WO2026019045A1 - Electronic device including mesh in audio hole - Google Patents

Abstract

Disclosed is an electronic device. The electronic device may comprise: a housing including a sidewall that includes an audio hole; a mesh assembly fastened inside the audio hole; and a speaker that is disposed inside the housing and brought into contact with the audio hole to transmit sound outward via the audio hole. The mesh assembly is spaced apart from the speaker and may be disposed inside the audio hole.

Description

Electronic device containing mesh within the audio hole

The present disclosure relates to an electronic device including a mesh within an audio hole.

The speakers of an electronic device can transmit sound to the outside through an audio hole. The speakers can be positioned so as to be in close contact with the audio hole and attached around the audio hole.

The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

An electronic device according to the present invention is disclosed. The electronic device may include a housing including a side wall including an audio hole, a mesh assembly fastened within the audio hole, and a speaker disposed within the housing and in contact with the audio hole to transmit sound to the outside through the audio hole. The mesh assembly may be spaced apart from the speaker and disposed within the audio hole.

An electronic device according to the present invention is disclosed. The electronic device may include a housing including a side wall including an audio hole, a mesh fixed within the audio hole, and a speaker disposed within the housing, the speaker contacting a portion of the side wall corresponding to an edge of the audio hole to transmit sound to the outside through the audio hole. The side wall may include a non-conductive portion facing an interior space of the housing and including a first hole defining the audio hole, and a conductive portion facing an exterior space of the housing and including a second hole defining a portion of the audio hole, and the mesh may be spaced apart from the speaker and disposed within the first hole.

FIG. 1 is a drawing showing an electronic device according to one embodiment.

Figure 2 is an exploded perspective view of an electronic device according to one embodiment.

FIG. 3 illustrates a speaker module and a housing according to one embodiment.

FIG. 4 illustrates a side wall including an audio hole, according to one embodiment.

FIG. 5 is a cross-sectional view showing a speaker module mounted in a housing according to one embodiment.

FIG. 6 is a cross-sectional view showing a mesh assembly installed within an audio hole, according to one embodiment.

FIG. 7 is a cross-sectional view showing a mesh assembly installed within a partially inclined audio hole, according to one embodiment.

FIG. 8 illustrates a speaker and a housing including a sealing member, according to one embodiment.

FIG. 9 is a cross-sectional view of a portion of an electronic device including a speaker and a housing including a sealing member, according to one embodiment.

FIG. 10 illustrates a conductive portion of a housing according to one embodiment.

FIG. 11 illustrates a mesh assembly fastened to a conductive portion of a housing according to one embodiment.

FIG. 12 is an exploded perspective view of a mesh assembly according to one embodiment.

FIG. 13 is a cross-sectional view including protective members of a mesh assembly according to one embodiment.

FIG. 14 is a cross-sectional view of an electronic device with the protective members of the mesh assembly removed, according to one embodiment.

Figure 15 is an exploded perspective view of a mesh assembly according to one embodiment.

FIG. 16 is a cross-sectional view including a protective member of a mesh assembly according to one embodiment.

FIG. 17 illustrates one of the installation processes of a mesh assembly according to one embodiment.

FIG. 18 is a block diagram of an electronic device within a network environment according to various embodiments.

The terms used in this disclosure are used only to describe specific embodiments and may not be intended to limit the scope of other embodiments. The singular expression may include plural expressions unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by those of ordinary skill in the art described in this disclosure. Terms defined in general dictionaries among the terms used in this disclosure may be interpreted as having the same or similar meaning in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined in this disclosure. In some cases, even if a term is defined in this disclosure, it cannot be interpreted to exclude embodiments of the present disclosure.

The various embodiments of the present disclosure described below illustrate a hardware-based approach as an example. However, since the various embodiments of the present disclosure include techniques utilizing both hardware and software, the various embodiments of the present disclosure do not exclude a software-based approach.

In the present disclosure, expressions such as “more than” or “less than” may be used to determine whether a specific condition is satisfied or fulfilled, but this is merely a description for expressing an example and does not exclude descriptions such as “more than” or “less than.” A condition described as “more than” may be replaced with “more than,” a condition described as “less than” may be replaced with “less than,” and a condition described as “more than and less than” may be replaced with “more than and less than.” In addition, hereinafter, “A” to “B” mean at least one of the elements from A (including A) to B (including B). hereinafter, “C” and/or “D” mean at least one of “C” or “D,” that is, including {“C,” “D,” “C” and “D”}. hereinafter, the meaning of “about E” may be replaced with a value within a margin of error of ±5% or ±10% based on E.

FIG. 1 is a drawing showing an electronic device according to one embodiment.

Referring to FIG. 1, an electronic device (100) according to one embodiment may include a housing (110) forming an exterior of the electronic device (100). For example, the housing (110) may include a first side (or front side) (100A), a second side (or back side) (100B), and a third side (or side surface) (100C) surrounding a space between the first side (100A) and the second side (100B). In one embodiment, the housing (110) may also refer to a structure (e.g., a frame structure (140) of FIG. 2) forming at least a portion of the first side (100A), the second side (100B), and/or the third side (100C).

An electronic device (100) according to one embodiment may include a substantially transparent front plate (102). In one embodiment, the front plate (102) may form at least a portion of the first surface (100A). In one embodiment, the front plate (102) may include, but is not limited to, a glass plate or a polymer plate including various coating layers, for example.

An electronic device (100) according to one embodiment may include a substantially opaque back plate (111). In one embodiment, the back plate (111) may form at least a portion of the second surface (100B). In one embodiment, the back plate (111) may be formed of a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

An electronic device (100) according to one embodiment may include a side bezel structure (or side member) (118) (e.g., a side wall (141) of a frame structure (140) of FIG. 2). In one embodiment, the side bezel structure (118) may be combined with a front plate (102) and/or a rear plate (111) to form at least a portion of a third side (100C) of the electronic device (100). For example, the side bezel structure (118) may form the entire third side (100C) of the electronic device (100). In one embodiment, the side bezel structure (118) may form the third side (100C) of the electronic device (100) together with the front plate (102) and/or the rear plate (111).

Unlike the illustrated embodiment, when the third side (100C) of the electronic device (100) is partially formed by the front plate (102) and/or the rear plate (111), the front plate (102) and/or the rear plate (111) may include a region that extends seamlessly from its edge toward the rear plate (111) and/or the front plate (102). The extending region of the front plate (102) and/or the rear plate (111) may be located at both ends of a long edge of the electronic device (100), for example, but is not limited to the above-described example.

In one embodiment, the side bezel structure (118) may comprise a metal and/or a polymer. In one embodiment, the back plate (111) and the side bezel structure (118) may be formed integrally and may comprise the same material (e.g., a metal material such as aluminum), but is not limited thereto. For example, the back plate (111) and the side bezel structure (118) may be formed as separate components and/or may comprise different materials.

In one embodiment, the electronic device (100) may include at least one of a display (101), an audio module (103, 104, 107), a sensor module (not shown), a camera module (105, 112, 113), a key input device (117), a light emitting element (not shown), and/or a connector hole. In one embodiment, the electronic device (100) may omit at least one of the above components (e.g., the key input device (117) or the light emitting element (not shown)) or may additionally include other components.

In one embodiment, the display (101) (e.g., the display module (1860) of FIG. 18) may be visually exposed through a substantial portion of the front plate (102). For example, at least a portion of the display (101) may be visible through the front plate (102) forming the first surface (100A). In one embodiment, the display (101) may be disposed on the back surface of the front plate (102).

In one embodiment, the outer shape of the display (101) may be formed to be substantially the same as the outer shape of the front plate (102) adjacent to the display (101). In one embodiment, in order to expand the area where the display (101) is visually exposed, the gap between the outer shape of the display (101) and the outer shape of the front plate (102) may be formed to be substantially the same.

In one embodiment, the display (101) (or the first surface (100A) of the electronic device (100)) may include a screen display area (101A). In one embodiment, the display (101) may provide visual information to a user through the screen display area (101A). In the illustrated embodiment, when the first surface (100A) is viewed from the front, the screen display area (101A) is depicted as being positioned on the inside of the first surface (100A) and spaced apart from the outer edge of the first surface (100A), but is not limited thereto. In one embodiment, when the first surface (100A) is viewed from the front, at least a portion of an edge of the screen display area (101A) may substantially coincide with an edge of the first surface (100A) (or the front plate (102)).

In one embodiment, the screen display area (101A) may include a sensing area (101B) configured to acquire biometric information of the user. Here, the meaning of "the screen display area (101A) includes the sensing area (101B)" may be understood to mean that at least a portion of the sensing area (101B) may overlap the screen display area (101A). For example, the sensing area (101B) may be an area capable of displaying visual information by the display (101) like other areas of the screen display area (101A) and additionally capable of acquiring biometric information of the user (e.g., a fingerprint). In one embodiment, the sensing area (101B) may also be formed in the key input device (117).

In one embodiment, the display (101) may include an area where a first camera module (105) (e.g., camera module 1880 of FIG. 18) is positioned. In one embodiment, an opening is formed in the area of the display (101), and the first camera module (105) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the first surface (100A). For example, the screen display area (101A) may surround at least a portion of an edge of the opening. In one embodiment, the first camera module (105) (e.g., an under display camera (UDC)) may be positioned under the display (101) so as to overlap the area of the display (101). For example, the display (101) can provide visual information to the user through the above area, and additionally, the first camera module (105) can obtain an image corresponding to a direction toward the first surface (100A) through the above area of the display (101).

In one embodiment, the display (101) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer capable of detecting a magnetic field-type stylus pen.

In one embodiment, the audio module (103, 104, 107) (e.g., audio module (1870) of FIG. 18) may include a microphone hole (103, 104) and a speaker hole (107).

In one embodiment, the microphone holes (103, 104) may include a first microphone hole (103) formed in a portion of the third surface (100C) and a second microphone hole (104) formed in a portion of the second surface (100B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (103, 104). The microphone may include multiple microphones to detect the direction of the sound.

In one embodiment, a second microphone hole (104) formed in a portion of the second surface (100B) may be positioned adjacent to a camera module (105, 112, 113). For example, the second microphone hole (104) may acquire sound according to the operation of the camera module (105, 112, 113). However, the present invention is not limited thereto.

In one embodiment, the speaker hole (107) may include an external speaker hole (107) and a call receiver hole (not shown). The external speaker hole (107) may be formed on a part of the third surface (100C) of the electronic device (100). In one embodiment, the external speaker hole (107) may be implemented as a single hole with the microphone hole (103). Although not shown, the call receiver hole (not shown) may be formed on another part of the third surface (100C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (107) on the third surface (100C). For example, based on the city of FIG. 1, the external speaker hole (107) may be formed on the third surface (100C) corresponding to the lower portion of the electronic device (100), and the call receiver hole may be formed on the third surface (100C) corresponding to the upper portion of the electronic device (100). However, this is not limited thereto, and in one embodiment, the call receiver hole may be formed at a location other than the third surface (100C). For example, the call receiver hole may be formed by a spaced space between the front plate (102) (or, display (101)) and the side bezel structure (118).

In one embodiment, the electronic device (100) may include at least one speaker (not shown) configured to output sound to the outside of the housing (110) through an external speaker hole (107) and/or a call receiver hole (not shown).

In one embodiment, a sensor module (not shown) (e.g., sensor module (1876) of FIG. 18) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (100) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

In one embodiment, a camera module (105, 112, 113) (e.g., camera module (1880) of FIG. 18) may include a first camera module (105) positioned to face a first side (100A) of the electronic device (100), a second camera module (112) positioned to face a second side (100B), and a flash (113).

In one embodiment, the second camera module (112) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera module (112) is not necessarily limited to including multiple cameras and may include a single camera.

In one embodiment, the first camera module (105) and the second camera module (112) may include one or more lenses, image sensors, and/or image signal processors.

In one embodiment, the flash (113) may include, for example, a light emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (100).

In one embodiment, a key input device (117) (e.g., input module (1850) of FIG. 18) may be disposed on a third side (100C) of the electronic device (100). In one embodiment, the electronic device (100) may not include some or all of the key input devices (117), and the key input devices (117) that are not included may be implemented in another form, such as a soft key, on the display (101).

In one embodiment, a connector hole may be formed on the third surface (100C) of the electronic device (100) so that a connector of an external device can be accommodated. A connection terminal (e.g., a connection terminal (1878) of FIG. 18) electrically connected to the connector of the external device may be arranged within the connector hole. The electronic device (100) according to one embodiment may include an interface module (e.g., an interface (1877) of FIG. 18) for processing electrical signals transmitted and received through the connection terminal.

In one embodiment, the electronic device (100) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on a first surface (100A) of the housing (110). The light-emitting element (not shown) may provide status information of the electronic device (100) in the form of light. In one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (105). For example, the light-emitting element (not shown) may include an LED, an IR LED, and/or a xenon lamp.

Figure 2 is an exploded perspective view of an electronic device according to one embodiment.

In the following, redundant descriptions of configurations having the same reference numerals as the configurations described above are omitted.

Referring to FIG. 2, an electronic device (100) according to one embodiment may include a frame structure (140), a first printed circuit board, a second printed circuit board (152), a cover plate (160), and a battery (170).

In one embodiment, the frame structure (140) may include a side wall (141) forming an exterior of the electronic device (100) (e.g., the third side (100C) of FIG. 2) and a support portion (143) extending inwardly from the side wall (141). In one embodiment, the frame structure (140) may be disposed between the display (101) and the back plate (111). In one embodiment, the side wall (141) of the frame structure (140) may surround a space between the back plate (111) and the front plate (102) (and/or the display (101)), and the support portion (143) of the frame structure (140) may extend from the side wall (141) within the space. According to one embodiment, a side wall (141) forming a side surface of an electronic device (100) (e.g., side surface (100C) of FIG. 2) may include a speaker hole (107) connecting the inside and the outside of the electronic device (100). The speaker hole (107) may penetrate the side wall (141).

In one embodiment, the frame structure (140) may support or accommodate other components included in the electronic device (100). For example, a display (101) may be disposed on one side of the frame structure (140) facing one direction (e.g., the (+) Z-axis direction), and the display (101) may be supported by a support portion (143) of the frame structure (140). According to one embodiment, a first printed circuit board (150), a second printed circuit board (152), a battery (170), and a second camera module (112) may be disposed on the other side of the frame structure (140) facing the opposite direction (e.g., the (-) Z-axis direction). The first printed circuit board (150), the second printed circuit board (152), the battery (170), and the second camera module (112) can each be mounted in a recess defined by a side wall (141) and/or a support portion (143) of the frame structure (140).

In one embodiment, the first printed circuit board (150), the second printed circuit board (152), and the battery (170) may be respectively coupled to the frame structure (140). For example, the first printed circuit board (150) and the second printed circuit board (152) may be fixedly disposed to the frame structure (140) via a coupling member such as a screw. For example, the battery (170) may be fixedly disposed to the frame structure (140) via an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

In one embodiment, the cover plate (160) may be disposed between the first printed circuit board (150) and the back plate (111). In one embodiment, the cover plate (160) may be disposed on the first printed circuit board (150). For example, the cover plate (160) may be disposed on a surface of the first printed circuit board (150) facing the (-) Z-axis direction.

In one embodiment, the cover plate (160) may at least partially overlap the first printed circuit board (150) with respect to the z-axis. In one embodiment, the cover plate (160) may cover at least a portion of the first printed circuit board (150). In this way, the cover plate (160) may protect the first printed circuit board (150) from physical impact or prevent detachment of a connector coupled to the first printed circuit board (150).

In one embodiment, the cover plate (160) may be fixedly positioned on the first printed circuit board (150) via a joining member (e.g., a screw), or may be joined to the frame structure (140) together with the first printed circuit board (150) via the joining member.

In one embodiment, the display (101) may be disposed between a frame structure (140) and a front plate (102). For example, the front plate (102) may be disposed on one side (e.g., in the (+) Z-axis direction) of the display (101), and the frame structure (140) may be disposed on the other side (e.g., in the (-) Z-axis direction).

In one embodiment, the front plate (102) may be coupled with the display (101). For example, the front plate (102) and the display (101) may be bonded to each other via an optically clear adhesive (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

In one embodiment, the front plate (102) may be coupled with a frame structure (140). For example, the front plate (102) may include an outer portion extending outside the display (101) when viewed in the Z-axis direction, and may be adhered to the frame structure (140) through an adhesive member (e.g., double-sided tape) disposed between the outer portion of the front plate (102) and the frame structure (140) (e.g., side wall (141)). However, the present invention is not limited to the above-described example.

In one embodiment, the first printed circuit board (150) and/or the second printed circuit board (152) may be equipped with a processor (e.g., processor 1820 of FIG. 18), memory (e.g., memory 1830 of FIG. 18), and/or an interface (e.g., interface 1877 of FIG. 18). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may electrically or physically connect the electronic device (100) to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector. In one embodiment, the first printed circuit board (150) and the second printed circuit board (152) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

In one embodiment, a battery (170) (e.g., battery (1889) of FIG. 18) may power at least one component of the electronic device (100). For example, the battery (170) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (170) may be disposed substantially coplanar with the first printed circuit board (150) and/or the second printed circuit board (152).

An electronic device (100) according to one embodiment may include an antenna module (not shown) (e.g., antenna module (1897) of FIG. 18). In one embodiment, the antenna module may be disposed between the rear plate (111) and the battery (170). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with an external device.

In one embodiment, the housing (110) of the electronic device (100) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (100). In this respect, at least a portion of the front plate (102), the frame structure (140), and/or the rear plate (111) that form the exterior of the electronic device (100) may be referred to as the housing (110) of the electronic device (100).

FIG. 3 illustrates a speaker module and a housing according to one embodiment. FIG. 4 illustrates a side wall including an audio hole according to one embodiment. FIG. 5 is a cross-sectional view illustrating a speaker module mounted in a housing according to one embodiment.

Referring to FIG. 3, the electronic device (100) may include a speaker (320) and a housing (110).

The housing (110) may form a part of the exterior of the electronic device (100). The housing (110) may include a side wall (310) defining a side surface of the electronic device (100). The side wall (310) may include an audio hole (311). The audio hole (311) may penetrate the side wall (310). The audio hole (311) may transmit sound (e.g., audio, sound, or sound wave) emitted from the speaker (320) to the exterior of the electronic device (100). The sound may include sound converted from an electrical signal through the speaker (320). The converted sound may be referred to as an audio signal. For example, the speaker (320) may be disposed at the lower portion of the electronic device (100), and the audio hole (311) may penetrate a portion of the side wall (310) disposed at the lower portion of the side wall of the housing (110). However, without being limited thereto, the audio hole (311) may be placed in a different part of the side wall (310) depending on the position where the speaker (320) is placed. The speaker (320) may transmit sound to the outside through the audio hole (311) of the side wall (310).

The electronic device (100) may include a printed circuit board (152) (e.g., the second printed circuit board (152) of FIG. 2). The printed circuit board (152) may be disposed at a lower portion of the electronic device (100). For example, the printed circuit board (152) may be disposed at a lower portion of a space surrounded by a side wall (310) of the housing (110). The printed circuit board (152) may be electrically connected to another printed circuit board (e.g., the first printed circuit board (150) of FIG. 2) within the electronic device (100).

The electronic device (100) may further include a connector (350) disposed on a printed circuit board (152). The connector (350) may connect the electronic device (100) to an external electronic device or storage device. The connector (350) may be partially exposed through a connector hole (315) formed in a side wall (310). For example, a portion of the connector (350) may be partially inserted into the connector hole (315). The connector (350) may be electrically connected to an external connector inserted into the connector hole (315).

Referring to FIGS. 4 and 5, the audio hole (311) can penetrate a non-conductive portion (410a) and a conductive portion (410b) forming a side wall (310) of the electronic device (100). The conductive portion (410b) can partially form an outer surface of the side wall (310) and can function as an antenna radiator. The non-conductive portion (410a) can be coupled to the conductive portion (410b). The non-conductive portion (410a) can be coupled to the conductive portion (410b), which is a structure for a portion of the side wall (310), through an injection molding process. A portion of the side wall (310) where the non-conductive portion (410a) and the conductive portion (410b) are coupled can be removed, thereby forming the audio hole (311).

The speaker (320) may include an acoustic duct (320a) connected to an audio hole (311). The acoustic duct (320a) may transmit sound generated from the speaker (320) to the outside. For example, the sound may be transmitted to the outside through the acoustic duct (320a) and the audio hole (311). For example, the acoustic duct (320a) and the audio hole (311) may provide an audio path extending from the speaker (320) to the outside of the electronic device (100). The speaker (320) may further include a sealing member (585) and an adhesive member (590) for closely contacting the inner surface of the side wall (310). The sealing member (585) may include rubber, a rubber ring, or an O-ring. The sealing member (585) may reduce noise leakage of sound emitted from the speaker (320). A sealing member (585) can be placed between the edge of the sound duct (320a) and the edge of the audio hole (311). The sealing member (585) can reduce the transmission of sound from the speaker (320) into the interior of the electronic device (100) by sealing between the sound duct (320a) and the audio hole (311).

When the sealing member (585) is attached to the peripheral portion of the audio hole (311) by an adhesive member (590) (e.g., an adhesive, an adhesive tape, a waterproof tape, or a waterproof adhesive), the adhesive material of the adhesive member (590) may flow out into the audio hole (311) due to the surrounding environment (e.g., heat, pressure, or external impact). The adhesive member (590) may be formed integrally with the sealing member (585).

The electronic device (100) may further include a mesh assembly (510). The mesh assembly (510), the sealing member (585), the adhesive member (590), and the mesh assembly (510) may be disposed on an audio path. To reduce the visibility of the adhesive material from the outside, the mesh assembly (510) may be disposed on the audio path closer to the outside of the electronic device (100) than the adhesive member (590). For example, the mesh assembly (510) may be disposed within the audio hole (311).

The mesh assembly (510) may include a mesh that crosses the inside of the audio hole (311). The mesh may be configured to prevent or reduce foreign matter from entering the electronic device (100) through the audio hole (311) and to transmit sound to the outside through the audio hole (311). For example, the mesh may include a plurality of openings to restrict foreign matter larger than a certain size from entering. The mesh may transmit sound transmitted from the speaker (320) to the outside through the openings.

The mesh assembly (510) may be disposed within the audio hole (311). The audio hole (311) may include a first hole (511a) penetrating the non-conductive portion (410a) and a second hole (511b) penetrating the conductive portion (410b). The mesh assembly (510) may be partially wrapped around the non-conductive portion (410a). For example, the mesh assembly (510) may be disposed within the first hole (511a) of the non-conductive portion (410a). For example, the non-conductive portion (410a) may be injected into the conductive portion (410b) in which the mesh assembly (510) is disposed. After the non-conductive portion (410a) is joined to the conductive portion (410b), a first hole (511a) and a second hole (511b) can be formed to form an audio hole (311). The mesh assembly (510) can be fixed to the side wall (310) by the injected non-conductive portion (410a).

FIG. 6 is a cross-sectional view showing a mesh assembly installed within an audio hole, according to one embodiment.

Referring to FIG. 6, the mesh assembly (510) may include a mesh (601), a first fixing structure (610), and/or a second fixing structure (620). The mesh (601) may be interposed between the first fixing structure (610) and the second fixing structure (620). The first fixing structure (610) and the second fixing structure (620) of the mesh assembly (510) may be coupled within a non-conductive portion (410a). For example, the outer surfaces of the first fixing structure (610) and the second fixing structure (620) may be surrounded by the non-conductive portion (410a). The outer surfaces of the first fixing structure (610) and the second fixing structure (620) may be in contact with the non-conductive portion (410a).

The first fixing structure (610) may be positioned closer to the interior of the electronic device (100) than the mesh (601), and the second fixing structure (620) may be positioned closer to the exterior of the electronic device (100) than the mesh (601). The first fixing structure (610) may be positioned so as to face the speaker (e.g., the speaker (320) of FIG. 3), and the second fixing structure (620) may be positioned so as to face the conductive portion (410b).

The first fixed structure (610) may include a portion (611) that contacts the first hole (511a) of the audio hole (311). The portion (611) of the first fixed structure (610) may be rounded. For example, the first fixed structure (610) may extend in the (+) Y-axis direction or the (-) Y-axis direction (e.g., a direction substantially perpendicular to the extension direction of the first hole (511a) or the audio hole (311)) and may be rounded at the portion (611). The portion (611) may be rounded so as to be inclined toward the speaker (320).

The second fixed structure (620) may include a protrusion (621) protruding toward the conductive portion (410b). The protrusion (621) of the second fixed structure (620) may be positioned in a fastening structure (e.g., a protrusion or a groove) included in the conductive portion (410b).

The second fixing structure (620) may include a portion (622) that contacts the first hole (511a) of the audio hole (311). The portion (622) of the second fixing structure (620) may be rounded. For example, the second fixing structure (620) may extend in the (+) Y-axis direction or the (-) Y-axis direction (e.g., in a direction substantially perpendicular to the first hole (511a) or the audio hole (311)) and may be rounded at the portion (622). The portion (622) may be rounded so as to be inclined toward the conductive portion (410b). For example, the portion (622) may be inclined in a direction away from the speaker (320).

The mesh assembly (510) may further include adhesive members (603, 605). The adhesive members (603, 605) may attach the first fixing structure (610) and the second fixing structure (620) to the mesh (601). For example, the first fixing structure (610) may be attached to one side of the mesh (601) by the adhesive member (603). The second fixing structure (620) may be attached to the other side of the mesh (601) by the adhesive member (605). The adhesive member (605) may be an adhesive, an adhesive layer, a tape, or a double-sided tape.

The mesh (601) of the mesh assembly (510) may be arranged to cross the first hole (511a) of the audio hole (311). The first fixing structure (610), the second fixing structure (620) and the adhesive members (603, 605) of the mesh assembly (510) may include openings corresponding to the audio hole (311). For example, the openings included in the first fixing structure (610), the second fixing structure (620) and the adhesive members (603, 605) of the mesh assembly (510) may be connected to the audio hole (311). The openings included in the first fixing structure (610), the second fixing structure (620) and the adhesive members (603, 605) of the mesh assembly (510) may define a portion of the first hole (511a) of the audio hole (311).

FIG. 7 is a cross-sectional view showing a mesh assembly installed within a partially inclined audio hole, according to one embodiment.

Referring to FIG. 7, the mesh assembly (510) may be placed in the audio hole (311) within the non-conductive portion (410a). The audio hole (311) may include a portion (711) of the audio hole (311) facing the interior of the electronic device (100) with respect to the mesh assembly (510) and another portion (712) of the audio hole (311) facing the exterior of the electronic device (100) with respect to the mesh assembly (510).

A portion (711) of the audio hole (311) may extend in a first direction (e.g., the (+) Y-axis direction) that is substantially perpendicular to the side wall (310). Another portion (711) of the audio hole (311) may have an inclination with respect to the portion (711) of the audio hole (311). The mesh assembly (510) may be disposed between the portion (711) of the audio hole (311) and the other portion (712) of the audio hole (311). The audio hole (311) may be formed after the non-conductive portion (410a) is injected into the conductive portion (410b). For example, a part (711) of the audio hole (311) may be formed by removing from the inside of the electronic device (100) through a cutting tool, and another part (712) of the audio hole (311) may be formed by removing from the outside of the electronic device (100) through a cutting tool.

When the mesh assembly (510) is placed within a portion (711) of the audio hole (311) that is spaced apart from the boundary between a portion (711) of the audio hole (311) and another portion (712) of the audio hole (311), the cutting process of the audio hole (311) may become complicated. By placing the mesh assembly (510) at the boundary between a portion (711) of the audio hole (311) and another portion (712) of the audio hole (311), the manufacturing process of the audio hole (311) may be simplified.

FIG. 8 illustrates a speaker and a housing including a sealing member, according to one embodiment. FIG. 9 is a cross-sectional view of a portion of an electronic device including a speaker and a housing including a sealing member, according to one embodiment.

Referring to FIGS. 8 and 9, the speaker (320) may further include a non-conductive portion (810) (e.g., injection molded) disposed at an end of the sound duct (320a). The non-conductive portion (810) may include an opening corresponding to the sound duct (320a). The speaker (320) may include a sealing member (820) disposed in the non-conductive portion (810). Although the sealing member (585) of FIG. 5 is formed as a separate component from the speaker (320), the sealing member (820) may be a part of the speaker (320). For example, the sealing member (820) may be coupled to the non-conductive portion (810). For example, the sealing member (820) may be a part of the non-conductive portion (810).

The sealing member (820) may be arranged along the edge of the audio hole (311) connected to the sound duct (320a). The sealing member (820) may isolate the audio path including the sound duct (320a) and the audio hole (311) from the interior of the electronic device (100) or the housing (110). The sealing member (820) may reduce the transmission of moisture or foreign substances flowing in through the audio hole (311) into the interior of the electronic device (100). The sealing member (820) may have elasticity. When the speaker (320) is arranged to be in close contact with the audio hole (311), the sealing member (820) may have elasticity. Due to the elasticity of the sealing member (820), when the speaker (320) is pressed in the direction of the audio hole (311) (e.g., in the (-) Y-axis direction) by another mechanism within the electronic device, the sealing member (820) can isolate the audio path from the outside or seal the audio path.

When the speaker (320) is fixed by an elastic sealing member (820), the adhesive member can be omitted and the volume of the speaker (320) can be increased. Due to the increased volume of the speaker (320), the resonance space of the speaker (320) can be increased.

Fig. 10 illustrates a conductive portion of a housing according to one embodiment. Fig. 11 illustrates a mesh assembly fastened to a conductive portion of a housing according to one embodiment.

Referring to FIGS. 10 and 11, the conductive portion (310b) of the side wall (310) of the housing (110) may include support portions (1011, 1012) for fixing the mesh assembly (510). The support portions (1011, 1012) may protrude from the inner surface (310-1) of the conductive portion (310b) of the side wall (310) toward the interior of the housing (110) (or the interior of the electronic device (100)).

A portion of the mesh assembly (510) may be secured to each of the support portions (1011, 1012). A protrusion (e.g., protrusion (621) of FIG. 6) protruding from a second fixing portion (e.g., second fixing structure (620) of FIG. 6) of the mesh assembly (510) may be positioned on the support portion (1011). The second fixing structure (620) may further include an additional protrusion with which the support portion (1012) comes into contact.

One of the support portions (1011, 1012) (e.g., support portion (1011)) may further include fastening structures (1011a, 1011b). In order for the mesh assembly (510) to be fixed to the support portion (1011), the mesh assembly (510) may include structures (621a, 621b) corresponding to the fastening structures (1011a, 1011b). The structures (621a, 621b) of the mesh assembly (510) may be formed on a portion including a protrusion (621) protruding from a second fastening structure (620) of the mesh assembly (510) toward the inner surface (310-1) of the conductive portion (310b) included in the side wall (310).

The fastening structures (1011a, 1011b) formed on the side wall (310) may include a fitting structure. The structures (621a, 621b) formed on the second fixing structure (620) of the mesh assembly (510) may include opening portions corresponding to each of the fastening structures (1011a, 1011b). A portion of the fastening structures (1011a, 1011b) may be inserted into the opening portions of the corresponding structures (621a, 621b). However, the present invention is not limited thereto, and the structures (621a, 621b) of the second fixing structure (620) of the mesh assembly (510) may include a fitting structure, and the fastening structures (1011a, 1011b) of the side wall (310) may include openings.

The mesh assembly (510) fixed to the side wall (310) can be spaced from the inner surface (310-1) of the conductive portion (310b) of the side wall (310) by the support portion (1011) on which the fastening structures (1011a, 1011b) are arranged. When the non-conductive portion (e.g., the non-conductive portion (310a) of FIG. 3) is injected, the non-conductive portion (310a) can be arranged in the space between the conductive portion (310b) and the mesh assembly (510) by wrapping the mesh assembly (510). The mesh assembly (510) wrapped by the non-conductive portion (310a) can be coupled to the side wall (310).

After being joined to the side wall (310), an audio hole is formed through a cutting process, and during or after the process of forming the audio hole, a portion of the mesh assembly (510) that is in contact with the audio hole (e.g., a portion of the first fixing structure (610) and the second fixing portion that is in contact with the audio hole) may be removed. The process of removing a portion of the mesh assembly (510) will be described later with reference to FIGS. 12, 13, and 14.

FIG. 12 is an exploded perspective view of a mesh assembly according to one embodiment. FIG. 13 is a cross-sectional view including protective members of a mesh assembly according to one embodiment. FIG. 14 is a cross-sectional view of an electronic device with protective members of a mesh assembly removed according to one embodiment.

Referring to FIG. 12, the mesh assembly (510) may include a mesh (601), a first fixing structure (610), a second fixing structure (620), a first protective film (1210), a second protective film (1220), and adhesive members (1091, 1092, 1093, 1094). The mesh (601) may include a fine mesh. The mesh (601) may be visible from the outside within the assembled electronic device (100). To prevent the mesh (601) from being damaged during the assembly process, the mesh assembly (510) may include a plurality of protective structures. For example, the mesh assembly (510) may include a first fixing structure (610) and a second fixing structure (620) that surround the mesh (601). The first fixing structure (610) and the second fixing structure (620) can wrap the mesh (601) to protect the mesh (601) during the cutting process for forming the audio hole during the assembly process of the mesh assembly (510). The mesh assembly (510) can further include protective films (1210, 1220). The first protective film (1210) can be placed between the first fixing structure (610) and the mesh (601). The second protective film (1220) can be placed between the second fixing structure (620) and the mesh (601). The protective films (1210, 1220) can limit or reduce the transfer of cutting oil or foreign substances to the mesh (601) during the cutting process. By means of a cutting tool, portions (610a, 620b) of the first fixing structure (610) and the second fixing structure (620) corresponding to the audio hole can be removed.

The protective films (1210, 1220) may include portions (1211, 1221) to be removed. The portions (1211, 1221) to be removed of the protective films (1210, 1220) may be removed by other methods without using a cutting tool. If the portions (1211, 1221) to be removed of the protective films (1210, 1220) are removed with a cutting tool, the mesh (601) may be damaged. The protective films (1210, 1220) may protect the mesh from cutting oil and debris of the fixed portion to be removed while the first fixed structure (610) and the second fixed structure (620) are removed. The portions (1211, 1221) to be removed of the protective films (1210, 1220) may be configured to be easily separated by forming micro-punches or micro-slits on the surface. To facilitate the removal of the portions (1211, 1221) to be removed, a handle or a protrusion formed on the portions (1211, 1221) to be removed may be included. The handle or protrusion may be removed using tweezers or a micro-tool. However, the present invention is not limited thereto. The portions (1211, 1221) to be removed may be separated using a jig to which an adhesive material is applied.

The mesh assembly (510) may include an adhesive member (e.g., adhesive members (603, 605) of FIG. 6) for bonding components constituting the mesh assembly (510). The adhesive members (1091, 1092, 1093, 1094) may include an adhesive, a double-sided tape, or a tape. Each of the adhesive members (1091, 1092, 1093, 1094) may include an opening corresponding to an audio hole. The first adhesive member (1091) may be disposed between an edge portion of the first fixing structure (610) and an edge portion of the first protective film (1210). The first adhesive member (1091) may attach the first fixing structure (610) to the first protective film (1210). The second adhesive member (1092) may be disposed between the edge portion of the first protective film (1210) and the edge portion of the mesh (601). The second adhesive member (1092) may attach the first protective film (1210) to the mesh (601). The third adhesive member (1093) may be disposed between the edge portion of the second protective film (1220) and the edge portion of the mesh (601). The third adhesive member (1093) may attach the second protective film (1220) to the mesh (601). The fourth adhesive member (1094) may be disposed between the edge portion of the second fixing structure (620) and the edge portion of the second protective film (1220). The fourth adhesive member (1094) may attach the second fixing structure (620) to the second protective film (1220).

Referring to FIGS. 13 and 14, the non-conductive portion (410a) can be fastened to the conductive portion (410b) through an injection molding process. The non-conductive portion (410a) can surround the mesh assembly (510) while being fastened to the conductive portion (410b). The conductive portion (410b) forming the side wall (310) and a portion of the non-conductive portion (410a) can be removed to form an audio hole (311). For example, the first hole (511a) of the audio hole (311) can be formed by removing a portion (1291a) of the non-conductive portion (410a) that faces inward of the electronic device with respect to the mesh assembly (510) and a portion (1291b) of the non-conductive portion (410a) that faces outward of the electronic device with respect to the mesh assembly (510). The second hole (511b) of the audio hole (311) can be formed by removing a part (1292) of the conductive portion (410b).

Among the audio holes (311), a hole portion (1411b) facing the outside of the electronic device with respect to the mesh assembly (510) can be removed from the outside of the side wall (310) toward the mesh assembly (510). During the cutting process for removing the outside of the side wall (310), a portion (129b) of the non-conductive portion (410a) facing the outside of the electronic device with respect to the mesh assembly (510), a portion (1292) of the conductive portion (410b), and a portion (620a) of the second fixing structure (620) can be removed. Through the process for removing the outside of the side wall (310), a hole portion (1411b) of the audio holes (311) facing the outside of the electronic device with respect to the mesh assembly (510) can be formed.

Among the audio holes (311), a hole portion (1411a) facing the inside of the electronic device with respect to the mesh assembly (510) can be removed from the inside of the side wall (310) toward the mesh assembly (510). During the cutting process for removing the inside of the side wall (310), a portion (1291a) of the non-conductive portion (410a) facing the inside of the electronic device with respect to the mesh assembly (510) and a portion (610a) of the first fixing structure (610) can be removed. Through the process for removing the inside of the side wall (310), a hole portion (1411b) facing the outside of the electronic device with respect to the mesh assembly (510) can be formed among the audio holes (311).

After the process of cutting the audio hole (311), the protective films (1210, 1220) can be removed. As the portions (1211, 1221) to be removed of the protective films (1210, 1220) are removed, the hole portion (1411a) facing the inside of the electronic device and the hole portion (1411b) facing the outside of the electronic device can be connected to each other.

FIG. 15 is an exploded perspective view of a mesh assembly according to one embodiment. FIG. 16 is a cross-sectional view including a protective member of a mesh assembly according to one embodiment.

Referring to FIGS. 15 and 16, the mesh assembly (1501) may include a mesh (601), a first fixing portion (1510) (e.g., a first fixing structure), a second fixing structure (620), a protective film (1220) (e.g., the second protective film (1220) of FIG. 12), and adhesive members (1591, 1093, 1094). The mesh (601), the second fixing structure (620), the protective film (1220), and the adhesive members (1093, 1094) of FIG. 15 may be identical or similar in configuration to the mesh (601), the second fixing structure (620), the second protective film (1220), and the adhesive members (1093, 1094) of FIG. 12.

The mesh (601) may include a fine mesh. The mesh (601) may be visible from the outside within the assembled electronic device (100). To prevent the mesh (601) from being damaged during the assembly process, the mesh assembly (1501) may include a second fixing structure (620), which is a protective structure. The second fixing structure (620) may wrap one side of the mesh (601) to protect the mesh (601) during a cutting process for forming an audio hole during the assembly process of the mesh assembly (1501). For example, the second fixing structure (620) may cover one side of the mesh (601) that is disposed on a side facing the outside of the electronic device (100). The mesh assembly (1501) may further include a protective film (1220). The protective film (1220) may be disposed between the second fixing structure (620) and the mesh (601). The protective film (1220) can limit or reduce the transfer of cutting oil or foreign matter to the mesh (601) during the cutting process.

The protective film (1220) may include a portion (1221) to be removed. The portion (1221) to be removed of the protective film (1220) may be removed by a method other than using a cutting tool. If the portion (1221) to be removed of the protective film (1220) is removed using a cutting tool, the mesh (601) may be damaged. The protective film (1220) may protect the mesh from cutting oil and debris of the fixed portion to be removed while a portion of the second fixed structure (620) is being removed. The portion (1211) to be removed of the protective film (1220) may be configured to form micro-punches or micro-cuts on the surface to facilitate separation.

The first fixing structure (1510) may be arranged along the edge of the mesh (601) and may include an opening (1510a) corresponding to an audio hole. Unlike the first fixing structure (610) of FIG. 12, the portion corresponding to the opening (1510a) of the first fixing structure (1510) may be removed before being assembled to the side wall (310) of the electronic device (100). Unlike the mesh assembly of FIG. 12, since there is no portion of the first fixing structure (1510) to be removed, a protective film facing the first fixing structure (1510) for the mesh (601) may be omitted.

The mesh assembly (1501) may include an adhesive member (e.g., adhesive members (603, 605) of FIG. 6) for bonding components constituting the mesh assembly (1501). The adhesive members (1591, 1093, 1094) may include an adhesive, a double-sided tape, or a tape. Each of the adhesive members (1591, 1093, 1094) may include an opening corresponding to an audio hole. The adhesive member (1591) may be positioned between an edge portion of the first fixing portion (1510) and an edge portion of the mesh (601). The adhesive member (1591) may attach the first fixing portion (1510) to the mesh (601). The adhesive members (1093, 1094) may be the same as the third adhesive member (1093) and the fourth adhesive member (1094) of FIG. 12.

FIG. 17 illustrates one of the installation processes of a mesh assembly according to one embodiment.

Referring to FIG. 17, the non-conductive portion (410a) may be connected to the conductive portion (410b) through an injection molding process. The non-conductive portion (410a) may surround a portion of the mesh assembly (1501) while being connected to the conductive portion (410b). For example, the core (1799) may contact a surface of the mesh assembly (1501) facing the interior of the electronic device. The core (1799) may be formed in a shape corresponding to a portion of the audio hole. The core (1799) may be removed after the non-conductive portion (410a) is injected. The non-conductive portion (410a) may not be disposed in a portion corresponding to the core (1799). By the core (1799), the non-conductive portion (410a) can be restricted from entering the opening (1510a) of the first fixed structure (1510). A portion corresponding to the first hole (511a) of the audio hole (311) can be formed during the injection process through the core (1799). As the core (1799) is positioned, cutting of the first fixed structure (1510) is unnecessary, so the possibility of damage to the mesh (601) can be reduced, and the protective film can be omitted.

Among the audio holes (311), a hole portion (1711) facing the outside of the electronic device with respect to the mesh assembly (1501) can be removed from the outside of the side wall (310) toward the mesh assembly (1501). During the cutting process for removing the outside of the side wall (310), a portion (1791) of the non-conductive portion (410a) facing the outside of the electronic device with respect to the mesh assembly (510), a portion (1792) of the conductive portion (410b), and a portion (620a) of the second fixing structure (620) can be removed. Through the process for removing the outside of the side wall (310), a hole portion (1711) of the audio holes (311) facing the outside of the electronic device with respect to the mesh assembly (1501) can be formed.

After the process of cutting the audio hole (311), the portion (1221) of the protective film (1220) to be removed can be removed.

According to the above-described embodiment, an electronic device (e.g., electronic device (100) of FIG. 3) may include a housing (e.g., housing (110) of FIG. 3). The housing may include a side wall (e.g., side wall (310) of FIG. 3) including an audio hole (e.g., audio hole (311) of FIG. 3). The electronic device may further include a mesh assembly (e.g., mesh assembly (510) of FIG. 5). The mesh assembly may be fastened within the audio hole. The electronic device may further include a speaker (e.g., speaker (320) of FIG. 3). The speaker may be disposed within the housing and contact the audio hole to transmit sound to the outside through the audio hole. The mesh assembly may be spaced apart from the speaker.

In one embodiment, the housing may include a conductive portion (e.g., conductive portion (410b) of FIG. 5) defining an outer surface of the side wall. The housing may further include a non-conductive portion (e.g., non-conductive portion (410a) of FIG. 5) coupled to the conductive portion. The audio hole may penetrate the conductive portion and the non-conductive portion.

In one embodiment, the mesh assembly may be positioned in a portion of the audio hole that is located in the non-conductive portion.

According to one embodiment, the speaker may include an acoustic duct that transmits the sound to the audio hole.

According to one embodiment, the speaker may include an adhesive member disposed on a surface of the speaker on which the end of the sound duct is disposed.

According to one embodiment, the adhesive member may be positioned along an edge of the audio hole to isolate the internal space of the electronic device from the audio hole.

According to one embodiment, the adhesive member may be attached to a ring-shaped rubber surrounding the acoustic duct.

The mesh assembly may include a first fixing portion (e.g., the first fixing portion (610) of FIG. 6) facing the speaker and positioned along an edge of the audio hole. The mesh assembly may further include a second fixing portion (e.g., the second fixing portion (620) of FIG. 6) facing the exterior of the electronic device and positioned along an edge of the audio hole. The mesh assembly may further include a mesh (e.g., the mesh (601) of FIG. 6) disposed between the first fixing portion and the second fixing portion and crossing the audio hole.

According to one embodiment, the first fixing portion and the second fixing portion can be inserted into a groove dug from the inner surface of the audio hole.

According to one embodiment, a portion of the first fixed portion and a portion of the second fixed portion in contact with the hole may be rounded.

In one embodiment, the first fixed portion is substantially planar, and a portion of the second fixed portion that contacts the hole may be rounded.

In one embodiment, the mesh assembly further comprises a film disposed between the mesh and the second fixed portion, wherein the film may include an opening corresponding to the audio hole.

In one embodiment, the mesh assembly further comprises another film disposed between the mesh and the first fixed portion, wherein the another film may include an opening corresponding to the audio hole.

According to one embodiment, the first fixed portion may include a protrusion that contacts the conductive portion of the side wall.

In one embodiment, the audio hole may be curved relative to the mesh assembly.

In one embodiment, the inner surface of the portion of the side wall that meets the speaker can be angled with respect to the mesh assembly.

According to one embodiment, an electronic device (e.g., electronic device (100) of FIG. 3) may include a housing (e.g., housing (110) of FIG. 3) including a side wall (e.g., side wall (310) of FIG. 3) including an audio hole (e.g., audio hole (311) of FIG. 3). The electronic device may include a mesh (e.g., mesh (601) of FIG. 6) fixed within the audio hole, a speaker (e.g., speaker (320) of FIG. 3) disposed within the housing and in contact with a portion of the side wall corresponding to an edge of the audio hole to transmit sound to the outside through the audio hole. The side wall may include a non-conductive portion (e.g., non-conductive portion (410a) of FIG. 5) facing the interior space of the housing and including a first hole defining a portion of the audio hole, and a conductive portion (e.g., conductive portion (410b) of FIG. 5) facing the exterior of the housing and including a second hole defining another portion of the audio hole. The mesh may be spaced apart from the speaker and disposed within the first hole.

According to one embodiment, the electronic device may further include a first fixing portion (e.g., the first fixing portion (610) of FIG. 6) facing the speaker and positioned along an edge of the mesh. The electronic device may further include a second fixing portion (e.g., the second fixing portion (620) of FIG. 6) facing an exterior of the electronic device and positioned along an edge of the mesh. Each of the first fixing portion and the second fixing portion may further include an opening corresponding to an audio hole.

According to one embodiment, the electronic device may further include a first film disposed between the mesh and the first fixing portion, and a second film disposed between the mesh and the second fixing portion. Each of the first film and the second film may include an opening corresponding to the audio hole.

According to one embodiment, the first fixed portion may include a protrusion that contacts the conductive portion of the side wall.

According to one embodiment, the speaker may include an acoustic duct (e.g., an acoustic duct (320a) of FIG. 5) that transmits the sound to the audio hole, and an adhesive member (e.g., an adhesive member (590) of FIG. 5) that is arranged on a surface of the speaker toward which the acoustic duct faces.

According to one embodiment, the adhesive member may be positioned along an edge of the audio hole to isolate the internal space of the electronic device from the audio hole.

FIG. 18 is a block diagram of an electronic device within a network environment according to various embodiments.

FIG. 18 is a block diagram of an electronic device (1801) within a network environment (1800) according to various embodiments. Referring to FIG. 18, in the network environment (1800), the electronic device (1801) may communicate with the electronic device (1802) via a first network (1898) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (1804) or the server (1808) via a second network (1899) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (1801) may communicate with the electronic device (1804) via the server (1808). According to one embodiment, the electronic device (1801) may include a processor (1820), a memory (1830), an input module (1850), an audio output module (1855), a display module (1860), an audio module (1870), a sensor module (1876), an interface (1877), a connection terminal (1878), a haptic module (1879), a camera module (1880), a power management module (1888), a battery (1889), a communication module (1890), a subscriber identification module (1896), or an antenna module (1897). In some embodiments, the electronic device (1801) may omit at least one of these components (e.g., the connection terminal (1878)), or may have one or more other components added. In some embodiments, some of these components (e.g., sensor module (1876), camera module (1880), or antenna module (1897)) may be integrated into a single component (e.g., display module (1860)).

The processor (1820) may control at least one other component (e.g., a hardware or software component) of the electronic device (1801) connected to the processor (1820) by executing, for example, software (e.g., a program (1840)), and may perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (1820) may store commands or data received from other components (e.g., a sensor module (1876) or a communication module (1890)) in a volatile memory (1832), process the commands or data stored in the volatile memory (1832), and store result data in a non-volatile memory (1834). According to one embodiment, the processor (1820) may include a main processor (1821) (e.g., a central processing unit or an application processor) or an auxiliary processor (1823) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (1821). For example, when the electronic device (1801) includes the main processor (1821) and the auxiliary processor (1823), the auxiliary processor (1823) may be configured to use less power than the main processor (1821) or to be specialized for a given function. The auxiliary processor (1823) may be implemented separately from the main processor (1821) or as a part thereof.

The auxiliary processor (1823) may control at least a portion of functions or states associated with at least one component (e.g., the display module (1860), the sensor module (1876), or the communication module (1890)) of the electronic device (1801), for example, on behalf of the main processor (1821) while the main processor (1821) is in an inactive (e.g., sleep) state, or together with the main processor (1821) while the main processor (1821) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (1823) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (1880) or a communication module (1890)). In one embodiment, the auxiliary processor (1823) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (1801) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (1808)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include a plurality of artificial neural network layers. The artificial neural network can be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-networks, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model can also or alternatively include a software structure.

The memory (1830) can store various data used by at least one component (e.g., the processor (1820) or the sensor module (1876)) of the electronic device (1801). The data can include, for example, software (e.g., the program (1840)) and input data or output data for commands related thereto. The memory (1830) can include volatile memory (1832) or non-volatile memory (1834).

The program (1840) may be stored as software in memory (1830) and may include, for example, an operating system (1842), middleware (1844), or an application (1846).

The input module (1850) can receive commands or data to be used in a component of the electronic device (1801) (e.g., a processor (1820)) from an external source (e.g., a user) of the electronic device (1801). The input module (1850) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

The audio output module (1855) can output audio signals to the outside of the electronic device (1801). The audio output module (1855) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

The display module (1860) can visually provide information to an external party (e.g., a user) of the electronic device (1801). The display module (1860) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (1860) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module (1870) can convert sound into an electrical signal, or vice versa. According to one embodiment, the audio module (1870) can acquire sound through the input module (1850), output sound through the sound output module (1855), or an external electronic device (e.g., electronic device (1802)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (1801).

The sensor module (1876) can detect the operating status (e.g., power or temperature) of the electronic device (1801) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (1876) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface (1877) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (1801) with an external electronic device (e.g., the electronic device (1802)). In one embodiment, the interface (1877) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal (1878) may include a connector through which the electronic device (1801) may be physically connected to an external electronic device (e.g., the electronic device (1802)). In one embodiment, the connection terminal (1878) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

The haptic module (1879) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (1879) may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module (1880) can capture still images and moving images. In one embodiment, the camera module (1880) may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module (1888) can manage the power supplied to the electronic device (1801). According to one embodiment, the power management module (1888) can be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

A battery (1889) may power at least one component of the electronic device (1801). In one embodiment, the battery (1889) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

The communication module (1890) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (1801) and an external electronic device (e.g., electronic device (1802), electronic device (1804), or server (1808)), and the performance of communication through the established communication channel. The communication module (1890) may operate independently from the processor (1820) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (1890) may include a wireless communication module (1892) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (1894) (e.g., a local area network (LAN) communication module, or a power line communication module). Any of these communication modules may communicate with an external electronic device (1804) via a first network (1898) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (1899) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a local area network or a wide area network)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (1892) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (1896) to identify or authenticate the electronic device (1801) within a communication network such as the first network (1898) or the second network (1899).

The wireless communication module (1892) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimizing terminal power and connecting multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (1892) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (1892) may support various technologies for securing performance in high-frequency bands, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (1892) may support various requirements specified in the electronic device (1801), an external electronic device (e.g., the electronic device (1804)), or a network system (e.g., the second network (1899)). According to one embodiment, the wireless communication module (1892) can support a peak data rate (e.g., 20 Gbps or more) for eMBB implementation, a loss coverage (e.g., 164 dB or less) for mMTC implementation, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC implementation.

The antenna module (1897) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (1897) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (1897) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (1898) or the second network (1899), may be selected from the plurality of antennas by, for example, the communication module (1890). A signal or power may be transmitted or received between the communication module (1890) and the external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (1897).

According to various embodiments, the antenna module (1897) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

According to one embodiment, commands or data may be transmitted or received between the electronic device (1801) and an external electronic device (1804) via a server (1808) connected to a second network (1899). Each of the external electronic devices (1802 or 1804) may be the same or a different type of device as the electronic device (1801). According to one embodiment, all or part of the operations executed in the electronic device (1801) may be executed in one or more of the external electronic devices (1802, 1804, or 1808). For example, when the electronic device (1801) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (1801) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (1801). The electronic device (1801) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (1801) may provide an ultra-low latency service using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (1804) may include an Internet of Things (IoT) device. The server (1808) may be an intelligent server utilizing machine learning and/or a neural network. According to one embodiment, the external electronic device (1804) or the server (1808) may be included in a second network (1899). The electronic device (1801) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document may be implemented as software (e.g., a program (1840)) including one or more instructions stored in a storage medium (e.g., an internal memory (1836) or an external memory (1838)) readable by a machine (e.g., an electronic device (1801)). For example, a processor (e.g., a processor (1820)) of the machine (e.g., an electronic device (1801)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims (15)

In an electronic device (100), A housing (110) including a side wall (310) including an audio hole (311); A mesh assembly (510) fastened within the above audio hole (311); and A speaker (320) is disposed within the housing (110) and is in contact with the audio hole (311) to transmit sound to the outside through the audio hole (311); The above mesh assembly (510) is spaced apart from the speaker (320). Electronic device (100). In the first paragraph, The above housing (110) is A conductive portion (410b) defining the outer surface of the side wall (310); and Includes a non-conductive portion (410a) coupled to the conductive portion (410b); The above audio hole (311) penetrates the conductive portion (410b) and the non-conductive portion (410a). Electronic device (100). In the second paragraph, The above mesh assembly (510) is placed in the portion of the audio hole (311) located in the non-conductive portion (410a). Electronic device (100). In the first paragraph, The above speaker (320) is, It includes an acoustic duct (320a) that transmits the above sound to the audio hole (311), Including an adhesive member (590) disposed on the surface of the speaker (320) on which the end of the sound duct (320a) is disposed. Electronic device (100). In paragraph 4, In order to isolate the internal space of the electronic device (100) and the audio hole (311), the adhesive member (590) is arranged along the edge of the audio hole (311). Electronic device (100). In paragraph 5, The above adhesive member (590) is attached to a ring-shaped sealing member (585) that surrounds the sound duct (320a). Electronic device (100). In the first paragraph, The above mesh assembly (510) is A first fixed part (610) facing the speaker (320) and positioned along the edge of the audio hole (311); A second fixed portion (620) facing the outside of the electronic device (100) and positioned along the edge of the audio hole (311); and A mesh (601) disposed between the first fixed part (610) and the second fixed part (620) and crossing the audio hole (311); Electronic device (100). In paragraph 7, The first fixed part (610) and the second fixed part (620) are Inserted into a groove dug from the inner surface of the above audio hole (311), Electronic device (100). In paragraph 7, A part of the first fixed part (610) and a part of the second fixed part (620) in contact with the hole are round, Electronic device (100). In paragraph 7, The above first fixed portion (610) is substantially flat, A part of the second fixed portion (620) in contact with the hole is round, Electronic device (100). In paragraph 7, The above mesh assembly (510) is Further comprising a film disposed between the above mesh (601) and the second fixed part (620), The above film, including an opening corresponding to the above audio hole (311), Electronic device (100). In Article 11, The above mesh assembly (510) is Further comprising another film disposed between the above mesh (601) and the first fixed portion (610), The other films mentioned above are, including an opening corresponding to the above audio hole (311), Electronic device (100). In paragraph 7, The above first fixed part (610) is, Including a protrusion that comes into contact with the conductive portion (410b) of the side wall (310). Electronic device (100). In the first paragraph, The above audio hole (311) is Bent based on the above mesh assembly (510), Electronic device (100). In the first paragraph, The inner surface of the portion of the side wall (310) that meets the speaker (320) is inclined with respect to the mesh assembly (510). Electronic device (100).