NL2003084A1 - Correction method for non-uniform reticle heating in a lithographic apparatus. - Google Patents
Correction method for non-uniform reticle heating in a lithographic apparatus. Download PDFInfo
- Publication number
- NL2003084A1 NL2003084A1 NL2003084A NL2003084A NL2003084A1 NL 2003084 A1 NL2003084 A1 NL 2003084A1 NL 2003084 A NL2003084 A NL 2003084A NL 2003084 A NL2003084 A NL 2003084A NL 2003084 A1 NL2003084 A1 NL 2003084A1
- Authority
- NL
- Netherlands
- Prior art keywords
- correction method
- lithographic apparatus
- reticle heating
- uniform
- uniform reticle
- Prior art date
Links
- 238000010438 heat treatment Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
- G03F7/706—Aberration measurement
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70653—Metrology techniques
- G03F7/70666—Aerial image, i.e. measuring the image of the patterned exposure light at the image plane of the projection system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US7631408P | 2008-06-27 | 2008-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL2003084A1 true NL2003084A1 (nl) | 2009-12-29 |
Family
ID=41446990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL2003084A NL2003084A1 (nl) | 2008-06-27 | 2009-06-25 | Correction method for non-uniform reticle heating in a lithographic apparatus. |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8184265B2 (nl) |
| JP (1) | JP4819924B2 (nl) |
| NL (1) | NL2003084A1 (nl) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL2008168A (en) * | 2011-02-25 | 2012-08-28 | Asml Netherlands Bv | Method of calculating model parameters of a substrate, a lithographic apparatus and an apparatus for controlling lithographic processing by a lithographic apparatus. |
| WO2014005780A1 (en) | 2012-07-06 | 2014-01-09 | Asml Netherlands B.V. | A lithographic apparatus |
| CN103226731A (zh) * | 2013-03-20 | 2013-07-31 | 太原理工大学 | 一种热分布图像在线预测方法 |
| JP2015011115A (ja) | 2013-06-27 | 2015-01-19 | マイクロン テクノロジー， インク． | フォトマスクおよび半導体装置の製造方法 |
| US10078272B2 (en) | 2014-12-02 | 2018-09-18 | Asml Netherlands B.V. | Lithographic method and apparatus |
| US10451977B2 (en) | 2014-12-02 | 2019-10-22 | Asml Netherlands B.V. | Lithographic method and apparatus |
| KR102162270B1 (ko) | 2015-09-04 | 2020-10-06 | 어플라이드 머티어리얼스, 인코포레이티드 | 스텝 크기 변경을 통한 라인 에지 거칠기 감소 |
| JP2018529996A (ja) | 2015-09-24 | 2018-10-11 | エーエスエムエル ネザーランズ ビー．ブイ． | リソグラフィプロセスにおけるレチクル加熱及び／又は冷却の影響を低減する方法 |
| US9466538B1 (en) | 2015-11-25 | 2016-10-11 | Globalfoundries Inc. | Method to achieve ultra-high chip-to-chip alignment accuracy for wafer-to-wafer bonding process |
| NL2020531A (en) | 2017-04-06 | 2018-10-10 | Asml Netherlands Bv | Lithographic Method and Apparatus |
| EP3444673A1 (en) * | 2017-08-14 | 2019-02-20 | ASML Netherlands B.V. | Method of adapting feed-forward parameters |
| CN112997117B (zh) | 2018-11-05 | 2024-12-17 | Asml控股股份有限公司 | 测量光刻设备中的图案形成装置的变形的设备和方法 |
| US11243478B2 (en) * | 2019-07-31 | 2022-02-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and method for thermal management of reticle in semiconductor manufacturing |
| CN112578638B (zh) * | 2019-09-29 | 2022-07-01 | 芯恩（青岛）集成电路有限公司 | 一种光刻方法、光刻装置及计算机可读存储介质 |
| EP3800505A1 (en) * | 2019-10-03 | 2021-04-07 | ASML Netherlands B.V. | Measurement system and method for characterizing a patterning device |
| CN112612183A (zh) * | 2020-12-14 | 2021-04-06 | 华虹半导体(无锡)有限公司 | 光罩热效应的补偿方法 |
| CN113093478A (zh) * | 2021-03-10 | 2021-07-09 | 华虹半导体(无锡)有限公司 | 光刻曝光方法、装置和存储介质 |
| CN113703282B (zh) * | 2021-08-02 | 2022-09-06 | 联芯集成电路制造(厦门)有限公司 | 光罩热膨胀校正方法 |
| WO2024138529A1 (zh) * | 2022-12-29 | 2024-07-04 | 中国科学院光电技术研究所 | 一种图案形成装置的热控方法 |
| CN119356023B (zh) * | 2024-10-23 | 2025-07-08 | 珠海市龙图光罩科技有限公司 | 掩模版的光刻方法、装置、设备及存储介质 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0116953A2 (en) * | 1983-02-18 | 1984-08-29 | Hitachi, Ltd. | Alignment apparatus |
| NL8600639A (nl) * | 1986-03-12 | 1987-10-01 | Asm Lithography Bv | Werkwijze voor het ten opzichte van elkaar uitrichten van een masker en een substraat en inrichting voor het uitvoeren van de werkwijze. |
| JPH08227845A (ja) * | 1995-02-21 | 1996-09-03 | Nikon Corp | 投影光学系の検査方法、及び該方法を実施するための投影露光装置 |
| US6151122A (en) * | 1995-02-21 | 2000-11-21 | Nikon Corporation | Inspection method and apparatus for projection optical systems |
| US6342941B1 (en) * | 1996-03-11 | 2002-01-29 | Nikon Corporation | Exposure apparatus and method preheating a mask before exposing; a conveyance method preheating a mask before exposing; and a device manufacturing system and method manufacturing a device according to the exposure apparatus and method |
| JPH09266151A (ja) * | 1996-03-28 | 1997-10-07 | Nikon Corp | 露光装置及び露光方法 |
| JPH10289865A (ja) * | 1997-04-11 | 1998-10-27 | Nikon Corp | 投影露光装置及び投影露光方法 |
| AU2549899A (en) * | 1998-03-02 | 1999-09-20 | Nikon Corporation | Method and apparatus for exposure, method of manufacture of exposure tool, device, and method of manufacture of device |
| JP3720582B2 (ja) * | 1998-06-04 | 2005-11-30 | キヤノン株式会社 | 投影露光装置及び投影露光方法 |
| EP1482373A1 (en) * | 2003-05-30 | 2004-12-01 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP5288838B2 (ja) * | 2008-03-04 | 2013-09-11 | キヤノン株式会社 | 露光装置 |
-
2009
- 2009-06-25 NL NL2003084A patent/NL2003084A1/nl not_active Application Discontinuation
- 2009-06-26 US US12/492,473 patent/US8184265B2/en active Active
- 2009-06-26 JP JP2009151813A patent/JP4819924B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010010687A (ja) | 2010-01-14 |
| US20090323039A1 (en) | 2009-12-31 |
| US8184265B2 (en) | 2012-05-22 |
| JP4819924B2 (ja) | 2011-11-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AD1A | A request for search or an international type search has been filed | ||
| WDAP | Patent application withdrawn |
Effective date: 20150617 |