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MXPA02008185A - Soportes electronicos y metodos y aparato para formar aberturas en soportes electronicos. - Google Patents

Soportes electronicos y metodos y aparato para formar aberturas en soportes electronicos.

Info

Publication number
MXPA02008185A
MXPA02008185A MXPA02008185A MXPA02008185A MXPA02008185A MX PA02008185 A MXPA02008185 A MX PA02008185A MX PA02008185 A MXPA02008185 A MX PA02008185A MX PA02008185 A MXPA02008185 A MX PA02008185A MX PA02008185 A MXPA02008185 A MX PA02008185A
Authority
MX
Mexico
Prior art keywords
electronic supports
layer
methods
forming apertures
electronic
Prior art date
Application number
MXPA02008185A
Other languages
English (en)
Inventor
Hilinski Kami Lammon
Original Assignee
Ppg Ind Ohio Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ppg Ind Ohio Inc filed Critical Ppg Ind Ohio Inc
Publication of MXPA02008185A publication Critical patent/MXPA02008185A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/10—Arrangements for cooling or lubricating tools or work
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/465—Coatings containing composite materials
    • C03C25/47—Coatings containing composite materials containing particles, fibres or flakes, e.g. in a continuous phase
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Composite Materials (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Casings For Electric Apparatus (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

La presente invencion provee un soporte electronico (210) que comprende: (A) una capa de prepreg (214) que comprende: (1) por lo menos un material de refuerzo (220); (2) por lo menos un material de matriz (216) en contacto con por lo menos una porcion de el o los materiales de refuerzo (220) y (B) por lo menos una capa (217) en contacto con por lo menos una porcion (224) de por lo menos una superficie de la capa de prepreg (214), la o las capas (217) comprenden por lo menos una carga inorganica (218) y no mas de 25 por ciento en peso de materiales adhesivos con base en el peso total de por lo menos una capa (217), con base en los solidos totales.
MXPA02008185A 2000-02-22 2001-02-22 Soportes electronicos y metodos y aparato para formar aberturas en soportes electronicos. MXPA02008185A (es)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US18402600P 2000-02-22 2000-02-22
US18397900P 2000-02-22 2000-02-22
US23361900P 2000-09-18 2000-09-18
US78353701A 2001-02-15 2001-02-15
PCT/US2001/005680 WO2001063984A1 (en) 2000-02-22 2001-02-22 Electronic supports and methods and apparatus for forming apertures in electronic supports

Publications (1)

Publication Number Publication Date
MXPA02008185A true MXPA02008185A (es) 2004-08-12

Family

ID=27497584

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA02008185A MXPA02008185A (es) 2000-02-22 2001-02-22 Soportes electronicos y metodos y aparato para formar aberturas en soportes electronicos.

Country Status (11)

Country Link
EP (1) EP1258179A1 (es)
JP (1) JP2003524302A (es)
KR (1) KR20020077917A (es)
CN (1) CN1444838A (es)
AU (1) AU2001241660A1 (es)
BR (1) BR0108561A (es)
CA (1) CA2400787A1 (es)
HK (1) HK1047678A1 (es)
MX (1) MXPA02008185A (es)
TW (1) TW550987B (es)
WO (1) WO2001063984A1 (es)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10693137B2 (en) 2013-07-10 2020-06-23 Boron Nitride Power, Llc Functionalized boron nitride materials as electroactive species in electrochemical energy storage devices

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1473328B1 (en) * 2002-02-06 2011-05-04 Sekisui Chemical Co., Ltd. Resin composition
KR100850760B1 (ko) * 2007-05-30 2008-08-06 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP5367523B2 (ja) * 2009-09-25 2013-12-11 新光電気工業株式会社 配線基板及び配線基板の製造方法
US9484123B2 (en) 2011-09-16 2016-11-01 Prc-Desoto International, Inc. Conductive sealant compositions
JP6712774B2 (ja) 2016-03-23 2020-06-24 パナソニックＩｐマネジメント株式会社 プリプレグ、金属張積層板、プリント配線板、プリプレグの製造方法
KR102893631B1 (ko) * 2021-10-07 2025-12-02 삼성디스플레이 주식회사 전자 장치
CN116396678B (zh) * 2021-12-27 2024-08-09 山东工业陶瓷研究设计院有限公司 一种常温固化辐射涂层料浆、辐射涂层及其制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2493662A1 (fr) * 1980-11-05 1982-05-07 Rhone Poulenc Ind Substrats metallises pour circuits imprimes et leur procede de preparation
GB2185437B (en) * 1985-12-26 1989-12-06 Hitachi Chemical Co Ltd Ceramic coated laminate and process for producing the same
US5552209A (en) * 1994-07-29 1996-09-03 Minnesota Mining And Manufacturing Company Internally damped circuit articles
IL137975A0 (en) * 1998-03-03 2001-10-31 Ppg Ind Ohio Inc Inorganic lubricant-coated glass strands and products including the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10693137B2 (en) 2013-07-10 2020-06-23 Boron Nitride Power, Llc Functionalized boron nitride materials as electroactive species in electrochemical energy storage devices

Also Published As

Publication number Publication date
JP2003524302A (ja) 2003-08-12
EP1258179A1 (en) 2002-11-20
HK1047678A1 (zh) 2003-02-28
WO2001063984A1 (en) 2001-08-30
CN1444838A (zh) 2003-09-24
CA2400787A1 (en) 2001-08-30
BR0108561A (pt) 2002-11-12
AU2001241660A1 (en) 2001-09-03
KR20020077917A (ko) 2002-10-14
TW550987B (en) 2003-09-01

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