MX2007005597A - Resinas epoxicas endurecidas con copolimero de bloque anfifilico y laminados electricos hechos de las mismas. - Google Patents
Resinas epoxicas endurecidas con copolimero de bloque anfifilico y laminados electricos hechos de las mismas.Info
- Publication number
- MX2007005597A MX2007005597A MX2007005597A MX2007005597A MX2007005597A MX 2007005597 A MX2007005597 A MX 2007005597A MX 2007005597 A MX2007005597 A MX 2007005597A MX 2007005597 A MX2007005597 A MX 2007005597A MX 2007005597 A MX2007005597 A MX 2007005597A
- Authority
- MX
- Mexico
- Prior art keywords
- epoxy resin
- block copolymer
- amphiphilic block
- epoxy resins
- peo
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 6
- 229920000647 polyepoxide Polymers 0.000 title abstract 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 title 1
- 239000004721 Polyphenylene oxide Substances 0.000 abstract 3
- 239000000203 mixture Substances 0.000 abstract 3
- 229920000570 polyether Polymers 0.000 abstract 3
- 229920000469 amphiphilic block copolymer Polymers 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- 125000002947 alkylene group Chemical group 0.000 abstract 1
- 229920001400 block copolymer Polymers 0.000 abstract 1
- 125000004432 carbon atom Chemical group C* 0.000 abstract 1
- 239000003054 catalyst Substances 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 229920000359 diblock copolymer Polymers 0.000 abstract 1
- 239000000178 monomer Substances 0.000 abstract 1
- 229920000428 triblock copolymer Polymers 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
Se describe una composicion epoxica de laminado curable que comprende: (a) una resina epoxica; (b) un copolimero de bloque anfifilico que contiene por lo menos un segmento de bloque miscible en resina epoxica y por lo menos un segmento de bloque no miscible en resina epoxica; en donde el segmento de bloque no miscible comprende por lo menos una estructura de polieter, siempre que la estructura de polieter de dicho segmento de bloque no miscible contenga por lo menos una o mas unidades de monomero de oxido de alquileno teniendo por lo menos cuatro atomos de carbono; de manera que cuando la composicion de resina epoxica se cura, la rigidez de la composicion de resina epoxica curada resultante se incrementa (c) un agente de curacion; y (d) un catalizador de curacion. El copolimero de bloque anfifilico de preferencia es un copolimero de bloque de polieter, tal como un copolimero de dibloque de PEO-PBO o un copolimero de tribloque de PEO-PBO-PEO.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US62661104P | 2004-11-10 | 2004-11-10 | |
| PCT/US2005/039963 WO2006052727A1 (en) | 2004-11-10 | 2005-11-02 | Amphiphilic block copolymer-toughened epoxy resins and electrical laminates made therefrom |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX2007005597A true MX2007005597A (es) | 2007-05-23 |
Family
ID=35770865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2007005597A MX2007005597A (es) | 2004-11-10 | 2005-11-02 | Resinas epoxicas endurecidas con copolimero de bloque anfifilico y laminados electricos hechos de las mismas. |
Country Status (15)
| Country | Link |
|---|---|
| US (1) | US7923073B2 (es) |
| EP (1) | EP1814948B1 (es) |
| JP (1) | JP5248860B2 (es) |
| KR (1) | KR101227201B1 (es) |
| CN (1) | CN101056933B (es) |
| AT (1) | ATE453688T1 (es) |
| BR (1) | BRPI0516702A (es) |
| CA (1) | CA2582360A1 (es) |
| DE (1) | DE602005018680D1 (es) |
| ES (1) | ES2337598T3 (es) |
| MX (1) | MX2007005597A (es) |
| NO (1) | NO20071727L (es) |
| RU (1) | RU2395545C2 (es) |
| TW (1) | TWI400296B (es) |
| WO (1) | WO2006052727A1 (es) |
Families Citing this family (72)
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| US8552104B2 (en) * | 2004-04-02 | 2013-10-08 | Dow Global Technologies Llc | Amphiphilic block copolymer-toughened thermoset resins |
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| JP4634856B2 (ja) * | 2005-05-12 | 2011-02-16 | 利昌工業株式会社 | 白色プリプレグ、白色積層板、及び金属箔張り白色積層板 |
| US9096790B2 (en) | 2007-03-22 | 2015-08-04 | Hexion Inc. | Low temperature coated particles comprising a curable liquid and a reactive powder for use as proppants or in gravel packs, methods for making and using the same |
| US9388311B2 (en) | 2007-08-02 | 2016-07-12 | Dow Global Technologies Llc | Amphiphilic block copolymers and inorganic nanofillers to enhance performance of thermosetting polymers |
| US8492482B2 (en) * | 2007-12-10 | 2013-07-23 | Arkema Inc. | Acrylic-based rubber modified thermoset composition |
| BRPI0905387B1 (pt) | 2008-01-08 | 2019-08-06 | Dow Global Technologies Inc. | Composição curável e resina termofixa enrijecida |
| CN101998970B (zh) | 2008-04-14 | 2013-12-18 | 陶氏环球技术公司 | 用于粉末涂料应用的环氧-咪唑催化剂 |
| EP2110397A1 (de) | 2008-04-16 | 2009-10-21 | Sika Technology AG | Auf amphiphilen Block-Copolymer basierendes Polyurethan-Polymer und dessen Verwendung als Schlagzähigkeitsmodifikator |
| CN102027231B (zh) * | 2008-05-16 | 2013-07-03 | 陶氏环球技术公司 | 风车螺旋桨叶片及其制造方法 |
| EP2128182A1 (de) | 2008-05-28 | 2009-12-02 | Sika Technology AG | Hitzehärtende Epoxidharzzusammensetzung enthaltend einen Beschleuniger mit Heteroatomen |
| DE502008000478D1 (de) | 2008-07-17 | 2010-05-06 | Sika Technology Ag | Haftvermittlerverbindungen für beölten Stahl |
| EP2303953A1 (en) * | 2008-07-17 | 2011-04-06 | Dow Global Technologies Inc. | Structural composites with improved toughness |
| EP2145924A1 (de) | 2008-07-18 | 2010-01-20 | Sika Technology AG | Auf amphiphilen Block-Copolymer basierende Reaktionsprodukte und deren Verwendung als Schlagzähigkeitsmodifikator |
| EP2182025B1 (de) | 2008-10-31 | 2010-10-06 | Sika Technology AG | Hitzehärtende Epoxidharzzusammensetzungen einsetzbar als Rohbauklebstoff oder Strukturschaum |
| TWI423741B (zh) * | 2009-02-13 | 2014-01-11 | Iteq Corp | An epoxy resin composition and a film and a substrate made of the epoxy resin composition |
| EP2401314A1 (en) | 2009-02-24 | 2012-01-04 | Dow Global Technologies LLC | Curable epoxy resin compositions and cured products therefrom |
| US8722798B2 (en) | 2009-03-09 | 2014-05-13 | Leiming Ji | Thermosettable composition containing a combination of an amphiphilic block copolymer and a polyol and a thermoset product therefrom |
| CN102449019A (zh) | 2009-05-27 | 2012-05-09 | 陶氏环球技术有限责任公司 | 聚合缩水甘油醚活性稀释剂 |
| EP2480586B1 (en) | 2009-09-22 | 2014-11-12 | Dow Global Technologies LLC | Process for preparing episulfide resins |
| JP2013506030A (ja) | 2009-09-25 | 2013-02-21 | ダウ グローバル テクノロジーズ エルエルシー | 硬化性エポキシ樹脂組成物及びこれから製造された複合材 |
| BR112012006361A2 (pt) | 2009-09-30 | 2019-09-24 | Dow Global Technologies Inc | composição de resina epóxl, processo para reduzir uma composição de resina epóxl de baixa coloração e composição de resina epóxi de baixa coloração curável |
| EP2499180A2 (en) | 2009-11-12 | 2012-09-19 | Dow Global Technologies LLC | Polyoxazolidone resins |
| JP5922582B2 (ja) | 2009-12-02 | 2016-05-24 | ブルー キューブ アイピー エルエルシー | コンポジット組成物 |
| WO2011068645A1 (en) | 2009-12-02 | 2011-06-09 | Dow Global Technologies Inc. | Coating compositions |
| KR20120101096A (ko) | 2009-12-02 | 2012-09-12 | 다우 글로벌 테크놀로지스 엘엘씨 | 에폭시 수지 조성물 |
| BR112012011527A2 (pt) | 2009-12-03 | 2019-09-24 | Dow Global Technologies Llc | aduto de poliamida, composição de resina epóxi curável, processo para preparar um aduto de amina e processo para preparar uma composição de resina epóxi curável |
| JP5902625B2 (ja) | 2009-12-08 | 2016-04-13 | ブルー キューブ アイピー エルエルシー | ヒドロキシル官能性ポリエステル樹脂 |
| BR112012013526A2 (pt) | 2009-12-09 | 2015-09-15 | Dow Global Technologies Llc | composição de resina de dióxido de divinilareno hidrolisada, composição de resina de dióxido de divinilareno hidrolisada curável, processo para hidrolisar uma resina epóxi de divinilareno e processo para preparar uma composição de resina de dióxido de divinilareno hidrolisada curável |
| WO2011071745A1 (en) | 2009-12-09 | 2011-06-16 | Dow Global Technologies Llc | Epoxy resin compositions |
| EP2519566A4 (en) * | 2009-12-29 | 2016-10-12 | Saint Gobain Abrasifs Sa | LONG-LUBBER COATED GRINDING |
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| WO2011097009A2 (en) | 2010-02-02 | 2011-08-11 | Dow Global Technologies Llc | Curable epoxy resin compositions |
| EP2365046A1 (de) | 2010-03-02 | 2011-09-14 | Sika Technology AG | Schlagzäher bei Raumtemperatur härtender zwei-komponentiger Strukturklebstoff |
| EP2365011A1 (de) | 2010-03-02 | 2011-09-14 | Sika Technology AG | Aminogruppen - terminierter Schlagzähigkeitsmodifikator und dessen Verwendungen in Epoxidharzzusammensetzungen |
| CN102884100B (zh) | 2010-03-24 | 2018-02-06 | 蓝立方知识产权有限责任公司 | 包括作为增韧剂的聚(环氧丙烷)多元醇的环氧树脂组合物 |
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| KR20130039760A (ko) | 2010-06-25 | 2013-04-22 | 다우 글로벌 테크놀로지스 엘엘씨 | 경화성 에폭시 수지 조성물 및 이로부터 제조된 복합체 |
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| WO2013081895A2 (en) | 2011-12-01 | 2013-06-06 | Dow Global Tecnologies LLC | Liquid accelerator composition for hardeners |
| BR112014014990B1 (pt) | 2011-12-20 | 2021-06-15 | Rohm And Haas Electronic Materials Llc | Processo para preparar um material compósito curado para uso num dispositivo de telecomunicação e produto curado |
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| CN105143301A (zh) | 2012-12-14 | 2015-12-09 | 蓝立方知识产权有限责任公司 | 改性环氧树脂 |
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| RU2559495C1 (ru) * | 2014-01-13 | 2015-08-10 | Открытое акционерное общество "Национальный институт авиационных технологий" (ОАО НИАТ) | Состав для получения связующего для препрегов, способ изготовления связующего, препрег и способ изготовления панели из полимерного композиционного материала |
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| FR3034423B1 (fr) * | 2015-04-03 | 2019-05-31 | Cnrs | Dispersion aqueuse de particules d'au moins un polymere thermoplastique, son procede de preparation et ses applications, notamment pour l'ensimage de fibres de renfort |
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| CN110325355A (zh) | 2017-02-26 | 2019-10-11 | 陶氏环球技术有限责任公司 | 具有降低的表面粗糙度的纤维复合材料及其制造方法 |
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| CN107722316A (zh) * | 2017-09-18 | 2018-02-23 | 乐凯特科技铜陵有限公司 | 一种高强度薄型半固化片及其制备方法 |
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| US20190390066A1 (en) | 2018-06-22 | 2019-12-26 | Covestro Llc | Waterborne compositions containing inorganic ion-exchangers to improve corrosion resistance |
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| CN109985530A (zh) * | 2019-02-24 | 2019-07-09 | 海南大学 | 一种制备环氧热固性树脂超滤膜的方法 |
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-
2005
- 2005-11-02 CA CA002582360A patent/CA2582360A1/en not_active Abandoned
- 2005-11-02 MX MX2007005597A patent/MX2007005597A/es active IP Right Grant
- 2005-11-02 JP JP2007541252A patent/JP5248860B2/ja not_active Expired - Fee Related
- 2005-11-02 WO PCT/US2005/039963 patent/WO2006052727A1/en not_active Ceased
- 2005-11-02 DE DE602005018680T patent/DE602005018680D1/de not_active Expired - Lifetime
- 2005-11-02 US US11/663,802 patent/US7923073B2/en not_active Expired - Fee Related
- 2005-11-02 CN CN2005800382698A patent/CN101056933B/zh not_active Expired - Fee Related
- 2005-11-02 KR KR1020077010527A patent/KR101227201B1/ko not_active Expired - Fee Related
- 2005-11-02 RU RU2007121650/04A patent/RU2395545C2/ru not_active IP Right Cessation
- 2005-11-02 EP EP05818062A patent/EP1814948B1/en not_active Expired - Lifetime
- 2005-11-02 AT AT05818062T patent/ATE453688T1/de active
- 2005-11-02 BR BRPI0516702-7A patent/BRPI0516702A/pt not_active IP Right Cessation
- 2005-11-02 ES ES05818062T patent/ES2337598T3/es not_active Expired - Lifetime
- 2005-11-09 TW TW094139243A patent/TWI400296B/zh not_active IP Right Cessation
-
2007
- 2007-04-02 NO NO20071727A patent/NO20071727L/no not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| KR101227201B1 (ko) | 2013-01-28 |
| ATE453688T1 (de) | 2010-01-15 |
| CN101056933B (zh) | 2012-11-21 |
| HK1112930A1 (en) | 2008-09-19 |
| US20080213489A1 (en) | 2008-09-04 |
| TWI400296B (zh) | 2013-07-01 |
| EP1814948A1 (en) | 2007-08-08 |
| WO2006052727A1 (en) | 2006-05-18 |
| NO20071727L (no) | 2007-08-08 |
| ES2337598T3 (es) | 2010-04-27 |
| CA2582360A1 (en) | 2006-05-18 |
| JP5248860B2 (ja) | 2013-07-31 |
| TW200624500A (en) | 2006-07-16 |
| KR20070084111A (ko) | 2007-08-24 |
| DE602005018680D1 (de) | 2010-02-11 |
| BRPI0516702A (pt) | 2008-09-16 |
| JP2008519886A (ja) | 2008-06-12 |
| RU2007121650A (ru) | 2008-12-20 |
| US7923073B2 (en) | 2011-04-12 |
| RU2395545C2 (ru) | 2010-07-27 |
| CN101056933A (zh) | 2007-10-17 |
| EP1814948B1 (en) | 2009-12-30 |
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