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AU2001267912A1 - Method for predicting consumption of consumable part, method for predicting deposited-film thickness, and plasma processor - Google Patents

Method for predicting consumption of consumable part, method for predicting deposited-film thickness, and plasma processor

Info

Publication number
AU2001267912A1
AU2001267912A1 AU2001267912A AU6791201A AU2001267912A1 AU 2001267912 A1 AU2001267912 A1 AU 2001267912A1 AU 2001267912 A AU2001267912 A AU 2001267912A AU 6791201 A AU6791201 A AU 6791201A AU 2001267912 A1 AU2001267912 A1 AU 2001267912A1
Authority
AU
Australia
Prior art keywords
predicting
deposited
film thickness
consumable part
consumption
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001267912A
Inventor
Shinji Sakano
Tsuyoshi Sendoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of AU2001267912A1 publication Critical patent/AU2001267912A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10P74/23—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H10P50/283—

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
AU2001267912A 2000-07-04 2001-07-03 Method for predicting consumption of consumable part, method for predicting deposited-film thickness, and plasma processor Abandoned AU2001267912A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000-201730 2000-07-04
JP2000201730A JP4554037B2 (en) 2000-07-04 2000-07-04 Consumable consumption level prediction method and deposited film thickness prediction method
PCT/JP2001/005755 WO2002003440A1 (en) 2000-07-04 2001-07-03 Method for predicting consumption of consumable part, method for predicting deposited-film thickness, and plasma processor

Publications (1)

Publication Number Publication Date
AU2001267912A1 true AU2001267912A1 (en) 2002-01-14

Family

ID=18699370

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001267912A Abandoned AU2001267912A1 (en) 2000-07-04 2001-07-03 Method for predicting consumption of consumable part, method for predicting deposited-film thickness, and plasma processor

Country Status (6)

Country Link
US (1) US7341644B2 (en)
JP (1) JP4554037B2 (en)
CN (1) CN1237584C (en)
AU (1) AU2001267912A1 (en)
TW (1) TW494457B (en)
WO (1) WO2002003440A1 (en)

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JP4220169B2 (en) * 2002-03-20 2009-02-04 富士重工業株式会社 Actual vehicle coating thickness prediction method, actual vehicle coating thickness prediction system, and recording medium
AU2003224727A1 (en) * 2002-03-28 2003-10-13 Tokyo Electron Limited A system and method for determining the state of a film in a plasma reactor using an electrical property
AU2003235901A1 (en) * 2002-05-16 2003-12-02 Tokyo Electron Limited Method of predicting processing device condition or processed result
JP2004071755A (en) * 2002-08-05 2004-03-04 Matsushita Electric Ind Co Ltd Plasma processing method and plasma processing apparatus
JP2004335841A (en) * 2003-05-09 2004-11-25 Tokyo Electron Ltd Prediction system and prediction method for plasma treatment apparatus
JP2004342806A (en) * 2003-05-15 2004-12-02 Fujitsu Ltd Method for manufacturing semiconductor device
US20050109278A1 (en) * 2003-11-26 2005-05-26 Ted Liang Method to locally protect extreme ultraviolet multilayer blanks used for lithography
JP4365226B2 (en) * 2004-01-14 2009-11-18 株式会社日立ハイテクノロジーズ Plasma etching apparatus and method
US7233878B2 (en) * 2004-01-30 2007-06-19 Tokyo Electron Limited Method and system for monitoring component consumption
JP4630702B2 (en) * 2005-03-28 2011-02-09 三機工業株式会社 Heat source system optimum operation control device
US7632542B2 (en) * 2005-10-26 2009-12-15 University Of Maryland Method for controlling uniformity of thin films fabricated in processing systems
JP5058560B2 (en) * 2006-10-26 2012-10-24 株式会社平間理化研究所 Etching solution management device
TWI475592B (en) * 2008-07-07 2015-03-01 Lam Res Corp Passive capacitively-coupled electrostatic (cce) probe arrangement for detecting plasma instabilities in a plasma processing chamber
WO2011002810A2 (en) * 2009-06-30 2011-01-06 Lam Research Corporation Methods for constructing an optimal endpoint algorithm
JP6085079B2 (en) * 2011-03-28 2017-02-22 東京エレクトロン株式会社 Pattern forming method, temperature control method for member in processing container, and substrate processing system
CN103971445A (en) * 2014-05-13 2014-08-06 威海华菱光电股份有限公司 Paper money thickness detecting device
JP6383647B2 (en) * 2014-11-19 2018-08-29 東京エレクトロン株式会社 Measuring system and measuring method
JP6635888B2 (en) 2016-07-14 2020-01-29 東京エレクトロン株式会社 Plasma processing system
JP2018107264A (en) * 2016-12-26 2018-07-05 東京エレクトロン株式会社 Consumption determination method and plasma processing apparatus
US11067515B2 (en) * 2017-11-28 2021-07-20 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for inspecting a wafer process chamber
CN109961998B (en) * 2017-12-22 2021-06-08 中微半导体设备(上海)股份有限公司 Plasma processing device and control method based on focus ring thickness monitoring
JP7037964B2 (en) * 2018-03-09 2022-03-17 東京エレクトロン株式会社 How the system operates to inspect the measuring instrument and focus ring
KR102689653B1 (en) 2019-06-26 2024-07-31 삼성전자주식회사 Sensor module and etching apparatus having the same
JP2019186579A (en) * 2019-07-31 2019-10-24 東京エレクトロン株式会社 Plasma treatment system and focus ring exchanging method
JP7466432B2 (en) * 2020-03-24 2024-04-12 東京エレクトロン株式会社 Plasma processing apparatus and method for measuring consumption amount
US12033838B2 (en) * 2020-03-24 2024-07-09 Tokyo Electron Limited Plasma processing apparatus and wear amount measurement method
JP6824461B2 (en) * 2020-06-05 2021-02-03 東京エレクトロン株式会社 Processing system
JP7505959B2 (en) * 2020-10-16 2024-06-25 東京エレクトロン株式会社 SUBSTRATE PROCESSING SYSTEM, CONTROL METHOD, AND CONTROL PROGRAM
JP7579752B2 (en) * 2021-05-27 2024-11-08 東京エレクトロン株式会社 Method for controlling cleaning and plasma processing apparatus

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5458732A (en) * 1992-04-14 1995-10-17 Texas Instruments Incorporated Method and system for identifying process conditions
US5576629A (en) * 1994-10-24 1996-11-19 Fourth State Technology, Inc. Plasma monitoring and control method and system
JPH1074734A (en) 1996-09-02 1998-03-17 Toshiba Corp Plasma processing apparatus and semiconductor device manufacturing method
US5810963A (en) * 1995-09-28 1998-09-22 Kabushiki Kaisha Toshiba Plasma processing apparatus and method
JP3307820B2 (en) * 1996-02-07 2002-07-24 株式会社田中製作所 Plasma electrode wear detection method
US6197116B1 (en) * 1996-08-29 2001-03-06 Fujitsu Limited Plasma processing system
JPH10218664A (en) * 1997-02-05 1998-08-18 Tokai Carbon Co Ltd Focus ring for plasma etching equipment
JP3071729B2 (en) * 1997-06-20 2000-07-31 九州日本電気株式会社 Plasma processing equipment

Also Published As

Publication number Publication date
US7341644B2 (en) 2008-03-11
TW494457B (en) 2002-07-11
CN1237584C (en) 2006-01-18
CN1454391A (en) 2003-11-05
JP2002025982A (en) 2002-01-25
JP4554037B2 (en) 2010-09-29
WO2002003440A1 (en) 2002-01-10
US20040007560A1 (en) 2004-01-15

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