[go: up one dir, main page]

NO813626L - Fremgangsmaate ved fremstilling av en flerlags keramisk modul for anvendelse i forbindelse med integrerte kretser - Google Patents

Fremgangsmaate ved fremstilling av en flerlags keramisk modul for anvendelse i forbindelse med integrerte kretser

Info

Publication number
NO813626L
NO813626L NO813626A NO813626A NO813626L NO 813626 L NO813626 L NO 813626L NO 813626 A NO813626 A NO 813626A NO 813626 A NO813626 A NO 813626A NO 813626 L NO813626 L NO 813626L
Authority
NO
Norway
Prior art keywords
binder
ceramic
module
conductive paste
layer
Prior art date
Application number
NO813626A
Other languages
English (en)
Norwegian (no)
Inventor
Frank C Bakermans
Lee Roger Conrad
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of NO813626L publication Critical patent/NO813626L/no

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/632Organic additives
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/638Removal thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/53After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone involving the removal of at least part of the materials of the treated article, e.g. etching, drying of hardened concrete
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81Coating or impregnation
    • C04B41/85Coating or impregnation with inorganic materials
    • C04B41/88Metals
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/91After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics involving the removal of part of the materials of the treated articles, e.g. etching
    • H10W70/098
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0014Shaping of the substrate, e.g. by moulding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H10W90/754

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
NO813626A 1980-10-28 1981-10-27 Fremgangsmaate ved fremstilling av en flerlags keramisk modul for anvendelse i forbindelse med integrerte kretser NO813626L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US20146980A 1980-10-28 1980-10-28
US06/307,657 US4345955A (en) 1980-10-28 1981-10-02 Process for manufacturing multilayer ceramic chip carrier modules

Publications (1)

Publication Number Publication Date
NO813626L true NO813626L (no) 1982-04-29

Family

ID=26896779

Family Applications (1)

Application Number Title Priority Date Filing Date
NO813626A NO813626L (no) 1980-10-28 1981-10-27 Fremgangsmaate ved fremstilling av en flerlags keramisk modul for anvendelse i forbindelse med integrerte kretser

Country Status (8)

Country Link
US (1) US4345955A (es)
EP (1) EP0050903B1 (es)
BR (1) BR8106873A (es)
CA (1) CA1167979A (es)
DE (1) DE3173737D1 (es)
DK (1) DK474181A (es)
ES (1) ES8206916A1 (es)
NO (1) NO813626L (es)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5820160B2 (ja) * 1978-06-17 1983-04-21 日本碍子株式会社 メタライズ層を備えたセラミツクス体
JPS57184296A (en) * 1981-05-09 1982-11-12 Hitachi Ltd Ceramic circuit board
US4504340A (en) * 1983-07-26 1985-03-12 International Business Machines Corporation Material and process set for fabrication of molecular matrix print head
US4546065A (en) * 1983-08-08 1985-10-08 International Business Machines Corporation Process for forming a pattern of metallurgy on the top of a ceramic substrate
JPS6047495A (ja) * 1983-08-25 1985-03-14 株式会社日立製作所 セラミツク配線基板
US4727410A (en) * 1983-11-23 1988-02-23 Cabot Technical Ceramics, Inc. High density integrated circuit package
US4510000A (en) * 1983-11-30 1985-04-09 International Business Machines Corporation Method for palladium activating molybdenum metallized features on a ceramic substrate
US4539058A (en) * 1983-12-12 1985-09-03 International Business Machines Corporation Forming multilayer ceramic substrates from large area green sheets
FR2558763B1 (fr) * 1984-01-27 1987-11-20 Thomson Csf Procede de fabrication d'un substrat ceramique, avec plots de connexion electriques transversaux
JPS61155243A (ja) * 1984-12-28 1986-07-14 富士通株式会社 グリ−ンシ−ト組成物
US4766671A (en) * 1985-10-29 1988-08-30 Nec Corporation Method of manufacturing ceramic electronic device
JPH0632355B2 (ja) * 1986-01-27 1994-04-27 株式会社日立製作所 セラミツク配線基板とその製造方法
GB8602331D0 (en) * 1986-01-30 1986-03-05 Ici Plc Multilayer systems
DE3630066C1 (de) * 1986-09-04 1988-02-04 Heraeus Gmbh W C Verfahren zur Herstellung von gesinterten metallisierten Aluminiumnitrid-Keramikkoerpern
US4767479A (en) * 1987-09-21 1988-08-30 United Technologies Corporation Method for bonding ceramic casting cores
US4765950A (en) * 1987-10-07 1988-08-23 Risi Industries, Inc. Process for fabricating parts from particulate material
US4929575A (en) * 1988-03-21 1990-05-29 The Dow Chemical Company Melt processable, green, ceramic precursor powder
FR2638594B1 (fr) * 1988-11-03 1990-12-21 Cartier Systemes G Procede de realisation d'un circuit electrique de puissance monocouche ou multicouches, et circuit obtenu par ce procede
US4933045A (en) * 1989-06-02 1990-06-12 International Business Machines Corporation Thin film multilayer laminate interconnection board assembly method
JP2761776B2 (ja) * 1989-10-25 1998-06-04 Ii Ai Deyuhon De Nimoasu Ando Co 多層回路板の製造方法
CA2071662A1 (en) * 1991-06-26 1992-12-27 Jon J. Gulick Integrated socket-type package for flip-chip semiconductor devices and circuits
US5240671A (en) * 1992-06-01 1993-08-31 Microelectronics And Computer Technology Corporation Method of forming recessed patterns in insulating substrates
US5340510A (en) * 1993-04-05 1994-08-23 Materials Systems Incorporated Method for making piezoelectric ceramic/polymer composite transducers
DE19615787A1 (de) * 1996-04-20 1997-10-23 Bosch Gmbh Robert Verfahren zur Herstellung eines keramischen Multilayer-Substrats
US6214523B1 (en) * 1998-01-09 2001-04-10 International Business Machines Corporation Pattern formation by removal of paste material
JP2004186395A (ja) * 2002-12-03 2004-07-02 Fujitsu Ltd セラミック基板の製造方法
DE102009013021A1 (de) * 2009-03-16 2010-09-23 Gkn Sinter Metals Holding Gmbh Schmiermittel für die Pulvermetallurgie
DE102013200281A1 (de) * 2013-01-11 2014-07-17 Robert Bosch Gmbh Verfahren zum Herstellen einer Aufnahme für ein Sensorelement
US11274065B2 (en) * 2018-06-13 2022-03-15 Fuelcell Energy, Inc. Ceramic felt material for high-temperature fuel cells

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1090014A (fr) * 1952-08-11 1955-03-25 Int Standard Electric Corp Méthodes et procédé de moulage de matériaux notamment de pièces en céramique
US3518756A (en) * 1967-08-22 1970-07-07 Ibm Fabrication of multilevel ceramic,microelectronic structures
US4197118A (en) * 1972-06-14 1980-04-08 Parmatech Corporation Manufacture of parts from particulate material
US3991029A (en) * 1973-05-03 1976-11-09 E. I. Du Pont De Nemours And Company Ceramic compositions and articles made therefrom
US3956052A (en) * 1974-02-11 1976-05-11 International Business Machines Corporation Recessed metallurgy for dielectric substrates
US4101710A (en) * 1977-03-07 1978-07-18 E. I. Du Pont De Nemours And Company Silver compositions

Also Published As

Publication number Publication date
ES506657A0 (es) 1982-08-16
US4345955A (en) 1982-08-24
DE3173737D1 (en) 1986-03-20
CA1167979A (en) 1984-05-22
EP0050903B1 (en) 1986-02-05
BR8106873A (pt) 1982-07-06
DK474181A (da) 1982-04-29
ES8206916A1 (es) 1982-08-16
EP0050903A1 (en) 1982-05-05

Similar Documents

Publication Publication Date Title
NO813626L (no) Fremgangsmaate ved fremstilling av en flerlags keramisk modul for anvendelse i forbindelse med integrerte kretser
EP0108211B1 (en) Multi-plate capacitors and methods of making them
US4510000A (en) Method for palladium activating molybdenum metallized features on a ceramic substrate
JPS58209133A (ja) 電気接続方法及びそれを利用する個人カ−ド
CN102149847A (zh) 镍金可电镀厚膜银糊剂和低温共烧陶瓷器件的电镀方法以及由此制备的ltcc器件
CN113068298B (zh) 连接电子部件的陶瓷基板及其制造方法
WO2000026957A1 (en) Method of manufacturing a multi-layered ceramic substrate
US5302219A (en) Method for obtaining via patterns in ceramic sheets
EP0535995B1 (en) Method of manufacturing electronic components
US4301580A (en) Manufacture of multi-layered electrical assemblies
KR930011159B1 (ko) 다층 상호접속 복합물
US6402866B1 (en) Powdered metallic sheet method for deposition of substrate conductors
JPS6235693A (ja) 回路基板
JPH11510963A (ja) セラミック多層基板の製造方法
CN100482037C (zh) 印刷电路板的嵌入式薄膜电阻制造方法
TW202416302A (zh) 厚膜電阻元件的製作方法
EP0078370A1 (en) Method of detecting residual glass during fabrication of ceramic substrates for semiconductors
JPS5828897A (ja) 多層セラミツクモジユ−ルの製法
JPH0542159B2 (es)
CN101202186A (zh) 贴片保险丝及其制造方法
JP3940589B2 (ja) セラミック配線基板の製造方法
JP2794879B2 (ja) 多層基板
JPH0787226B2 (ja) 低誘電率絶縁体基板
JPS6351395B2 (es)
JPS5851598A (ja) 多層セラミツク回路基板及びその製造方法