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MXPA02008186A - Soportes electronicos y metodos y aparato para formar aberturas en soportes electronicos.. - Google Patents

Soportes electronicos y metodos y aparato para formar aberturas en soportes electronicos..

Info

Publication number
MXPA02008186A
MXPA02008186A MXPA02008186A MXPA02008186A MXPA02008186A MX PA02008186 A MXPA02008186 A MX PA02008186A MX PA02008186 A MXPA02008186 A MX PA02008186A MX PA02008186 A MXPA02008186 A MX PA02008186A MX PA02008186 A MXPA02008186 A MX PA02008186A
Authority
MX
Mexico
Prior art keywords
inorganic filler
electronic supports
matrix material
methods
forming apertures
Prior art date
Application number
MXPA02008186A
Other languages
English (en)
Inventor
Charles F Ii Kahle
Original Assignee
Ppg Ind Ohio Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ppg Ind Ohio Inc filed Critical Ppg Ind Ohio Inc
Publication of MXPA02008186A publication Critical patent/MXPA02008186A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/465—Coatings containing composite materials
    • C03C25/47—Coatings containing composite materials containing particles, fibres or flakes, e.g. in a continuous phase
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3382—Including a free metal or alloy constituent
    • Y10T442/3415—Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the woven fabric]
    • Y10T442/3455—Including particulate material other than fiber

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Composite Materials (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Casings For Electric Apparatus (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

La presente invencion provee un soporte electronico (10) que comprende: (A) por lo menos un material de refuerzo de fibra tejida (20) formado a partir de por lo menos una fibra libre de vidrio basaltico y (B) por lo menos un material de matriz (16) en contacto con por lo menos una porcion de el o los materiales de refuerzo (20), el o los materiales de matriz (16) comprende por lo menos un polimero no fluorado y por lo menos una carga inorganica (18), en donde la o las cargas inorganicas (18) comprenden por lo menos un lubricante solido, inorganico, lamelar y no hidratable que tiene una resistividad electrica alta y en donde la o las cargas inorganicas (18) comprenden por lo menos 6 por ciento en peso de un peso combinado total de la o las cargas inorganicas (18) y el o los materiales de matriz (16), con base en los solidos totales.
MXPA02008186A 2000-02-22 2001-02-22 Soportes electronicos y metodos y aparato para formar aberturas en soportes electronicos.. MXPA02008186A (es)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US18402600P 2000-02-22 2000-02-22
US18397900P 2000-02-22 2000-02-22
US23361900P 2000-09-18 2000-09-18
US09/783,538 US20020123285A1 (en) 2000-02-22 2001-02-15 Electronic supports and methods and apparatus for forming apertures in electronic supports
PCT/US2001/005729 WO2001063985A2 (en) 2000-02-22 2001-02-22 Electronic supports and methods and apparatus for forming apertures in electronic supports

Publications (1)

Publication Number Publication Date
MXPA02008186A true MXPA02008186A (es) 2004-08-12

Family

ID=27497585

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA02008186A MXPA02008186A (es) 2000-02-22 2001-02-22 Soportes electronicos y metodos y aparato para formar aberturas en soportes electronicos..

Country Status (12)

Country Link
US (1) US20020123285A1 (es)
EP (1) EP1258178A2 (es)
JP (1) JP2003526202A (es)
KR (1) KR20020077503A (es)
CN (1) CN1425268A (es)
AU (1) AU2001238644A1 (es)
BR (1) BR0108559A (es)
CA (1) CA2400790A1 (es)
HK (1) HK1048045A1 (es)
MX (1) MXPA02008186A (es)
TW (1) TW552831B (es)
WO (1) WO2001063985A2 (es)

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US6783860B1 (en) * 2001-05-11 2004-08-31 R. E. Service Company, Inc. Laminated entry and exit material for drilling printed circuit boards
US7013965B2 (en) * 2003-04-29 2006-03-21 General Electric Company Organic matrices containing nanomaterials to enhance bulk thermal conductivity
US20050112344A1 (en) * 2003-08-20 2005-05-26 Redfern Sean M. Apparatus and method for use in printed circuit board drilling applications
US20050061496A1 (en) * 2003-09-24 2005-03-24 Matabayas James Christopher Thermal interface material with aligned carbon nanotubes
US7291390B2 (en) * 2003-11-07 2007-11-06 Ppg Industries Ohio, Inc. Sizing composition for glass fibers and sized fiber glass products
JP4241340B2 (ja) * 2003-11-25 2009-03-18 日東電工株式会社 樹脂シート、液晶セル基板、液晶表示装置、エレクトロルミネッセンス表示装置用基板、エレクトロルミネッセンス表示装置および太陽電池用基板
EP1751796A1 (en) * 2004-05-20 2007-02-14 General Electric Company, (a New York Corporation) Organic matrices containing nanomaterials to enhance bulk thermal conductivity
US20060003624A1 (en) * 2004-06-14 2006-01-05 Dow Richard M Interposer structure and method
FR2877001B1 (fr) * 2004-10-21 2006-12-15 Saint Gobain Vetrotex Fils de verre ensimes electro-conducteurs.
US7709599B2 (en) * 2005-10-12 2010-05-04 Ppg Industries Ohio, Inc. Compounds, rosins, and sizing compositions
WO2007114392A1 (ja) * 2006-03-30 2007-10-11 Kyocera Corporation 配線基板および実装構造体
KR100859051B1 (ko) * 2007-03-26 2008-09-17 전병옥 신축성 선재 및 이를 이용한 결합체
CH699836B1 (de) * 2007-09-18 2010-05-14 Ct Concept Holding Ag Leiterkarte und Verfahren zum Herstellen einer solchen Leiterkarte.
CN101878678A (zh) 2007-09-28 2010-11-03 三星层板有限公司 用于在印刷电路板中钻孔的改进系统和方法
KR100979541B1 (ko) 2008-07-16 2010-09-02 삼성전기주식회사 프리프레그, 프리프레그 제조방법 및 이를 이용한동박적층판
US20100164030A1 (en) * 2008-12-31 2010-07-01 International Business Machines Corporation Chip carrier bearing large silicon for high performance computing and related method
JP5420963B2 (ja) * 2009-04-21 2014-02-19 ジャパンマテックス株式会社 パッキン材料及びこの材料を用いたグランドパッキン
KR101037107B1 (ko) * 2009-11-30 2011-05-26 삼성전기주식회사 캐비티 형성용 패드 및 이를 이용한 캐비티 형성 방법
CN103766009B (zh) 2011-08-29 2017-08-11 飞利浦照明控股有限公司 柔性照明组件、灯具和制造柔性层的方法
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JP6585438B2 (ja) * 2015-02-10 2019-10-02 株式会社東芝 電気絶縁体および高電圧機器
US20160368821A1 (en) * 2015-06-17 2016-12-22 International Business Machines Corporation Method of glass fabric production including resin adhesion for printed circuit board formation
CN105555021B (zh) * 2016-02-29 2018-06-08 沪士电子股份有限公司 防caf印刷线路板的基板及其制造方法
EP3520584B1 (en) * 2016-09-27 2026-01-14 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Flame retardant structure for component carrier
DE112019005002T5 (de) 2018-10-02 2021-06-24 Rogers Corporation Gedruckte Leiterplatten-Substrate, bestehend aus einem beschichteten Bornitrid
CN109851336B (zh) * 2019-01-23 2021-09-24 中南大学 一种高模量致密连续莫来石纳米陶瓷纤维及其制备方法
EP4004097A4 (en) * 2019-07-31 2024-05-29 Northeastern University THERMALLY CONDUCTIVE BORON NITRIDE FILMS AND MULTILAYER COMPOSITES CONTAINING THEM
CN116997576A (zh) * 2021-03-24 2023-11-03 松下知识产权经营株式会社 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板、以及布线板
KR102573552B1 (ko) * 2021-10-20 2023-09-01 주식회사 심텍 Ald 공법을 이용한 반도체 패키지용 인쇄회로기판 및 그 반도체 패키지
CN115028171B (zh) * 2022-06-30 2023-12-01 陕西科技大学 一种通过离子交换法制备玄武岩纳米片及制备方法
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Also Published As

Publication number Publication date
CA2400790A1 (en) 2001-08-30
HK1048045A1 (zh) 2003-03-14
WO2001063985A3 (en) 2002-04-04
AU2001238644A1 (en) 2001-09-03
TW552831B (en) 2003-09-11
CN1425268A (zh) 2003-06-18
WO2001063985A2 (en) 2001-08-30
US20020123285A1 (en) 2002-09-05
KR20020077503A (ko) 2002-10-11
EP1258178A2 (en) 2002-11-20
JP2003526202A (ja) 2003-09-02
BR0108559A (pt) 2005-01-11

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