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MX2015008261A - Dispositivo de bombardeo de iones y metodo para usar el mismo para limpiar una superficie de sustrato. - Google Patents

Dispositivo de bombardeo de iones y metodo para usar el mismo para limpiar una superficie de sustrato.

Info

Publication number
MX2015008261A
MX2015008261A MX2015008261A MX2015008261A MX2015008261A MX 2015008261 A MX2015008261 A MX 2015008261A MX 2015008261 A MX2015008261 A MX 2015008261A MX 2015008261 A MX2015008261 A MX 2015008261A MX 2015008261 A MX2015008261 A MX 2015008261A
Authority
MX
Mexico
Prior art keywords
electrode
ion bombardment
same
substrate surface
vacuum chamber
Prior art date
Application number
MX2015008261A
Other languages
English (en)
Other versions
MX368879B (es
Inventor
Satoshi Hirota
Homare Nomura
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Publication of MX2015008261A publication Critical patent/MX2015008261A/es
Publication of MX368879B publication Critical patent/MX368879B/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02—Pretreatment of the material to be coated
    • C23C16/0227—Pretreatment of the material to be coated by cleaning or etching
    • C23C16/0245—Pretreatment of the material to be coated by cleaning or etching by etching with a plasma
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02—Pretreatment of the material to be coated
    • C23C16/0227—Pretreatment of the material to be coated by cleaning or etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/48—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
    • C23C16/486—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation using ion beam radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4584—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally the substrate being rotated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating
    • H01J2237/3321—CVD [Chemical Vapor Deposition]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/335—Cleaning

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physical Vapour Deposition (AREA)
  • Cleaning In General (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

Se proporciona un dispositivo de bombardeo de iones (1) para estabilizar y limpiar la superficie de un sustrato. El dispositivo está provisto con lo siguiente: una cámara de vacío (2); por lo menos un electrodo (3) que está dispuesto sobre la cara de la pared interior de la cámara de vacío (2) y emite electrones; una pluralidad de ánodos (4) que reciben los electrones a partir del electrodo (3) y que están dispuestos con el fin de estar orientados hacia el electrodo con el sustrato intercalado entre los mismos; y una pluralidad de fuentes de alimentación de descarga (5) que se corresponden con los ánodos (4) respectivamente. Cada una de las fuentes de alimentación de descarga (5) está aislada con respecto a la cámara de vacío (2) y proporciona al ánodo (4) que se corresponde con la fuente de alimentación de descarga (5) relevante unas corrientes y tensiones que pueden establecerse de manera independiente una de otra, generando de ese modo una descarga luminiscente entre tal ánodo (4) y el electrodo (3).
MX2015008261A 2013-02-07 2014-01-09 Dispositivo de bombardeo de iones y metodo para usar el mismo para limpiar una superficie de sustrato. MX368879B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013022264A JP6076112B2 (ja) 2013-02-07 2013-02-07 イオンボンバードメント装置及びこの装置を用いた基材の表面のクリーニング方法
PCT/JP2014/000047 WO2014122876A1 (ja) 2013-02-07 2014-01-09 イオンボンバードメント装置及びこの装置を用いた基材の表面のクリーニング方法

Publications (2)

Publication Number Publication Date
MX2015008261A true MX2015008261A (es) 2015-09-29
MX368879B MX368879B (es) 2019-10-21

Family

ID=51299478

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2015008261A MX368879B (es) 2013-02-07 2014-01-09 Dispositivo de bombardeo de iones y metodo para usar el mismo para limpiar una superficie de sustrato.

Country Status (12)

Country Link
US (1) US20150299847A1 (es)
EP (1) EP2955244A4 (es)
JP (1) JP6076112B2 (es)
KR (2) KR20170045397A (es)
CN (1) CN104968826B (es)
BR (1) BR112015019027A8 (es)
CA (1) CA2893118C (es)
IL (1) IL239072B (es)
MX (1) MX368879B (es)
RU (1) RU2015137774A (es)
TW (1) TWI489513B (es)
WO (1) WO2014122876A1 (es)

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EP3449033A1 (de) * 2015-11-05 2019-03-06 Bühler Alzenau GmbH Vorrichtung und verfahren zur vakuumbeschichtung
JP6476261B1 (ja) * 2017-10-17 2019-02-27 株式会社神戸製鋼所 成膜方法
CN108054079A (zh) * 2017-11-29 2018-05-18 上海华力微电子有限公司 焊盘结晶缺陷的去除方法
KR102336559B1 (ko) * 2019-11-26 2021-12-08 세메스 주식회사 부품 표면 처리 방법 및 부품 처리 장치
CN111029278B (zh) * 2019-12-10 2021-06-29 长江存储科技有限责任公司 一种晶圆片的加工方法和系统
US20220162737A1 (en) * 2020-11-25 2022-05-26 Oem Group, Llc Systems and methods for in-situ etching prior to physical vapor deposition in the same chamber
CN114717522B (zh) * 2022-05-12 2025-04-22 沈阳爱科斯科技有限公司 多弧离子镀膜装置
CN115354298A (zh) * 2022-07-05 2022-11-18 湖南红太阳光电科技有限公司 一种pecvd设备石墨舟清洗系统
JP2024032474A (ja) 2022-08-29 2024-03-12 株式会社神戸製鋼所 イオンボンバードメント装置及びイオンボンバードメント処理方法
CN115637418B (zh) * 2022-10-12 2024-10-11 中微半导体设备(上海)股份有限公司 形成涂层的方法、涂覆装置、零部件及等离子体反应装置
CN116234392B (zh) * 2022-11-11 2025-10-10 深圳市华星光电半导体显示技术有限公司 一种柔性显示面板的制备方法以及柔性显示面板
KR102595151B1 (ko) * 2022-12-29 2023-10-27 (주)제이 앤 엘 테크 연료전지용 금속분리판 및 그 제조방법

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Also Published As

Publication number Publication date
KR20170045397A (ko) 2017-04-26
US20150299847A1 (en) 2015-10-22
KR101935090B1 (ko) 2019-01-03
BR112015019027A2 (pt) 2017-07-18
RU2015137774A (ru) 2017-03-13
TWI489513B (zh) 2015-06-21
EP2955244A1 (en) 2015-12-16
BR112015019027A8 (pt) 2019-11-12
WO2014122876A1 (ja) 2014-08-14
JP2014152356A (ja) 2014-08-25
CN104968826B (zh) 2017-06-09
CN104968826A (zh) 2015-10-07
CA2893118C (en) 2019-02-12
IL239072A0 (en) 2015-07-30
JP6076112B2 (ja) 2017-02-08
CA2893118A1 (en) 2014-08-14
TW201438053A (zh) 2014-10-01
KR20150104149A (ko) 2015-09-14
IL239072B (en) 2019-05-30
EP2955244A4 (en) 2016-10-05
MX368879B (es) 2019-10-21

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