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AU2001272581A1 - A method for individualised marking of circuit boards - Google Patents

A method for individualised marking of circuit boards

Info

Publication number
AU2001272581A1
AU2001272581A1 AU2001272581A AU7258101A AU2001272581A1 AU 2001272581 A1 AU2001272581 A1 AU 2001272581A1 AU 2001272581 A AU2001272581 A AU 2001272581A AU 7258101 A AU7258101 A AU 7258101A AU 2001272581 A1 AU2001272581 A1 AU 2001272581A1
Authority
AU
Australia
Prior art keywords
individualised
marking
circuit boards
blanks
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001272581A
Inventor
Rauno Salmi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of AU2001272581A1 publication Critical patent/AU2001272581A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C11/00—Auxiliary processes in photography
    • G03C11/02—Marking or applying text
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09927—Machine readable code, e.g. bar code
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0551—Exposure mask directly printed on the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H10P72/0614—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Heat Sensitive Colour Forming Recording (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Making Paper Articles (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Surgical Instruments (AREA)
  • Glass Compositions (AREA)
  • Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)

Abstract

A method for individualised marking of electronic components in electronics manufacture, such as circuit boards. On the photosensitive surface required for manufacturing the blanks is exposed, on each blank, a machine-readable pattern, which is subsequently used in the manufacture of the product itself, for individualising the blanks in question.
AU2001272581A 2000-06-21 2001-06-21 A method for individualised marking of circuit boards Abandoned AU2001272581A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FI20001480 2000-06-21
FI20001480A FI109054B (en) 2000-06-21 2000-06-21 Procedure for individualized labeling of printed circuit boards
PCT/FI2001/000597 WO2001098829A1 (en) 2000-06-21 2001-06-21 A method for individualised marking of circuit boards

Publications (1)

Publication Number Publication Date
AU2001272581A1 true AU2001272581A1 (en) 2002-01-02

Family

ID=8558614

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001272581A Abandoned AU2001272581A1 (en) 2000-06-21 2001-06-21 A method for individualised marking of circuit boards

Country Status (10)

Country Link
US (1) US20030175625A1 (en)
EP (1) EP1297383B1 (en)
JP (1) JP2004501518A (en)
KR (1) KR20030025934A (en)
CN (1) CN1203371C (en)
AT (1) ATE382881T1 (en)
AU (1) AU2001272581A1 (en)
DE (1) DE60132205T2 (en)
FI (1) FI109054B (en)
WO (1) WO2001098829A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK176229B1 (en) * 2002-06-18 2007-03-26 Photosolar Aps Optical element for shielding light
JP4565916B2 (en) * 2004-07-23 2010-10-20 三洋電機株式会社 Photoreactor
US8492072B2 (en) * 2009-04-30 2013-07-23 Infineon Technologies Ag Method for marking objects
CN103324037B (en) * 2013-07-04 2015-01-07 北京京东方光电科技有限公司 Exposure device and method
WO2022107116A1 (en) * 2020-11-17 2022-05-27 Orbotech Ltd. Multi pattern maskless lithography method and system

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3694081A (en) * 1970-02-11 1972-09-26 Pek Inc Method and apparatus for contact printing
DE3147994A1 (en) * 1981-12-04 1983-06-16 Fa. Georg Rothkegel, 5140 Erkelenz Process for the production of serial or reference codes
JPS6172216A (en) * 1984-09-17 1986-04-14 Shinku Lab:Kk Exposure method
JPS6454455A (en) * 1987-08-25 1989-03-01 Mitsubishi Electric Corp Aligner
JPH0189771U (en) * 1987-12-04 1989-06-13
US4853317A (en) * 1988-04-04 1989-08-01 Microfab Technologies, Inc. Method and apparatus for serializing printed circuit boards and flex circuits
JPH03239552A (en) * 1990-02-15 1991-10-25 Matsushita Electric Works Ltd Printing method of printed-wiring board
JPH04359588A (en) * 1991-06-06 1992-12-11 Mitsubishi Electric Corp Manufacture of printed wiring board
CA2075026A1 (en) * 1991-08-08 1993-02-09 William E. Nelson Method and apparatus for patterning an imaging member
JPH06255232A (en) * 1991-09-11 1994-09-13 Cmk Corp Method for manufacturing printed wiring board
JPH10112579A (en) * 1996-10-07 1998-04-28 M S Tec:Kk Resist exposing method and exposing apparatus
JPH10230382A (en) * 1997-02-21 1998-09-02 Fuji Print Kogyo Kk Direct plotting method for printed board
US6251550B1 (en) * 1998-07-10 2001-06-26 Ball Semiconductor, Inc. Maskless photolithography system that digitally shifts mask data responsive to alignment data

Also Published As

Publication number Publication date
FI20001480L (en) 2001-12-22
US20030175625A1 (en) 2003-09-18
WO2001098829A1 (en) 2001-12-27
DE60132205T2 (en) 2008-12-18
CN1437713A (en) 2003-08-20
EP1297383A1 (en) 2003-04-02
DE60132205D1 (en) 2008-02-14
KR20030025934A (en) 2003-03-29
HK1056611A1 (en) 2004-02-20
FI109054B (en) 2002-05-15
FI20001480A0 (en) 2000-06-21
ATE382881T1 (en) 2008-01-15
EP1297383B1 (en) 2008-01-02
JP2004501518A (en) 2004-01-15
CN1203371C (en) 2005-05-25

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