-07-20 | 2001-07-20 | Vertically integrated chip on chip circuit stack |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001280684A1 true AU2001280684A1 (en) | 2002-02-05 |
Family
ID=24484224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001280684A Abandoned AU2001280684A1 (en) | 2000-07-20 | 2001-07-20 | Vertically integrated chip on chip circuit stack |
Country Status (2)
| Country | Link |
|---|---|
| AU (1) | AU2001280684A1 (en) |
| WO (1) | WO2002009181A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100411170C (en) * | 2005-05-30 | 2008-08-13 | 矽品精密工业股份有限公司 | Multi-chip stack structure |
| US7485969B2 (en) | 2005-09-01 | 2009-02-03 | Micron Technology, Inc. | Stacked microelectronic devices and methods for manufacturing microelectronic devices |
| SG130073A1 (en) * | 2005-09-01 | 2007-03-20 | Micron Technology Inc | Stacked microelectronic devices and methods for manufacturing microelectronic devices |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5291061A (en) * | 1993-04-06 | 1994-03-01 | Micron Semiconductor, Inc. | Multi-chip stacked devices |
| US5323060A (en) * | 1993-06-02 | 1994-06-21 | Micron Semiconductor, Inc. | Multichip module having a stacked chip arrangement |
| US5442230A (en) * | 1994-09-16 | 1995-08-15 | National Semiconductor Corporation | High density integrated circuit assembly combining leadframe leads with conductive traces |
| KR0147259B1 (en) * | 1994-10-27 | 1998-08-01 | 김광호 | Stack type semiconductor package and method for manufacturing the same |
| US6005778A (en) * | 1995-06-15 | 1999-12-21 | Honeywell Inc. | Chip stacking and capacitor mounting arrangement including spacers |
-
2001
- 2001-07-20 WO PCT/US2001/023018 patent/WO2002009181A1/en not_active Ceased
- 2001-07-20 AU AU2001280684A patent/AU2001280684A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| WO2002009181A1 (en) | 2002-01-31 |
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