MY162078A - Copper foil for printed circuit board and copper-clad laminate for printed circuit board - Google Patents
Copper foil for printed circuit board and copper-clad laminate for printed circuit boardInfo
- Publication number
- MY162078A MY162078A MYPI2012003731A MYPI2012003731A MY162078A MY 162078 A MY162078 A MY 162078A MY PI2012003731 A MYPI2012003731 A MY PI2012003731A MY PI2012003731 A MYPI2012003731 A MY PI2012003731A MY 162078 A MY162078 A MY 162078A
- Authority
- MY
- Malaysia
- Prior art keywords
- copper
- circuit board
- printed circuit
- zinc
- copper foil
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 6
- 239000011889 copper foil Substances 0.000 title abstract 5
- 229910052725 zinc Inorganic materials 0.000 abstract 4
- 239000011701 zinc Substances 0.000 abstract 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract 2
- 238000005530 etching Methods 0.000 abstract 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract 1
- KOMIMHZRQFFCOR-UHFFFAOYSA-N [Ni].[Cu].[Zn] Chemical compound [Ni].[Cu].[Zn] KOMIMHZRQFFCOR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 230000003628 erosive effect Effects 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 238000004381 surface treatment Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010038285 | 2010-02-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY162078A true MY162078A (en) | 2017-05-31 |
Family
ID=44506726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2012003731A MY162078A (en) | 2010-02-24 | 2011-02-21 | Copper foil for printed circuit board and copper-clad laminate for printed circuit board |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP5254491B2 (ja) |
| KR (1) | KR101344176B1 (ja) |
| CN (1) | CN102783255B (ja) |
| MY (1) | MY162078A (ja) |
| TW (1) | TWI509113B (ja) |
| WO (1) | WO2011105318A1 (ja) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5497808B2 (ja) * | 2012-01-18 | 2014-05-21 | Ｊｘ日鉱日石金属株式会社 | 表面処理銅箔及びそれを用いた銅張積層板 |
| KR101519314B1 (ko) * | 2013-10-18 | 2015-05-11 | 미쓰비시덴키 가부시키가이샤 | 가공 테이블용 지그, 가공 테이블용 지그의 제조 방법 및 레이저 가공 방법 |
| CN112041485B (zh) | 2018-04-27 | 2023-07-14 | Ｊｘ金属株式会社 | 表面处理铜箔、覆铜积层板及印刷配线板 |
| US12363826B2 (en) * | 2018-07-18 | 2025-07-15 | Resonac Corporation | Copper-clad laminate, printed wiring board, semiconductor package and method for producing copper-clad laminate |
| WO2022014647A1 (ja) * | 2020-07-16 | 2022-01-20 | 三井金属鉱業株式会社 | 銅張積層板及びプリント配線板の製造方法 |
| CN116399655B (zh) * | 2022-11-23 | 2025-10-31 | 立芯精密智造(昆山)有限公司 | 一种微腐蚀液及其在显现单质金属镀层Cu-Ni交界面分界线中的应用 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07202367A (ja) * | 1993-12-28 | 1995-08-04 | Japan Energy Corp | 印刷回路用銅箔の表面処理方法 |
| JP3292774B2 (ja) * | 1994-02-15 | 2002-06-17 | 三井金属鉱業株式会社 | プリント配線板用銅箔およびその製造方法 |
| JP3142259B2 (ja) * | 1998-11-30 | 2001-03-07 | 三井金属鉱業株式会社 | 耐薬品性および耐熱性に優れたプリント配線板用銅箔およびその製造方法 |
| JP3670185B2 (ja) * | 2000-01-28 | 2005-07-13 | 三井金属鉱業株式会社 | プリント配線板用表面処理銅箔の製造方法 |
| JP4172704B2 (ja) * | 2003-07-31 | 2008-10-29 | 日鉱金属株式会社 | 表面処理銅箔およびそれを使用した基板 |
| JP4907580B2 (ja) * | 2008-03-25 | 2012-03-28 | 新日鐵化学株式会社 | フレキシブル銅張積層板 |
| CN101981230B (zh) * | 2008-06-17 | 2013-01-16 | Jx日矿日石金属株式会社 | 印刷电路板用铜箔及印刷电路板用包铜层压板 |
-
2011
- 2011-02-21 WO PCT/JP2011/053646 patent/WO2011105318A1/ja not_active Ceased
- 2011-02-21 CN CN201180010771.3A patent/CN102783255B/zh not_active Expired - Fee Related
- 2011-02-21 KR KR1020127019538A patent/KR101344176B1/ko not_active Expired - Fee Related
- 2011-02-21 MY MYPI2012003731A patent/MY162078A/en unknown
- 2011-02-21 JP JP2012501763A patent/JP5254491B2/ja not_active Expired - Fee Related
- 2011-02-23 TW TW100105943A patent/TWI509113B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP5254491B2 (ja) | 2013-08-07 |
| TW201137183A (en) | 2011-11-01 |
| WO2011105318A1 (ja) | 2011-09-01 |
| CN102783255A (zh) | 2012-11-14 |
| KR101344176B1 (ko) | 2013-12-20 |
| CN102783255B (zh) | 2017-04-19 |
| TWI509113B (zh) | 2015-11-21 |
| KR20120115339A (ko) | 2012-10-17 |
| JPWO2011105318A1 (ja) | 2013-06-20 |
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