AU2001277013A1 - Flip chip substrate design - Google Patents

Flip chip substrate design

Info

Publication number: AU2001277013A1
Authority: AU; Australia
Prior art keywords: flip chip; chip substrate; substrate design; design; flip
Prior art date: 2000-07-19
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

AU2001277013A

Inventor

Honorio T. Granada Jr.

Rajeev Joshi

Connie Tangpuz

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Fairchild Semiconductor Corp

Original Assignee

Fairchild Semiconductor Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-07-19

Filing date

2001-07-18

Publication date

2002-01-30

2001-07-18 Application filed by Fairchild Semiconductor Corp filed Critical Fairchild Semiconductor Corp

2002-01-30 Publication of AU2001277013A1 publication Critical patent/AU2001277013A1/en

Status Abandoned legal-status Critical Current

Classifications

- H10W74/111—
- H10W76/161—
- H10W72/20—
- H10W72/252—
- H10W72/29—
- H10W72/923—

AU2001277013A 2000-07-19 2001-07-18 Flip chip substrate design Abandoned AU2001277013A1 (en)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
US09/619,115 US6661082B1 (en)	2000-07-19	2000-07-19	Flip chip substrate design
US09619115		2000-07-19
PCT/US2001/022798 WO2002007217A1 (en)	2000-07-19	2001-07-18	Flip chip substrate design

Publications (1)

Publication Number	Publication Date
AU2001277013A1 true AU2001277013A1 (en)	2002-01-30

Family

ID=24480517

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU2001277013A Abandoned AU2001277013A1 (en)	2000-07-19	2001-07-18	Flip chip substrate design

Country Status (6)

Country	Link
US (2)	US6661082B1 (en)
JP (1)	JP2004504724A (en)
CN (1)	CN1240129C (en)
AU (1)	AU2001277013A1 (en)
DE (1)	DE10196439T1 (en)
WO (1)	WO2002007217A1 (en)

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US6720642B1 (en) *	1999-12-16	2004-04-13	Fairchild Semiconductor Corporation	Flip chip in leaded molded package and method of manufacture thereof
US6989588B2 (en) *	2000-04-13	2006-01-24	Fairchild Semiconductor Corporation	Semiconductor device including molded wireless exposed drain packaging
US6870254B1 (en)	2000-04-13	2005-03-22	Fairchild Semiconductor Corporation	Flip clip attach and copper clip attach on MOSFET device
US6661082B1 (en) *	2000-07-19	2003-12-09	Fairchild Semiconductor Corporation	Flip chip substrate design
US6798044B2 (en) *	2000-12-04	2004-09-28	Fairchild Semiconductor Corporation	Flip chip in leaded molded package with two dies
US6753605B2 (en) *	2000-12-04	2004-06-22	Fairchild Semiconductor Corporation	Passivation scheme for bumped wafers
US6469384B2 (en) *	2001-02-01	2002-10-22	Fairchild Semiconductor Corporation	Unmolded package for a semiconductor device
US6777786B2 (en) *	2001-03-12	2004-08-17	Fairchild Semiconductor Corporation	Semiconductor device including stacked dies mounted on a leadframe
US6645791B2 (en) *	2001-04-23	2003-11-11	Fairchild Semiconductor	Semiconductor die package including carrier with mask
US7061077B2 (en)	2002-08-30	2006-06-13	Fairchild Semiconductor Corporation	Substrate based unmolded package including lead frame structure and semiconductor die
US20040084508A1 (en) *	2002-10-30	2004-05-06	Advanpack Solutions Pte. Ltd.	Method for constraining the spread of solder during reflow for preplated high wettability lead frame flip chip assembly
US6762495B1 (en) *	2003-01-30	2004-07-13	Qualcomm Incorporated	Area array package with non-electrically connected solder balls
US7217594B2 (en) *	2003-02-11	2007-05-15	Fairchild Semiconductor Corporation	Alternative flip chip in leaded molded package design and method for manufacture
US7196313B2 (en) *	2004-04-02	2007-03-27	Fairchild Semiconductor Corporation	Surface mount multi-channel optocoupler
US7256479B2 (en) *	2005-01-13	2007-08-14	Fairchild Semiconductor Corporation	Method to manufacture a universal footprint for a package with exposed chip
KR101297645B1 (en) *	2005-06-30	2013-08-20	페어차일드 세미컨덕터 코포레이션	Semiconductor die package and method for making the same
US7504733B2 (en)	2005-08-17	2009-03-17	Ciclon Semiconductor Device Corp.	Semiconductor die package
US7560808B2 (en) *	2005-10-19	2009-07-14	Texas Instruments Incorporated	Chip scale power LDMOS device
US7285849B2 (en) *	2005-11-18	2007-10-23	Fairchild Semiconductor Corporation	Semiconductor die package using leadframe and clip and method of manufacturing
US7446375B2 (en) *	2006-03-14	2008-11-04	Ciclon Semiconductor Device Corp.	Quasi-vertical LDMOS device having closed cell layout
US7768075B2 (en)	2006-04-06	2010-08-03	Fairchild Semiconductor Corporation	Semiconductor die packages using thin dies and metal substrates
US7618896B2 (en)	2006-04-24	2009-11-17	Fairchild Semiconductor Corporation	Semiconductor die package including multiple dies and a common node structure
US20080036078A1 (en) *	2006-08-14	2008-02-14	Ciclon Semiconductor Device Corp.	Wirebond-less semiconductor package
US7768105B2 (en)	2007-01-24	2010-08-03	Fairchild Semiconductor Corporation	Pre-molded clip structure
US20090166826A1 (en) *	2007-12-27	2009-07-02	Janducayan Omar A	Lead frame die attach paddles with sloped walls and backside grooves suitable for leadless packages
US20090194856A1 (en) *	2008-02-06	2009-08-06	Gomez Jocel P	Molded package assembly
US20090261462A1 (en) *	2008-04-16	2009-10-22	Jocel Gomez	Semiconductor package with stacked die assembly
US7855439B2 (en) *	2008-08-28	2010-12-21	Fairchild Semiconductor Corporation	Molded ultra thin semiconductor die packages, systems using the same, and methods of making the same
US7829988B2 (en) *	2008-09-22	2010-11-09	Fairchild Semiconductor Corporation	Stacking quad pre-molded component packages, systems using the same, and methods of making the same
US8314499B2 (en) *	2008-11-14	2012-11-20	Fairchild Semiconductor Corporation	Flexible and stackable semiconductor die packages having thin patterned conductive layers
US8049312B2 (en) *	2009-01-12	2011-11-01	Texas Instruments Incorporated	Semiconductor device package and method of assembly thereof
US7973393B2 (en)	2009-02-04	2011-07-05	Fairchild Semiconductor Corporation	Stacked micro optocouplers and methods of making the same
US20100289129A1 (en) *	2009-05-14	2010-11-18	Satya Chinnusamy	Copper plate bonding for high performance semiconductor packaging
JP5953703B2 (en) *	2011-10-31	2016-07-20	ソニー株式会社	Lead frame and semiconductor device
CN103878462A (en) *	2012-12-20	2014-06-25	浙江大学	Welding method replacing solder sheet by small welding block
TWI544580B (en) *	2015-05-01	2016-08-01	頎邦科技股份有限公司	Semiconductor package process with hollow chamber
US11209598B2 (en)	2019-02-28	2021-12-28	International Business Machines Corporation	Photonics package with face-to-face bonding

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US5629835A (en) *	1994-07-19	1997-05-13	Olin Corporation	Metal ball grid array package with improved thermal conductivity
US5789809A (en) *	1995-08-22	1998-08-04	National Semiconductor Corporation	Thermally enhanced micro-ball grid array package
US5637916A (en) *	1996-02-02	1997-06-10	National Semiconductor Corporation	Carrier based IC packaging arrangement
US5814884C1 (en) *	1996-10-24	2002-01-29	Int Rectifier Corp	Commonly housed diverse semiconductor die
KR100234719B1 (en) *	1997-03-14	1999-12-15	김영환	Area array package and its manufacturing method
US6423623B1 (en) *	1998-06-09	2002-07-23	Fairchild Semiconductor Corporation	Low Resistance package for semiconductor devices
US6133634A (en)	1998-08-05	2000-10-17	Fairchild Semiconductor Corporation	High performance flip chip package
US6329713B1 (en) *	1998-10-21	2001-12-11	International Business Machines Corporation	Integrated circuit chip carrier assembly comprising a stiffener attached to a dielectric substrate
US6720642B1 (en) *	1999-12-16	2004-04-13	Fairchild Semiconductor Corporation	Flip chip in leaded molded package and method of manufacture thereof
US6624522B2 (en) *	2000-04-04	2003-09-23	International Rectifier Corporation	Chip scale surface mounted device and process of manufacture
US6661082B1 (en) *	2000-07-19	2003-12-09	Fairchild Semiconductor Corporation	Flip chip substrate design
US6753605B2 (en) *	2000-12-04	2004-06-22	Fairchild Semiconductor Corporation	Passivation scheme for bumped wafers
US6798044B2 (en) *	2000-12-04	2004-09-28	Fairchild Semiconductor Corporation	Flip chip in leaded molded package with two dies
US6469384B2 (en) *	2001-02-01	2002-10-22	Fairchild Semiconductor Corporation	Unmolded package for a semiconductor device
US6683375B2 (en) *	2001-06-15	2004-01-27	Fairchild Semiconductor Corporation	Semiconductor die including conductive columns
US6633030B2 (en) *	2001-08-31	2003-10-14	Fiarchild Semiconductor	Surface mountable optocoupler package
US6566749B1 (en) *	2002-01-15	2003-05-20	Fairchild Semiconductor Corporation	Semiconductor die package with improved thermal and electrical performance
DE10392377T5 (en) *	2002-03-12	2005-05-12	FAIRCHILD SEMICONDUCTOR CORP. (n.d.Ges.d. Staates Delaware)	Wafer level coated pin-like bumps made of copper
US6836023B2 (en) *	2002-04-17	2004-12-28	Fairchild Semiconductor Corporation	Structure of integrated trace of chip package
US6806580B2 (en) *	2002-12-26	2004-10-19	Fairchild Semiconductor Corporation	Multichip module including substrate with an array of interconnect structures

2000
- 2000-07-19 US US09/619,115 patent/US6661082B1/en not_active Expired - Lifetime
2001
- 2001-07-18 JP JP2002513020A patent/JP2004504724A/en not_active Abandoned
- 2001-07-18 CN CNB018145981A patent/CN1240129C/en not_active Expired - Fee Related
- 2001-07-18 DE DE10196439T patent/DE10196439T1/en not_active Ceased
- 2001-07-18 AU AU2001277013A patent/AU2001277013A1/en not_active Abandoned
- 2001-07-18 WO PCT/US2001/022798 patent/WO2002007217A1/en not_active Ceased
2003
- 2003-09-11 US US10/660,866 patent/US7101734B2/en not_active Expired - Fee Related

Also Published As

Publication number	Publication date
US20050051878A1 (en)	2005-03-10
WO2002007217A1 (en)	2002-01-24
US6661082B1 (en)	2003-12-09
US7101734B2 (en)	2006-09-05
DE10196439T1 (en)	2003-11-13
JP2004504724A (en)	2004-02-12
CN1240129C (en)	2006-02-01
CN1470067A (en)	2004-01-21

Publication	Publication Date	Title
AU2001277013A1 (en)	2002-01-30	Flip chip substrate design
AU2002217901A1 (en)	2002-06-11	Flip chip mounting technique
AU2001234973A1 (en)	2001-08-20	Semiconductor devices
AU2002243735A1 (en)	2002-08-19	High performance silicon contact for flip chip
AU2002216217A1 (en)	2002-07-01	Semiconductor package
AU2001253142A1 (en)	2001-10-30	High speed flip chip assembly process
AU2002244124A1 (en)	2002-09-12	Self-coplanarity bumping shape for flip chip
AU2002247383A1 (en)	2002-10-08	In-street integrated circuit wafer via
AU2000224587A1 (en)	2001-08-14	Semiconductor device
AU2001236028A1 (en)	2001-09-12	Semiconductor device
AU2319600A (en)	2001-08-07	Semiconductor device
AU2001232248A1 (en)	2001-08-20	Semiconductor integrated circuit device
EP1220450B8 (en)	2008-11-26	Semiconductor integrated circuit
AU2002316979A1 (en)	2003-01-02	Semiconductor device
AU2001284456A1 (en)	2002-03-22	Substrate transporting device
AU2002338003A1 (en)	2003-06-10	Semiconductor Devices
AU2001246878A1 (en)	2001-10-23	Semiconductor photodetector
AU2002355550A1 (en)	2003-02-24	Self-programmable chip
AU2002355469A1 (en)	2003-02-24	Semiconductor module
AU2000274531A1 (en)	2002-04-15	Semiconductor device
AU2001257610A1 (en)	2001-11-07	Chip carrier socket
AU2002228179A1 (en)	2002-08-12	Micro-element substrate interconnection
AU2001277975A1 (en)	2002-02-05	Fabricated chip
AU2001239167A1 (en)	2001-08-27	Chip card
AU2001280684A1 (en)	2002-02-05	Vertically integrated chip on chip circuit stack