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AU2001273537A1 - Improved electrode for plasma processing system - Google Patents

Improved electrode for plasma processing system

Info

Publication number
AU2001273537A1
AU2001273537A1 AU2001273537A AU7353701A AU2001273537A1 AU 2001273537 A1 AU2001273537 A1 AU 2001273537A1 AU 2001273537 A AU2001273537 A AU 2001273537A AU 7353701 A AU7353701 A AU 7353701A AU 2001273537 A1 AU2001273537 A1 AU 2001273537A1
Authority
AU
Australia
Prior art keywords
processing system
plasma processing
improved electrode
electrode
improved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001273537A
Inventor
Murray D. Sirkis
Eric J. Strang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of AU2001273537A1 publication Critical patent/AU2001273537A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32605—Removable or replaceable electrodes or electrode systems

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Cleaning In General (AREA)
AU2001273537A 2000-07-20 2001-07-19 Improved electrode for plasma processing system Abandoned AU2001273537A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US21973500P 2000-07-20 2000-07-20
US60219735 2000-07-20
PCT/US2001/022509 WO2002009241A2 (en) 2000-07-20 2001-07-19 Electrode for plasma processing system

Publications (1)

Publication Number Publication Date
AU2001273537A1 true AU2001273537A1 (en) 2002-02-05

Family

ID=22820562

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001273537A Abandoned AU2001273537A1 (en) 2000-07-20 2001-07-19 Improved electrode for plasma processing system

Country Status (3)

Country Link
US (1) US20030106793A1 (en)
AU (1) AU2001273537A1 (en)
WO (1) WO2002009241A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100899355B1 (en) * 2007-11-15 2009-05-27 한국과학기술연구원 Plasma Deposition Apparatus and Method
SG183269A1 (en) * 2010-02-22 2012-09-27 Lam Res Corp Flush mounted fastener for plasma processing apparatus
US12522923B2 (en) 2022-03-11 2026-01-13 Applied Materials, Inc. Advanced barrier nickel oxide (BNiO) coating development for process chamber components via ozone treatment

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3481854A (en) * 1967-01-20 1969-12-02 Us Air Force Preparation of thin cermet films by radio frequency sputtering
GB1272580A (en) * 1968-06-12 1972-05-03 Edwards High Vacuum Int Ltd Targets for radio frequency sputtering apparatus
GB1499857A (en) * 1975-09-18 1978-02-01 Standard Telephones Cables Ltd Glow discharge etching
IT1203089B (en) * 1976-03-03 1989-02-15 Int Plasma Corp PROCEDURE AND EQUIPMENT TO PERFORM CHEMICAL REACTIONS IN THE REGION OF THE LUMINESCENT DISCHARGE OF A PLASMA
US5074456A (en) * 1990-09-18 1991-12-24 Lam Research Corporation Composite electrode for plasma processes
ES2093133T3 (en) * 1991-04-12 1996-12-16 Balzers Hochvakuum PROCEDURE AND INSTALLATION FOR THE COATING OF AT LEAST ONE OBJECT.
US5628869A (en) * 1994-05-09 1997-05-13 Lsi Logic Corporation Plasma enhanced chemical vapor reactor with shaped electrodes
US5569356A (en) * 1995-05-19 1996-10-29 Lam Research Corporation Electrode clamping assembly and method for assembly and use thereof
US6073577A (en) * 1998-06-30 2000-06-13 Lam Research Corporation Electrode for plasma processes and method for manufacture and use thereof
US6219219B1 (en) * 1998-09-30 2001-04-17 Applied Materials, Inc. Cathode assembly containing an electrostatic chuck for retaining a wafer in a semiconductor wafer processing system
JP3744726B2 (en) * 1999-06-08 2006-02-15 信越化学工業株式会社 Silicon electrode plate

Also Published As

Publication number Publication date
US20030106793A1 (en) 2003-06-12
WO2002009241A3 (en) 2002-05-23
WO2002009241A2 (en) 2002-01-31

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