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WO2025069363A1 - Appareil de balayage de faisceau, appareil de traitement et procédé de traitement - Google Patents

Appareil de balayage de faisceau, appareil de traitement et procédé de traitement Download PDF

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Publication number
WO2025069363A1
WO2025069363A1 PCT/JP2023/035587 JP2023035587W WO2025069363A1 WO 2025069363 A1 WO2025069363 A1 WO 2025069363A1 JP 2023035587 W JP2023035587 W JP 2023035587W WO 2025069363 A1 WO2025069363 A1 WO 2025069363A1
Authority
WO
WIPO (PCT)
Prior art keywords
processing
optical
light
beam scanning
optical system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2023/035587
Other languages
English (en)
Inventor
Kento Hara
Motofusa Ishikawa
Yoshio Kawabe
Christiane Thiel
Lars Johann WACKER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon SLM Solutions AG
Nikon Corp
Original Assignee
Nikon SLM Solutions AG
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon SLM Solutions AG, Nikon Corp filed Critical Nikon SLM Solutions AG
Priority to PCT/JP2023/035587 priority Critical patent/WO2025069363A1/fr
Publication of WO2025069363A1 publication Critical patent/WO2025069363A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20—Direct sintering or melting
    • B22F10/25—Direct deposition of metal particles, e.g. direct metal deposition [DMD] or laser engineered net shaping [LENS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20—Direct sintering or melting
    • B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/40—Radiation means
    • B22F12/49—Scanners
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing
    • B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0955—Lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/14—Beam splitting or combining systems operating by reflection only
    • G02B27/141—Beam splitting or combining systems operating by reflection only using dichroic mirrors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/283—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising used for beam splitting or combining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/40—Radiation means
    • B22F12/44—Radiation means characterised by the configuration of the radiation means
    • B22F12/45—Two or more
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/90—Means for process control, e.g. cameras or sensors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/105—Scanning systems with one or more pivoting mirrors or galvano-mirrors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/12—Scanning systems using multifaceted mirrors

Definitions

  • the present invention relates to a technical field of a beam scanning apparatus configured to perform a scanning of a processing beam, and a processing apparatus and a processing method configured to process an object by using the processing beam from the beam scanning apparatus.
  • Patent Literatures 1 and 2 disclose examples of a beam scanning apparatus configured to perform a scanning of a processing beam.
  • the beam scanning apparatus is required to perform the scanning of the processing beam.
  • Patent Literature 1 US 9,903,762B2
  • Patent Literature 2 US 10,124,537B2
  • a first aspect provides a beam scanning apparatus configured to perform a scanning of a processing beam that is used by a processing apparatus, the beam scanning apparatus includes: a condensing optical system that condenses the processing beam entering the beam scanning apparatus in a divergent state; a beam split member that transmits the processing beam from the condensing optical system; and a scanning optical member which scans the processing beam from the beam split member, the beam split member reflects light that enters the beam split member through the scanning optical member to direct the light toward a light receiving apparatus.
  • a second aspect provides a beam scanning apparatus configured to perform a scanning of a processing beam that is used by a processing apparatus
  • the beam scanning apparatus includes: a condensing optical system that condenses the processing beam entering the beam scanning apparatus; a beam split member that transmits the processing beam from the condensing optical system; a scanning optical member which scans the processing beam from the beam split member; and an aberration reduction member that is disposed in an optical path of the processing beam between the condensing optical system and the scanning optical member and that reduces an aberration generated by the processing beam transmitted through the beam split member, the beam split member reflects light that enters the beam split member through the scanning optical member to direct the light toward a light receiving apparatus.
  • a third aspect provides a processing apparatus including the beam scanning apparatus provided by the first or second aspect, the processing apparatus processing an object by using the processing beam from the beam scanning apparatus.
  • a fourth aspect provides a processing method including: emitting the processing beam from the beam scanning apparatus provided by the first or second aspect; and processing an object by performing a scanning of the processing beam from the beam scanning apparatus.
  • a fifth aspect provides a processing method including: emitting the processing beam from the processing apparatus provided by the third aspect; and processing an object by using the processing beam.
  • FIG. 1 is a cross-sectional view that illustrates a configuration of a processing apparatus in a first embodiment.
  • FIG. 2 is a perspective view that illustrates a configuration of a beam scanning apparatus in the first embodiment.
  • FIG. 3 is a cross-sectional view that illustrates the configuration of the beam scanning apparatus in the first embodiment.
  • FIG. 4 is a cross-sectional view that illustrates a configuration of a condensing optical system in the first embodiment.
  • FIG. 5 is a perspective view that illustrates a configuration of a beam scanning apparatus in a second embodiment.
  • FIG. 6 is a perspective view that illustrates a positional relationship between an aberration reduction member and a beam split member.
  • FIG. 7 is a perspective view that illustrates the configuration of the beam scanning apparatus in the second embodiment.
  • FIG. 1 is a cross-sectional view that illustrates a configuration of a processing apparatus in a first embodiment.
  • FIG. 2 is a perspective view that illustrates a configuration of a beam scanning apparatus in the
  • FIG. 8 is a cross-sectional view that illustrates a configuration of a beam scanning apparatus in a third embodiment.
  • FIG. 9 is a cross-sectional view that illustrates a configuration of a beam scanning apparatus in a fourth embodiment.
  • FIG. 10 is a perspective view that illustrates the configuration of the beam scanning apparatus in the fourth embodiment.
  • FIG. 11 is a cross-sectional view that illustrates the configuration of the beam scanning apparatus in the fourth embodiment.
  • FIG. 12A is a perspective view that illustrates a configuration of a beam scanning apparatus in a fifth embodiment.
  • FIG. 12B is a perspective view that illustrates a configuration of a beam scanning apparatus in a fifth embodiment.
  • FIG. 12C is a perspective view that illustrates a configuration of a beam scanning apparatus in a fifth embodiment.
  • FIG. 12A is a perspective view that illustrates a configuration of a beam scanning apparatus in a fifth embodiment.
  • FIG. 12B is a perspective view that illustrates a configuration of a beam scanning apparatus in
  • FIG. 13 is a cross-sectional view that illustrates a configuration of a condensing optical system in a sixth embodiment.
  • FIG. 14 is a cross-sectional view that illustrates the configuration of the condensing optical system in the sixth embodiment.
  • FIG. 15 is a cross-sectional view that illustrates the configuration of the condensing optical system in the sixth embodiment.
  • FIG. 16 is a cross-sectional view that illustrates the configuration of the condensing optical system in the sixth embodiment.
  • FIG. 17 is a cross-sectional view that illustrates the configuration of the condensing optical system in the sixth embodiment.
  • FIG. 18 is a cross-sectional view that illustrates a configuration of a condensing optical system in a seventh embodiment.
  • FIG. 14 is a cross-sectional view that illustrates the configuration of the condensing optical system in the sixth embodiment.
  • FIG. 15 is a cross-sectional view that illustrates the configuration of the condensing optical system in the sixth embodiment.
  • FIG. 19 is a cross-sectional view that illustrates a configuration of a condensing optical system.
  • FIG. 20 is a cross-sectional view that illustrates a configuration of a processing apparatus in an eighth embodiment.
  • FIG. 21 is a perspective view that illustrates an exterior appearance of the processing apparatus in the eighth embodiment.
  • FIG. 22 is a top view that illustrates the exterior appearance of the processing apparatus in the eighth embodiment.
  • FIG. 23 is a bottom view that illustrates the exterior appearance of the processing apparatus in the eighth embodiment.
  • Each of FIG. 24A and FIG. 24B is a bottom view that illustrates the exterior appearance of the processing apparatus in modification.
  • FIG. 25 is a bottom view that illustrates the exterior appearance of the processing apparatus in modification.
  • FIG. 26 is a bottom view that illustrates the exterior appearance of the processing apparatus in modification.
  • FIG. 27 is a bottom view that illustrates the exterior appearance of the processing apparatus in modification.
  • FIG. 28 is a bottom view that illustrates the exterior appearance of the processing apparatus in modification.
  • Each of FIG. 29A and FIG. 29B is a bottom view that illustrates the exterior appearance of the processing apparatus in modification.
  • FIG. 30 is a cross-sectional view that illustrates the configuration of the processing apparatus in modification.
  • FIG. 31 is a cross-sectional view that illustrates another configuration of the processing apparatus in the first embodiment.
  • a positional relationship of various components included in the processing apparatus 1 will be described by using an XYZ rectangular coordinate system that is defined by an X-axis, a Y-axis and a Z-axis that are perpendicular to one another.
  • X-axis direction and a Y-axis direction is assumed to be a horizontal direction (namely, a predetermined direction in a horizontal plane) and a Z-axis direction is assumed to be a vertical direction (namely, a direction that is perpendicular to the horizontal plane, and substantially a vertical direction or a gravity direction) in the below-described description, for convenience of the description.
  • rotational directions (in other words, inclination directions) around the X-axis, the Y-axis and the Z-axis are referred to as a ⁇ X direction, a ⁇ Y direction and a ⁇ Z direction, respectively.
  • the Z-axis direction may be the gravity direction.
  • an XY plane may be a horizontal direction.
  • processing apparatus 1a in First embodiment
  • the processing apparatus 1 in a first embodiment will be described.
  • the processing apparatus 1 in the first embodiment is referred to as a “processing apparatus 1a”.
  • FIG. 1 is a cross-sectional view that illustrates the configuration of the processing apparatus 1a in the first embodiment.
  • the processing apparatus 1a includes a carrier 111 and a material application apparatus 112.
  • the carrier 111 is a member on which a material layer ML is formed.
  • the material application apparatus 112 is an apparatus that is configured to form the material layer ML on the carrier 111 under the control of a control apparatus 3 that is illustrated conceptually in FIG. 1.
  • FIG. 1 does not illustrate a cross-section of the control apparatus 3.
  • the material layer ML is a layer of build material M.
  • the build material M is powder, for example.
  • the build material M may be at least one of metal powder and resin powder. However, the build material M may not be the powder.
  • the processing apparatus 1a irradiates at least a part of the material layer ML formed on the carrier 111 with processing light EL.
  • the processing light EL may be referred to as a processing beam.
  • the molten material layer ML solidifies.
  • a structural layer SL corresponding to the solidified material layer ML is formed.
  • the structural layer SL may be equivalent to a sintered layer formed by a sintering of the build material M.
  • the processing apparatus 1a includes a beam scanning apparatus 2 that is configured to emit the processing light EL, in order to irradiate the material layer ML with the processing light EL.
  • the processing apparatus 1a irradiates the material layer ML with the processing light EL emitted from the beam scanning apparatus 2.
  • the beam scanning apparatus 2 selectively irradiates the material layer ML with the processing light EL to selectively solidify the material layer ML under the control of the control apparatus 3.
  • the beam scanning apparatus 2 deflects and scans (sweeps) the processing light EL by using a below-described scanning optical member 23.
  • the beam scanning apparatus 2 uses the below-described scanning optical member 23 to change an emission direction along which the processing light EL is emitted from the beam scanning apparatus 2. For example, the beam scanning apparatus 2 deflects and scans the processing light EL about the ⁇ X and ⁇ Y directions. As a result, an irradiation position of the processing light EL on a surface of the material layer ML moves along the direction that is parallel to the carrier 111 (namely, the direction that is parallel to the material layer ML, and the direction that is parallel to the XY plane in an example illustrated in FIG. 1). In this manner, the beam scanning apparatus 2 is configured to scan the processing light EL. In other words, the beam scanning apparatus 2 is configured to perform a scanning of the processing light EL. In other words, the beam scanning apparatus 2 is configured to perform a scanning using the processing light EL. For example, the beam scanning apparatus 2 is configured to scan at least a part of the material layer ML with the processing light EL.
  • the beam scanning apparatus 2 deflects the processing light EL based on processing path information that indicates a moving trajectory of the irradiation position of the processing light EL so that a position indicated by the processing path information is irradiated with the processing light EL.
  • the processing path information is generated based on CAD data of the three-dimensional structural object that should be build, for example. Therefore, the structural layer SL that is built is substantially same as a shape of a part of the three-dimensional structural object that should be built.
  • the processing apparatus 1a lowers the carrier 111 after building the structural layer SL.
  • the carrier 111 is movable along the Z-axis direction in FIG. 1.
  • the processing apparatus 1a includes a carrier movement apparatus 113.
  • the carrier movement apparatus 113 is an apparatus that is configured to move the carrier 111 along the Z-axis direction under the control of the control apparatus 3. After the carrier movement apparatus 113 lowers the carrier 111 (moves the carrier 111 toward the -Z side in the example illustrated in FIG.
  • the material application apparatus 112 forms (dispenses, coats, or applies) a new material layer ML on the carrier 111 (more specifically, on the structural layer SL that has been already built and the old material layer ML that has been already formed). Then, the processing apparatus 1a irradiates the newly formed material layer ML with the processing light EL emitted from the beam scanning apparatus 2. As a result, a new structural layer SL is built on the structural layer SL that has been already built. Namely, a new structural layer SL is stacked on the structural layer SL that has been already built.
  • the processing apparatus 1a repeats the same operation. Namely, the processing apparatus 1a alternately repeats an operation for forming the material layer ML, an operation for solidifying at least a part of the formed material layer ML to form the structural layer SL, and an operation for lowering the carrier 111. As a result, the three-dimensional structural object in which a plurality of structural layers SL are stacked is formed on the carrier 111. Namely, the processing apparatus 1a performs the additive manufacturing on the carrier 111 (specifically, performs the additive manufacturing using the material layer ML formed on the carrier 111) to build the three-dimensional structural object on the carrier 111.
  • the processing apparatus 1a builds the three-dimensional structural object on the carrier 111 by performing the additive manufacturing to the carrier 111 by using the material layer ML formed on the carrier 111. In this manner, the processing apparatus 1a builds the three-dimensional structural object by performing the additive manufacturing based on a Powder Bed Fusion method (PBF) such as a Selective Laser Sintering method (SLS).
  • PPF Powder Bed Fusion method
  • SLS Selective Laser Sintering method
  • a build plate 114 may be disposed on the carrier 111.
  • the processing apparatus 1a may form the material layer ML on the build plate 114.
  • the three-dimensional structural object in which the plurality of structural layers SL are stacked may be formed on the build plate 114.
  • the processing apparatus 1a may form the three-dimensional structural object on the build plate 114 by performing the additive manufacturing on the build plate 114 (namely, performing the additive manufacturing using the material layer ML formed on the build plate 114).
  • the processing apparatus 1a may form the three-dimensional structural object on the build plate 114 by performing the additive manufacturing to the build plate 114 by using the material layer ML formed on the build plate 114.
  • the processing apparatus 1a further includes a build cylinder 115.
  • the build cylinder 115 includes at least one side wall 1151.
  • the at least one side wall 1151 may be in contact with the build material M.
  • the build cylinder 115 may serve as a container for housing the build material M.
  • the at least one side wall 1151 may be in contact with the carrier 111.
  • the build cylinder 115 may serve as a guide member for guiding the carrier 111 that is movable along the Z-axis direction.
  • the processing apparatus 1a lowers the carrier 111 inside the build cylinder 115 so that a new material layer ML can be formed on the carrier 111.
  • the processing apparatus 1a further includes a processing chamber 120.
  • the processing chamber 120 may be referred to as a processing chamber.
  • the processing chamber 120 includes: a side wall 121 extending perpendicular to the XY plane; a bottom wall 122 and a top wall 123 extending parallel to the XY plane.
  • the processing chamber 120 is a box-shaped structure having a cuboid shape or a cubic shape.
  • the processing chamber 120 may be a box-shaped structure having another shape.
  • the processing chamber 120 may be a box structure having a cylindrical shape, a conical shape, or a pyramid shape.
  • the processing chamber 120 forms a chamber space SP120 therein.
  • the chamber space SP120 is a space surrounded by the side wall 121, the bottom wall 122, and the top wall 123.
  • the processing chamber 120 fulfills a housing function for maintaining a spatially, atmospherically, and fluidically closed (or substantially closed) processing environment within the chamber space SP120.
  • the processing chamber 120 may not be hermetically sealed to a space outside the processing chamber 120.
  • an opening that may serve as at least one of a gas inlet and a gas outlet may be formed in the side wall 121 of the processing chamber 120.
  • an opening 1231 through which the processing light EL emitted from the beam scanning apparatus 2 is allowed to pass may be formed in the top wall 123 of the processing chamber 120.
  • the processing light EL emitted from the beam scanning apparatus 2 may enter the chamber space SP120 inside the processing chamber 120 through the opening 1231.
  • the processing chamber 120 may not include the top wall 123.
  • an opening 1221 through which the processing light EL entering the chamber space SP120 is allowed to pass may be formed in the bottom wall 122.
  • FIG. 1 illustrates an example of the flow direction of the gas flow GF.
  • the flow direction of the gas flow GF is not limited to the direction illustrated in FIG. 1, and may be the X direction, any direction within the XY plane, or any other direction.
  • the build cylinder 115 directly adjoins the processing chamber 120. Especially, the build cylinder 115 directly adjoins the processing chamber 120 below the processing chamber 120. Specifically, the build cylinder 115 adjoins the opening 1221 formed in the bottom wall 122 of the processing chamber 120. As a result, the material layer ML is irradiated with the processing light EL emitted from the beam scanning apparatus 2 through the opening 1221.
  • the build cylinder 115 may be attached to the processing chamber 120.
  • the build cylinder 115 is attached to the processing chamber 120 so that the build cylinder 115 is fixed to the processing chamber 120.
  • the material layer ML formed on the carrier 111 located in the build cylinder 115 substantially faces the chamber space SP120 inside the processing chamber 120.
  • the material layer ML is substantially located in the chamber space SP120 inside the processing chamber 120. Therefore, the chamber space SP120 may be substantially a space in which the material layer ML is processed (namely, in which the additive manufacturing is performed).
  • the build cylinder 115 may be attached to the processing chamber 120 in a detachable state from the processing chamber 120. Alternatively, the build cylinder 115 may not directly adjoin the processing chamber 120. For example, the build cylinder 115 may be attached to the processing chamber 120 so that the processing chamber 120 is opened at least partially.
  • a carrier plate 133 is disposed above the processing chamber 120, and the beam scanning apparatus 2 is disposed on the carrier plate 133.
  • the processing apparatus 1a dose not need to include the carrier plate 133.
  • the beam scanning apparatus 2 may be placed on the top wall 123 of the processing chamber 120 or the beam scanning apparatus 2 may be supported by a member included in the processing apparatus 1a.
  • the beam scanning apparatus 2 may be disposed above the processing chamber 120.
  • the beam scanning apparatus 2 emits the processing light EL downwardly from the beam scanning apparatus 2.
  • the beam scanning apparatus 2 emits the processing light EL toward the material layer ML located below the beam scanning apparatus 2. Since the material layer ML is processed by the processing light EL, a processed position at which the material layer ML is processed is located below the beam scanning apparatus 2.
  • the processing position may be referred to as an irradiation position of the processing light EL.
  • gas may flow into the air gap between the processing chamber 120 and the carrier plate 133. This gas may be used to adjust a temperature of (for example, cool) t at least one of the processing chamber 120 and the carrier plate 133 (the beam scanning apparatus 2 in some cases).
  • the carrier plate 133 may form a part of the processing chamber 120, typically the top wall 123 of the processing chamber 120.
  • the beam scanning apparatus 2 may be provided on the ceiling of the processing chamber 120.
  • various arithmetic processing or functions included in the computer program may be realized by a logical processing block that is realized in the control apparatus 3 by means of the control apparatus a (namely, a computer) executing the computer program, may be realized by a hardware such as a predetermined gate array (for example, a FPGA (Field Programmable Gate Array, an ASIC (Application Specific Integrated Circuit), and so on) of the control apparatus 3, or may be realized in a form in which the logical processing block and a partial hardware module that realizes a partial element of the hardware are combined.

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Abstract

<u /> Un appareil de balayage de faisceau est un appareil de balayage de faisceau conçu pour effectuer un balayage d'un faisceau de traitement qui est utilisé par un appareil de traitement, et comprend : un système optique de condensation qui condense le faisceau de traitement entrant dans l'appareil de balayage de faisceau dans un état divergent ; un élément de division de faisceau qui transmet le faisceau de traitement à partir du système optique de condensation ; et un élément optique de balayage qui balaye le faisceau de traitement à partir de l'élément de division de faisceau, l'élément de division de faisceau réfléchit la lumière qui entre dans l'élément de division de faisceau à travers l'élément optique de balayage pour diriger la lumière vers un appareil de réception de lumière.
PCT/JP2023/035587 2023-09-29 2023-09-29 Appareil de balayage de faisceau, appareil de traitement et procédé de traitement Pending WO2025069363A1 (fr)

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