WO2025204668A1 - Separation device - Google Patents

Abstract

Provided is a separation device capable of generating a sufficient wedge effect even in a central region of a plate member. The separation device according to an embodiment comprises: a first holding part for holding one surface of a plate member; a second holding part for holding the other surface of the plate member; a drive part for rotating the first holding part and the second holding part; and a nozzle for injecting a liquid to a side surface of the plate member. At least one of the first holding part and the second holding part includes a plurality of suction parts for sucking the plate member, and a biasing part provided in each of the plurality of suction parts and biasing the suction part in a direction separating from the plate member.

Description

Separation device

An embodiment of the present invention relates to a separation device.

There are cases where a technique for separating plate members is required. For example, a separation device has been proposed that uses a water jet to separate a bonded substrate (an example of a plate member) in which a pair of substrates are bonded together into individual substrates (see Patent Document 1).
In such a separation device, a pair of block-shaped holding parts is used to hold the central region of the bonded substrate. The pair of holding parts is then rotated to rotate the bonded substrate held by the pair of holding parts. Furthermore, high-pressure liquid is sprayed from a water jet nozzle toward the sides of the rotated bonded substrate. The sprayed liquid penetrates between the substrates, creating a wedge effect, separating the bonded substrate into two substrates.

However, because the central region of the bonded substrates is held by a block-shaped holding portion, it is difficult for a wedge effect to occur. As a result, separation of the pair of substrates may be insufficient in the central region of the bonded substrates, which are plate members.

Therefore, there was a need to develop a separation device that could generate a sufficient wedge effect even in the central region of the plate member.

Japanese Patent Application Publication No. 11-5064

The problem that this invention aims to solve is to provide a separation device that can generate a sufficient wedge effect even in the central region of the plate member.

The separation device according to this embodiment comprises a first holding unit that holds one side of a plate member, a second holding unit that holds the other side of the plate member, a drive unit that rotates the first and second holding units, and a nozzle that sprays liquid onto the side of the plate member. At least one of the first and second holding units has a plurality of suction units that suction the plate member, and a biasing unit that is provided on each of the plurality of suction units and biases the suction unit in a direction away from the plate member.

According to an embodiment of the present invention, a separation device is provided that can generate a sufficient wedge effect even in the central region of the plate member.

1 is a schematic diagram illustrating a separation device according to an embodiment of the present invention; 2 is a schematic enlarged view of part A of the separation device in FIG. 1. FIG. 3 is a schematic plan view of the holding portion of the rotation holding portion when viewed from a direction along the central axis of rotation of the separation device. FIG. 1A to 1C are schematic views for illustrating separation of bonded substrates. 1A to 1C are schematic views for illustrating separation of bonded substrates. 1A to 1C are schematic views for illustrating separation of bonded substrates. 1A to 1C are schematic views for illustrating separation of bonded substrates. 10A and 10B are schematic views illustrating a biasing portion according to another embodiment. 10A and 10B are schematic diagrams illustrating the action and effect of the biasing portion. FIG. 10 is a schematic enlarged view illustrating a portion of a holding section in a separation device according to another embodiment.

Below, an embodiment will be illustrated with reference to the drawings. Note that in each drawing, similar components will be given the same reference numerals and detailed descriptions will be omitted where appropriate.

The plate member separated by the separation device 1 according to this embodiment is a bonded substrate 100. The bonded substrate 100 has, for example, a substrate 101 and a substrate 102 bonded to one side of the substrate 101. There are no particular limitations on the substrates 101 and 102 as long as they are plate-shaped. The substrates 101 and 102 can be, for example, semiconductor wafers, substrates containing inorganic materials such as quartz or ceramics, or substrates containing metal.

In the following, as an example, a case will be described in which substrate 101 and substrate 102 are semiconductor wafers. For example, a porous layer is provided on one side of substrate 101, and a single-crystal Si layer is provided on the porous layer. For example, a single-crystal Si layer is provided on one side of substrate 102. Furthermore, for example, an insulating layer is provided on the single-crystal Si layer of substrate 101 or the single-crystal Si layer of substrate 102. Then, for example, substrates 101 and 102 are bonded together via the insulating layer. However, the bonded substrate 100 is not limited to the example shown. The bonded substrate 100 may be any substrate in which substrates 101 and 102 are bonded together. Furthermore, the plate member may be two plates bonded together and separated by separation device 1, or a single plate that is separated (divided) into two pieces by separation device 1.

FIG. 1 is a schematic diagram illustrating a separation device 1 according to this embodiment.
FIG. 2 is a schematic enlarged view of part A of the separation device 1 in FIG.
FIG. 3 is a schematic plan view of the holding portion 23 of the rotation holding portion 20 as viewed from the direction along the central rotation axis 1 a of the separation device 1 .

As shown in FIG. 1, the separation device 1 includes, for example, a base 10, a rotational holding unit 20, a positioning unit 30, a separation unit 40, and a controller 50.

The base 10 can be provided, for example, at the installation location of the separation device 1. A rotary holding unit 20, a positioning unit 30, and a separation unit 40 can be provided on one side of the base 10. In addition, a base 10a can be provided opposite the base 10. Between the base 10a and the base 10, a holding unit 21 (an example of a first holding unit), a support unit 22, a holding unit 23 (an example of a second holding unit), a drive unit 24, and a movement unit 25, which will be described later, are provided. The base 10a can be integrated with the base 10, for example, via a stand (not shown).

The rotating holder 20 holds and rotates the bonded substrate 100, which is made up of a pair of substrates 101 and 102 bonded together.

The rotating holding unit 20 includes, for example, a holding unit 21, a support unit 22, a holding unit 23, a driving unit 24, a moving unit 25, and an exhaust unit 26.

The holding portions 21 and 23 are provided opposite to each other so as to be able to hold both sides of the bonded substrate 100 .
The holding unit 21 is provided on the substrate 101 side of the bonded substrate 100. The holding unit 21 suction-holds one surface (the surface on the substrate 101 side) of the bonded substrate 100. The holding unit 21 can be, for example, a vacuum chuck. For example, a suction hole is opened in the surface of the holding unit 21 on the bonded substrate 100 side. An exhaust unit 26 is connected to the suction hole.

The support portion 22 rotatably supports the holding portion 21. The support portion 22 is provided on, for example, the base 10a.
The support portion 22 includes, for example, a rotation shaft 22a and a rotation mechanism 22b.

The rotating shaft 22a extends along the central rotation axis 1a of the separation device 1. A holding portion 21 is provided on one end of the rotating shaft 22a. The other end of the rotating shaft 22a is connected to the rotation mechanism 22b.

The rotation mechanism 22b rotates the holding unit 21 in synchronization with the holding unit 23, which will be described later. The rotation mechanism 22b has a synchronous transmission member such as a timing belt or timing pulley. The synchronous transmission member is connected to the rotation shaft 22a on which the holding unit 21 is mounted and to the drive unit 24, which will be described later. In this way, the drive unit 24 can rotate the holding unit 21 simultaneously with the holding unit 23, which will be described later, and at the same rotation speed. This makes it possible to simplify the configuration of the rotation mechanism 22b and the control program, which in turn reduces the manufacturing costs of the separation device 1.

The holding portion 23 is provided on the substrate 102 side of the bonded substrate 100. The holding portion 23 holds the other surface of the bonded substrate 100 (the surface on the substrate 102 side) by suction.
As shown in FIGS. 1 to 3, the holding portion 23 has, for example, a base portion 23a, an adsorption portion 23b, and an urging portion 23c.

The base 23a is, for example, disk-shaped. The base 23a is provided at the end of the rotation shaft 24a of the drive unit 24 on the support unit 22 side.

The suction portion 23b is provided on the support portion 22 side of the base portion 23a. The suction portion 23b adsorbs the other surface of the bonded substrate 100 (the surface facing the substrate 102). The suction portion 23b is, for example, a vacuum pad.

For example, one adsorption unit 23b (corresponding to an example of a first adsorption unit) may be provided at the position of the rotation center axis 1a of the separation device 1 (the rotation center axis of the base 23a).
For example, a plurality of adsorption units 23b (corresponding to an example of a second adsorption unit) can be arranged on a circumference centered on the central rotation axis 1a (central rotation axis of the base 23a) of the separation device 1. For example, a plurality of adsorption units 23b can be arranged near the periphery of the base 23a and along the periphery of the base 23a.

Furthermore, multiple suction portions 23b can be arranged in a line in the region between the periphery of the base 23a and the central axis of rotation of the base 23a. In this case, as shown in FIG. 3, multiple suction portions 23b can be arranged in a line on the circumference of a concentric circle centered on the central axis of rotation of the base 23a. Furthermore, multiple suction portions 23b can be arranged radially from the central axis of rotation of the base 23a.

It is sufficient that the suction portions 23b are provided at least at the position of the central axis of the base portion 23a and near the periphery of the base portion 23a. The arrangement and number of the suction portions 23b can be changed as appropriate depending on the size of the bonded substrate 100, etc.

In addition, a hole 23a1 is provided inside the base 23a. The hole 23a1 is connected to multiple suction units 23b. The hole 23a1 is also connected to the exhaust unit 26 via a piping member such as a rotary joint provided in the drive unit 24. In other words, the hole 23a1 serves as an exhaust flow path.

The hole 23a1 shown in Figure 3 is connected to multiple adsorption sections 23b. This simplifies the exhaust path for the multiple adsorption sections 23b, thereby simplifying the structure of the holding section 23 and ultimately reducing the manufacturing costs of the separation device 1.

Also, a hole 23a1 can be provided for each of the plurality of suction portions 23b. Alternatively, the plurality of suction portions 23b can be divided into a plurality of groups, and a hole 23a1 can be provided for each of the plurality of groups so that they are connected to each other. For example, in the arrangement of the plurality of suction portions 23b illustrated in Figure 3, the plurality of suction portions 23b can be divided into groups: a suction portion 23b provided at the center axis of the base 23a, a plurality of suction portions 23b provided near the periphery of the base 23a, and a plurality of suction portions 23b provided in the area between these, and a hole 23a1 can be provided for each of the groups so that they are connected to each other.

If a hole 23a1 is provided for each of the multiple suction portions 23b, it is possible to prevent leakage from one suction portion 23b from affecting the suction of the other suction portions 23b. If a hole 23a1 is provided for each of the multiple groups, it is possible to prevent leakage from an suction portion 23b in one group from affecting the suction of the suction portions 23b in the other groups. This improves the reliability of suction.

The biasing portion 23c is provided between the suction portion 23b and the base portion 23a. For example, a biasing portion 23c can be provided for each of the multiple suction portions 23b. Note that the suction portion 23b located at the center axis of the base portion 23a may or may not have a biasing portion 23c.

The biasing portion 23c biases the suction portion 23b in a direction away from the laminated substrate 100 (toward the base portion 23a). A hole is provided inside the biasing portion 23c, and the suction portion 23b and the hole 23a1 of the base portion 23a are connected via the hole in the biasing portion 23c.

2, the suction portion 23b can be integrally formed with the biasing portion 23c. For example, a bellows pad (e.g., a so-called bellows vacuum pad) can be formed having the suction portion 23b and the biasing portion 23c.
The effect of the biasing portion 23c will be described in detail later.

The drive unit 24 rotates the holder 23 and also rotates the holder 21 in synchronization with the holder 23 via the rotation mechanism 22b and the rotation shaft 22a. As a result, the drive unit 24 can rotate the bonded substrate 100 held by the holder 23 and the holder 21. The drive unit 24 can also control the rotation speed of the bonded substrate 100 and start and stop the rotation. The drive unit 24 can include, for example, a control motor such as a servo motor and a rotation shaft 24a. The rotation shaft 24a is connected to the control motor via a transmission member or the like.

Furthermore, as shown in FIG. 1, the central rotation axis of rotation shaft 22a, the central rotation axis of holding unit 21, the central rotation axis of holding unit 23, and the central rotation axis of rotation shaft 24a overlap with central rotation axis 1a. In other words, these central rotation axes are arranged to be coaxial. Therefore, when the bonded substrate 100 is rotated, it is possible to prevent the relative positions of holding unit 21 and holding unit 23 from shifting in the direction perpendicular to central rotation axis 1a.

The moving unit 25 moves the drive unit 24 in a direction along the central axis of rotation 1a. The moving unit 25, for example, raises and lowers the drive unit 24. The drive unit 24 (rotation axis 24a) is provided with a holding unit 23, so by moving the drive unit 24 with the moving unit 25, the distance between the holding unit 23 and the holding unit 21 in the direction along the central axis of rotation 1a can be changed. Therefore, the moving unit 25 can hold and release the bonded substrate 100 using the holding unit 23 and the holding unit 21. The moving unit 25 can have, for example, a drive mechanism such as an air cylinder or hydraulic cylinder, and a guide mechanism for moving the drive unit 24 linearly.

The exhaust unit 26 is connected to the holding unit 21 via a piping member such as a rotary joint provided on the support unit 22. The exhaust unit 26 sucks in gas between the holding unit 21 and the bonded substrate 100 (substrate 101) so that the pressure between the holding unit 21 and the bonded substrate 100 (substrate 101) becomes negative. The exhaust unit 26 is also connected to the holding unit 23 (suction unit 23b) via a piping member such as a rotary joint provided on the drive unit 24. The exhaust unit 26 sucks in gas between the holding unit 23 (suction unit 23b) and the bonded substrate 100 (substrate 102) so that the pressure between the holding unit 23 (suction unit 23b) and the bonded substrate 100 (substrate 102) becomes negative. The exhaust unit 26 has an exhaust device such as a vacuum pump.

In addition, a gas-liquid separator can be provided between holding section 21 and holding section 23 and an exhaust device such as a vacuum pump.

A pressure control device can also be provided at least between the holding unit 21 and the gas-liquid separator, and between the holding unit 23 and the gas-liquid separator. If a pressure control device is provided, it becomes possible to control the suction force in the holding unit 21 and the holding unit 23.

The positioning unit 30 positions the bonded substrate 100 in a direction perpendicular to the central rotation axis 1a. The positioning unit 30 aligns the position of the bonded substrate 100 so that the central rotation axis of the bonded substrate 100 overlaps with the central rotation axis 1a of the separation device 1 in a plan view. Therefore, the central rotation axis of the bonded substrate 100 after positioning can be set to the central rotation axis 1a.

The positioning unit 30 includes, for example, a pin 31, an arm 32, a moving unit 33, a moving unit 34, a guide 35, and an absorbing unit 36. Multiple sets of the pin 31, the arm 32, the moving unit 33, the guide 35, and the absorbing unit 36 can be provided.

The pin 31 is, for example, columnar and extends in a direction along the central axis of rotation 1a. The side of the pin 31 contacts the side of the laminated substrate 100. The pin 31 can be provided, for example, at the upper end of the arm 32. Furthermore, when viewed from a direction along the central axis of rotation 1a, the multiple pins 31 can be provided in positions that are rotationally symmetrical around the central axis of rotation 1a.

The arm 32 is plate-shaped and extends in a direction along the rotation center axis 1a.
The moving unit 33 moves the arm 32 in a direction along the rotation central axis 1a. For example, the moving unit 33 raises and lowers the arm 32. The moving unit 33 has a driving mechanism such as an air cylinder or a hydraulic cylinder.

One moving unit 34 can be provided for each of the multiple arms 32. The moving unit 34 has, for example, a link mechanism or a cam mechanism, and simultaneously changes the positions of the multiple arms 32 in a direction perpendicular to the rotation center axis 1a. For example, the moving unit 34 moves the multiple arms 32 toward the rotation center axis 1a, causing the multiple pins 31 to press the side surfaces of the bonded substrate 100 toward the rotation center axis 1a. The multiple pins 31 press the side surfaces of the bonded substrate 100 toward the rotation center axis 1a, causing the rotation center axis of the bonded substrate 100 to overlap with the rotation center axis 1a in a planar view. In other words, the bonded substrate 100 is positioned. Furthermore, for example, the moving unit 34 moves the multiple arms 32 in a direction away from the rotation center axis 1a, thereby moving the multiple pins 31 away from the side surfaces of the bonded substrate 100.

A guide 35 is provided between each of the multiple arms 32 and the moving unit 34. The guide 35 guides the movement of the arm 32 in the direction along the central axis of rotation 1a. The guide 35 may be, for example, a linear guide. By providing the guide 35, the relative position between the arm 32 and the moving unit 34 in the direction along the central axis of rotation 1a can be changed as desired.

The absorbing section 36 is provided between the arm 32 and the moving section 33. The absorbing section 36 absorbs changes in position between the arm 32 and the moving section 33 in a direction perpendicular to the rotation center axis 1a. The absorbing section 36 may comprise, for example, an elastic body such as rubber or a spring. With the absorbing section 36 provided, even if the position between the moving section 33 and the arm 32 shifts in a direction perpendicular to the rotation center axis 1a, the amount of shift can be absorbed by the moving section 34.

The separation unit 40 sprays high-pressure liquid 40a onto the side of the rotating bonded substrate 100, separating the bonded substrate 100 into substrate 101 and substrate 102. The liquid 40a is sprayed toward a layer (e.g., a porous layer or a single-crystal Si layer) provided between substrate 101 and substrate 102. The liquid 40a can be, for example, water such as ultrapure water. When the liquid 40a is water, the separation unit 40 can be a so-called water jet device.

The separating unit 40 includes, for example, a nozzle 41 , a supplying unit 42 , and a moving unit 43 .
The nozzle 41 sprays the liquid 40a onto the side surface of the rotating bonded substrate 100. The nozzle 41 is cylindrical and has an injection port 41a at one end. The diameter of the injection port 41a is, for example, about 0.1 mm to 1 mm. The radial width (thickness) of the end of the nozzle 41 where the injection port 41a is provided is, for example, about 1 cm to 5 cm. By setting the thickness of the end of the nozzle 41 in this manner, damage to the nozzle 41 can be suppressed even when the liquid 40a is sprayed at high pressure. In the direction along the rotation central axis 1a, the central axis of the injection port 41a of the nozzle 41 is located between the substrate 101 and the substrate 102. Furthermore, the central axis of the injection port 41a of the nozzle 41 can be, for example, approximately parallel to the surface of the holder 21 facing the bonded substrate 100.

The supply unit 42 supplies high-pressure liquid 40a to the nozzle 41. The pressure of the liquid 40a sprayed from the nozzle 41 is, for example, approximately 15 MPa to 90 MPa. The flow rate of the liquid 40a is approximately 60 mL/min to 150 mL/min.

The supply unit 42 is connected, for example, via high-pressure piping, to the end of the nozzle 41 opposite the end where the injection port 41a is provided. The supply unit 42 may be equipped with, for example, a tank for storing the liquid 40a, a high-pressure pump for supplying the liquid 40a stored in the tank to the nozzle 41, a control valve for controlling the flow rate and pressure of the liquid 40a supplied to the nozzle 41, and a switching valve for switching between supplying and stopping the supply of the liquid 40a.

The moving unit 43 moves the position of the nozzle 41 (injection port 41a) within a plane perpendicular to the rotation center axis 1a. The moving unit 43 moves the position of the nozzle 41 (injection port 41a), for example, between a direction along the tangent to the periphery of the bonded substrate 100 and a direction toward the rotation center axis (for example, rotation center axis 1a) of the bonded substrate 100. The moving unit 43 can be, for example, an XY table or a robot capable of control along two or more axes. The moving unit 43 can be mounted on the base 10 via a stand 43a, for example.

The controller 50 includes, for example, a calculation unit such as a CPU (Central Processing Unit) and a storage unit such as a memory. The controller 50 is, for example, a computer. The controller 50 controls the operation of each element provided in the separation device 1 based on a control program stored in the storage unit.

Next, we will explain the operation of the separation device 1, i.e., the separation of the bonded substrate 100, which is an example of a plate member, and also explain the effect of the aforementioned biasing portion 23c.

4 to 7 are schematic views illustrating the separation of the bonded substrate 100. FIG.
The shaded areas in FIGS. 4, 5 and 7 represent separated regions.
6 is a cross-sectional view taken along line BB in FIG.

In the separation process of the bonded substrate 100, the rotating holding unit 20 holds the bonded substrate 100. As described above, the holding unit 21 adsorbs one surface (the surface on the substrate 101 side) of the bonded substrate 100. Furthermore, the adsorption unit 23b of the holding unit 23 adsorbs the other surface (the surface on the substrate 102 side) of the bonded substrate 100. In the case of a bellows pad having the adsorption unit 23b and the biasing unit 23c, when the adsorption unit 23b adsorbs the bonded substrate 100, the biasing unit 23c contracts and biases the substrate 102 in a direction to peel it off from the substrate 101.
Then, by rotating the holding parts 21 and 23, the bonded substrate 100 held by suction on the holding parts 21 and 23 is rotated.

Next, as shown by the solid line nozzle 41 in Figure 4, the nozzle 41, which was located at standby position [a], is moved to the vicinity of the periphery of the bonded substrate 100 and positioned at separation start position [b]. Separation start position [b] is a predetermined position on the side of the bonded substrate 100 from the nozzle 41, and is a position where the central axis of the nozzle outlet 41a of the nozzle 41 overlaps with a tangent to the periphery of the bonded substrate 100. The nozzle 41 positioned at separation start position [b] sprays liquid 40a between substrate 101 and substrate 102. At this time, because the bonded substrate 100 is rotating, liquid 40a can be sprayed between substrate 101 and substrate 102 over the entire periphery of the bonded substrate 100. Therefore, separation can be performed over the entire periphery of the bonded substrate 100.

Then, for example, as shown in Figure 4, the nozzle 41 is moved to follow the separated area, and the substrates 101 and 102 are separated by spraying liquid 40a in the area between the periphery of the bonded substrate 100 and the center of rotation.

In this separation process of the bonded substrate 100, as shown in Figure 4, the nozzle 41 is moved in an arc-shaped trajectory from the separation start position [b] to the separation position [c] at the center of rotation of the bonded substrate 100. The nozzle 41 is also moved so that the distance d between the nozzle 41 and the bonded substrate 100 remains approximately constant. By moving the nozzle 41 so that the distance d remains approximately constant, the nozzle outlet 41a of the nozzle 41 can be brought as close as possible to the side surface of the bonded substrate 100.

Furthermore, since the liquid 40a is sprayed while the nozzle 41 is moved in such an arc-shaped trajectory, the liquid 40a is sprayed toward a partial region Ra on the periphery of the bonded substrate 100. Note that region Ra is a region that includes an arc with a central angle of 90 degrees on the periphery of the bonded substrate 100. Even if the liquid 40a is sprayed toward such a partial region Ra on the circumference, because the bonded substrate 100 is rotating, the liquid 40a is sprayed over the entire circumference of the bonded substrate 100, and separation can be performed over the entire region of the bonded substrate 100.

Figure 5 is a schematic diagram illustrating the separation of bonded substrates, illustrating the separation state as the nozzle 41 moves from the separation start position [b] to the separation position [c] at the center of rotation of the bonded substrate 100. As shown in Figure 5, when viewed from the direction along the rotation center axis 1a of the separation device 1, separation occurs up to the region inside the suction portion 23b provided near the periphery of the holding portion 23 (base portion 23a). As mentioned above, the biasing portion 23c biases the substrate 102 in the direction of peeling it off from the substrate 101.

As a result, when separation reaches an area inside the suction portion 23b provided near the periphery of the holding portion 23 (base portion 23a), the biasing portion 23c contracts, causing the substrate 102 to bend in a direction away from the substrate 101, as shown in FIG. 6. When the substrate 102 bends in a direction away from the substrate 101, the distance between the peripheral edge of the substrate 101 and the peripheral edge of the substrate 102 increases in the direction along the central axis 1a of rotation of the separation device 1. In addition, a wedge-shaped gap is formed between the substrates 101 and 102. This makes it easier for the sprayed liquid 40a to enter between the substrates 101 and 102, creating a sufficient wedge effect and allowing separation to proceed efficiently.

As the separated region moves further toward the central axis of rotation of the bonded substrate 100, the biasing portion 23c provided in the separated region causes the substrate 102 to bend in a direction away from the substrate 101. As a result, a wedge-shaped gap is maintained between the substrates 101 and 102, making it easier for the sprayed liquid 40a to enter the gap. As a result, a sufficient wedge effect can be maintained all the way up to the central region near the central axis of rotation of the bonded substrate 100.

7, when separation has progressed to the position of the central axis of rotation of the bonded substrate 100, spraying of the liquid 40a from the nozzle 41 is stopped. After separation of the bonded substrate 100 is completed, the nozzle 41 moves to a standby position [a] separated from the bonded substrate 100 (see FIG. 4).
Then, the rotation of the holders 21 and 23 is stopped, thereby stopping the rotation of the bonded substrate stack 100 that has been separated.
In this manner, the bonded substrate 100 can be separated.

FIG. 8 is a schematic view illustrating a biasing portion 123c according to another embodiment.
As shown in FIG. 8, the holding portion 123 includes, for example, a base portion 123a, a suction portion 123b, a biasing portion 123c, and a pipe 123d.

The base 123a may be, for example, a disk.
The suction portion 123b may be, for example, a vacuum pad.
The pipe 123d can be slidably provided in a hole that penetrates the base 123a in the thickness direction. One end of the pipe 123d is exposed on one side of the base 123a. The other end of the pipe 123d is exposed on the other side of the base 123a. The suction unit 123b can be provided at one end of the pipe 123d. The other end of the pipe 123d can be connected to the exhaust unit 26 via a piping member such as a rotary joint provided in the drive unit 24.

The biasing portion 123c biases the suction portion 123b in a direction approaching the base 123a. The biasing portion 123c can be, for example, a compression spring. The biasing portion 123c is provided, for example, on the side of the base 123a opposite the suction portion 123b side. The pipe 123d can be inserted inside the biasing portion 123c, which is a compression spring. One end of the biasing portion 123c can be in contact with the base 123a. The other end of the biasing portion 123c can be in contact with a flange member 123d1, such as a retaining ring, provided on the pipe 123d. A flange member 123d2, such as a retaining ring, is provided near the end of the pipe 123d on the suction portion 123b side. The flange member 123d2 can be in contact with the base 123a due to the biasing force of the biasing portion 123c.

9A and 9B are schematic diagrams illustrating the effects of the biasing portion 123c.
9A, the suction unit 123b suction-holds the other surface (the surface on the substrate 102 side) of the bonded substrate 100. At this time, the position of the base 123a is controlled by the moving unit 25 so that a gap is provided between the flange member 123d2 and the base 123a.

Next, in the same manner as described above, the holders 21 and 123 are rotated, thereby rotating the bonded substrate 100 held by suction on the holders 21 and 123. Then, liquid 40a is sprayed between the substrates 101 and 102, separating the substrates 101 and 102.

As described above, as the separation of substrates 101 and 102 progresses due to the spraying of liquid 40a, as shown in FIG. 9(b), the biasing portion 123c causes substrate 102 to bend in a direction away from substrate 101. Therefore, as described above, a wedge-shaped gap is formed between substrates 101 and 102. As a result, the sprayed liquid 40a can easily penetrate between substrates 101 and 102, creating a sufficient wedge effect and allowing separation to progress efficiently up to the central region of the bonded substrate 100.

Note that although a compression spring is given as an example of the biasing portion 123c, a tension spring, coil spring, rubber, or other elastic body may also be used. In other words, the biasing portion may be anything that can bias the substrate 102 in the direction of peeling it off from the substrate 101.

In addition, the biasing portions 23c, 123c provided on the circumference of a circle centered on the central axis of rotation can be made more easily deformable than the biasing portions 23c, 123c provided at the position of the central axis of rotation. In this way, the substrate 102 becomes more likely to bend in a direction away from the substrate 101, making it easier to generate the wedge effect described above.
For example, the elastic modulus of the material of the urging portion 23c provided on the circumference centered on the rotation center axis may be set to be smaller than the elastic modulus of the material of the urging portion 23c provided at the position of the rotation center axis.
For example, the spring constant of the biasing portion 123c provided on the circumference of a circle centered on the central axis of rotation may be set smaller than the spring constant of the material of the biasing portion 23c provided at the position of the central axis of rotation.

Furthermore, the holes 23a1 communicating with the respective biasing portions 23c, 123c arranged on a circumference centered on the rotational center axis can be separated and the suction force acting on each can be changed so that the biasing portions 23c, 123c arranged on a circumference centered on the rotational center axis deform more than the biasing portions 23c, 123c arranged on a circumference centered on the rotational center axis. For example, the exhaust volume of the exhaust section 26 can be controlled so that the suction force acting on the holes 23a1 communicating with the biasing portions 23c, 123c arranged at the rotational center axis is greater than the hole 23a1 communicating with the biasing portions 23c, 123c arranged on a circumference centered on the rotational center axis.

In addition, while the above examples show cases where the suction portion 23b and the biasing portion 23c, or the suction portion 123b and the biasing portion 123c, are provided on the substrate 102 side of the bonded substrate 100, they can also be provided on the substrate 101 side of the bonded substrate 100. They can also be provided on the substrate 101 side and the substrate 102 side of the bonded substrate 100. In other words, the suction portion 23b and the biasing portion 23c, or the suction portion 123b and the biasing portion 123c, can be provided on at least either the substrate 101 side or the substrate 102 side of the bonded substrate 100.

In this case, if the suction unit 23b and the biasing unit 23c, or the suction unit 123b and the biasing unit 123c, are provided on the substrate 101 side and the substrate 102 side of the bonded substrate 100, the position of the peripheral edge of the bonded substrate 100 may vary in the direction along the central axis of rotation 1a of the separation device 1. If the position of the peripheral edge of the bonded substrate 100 varies, there is a risk that the liquid 40a will not be sprayed in the appropriate position. Therefore, when the suction unit 23b and the biasing unit 23c, or the suction unit 123b and the biasing unit 123c are provided on the substrate 101 side and the substrate 102 side of the bonded substrate 100, it is preferable to provide an image sensor that detects the position of the peripheral edge of the bonded substrate 100, and a moving unit that moves the position of the nozzle 41 based on images captured by the image sensor.

FIG. 10 is a schematic enlarged view illustrating the holding portion 23 in the separation device 11 according to another embodiment.
The separating device 11 is the same as the separating device 1 except that an imaging unit 60 is further provided in addition to the separating device 1 described above.
The imaging unit 60 is electrically connected to the controller 50. The imaging unit 60 is a camera or the like that captures an image of the urging unit 23 c. The image of the urging unit 23 c captured by the imaging unit 60 includes a speckle pattern generated on the surface of the urging unit 23 c. The speckle pattern can be a pattern of multiple dots generated on the surface by, for example, painting or spraying a fine substance onto the surface of the urging unit 23 c.

The controller 50 can analyze and process the image data of the speckle pattern acquired by the imaging unit 60 .
For example, the controller 50 uses the digital image correlation (DIC) method to set a minute analysis area called a subset in the image before the start of separation (before deformation) of the speckle pattern image data, and performs a matching process or the like to determine the position of the subset in the image after the start of separation (after deformation), thereby making it possible to calculate the amount of displacement at any point of the biasing portion 23 c before and after deformation.

In this way, it is possible to detect the change in shape of the urging portion 23c, and to determine the separation state of the bonded substrate stack 100.
More specifically, the separation status of the bonded substrate 100 can be determined by calculating the displacement (deformation) of the urging portion 23c before and after the start of separation based on the speckle pattern generated on the surface of the urging portion 23c as described above.

For example, when determining the separation status of the outer peripheral region of the bonded substrate 100, the speckle pattern of the biasing portion 23c provided on the suction portion 23b near the periphery of the holding portion 23 is imaged, and the amount of displacement at any point on the biasing portion 23c is calculated from the acquired image data. When the amount of displacement reaches the predetermined amount required for the separation state, it can be determined that separation in the outer peripheral region has been completed.

Furthermore, for example, when determining the separation status of the central region of the bonded substrate 100 (the region near the central axis of rotation of the bonded substrate 100), the speckle pattern of the biasing unit 23c located at the position of the central axis of rotation is captured, and the amount of displacement at any point on the biasing unit 23c is calculated from the acquired image data. When the amount of displacement that would result in a pre-determined separated state is reached, it can be determined that separation in the central region has been completed.

Based on the separation situation described above, it is also possible to control the movement unit 25 to move the nozzle 41 from the outer periphery toward the center.

Furthermore, by simultaneously capturing images of multiple biasing portions 23c arranged on a circumference centered on the rotation central axis 1a and comparing the amount of displacement of each, it is possible to determine whether separation is progressing uniformly.

In order to determine the separation status, it is sufficient to be able to detect changes in the shape of the urging portion 23c. For example, the imaging unit 60 can capture an image of the urging portion 23c, not just a speckle pattern. The controller 50 can then determine the amount of displacement by comparing the axial length and changes in the external shape of the urging portion 23c before and after separation, and determine the separation status and completion.

The above examples show separation devices 1 and 11 in which the central axis of rotation 1a extends in a substantially vertical direction, but the present invention can also be applied to separation devices in which the central axis of rotation 1a extends in a substantially horizontal direction.

Although the embodiments have been described above, the present invention is not limited to these descriptions.
With respect to the above-described embodiments, those skilled in the art may add, delete, or modify components as appropriate, or add, omit, or change processes or conditions as appropriate, and these modifications are also within the scope of the present invention as long as they retain the characteristics of the present invention.
For example, the shape, dimensions, material, arrangement, etc. of each element included in the separation device 1 are not limited to those exemplified, and can be changed as appropriate.
Furthermore, the elements of each of the above-described embodiments can be combined to the greatest extent possible, and such combinations are also included within the scope of the present invention as long as they include the features of the present invention.

1 Separation device, 1a Rotational axis, 20 Rotational holding unit, 21 Holding unit, 23 Holding unit, 23a Base, 23b Suction unit, 23c Actuation unit, 24 Drive unit, 26 Exhaust unit, 40 Separation unit, 40a Liquid, 41 Nozzle, 50 Controller, 60 Imaging unit, 100 Bonded substrate, 101 Substrate, 102 Substrate, 123 Holding unit, 123a Base, 123b Suction unit, 123c Actuation unit, 123d Pipe

Claims (6)

a first holding portion that holds one surface of the plate member;
a second holding portion that holds the other surface of the plate member;
a drive unit that rotates the first holding unit and the second holding unit;
a nozzle for spraying a liquid onto a side surface of the plate member;
Equipped with
A separation device in which at least one of the first holding portion and the second holding portion has a plurality of suction portions that adsorb the plate member, and a biasing portion provided on each of the plurality of suction portions that biases the suction portion in a direction away from the plate member. The separation device according to claim 1, wherein the suction portion and the biasing portion are integrally formed. The plurality of adsorption units are
a first suction portion provided at a position of a rotation central axis of the first holding portion and the second holding portion;
a plurality of second suction portions provided on a circumference centered on the rotation central axis;
3. The separation device according to claim 1 or 2, comprising: The separation device according to claim 3, wherein the plurality of second adsorption units are arranged on the circumference of concentric circles centered on the central axis of rotation. A separation device as described in claim 3, wherein the second biasing portion provided on the second suction portion is more easily deformed than the first biasing portion provided on the first suction portion. an imaging unit that images the biasing unit;
The separating device according to claim 1 , further comprising a controller that calculates a displacement amount of the biasing portion from the image captured by the imaging portion and determines a separation state of the plate members based on the displacement amount.