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MX2018009285A - Metodo y dispositivo para la creacion planar y modificaciones en estados solidos. - Google Patents

Metodo y dispositivo para la creacion planar y modificaciones en estados solidos.

Info

Publication number
MX2018009285A
MX2018009285A MX2018009285A MX2018009285A MX2018009285A MX 2018009285 A MX2018009285 A MX 2018009285A MX 2018009285 A MX2018009285 A MX 2018009285A MX 2018009285 A MX2018009285 A MX 2018009285A MX 2018009285 A MX2018009285 A MX 2018009285A
Authority
MX
Mexico
Prior art keywords
solid state
modifications
solid bodies
laser processing
producing planar
Prior art date
Application number
MX2018009285A
Other languages
English (en)
Inventor
Rieske Ralf
Beyer Christian
Günther Christoph
Richter Jan
Swoboda Marko
Original Assignee
Siltectra Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltectra Gmbh filed Critical Siltectra Gmbh
Publication of MX2018009285A publication Critical patent/MX2018009285A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • H10P74/203—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Laser Beam Processing (AREA)
  • Silicon Compounds (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

La presente invención se relaciona con un método para crear modificaciones en un estado sólido, en donde una región para guía de grietas para guiar una grieta para separar una porción de estado sólido, en particular una capa de estado sólido, desde el cuerpo de estado sólido, se predetermina por las modificaciones. El método de acuerdo con la invención de preferencia comprende los pasos: Mover el estado sólido con relación al sistema para procesamiento por láser, luego generar una pluralidad de haces láser por medio del sistema para procesamiento por láser para crear al menos una modificación, en donde el sistema para procesamiento por láser se ajusta para enfocamiento definido de los haces láser continuamente como una función de una pluralidad de parámetros, en particular al menos dos parámetros. (figura 1).
MX2018009285A 2016-01-05 2016-12-12 Metodo y dispositivo para la creacion planar y modificaciones en estados solidos. MX2018009285A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016000051.1A DE102016000051A1 (de) 2016-01-05 2016-01-05 Verfahren und Vorrichtung zum planaren Erzeugen von Modifikationen in Festkörpern
PCT/EP2016/080667 WO2017118533A1 (de) 2016-01-05 2016-12-12 Verfahren und vorrichtung zum planaren erzeugen von modifikationen in festkörpern

Publications (1)

Publication Number Publication Date
MX2018009285A true MX2018009285A (es) 2019-02-28

Family

ID=57680223

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2018009285A MX2018009285A (es) 2016-01-05 2016-12-12 Metodo y dispositivo para la creacion planar y modificaciones en estados solidos.

Country Status (13)

Country Link
US (2) US11059202B2 (es)
EP (1) EP3400110B1 (es)
JP (2) JP6818755B2 (es)
KR (1) KR102125439B1 (es)
CN (1) CN108472766B (es)
BR (1) BR112018013599A2 (es)
CA (1) CA3010394A1 (es)
DE (1) DE102016000051A1 (es)
MX (1) MX2018009285A (es)
MY (1) MY191384A (es)
SG (1) SG11201805682WA (es)
WO (1) WO2017118533A1 (es)
ZA (1) ZA201804352B (es)

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CN111420938B (zh) * 2020-04-28 2022-03-15 株洲国创轨道科技有限公司 一种多激光头智能化激光清洗方法及装置
CN113146048A (zh) * 2021-03-17 2021-07-23 广东工业大学 一种激光应力辅助pdms表面裂纹生长的方法及装置
CN114800899A (zh) * 2022-04-19 2022-07-29 广东高景太阳能科技有限公司 一种单晶硅片色差改善方法、系统、存储介质及电子设备
CN117283152A (zh) * 2023-08-17 2023-12-26 山东大学 一种高效率激光切割碳化硅晶锭的方法及装置
CN120095315B (zh) * 2025-04-29 2025-09-16 西湖仪器(杭州)技术有限公司 一种SiC晶锭的激光加工装置

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Also Published As

Publication number Publication date
KR102125439B1 (ko) 2020-06-22
CN108472766B (zh) 2021-02-09
EP3400110A1 (de) 2018-11-14
BR112018013599A2 (pt) 2019-01-08
DE102016000051A1 (de) 2017-07-06
WO2017118533A1 (de) 2017-07-13
US20210299910A1 (en) 2021-09-30
MY191384A (en) 2022-06-22
CA3010394A1 (en) 2017-07-13
CN108472766A (zh) 2018-08-31
JP2019500220A (ja) 2019-01-10
US11059202B2 (en) 2021-07-13
SG11201805682WA (en) 2018-08-30
EP3400110B1 (de) 2021-04-07
JP6818755B2 (ja) 2021-01-20
JP7271501B2 (ja) 2023-05-11
US20190366586A1 (en) 2019-12-05
KR20180100063A (ko) 2018-09-06
JP2021061435A (ja) 2021-04-15
ZA201804352B (en) 2019-06-26

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