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MXPA02008185A - Electronic supports and methods and apparatus for forming apertures in electronic supports. - Google Patents

Electronic supports and methods and apparatus for forming apertures in electronic supports.

Info

Publication number
MXPA02008185A
MXPA02008185A MXPA02008185A MXPA02008185A MXPA02008185A MX PA02008185 A MXPA02008185 A MX PA02008185A MX PA02008185 A MXPA02008185 A MX PA02008185A MX PA02008185 A MXPA02008185 A MX PA02008185A MX PA02008185 A MXPA02008185 A MX PA02008185A
Authority
MX
Mexico
Prior art keywords
electronic supports
layer
methods
forming apertures
electronic
Prior art date
Application number
MXPA02008185A
Other languages
Spanish (es)
Inventor
Hilinski Kami Lammon
Original Assignee
Ppg Ind Ohio Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ppg Ind Ohio Inc filed Critical Ppg Ind Ohio Inc
Publication of MXPA02008185A publication Critical patent/MXPA02008185A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/10—Arrangements for cooling or lubricating tools or work
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/465—Coatings containing composite materials
    • C03C25/47—Coatings containing composite materials containing particles, fibres or flakes, e.g. in a continuous phase
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Composite Materials (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Casings For Electric Apparatus (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The present invention provides an electronic support (210) comprising: (A) a prepeg layer (214) comprising: (1) at least one reinforcement material (220); (2) at least one matrix material (216) in contact with at least a portion of the at least one reinforcement material (220); and (B) at least one layer (217) in contact with at least a portion (224) of at least one surface of the prepeg layer (214), the at least one layer (217) comprising at least one inorganic filler (218) and not greater than 25 weight percent of adhesive materials based on the total weight of at least one layer (217) on a total solids basis.
MXPA02008185A 2000-02-22 2001-02-22 Electronic supports and methods and apparatus for forming apertures in electronic supports. MXPA02008185A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US18402600P 2000-02-22 2000-02-22
US18397900P 2000-02-22 2000-02-22
US23361900P 2000-09-18 2000-09-18
US78353701A 2001-02-15 2001-02-15
PCT/US2001/005680 WO2001063984A1 (en) 2000-02-22 2001-02-22 Electronic supports and methods and apparatus for forming apertures in electronic supports

Publications (1)

Publication Number Publication Date
MXPA02008185A true MXPA02008185A (en) 2004-08-12

Family

ID=27497584

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA02008185A MXPA02008185A (en) 2000-02-22 2001-02-22 Electronic supports and methods and apparatus for forming apertures in electronic supports.

Country Status (11)

Country Link
EP (1) EP1258179A1 (en)
JP (1) JP2003524302A (en)
KR (1) KR20020077917A (en)
CN (1) CN1444838A (en)
AU (1) AU2001241660A1 (en)
BR (1) BR0108561A (en)
CA (1) CA2400787A1 (en)
HK (1) HK1047678A1 (en)
MX (1) MXPA02008185A (en)
TW (1) TW550987B (en)
WO (1) WO2001063984A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10693137B2 (en) 2013-07-10 2020-06-23 Boron Nitride Power, Llc Functionalized boron nitride materials as electroactive species in electrochemical energy storage devices

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1473328B1 (en) * 2002-02-06 2011-05-04 Sekisui Chemical Co., Ltd. Resin composition
KR100850760B1 (en) * 2007-05-30 2008-08-06 삼성전기주식회사 Printed Circuit Board and Manufacturing Method
JP5367523B2 (en) * 2009-09-25 2013-12-11 新光電気工業株式会社 Wiring board and method of manufacturing wiring board
US9484123B2 (en) 2011-09-16 2016-11-01 Prc-Desoto International, Inc. Conductive sealant compositions
JP6712774B2 (en) 2016-03-23 2020-06-24 パナソニックＩｐマネジメント株式会社 Manufacturing method of prepreg, metal-clad laminate, printed wiring board, and prepreg
KR102893631B1 (en) * 2021-10-07 2025-12-02 삼성디스플레이 주식회사 Display device
CN116396678B (en) * 2021-12-27 2024-08-09 山东工业陶瓷研究设计院有限公司 Normal-temperature curing radiation coating slurry, radiation coating and preparation method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2493662A1 (en) * 1980-11-05 1982-05-07 Rhone Poulenc Ind METALLIZED SUBSTRATES FOR PRINTED CIRCUITS AND PROCESS FOR PREPARING THE SAME
GB2185437B (en) * 1985-12-26 1989-12-06 Hitachi Chemical Co Ltd Ceramic coated laminate and process for producing the same
US5552209A (en) * 1994-07-29 1996-09-03 Minnesota Mining And Manufacturing Company Internally damped circuit articles
IL137975A0 (en) * 1998-03-03 2001-10-31 Ppg Ind Ohio Inc Inorganic lubricant-coated glass strands and products including the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10693137B2 (en) 2013-07-10 2020-06-23 Boron Nitride Power, Llc Functionalized boron nitride materials as electroactive species in electrochemical energy storage devices

Also Published As

Publication number Publication date
JP2003524302A (en) 2003-08-12
EP1258179A1 (en) 2002-11-20
HK1047678A1 (en) 2003-02-28
WO2001063984A1 (en) 2001-08-30
CN1444838A (en) 2003-09-24
CA2400787A1 (en) 2001-08-30
BR0108561A (en) 2002-11-12
AU2001241660A1 (en) 2001-09-03
KR20020077917A (en) 2002-10-14
TW550987B (en) 2003-09-01

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