[go: up one dir, main page]

AR087137A1 - Procedimiento y dispositivo de polarizacion de un electrodo dbd - Google Patents

Procedimiento y dispositivo de polarizacion de un electrodo dbd

Info

Publication number
AR087137A1
AR087137A1 ARP100104353A ARP100104353A AR087137A1 AR 087137 A1 AR087137 A1 AR 087137A1 AR P100104353 A ARP100104353 A AR P100104353A AR P100104353 A ARP100104353 A AR P100104353A AR 087137 A1 AR087137 A1 AR 087137A1
Authority
AR
Argentina
Prior art keywords
tht
transformer
dbd
dbd electrode
polarization procedure
Prior art date
Application number
ARP100104353A
Other languages
English (en)
Inventor
Joseph Leclercq
Eric Michel
Eric Tixhon
Original Assignee
Agc Glass Europe
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agc Glass Europe filed Critical Agc Glass Europe
Publication of AR087137A1 publication Critical patent/AR087137A1/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32348—Dielectric barrier discharge
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • C23C16/507—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using external electrodes, e.g. in tunnel type reactors
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H2242/00—Auxiliary systems
    • H05H2242/20—Power circuits
    • H05H2242/22—DC, AC or pulsed generators

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Surface Treatment Of Glass (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Plasma Technology (AREA)

Abstract

Dispositivo de tratamiento de superficie para descarga de barrera dieléctrica (DBD) que comprende un transformador THT/HF en la que la fuente de corriente continua (DC) se intercala en el circuito secundario del transformador THT/HF, de forma tal que las especies químicas se forman de iones eléctricamente positivos o negativos producidos en el plasma son selectivamente atraídas por un substrato blanco y rechazados por los electrodos de carga correspondiente.
ARP100104353A 2009-11-24 2010-11-24 Procedimiento y dispositivo de polarizacion de un electrodo dbd AR087137A1 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP09176940 2009-11-24
EP10153448A EP2326151A1 (fr) 2009-11-24 2010-02-12 Procédé et dispositif de polarisation d'une électrode DBD

Publications (1)

Publication Number Publication Date
AR087137A1 true AR087137A1 (es) 2014-02-26

Family

ID=42983804

Family Applications (1)

Application Number Title Priority Date Filing Date
ARP100104353A AR087137A1 (es) 2009-11-24 2010-11-24 Procedimiento y dispositivo de polarizacion de un electrodo dbd

Country Status (10)

Country Link
US (1) US9401265B2 (es)
EP (2) EP2326151A1 (es)
JP (1) JP5850847B2 (es)
CN (1) CN102668721B (es)
AR (1) AR087137A1 (es)
BR (1) BR112012012496B1 (es)
EA (1) EA023480B1 (es)
PL (1) PL2505041T3 (es)
SI (1) SI2505041T1 (es)
WO (1) WO2011064217A1 (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2935648B1 (en) * 2012-12-21 2019-08-28 AGC Inc. Pair of electrodes for dbd plasma process
JP6280677B1 (ja) * 2017-06-27 2018-02-14 キヤノンアネルバ株式会社 プラズマ処理装置
EP3648551B1 (en) 2017-06-27 2021-08-18 Canon Anelva Corporation Plasma treatment device
JP6458206B1 (ja) 2017-06-27 2019-01-23 キヤノンアネルバ株式会社 プラズマ処理装置
JP6457707B1 (ja) 2017-06-27 2019-01-23 キヤノンアネルバ株式会社 プラズマ処理装置
CZ307842B6 (cs) * 2018-05-02 2019-06-12 Fyzikální Ústav Av Čr, V. V. I. Způsob generování nízkoteplotního plazmatu, způsob povlakování vnitřního povrchu dutých elektricky vodivých nebo feromagnetických trubic a zařízení pro provádění těchto způsobů
PL3817517T3 (pl) 2018-06-26 2024-10-28 Canon Anelva Corporation Urządzenie do obróbki plazmą, sposób obróbki plazmą, program oraz nośnik pamięci
TWI728569B (zh) * 2019-11-25 2021-05-21 馗鼎奈米科技股份有限公司 放電極化設備

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3619352A1 (de) 1986-06-09 1987-12-10 Philips Patentverwaltung Eintaktdurchflusswandler
JP3577601B2 (ja) 1993-09-20 2004-10-13 株式会社ダイオー 大気圧グロ−放電プラズマ処理法
JPH07155529A (ja) 1993-12-01 1995-06-20 Takuma Co Ltd ガス処理装置とそれの運転方法
DE19537212A1 (de) 1994-10-06 1996-04-11 Leybold Ag Vorrichtung zum Beschichten von Substraten im Vakuum
US5573597A (en) * 1995-06-07 1996-11-12 Sony Corporation Plasma processing system with reduced particle contamination
JPH08337497A (ja) * 1995-06-09 1996-12-24 Iwatani Internatl Corp ダイヤモンド薄膜の気相合成法
CA2197978A1 (en) 1995-06-19 1996-12-20 Paul D. Spence Discharge methods and electrodes for generating plasmas at one atmosphere of pressure, and materials treated therewith
CN1161820C (zh) * 1998-07-31 2004-08-11 佳能株式会社 半导体层制造方法和制造设备、光生伏打电池的制造方法
FR2782837B1 (fr) * 1998-08-28 2000-09-29 Air Liquide Procede et dispositif de traitement de surface par plasma a pression atmospherique
TWI225499B (en) * 1999-04-15 2004-12-21 Konishiroku Photo Ind Protective film for polarizing plate
EP1073091A3 (en) * 1999-07-27 2004-10-06 Matsushita Electric Works, Ltd. Electrode for plasma generation, plasma treatment apparatus using the electrode, and plasma treatment with the apparatus
US6827870B1 (en) * 1999-10-12 2004-12-07 Wisconsin Alumni Research Foundation Method and apparatus for etching and deposition using micro-plasmas
JP2003523053A (ja) 2000-02-11 2003-07-29 ダウ・コーニング・アイルランド・リミテッド 大気圧プラズマシステム
JP2003003268A (ja) 2001-06-19 2003-01-08 Konica Corp 大気圧プラズマ処理装置、大気圧プラズマ処理方法、基材、光学フィルム、及び画像表示素子
CN1266988C (zh) * 2002-11-26 2006-07-26 广东杰特科技发展有限公司 发生随机性流光放电等离子体的工业装置及其应用
US7988816B2 (en) * 2004-06-21 2011-08-02 Tokyo Electron Limited Plasma processing apparatus and method
JP5367369B2 (ja) * 2005-08-26 2013-12-11 フジフィルム マニュファクチャリング ユーロプ ビー．ブイ． 放電プラズマを発生させ制御するための方法、装置および該装置の使用方法
US7589470B2 (en) * 2006-01-31 2009-09-15 Dublin City University Method and apparatus for producing plasma
EP1979400A1 (en) * 2006-02-02 2008-10-15 FUJIFILM Manufacturing Europe B.V. Method for surface treatment by plasma and surface treatment apparatus
KR20080024885A (ko) * 2006-09-15 2008-03-19 이택기 플라즈마 반응기의 파라미터 계산 방법
CN201017845Y (zh) * 2007-03-14 2008-02-06 万京林 差分馈电介质阻挡放电低温等离子体装置
EP2145701A1 (fr) * 2008-07-16 2010-01-20 AGC Flat Glass Europe SA Procédé et installation pour la préparation de surface par décharge à barrière diélectrique
EP2145978A1 (fr) * 2008-07-16 2010-01-20 AGC Flat Glass Europe SA Procédé et installation pour le dépôt de couches sur un substrat
EP2180768A1 (en) * 2008-10-23 2010-04-28 TNO Nederlandse Organisatie voor Toegepast Wetenschappelijk Onderzoek Apparatus and method for treating an object

Also Published As

Publication number Publication date
BR112012012496A2 (pt) 2016-04-12
WO2011064217A1 (fr) 2011-06-03
EP2505041B1 (fr) 2013-09-18
JP5850847B2 (ja) 2016-02-03
CN102668721A (zh) 2012-09-12
JP2013511816A (ja) 2013-04-04
EA201290431A1 (ru) 2013-04-30
EP2505041B8 (fr) 2014-04-23
EA023480B1 (ru) 2016-06-30
US20120258260A1 (en) 2012-10-11
SI2505041T1 (sl) 2014-03-31
EP2505041A1 (fr) 2012-10-03
CN102668721B (zh) 2015-04-29
PL2505041T3 (pl) 2014-07-31
US9401265B2 (en) 2016-07-26
EP2326151A1 (fr) 2011-05-25
WO2011064217A8 (fr) 2011-09-01
BR112012012496B1 (pt) 2020-11-17

Similar Documents

Publication Publication Date Title
AR087137A1 (es) Procedimiento y dispositivo de polarizacion de un electrodo dbd
AR086942A1 (es) Disposicion de electrodo para una descarga de gas dielectricamente impedida
MX2018003958A (es) Circuito de drenaje de batería para instrumento quirúrgico.
MX359728B (es) Fuentes de ionizacion de descarga de barrera dielectrica para espectrometria.
IN2014DN07921A (es)
CL2012001643A1 (es) Disposición de electrodo para un tratamiento de una superficie con plasma para una descarga con barrera dielectrica, que comprende; un electrodo plano y un dielectrico formado por un material plano flexible, en cuyo lado orientado hacia la superficie a ser tratada tiene una estructura con zonas aireadoras; y procedimiento de tratamiento.
MX2017004731A (es) Monitoreo de fallas en un interruptor en un sistema para fumar calentado electricamente.
MX386548B (es) Disposición de electrodos para formar una descarga de plasma a través de barrera dieléctrica.
AR091244A1 (es) Panel con un elemento de conexion electrica
EA201190076A1 (ru) Ультраконденсатор и электронная аккумуляторная батарея с квантовой точкой
WO2014085140A3 (en) High power rf field effect transistor switching using dc biases
CL2011002005A1 (es) Celda electrolitica, que comprende un recipiente de contencion, un primer electrodo, un segundo electrodo, una fuente de corriente electrica; un gas que se forma durante la electrolisis; un separador con el primer electrodo y un material dielectrico distal a la fuente de corriente electrica paraa controlar el lugar de la nucleacion del gas.
JP2012079690A5 (ja) 半導体装置
WO2013156352A3 (de) Plasmaroller
JP2013084939A5 (ja) 半導体装置の作製方法
PH12016500212A1 (en) Therapeutic electron and ion transfer via half-cell
WO2016003523A3 (en) Polar elastomers for high performance electronic and optoelectronic devices
MX2015008261A (es) Dispositivo de bombardeo de iones y metodo para usar el mismo para limpiar una superficie de sustrato.
PH12014501271A1 (en) An ionization monitoring device and method
WO2011073189A3 (en) Large area light emitting device comprising organic light emitting diodes
AR096409A1 (es) Batería con fusible integrado
WO2016100262A8 (en) Entropic energy transfer methods and circuits
EA201492043A1 (ru) Органическое фотонное устройство
EP2755245A3 (en) Light emitting device
GB2449817A (en) Phosphor electroluminescent devices

Legal Events

Date Code Title Description
FG Grant, registration
FD Application declared void or lapsed, e.g., due to non-payment of fee