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MY147246A - Electronic assembly with detachable components - Google Patents

Electronic assembly with detachable components

Info

Publication number
MY147246A
MY147246A MYPI20080463A MYPI20080463A MY147246A MY 147246 A MY147246 A MY 147246A MY PI20080463 A MYPI20080463 A MY PI20080463A MY PI20080463 A MYPI20080463 A MY PI20080463A MY 147246 A MY147246 A MY 147246A
Authority
MY
Malaysia
Prior art keywords
electronic assembly
components
acm
fixture
assembly
Prior art date
Application number
MYPI20080463A
Other languages
English (en)
Inventor
Chen Kong-Chen
Original Assignee
Wintec Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/351,418 external-priority patent/US7928591B2/en
Priority claimed from US11/593,788 external-priority patent/US20070187844A1/en
Application filed by Wintec Ind Inc filed Critical Wintec Ind Inc
Publication of MY147246A publication Critical patent/MY147246A/en

Links

Classifications

    • H10W76/161—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H10W46/00—
    • H10W72/00—
    • H10W72/30—
    • H10W76/60—
    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10159—Memory
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H10W20/20—
    • H10W46/301—
    • H10W46/503—
    • H10W46/507—
    • H10W46/601—
    • H10W70/63—
    • H10W72/352—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
MYPI20080463A 2006-02-10 2007-02-09 Electronic assembly with detachable components MY147246A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/351,418 US7928591B2 (en) 2005-02-11 2006-02-10 Apparatus and method for predetermined component placement to a target platform
US11/593,788 US20070187844A1 (en) 2006-02-10 2006-11-06 Electronic assembly with detachable components

Publications (1)

Publication Number Publication Date
MY147246A true MY147246A (en) 2012-11-14

Family

ID=44839717

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20080463A MY147246A (en) 2006-02-10 2007-02-09 Electronic assembly with detachable components

Country Status (4)

Country Link
JP (1) JP5221387B2 (zh)
DE (1) DE112007000316T5 (zh)
MY (1) MY147246A (zh)
TW (1) TWI401005B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111799031A (zh) * 2020-07-14 2020-10-20 周开 一种多层超导带材叠成的高温超导体
US20220223441A1 (en) * 2021-01-08 2022-07-14 Kla Corporation Process condition sensing apparatus

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3482826B2 (ja) * 1997-08-01 2004-01-06 セイコーエプソン株式会社 Ｉｃ実装方法、液晶表示装置および電子機器並びに液晶表示装置の製造装置
JP4257534B2 (ja) * 1998-07-28 2009-04-22 セイコーエプソン株式会社 半導体装置の製造方法
JP2000100873A (ja) * 1998-09-18 2000-04-07 Matsushita Electric Ind Co Ltd ベアチップ実装方法
JP4246835B2 (ja) * 1999-03-09 2009-04-02 ローム株式会社 半導体集積装置
JP2002353602A (ja) * 2002-03-06 2002-12-06 Matsushita Electric Ind Co Ltd バンプ付きワークの実装用導電性ペースト
JP2004079905A (ja) * 2002-08-21 2004-03-11 Sony Corp 半導体装置及びその製造方法
JP4221238B2 (ja) * 2002-09-26 2009-02-12 エルピーダメモリ株式会社 メモリモジュール
DE10297818T5 (de) * 2002-11-29 2006-03-16 Infineon Technologies Ag Anbringen von Flipchips an Substraten
DE10336171B3 (de) * 2003-08-07 2005-02-10 Technische Universität Braunschweig Carolo-Wilhelmina Multichip-Schaltungsmodul und Verfahren zur Herstellung hierzu

Also Published As

Publication number Publication date
DE112007000316T5 (de) 2008-12-11
JP5221387B2 (ja) 2013-06-26
TW200833207A (en) 2008-08-01
JP2009526403A (ja) 2009-07-16
TWI401005B (zh) 2013-07-01

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