MX2016014012A - Aleacion de soldadura libre de plomo. - Google Patents
Aleacion de soldadura libre de plomo.Info
- Publication number
- MX2016014012A MX2016014012A MX2016014012A MX2016014012A MX2016014012A MX 2016014012 A MX2016014012 A MX 2016014012A MX 2016014012 A MX2016014012 A MX 2016014012A MX 2016014012 A MX2016014012 A MX 2016014012A MX 2016014012 A MX2016014012 A MX 2016014012A
- Authority
- MX
- Mexico
- Prior art keywords
- lead
- mass
- free solder
- solder alloy
- free
- Prior art date
Links
- 229910045601 alloy Inorganic materials 0.000 title abstract 5
- 239000000956 alloy Substances 0.000 title abstract 5
- 229910000679 solder Inorganic materials 0.000 title abstract 4
- 239000000203 mixture Substances 0.000 abstract 3
- 238000003466 welding Methods 0.000 abstract 3
- 229910020882 Sn-Cu-Ni Inorganic materials 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
Abstract
El propósito de la presente invención es proveer una aleación de soldadura libre de plomo y soldadura en la cual es posible mantener alta resistencia de unión que no disminuye incluso en un estado de alta temperatura después de la soldadura, la aleación de soldadura libre de plomo y soldadura que tiene alto grado de confiabilidad y versatilidad. En la presente invención, la composición base es Sn-Cu-Ni, la composición de aleación libre de plomo contiene 0.1 a 2.0% en masa de Cu, 0.01 a 0.5% en masa de Ni, 0.1 a 5% en masa de Bi y 76.0 a 99.5% en masa de Sn. Como resultado de tal composición de aleación libre de plomo, la fuerza de unión de la soldadura no disminuye durante la soldadura, incluso cuando la soldadura es expuesta a altas temperaturas durante un largo período de tiempo, como será evidente, permitiendo mediante esto una soldadura altamente confiable.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014094277 | 2014-04-30 | ||
| JP2015004403 | 2015-01-13 | ||
| PCT/JP2015/062818 WO2015166945A1 (ja) | 2014-04-30 | 2015-04-28 | 鉛フリーはんだ合金 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| MX2016014012A true MX2016014012A (es) | 2017-01-11 |
| MX378787B MX378787B (es) | 2025-03-10 |
Family
ID=54358672
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2016014012A MX378787B (es) | 2014-04-30 | 2015-04-28 | Aleación de soldadura libre de plomo. |
| MX2021000260A MX2021000260A (es) | 2014-04-30 | 2016-10-25 | Aleacion de soldadura libre de plomo. |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2021000260A MX2021000260A (es) | 2014-04-30 | 2016-10-25 | Aleacion de soldadura libre de plomo. |
Country Status (15)
| Country | Link |
|---|---|
| US (1) | US10286497B2 (es) |
| EP (2) | EP3138658B1 (es) |
| JP (3) | JP5872114B1 (es) |
| KR (1) | KR20160147996A (es) |
| CN (3) | CN114161023A (es) |
| AU (1) | AU2015254179B2 (es) |
| BR (2) | BR122021001612B1 (es) |
| CA (1) | CA2946994C (es) |
| HK (1) | HK1259425A1 (es) |
| MX (2) | MX378787B (es) |
| MY (1) | MY188657A (es) |
| PH (1) | PH12016502152B1 (es) |
| RU (3) | RU2018118008A (es) |
| SG (1) | SG11201608933SA (es) |
| WO (1) | WO2015166945A1 (es) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BR122021001612B1 (pt) * | 2014-04-30 | 2021-10-13 | Nihon Superior Co., Ltd | Liga de solda isenta de chumbo e isenta de prata, e junta soldada que utiliza a mesma |
| JP6788337B2 (ja) * | 2015-10-16 | 2020-11-25 | Ａｇｃ株式会社 | 接合用組成物 |
| JP6504401B2 (ja) * | 2015-11-05 | 2019-04-24 | パナソニックＩｐマネジメント株式会社 | はんだ合金およびそれを用いた実装構造体 |
| CN105665956A (zh) * | 2016-03-23 | 2016-06-15 | 徐宏达 | 一种用于钎焊铝及其合金的软钎料合金 |
| JP6755546B2 (ja) * | 2016-08-09 | 2020-09-16 | 株式会社日本スペリア社 | 接合方法 |
| CN108290249B (zh) * | 2016-09-13 | 2020-01-10 | 千住金属工业株式会社 | 软钎料合金、焊料球和钎焊接头 |
| CN106825983B (zh) * | 2017-03-10 | 2020-05-05 | 南京达迈科技实业有限公司 | 一种SnAgSbNi系无铅焊锡合金及其制备方法和应用 |
| JPWO2018174162A1 (ja) * | 2017-03-23 | 2019-03-28 | 株式会社日本スペリア社 | はんだ継手 |
| ES2887361T3 (es) * | 2017-03-31 | 2021-12-22 | Senju Metal Industry Co | Aleación para soldadura, pasta para soldadura y unión de soldadura |
| WO2018235925A1 (ja) * | 2017-06-22 | 2018-12-27 | Ａｇｃ株式会社 | 窓材、光学パッケージ |
| CN107671451A (zh) * | 2017-08-21 | 2018-02-09 | 番禺得意精密电子工业有限公司 | 电连接器及其焊料 |
| US11123823B2 (en) * | 2017-11-08 | 2021-09-21 | Alpha Assembly Solutions Inc. | Cost-effective lead-free solder alloy for electronic applications |
| JP7420363B2 (ja) * | 2018-03-06 | 2024-01-23 | 株式会社日本スペリア社 | はんだ継手 |
| JP7287606B2 (ja) * | 2018-08-10 | 2023-06-06 | 株式会社日本スペリア社 | 鉛フリーはんだ合金 |
| CN108994480A (zh) * | 2018-10-10 | 2018-12-14 | 云南锡业锡材有限公司 | 一种SnBiAgCu高可靠性无铅焊料合金 |
| TWI820277B (zh) * | 2018-12-27 | 2023-11-01 | 美商阿爾發金屬化工公司 | 無鉛焊料組成物 |
| CN109702374B (zh) * | 2019-02-13 | 2021-02-09 | 南昌大学 | 一种Sn-Cu-Ni-In无铅钎料合金及其制备方法 |
| CN113897511A (zh) * | 2019-04-11 | 2022-01-07 | 日本斯倍利亚社股份有限公司 | 无铅焊料合金和焊料接合部 |
| CN110315238B (zh) * | 2019-07-31 | 2021-09-17 | 广东省科学院中乌焊接研究所 | 一种碳纳米管增强无铅钎料、其制备方法及其应用 |
| JP7796316B2 (ja) * | 2019-08-05 | 2026-01-09 | 株式会社日本スペリア社 | はんだ－金属メッシュ複合材及びその製造方法 |
| JP6912742B1 (ja) | 2020-02-14 | 2021-08-04 | 千住金属工業株式会社 | 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手 |
| KR20260004560A (ko) * | 2020-11-19 | 2026-01-08 | 센주긴조쿠고교 가부시키가이샤 | 땜납 합금, 땜납 볼, 및 땜납 이음 |
| KR102853900B1 (ko) * | 2020-12-23 | 2025-09-02 | 엠케이전자 주식회사 | 무연 솔더 합금, 그를 포함하는 솔더 페이스트, 및 그를 포함하는 반도체 부품 |
| JP7161133B1 (ja) * | 2021-09-30 | 2022-10-26 | 千住金属工業株式会社 | はんだ合金、はんだボール、はんだプリフォーム、はんだペースト及びはんだ継手 |
| JP2023060639A (ja) * | 2021-10-18 | 2023-04-28 | Tdk株式会社 | はんだ組成物および電子部品 |
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| WO2014002304A1 (ja) | 2012-06-29 | 2014-01-03 | ハリマ化成株式会社 | はんだ合金、ソルダペーストおよび電子回路基板 |
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-
2015
- 2015-04-28 BR BR122021001612-7A patent/BR122021001612B1/pt active IP Right Grant
- 2015-04-28 RU RU2018118008A patent/RU2018118008A/ru not_active Application Discontinuation
- 2015-04-28 RU RU2016146520A patent/RU2662176C2/ru active
- 2015-04-28 EP EP15785689.9A patent/EP3138658B1/en active Active
- 2015-04-28 RU RU2018118007A patent/RU2695791C2/ru active
- 2015-04-28 MX MX2016014012A patent/MX378787B/es unknown
- 2015-04-28 CA CA2946994A patent/CA2946994C/en active Active
- 2015-04-28 SG SG11201608933SA patent/SG11201608933SA/en unknown
- 2015-04-28 KR KR1020167033604A patent/KR20160147996A/ko not_active Ceased
- 2015-04-28 AU AU2015254179A patent/AU2015254179B2/en active Active
- 2015-04-28 CN CN202111526384.7A patent/CN114161023A/zh active Pending
- 2015-04-28 WO PCT/JP2015/062818 patent/WO2015166945A1/ja not_active Ceased
- 2015-04-28 BR BR112016024855-4A patent/BR112016024855B1/pt active IP Right Grant
- 2015-04-28 JP JP2015524557A patent/JP5872114B1/ja active Active
- 2015-04-28 EP EP20170413.7A patent/EP3708292A1/en active Pending
- 2015-04-28 MY MYPI2016001916A patent/MY188657A/en unknown
- 2015-04-28 CN CN201810326161.8A patent/CN108515289A/zh active Pending
- 2015-04-28 US US14/901,638 patent/US10286497B2/en active Active
- 2015-04-28 CN CN201580001155.XA patent/CN105339131A/zh active Pending
- 2015-12-03 JP JP2015236930A patent/JP6339993B2/ja active Active
-
2016
- 2016-04-08 JP JP2016078295A patent/JP2016129908A/ja active Pending
- 2016-10-25 MX MX2021000260A patent/MX2021000260A/es unknown
- 2016-10-27 PH PH12016502152A patent/PH12016502152B1/en unknown
-
2019
- 2019-01-31 HK HK19101829.4A patent/HK1259425A1/zh unknown
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