WO2024196031A1 - Electronic device comprising waterproof structure - Google Patents

Abstract

An electronic device according to one embodiment may comprise: a housing; a printed circuit board within the housing; and a flash module including a conductive pad in contact with the top of the printed circuit board, a light-emitting portion disposed on the conductive pad and configured to emit light, and a support member disposed on the conductive pad and surrounding at least a portion of the light-emitting portion. The electronic device may comprise a shield can including a first portion which includes an opening penetrated by the flash module for a path of the light and contacts the support member so as to reduce moisture flowing into the conductive pad from the outside of the electronic device, and a second portion extending from the first portion to the printed circuit board.

Description

Electronic devices including waterproof structures

The embodiments described below relate to electronic devices including a waterproof structure.

Small electronic devices, such as smart phones or tablet personal computers, may include electronic components within the electronic device to implement various functions of the electronic device. In order to reduce damage to the electronic components due to moisture entering from the outside of the electronic device, the electronic device may include a waterproof structure for the electronic components.

The above information may be provided as related art for the purpose of assisting in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

In one embodiment, an electronic device may include a housing including a hole, a printed circuit board within the housing including a first region facing the hole and a second region surrounding the first region, and a window at least partially positioned within the hole. The electronic device may include a flash module including a conductive pad disposed below the hole and in contact with the first region of the printed circuit board, a light emitting portion disposed on the conductive pad and configured to emit light toward the window based on power provided through the conductive pad, and a support member disposed on the conductive pad and surrounding at least a portion of the light emitting portion. The electronic device may include a shield can including a first portion including an opening penetrated by the flash module for a path of the light and contacting the support member to reduce moisture entering the conductive pad from an outside of the electronic device, and a second portion extending from the first portion to a second region surrounding the first region.

In one embodiment, an electronic device may include a housing including a hole, a printed circuit board within the housing including a first region facing the hole and a second region surrounding the first region, and a window at least partially positioned within the hole. The electronic device may include a flash module including a conductive pad disposed below the hole and in contact with the first region of the printed circuit board, a light emitting portion disposed on the conductive pad and including a first side facing the window, a second side in contact with the conductive pad, and a third side extending from the first side to the second side, the light emitting portion configured to emit light toward the window based on power provided through the conductive pad, and a support member disposed on the conductive pad and surrounding the third side of the light emitting portion. The electronic device may include a shield can including a first portion that includes an opening penetrated by the light emitting portion and the support member for the path of the light and that contacts the support member to reduce moisture flowing into the conductive pad from the outside of the electronic device, and a second portion that extends from the first portion to a second region surrounding the first region. The support member may include a support portion that supports the first portion at a position adjacent to an edge of the opening and protrudes toward the second portion extending from the first portion.

FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

FIG. 2 is a diagram illustrating an electronic device according to one embodiment.

FIG. 3 is an exploded perspective view of an electronic device according to one embodiment.

Figure 4a is a partially exploded perspective view of an exemplary electronic device.

Figure 4b is a partial cross-sectional view of an exemplary electronic device.

Figures 5a, 5b, and 5c are partial cross-sectional views of an exemplary electronic device.

Figures 6a and 6b are partial cross-sectional views of an exemplary electronic device.

FIG. 6c is a perspective view illustrating a portion of the exemplary electronic device of FIG. 6b.

Figure 7a is a partial cross-sectional view of an exemplary electronic device.

FIG. 7b is a perspective view illustrating a portion of the exemplary electronic device of FIG. 7a.

Figure 8a is a partial cross-sectional view of an exemplary electronic device.

FIG. 8b is a perspective view illustrating a portion of the exemplary electronic device of FIG. 8a.

Figure 8c is a partial cross-sectional view of an exemplary electronic device.

FIG. 8d is a perspective view illustrating a portion of the exemplary electronic device of FIG. 8c.

Figure 9 is a partial cross-sectional view of an exemplary electronic device.

FIG. 10 is a flow chart illustrating part of a manufacturing process of an exemplary electronic device.

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components. In addition, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

FIG. 1 is a block diagram of an electronic device within a network environment, according to one embodiment.

Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). According to one embodiment, the electronic device (101) may include at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. According to one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

The processor (120) may control at least one other component (e.g., a hardware or software component) of an electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store result data in a nonvolatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

The auxiliary processor (123) may control at least a portion of functions or states associated with at least one of the components of the electronic device (101) (e.g., the display module (160), the sensor module (176), or the communication module (190)), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing device) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. Such learning may be performed, for example, in the electronic device (101) on which artificial intelligence is performed, or may be performed through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers. The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-networks, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may additionally or alternatively include a software structure.

The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or nonvolatile memory (134).

The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

The audio output module (155) can output an audio signal to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive an incoming call. According to one embodiment, the receiver can be implemented separately from the speaker or as a part thereof.

The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) can include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) can include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can obtain sound through an input module (150), or output sound through an audio output module (155), or an external electronic device (e.g., an electronic device (102)) (e.g., a speaker or a headphone) directly or wirelessly connected to the electronic device (101).

The sensor module (176) can detect an operating state (e.g., power or temperature) of the electronic device (101) or an external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface (177) may support one or more designated protocols that may be used to allow the electronic device (101) to directly or wirelessly connect with an external electronic device (e.g., the electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., the electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that a user can perceive through a tactile or kinesthetic sense. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module (180) can capture still images and moving images. According to one embodiment, the camera module (180) can include one or more lenses, image sensors, image signal processors, or flashes.

The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery (189) can power at least one component of the electronic device (101). According to one embodiment, the battery (189) can include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

The communication module (190) may support establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., the electronic device (102), the electronic device (104), or the server (108)), and performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., the application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module or a power line communication module). Among these communication modules, a corresponding communication module may communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) may use subscriber information (e.g., international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196) to identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199).

The wireless communication module (192) can support a 5G network and next-generation communication technology after a 4G network, for example, NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), terminal power minimization and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) may support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) may support various requirements specified in an electronic device (101), an external electronic device (e.g., electronic device (104)), or a network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL) each, or 1 ms or less for round trip) for URLLC realization.

The antenna module (197) can transmit or receive signals or power to or from the outside (e.g., an external electronic device). According to one embodiment, the antenna module (197) can include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) can include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), can be selected from the plurality of antennas by, for example, the communication module (190). A signal or power can be transmitted or received between the communication module (190) and the external electronic device through the selected at least one antenna. According to one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) can be additionally formed as a part of the antenna module (197).

In one embodiment, the antenna module (197) can form a mmWave antenna module. In one embodiment, the mmWave antenna module can include a printed circuit board, an RFIC positioned on or adjacent to one surface (e.g., a bottom surface) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) positioned on or adjacent to another surface (e.g., a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

At least some of the above components may be connected to each other and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, a general purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)).

In one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). In one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform at least a part of the function or service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as it is or additionally and provide it as at least a part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide an ultra-low latency service by using, for example, distributed computing or mobile edge computing. According to one embodiment, the external electronic device (104) may include an IoT (Internet of Things) device. The server (108) may be an intelligent server using machine learning and/or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199). The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

FIG. 2 is a diagram illustrating an electronic device according to one embodiment.

Referring to FIG. 2, an electronic device (101) according to one embodiment may include a housing (210) forming an exterior of the electronic device (101). For example, the housing (210) may include a front surface (200A), a rear surface (200B), and a side surface (200C) surrounding a space between the front surface (200A) and the rear surface (200B). According to one embodiment, the housing (210) may also refer to a structure forming at least a portion of the front surface (200A), the rear surface (200B), and/or the side surface (200C).

An electronic device (101) according to one embodiment may include a substantially transparent front plate (202). According to one embodiment, the front plate (202) may form at least a portion of the front surface (200A). According to one embodiment, the front plate (202) may include, for example, but is not limited to, a glass plate including various coating layers, or a polymer plate.

An electronic device (101) according to one embodiment may include a substantially opaque back plate (211). According to one embodiment, the back plate (211) may form at least a portion of the back surface (200B). According to one embodiment, the back plate (211) may be formed of a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

An electronic device (101) according to one embodiment may include a side bezel structure (or side member) (218). According to one embodiment, the side bezel structure (218) may be coupled with the front plate (202) and/or the back plate (211) to form at least a portion of the side surface (200C) of the electronic device (101). For example, the side bezel structure (218) may form the entire side surface (200C) of the electronic device (101), or, for another example, the side bezel structure (218) may form the side surface (200C) of the electronic device (101) together with the front plate (202) and/or the back plate (211).

Unlike the illustrated embodiment, when the side surface (200C) of the electronic device (101) is partially formed by the front plate (202) and/or the rear plate (211), the front plate (202) and/or the rear plate (211) may include a region that extends seamlessly from its edge toward the rear plate (211) and/or the front plate (202). The extending region of the front plate (202) and/or the rear plate (211) may be located at both ends of a long edge of the electronic device (101), for example, but is not limited to the above-described example.

In one embodiment, the side bezel structure (218) may include a metal and/or a polymer. In one embodiment, the back plate (211) and the side bezel structure (218) may be formed integrally and may include the same material (e.g., a metal material such as aluminum), but is not limited thereto. For example, the back plate (211) and the side bezel structure (218) may be formed as separate configurations and/or may include different materials.

According to one embodiment, the electronic device (101) may include at least one of a display (201) (e.g., the display module (160) of FIG. 1), an audio module (203, 204, 207) (e.g., the audio module (170) of FIG. 1), a sensor module (not shown) (e.g., the sensor module (176) of FIG. 1), a camera module (205, 212) (e.g., the camera module (180) of FIG. 1), a key input device (217) (e.g., the input module (150) of FIG. 1), a light emitting element (not shown), and/or a connector hole (208). According to one embodiment, the electronic device (101) may omit at least one of the above components (e.g., the key input device (217) or the light emitting element (not shown)) or may additionally include other components.

In one embodiment, the display (201) can be visually exposed through a substantial portion of the front plate (202). For example, at least a portion of the display (201) can be visible through the front plate (202) forming the front surface (200A). In one embodiment, the display (201) can be disposed on the back surface of the front plate (202).

According to one embodiment, the outer shape of the display (201) may be formed to be substantially the same as the outer shape of the front plate (202) adjacent to the display (201). According to one embodiment, in order to expand the area where the display (201) is visually exposed, the gap between the outer shape of the display (201) and the outer shape of the front plate (202) may be formed to be substantially the same.

In one embodiment, the display (201) (or the front surface (200A) of the electronic device (101)) may include a screen display area (201A). In one embodiment, the display (201) may provide visual information to a user through the screen display area (201A). In the illustrated embodiment, when the front surface (200A) is viewed straight ahead, the screen display area (201A) is depicted as being positioned on the inner side of the front surface (200A) and spaced apart from the outer side of the front surface (200A), but is not limited thereto. In another embodiment, when the front surface (200A) is viewed straight ahead, at least a portion of an edge of the screen display area (201A) may substantially coincide with an edge of the front surface (200A) (or the front plate (202)).

According to one embodiment, the screen display area (201A) may include a sensing area (201B) configured to acquire biometric information of the user. Here, the meaning of "the screen display area (201A) includes the sensing area (201B)" may be understood as that at least a portion of the sensing area (201B) may overlap the screen display area (201A). For example, the sensing area (201B) may mean an area that can display visual information by the display (201) like other areas of the screen display area (201A) and additionally acquire biometric information (e.g., a fingerprint) of the user. According to one embodiment, the sensing area (201B) may also be formed in the key input device (217).

In one embodiment, the display (201) may include an area where the first camera (205) is positioned. In one embodiment, an opening is formed in the area of the display (201), and the first camera (205) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the front (200A). In this case, the screen display area (201A) may surround at least a portion of an edge of the opening. In one embodiment, the first camera (205) (e.g., an under display camera (UDC)) may be positioned below the display (201) so as to overlap the area of the display (201). In this case, the display (201) may provide visual information to the user through the area, and additionally, the first camera (205) may obtain an image corresponding to a direction facing the front (200A) through the area of the display (201).

According to one embodiment, the display (201) may be coupled with or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen.

According to one embodiment, the audio module (203, 204, 207) may include a microphone hole (203, 204) and a speaker hole (207).

According to one embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed in a portion of the side (200C) and a second microphone hole (204) formed in a portion of the rear (200B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (203, 204). The microphone may include a plurality of microphones so as to detect the direction of the sound.

According to one embodiment, the second microphone hole (204) formed in a portion of the rear surface (200B) may be positioned adjacent to the camera module (205, 212). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212). However, the present invention is not limited thereto.

According to one embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed in a part of the side surface (200C) of the electronic device (101). According to one embodiment, the external speaker hole (207) may be implemented as a single hole with the microphone hole (203). Although not shown, the call receiver hole (not shown) may be formed in another part of the side surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) in the side surface (200C). For example, with reference to the illustration in FIG. 2, the external speaker hole (207) may be formed in the side surface (200C) corresponding to the lower portion of the electronic device (101), and the call receiver hole may be formed in the side surface (200C) corresponding to the upper portion of the electronic device (101). However, this is not limited thereto, and according to one embodiment, the call receiver hole may be formed at a location other than the side (200C). For example, the call receiver hole may be formed by a spaced space between the front plate (202) (or, display (201)) and the side bezel structure (218).

According to one embodiment, the electronic device (101) may include at least one speaker (not shown) configured to output sound to the outside of the housing through an external speaker hole (207) and/or a call receiver hole (not shown). For example, the speaker may include a piezo speaker configured to output audio by vibrating a diaphragm within the speaker using a piezoelectric element, but is not limited thereto.

According to one embodiment, a sensor module (not shown) may generate an electric signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, a heart rate monitor (HRM) sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

According to one embodiment, the camera module (205, 212) may include a first camera (205) positioned to face the front (200A) of the electronic device (101), and a second camera (212) positioned to face the rear (200B).

According to one embodiment, the second camera (212) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera (212) is not necessarily limited to including multiple cameras and may include one camera.

According to one embodiment, the first camera (205) and the second camera (212) may include one or more lenses, image sensors, and/or image signal processors.

In one embodiment, the electronic device (101) may include a flash (213) positioned to face the rear (200B). According to one embodiment, the flash (213) may include, for example, a light emitting diode or a xenon lamp. According to one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be positioned on one side of the electronic device (101).

In one embodiment, the key input device (217) may be positioned on a side (200C) of the electronic device (101). In one embodiment, the electronic device (101) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (201).

According to one embodiment, a connector hole (208) may be formed on a side surface (200C) of the electronic device (101) so that a connector of an external device may be accommodated. A connection terminal (e.g., a connection terminal (178) of FIG. 1) electrically connected to a connector of an external device may be arranged within the connector hole (208). The electronic device (101) according to one embodiment may include an interface module (e.g., an interface (177) of FIG. 1) for processing an electrical signal transmitted and received through the connection terminal.

According to one embodiment, the electronic device (101) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on the front surface (200A) of the housing. The light-emitting element (not shown) may provide status information of the electronic device (101) in the form of light. According to one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera (205). For example, the light-emitting element (not shown) may include an LED, an IR LED, and/or a xenon lamp.

FIG. 3 is an exploded perspective view of an electronic device according to one embodiment.

In the following, duplicate descriptions of configurations having the same reference numerals as the aforementioned configurations are omitted.

Referring to FIG. 3, an electronic device (101) according to one embodiment may include a display (201), a front plate (202), a rear plate (211), a frame structure (240), a first printed circuit board (250), a second printed circuit board (252), a cover plate (260), and a battery (270) (e.g., battery (189) of FIG. 1).

In one embodiment, the frame structure (240) may include an inner wall (241) forming an outer appearance of the electronic device (101) (e.g., side surface (200C) of FIG. 2) and a support structure (243) extending inwardly from the inner wall (241). In one embodiment, the frame structure (240) may be disposed between the display (201) and the back plate (211). In one embodiment, the inner wall (241) of the frame structure (240) may surround a space between the back plate (211) and the front plate (202) (and/or the display (201)), and the support structure (243) of the frame structure (240) may extend from the inner wall (241) within the space.

In one embodiment, the frame structure (240) may support or accommodate other components included in the electronic device (101). For example, a display (201) may be disposed on one side of the frame structure (240) facing one direction (e.g., +z direction), and the display (201) may be supported by a support structure (243) of the frame structure (240). For example, a first printed circuit board (250), a second printed circuit board (252), a battery (270), and a second camera (212) may be disposed on the other side of the frame structure (240) facing the opposite direction (e.g., -z direction). The first printed circuit board (250), the second printed circuit board (252), the battery (270), and the second camera (212) may be respectively mounted in recesses defined by an inner wall (241) of the frame structure (240) and/or the support structure (243).

According to one embodiment, the first printed circuit board (250), the second printed circuit board (252), and the battery (270) may be respectively coupled to the frame structure (240). For example, the first printed circuit board (250) and the second printed circuit board (252) may be fixedly arranged to the frame structure (240) through a coupling member such as a screw. For example, the battery (270) may be fixedly arranged to the frame structure (240) through an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

According to one embodiment, the cover plate (260) may be disposed between the first printed circuit board (250) and the back plate (211). According to one embodiment, the cover plate (260) may be disposed on the first printed circuit board (250). For example, the cover plate (260) may be disposed on a surface facing the -z direction of the first printed circuit board (250).

In one embodiment, the cover plate (260) may at least partially overlap the first printed circuit board (250) with respect to the z-axis. In one embodiment, the cover plate (260) may cover at least a portion of the first printed circuit board (250). In this way, the cover plate (260) may protect the first printed circuit board (250) from physical impact or prevent detachment of a connector coupled to the first printed circuit board (250).

According to one embodiment, the cover plate (260) may be fixedly positioned on the first printed circuit board (250) via a joining member (e.g., a screw), or may be joined to the frame structure (240) together with the first printed circuit board (250) via the joining member.

In one embodiment, the display (201) may be positioned between a frame structure (240) and a front plate (202). For example, the front plate (202) may be positioned on one side (e.g., in the +z direction) of the display (201), and the frame structure (240) may be positioned on the other side (e.g., in the -z direction).

In one embodiment, the front plate (202) can be coupled with the display (201). For example, the front plate (202) and the display (201) can be adhered to each other via an optical adhesive material (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

In one embodiment, the front plate (202) may be coupled with the frame structure (240). For example, the front plate (202) may include an outer portion extending outside the display (201) when viewed in the z-axis direction, and may be coupled to the frame structure (240) through an adhesive member (e.g., double-sided tape) disposed between the outer portion of the front plate (202) and the frame structure (240) (e.g., inner wall (241)). However, the present invention is not limited to the above-described example.

According to one embodiment, the first printed circuit board (250) and/or the second printed circuit board (252) may be equipped with a processor (e.g., the processor (120) of FIG. 1), a memory (e.g., the memory (130) of FIG. 1), and/or an interface (e.g., the interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, a volatile memory (e.g., the volatile memory (132) of FIG. 1) or a nonvolatile memory (e.g., the nonvolatile memory (134) of FIG. 1). The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, and may include a USB connector, an SD card/MMC (multimedia card) connector, or an audio connector. In one embodiment, the first printed circuit board (250) and the second printed circuit board (252) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

In one embodiment, the battery (270) can power at least one component of the electronic device (101). For example, the battery (270) can include a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (270) can be disposed substantially coplanar with the first printed circuit board (250) and/or the second printed circuit board (252).

An electronic device (101) according to one embodiment may include an antenna module (not shown). According to one embodiment, the antenna module may be disposed between the rear plate (211) and the battery (270). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with an external device.

In one embodiment, a first camera (205) (e.g., a front camera) may be positioned on at least a portion of a frame structure (240) (e.g., a support structure (243)) such that a lens can receive external light through a portion of a front plate (202) (e.g., a camera area (237)) (e.g., a front (200A) of FIG. 1).

In one embodiment, the second camera (212) (e.g., a rear camera) may be positioned between the frame structure (240) and the rear plate (211). In one embodiment, the second camera (212) may be electrically connected to the first printed circuit board (250) via a connecting member (e.g., a connector). In one embodiment, the second camera (212) may be positioned such that the lens can receive external light through the camera area (284) of the rear plate (211) of the electronic device (101).

According to one embodiment, the camera area (284) may be formed on a surface of the rear plate (211) (e.g., the rear surface (200B) of FIG. 1). According to one embodiment, the camera area (284) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera (212). According to one embodiment, at least a portion of the camera area (284) may protrude from the surface of the rear plate (211) by a predetermined height. However, the present invention is not limited thereto, and in another embodiment, the camera area (284) may form a plane substantially identical to the surface of the rear plate (211).

According to one embodiment, the housing (e.g., the housing (210) of FIG. 2) of the electronic device (101) may mean a configuration or structure forming at least a portion of the exterior of the electronic device (101). In this regard, at least a portion of the front plate (202), the frame structure (240), and/or the rear plate (211) forming the exterior of the electronic device (101) may be referred to as the housing (210) of the electronic device (101).

FIG. 4a is a partially exploded perspective view of an exemplary electronic device. FIG. 4b is a partial cross-sectional view of the exemplary electronic device.

Referring to FIGS. 4A and 4B, the electronic device (101) may include a housing (210) including a hole (215), a printed circuit board (410) (e.g., the first printed circuit board (250) and the second printed circuit board (252) of FIG. 3), a window (420), a flash module (430) (e.g., the flash (213) of FIG. 2), and a shield can (440).

According to one embodiment, the hole (215) may be formed in the rear plate of the housing (210) (e.g., the rear plate (211) of FIG. 2). The hole (215) may be a path through which light emitted from the flash module (430) is transmitted to the outside of the electronic device (101). The flash module (430) may be positioned adjacent to the camera module (e.g., the camera module (180) of FIG. 1) for linkage with the camera module. For example, the hole (215) may be formed in a camera area (e.g., the camera area (284) of FIG. 3) where the camera is positioned (e.g., the second camera (212) of FIG. 2)) so as to be adjacent to the camera.

According to one embodiment, the printed circuit board (410) within the housing (210) may include a first region (411) facing the hole (215), and a second region (412) surrounding the first region (411). For example, the second region (412) may extend from the first region (411). For example, the second region (412) may be connected to the first region (411). For example, the second region (412) may surround the first region (411). For example, the second region (412) may be a remaining region of the printed circuit board (410) excluding the first region (411). For example, the first region (411) may be disposed on one surface of the printed circuit board (410) facing a portion of the housing (210) where the hole (215) is formed. The second region (412) may be a region on the one surface that extends from the first region (411) and surrounds the first region (411). For example, the first region (411) may be faced away from the hole (215). The flash module (430) may be positioned between the first region (411) and the hole (215). For example, the first region (411) may be a region connected to the flash module (430). The second region (412) that surrounds the first region (411) may be a region spaced apart from the flash module (430).

In one embodiment, the window (420) can be positioned at least partially within the hole (215). For example, the window (420) can fill at least a portion of the hole (215). For example, the window (420) can pass through at least a portion of the hole (215). For example, the window (420) can include a transparent or translucent material (e.g., glass) for light emitted from the flash module (430) through the hole (215) toward the exterior of the electronic device (101).

In one embodiment, a flash module (430) may be disposed under the hole (215). The flash module (430) may include a conductive pad (431), a light-emitting portion (432), and a support member (433). The conductive pad (431) may be in contact with a first region (411) of a printed circuit board (410). The light-emitting portion (432) may be disposed on the conductive pad (431) and configured to emit light toward the window (420) based on power provided through the conductive pad (431). The support member (433) may be disposed on the conductive pad (431) and surround at least a portion of the light-emitting portion (432).

For example, the flash module (430) may be configured to emit light to the outside of the electronic device (101) through the hole (215). For example, the flash module (430) may overlap the hole (215) when the housing (210) is viewed from above. For example, the flash module (430) may be positioned under a window (420) at least part of which is positioned within the hole (215). For example, the flash module (430) may be positioned between the first region (411) of the printed circuit board (410) and the window (420).

For example, the conductive pad (431) may be connected to the first region (411) of the printed circuit board (410). For example, the conductive pad (431) may be configured to receive power from the printed circuit board (410). For example, although not shown, the conductive pad (431) may include a first electrode that receives current from the first region (411) and a second electrode that emits the supplied current through the first region (411). The conductive pad (431) may supply power to the flash module (430) through the supplied current.

For example, the light emitting portion (432) may be connected to the conductive pad (431). For example, the light emitting portion (432) may be a portion of the flash module (430) configured to emit light. For example, the light emitting portion (432) may be configured to emit light to the outside of the electronic device (101) through the window (420) and the hole (215) based on power provided through the conductive pad (431). For example, although not shown, the light emitting portion (432) may include at least one light emitting element to emit light based on power provided through the conductive pad (431).

For example, the support member (433) may form at least a portion of the exterior of the flash module (430). For example, the support member (433) may support the flash module (430) using the printed circuit board (410). For example, the support member (433) may cover at least a portion of the conductive pad (431). For example, the support member (433) may surround the light emitting portion (432) by wrapping at least a portion of the light emitting portion (432) so that light emitted from the light emitting portion (432) is transmitted to the outside of the electronic device (101) through the hole (215).

According to one embodiment, the shield can (440) may include a first portion (441) including an opening (450) penetrated by the flash module (430), and a second portion (442) extending from the first portion (441) to a second portion (412) surrounding a first region (411) of the printed circuit board (410). The first portion (441) may contact a support member (433) of the flash module (430) to reduce moisture flowing into the conductive pad (431) of the flash module (430) from the outside of the electronic device (101).

For example, the first portion (441) may be a portion of the shield can (440) that comes into contact with the flash module (430). For example, the first portion (441) may be a portion that extends from the support member (433) of the flash module (430) to the second portion (442). For example, the first portion (441) may be a portion that surrounds at least a portion of the support member (433). For example, the first portion (441) may be a portion that faces the window (420). For example, the first portion (441) may be a portion that overlaps the window (420) when the window (420) is viewed from above. For example, the first portion (441) may be a portion that overlaps at least a portion of the hole (215) when the hole (215) is viewed from above.

For example, the opening (450) can be formed in the first portion (441). For example, the opening (450) can allow at least a portion of the flash module (430) to pass through. For example, the first portion (441) can press the flash module (430) through an edge of the opening (450). For example, the opening (450) can be filled by the flash module (430). The first portion (441) can be configured to include the opening (450) such that light emitted from the flash module (430) through the opening (450) is transmitted to the outside of the electronic device (101).

For example, the first portion (441) may be in contact with the flash module (430) along the edge of the opening (450) to reduce moisture from entering the conductive pad (431) through at least some of the plurality of holes (e.g., the microphone hole (203), the speaker hole (207), the connector hole (208), the ear jack (not shown), and/or the key button hole (not shown) of FIG. 2) including the hole (215) of the housing (210) from the outside of the electronic device (101). For example, the first portion (441), together with the light-emitting portion (432) of the flash module (430) and the support member (433) disposed on the conductive pad (431), may reduce moisture from entering the conductive pad (431) from the outside of the electronic device (101).

For example, the second portion (442) may be a portion of the shield can (440) that comes into contact with the printed circuit board (410). For example, the second portion (442) may be attached to the second region (412) that surrounds the first region (411) of the printed circuit board (410). For example, the second portion (442) may shield at least a portion of the flash module (430). For example, the second portion (442) may surround at least a portion of the conductive pad (431) to reduce moisture from entering the conductive pad (431) from the outside of the electronic device (101) together with the first portion (441). For example, the second portion (442) may be soldered onto the second region (412) to reduce moisture from the outside of the electronic device (101) flowing into the conductive pad (431) through a gap between the second portion (442) and the second region (412) of the printed circuit board (410).

For example, the shield can (440) can isolate the conductive pad (431) of the flash module (430) from the outside of the electronic device (101) by having the opening (450) of the shield can (440) filled with at least a portion of the flash module (430) and the shield can (440) shielding the conductive pad (431) of the flash module (430). The shield can (440) can reduce electromagnetic noise of the conductive pad (431) caused by other electronic components that are not shielded by the shield can (440) by shielding the conductive pad (431) and reduce the inflow of moisture from the outside into the conductive pad (431).

According to one embodiment, the support member (433) may include a groove (433a) formed along an edge of the support member (433). A first portion (441) of the shield can (440) may be fastened to the groove (433a). For example, the groove (433a) may be formed on a side surface of the flash module (430). For example, the groove (433a) may be a portion of the support member (433) that comes into contact with the first portion (441). For example, the first portion (441) may be fastened to the groove (433a) by fastening an edge of an opening (450) included in the first portion (441) into the groove (433a). For example, the groove (433a) may have a shape corresponding to a shape of an edge of the opening (450) that is fastened to the groove (433a). The first part (441) can reduce the inflow of moisture from the outside of the electronic device (101) to the conductive pad (431) by being connected to the groove (433a) of the support member (433).

According to one embodiment, the opening (450) included in the first portion (441) may be penetrated by the light emitting portion (432) and the support member (433). The support member (433) may support the first portion (441) at a position adjacent to the edge of the opening (450) and may include a support member (433b) protruding toward the second portion (442) extending from the first portion (441).

For example, the opening (450) can be filled by the light emitting portion (432) and the supporting member (433). For example, the edge of the opening (450) can be in contact with the supporting member (433) surrounding at least a portion of the light emitting portion (432). For example, the supporting member (433b) can protrude from the supporting member (433) toward the second portion (442) to face the second area (412) of the printed circuit board (410). The supporting member (433b) can reduce the detachment of the first portion (441) from the flash module (430) due to an external impact by supporting the first portion (441), and can reduce moisture flowing into the conductive pad (431) through the opening (450) from the outside of the electronic device (101).

According to one embodiment, the electronic device (101) may further include a first space (S1) surrounded by a flash module (430), a shield can (440), and a printed circuit board (410). A second portion (442) of the shield can (440) may seal the first space (S1) by coming into contact with a second area (412) of the printed circuit board (410).

For example, the first space (S1) may be a space covered by the second area (412) of the printed circuit board (410), the flash module (430), and the shield can (440). For example, the first space (S1) may be sealed such that the opening (450) is filled by at least a portion of the flash module (430) and the shield can (440) extends from the opening (450) to the second area (412) of the printed circuit board (410). For example, the second portion (442) of the shield can (440) may be attached onto the second area (412) of the printed circuit board (410) to seal the first space (S1). By sealing the first space (S1) with the second region (412) and the flash module (430), the shield can (440) can reduce moisture flowing into the first space (S1) from the outside of the electronic device (101). By sealing the first space (S1), the shield can (440) can reduce moisture flowing into the conductive pad (431) that is in contact with the first region (411) surrounded by the second region (412).

According to one embodiment, the light emitting portion (432) may include a first surface (432a) facing the window (420), a second surface (432b) in contact with the conductive pad (431), and a third surface (432c) extending from the first surface (432a) to the second surface (432b). The support member (433) may contact the first portion (441) of the shield can (440) along the edge of the opening (450) and surround the third surface (432c). For example, the first surface (432a) may be a surface of the light emitting portion (432) from which light is emitted. For example, the first surface (432a) may face the hole (215). For example, the second side (432b) may be a side that is connected to the conductive pad (431) among the light-emitting portions (432). For example, the third side (432c) may connect the first side (432a) and the second side (432b). For example, the third side (432c) may face the edge of the opening (450). For example, the third side (432c) may be a side that faces the first portion (441). For example, the support member (433) that surrounds the third side (432c) may cover the conductive pad (431) together with the first side (432a). Since the support member (433) surrounding the third surface (432c) comes into contact with the first part (441) of the shield can (440), the support member (433) can reduce the inflow of moisture from the outside of the electronic device (101) to the conductive pad (431).

According to one embodiment, the electronic device (101) may further include a first waterproofing member (470) disposed between the window (420), at least a portion of which is positioned within the hole (215), and the housing (210) to reduce moisture flowing into the housing (210) from the outside of the electronic device (101) through the hole (215). For example, the first waterproofing member (470) may surround at least a portion of the window (420). For example, the electronic device (101) may include a gap between the window (420) and the hole (215). In order to reduce moisture flowing into the housing (210) from the outside of the electronic device (101), the first waterproofing member (470) may be disposed within the housing (210) between the housing (210) and the window (420).

According to one embodiment, the electronic device (101) may further include another shield can (401) that is distinct from the shield can (440) that comes into contact with the flash module (430). The other shield can (401) may surround the flash module (430) and other electronic components. The shield can (440) and the other shield can (401) may reduce interference between the flash module (430) and the other electronic components by surrounding the flash module (430) and the other electronic components, respectively.

According to the above-described embodiment, the electronic device (101) includes a shield can (440) including a first portion (441) in contact with a support member (433) of a flash module (430), and a second portion (442) extending from the first portion (441) to a second area (412) of a printed circuit board (410), thereby reducing the inflow of moisture from the outside of the electronic device (101) into the conductive pad (431) and reducing interference between at least one electronic component within the housing (210) and the conductive pad (431). The shield can (440) includes an opening (450) penetrated by the flash module (430), thereby providing a path for light emitted from the flash module (430) to be transmitted to the outside of the electronic device (101).

Figures 5a, 5b, and 5c are partial cross-sectional views of an exemplary electronic device.

Referring to FIGS. 5A and 5B and 5C, the electronic device (101) may include a housing (210) including a hole (215), a printed circuit board (410) (e.g., the first printed circuit board (250) and the second printed circuit board (252) of FIG. 3) within the housing (210), a window (420) at least partially positioned within the hole (215), a flash module (430) disposed below the hole (215), and a shield can (440). The printed circuit board (410) may include a first region (411) facing the hole (215) and a second region (412) surrounding the first region (411). The flash module (430) may include a conductive pad (431) in contact with the first region (411), a light-emitting portion (432) disposed on the conductive pad (431) and configured to emit light toward the window (420) based on power provided through the conductive pad (431), and a support member (433) disposed on the conductive pad and surrounding at least a portion of the light-emitting portion (432). The shield can (440) may include a first portion (441) that includes an opening (450) penetrated by the flash module (430) for a path of the light and that contacts the support member (433) to reduce moisture flowing into the conductive pad (431) from the outside of the electronic device (101), and a second portion (442) that extends from the first portion (441) to a second region (412) surrounding the first region (411). According to one embodiment, the shield can (440) may have a shape that extends from another shield can adjacent to the shield can (440) (e.g., another shield can (401) of FIG. 4b).

Below, redundant descriptions of the configurations described in FIGS. 4a and 4b are omitted.

According to one embodiment, the first portion (441) may further include a first waterproof portion (441a) extending from an edge of the opening (450) toward the second portion (442), and a side wall (441b) extending from the first waterproof portion (441a) toward the window (420) and surrounding at least a portion of the support member (433).

For example, the first waterproof portion (441a) may be a portion that comes into contact with the flash module (430). For example, referring to FIG. 5A, the support member (433) of the flash module (430) may include a groove (433a) formed along an edge of the support member (433), and a support portion (443b) that extends from the groove (433a) and supports the first portion (441). The first waterproof portion (441a) may be fastened within the groove (433a). The first waterproof portion (441a) may be supported by the support portion (443b). The electronic device (101) can reduce moisture flowing into the conductive pad (431) of the flash module (430) from the outside of the electronic device (101) through the opening (450) by including the first waterproofing portion (441a), together with the groove (433a) and the support portion (433a).

For example, the side wall (441b) can face at least a part of the support member (433). For example, the side wall (441b) can have a step with respect to the first waterproof portion (441a) by extending from the first waterproof portion (441a) toward the window (420). By having the step with respect to the first waterproof portion (441a) that comes into contact with the flash module (430), the side wall (441b) can reduce the first waterproof portion (441a) from being detached from the flash module (430) due to external impact.

Referring to FIG. 5a, the electronic device (101) may further include an adhesive member (510) between the side wall (441b) and the support member (433). For example, the adhesive member (510) may be disposed on the first waterproof portion (441a). For example, the adhesive member (510) may be positioned within a mounting space formed by the first waterproof portion (441a) and the side wall (441b). For example, the adhesive member (510) may be in contact with the support member (433), the first waterproof portion (441a), and the side wall (441b). The electronic device (101) can reduce moisture flowing into the conductive pad (431) through the opening (450) from the outside of the electronic device (101) by including the adhesive member (510), and reduce the detachment of the first part (441) from the flash module (430) due to external impact.

Referring to FIG. 5b, the opening (450) may be penetrated by the conductive pad (431). The support member (433) may include a protrusion (433c) that protrudes toward the side wall (441b) to cover the first waterproof portion (441a) and seal the conductive pad (431). For example, an edge of the opening (450) may be in contact with the conductive pad (431). For example, the first waterproof portion (441a) may extend from the conductive pad (431) toward the second portion (442) of the shield can (440), thereby contacting the second area (412) of the printed circuit board (410). For example, the side wall (441b) may extend from the first waterproof portion (441a) toward the window (420), thereby enclosing the support member (433). For example, the protrusion (433c) can be brought into contact with the side wall (441b) and the first waterproof portion (441a) by protruding toward the side wall (441b).

For example, the light emitting portion (432) of the flash module (430) may include a first surface (432a) facing the window (420), a second surface (432b) in contact with the conductive pad (431), and a third surface (432c) extending from the first surface (432a) to the second surface (432b). The support member (433) may surround the third surface (432c) of the light emitting portion (432). The side wall (441b) may face the third surface (432c). The protrusion (433c) may seal the conductive pad (431) in contact with the second surface (432b) together with the first waterproof portion (441a) by extending toward the side wall (441b). The above support member (433) can reduce the inflow of moisture from the outside of the electronic device (101) to the conductive pad (431) by including the protrusion (433c).

Referring to Fig. 5c, unlike that illustrated in Fig. 5a, the groove (433a) and/or the support portion (433b) of the support member (433) may be omitted. The first waterproof portion (441a) may be in contact with the support member (433) along an edge of the support member (433).

For example, the first waterproofing portion (441a) can pressurize the support member (433). For example, the first waterproofing portion (441a) can be attached to the support member (433) via the adhesive member (510). Since the first waterproofing portion (441a) is attached to the support member (433) via the adhesive member (510), the first portion (441) including the first waterproofing portion (441a) can be supported by the support member (433). Since the first waterproof portion (441a) is in contact with the support member (433), the first waterproof portion (441a) can reduce moisture flowing into the conductive pad (431) through the opening (450) from the outside of the electronic device (101) and reduce the first portion (441) from being detached from the flash module (430) due to external impact.

According to the above-described embodiment, the electronic device (101) includes a shield can (440) including a first waterproof portion (441a) and a side wall (441b), thereby reducing detachment of the shield can (440) from the flash module (430) due to external impact. The electronic device (101) includes an adhesive member (510) between the side wall (441b) and the support member (433) of the flash module (430), thereby reducing detachment of the first portion (441) from the flash module (430) and reducing inflow of moisture from the outside of the electronic device (101) to the conductive pad (431). The above support member (433) can reduce the inflow of moisture from the outside of the electronic device (101) to the conductive pad (431) by including a protrusion (433c) protruding toward the side wall (441b).

FIGS. 6A and 6B are partial cross-sectional views of an exemplary electronic device. FIG. 6C is a perspective view illustrating a portion of the exemplary electronic device of FIG. 6B.

Referring to FIGS. 6A and 6B, the electronic device (101) may include a housing (210) including a hole (215), a printed circuit board (410) (e.g., the first printed circuit board (250) and the second printed circuit board (252) of FIG. 3), a window (420), a flash module (430), and a shield can (440). The printed circuit board (410) may include a first region (411) and a second region (412). The flash module (430) may include a conductive pad (431), a light emitting portion (432), and a support member (433). The shield can (440) may include a first portion (441) including an opening (450), and a second portion (442) extending from the first portion (441).

According to one embodiment, the first portion (441) may further include a second waterproof portion (610) that protrudes toward the window (420) and isolates the flash module (430) from the outside of the electronic device (101) by coming into contact with the window (420). For example, the second waterproof portion (610) may extend from the first portion (441) of the shield can (440) to the window (420). For example, the second waterproof portion (610) may support the window (420). For example, the second waterproof portion (610) may isolate the flash module (430) from the outside of the electronic device (101) by sealing a space surrounded by the window (420), the flash module (430), and the shield can (440). The second waterproofing portion (610) can reduce the inflow of moisture from the outside to the flash module (430) by isolating the outside from the flash module (430).

Referring to FIGS. 6B and 6C, the window (420) may include a third portion (421) penetrating the hole (215), and a fourth portion (422) extending from the third portion (421) and supporting the housing (210). The second waterproofing portion (610) may include a support surface (611) that contacts the fourth portion (422) among the third portion (421) and the fourth portion (422). For example, the third portion (421) may be a portion of the window (420) that overlaps the hole (215) when the hole (215) is viewed from above. For example, the third portion (421) may be a portion of the window (420) that is exposed to the outside of the electronic device (101) through the hole (215). For example, the fourth portion (422) may be a portion of the window (420) that is covered by the housing (210). For example, the fourth portion (422) may be a portion that comes into contact with the first waterproof member (470) to reduce moisture flowing into the housing (210) from the outside of the electronic device (101) through the hole (215). For example, the support surface (611) may be a portion of the second waterproof member (610) that comes into contact with the window (420). For example, the support surface (611) may be attached to the fourth portion (422) of the window (420). For example, the support surface (611) may press the fourth portion (422) of the window (420) using the printed circuit board (410). The shield can (440) can reduce moisture flowing into the flash module (430) from the outside of the electronic device (101) by including a second waterproofing portion (610) including the support surface (611).

For example, the support member (433) may include a groove (433a) formed along an edge of the support member (433), and a support member (433b) extending from the groove (433a) and supporting a first portion (441). The first portion (441) may be fastened within the groove (433a). The electronic device (101) may further include a first space (S1) surrounded by a printed circuit board (410), a flash module (430), and a shield can (440). The first portion (441) may be fastened with the groove (433a) to reduce moisture flowing into the first space (S1) through the opening (450). The second portion (442) can reduce moisture flowing into the first space (S1) through a gap between the printed circuit board (410) and the second portion (442) by extending from the first portion (441) to the second area (412) of the printed circuit board (410). The second waterproof portion (610) of the first portion (441) can isolate a portion of the flash module (430) except for a portion in contact with the first space (S1) from the outside of the electronic device (101) by contacting the window (420).

According to the above-described embodiment, the electronic device (101) includes a shield can (440) that comes into contact with the window (420) and includes a second waterproof portion (610) that isolates the flash module (430) from the outside of the electronic device (101), thereby reducing damage to the flash module (430) due to moisture flowing in from the outside.

FIG. 7a is a partial cross-sectional view of an exemplary electronic device. FIG. 7b is a perspective view illustrating a portion of the exemplary electronic device of FIG. 7a.

Referring to FIGS. 7A and 7B, the electronic device (101) may include a housing (210) including a hole (215), a printed circuit board (410) (e.g., the first printed circuit board (250) and the second printed circuit board (252) of FIG. 3), a window (420), a flash module (430), and a shield can (440). The printed circuit board (410) may include a first region (411) and a second region (412). The flash module (430) may include a conductive pad (431), a light emitting portion (432), and a support member (433). The shield can (440) may include a first portion (441) including an opening (450), and a second portion (442) extending from the first portion (441).

According to one embodiment, the electronic device (101) may further include a second waterproof member (710) disposed between the window (420) and the first portion (441) to isolate the flash module (430) from the exterior of the electronic device (101). The second waterproof member (710) may include a through hole (711) for providing a path for light emitted from the light emitting portion (432) toward the window (420). For example, the second waterproof member (710) may be in contact with each of the first portion (441) of the shield can (440) and the window (420). For example, the second waterproof member (710) may pressurize the window (420) by using the first portion (441). For example, the through hole (711) may at least partially overlap the hole (215) when viewed from above, for a path for light emitted from the light emitting portion (432) of the flash module (430). The electronic device (101) may reduce the inflow of moisture from the outside of the electronic device (101) into the flash module (430) by including the second waterproofing member (710).

According to one embodiment, the second waterproofing member (710) may include, but is not limited to, at least one of poron, tape, and rubber.

According to one embodiment, the electronic device (101) may further include a second space (S2) surrounded by a window (420), a first portion (441), a flash module (430), and a second waterproof member (710). The second waterproof member (710) may seal the second space (S2) by extending from the first portion (441) to the window (420). For example, the second space (S2) may be a space surrounded by a light-emitting portion (432), a support member (433), the first portion (441), the window (420), and the second waterproof member (710). For example, the second waterproof member (710) may seal the second space (S2) by extending from the first portion (441) to the window (420). The second waterproofing member (710) can reduce the inflow of moisture from the outside of the electronic device (101) to the flash module (430) by sealing the second space (S2).

For example, the support member (433) may include a groove (433a) formed along an edge of the support member (433), and a support member (433b) extending from the groove (433a) and supporting a first portion (441). The first portion (441) may be fastened within the groove (433a). The electronic device (101) may further include a first space (S1) surrounded by a printed circuit board (410), a flash module (430), and a shield can (440). The first portion (441) may be fastened with the groove (433a) to reduce moisture flowing into the first space (S1) through the opening (450). The second portion (442) can reduce moisture flowing into the first space (S1) through a gap between the printed circuit board (410) and the second portion (442) by extending from the first portion (441) to the second area (412) of the printed circuit board (410). The shield can (440) can reduce moisture flowing into the conductive pad (431) from the outside of the electronic device (101) in contact with the first space (S1) by sealing the first space (S1). The second waterproofing member (710) disposed between the first portion (441) and the window (420) can isolate a portion of the flash module (430) except for a portion of the flash module (430) that is in contact with the first space (S1) and includes the conductive pad (431) from the outside of the electronic device (101) by sealing the second space (S2).

According to one embodiment, the second waterproofing member (710) may include metal. The second waterproofing member (710) may seal the second space (S2) by being welded with the first part (441) of the shield can (440) and the window (420). For example, the second waterproofing member (710) may include solder, but is not limited thereto. The second waterproofing member (710) may reduce the inflow of moisture from the outside of the electronic device (101) into the flash module (430) by sealing the second space (S2).

According to the above-described embodiment, the electronic device (101) includes a window (420) and a second waterproof member (710) that comes into contact with the first portion (441) and isolates the flash module (430) from the outside of the electronic device (101), thereby reducing damage to the flash module (430) due to moisture flowing in from the outside.

FIG. 8A is a partial cross-sectional view of an exemplary electronic device. FIG. 8B is a perspective view illustrating a portion of the exemplary electronic device of FIG. 8A. FIG. 8C is a partial cross-sectional view of the exemplary electronic device. FIG. 8D is a perspective view illustrating a portion of the exemplary electronic device of FIG. 8C.

Referring to FIGS. 8A and 8B, the electronic device (101) may include a housing (210) including a hole (215), a printed circuit board (410) (e.g., the first printed circuit board (250) and the second printed circuit board (252) of FIG. 3), a window (420), a flash module (430), and a shield can (440). The printed circuit board (410) may include a first region (411) and a second region (412). The flash module (430) may include a conductive pad (431), a light emitting portion (432), and a support member (433). The shield can (440) may include a first portion (441) including an opening (450), and a second portion (442) extending from the first portion (441). According to one embodiment, the electronic device (101) may further include at least one electronic component (810) disposed on the second region (412) and surrounded by a shield can (440).

According to one embodiment, the electronic device (101) may further include a shielding member (820) extending from the second region (412) to the shield can (440) and separating at least one electronic component (810) and the flash module (430).

For example, referring to FIGS. 8A and 8B, the shield can (440) may have an extended shape from another shield can (e.g., another shield can (401) of FIG. 4B) surrounding at least one electronic component (810). For example, the shielding member (820) may be disposed between the flash module (430) and the at least one electronic component (810). For example, the shielding member (820) may surround at least a portion of the at least one electronic component (810). The electronic device (101) may reduce interference of the flash module (430) from the at least one electronic component (810) by including the shielding member (820).

According to one embodiment, the first portion (441) may include at least one rib (830) that extends from at least a portion of an edge of the opening (450) to the printed circuit board (410) so as to contact the conductive pad (431).

For example, referring to FIGS. 8A and 8B, at least one rib (830) may include a first rib (831) and a second rib (832). The first rib (831) and the second rib (832) may extend from at least a portion of an edge of the opening (450) to a second region (412) of the printed circuit board (410), thereby contacting the conductive pad (431). The first rib (831) and the second rib (832) may isolate the at least one electronic component (810) and the conductive pad (431), thereby reducing interference from the at least one electronic component (810) to the conductive pad (431).

For example, referring to FIGS. 8C and 8D , a shield can (440) coupled with a flash module (430) may be spaced apart from another shield can (401) adjacent to the shield can (440). At least one electronic component (810) may include a first electronic component (811) and a second electronic component (812) surrounded by the shield can (440). At least one rib (830) may include a first rib (831), a second rib (832), a third rib (833), and a fourth rib (834) that are spaced apart from each other by extending from at least a portion of an edge of the opening (450) to the printed circuit board (410) to contact the conductive pad (431). The first rib (831), the second rib (832), the third rib (833), and the fourth rib (834) can reduce interference from each of the electronic components (811, 812) to the flash module (430) by separating each of the electronic components (811, 812) from the flash module (430).

In one embodiment, at least one rib (830) may be deformable. The at least one rib (830) may be an elastic portion of the shield can (440). However, the present invention is not limited thereto.

According to the above-described embodiment, the electronic device (101) can reduce interference from at least one electronic component (810) to the flash module (430) by including a shielding member (820). The electronic device (101) can reduce interference from the at least one electronic component (810) to the flash module (430) by including a shield can (440) including at least one rib (830).

Figure 9 is a partial cross-sectional view of an exemplary electronic device.

Referring to FIG. 9, the electronic device (101) may include a housing (210) including a hole (215), a printed circuit board (410) (e.g., the first printed circuit board (250) and the second printed circuit board (252) of FIG. 3), a window (420), and a flash module (430). The printed circuit board (410) may include a first region (411) and a second region (412). The flash module (430) may include a conductive pad (431), a light emitting portion (432), and a support member (433). The window (420) may include a third portion (421) penetrating the hole (215), and a fourth portion (422) extending from the third portion (421) and supporting the housing (210).

According to one embodiment, the window (420) may include a pattern (420a) formed on at least a portion of the window (420) positioned within the housing (210). The pattern (420a) may be referred to as a serration pattern. The window (420) may be configured to include the pattern (420a) so that light emitted from the flash module (430) is not dispersed within the housing (210) but is focused onto the window (420). The pattern (420a) may increase the amount of light transmitted from the flash module (430) to the outside of the electronic device (101) through the window (420) and the hole (215) by focusing the light.

According to one embodiment, the fourth portion (422) of the window (420) may include a third waterproofing portion (422a) that extends from the fourth portion (442) toward the second area (412) of the printed circuit board (410) to surround at least a portion of the flash module (430). The electronic device (101) may further include a third waterproofing member (910) that is disposed on the second area (412) of the printed circuit board (410) and is in contact with the third waterproofing portion (422a) to isolate the flash module (430) from the exterior of the electronic device (101). For example, the third waterproofing portion (422a) may be supported by the third waterproofing member (910). For example, the third waterproofing portion (422a) can separate the flash module (430) from the outside of the electronic device (101) together with the third waterproofing member (910). The electronic device (101) can reduce the inflow of moisture from the outside into the flash module (430) by including the third waterproofing portion (422a) and the third waterproofing member (910).

According to one embodiment, the electronic device (101) may include a third space (S3) surrounded by a window (420), a third waterproofing member (910), a second region (412) of a printed circuit board (410), and a flash module (430). The third waterproofing member (910) may seal the third space (S3) together with a third waterproofing portion (422a) of the window (420). By including the third waterproofing portion (422a) sealing the third space (S3) and the third waterproofing member (910), the electronic device (101) may reduce moisture flowing into the flash module (430) from the outside of the electronic device (101) through the third space (S3).

According to the above-described embodiment, the electronic device (101) can reduce the inflow of moisture from the outside of the electronic device (101) into the flash module (430) by including a third waterproofing portion (422a) extending from the window (420) toward the printed circuit board (410), and a third waterproofing member (910) in contact with the printed circuit board (410) and the third waterproofing portion (422a).

FIG. 10 is a flow chart illustrating part of a manufacturing process of an exemplary electronic device.

In process (1000), a printed circuit board (e.g., a printed circuit board (410) of FIG. 4a) may be prepared for connection with a plurality of electronic components. For example, the printed circuit board (e.g., a circuit board (410) of FIG. 4a) may be prepared with a ground plane printed on the printed circuit board (410) to be connected to at least a portion of an integrated circuit and/or a shield can (e.g., a shield can (440) of FIG. 4a).

In the process (1010), a plurality of electronic components may be arranged on a printed circuit board (410). For example, at least one electronic component (e.g., at least one electronic component (810) of FIG. 8A) excluding a flash module (e.g., a flash module (430) of FIG. 4A) may be electrically connected to the printed circuit board (410).

In the process (1020), the flash module (430) can be fastened to the shield can (440). For example, the flash module (430) can be welded to an edge of an opening (e.g., opening (450) of FIG. 4a) of the shield can (440). For example, the shield can (440) can be fastened to the shield can (440) via an adhesive member (e.g., adhesive member (510) of FIG. 5a).

In the process (1030), a shield can (440) connected to a flash module (430) may be soldered on a printed circuit board (410). The flash module (430) may be connected to a first region (e.g., a first region (411) of FIG. 4A) of the printed circuit board (410). The flash module (430) may be placed on the printed circuit board (410) so as to face a hole (e.g., a hole (215) of FIG. 4A). A plurality of other shield cans, excluding the shield can (440) connected to the flash module (430), may be soldered on the printed circuit board (410) so as to cover a plurality of electronic components arranged on the printed circuit board (410).

According to the above-described embodiment, the electronic device (e.g., the electronic device (101) of FIG. 1) includes a flash module (430) that is connected to a shield can (440) and then placed on a printed circuit board (410) together with the shield can (440), thereby simplifying the assembly of the flash module (430) and the shield can (440) on the printed circuit board (410).

According to the above-described embodiment, the electronic device (e.g., the electronic device (101) of FIG. 1) may include a housing (e.g., the housing (210) of FIG. 2) including a hole (e.g., the hole (215) of FIG. 4a), a printed circuit board (e.g., the first printed circuit board (250) of FIG. 3, the second printed circuit board (252) of FIG. 3, the printed circuit board (410) of FIG. 4a) within the housing including a first region facing the hole (e.g., the first region (411) of FIG. 4a), and a second region surrounding the first region (e.g., the second region (412) of FIG. 4a), and a window (e.g., the window (420) of FIG. 4a) at least partially positioned within the hole. The electronic device may include a flash module (e.g., a flash module (430) of FIG. 4a) including a conductive pad (e.g., a conductive pad (431) of FIG. 4b) disposed under the hole and in contact with the first area of the printed circuit board, a light-emitting member (e.g., a light-emitting member (432) of FIG. 4b) disposed on the conductive pad and configured to emit light toward the window based on power provided through the conductive pad, and a support member (e.g., a support member (433) of FIG. 4b) disposed on the conductive pad and surrounding at least a portion of the light-emitting member. The electronic device may include a shield can (e.g., the shield can (440) of FIG. 4a) including a first portion (e.g., the first portion (441) of FIG. 4b) contacting the support member to reduce moisture flowing into the conductive pad from the outside of the electronic device, and a second portion (e.g., the second portion (442) of FIG. 4b) extending from the first portion to a second region surrounding the first region. According to the above-mentioned embodiment, the electronic device may reduce the inflow of moisture from the outside to the conductive pad and reduce interference of the flash module by other electronic components by including the shield can. The above-mentioned embodiment may have various effects including the above-mentioned effects.

In one embodiment, the support member may include a groove formed along an edge of the support member (e.g., groove (433a) of FIG. 4B). The first portion may be fastened within the groove. In the above-mentioned embodiment, the first portion may be fastened within the groove, thereby reducing moisture flowing into the conductive pad through the opening. The above-mentioned embodiment may have various effects including the above-mentioned effects.

In one embodiment, the opening may be penetrated by the light-emitting portion and the support member. The support member may include a support member (e.g., a support member (433b) of FIG. 4b) that supports the first portion at a position adjacent to an edge of the opening and protrudes toward the second portion extending from the first portion. In the above-mentioned embodiment, the support member may reduce moisture flowing into the conductive pad through the opening by including the support member. The above-mentioned embodiment may have various effects including the above-mentioned effects.

An electronic device according to one embodiment may further include a first space (e.g., the first space (S1) of FIG. 4B) surrounded by the flash module, the shield can, and the printed circuit board. The second portion may seal the first space by coming into contact with the second region. According to the above-mentioned embodiment, the second portion may reduce moisture flowing into the conductive pad through a gap between the second portion and the printed circuit board by sealing the first space. The above-mentioned embodiment may have various effects including the above-mentioned effects.

According to one embodiment, the light emitting portion may include a first surface facing the window (e.g., the first surface (432a) of FIG. 4B), a second surface in contact with the conductive pad (e.g., the second surface (432b) of FIG. 4B), and a third surface extending from the first surface to the second surface (e.g., the third surface (432c) of FIG. 4B). The support member may contact the first portion along an edge of the opening and surround the third surface. According to the above-mentioned embodiment, the first portion may reduce moisture flowing into the conductive pad through the opening by contacting the support member surrounding the third surface of the light emitting portion. The above-mentioned embodiment may have various effects including the above-mentioned effects.

In one embodiment, the first portion may further include a first waterproof portion (e.g., the first waterproof portion (441a) of FIG. 5A) extending from an edge of the opening toward the second portion, and a sidewall (e.g., the sidewall (441b) of FIG. 5A) extending from the first waterproof portion toward the window and surrounding at least a portion of the support member. In the above-mentioned embodiment, the first portion may reduce moisture flowing into the conductive pad through the opening by including the first waterproof portion and the sidewall. The above-mentioned embodiment may have various effects including the above-mentioned effects.

The electronic device according to one embodiment may further include an adhesive member (e.g., an adhesive member (510) of FIG. 5A) between the side wall and the support member. According to the above-mentioned embodiment, the electronic device may reduce moisture flowing into the conductive pad through the opening by including the adhesive member. The above-mentioned embodiment may have various effects including the above-mentioned effects.

In one embodiment, the opening can be penetrated by the conductive pad. The support member can include a protrusion (e.g., a protrusion (433c) of FIG. 5b) that protrudes toward the side wall to cover the first waterproof portion and seal the conductive pad. In the above-mentioned embodiment, the support member can reduce moisture flowing into the conductive pad from the outside of the electronic device by including the protrusion. The above-mentioned embodiment can have various effects including the above-mentioned effects.

According to one embodiment, the first portion may further include a second waterproof portion (e.g., the second waterproof portion (610) of FIG. 6A) that protrudes toward the window and isolates the flash module from the outside of the electronic device by coming into contact with the window. According to the above-mentioned embodiment, the first portion may reduce the inflow of moisture from the outside of the electronic device into the flash module by including the second waterproof portion. The above-mentioned embodiment may have various effects including the above-mentioned effects.

According to one embodiment, the window may include a third portion penetrating the hole (e.g., the third portion (421) of FIG. 6B) and a fourth portion extending from the third portion and supporting the housing (e.g., the fourth portion (422) of FIG. 6B). The second waterproofing portion may include a support surface (e.g., the support surface (611) of FIG. 6C) that contacts the fourth portion among the third portion and the fourth portion. According to the above-mentioned embodiment, the second waterproofing portion may reduce the inflow of moisture from the outside of the electronic device into the flash module by contacting the fourth portion of the window. The above-mentioned embodiment may have various effects including the above-mentioned effects.

An electronic device according to one embodiment may further include a waterproof member (e.g., a second waterproof member (710) of FIG. 7A) that includes a through hole (e.g., a through hole (711) of FIG. 7A) for providing the path of the light and isolating the flash module from the outside of the electronic device by being disposed between the window and the first portion. According to the above-mentioned embodiment, the electronic device may reduce the inflow of moisture from the outside of the electronic device into the flash module by further including the waterproof member. The above-mentioned embodiment may have various effects including the above-mentioned effects.

An electronic device according to one embodiment may further include a second space (e.g., the second space (S2) of FIG. 7A) surrounded by the window, the first portion, the flash module, and the waterproof member. The waterproof member may seal the second space by extending from the first portion to the window. According to the above-mentioned embodiment, the electronic device may reduce the inflow of moisture from the outside of the electronic device into the flash module by including the waterproof member that seals the second space. The above-mentioned embodiment may have various effects including the above-mentioned effects.

An electronic device according to one embodiment may further include at least one electronic component (e.g., at least one electronic component (810) of FIG. 8A) disposed on the second region and surrounded by the shield can. According to the above-mentioned embodiment, the electronic device may provide additional space within the housing for other electronic components except for the flash module and the at least one electronic component by including the at least one electronic component surrounded by the shield can. The above-mentioned embodiment may have various effects including the above-mentioned effects.

An electronic device according to one embodiment may further include a shielding member (e.g., a shielding member (820) of FIG. 8A) extending from the second region to the shield can and separating the at least one electronic component and the flash module. According to the above-mentioned embodiment, the electronic device may reduce interference of the flash module by the at least one electronic component by including the shielding member. The above-mentioned embodiment may have various effects including the above-mentioned effects.

In one embodiment, the first portion may include at least one rib (e.g., at least one rib (830) of FIG. 8A) that extends from at least a portion of an edge of the opening to the printed circuit board so as to contact the conductive pad. In the above-mentioned embodiment, the electronic device may reduce interference of the flash module by electronic components other than the flash module by including the at least one rib. The above-mentioned embodiment may have various effects including the above-mentioned effects.

In one embodiment, an electronic device may include a housing including a hole, a printed circuit board within the housing including a first region facing the hole and a second region surrounding the first region, and a window at least partially positioned within the hole. The electronic device may include a flash module including a conductive pad disposed below the hole and in contact with the first region of the printed circuit board, a light emitting portion disposed on the conductive pad and including a first side facing the window, a second side in contact with the conductive pad, and a third side extending from the first side to the second side, the light emitting portion configured to emit light toward the window based on power provided through the conductive pad, and a support member disposed on the conductive pad and surrounding the third side of the light emitting portion. The electronic device may include a shield can including a first portion that contacts the support member to reduce moisture flowing into the conductive pad from the outside of the electronic device, the first portion including an opening penetrated by the light emitting portion and the support member for the path of the light, and a second portion that extends from the first portion to a second region surrounding the first region. The support member may include a support portion that supports the first portion at a position adjacent to an edge of the opening and protrudes toward the second portion extending from the first portion. According to the above-mentioned embodiment, the electronic device may reduce moisture flowing into the conductive pad from the outside and reduce interference of the flash module by other electronic components by including the shield can. The support member may reduce moisture flowing into the conductive pad through the opening by including the support portion. The above-mentioned embodiment may have various effects including the above-mentioned effects.

In one embodiment, the support member may include a groove formed along an edge of the support member. The first portion may be fastened within the groove. In the above-mentioned embodiment, the first portion may be fastened within the groove, thereby reducing moisture flowing into the conductive pad through the opening. The above-mentioned embodiment may have various effects including the above-mentioned effects.

An electronic device according to one embodiment may further include a first space surrounded by the flash module, the shield can, and the printed circuit board. The second portion may seal the first space by coming into contact with the second region. According to the above-mentioned embodiment, the second portion may reduce moisture flowing into the conductive pad through a gap between the second portion and the printed circuit board by sealing the first space. The above-mentioned embodiment may have various effects including the above-mentioned effects.

An electronic device according to one embodiment may further include a waterproof member that includes a through hole for providing the path of the light and is disposed between the window and the first portion to isolate the flash module from the outside of the electronic device. According to the above-mentioned embodiment, the electronic device may further include the waterproof member to reduce the inflow of moisture from the outside of the electronic device into the flash module. The above-mentioned embodiment may have various effects including the above-mentioned effects.

An electronic device according to one embodiment may further include a second space surrounded by the window, the first portion, the flash module, and the waterproof member. The waterproof member may extend from the first portion to the window to seal the second space. According to the above-mentioned embodiment, the electronic device may reduce moisture from entering the flash module from the outside of the electronic device by including the waterproof member that seals the second space. The above-mentioned embodiment may have various effects including the above-mentioned effects.

The electronic devices according to various embodiments disclosed in this document may be devices of various forms. The electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliance devices. The electronic devices according to embodiments of this document are not limited to the above-described devices.

It should be understood that the various embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly dictates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

The term "module" used in various embodiments of this document may include a unit implemented in hardware, software or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be an integrally configured component or a minimum unit of the component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, ‘non-transitory’ simply means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded between a seller and a buyer as a commodity. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a part of the computer program product may be at least temporarily stored or temporarily generated in a machine-readable storage medium, such as a memory of a manufacturer's server, a server of an application store, or an intermediary server.

According to various embodiments, each component (e.g., a module or a program) of the above-described components may include a single or multiple entities, and some of the multiple entities may be separately arranged in other components. According to various embodiments, one or more of the components or operations of the above-described components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, the multiple components (e.g., a module or a program) may be integrated into one component. In such a case, the integrated component may perform one or more functions of each of the multiple components identically or similarly to those performed by the corresponding component of the multiple components before the integration. According to various embodiments, the operations performed by the module, program, or other component may be executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims (15)

In an electronic device (101), A housing (210) including a hole (215); A printed circuit board (250; 252; 410) within the housing (210) including a first area (411) facing the hole (215) and a second area (412) surrounding the first area (411); A window (420) at least partially located within the above hole (215); A flash module (430) including a conductive pad (431) disposed below the hole (215) and in contact with the first region (411) of the printed circuit board (250; 252; 410), a light-emitting portion (432) disposed on the conductive pad (431) and configured to emit light toward the window (420) based on power provided through the conductive pad (431), and a support member (433) disposed on the conductive pad (431) and surrounding at least a portion of the light-emitting portion (432); and A shield can (440) including a first portion (441) that contacts the support member (433) to reduce moisture flowing into the conductive pad (431) from the outside of the electronic device (101) and includes an opening (450) penetrated by the flash module (430) for the light path, and a second portion (442) that extends from the first portion (441) to a second region (412) that surrounds the first region (411); Electronic devices (101). In the first paragraph, The above support member (433) is Including a groove (433a) formed along the edge of the above support member (433), The above first part (441) is, Attached within the above home (433a), Electronic devices (101). In claim 1 or 2, The above opening (450) is Penetrated by the above light emitting part (432) and the above support member (433), The above support member (433) is A supporting portion (433b) that supports the first portion (441) at a position adjacent to the edge of the opening (450) and protrudes toward the second portion (442) extending from the first portion (441). Electronic devices (101). In any one of claims 1 to 3, It further includes a first space (S1) surrounded by the flash module (430), the shield can (440), and the printed circuit board (250; 252; 410). The above second part (442) is, Sealing the first space (S1) by coming into contact with the second region (412). Electronic devices (101). In any one of claims 1 to 4, The above light emitting part (432) is A first surface (432a) facing the above window (420); A second surface (432b) in contact with the above-mentioned challenging pad (431); and Including a third surface (432c) extending from the first surface (432a) to the second surface (432b); The above support member (433) is Contacting the first part (441) along the edge of the above opening (450) and surrounding the third surface (432c), Electronic devices (101). In any one of paragraphs 1 to 5, The above first part (441) is, Further comprising a first waterproofing portion (441a) extending from the edge of the opening (450) toward the second portion (442), and a side wall (441b) extending from the first waterproofing portion (441a) toward the window (420) and surrounding at least a portion of the support member (433). Electronic devices (101). In any one of claims 1 to 6, Further comprising an adhesive member (510) between the side wall (441b) and the support member (433); Electronic devices (101). In any one of claims 1 to 7, The above opening (450) is Penetrated by the above-mentioned challenging pad (431), The above support member (433) is It includes a protrusion (433c) that covers the first waterproofing portion (441a) and seals the conductive pad (431) by protruding toward the side wall (441b). Electronic devices (101). In any one of claims 1 to 8, The above first part (441) is, It further includes a second waterproofing portion (610) that protrudes toward the window (420) and isolates the flash module (430) from the outside of the electronic device (101) by coming into contact with the window (420). Electronic devices (101). In any one of claims 1 to 9, The above window (420) is A third part (421) penetrating the above hole (215); and A fourth portion (422) extending from the third portion (421) and supporting the housing (210); The above second waterproofing part (610) is Including a support surface (611) that comes into contact with the fourth part (422) among the third part (421) and the fourth part (422). Electronic devices (101). In any one of claims 1 to 10, Further comprising a waterproof member (710) including a through hole (711) for providing the light path and positioned between the window (420) and the first part (441) to isolate the flash module (430) from the outside of the electronic device (101); Electronic devices (101). In any one of claims 1 to 11, It further includes a second space (S2) surrounded by the above window (420), the first part (441), the flash module (430), and the waterproof member (710). The above waterproof member (710) is By extending from the first part (441) to the window (420), sealing the second space (S2), Electronic devices (101). In any one of claims 1 to 12, At least one electronic component (810) disposed on the second region (412) and surrounded by the shield can (440); Electronic devices (101). In any one of claims 1 to 13, A shielding member (820) extending from the second region (412) to the shield can (440) and further comprising a shielding member separating the at least one electronic component (810) and the flash module (430). Electronic devices (101). In any one of claims 1 to 14, The above first part (441) is, At least one rib (830) extending from at least a portion of the edge of the opening (450) to the printed circuit board (250; 252; 410) and contacting the conductive pad (431), Electronic devices (101).

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