GB2431412B - Lead-free solder alloy - Google Patents

Lead-free solder alloy

Info

Publication number: GB2431412B
Authority: GB; United Kingdom
Prior art keywords: lead; free solder; solder alloy; alloy; free
Prior art date: 2005-10-24
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

GB0521636A

Other versions

GB0521636D0 (en

GB2431412A (en

Inventor

Gerard Campbell

Anthony Ingham

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Fernox Ltd

Original Assignee

Alpha Fry Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2005-10-24

Filing date

2005-10-24

Publication date

2009-10-07

2005-10-24 Application filed by Alpha Fry Ltd filed Critical Alpha Fry Ltd

2005-10-24 Priority to GB0521636A priority Critical patent/GB2431412B/en

2005-11-30 Publication of GB0521636D0 publication Critical patent/GB0521636D0/en

2006-10-23 Priority to EP06794884A priority patent/EP1948388A1/en

2006-10-23 Priority to PCT/GB2006/003948 priority patent/WO2007049025A1/en

2007-04-25 Publication of GB2431412A publication Critical patent/GB2431412A/en

2009-10-07 Application granted granted Critical

2009-10-07 Publication of GB2431412B publication Critical patent/GB2431412B/en

2025-10-24 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Classifications

- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Chemical & Material Sciences (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Coating With Molten Metal (AREA)

GB0521636A 2005-10-24 2005-10-24 Lead-free solder alloy Expired - Fee Related GB2431412B (en)

Priority Applications (3)

Application Number	Priority Date	Filing Date	Title
GB0521636A GB2431412B (en)	2005-10-24	2005-10-24	Lead-free solder alloy
EP06794884A EP1948388A1 (en)	2005-10-24	2006-10-23	Lead-free solder alloy
PCT/GB2006/003948 WO2007049025A1 (en)	2005-10-24	2006-10-23	Lead-free solder alloy

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
GB0521636A GB2431412B (en)	2005-10-24	2005-10-24	Lead-free solder alloy

Publications (3)

Publication Number	Publication Date
GB0521636D0 GB0521636D0 (en)	2005-11-30
GB2431412A GB2431412A (en)	2007-04-25
GB2431412B true GB2431412B (en)	2009-10-07

Family

ID=35458593

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
GB0521636A Expired - Fee Related GB2431412B (en)	2005-10-24	2005-10-24	Lead-free solder alloy

Country Status (3)

Country	Link
EP (1)	EP1948388A1 (en)
GB (1)	GB2431412B (en)
WO (1)	WO2007049025A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB2406101C (en) *	2004-10-27	2007-09-11	Quantum Chem Tech Singapore	Improvements in ro relating to solders
US20110091351A1 (en) *	2007-08-24	2011-04-21	Than Trong Long	Bonding composition
BR112016024855B1 (en) *	2014-04-30	2021-05-04	Nihon Superior Co., Ltd	lead-free and silver-free solder alloy, and soldered joint using the same
CN106425154A (en) *	2016-11-29	2017-02-22	东莞市广信知识产权服务有限公司	Unleaded brazing filler metal
CN111286688B (en) *	2020-04-02	2022-03-01	江西金屹有色金属有限公司	Production process of tinned copper wire
CN114807677B (en) *	2021-05-19	2023-08-08	苏州优诺电子材料科技有限公司	Tin alloy and preparation method thereof

Citations (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0336575A1 (en) *	1988-03-31	1989-10-11	COOKSON GROUP plc	Low toxicity alloy compositions for joining and sealing
JPH1034376A (en) *	1996-07-26	1998-02-10	Nippon Genma:Kk	Lead-free solder
JP2000190090A (en) *	1998-12-21	2000-07-11	Senju Metal Ind Co Ltd	Lead free solder
US6365097B1 (en) *	1999-01-29	2002-04-02	Fuji Electric Co., Ltd.	Solder alloy
JP2003001482A (en) *	2001-06-19	2003-01-08	Tokyo Daiichi Shoko:Kk	Lead-free solder alloy
US20040062679A1 (en) *	2001-06-28	2004-04-01	Senju Metal Industry Co., Ltd.	Lead-free solder alloy
JP2005153007A (en) *	2003-01-22	2005-06-16	Hakko Kk	Lead-free solder for manual soldering or flow soldering, and electronic component using the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5863493A (en) *	1996-12-16	1999-01-26	Ford Motor Company	Lead-free solder compositions
WO1999004048A1 (en) *	1997-07-17	1999-01-28	Litton Systems, Inc.	Tin-bismuth based lead-free solders
JP2000288772A (en) *	1999-02-02	2000-10-17	Nippon Genma:Kk	Lead-free solder
US6517602B2 (en) *	2000-03-14	2003-02-11	Hitachi Metals, Ltd	Solder ball and method for producing same
JP3775172B2 (en) *	2000-05-22	2006-05-17	株式会社村田製作所	Solder composition and soldered article
DE10319888A1 (en) *	2003-04-25	2004-11-25	Siemens Ag	Solder material based on SnAgCu
GB2419137A (en) *	2004-10-15	2006-04-19	Alpha Fry Ltd	Solder alloy

2005
- 2005-10-24 GB GB0521636A patent/GB2431412B/en not_active Expired - Fee Related
2006
- 2006-10-23 WO PCT/GB2006/003948 patent/WO2007049025A1/en not_active Ceased
- 2006-10-23 EP EP06794884A patent/EP1948388A1/en not_active Withdrawn

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0336575A1 (en) *	1988-03-31	1989-10-11	COOKSON GROUP plc	Low toxicity alloy compositions for joining and sealing
JPH1034376A (en) *	1996-07-26	1998-02-10	Nippon Genma:Kk	Lead-free solder
JP2000190090A (en) *	1998-12-21	2000-07-11	Senju Metal Ind Co Ltd	Lead free solder
US6365097B1 (en) *	1999-01-29	2002-04-02	Fuji Electric Co., Ltd.	Solder alloy
JP2003001482A (en) *	2001-06-19	2003-01-08	Tokyo Daiichi Shoko:Kk	Lead-free solder alloy
US20040062679A1 (en) *	2001-06-28	2004-04-01	Senju Metal Industry Co., Ltd.	Lead-free solder alloy
JP2005153007A (en) *	2003-01-22	2005-06-16	Hakko Kk	Lead-free solder for manual soldering or flow soldering, and electronic component using the same

Also Published As

Publication number	Publication date
WO2007049025A1 (en)	2007-05-03
GB0521636D0 (en)	2005-11-30
GB2431412A (en)	2007-04-25
EP1948388A1 (en)	2008-07-30

Publication	Publication Date	Title
GB2421030B (en)	2008-03-19	Solder alloy
TWI371499B (en)	2012-09-01	Copper alloy
GB2433944B (en)	2008-12-24	Solder alloy
EP1873266A4 (en)	2010-07-28	Copper alloy
EP1772225A4 (en)	2009-07-29	Lead-free solder alloy
EP1825011A4 (en)	2008-01-23	Lead-free solder alloy
TWI366497B (en)	2012-06-21	Pb-free solder alloy
ZA200803347B (en)	2009-01-28	Metal passivation
DE602005015496D1 (en)	2009-08-27	Lead-free copper alloy sliding material
PL1922175T3 (en)	2020-03-31	Solder composition
TWI347243B (en)	2011-08-21	Solder alloy for bonding oxide
GB0510243D0 (en)	2005-06-29	Metal Alloy Manufacturing
TWI365787B (en)	2012-06-11	Reflow furnace
TWI347366B (en)	2011-08-21	Lead-free solder alloy composition
GB0519254D0 (en)	2005-10-26	Silver alloy
EP1824638A4 (en)	2009-07-08	LEAD-FREE LOT ALLOY
EP1980355A4 (en)	2010-06-16	Lead-free solder alloy
EP1871555A4 (en)	2010-08-18	Aluminum alloy
GB2431412B (en)	2009-10-07	Lead-free solder alloy
ZA200704903B (en)	2008-09-25	Aluminium alloy brazing material
GB2429115B (en)	2009-03-04	Metal complex
GB0513860D0 (en)	2005-08-10	Silver alloy
GB0703765D0 (en)	2007-04-04	Lead-free solder alloy
GB0721200D0 (en)	2007-12-05	Lead-free solder alloy
GB0407531D0 (en)	2004-05-05	An alloy

Legal Events

Date	Code	Title	Description
2014-06-25	PCNP	Patent ceased through non-payment of renewal fee	Effective date: 20131024