WO2025069363A1

WO2025069363A1 - Beam scanning apparatus, processing apparatus, and processing method

Info

Publication number: WO2025069363A1
Application number: PCT/JP2023/035587
Authority: WO
Inventors: Kento Hara; Motofusa Ishikawa; Yoshio Kawabe; Christiane Thiel; Lars Johann WACKER
Original assignee: Nikon SLM Solutions AG; Nikon Corp
Current assignee: Nikon SLM Solutions AG; Nikon Corp
Priority date: 2023-09-29
Filing date: 2023-09-29
Publication date: 2025-04-03
Anticipated expiration: 2026-03-29

Abstract

A beam scanning apparatus is a beam scanning apparatus configured to perform a scanning of a processing beam that is used by a processing apparatus, and includes: a condensing optical system that condenses the processing beam entering the beam scanning apparatus in a divergent state; a beam split member that transmits the processing beam from the condensing optical system; and a scanning optical member which scans the processing beam from the beam split member, the beam split member reflects light that enters the beam split member through the scanning optical member to direct the light toward a light receiving apparatus.

Description

BEAM SCANNING APPARATUS, PROCESSING APPARATUS, AND PROCESSING METHOD

The present invention relates to a technical field of a beam scanning apparatus configured to perform a scanning of a processing beam, and a processing apparatus and a processing method configured to process an object by using the processing beam from the beam scanning apparatus.

Patent Literatures 1 and 2 disclose examples of a beam scanning apparatus configured to perform a scanning of a processing beam. The beam scanning apparatus is required to perform the scanning of the processing beam.

Patent Literature 1: US 9,903,762B2
Patent Literature 2: US 10,124,537B2

A first aspect provides a beam scanning apparatus configured to perform a scanning of a processing beam that is used by a processing apparatus, the beam scanning apparatus includes: a condensing optical system that condenses the processing beam entering the beam scanning apparatus in a divergent state; a beam split member that transmits the processing beam from the condensing optical system; and a scanning optical member which scans the processing beam from the beam split member, the beam split member reflects light that enters the beam split member through the scanning optical member to direct the light toward a light receiving apparatus.

A second aspect provides a beam scanning apparatus configured to perform a scanning of a processing beam that is used by a processing apparatus, the beam scanning apparatus includes: a condensing optical system that condenses the processing beam entering the beam scanning apparatus; a beam split member that transmits the processing beam from the condensing optical system; a scanning optical member which scans the processing beam from the beam split member; and an aberration reduction member that is disposed in an optical path of the processing beam between the condensing optical system and the scanning optical member and that reduces an aberration generated by the processing beam transmitted through the beam split member, the beam split member reflects light that enters the beam split member through the scanning optical member to direct the light toward a light receiving apparatus.

A third aspect provides a processing apparatus including the beam scanning apparatus provided by the first or second aspect, the processing apparatus processing an object by using the processing beam from the beam scanning apparatus.

A fourth aspect provides a processing method including: emitting the processing beam from the beam scanning apparatus provided by the first or second aspect; and processing an object by performing a scanning of the processing beam from the beam scanning apparatus.
A fifth aspect provides a processing method including: emitting the processing beam from the processing apparatus provided by the third aspect; and processing an object by using the processing beam.

FIG. 1 is a cross-sectional view that illustrates a configuration of a processing apparatus in a first embodiment. FIG. 2 is a perspective view that illustrates a configuration of a beam scanning apparatus in the first embodiment. FIG. 3 is a cross-sectional view that illustrates the configuration of the beam scanning apparatus in the first embodiment. FIG. 4 is a cross-sectional view that illustrates a configuration of a condensing optical system in the first embodiment. FIG. 5 is a perspective view that illustrates a configuration of a beam scanning apparatus in a second embodiment. FIG. 6 is a perspective view that illustrates a positional relationship between an aberration reduction member and a beam split member. FIG. 7 is a perspective view that illustrates the configuration of the beam scanning apparatus in the second embodiment. FIG. 8 is a cross-sectional view that illustrates a configuration of a beam scanning apparatus in a third embodiment. FIG. 9 is a cross-sectional view that illustrates a configuration of a beam scanning apparatus in a fourth embodiment. FIG. 10 is a perspective view that illustrates the configuration of the beam scanning apparatus in the fourth embodiment. FIG. 11 is a cross-sectional view that illustrates the configuration of the beam scanning apparatus in the fourth embodiment. FIG. 12A is a perspective view that illustrates a configuration of a beam scanning apparatus in a fifth embodiment. FIG. 12B is a perspective view that illustrates a configuration of a beam scanning apparatus in a fifth embodiment. FIG. 12C is a perspective view that illustrates a configuration of a beam scanning apparatus in a fifth embodiment. FIG. 13 is a cross-sectional view that illustrates a configuration of a condensing optical system in a sixth embodiment. FIG. 14 is a cross-sectional view that illustrates the configuration of the condensing optical system in the sixth embodiment. FIG. 15 is a cross-sectional view that illustrates the configuration of the condensing optical system in the sixth embodiment. FIG. 16 is a cross-sectional view that illustrates the configuration of the condensing optical system in the sixth embodiment. FIG. 17 is a cross-sectional view that illustrates the configuration of the condensing optical system in the sixth embodiment. FIG. 18 is a cross-sectional view that illustrates a configuration of a condensing optical system in a seventh embodiment. FIG. 19 is a cross-sectional view that illustrates a configuration of a condensing optical system. FIG. 20 is a cross-sectional view that illustrates a configuration of a processing apparatus in an eighth embodiment. FIG. 21 is a perspective view that illustrates an exterior appearance of the processing apparatus in the eighth embodiment. FIG. 22 is a top view that illustrates the exterior appearance of the processing apparatus in the eighth embodiment. FIG. 23 is a bottom view that illustrates the exterior appearance of the processing apparatus in the eighth embodiment. Each of FIG. 24A and FIG. 24B is a bottom view that illustrates the exterior appearance of the processing apparatus in modification. FIG. 25 is a bottom view that illustrates the exterior appearance of the processing apparatus in modification. FIG. 26 is a bottom view that illustrates the exterior appearance of the processing apparatus in modification. FIG. 27 is a bottom view that illustrates the exterior appearance of the processing apparatus in modification. FIG. 28 is a bottom view that illustrates the exterior appearance of the processing apparatus in modification. Each of FIG. 29A and FIG. 29B is a bottom view that illustrates the exterior appearance of the processing apparatus in modification. FIG. 30 is a cross-sectional view that illustrates the configuration of the processing apparatus in modification. FIG. 31 is a cross-sectional view that illustrates another configuration of the processing apparatus in the first embodiment.

At first, with reference to drawings, an embodiment of a beam scanning apparatus, a processing apparatus, and a processing method will be described. In the below-described description, the embodiment of the beam scanning apparatus, the processing apparatus, and the processing method will be described by using a processing apparatus 1 to which the embodiment of the beam scanning apparatus, the processing apparatus, and the processing method is adapted. Especially, in the below-described description, an example in which the processing apparatus 1 is configured to build a three-dimensional structural object (a three-dimensional workpiece) by performing an additive manufacturing.

In the below-described description, a positional relationship of various components included in the processing apparatus 1 will be described by using an XYZ rectangular coordinate system that is defined by an X-axis, a Y-axis and a Z-axis that are perpendicular to one another. Note that each of an X-axis direction and a Y-axis direction is assumed to be a horizontal direction (namely, a predetermined direction in a horizontal plane) and a Z-axis direction is assumed to be a vertical direction (namely, a direction that is perpendicular to the horizontal plane, and substantially a vertical direction or a gravity direction) in the below-described description, for convenience of the description. Moreover, rotational directions (in other words, inclination directions) around the X-axis, the Y-axis and the Z-axis are referred to as a θX direction, a θY direction and a θZ direction, respectively. Here, the Z-axis direction may be the gravity direction. Moreover, an XY plane may be a horizontal direction.

(1) Processing Apparatus 1a in First embodiment
First, the processing apparatus 1 in a first embodiment will be described. In the below-described description, the processing apparatus 1 in the first embodiment is referred to as a “processing apparatus 1a”.

(1-1) Configuration of Processing Apparatus 1a in First embodiment
Firstly, with reference to FIG. 1, a configuration of the processing apparatus 1a in the first embodiment will be described. FIG. 1 is a cross-sectional view that illustrates the configuration of the processing apparatus 1a in the first embodiment.

As illustrated in FIG. 1, the processing apparatus 1a includes a carrier 111 and a material application apparatus 112. The carrier 111 is a member on which a material layer ML is formed. The material application apparatus 112 is an apparatus that is configured to form the material layer ML on the carrier 111 under the control of a control apparatus 3 that is illustrated conceptually in FIG. 1. For convenience of description, FIG. 1 does not illustrate a cross-section of the control apparatus 3. The material layer ML is a layer of build material M. The build material M is powder, for example. As one example, the build material M may be at least one of metal powder and resin powder. However, the build material M may not be the powder.

The processing apparatus 1a irradiates at least a part of the material layer ML formed on the carrier 111 with processing light EL. Note that the processing light EL may be referred to as a processing beam. When at least a part of the material layer ML is irradiated with the processing light EL, at least a part of the material layer ML is molten. Then, after the molten material layer ML is no longer irradiated with the processing light EL, the molten material layer ML solidifies. As a result, a structural layer SL corresponding to the solidified material layer ML is formed. The structural layer SL may be equivalent to a sintered layer formed by a sintering of the build material M.

The processing apparatus 1a includes a beam scanning apparatus 2 that is configured to emit the processing light EL, in order to irradiate the material layer ML with the processing light EL. The processing apparatus 1a irradiates the material layer ML with the processing light EL emitted from the beam scanning apparatus 2. The beam scanning apparatus 2 selectively irradiates the material layer ML with the processing light EL to selectively solidify the material layer ML under the control of the control apparatus 3. In order to selectively irradiate the material layer ML with the processing light EL, the beam scanning apparatus 2 deflects and scans (sweeps) the processing light EL by using a below-described scanning optical member 23. Namely, the beam scanning apparatus 2 uses the below-described scanning optical member 23 to change an emission direction along which the processing light EL is emitted from the beam scanning apparatus 2. For example, the beam scanning apparatus 2 deflects and scans the processing light EL about the θX and θY directions. As a result, an irradiation position of the processing light EL on a surface of the material layer ML moves along the direction that is parallel to the carrier 111 (namely, the direction that is parallel to the material layer ML, and the direction that is parallel to the XY plane in an example illustrated in FIG. 1). In this manner, the beam scanning apparatus 2 is configured to scan the processing light EL. In other words, the beam scanning apparatus 2 is configured to perform a scanning of the processing light EL. In other words, the beam scanning apparatus 2 is configured to perform a scanning using the processing light EL. For example, the beam scanning apparatus 2 is configured to scan at least a part of the material layer ML with the processing light EL.

The beam scanning apparatus 2 deflects the processing light EL based on processing path information that indicates a moving trajectory of the irradiation position of the processing light EL so that a position indicated by the processing path information is irradiated with the processing light EL. The processing path information is generated based on CAD data of the three-dimensional structural object that should be build, for example. Therefore, the structural layer SL that is built is substantially same as a shape of a part of the three-dimensional structural object that should be built.

The processing apparatus 1a lowers the carrier 111 after building the structural layer SL. For this purpose, the carrier 111 is movable along the Z-axis direction in FIG. 1. To move the carrier 111 in the Z-axis direction, the processing apparatus 1a includes a carrier movement apparatus 113. The carrier movement apparatus 113 is an apparatus that is configured to move the carrier 111 along the Z-axis direction under the control of the control apparatus 3. After the carrier movement apparatus 113 lowers the carrier 111 (moves the carrier 111 toward the -Z side in the example illustrated in FIG. 1), the material application apparatus 112 forms (dispenses, coats, or applies) a new material layer ML on the carrier 111 (more specifically, on the structural layer SL that has been already built and the old material layer ML that has been already formed). Then, the processing apparatus 1a irradiates the newly formed material layer ML with the processing light EL emitted from the beam scanning apparatus 2. As a result, a new structural layer SL is built on the structural layer SL that has been already built. Namely, a new structural layer SL is stacked on the structural layer SL that has been already built.

Thereafter, the processing apparatus 1a repeats the same operation. Namely, the processing apparatus 1a alternately repeats an operation for forming the material layer ML, an operation for solidifying at least a part of the formed material layer ML to form the structural layer SL, and an operation for lowering the carrier 111. As a result, the three-dimensional structural object in which a plurality of structural layers SL are stacked is formed on the carrier 111. Namely, the processing apparatus 1a performs the additive manufacturing on the carrier 111 (specifically, performs the additive manufacturing using the material layer ML formed on the carrier 111) to build the three-dimensional structural object on the carrier 111. In other words, the processing apparatus 1a builds the three-dimensional structural object on the carrier 111 by performing the additive manufacturing to the carrier 111 by using the material layer ML formed on the carrier 111. In this manner, the processing apparatus 1a builds the three-dimensional structural object by performing the additive manufacturing based on a Powder Bed Fusion method (PBF) such as a Selective Laser Sintering method (SLS).

As illustrated in FIG. 1, a build plate 114 may be disposed on the carrier 111. In this case, the processing apparatus 1a may form the material layer ML on the build plate 114. As a result, the three-dimensional structural object in which the plurality of structural layers SL are stacked may be formed on the build plate 114. Namely, the processing apparatus 1a may form the three-dimensional structural object on the build plate 114 by performing the additive manufacturing on the build plate 114 (namely, performing the additive manufacturing using the material layer ML formed on the build plate 114). In other words, the processing apparatus 1a may form the three-dimensional structural object on the build plate 114 by performing the additive manufacturing to the build plate 114 by using the material layer ML formed on the build plate 114.

The processing apparatus 1a further includes a build cylinder 115. The build cylinder 115 includes at least one side wall 1151. The at least one side wall 1151 may be in contact with the build material M. In this case, the build cylinder 115 may serve as a container for housing the build material M. The at least one side wall 1151 may be in contact with the carrier 111. In this case, the build cylinder 115 may serve as a guide member for guiding the carrier 111 that is movable along the Z-axis direction. Specifically, after the structural layer SL has been built as described above (namely, after the irradiation of the formed material layer ML with the processing light EL is completed), the processing apparatus 1a lowers the carrier 111 inside the build cylinder 115 so that a new material layer ML can be formed on the carrier 111.

The processing apparatus 1a further includes a processing chamber 120. Note that the processing chamber 120 may be referred to as a processing chamber. The processing chamber 120 includes: a side wall 121 extending perpendicular to the XY plane; a bottom wall 122 and a top wall 123 extending parallel to the XY plane. The processing chamber 120 is a box-shaped structure having a cuboid shape or a cubic shape. However, the processing chamber 120 may be a box-shaped structure having another shape. For example, the processing chamber 120 may be a box structure having a cylindrical shape, a conical shape, or a pyramid shape.

The processing chamber 120 forms a chamber space SP120 therein. The chamber space SP120 is a space surrounded by the side wall 121, the bottom wall 122, and the top wall 123. The processing chamber 120 fulfills a housing function for maintaining a spatially, atmospherically, and fluidically closed (or substantially closed) processing environment within the chamber space SP120.

The processing chamber 120 may not be hermetically sealed to a space outside the processing chamber 120. For example, an opening that may serve as at least one of a gas inlet and a gas outlet may be formed in the side wall 121 of the processing chamber 120. For example, an opening 1231 through which the processing light EL emitted from the beam scanning apparatus 2 is allowed to pass may be formed in the top wall 123 of the processing chamber 120. As a result, the processing light EL emitted from the beam scanning apparatus 2 may enter the chamber space SP120 inside the processing chamber 120 through the opening 1231. Alternatively, the processing chamber 120 may not include the top wall 123. For example, an opening 1221 through which the processing light EL entering the chamber space SP120 is allowed to pass may be formed in the bottom wall 122. Alternatively, the processing chamber 120 may not include the bottom wall 122. A gas flow may be formed in processing chamber 120. FIG. 1 illustrates an example of the flow direction of the gas flow GF. The flow direction of the gas flow GF is not limited to the direction illustrated in FIG. 1, and may be the X direction, any direction within the XY plane, or any other direction.

The build cylinder 115 directly adjoins the processing chamber 120. Especially, the build cylinder 115 directly adjoins the processing chamber 120 below the processing chamber 120. Specifically, the build cylinder 115 adjoins the opening 1221 formed in the bottom wall 122 of the processing chamber 120. As a result, the material layer ML is irradiated with the processing light EL emitted from the beam scanning apparatus 2 through the opening 1221. The build cylinder 115 may be attached to the processing chamber 120. For example, the build cylinder 115 is attached to the processing chamber 120 so that the build cylinder 115 is fixed to the processing chamber 120. As a result, the material layer ML formed on the carrier 111 located in the build cylinder 115 substantially faces the chamber space SP120 inside the processing chamber 120. In other words, the material layer ML is substantially located in the chamber space SP120 inside the processing chamber 120. Therefore, the chamber space SP120 may be substantially a space in which the material layer ML is processed (namely, in which the additive manufacturing is performed). However, the build cylinder 115 may be attached to the processing chamber 120 in a detachable state from the processing chamber 120. Alternatively, the build cylinder 115 may not directly adjoin the processing chamber 120. For example, the build cylinder 115 may be attached to the processing chamber 120 so that the processing chamber 120 is opened at least partially.

A carrier plate 133 is disposed above the processing chamber 120, and the beam scanning apparatus 2 is disposed on the carrier plate 133. The processing apparatus 1a dose not need to include the carrier plate 133. In this case, the beam scanning apparatus 2 may be placed on the top wall 123 of the processing chamber 120 or the beam scanning apparatus 2 may be supported by a member included in the processing apparatus 1a. As illustrated in FIG. 31, the beam scanning apparatus 2 may be disposed above the processing chamber 120. In these case, the beam scanning apparatus 2 emits the processing light EL downwardly from the beam scanning apparatus 2. Specifically, the beam scanning apparatus 2 emits the processing light EL toward the material layer ML located below the beam scanning apparatus 2. Since the material layer ML is processed by the processing light EL, a processed position at which the material layer ML is processed is located below the beam scanning apparatus 2. The processing position may be referred to as an irradiation position of the processing light EL.

As illustrated in FIG. 1, an air gap is provided between the processing chamber 120 and the carrier plate 133 so that the processing chamber 120 and the carrier plate 133 are thermally decoupled from each other. As a result, the processing chamber 120 and the beam scanning apparatus 2 are thermally and mechanically decoupled from each other. Therefore, there is a low possibility that a relative positional relationship between the processing chamber 120 (especially the lower part of the processing chamber 120 where the material layer ML is formed) and the beam scanning apparatus 2 unintentionally changes in the build period during which the build operation for building the three-dimensional structural object is performed. In other words, there is a low possibility that the beam scanning apparatus 2 moves unintentionally relative to the processing chamber 120 in the build period. Thus, a build accuracy of the three-dimensional structural object is improved. As a result, a quality of the built three-dimensional structural object is improved.

Note that gas may flow into the air gap between the processing chamber 120 and the carrier plate 133. This gas may be used to adjust a temperature of (for example, cool) t at least one of the processing chamber 120 and the carrier plate 133 (the beam scanning apparatus 2 in some cases). The carrier plate 133 may form a part of the processing chamber 120, typically the top wall 123 of the processing chamber 120. The beam scanning apparatus 2 may be provided on the ceiling of the processing chamber 120.

The control apparatus 3 is configured to control an operation of the processing apparatus 1a. For example, the control apparatus 3 may be configured to control the movement of the carrier 111 by the carrier movement apparatus 113. Namely, the control apparatus 3 may be configured to control the carrier movement apparatus 113. For example, the control apparatus 3 may be configured to control the formation of the material layer ML by the material application apparatus 112. Namely, the control apparatus 3 may be configured to control the material application apparatus 112. For example, the control apparatus 3 may be configured to control the irradiation of the processing light EL by the beam scanning apparatus 2. Namely, the control apparatus 3 may be configured to control the beam scanning apparatus 2.

The control apparatus 3 may include an arithmetic apparatus 31 and a storage apparatus 32, for example. The arithmetic apparatus 31 may include at least one of a CPU (Central Processing Unit) and a GPU (Graphic Processing Unit), for example. The storage apparatus 32 may include a memory. The control apparatus 3 serves as an apparatus for controlling the operation of the processing apparatus 1a by means of the arithmetic apparatus 31 executing a computer program. The computer program is a computer program that allows the arithmetic apparatus 31 to execute (namely, to perform) a below-described operation that should be executed by the control apparatus 3. Namely, the computer program is a computer program that allows the control apparatus 3 to function so as to make the processing apparatus 1a execute the below-described operation. The computer program executed by the arithmetic apparatus 31 may be recorded in the storage apparatus 32 (namely, a recording medium) of the control apparatus 3, or may be recorded in any recording medium (for example, a hard disk or a semiconductor memory) that is built in the control apparatus 3 or that is attachable to the control apparatus 3. Alternatively, the arithmetic apparatus 31 may download the computer program that should be executed from an apparatus external to the control apparatus 3. Note that the storage apparatus 32 may be referred to as a recording apparatus.

For example, the control apparatus 3 may be disposed at the outside of the processing apparatus 1a as a server or the like. In this case, the control apparatus 3 may be connected to the processing apparatus 1a through a wired and / or wireless network (alternatively, a data bus and / or a communication line). A network using a serial-bus-type interface such as at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485 and USB may be used as the wired network. A network using a parallel-bus-type interface may be used as the wired network. A network using an interface that is compatible to Ethernet (registered trademark) such as at least one of 10-BASE-T, 100BASE-TX or 1000BASE-T may be used as the wired network. A network using an electrical wave may be used as the wireless network. A network that is compatible to IEEE802.1x (for example, at least one of a wireless LAN and Bluetooth (registered trademark)) is one example of the network using the electrical wave. A network using an infrared ray may be used as the wireless network. A network using an optical communication may be used as the wireless network. In this case, the control apparatus 3 and the processing apparatus 1a may be configured to transmit and receive various information through the network. Moreover, the control apparatus 3 may be configured to transmit information such as a command and a control parameter to the processing apparatus 1a through the network. The processing apparatus 1a may include a receiving apparatus that is configured to receive the information such as the command and the control parameter from the control apparatus 3 through the network. The processing apparatus 1a may include a transmission apparatus that is configured to transmit the information such as the command and the control parameter to the control apparatus 3 through the network. Note that an apparatus including the processing apparatus 1a and the control apparatus 3 may be referred to as a processing system.

Alternatively, the control apparatus 3 may be disposed in the processing apparatus 1a. Namely, the processing apparatus 1a may include the control apparatus 3. Alternatively, a first control apparatus that is configured to perform a part of the arithmetic processing performed by the control apparatus 3 may be disposed in the processing apparatus 1a and a second control apparatus that is configured to perform another part of the arithmetic processing performed by the control apparatus 3 may be disposed at an outside of the processing apparatus 1a.

An arithmetic model that can be built by a machine learning may be implemented in the control apparatus 3 by the arithmetic apparatus 31 executing a computer program. For example, an arithmetic model including a neural network (so-called Artificial Intelligence (AI)) is one example of the arithmetic model that can be constructed by the machine learning. In this case, a learning of the arithmetic model may include a learning of parameters of the neural network (for example, at least one of weights and biases). The control apparatus 3 may control the operation of the processing apparatus 1a by using the arithmetic model. Namely, the operation for controlling the operation of the processing apparatus 1a may include an operation for controlling the operation of the processing apparatus 1a by using the arithmetic model. Incidentally, the arithmetic model that has already been built by an off-line machine learning using teaching data may be implemented in the control apparatus 3. Moreover, the arithmetic model implemented in the control apparatus 3 may be updated by an online machine learning on the control apparatus 3. Alternatively, the control apparatus 3 may control the operation of the processing apparatus 1a by using an arithmetic model implemented in an apparatus external to the control apparatus 3 (namely, an apparatus external to the processing apparatus 1a), in addition to or instead of the arithmetic model implemented in the control apparatus 3.

Note that at least one of an optical disc such as a CD-ROM, a CD-R, a CD-RW, a flexible disc, a MO, a DVD-ROM, a DVD-RAM, a DVD-R, a DVD+R, a DVD-RW, a DVD+RW and a Blu-ray (registered trademark), a magnetic disc such as a magnetic tape, an optical-magnetic disc, a semiconductor memory such as a USB memory, and another medium that is configured to store the program may be used as the recording medium recording therein the computer program that should be executed by the control apparatus 3. The recording medium may include a device that is configured to record the computer program (for example, a device for a universal use or a device for an exclusive use in which the computer program is embedded to be executable in a form of at least one of a software, a firmware and the like). Moreover, various arithmetic processing or functions included in the computer program may be realized by a logical processing block that is realized in the control apparatus 3 by means of the control apparatus a (namely, a computer) executing the computer program, may be realized by a hardware such as a predetermined gate array (for example, a FPGA (Field Programmable Gate Array, an ASIC (Application Specific Integrated Circuit), and so on) of the control apparatus 3, or may be realized in a form in which the logical processing block and a partial hardware module that realizes a partial element of the hardware are combined.

(1-2) Configuration of Beam Scanning Apparatus 2
Next, with reference to FIG. 2 to FIG. 3, a configuration of the beam scanning apparatus 2 will be described. FIG. 2 is a perspective view that illustrates the configuration of the beam scanning apparatus 2. FIG. 3 is a cross-sectional view that illustrates the configuration of the beam scanning apparatus 2. Note that the configuration of the beam scanning apparatus 2 illustrated in FIG. 2 to FIG. 3 is one example, and the configuration of the beam scanning apparatus 2 is not limited to the configuration illustrated in FIG. 2 to FIG. 3.
As illustrated in FIG. 2 to FIG. 3, the beam scanning apparatus 2 includes a condensing optical system 21, a beam split member 22, a scanning optical member 23, a light receiving apparatus 24, and a housing 25.

The condensing optical system 21, the beam split member 22, and the scanning optical member 23 are contained in a containing space SP25 in the housing 25. On the other hand, the light receiving apparatus 24 may not be contained in the containing space SP25. The light receiving apparatus 24 may be located in a space outside the housing 25. However, the light receiving apparatus 24 may be contained in the containing space SP25. Note that FIG. 2 is a diagram in which the housing 25 is illustrated as a transparent housing in order to illustrate the condensing optical system 21, the beam split member 22, and the scanning optical member 23 contained in the containing space SP25.

The housing 25 includes: a bottom wall 2540 that extends parallel to the XY plane; a side wall 2550 a lower end (an end at the -Z side) of which is connected to the bottom wall 2540 and that extends perpendicular to the XY plane; and a top wall 2560 that is connected to an upper (top) end (an end at the +Z side) of the side wall 2550 and that extends parallel to the XY plane. Thus, the housing 25 is a box-shaped structure having a cuboid shape or a cubic shape. However, the housing 25 may be a box-shaped structure having another shape. The housing 25 or parts of the housing 25 may be made of a low thermal expansion member such as Invar, or may be made of aluminum, stainless steel or combinations. Further, part of the plurality of members belonging to the housing may be made from a different material from other part. When the plurality of members are formed of different materials, one or more flexures may be formed in at least one of the members to reduce distortion due to differences in coefficients of thermal expansion.

At least one opening is formed in the housing 25. The opening is an opening that spatially connects the containing space SP25 and a space outside the housing 25. In the below-described description, an example in which three openings 251, 252 and 253 are formed in the housing 25 will be described, as illustrated in FIG. 2 to FIG. 3.

Specifically, the opening 251 that corresponds to a through-hole penetrating the bottom wall 2540 is formed in the bottom wall 2540 of the housing 25. Namely, the opening 251 is formed in the bottom surface 2541 that is an outer surface of the bottom wall 2540. Note that the bottom surface 2541 is a surface (an outer surface) of the bottom wall 2540 facing downwardly. The bottom surface 2541 is a surface (an outer surface) of the bottom wall 2540 intersecting with the Z-axis direction that is the gravity direction. The bottom surface 2541 is a surface (an outer surface) of the bottom wall 2540 facing downwardly along the Z-axis direction that is the gravity direction.

Furthermore, the opening 252 that corresponds to a through-hole penetrating the side wall 2550 is formed in the side wall 2550 of the housing 25. Namely, the opening 252 is formed in a side surface 2551 that is an outer surface of the side wall 2550. Note that the side surface 2551 is a surface (an outer surface) of the side wall 2550 facing sideways. The side surface 2551 is a surface (an outer surface) of the side wall 2550 intersecting with a crossing direction (for example, a direction along the XY plane) that is a direction intersecting with the gravity direction. The side surface 2551 is a surface (an outer surface) of the side wall 2550 facing toward the crossing direction (for example, the direction along the XY plane) that is the direction intersecting with the gravity direction.

As such, a normal of the bottom wall 2540 and a normal of the side wall 2550 may intersect, typically perpendicular to each other.

Furthermore, the opening 253 that corresponds to a through-hole penetrating the top wall 2560 is formed in the top wall 2560 of the housing 25. Namely, the opening 253 is formed in a top surface 2561 that is an outer surface of the top wall 2560. Note that the top surface 2561 is a surface (an outer surface) of the top wall 2560 facing upwardly. The top surface 2561 is a surface (an outer surface) of the top wall 2560 intersecting with the Z-axis direction that is the gravity direction. The top surface 2561 is a surface (an outer surface) of the top wall 2560 facing upwardly along the Z-axis direction that is the gravity direction.

The processing light EL emitted by the beam scanning apparatus 2 toward the material layer ML is supplied to the beam scanning apparatus 2 from a light source 4 of the processing apparatus 1a (alternatively, a light source 4 external to the processing apparatus 1a). The light source 4 generates the processing light EL. In the first embodiment, an example in which the light source 4 generates infrared light as the processing light EL will be described. Namely, the light source 4 generates the processing light EL whose peak wavelength is 1000 nm or a wavelength in the vicinity of 1000 nm. In other words, the light source 4 generates the processing light EL in a wavelength bandwidth in which the peak wavelength is 1000 nm or the wavelength in the vicinity of 1000 nm. However, the light source 4 may generate light different from the infrared light as the processing light EL. For example, the light source 4 may generate at least one of visible light and ultraviolet light as the processing light EL.

In the first embodiment, a light source that is configured to change a cross-sectional intensity profile (cross-sectional power distribution) of the processing light EL to be emitted may be used as the light source 4. One example of the light source that is configured to change the cross-sectional intensity profile of the processing light EL to be emitted is disclosed in each of US10,423,015B and WO2023/056435A, for example.

The processing light EL generated by the light source 4 is supplied from the light source 4 to the beam scanning apparatus 2. In the below-described description, an example in which the processing light EL is supplied from the light source 4 to the beam scanning apparatus 2 through or via an optical fiber 5 will be described, as illustrated in FIG. 3. The optical fiber 5 may be referred to as a beam transmission member. Incidentally, the optical fiber 5 is omitted in FIG. 2 for convenience of illustration. However, the processing light EL may be supplied from the light source 4 to the beam scanning apparatus 2 by using a method different from a method using the optical fiber 5.

In order to supply the processing light EL from the light source 4 to the beam scanning apparatus 2 through the optical fiber 5, a connecting member 2552 to which the optical fiber 5 is connected is attached to the housing 25. In the example illustrated in FIG. 3, the connecting member 2552 is an optical connector in which a fiber insertion port, into which an emission end 51 of the optical fiber 5 is allowed to be inserted, is formed. The fiber insertion port may be referred to as a fiber connection port. In this case, the emission end 51 of the optical fiber 5 may serve as an optical connector that is allowed to be inserted into the fiber insertion port of the connecting member 2552. Therefore, in the example illustrated in FIG. 3, the connecting member 2552 serves as a female-type optical connector and the emission end 51 of the optical fiber 5 serves as a male-type optical connector.

Especially in the first embodiment, the connecting member 2552 may be attached to the side surface 2551 of the housing 25. In other words, the connecting member 2552 may be attached to the side wall 2550 or may be formed on the side wall 2550. Specifically, the connecting member 2552 may be attached to the side surface 2551 so that the fiber insertion port of the connecting member 2552 and the opening 252 are spatially or optically connected to each other. The connecting member 2552 may be attached to the side surface 2551 so that the opening 252 is located on an optical path of the processing light EL emitted from the optical fiber 5 connected to the connecting member 2552. Especially, the connecting member 2552 is attached to the side surface 2551 so that an insertion direction of the optical fiber 5 to the fiber insertion port of the connecting member 2552 is a direction along the XY plane (in the example illustrated in FIG. 3, the Y-axis direction). In this case, as illustrated in FIG. 3, the emission end 51 of the optical fiber 5 is inserted into (namely, connected to) the connecting member 2552 from a lateral side of the connecting member 2552.

As a result, the processing light EL propagating from the light source 4 through the optical fiber 5 enters the beam scanning apparatus 2 through the opening 252. Specifically, the processing light EL propagating from the light source 4 through the optical fiber 5 enters the beam scanning apparatus 2 through the opening 252 from the emission end 51 of the optical fiber 5 connected to the connecting member 2552. Namely, the processing light EL enters the containing space SP25 inside the housing 25 through the opening 252.

Furthermore, in the first embodiment, an optical window 2520 is disposed in the opening 252. The optical window 2520 is an optical member that transmits the processing light EL. The optical window 2520 is an optical member that does not have an optical power (namely, does not have a refractive power). However, the optical window 2520 may be an optical member that has an optical power (namely, has a refractive power). In a case where the optical window 2520 is disposed in the opening 252, the processing light EL emitted from the optical fiber 5 enters the beam scanning apparatus 2 through the optical window 2520. The processing light EL emitted from the optical fiber 5 passes through (is transmitted through) the optical window 2520 and enters the beam scanning apparatus 2. In the below-described description, a surface of the optical window 2520 to which the processing light EL emitted from the optical fiber 5 enters is referred to as an “entrance surface 2521”. In the example illustrated in FIG. 2 and FIG. 3, a surface of the optical window 2520 facing sideways (especially, facing toward +Y side) is the entrance surface 2521.

In a case where the optical window 2520 is disposed in the opening 252 in this manner, there is a lower possibility that unnecessary material (for example, dust or dirt) existing outside (exterior of) the housing 25 enters the containing space SP25 inside (interior of) the housing 25 through the opening 252, compared to a case where the optical window 2520 is not disposed in the opening 252. If the unnecessary material entering the containing space SP25 blocks a part of the processing light EL, there is a possibility that a characteristic (for example, an intensity or an intensity distribution) of the processing light EL unintentionally varies. As a result, there is a possibility that such a technical problem arises that the processing apparatus 1a cannot properly perform the additive manufacturing. For example, there is a possibility that such a technical problem arises that the build accuracy or the build speed of the three-dimensional structural object by the processing apparatus 1a deteriorates. However, in a case where the optical window 2520 is disposed at the opening 252, there is a low possibility that such a technical problem arises. As a result, the processing apparatus 1a can properly perform the additive manufacturing. For example, the processing apparatus 1a can build the three-dimensional structural object with high build accuracy and / or with high build speed.

However, the optical window 2520 may not be disposed in the opening 252. Even in this case, the fact remains that the beam scanning apparatus 2 can emit the processing light EL toward the material layer ML.

The processing light EL entering the beam scanning apparatus 2 through the optical window 2520 enters the condensing optical system 21. The condensing optical system 21 is an optical system that condenses the processing light EL that has entered the beam scanning apparatus 2. Specifically, the condensing optical system 21 is an optical system that condenses the processing light EL that has entered the beam scanning apparatus 2 onto the material layer ML.

Especially, in the first embodiment the processing light EL with a divergent state enters the condensing optical system 21. Namely, the processing light EL that is divergent light enters the condensing optical system 21. In this case, the condensing optical system 21 condenses the processing light EL that has entered the beam scanning apparatus 2 in the divergent state. Namely, the condensing optical system 21 condenses the processing light EL that is the divergent light.

However, the condensing optical system 21 may condense the processing light EL that has entered the beam scanning apparatus 2 with a convergent state (divergence state). Namely, the condensing optical system 21 may condense the processing light EL that is convergent light (converged light). Alternatively, the condensing optical system 21 may condense the processing light EL that has entered the beam scanning apparatus 2 as collimated light. Namely, the condensing optical system 21 may condense the processing light EL that is the collimated light.

Here, with reference to FIG. 4 in along with FIG. 2 to FIG. 3, a configuration of the condensing optical system 21 will be described. FIG. 4 is a cross-sectional view that illustrates the configuration of the condensing optical system 21.

As illustrated in FIG. 2 to FIG. 4, the condensing optical system 21 includes a front group optical system 211, a rear group optical system 212, a reflective mirror (a reflective member) 2131 and a reflective mirror (a reflective member) 2132.

The front group optical system 211 condenses the processing light EL that has entered the front group optical system 211 in the divergent state. Specifically, the front group optical system 211 cooperates with the rear group optical system 212 to condense the processing light EL that has entered the front group optical system 211 in the divergent state. Especially, the front group optical system 211 cooperates with the rear group optical system 212 to condense the processing light EL, which has entered the front group optical system 211 in the divergent state, onto the material layer ML.

The processing light EL emitted from the front group optical system 211 enters the reflective mirror 2131. Thus, the front group optical system 211 emits the processing light EL toward the reflective mirror 2131. The reflective mirror 2131 reflects the processing light EL entering the reflective mirror 2131. Specifically, the reflective mirror 2131 reflects the processing light EL entering reflective mirror 2131 toward the reflective mirror 2132. As a result, the processing light EL reflected by the reflective mirror 2131 enters the reflective mirror 2132. The reflective mirror 2132 reflects the processing light EL entering the reflective mirror 2132. Specifically, the reflective mirror 2132 reflects the processing light EL entering the reflective mirror 2132 toward the rear group optical system 212. As a result, the processing light EL reflected by the reflective mirror 2132 enters the rear group optical system 212.

Here, the reflective mirror 2131 reflects the processing light EL, which propagates along an optical axis of the front group optical system 211 (in the examples illustrated in FIG. 2 to FIG. 4, an optical axis along the Y-axis), toward a direction that intersects with the optical axis of the front group optical system 211 so that the optical path of the processing light EL is turned back. Especially, the reflective mirror 2131 reflects the processing light EL so that the optical path of the processing light EL from the reflective mirror 2131 to the reflective mirror 2132 is located between the front group optical system 211 and the rear group optical system 212. Furthermore, the reflective mirror 2132 reflects, toward the rear group optical system 212, the processing light EL propagating from the reflective mirror 2131 so that the optical path of the processing light EL is turned back.

Since the optical path of the processing light EL is folded into an Z shape with the reflective mirrors 2131 ad 2132, a size of the condensing optical system 21 itself is smaller. Specifically, in a case where the processing light EL emitted from the front group optical system 211 enters the rear group optical system 212 via the reflective mirrors 2131 and 2132, the size of the condensing optical system 21 in a direction (in the example illustrated in FIG. 2 to FIG. 4, the Y-axis direction) along the optical axis of the optical system 21 is smaller, compared to the case where the processing light EL emitted from the front group optical system 211 enters the rear group optical system 212 without passing through the reflective mirrors 2131 and 2132. As a result, the size of the housing 25 that contains the condensing optical system 21 is also smaller. As a result, the beam scanning apparatus 2 can be downsized.

The reflective mirror 2131 may be disposed above (namely, at the +Z side of) the rear group optical system 212. The reflective mirror 2131 may be disposed above the reflective mirror 2132. The reflective mirror 2132 may be disposed below (namely, at the -Z side of) the front group optical system 211. The reflective mirror 2132 may be disposed below the reflective mirror 2131. In this case, the reflective mirror 2131 may reflect the processing light EL emitted from the front group optical system 211 toward the reflective mirror 2132 located diagonally below the reflective mirror 2131. The reflective mirror 2132 may reflect the processing light EL reflected by the reflective mirror 2131, which is located diagonally above the reflective mirror 2132, toward the rear group optical system 212. In this case, an optical path of the processing light EL emitted from the front group optical system 211 may be located above an optical path of the processing light EL emitted from the rear group optical system 212. In other words, the front group optical system 211 may be disposed above the rear group optical system 212. Conversely, the optical path of the processing light EL emitted from the rear group optical system 212 may be located below the optical path of the processing light EL emitted from the front group optical system 211. Namely, the rear group optical system 212 may be disposed below the front group optical system 211. Since the reflecting mirrors 2131 and 2132 are deflecting mirrors that fold the optical path and / or the optical axis, they may be called folding mirrors.

The rear group optical system 212 condenses the processing light EL from the front group optical system 211. Namely, the rear group optical system 212 condenses the processing light EL that has entered the rear group optical system 212 from the front group optical system 211 via the reflective mirrors 2131 and 2132. Specifically, the rear group optical system 212 condenses the processing light EL onto the material layer ML.

In order to condense the processing light EL entering the condensing optical system 21 (especially, the front group optical system 211) in the divergent state, the front group optical system 211 includes a movable lens 2111 and a fixed lens 2112, as illustrated in FIG. 2 to FIG. 4. Furthermore, the rear group optical system 212 includes a movable lens 2121 and a fixed lens 2122.

The movable lens 2111 is a positive lens. Namely, the movable lens 2111 is a lens having a positive optical power (in other words, having a positive refractive power). Furthermore, the movable lens 2111 is a lens that is movable along a direction (in the example illustrated in FIG. 2 to FIG. 4, the Y-axis direction) that is along an optical axis of the movable lens 2111. Thus, as illustrated in FIG. 2, the processing apparatus 1a may include an actuator 2141 that serve as a driving member for driving (in other words, moving) the movable lens 2111. Incidentally, in FIG. 3 and FIG. 4, the actuator 2141 is omitted for convenience of illustration.

The fixed lens 2112 is a lens that is fixed so that its location does not change. Specifically, the fixed lens 2112 is a lens that is stationary with respect to the optical path of the processing light EL transmitted through the fixed lens 2112. Namely, the fixed lens 2112 is a lens that is fixed so that a positional relationship between the beam split member 22 and the fixed lens 2112 does not change (in other words, is maintained).

The movable lens 2121 is a negative lens. Namely, the movable lens 2121 is a lens having a negative optical power (in other words, having a negative refractive power). However, the movable lens 2121 may be a positive lens. Furthermore, the movable lens 2121 is a lens that is movable along a direction (in the example illustrated in FIG. 2 to FIG. 4, the Y-axis direction) that is along an optical axis of the movable lens 2121. Thus, the processing apparatus 1a may include an actuator 2142 that serve as a driving member for driving (in other words, moving) the movable lens 2121, as illustrated in FIG. 2. Incidentally, in FIG. 3 and FIG. 4, the actuator 2142 is omitted for convenience of illustration.

The fixed lens 2122 is a positive lens. Namely, the fixed lens 2122 is a lens having a positive optical power (in other words, having a positive refractive power). Furthermore, the fixed lens 2122 is a lens that is fixed so that its location does not change. Specifically, the fixed lens 2112 is a lens that is stationary with respect to the optical path of the processing light EL transmitted through the fixed lens 2122. Namely, the fixed lens 2122 is a lens that is fixed so that a positional relationship between the beam split member 22 and the fixed lens 2122 does not change (in other words, is maintained).

The processing light EL that has entered the condensing optical system 21 (especially, the front group optical system 211) in the divergent state enters the movable lens 2111. The movable lens 2111 transmits at least a part of the processing light EL that has entered the movable lens 2111. Here, the movable lens 2111 is an entrance optical member disposed at a position closest to the entrance side among the plurality of optical members of the condensing optical system 21. Here, if the movable lens 2111, which is the entrance optical member, is a negative lens, the processing light EL in the divergent state is further diverged by the movable lens 2111. Namely, a divergence angle of the processing light EL transmitted through the movable lens 2111 is larger than a divergence angle of the processing light EL entering the movable lens 2111. As a result, there is a possibility that the processing light EL is diverged so excessively that a part of the processing light EL transmitted through the movable lens 2111 does not enter at least one of the fixed lens 2112, the movable lens 2121, and the fixed lens 2122. However, in the first embodiment, since the movable lens 2111 is the positive lens, the processing light EL in the divergent state is not further diverged by the movable lens 2111. Namely, the divergence angle of the processing light EL transmitted through the movable lens 2111 is not larger than the divergence angle of the processing light EL entering the movable lens 2111. As a result, there is a low possibility that the processing light EL is diverged so excessively that a part of the processing light EL transmitted through the movable lens 2111 does not enter at least one of the fixed lens 2112, the movable lens 2121 and the fixed lens 2122. As a result, loss of the processing light EL is reduced. However, in a case where such a technical problem does not arise, the movable lens 2111 may be the negative lens.

The processing light EL transmitted through the movable lens 2111 enters the fixed lens 2112. The fixed lens 2112 transmits at least a part of the processing light EL that has entered the fixed lens 2112. FIG. 4 illustrates an example in which the fixed lens 2112 is a negative lens, however, the fixed lens 2112 may be a positive lens.

The processing light EL transmitted through the fixed lens 2112 enters the movable lens 2121 via the reflective mirrors 2131 and 2132. The movable lens 2121 transmits at least a part of the processing light EL that has entered the movable lens 2121. The processing light EL transmitted through the movable lens 2121 enters the fixed lens 2122.

Here, a length of the optical path of the processing light EL between the movable lens 2121 and the movable lens 2111 may be longer than a length of the optical path of the processing light EL between the movable lens 2121 and the fixed lens 2122. In other words, a distance between the movable lens 2121 and the movable lens 2111 along the optical path of the processing light EL between the movable lens 2121 and the movable lens 2111 may be longer than a distance between the movable lens 2121 and the fixed lens 2122 along the optical path of the processing light EL between the movable lens 2121 and the fixed lens 2122.

The fixed lens 2122 transmits at least a part of the processing light EL that has entered the fixed lens 2122. The processing light EL transmitted through the fixed lens 2122 enters the beam split member 22. Here, the fixed lens 2122 is a terminal optical member disposed at a position closest to an emission side among the plurality of optical members of the condensing optical system 21. Thus, if the fixed lens 2122 is a negative lens, there is a possibility that the condensing optical system 21 (especially, the rear group optical system 212) is unable to condense the processing light EL. This is because there is a possibility that the processing light EL transmitted through the fixed lens 2122 becomes the divergent light. Thus, in the first embodiment, the positive lens is used as the fixed lens 2122 that is the terminal optical member, the fixed lens 2122, as described above. As a result, the condensing optical system 21 (especially, the rear group optical system 212) can properly condense the processing light EL. In order to extend the back focus of the condensing optical system 21, the fixed lens 2122 as the terminal optical member may have a negative refractive power. At this time, the movable lens 2121 may have a positive refractive power.

The condensing optical system 21 forms no condensed point between the entrance optical member (in the example illustrated in FIG. 2 to FIG. 4, the movable lens 2111) and the terminal optical member (in the example illustrated in FIG. 2 to FIG. 4, the fixed lens 2122). In this case, there is low possibility that the optical member of the condensing optical system 21 (for example, at least one of the movable lens 2111, the fixed lens 2112, the movable lens 2121, the fixed lens 2122, the reflective mirror 2131 and the reflective mirrors 2131) is irradiated with the processing light EL, which is intense because it is in a condensed state. As a result, there is a low possibility that the processing light EL, whose intensity is high because it is in the condensed state, damages the optical member of the condensing optical system 21. However, the condensing optical system 21 may form the condensed point between the entrance optical member (in the example illustrated in FIG. 2 to FIG. 4, the movable lens 2111) and the terminal optical member (in the example illustrated in FIG. 2 to FIG. 4, the fixed lens 2122). The condensing optical system 21 may have one or more apertures that define the beam diameter of the processing light EL. One or more apertures may be arranged at least one of location on the incident side of the movable lens 2111 and location(s) around the fixed lens 2122 . The one or more apertures may be temperature adjusted by a temperature adjustment apparatus of FIG. 10 described later.

The beam scanning apparatus 2 may change at least one of a condensed position of the processing light EL and a spot size of the processing light EL by moving at least one of the movable lenses 2111 and 2121 by using at least one of the actuators 2141 and 2142 under the control of the control apparatus 3. The spot size of the processing light EL may mean a size of a beam spot formed by the processing light EL on a surface of an object (for example, the material layer ML) that is irradiated with the processing light EL. Namely, the spot size of the processing light EL may mean the size of an irradiation area (namely, the beam spot) that is irradiated with the processing light EL on the surface of the object (for example, the material layer ML).

Especially in the first embodiment, the beam scanning apparatus 2 may change the condensed position of the processing light EL and the spot size of the processing light EL by moving the movable lenses 2111 and 2121 by using actuators 2141 and 2142 under the control of the control apparatus 3. For example, the beam scanning apparatus 2 may simultaneously change the condensed position of the processing light EL and the spot size of the processing light EL by moving the movable lenses 2111 and 2121 simultaneously. For example, the beam scanning apparatus 2 may synchronously change the condensed position of the processing light EL and the spot size of the processing light EL by synchronously moving the movable lenses 2111 and 2121. For example, the beam scanning apparatus 2 may change the condensed position of the processing light EL and the spot size of the processing light EL by moving one of the movable lenses 2111 and 2121 and then moving the other of the movable lenses 2111 and 2121.

The beam scanning apparatus 2 may change the condensed position of the processing light EL and the spot size of the processing light EL so that the condensed position of the processing light EL is set at a desired position and the spot size of the processing light EL is a desired size. For example, as described in detail later, the beam scanning apparatus 2 scans or sweeps the surface of the material layer ML with the processing light EL by using the scanning optical member 23. Namely, the beam scanning apparatus 2 moves the irradiation area that is irradiated with the processing light EL on the surface of the material layer ML by using the scanning optical member 23. In this case, if the condensed position of the processing light EL is kept to be fixed, there is a possibility that a state of the beam scanning apparatus 2 changes between a first state in which the material layer ML is irradiated with the processing light EL in a focused state and a second state in which the material layer ML is irradiated with the processing light EL in a defocused state. Note that the focus state may mean a state in which the condensed position of the processing light EL is located on the surface of the uppermost material layer ML (or near the surface of the topmost material layer ML). The defocused state may mean a state in which the condensed position of the processing light EL is away by a certain distance or more from the surface of the topmost material layer ML (or the vicinity of the surface of the topmost material layer ML). As a result, the intensity of the processing light EL may unintentionally vary on the surface of the material layer ML along with the scanning of the processing light EL by the scanning optical member 23 due to a difference between the intensity of the processing light EL in the defocused state on the surface of the topmost material layer ML and the intensity of the processing light EL in the focused state on the surface of the topmost material layer ML. Such variation in the intensity of the processing light EL may result in a deterioration of the build accuracy. Thus, the beam scanning apparatus 2 may change the condensed position of the processing light EL and the spot size of the processing light EL so that the condensed position of the processing light EL is located on the surface of the topmost material layer ML (or near the surface of the topmost material layer ML) and the spot size of the processing light EL is the desired size, along with the scanning of the processing light by the scanning optical member 23. As a result, there is a low possibility that the intensity of the processing light EL varies unintentionally on the surface of the material layer ML along with the scanning of the processing light EL by the scanning optical member 23. As a result, the processing apparatus 1a can build the three-dimensional structural object with high build accuracy. In the case of building using the defocused processing light EL, the beam scanning apparatus 2 may be controlled so that the condensing position of the processing light EL is located on the surface defocused from the surface of the uppermost material layer ML during the scanning of the processing light EL by the scanning optical member 23.

The beam scanning apparatus 2 may change the condensed position of the processing light EL and the spot size of the processing light EL so that the spot size of the processing light EL is maintained constant even in a case where the condensed position of the processing light EL is changed. Specifically, a variation of the spot size of the processing light EL on the surface of the material layer ML results in the variation of the intensity of the processing light EL on the surface of the material layer ML. This is because the intensity of the processing light EL per unit area (namely, an influence of the processing light EL) is smaller as the spot size is larger. Thus, the beam scanning apparatus 2 may change the condensed position of the processing light EL and the spot size of the processing light EL so that the condensed position of the processing light EL is located on the surface of the topmost material layer ML (or near the surface of the topmost material layer ML) and the spot size of the processing light EL is maintained constant, along with the scanning of the processing light EL by the scanning optical member 23. As a result, there is a low possibility that the intensity of the processing light EL varies unintentionally on the surface of the material layer ML along with the scanning of the processing light EL by the scanning optical member 23. As a result, the processing apparatus 1a can build the three-dimensional structural object with high build accuracy.

When the optical path of the processing light EL between the movable lens 2111 and the movable lens 2121 is short, there is a possibility that large aberration will occur. However, in the first embodiment, since the optical path of the processing light EL between the movable lens 2111 and the movable lens 2121 is lengthened, the aberration of the beam scanning apparatus 2 can be reduced.

Moreover, it is possible to reduce the moving distance of at least one of the movable lenses 2111 and 2121 that is necessary to change the condensed position of the processing light EL and the spot size of the processing light EL by a certain amount by increasing the optical power (namely, by increasing a refractive power) of at least one of the movable lenses 2111 and 2121. In this case, however, there is a possibility that a relatively large aberration occurs due to the increased optical power of at least one of the movable lenses 2111 and 2121. In the first embodiment, the beam scanning apparatus 2 has a relatively longer optical path of the processing light EL between the movable lenses 2111 and 2121 instead of increasing the optical power of at least one of the movable lenses 2111 and 2121 more than necessary. As a result, the beam scanning apparatus 2 can reduce the aberration while reducing the moving distance of at least one of the movable lenses 2111 and 2121 that is necessary to change the condensed position of the processing light EL and the spot size of the processing light EL by a certain amount.

Moreover, in the first embodiment, the beam scanning apparatus 2 fixes the location of the fixed lens 2122 as the terminal optical member and moves the other lenses, in order to change the condensed position of the processing light EL and the spot size of the processing light EL as described above. Here, in a case where a numerical aperture (NA: Numerical Aperture) of the condensing optical system 21 is determined in advance, a size of the fixed lens 2122 that is the terminal optical member is larger as a working distance of the processing apparatus 1a (for example, a distance between the beam scanning apparatus 2 and the carrier 111) is longer. Considering that it is more difficult to move the fixed lens 2122 as the size of the fixed lens 2122 is larger, the beam scanning apparatus 2 has such an advantage in the first embodiment that the beam scanning apparatus 2 may remain fixed the fixed lens 2122 whose size may be relatively large.

Again in FIG. 2 to FIG. 3, the processing light EL emitted from the condensing optical system 21 enters the beam split member 22. Thus, the condensing optical system 21 is disposed between an entrance position at which the processing light EL enters the beam scanning apparatus 2 (specifically, a position at which the optical window 2520 is disposed) and the beam split member 22.

The beam split member 22 transmits at least a part of the processing light EL that has entered the beam split member 22. The processing light EL transmitted through the beam split member 22 enters the scanning optical member 23. Thus, the beam split member 22 is disposed between the condensing optical system 21 (especially, the fixed lens 2122 that is the terminal optical member thereof) and the scanning optical member 23. The beam split member 22 is disposed in the optical path of the processing light EL between the condensing optical system 21 (especially, the fixed lens 2122 that is the terminal optical member thereof) and the scanning optical member 23.

The scanning optical member 23 scans the processing light EL that has entered the scanning optical member 23 from the beam split member 22. Specifically, the scanning optical member 23 scans the surface of the material layer ML with the processing light EL. Namely, the scanning optical member 23 moves the irradiation area, which is irradiated with the processing light EL, on the surface of the material layer ML.

FIG. 2 to FIG. 3 illustrate an example in which the scanning optical member 23 is a Galvano mirror. The Galvano mirror is an optical member that changes an emission direction of the processing light EL emitted from the Galvano mirror by deflecting the processing light EL. Therefore, the Galvano mirror may be referred to as a deflection optical system.

The scanning optical member 23 that is the Galvano mirror may include a scanning mirror 231, a scanning mirror 232, and an actuator 233. Incidentally, in FIG. 3, the actuator 233 is omitted for convenience of illustration. The processing light EL from the beam split member 22 enters the scanning mirror 231. The scanning mirror 231 reflects the processing light EL that has entered the scanning mirror 231 toward the scanning mirror 232. The scanning mirror 232 reflects the processing light EL that has entered the scanning mirror 232 toward the material layer ML.

The actuator 233 includes a first actuator that serves as a driving member that is configured to drive (in other words, move) the scanning mirror 231. Specifically, the actuator 233 includes the first actuator that serves as a driving member that is configured to swing or rotate the scanning mirror 231 around a rotational axis along one of the X-axis and Y-axis. In a case where the scanning mirror 231 is swinged or rotated, the processing light EL scans the surface of the material layer ML along one of the X-axis direction and the Y-axis direction. Namely, the irradiation area that is irradiated with the processing light EL moves along one of the X-axis direction and the Y-axis direction on the surface of the material layer ML.

The actuator 233 includes a second actuator that serves as a driving member that is further configured to drive (in other words, move) the scanning mirror 232. Specifically, the actuator 233 includes the second actuator that serves as a driving member that is configured to swing or rotate the scanning mirror 232 around a rotational axis along the other of the X-axis and Y-axis. In a case where the scanning mirror 231 is swinged or rotated, the processing light EL scans the surface of the material layer ML along the other of the X-axis direction and the Y-axis direction. Namely, the irradiation area that is irradiated with the processing light EL moves along the other of the X-axis direction and the Y-axis direction on the surface of the material layer ML.

Incidentally, the scanning optical member 23 may be any optical member that is different from the Galvano mirror and that is configured to scan the processing light EL. For example, the scanning optical member 23 may be at least one of a polygon mirror, a resonant mirror, an AOD (Acousto-Optic Deflector), and EOD (Electro Optic Deflector).

The scanning optical member 23 emits the processing light EL downwardly from the scanning optical member 23. Especially, the scanning optical member 23 emits the processing light EL toward the opening 251 formed in the bottom surface 2541 of the housing 25. Conversely, the scanning optical member 23 is aligned with the housing 25 so that the opening 251 is located on the optical path of the processing light EL emitted from the scanning optical member 23. As a result, the processing light EL emitted from the scanning optical member 23 is emitted through the opening 251 toward the outside of the beam scanning apparatus 2. The processing light EL emitted from the scanning optical member 23 is emitted through the opening 251 toward the material layer ML located below the beam scanning apparatus 2. Namely, the beam scanning apparatus 2 emits the processing light EL through the opening 251.

Furthermore, in the first embodiment, an optical window 2510 is disposed in the opening 251. The optical window 2510 is an optical component that transmits the processing light EL. The optical window 2510 is an optical member that has a substantially plane-parallel shaped and that has no optical power (namely, has no refractive power). However, optical window 2510 may be an optical member that has an optical power (namely, has a refractive power). In a case where the optical window 2510 is disposed in the opening 251, the processing light EL emitted from the scanning optical member 23 is emitted through the optical window 2510 to the outside of the beam scanning apparatus 2. Namely, the beam scanning apparatus 2 emits the processing light EL from the optical window 2510.

In a case where the optical window 2510 is disposed in the opening 251 in this manner, there is a lower possibility that the unnecessary material (for example, the dust or the dirt) existing outside the housing 25 enters the containing space SP25 inside the housing 25 through the opening 251, compared to a case where the optical window 2510 is not disposed in the opening 251. If the unnecessary material entering the containing space SP25 blocks a part of the processing light EL, there is a possibility that the characteristic (for example, the intensity or the intensity distribution) of the processing light EL unintentionally varies. As a result, there is a possibility that such a technical problem arises that the processing apparatus 1a cannot properly perform the additive manufacturing. For example, there is a possibility that such a technical problem arises that the build accuracy or the build speed of the three-dimensional structural object by the processing apparatus 1a deteriorates. However, in a case where the optical window 2510 is disposed at the opening 251, there is a low possibility that such a technical problem arises. As a result, the processing apparatus 1a can properly perform the additive manufacturing. For example, the processing apparatus 1a can build the three-dimensional structural object with high build accuracy and/or with high build speed.

However, no optical window may be disposed in the opening 251. Even in this case, the fact remains that the beam scanning apparatus 2 can emit the processing light EL toward the material layer ML.

The material layer ML is irradiated with the processing light EL emitted from the beam scanning apparatus 2. As a result, the structural layer SL is formed as described above.

On the other hand, light received by the light receiving apparatus 24 may enter the optical window 2510. Thus, the optical window 2510 is an optical member that transmits the processing light EL and that transmits the light received by the light receiving apparatus 24. Specifically, as described in detail later, the control apparatus 3 is configured to observe (in other words, monitor) a state of the building of the three-dimensional structural object by the processing apparatus 1a based on a received result by the light receiving apparatus 24. Thus, light that is usable to observe (in other words, monitor) the state of the building of the three-dimensional structural object by the processing apparatus 1a may enter the optical window 2510 as the light received by the light receiving apparatus 24. For example, light from the material layer ML, which is an observation target (an observation target object), may enter the optical window 2510 as the light received by the light receiving apparatus 24 because the three-dimensional structural object is built from the material layer ML. For example, light from the melt pool, which is the observation target, may enter the optical window 2510 as the light received by the light receiving apparatus 24 because the three-dimensional structural object is built by the processing light EL forming the melt pool in the material layer ML. For example, light from the structural layer SL, which is the observation target, may enter the optical window 2510 as the light received by the light receiving apparatus 24 because the three-dimensional structural object includes the structural layer SL.

In the below-described description, the light entering the optical window 2510 as the light received by the light receiving apparatus 24 (for example, the light that is usable to observe the state of the building of the three-dimensional structural object by the processing apparatus 1a) is referred to as observation light OL. Namely, light from the observation target is referred to as the observation light OL.

The wavelength bandwidth of the observation light OL is different from the wavelength bandwidth of the processing light EL. Specifically, as described above, the processing light EL is the light in a first wavelength bandwidth whose peak wavelength is 1000 nm or the wavelength in the vicinity of 1000 nm. On the other hand, the observation light OL may be light in a second wavelength bandwidth from 400 nm to 800 nm. Namely, the observation light OL may be visible light. For example, in a case where the observation light OL includes reflected light of ambient light from the observation target, the observation light OL may normally include visible light. The observation light OL may be light in a third wavelength bandwidth from 1200 nm to 1700 nm. The observation light OL may be light in both of the second wavelength bandwidth and the third wavelength bandwidth.

Thus, in the below-described description, an example in which the wavelength bandwidth of the observation light OL is a wavelength bandwidth shorter than the wavelength bandwidth of the processing light EL will be described. Namely, an example in which the wavelength bandwidth of the processing light EL is a wavelength bandwidth longer than the wavelength bandwidth of the observation light OL will be described. However, the wavelength bandwidth of the processing light EL may be shorter than the wavelength bandwidth of the observation light OL. The wavelength bandwidth of the processing light EL may overlap at least partially with the wavelength bandwidth of the observation light OL.

The observation light OL that has entered the optical window 2510 enters the scanning optical member 23. Specifically, the observation light OL that has entered the optical window 2510 enters the scanning mirror 232 of the scanning optical member 23. The scanning mirror 232 reflects the observation light OL that has entered the scanning mirror 232 toward the scanning mirror 231. As a result, the observation light OL reflected by the scanning mirror 232 enters the scanning mirror 231. The scanning mirror 231 reflects the observation light OL that has entered the scanning mirror 231 toward the beam split member 22. As a result, the observation light OL reflected by the scanning mirror 231 enters the beam split member 22.

The beam split member 22 reflects at least a part of the observation light OL that has entered the beam split member 22. On the other hand, as described above, the beam split member 22 transmits at least a part of the processing light EL that has entered the beam split member 22. Thus, the beam split member 22 is an optical member having an optical characteristic of reflecting at least a part of the observation light OL and transmitting at least a part of the processing light EL.

In a case where the wavelength bandwidth of the observation light OL is different from the wavelength bandwidth of the processing light EL as described above, a dichroic mirror may be used as one example of the beam split member 22 having the optical characteristic of reflecting at least a part of the observation light OL and transmitting at least a part of the processing light EL. The dichroic mirror may be a substantially planar-plate optical member having a circular, rectangular, or polygonal shape in plan view, for example. A dichroic prism may be used as another example of the beam split member 22. FIG. 2 to FIG. 3 illustrate an example in which the beam split member 22 is the dichroic mirror. In the below-described description, the example in which the beam split member 22 is the dichroic mirror will be described.

However, the beam split member 22 may be an optical member that is different from the dichroic mirror and the dichroic prism. For example, the beam split member 22 may be an amplitude-type of beam splitter. For example, the beam split member 22 may be a polarization beam splitter. In this case, the light source 4 may supply linearly polarized processing light EL. Further, the polarization beam splitter may be an optical member with a polarization separation film formed thereon, or may be a Brewster plate mirror. The linearly polarized processing light EL from the light source 4 may be transmitted through the polarization beam splitter. Furthermore, the observation light OL may typically be non-polarized light. Here, at least a part of the observation light OL that enters the polarization beam splitter via the scanning optical member 23 may be reflected and directed toward the aperture 253. The polarization direction of the processing light EL with respect to the polarization separation surface of the polarization beam splitter may be p-polarized light. Of the observation light OL that enters the polarization beam splitter, s-polarized light with respect to the polarization separation surface may be reflected and directed toward the aperture 253.

The beam split member 22 emits the observation light OL upwardly from the beam split member 22. Especially, the beam split member 22 emits the observation light OL toward the opening 253 formed in the top surface 2561 of the housing 25. Conversely, the beam split member 22 is aligned with the housing 25 so that the opening 253 is located on an optical path of the observation light OL reflected by the beam split member 22. As a result, the observation light OL reflected by the beam split member 22 is emitted through the opening 253 toward the outside of the beam scanning apparatus 2. The observation light OL reflected by the beam split member 22 enters the light receiving apparatus 24 through the opening 253. As a result, the light receiving apparatus 24 optically receives the observation light OL through the opening 253. Thus, the light receiving apparatus 24 is disposed at a position at which the light receiving apparatus 24 can receive the observation light OL emitted from the opening 253. For example, the light receiving apparatus 24 may be attached to the top surface 2561 (namely, the top wall 2560) in which the opening 253 is formed. For example, the light receiving apparatus 24 may be disposed above the top surface 2561 (namely, the top wall 2560) in which the opening 253 is formed.

Here, since the beam split member 22 reflects the observation light OL, the observation light OL enters the light receiving apparatus 24 without passing through the condensing optical system 21 through which the processing light EL passes. In this case, as described in detail later, the configuration of the condensing optical system 21 can be simplified compared to a case where the observation light OL passes through the condensing optical system 21.

Furthermore, in the first embodiment, an optical window 2530 is disposed in the opening 253. The optical window 2530 is an optical member that transmits the observation light OL. The optical window 2530 is an optical member that has a substantially plane-parallel shaped and that has no optical power (namely, has no refractive power). However, the optical window 2530 may be an optical member that has an optical power (namely, has a refractive power). In a case where the optical window 2530 is disposed in the opening 253, the observation light OL reflected by the beam split member 22 is emitted through the optical window 2530 to the outside of the beam scanning apparatus 2. Namely, the beam scanning apparatus 2 emits the observation light OL through the optical window 2530. The light receiving apparatus 24 optically receives the observation light OL through the optical window 2530.

In a case where the optical window 2530 is disposed in the opening 253 in this manner, there is a lower possibility that the unnecessary material (for example, the dust or the dirt) existing outside the housing 25 enters the containing space SP25 inside the housing 25 through the opening 253, compared to a case where the optical window 2530 is not disposed in the opening 253. If the unnecessary material entering the containing space SP25 blocks a part of the processing light EL, there is a possibility that the characteristic (for example, the intensity or the intensity distribution) of the processing light EL unintentionally varies. As a result, there is a possibility that such a technical problem arises that the processing apparatus 1a cannot properly perform the additive manufacturing. For example, there is a possibility that such a technical problem arises that the build accuracy, material properties or the build speed of the three-dimensional structural object by the processing apparatus 1a deteriorates. However, in a case where the optical window 2530 is disposed at the opening 253, there is a low possibility that such a technical problem arises. As a result, the processing apparatus 1a can properly perform the additive manufacturing. For example, the processing apparatus 1a can build the three-dimensional structural object with high build accuracy and / or with high build speed.

However, no optical window 2530 may be disposed in the opening 253. Even in this case, the fact remains that the beam scanning apparatus 2 can emit the observation light OL toward the light receiving apparatus 24. A cover member or a beam damper may be provided outside the optical window 2530. Note that the cover member or the beam damper may be provided in the opening 253 instead of the optical window 2530.

The light receiving apparatus 24 optically receives the observation light OL that has entered the light receiving apparatus 24. The light receiving apparatus 24 outputs the received result of the observation light OL by the light receiving apparatus 24 to the control apparatus 3. The control apparatus 3 may control the processing apparatus 1a based on the result of the analysis of the received result of the observation light OL by the light receiving apparatus 24.

As one example, the control apparatus 3 may observe (in other words, monitor) the state of the building of the three-dimensional structural object by the processing apparatus 1a based on the received result of the observation light OL by the light receiving apparatus 24. Furthermore, the control apparatus 3 may control the processing apparatus 1a to properly build the three-dimensional structural object based on an observation result (in other words, a monitoring result) of the state of the building of the three-dimensional structural object by the processing apparatus 1a. Namely, the control apparatus 3 may control the processing apparatus 1a to properly build the three-dimensional structural object based on an analysis result of the received result of the observation light OL by the light receiving apparatus 24.

An imaging apparatus (namely, a camera) that is configured to capture an image of the observation target may be used as one example of the light receiving apparatus 24. In this case, the light receiving apparatus 24 may output an image generated by the light receiving apparatus 24 capturing the image of the observation target as the received result of the observation light OL by the light receiving apparatus 24. The control apparatus 3 may observe (in other words, monitor) the state of the building of the three-dimensional structural object by the processing apparatus 1a based on the image generated by the light receiving apparatus 24. The control apparatus 3 may control the processing apparatus 1a to properly build the three-dimensional structural object based on the image generated by the light receiving apparatus 24. For example, the light receiving apparatus 24 may capture an image of a melt pool formed on the material layer ML by the processing light EL. The control apparatus 3 may control, for example, the intensity of the processing light EL or the scanning speed of the processing light EL based on the captured image of the melt pool. Note that the light receiving apparatus 24 may detect the melt pool using one-color or a two-color method and/or thermography method. Such a light receiving apparatus 24 is disclosed, for example, in at least one of US Patent Publication Nos. 2021/0268586 and 2021/0387261. Acquisition unit 310 of at least one of US Patent Publication Nos. 2021/0268586 and 2021/0387261 may be applied to light receiving apparatus 24 . Also, the technology disclosed in at least one of US Patent Publication Nos. 2022/347751 and 2022/0252392 may be applied to the light receiving apparatus 24.

(1-3) Technical Effect of Processing Apparatus 1a in First embodiment
As described above, in the first embodiment, the beam scanning apparatus 2 can properly scan the processing light EL by using the scanning optical member 23. Thus, the processing apparatus 1a can properly perform the additive manufacturing by using the beam scanning apparatus 2. Namely, the processing apparatus 1a can properly build the three-dimensional structural object by using the beam scanning apparatus 2.

Furthermore, in the first embodiment, the beam scanning apparatus 2 can properly optically receive the observation light OL by using the light receiving apparatus 24. Thus, the processing apparatus 1a can properly perform the additive manufacturing based on the received result of the observation light OL by the light receiving apparatus 24. Namely, the processing apparatus 1a can properly build a three-dimensional structural object based on the received result of the observation light OL by the light receiving apparatus 24.

Especially in the first embodiment, the observation light OL may enter the light receiving apparatus 24 without passing through the condensing optical system 21 through which the processing light EL passes as described above. Especially, the observation light OL may enter the light receiving apparatus 24 without passing through the movable lenses 2111 and 2121 of the condensing optical system 21. Here, in a case where the observation light OL enters the light receiving apparatus 24 by passing through the condensing optical system 21 (especially, passing through the movable lenses 2111 and 2121), the condensing optical system 21 is required to be designed so that the condensing optical system 21 reduces a chromatic aberration caused by a difference between the wavelength bandwidth of the processing light EL and the wavelength bandwidth of the observation light OL. For example, the condensing optical system 21 is required to include an achromatic lens to reduce the chromatic aberration caused by the difference between the wavelength bandwidth of the processing light EL and the wavelength bandwidth of the observation light OL. However, the configuration of the condensing optical system 21 designed to reduce the chromatic aberration is generally complex. As a result, a weight of the condensing optical system 21 designed to reduce the chromatic aberration increases. In the first embodiment, however, since the observation light OL does not pass through the condensing optical system 21, the condensing optical system 21 is freed from the design for reducing the chromatic aberration caused by the difference in the wavelength bandwidths of the processing light EL and the wavelength bandwidth of the observation light OL. As a result, the configuration of the condensing optical system 21 in the first embodiment is simplified compared to the configuration of the condensing optical system 21 designed to reduce the chromatic aberration. As a result, the weight of the condensing optical system 21 in the first embodiment is lighter compared to the weight of the condensing optical system 21 designed to reduce the chromatic aberration. Thus, a practically advantageous effect of simplifying the configuration of the condensing optical system 21 is achievable by the first embodiment. In the first embodiment, since the movable lenses 2111 and 2121 are light, it is possible to obtain the advantageous effect of improved controllability of the condensing position of the processing light EL and the spot size of the processing light EL.

Furthermore, in the first embodiment, the processing light EL generated by the light source 4 may be supplied from the light source 4 to the beam scanning apparatus 2 through the opening 252 formed in the side surface 2551 of the housing 25 (for example, the optical window 2520 disposed in the opening 252), as described above. Specifically, as described above with reference to FIG. 3, the processing light EL generated by the light source 4 may be supplied or provided from the light source 4 to the beam scanning apparatus 2 through the optical fiber 5 connected to the connecting member 2552 that is connected to the opening 252. Here, since the opening 252 is formed in the side surface 2551 facing sideways, there is a low possibility that the unnecessary material (for example, the dust or the dirt) existing outside the housing 25 is deposited by gravity on the surface of the optical window 2520 disposed in the opening 252 in a situation where the optical fiber 5 is disconnected from the connecting member 2552 (namely, the fiber insertion port of the connecting member 2552 is exposed). Especially, there is a low possibility that the unnecessary material is deposited by gravity on the entrance surface 2521 of the optical window 2520 to which the processing light EL emitted from the optical fiber 5 enters. For example, even in a case where the optical fiber 5 is disconnected from the connecting member 2552 during an initial setup of the processing apparatus 1a, there is a low possibility that the unnecessary material is deposited on the entrance surface 2521 of the optical window 2520. For example, even in a case where the optical fiber 5 is disconnected from the connecting member 2552 in assembling the processing apparatus 1a, there is a low possibility that the unnecessary material is deposited on the entrance surface 2521 of the optical window 2520. For example, even in a case where the optical fiber 5 is disconnected from the connecting member 2552 during a maintenance of the processing apparatus 1a, there is a low possibility that the unnecessary material is deposited on the entrance surface 2521 of the optical window 2520.

Here, if the unnecessary material is deposited on the entrance surface 2521 of the optical window 2520, there is a possibility that such a technical problem arises that a part of the processing light EL passing through the optical window 2520 is blocked by the unnecessary material. As a result, there is a possibility that the characteristic (for example, the intensity or the intensity distribution) of the processing light EL unintentionally varies and the processing apparatus 1a cannot properly perform the additive manufacturing. For example, there is a possibility that such a technical problem arises that the build accuracy or the build speed of the three-dimensional structural object by the processing apparatus 1a deteriorates. In the first embodiment, however, there is a low possibility that such a technical problem arises because there is a low possibility that the unnecessary material is deposited on the surface of the optical window 2520 as described above. As a result, the processing apparatus 1a can properly perform the additive manufacturing. For example, the processing apparatus 1a can build three-dimensional structural object with high build accuracy and / or with high build speed. Further, when unnecessary substances are deposited on the incident surface 2521 of the optical window 2520, the processing light EL passing through the optical window 2520 may burn the unnecessary substances onto the optical window 2520 and damage the optical window 2520 by burning. However, in the first embodiment, such a technical problem is less likely to occur because the possibility of deposition of unwanted substances on the surface of the optical window 2520 is low as described above.

Furthermore, in the first embodiment, the processing apparatus 1a may change the condensed position of the processing light EL and the spot size of the processing light EL by moving the two movable lenses 2111 and 2121. Here, if the processing apparatus 1a includes one of the two movable lenses 2111 and 2121 but does not include the other of the two movable lenses 2111 and 2121, the processing apparatus 1a can change the condensed position of the processing light EL so that the condensed position of the processing light EL is set at the desired position, but at the same time it is not easy for the processing apparatus 1a to change the spot size of the processing light EL so that the spot size of the processing light EL is the desired size. Similarly, if the processing apparatus 1a includes one of the two movable lenses 2111 and 2121 but does not include the other of the two movable lenses 2111 and 2121, the processing apparatus 1a can change the spot size of the processing light EL so that the spot size of the processing light EL is the desired size, but at the same time it is not easy for the processing apparatus 1a to change the condensed position of the processing light EL so that the condensed position of the processing light EL is set at the desired position. In the first embodiment, however, the processing apparatus 1a includes two movable lenses 2111 and 2121. Therefore, the processing apparatus 1a can change the condensed position of the processing light EL and the spot size of the processing light EL so that the condensed position of the processing light EL is set at the desired position and the spot size of the processing light EL is the desired size.

Furthermore, in the first embodiment, the optical path of the processing light EL between the movable lens 2111 and the movable lens 2121 is made relatively long, as described above. Therefore, as already described above, the processing apparatus 1a can reduce the aberrations while reducing the moving distance of at least one of the reflective mirrors 2131 and 2132 that is necessary to change the condensed position of the processing light EL and the spot size of the processing light EL by a certain amount.

(2) Processing Apparatus 1b in Second embodiment
Next, the processing apparatus 1 in a second embodiment will be described. In the below-described description, the processing apparatus 1 in the second embodiment is referred to as a “processing apparatus 1b”. The processing apparatus 1b in the second embodiment is different from the above-described processing apparatus 1a in the first embodiment in that the processing apparatus 1b includes a beam scanning apparatus 2b instead of the beam scanning apparatus 2. Other features of the processing apparatus 1b may be same as other features of the processing apparatus 1a. Thus, in the below-described description, a configuration of the beam scanning apparatus 2b in the second embodiment will be described with reference to FIG. 5. FIG. 5 is a perspective view that illustrates the configuration of the beam scanning apparatus 2b in the second embodiment.

As illustrated in FIG. 5, the beam scanning apparatus 2b in the second embodiment is different from the above-described beam scanning apparatus 2 in the first embodiment in that the beam scanning apparatus 2b has an aberration reduction member 26b. Incidentally, in FIG. 5, the illustration of the condensing optical system 21 is simplified for the sake of simplicity of the drawing. Other features of the beam scanning apparatus 2b may be same as other features of the beam scanning apparatus 2.

The aberration reduction member 26b is an optical member configured to reduce aberration generated in the processing light EL. Specifically, in a case where the beam split member 22 transmits the processing light EL condensed by the condensing optical system 21, there is a possibility that the aberration (especially, an astigmatism, the same is applied to the second embodiment) is generated in the processing light EL. Namely, there is a possibility that the astigmatism occurs in the processing light EL due to the beam split member 22 transmitting the processing light EL condensed by the condensing optical system 21. The aberration reduction member 26b is an optical member configured to reduce this astigmatism.

The aberration reduction member 26b may be an optical member that generates an inverse aberration relative to the aberration generated by the beam split member 22. In other words, the aberration reduction member 26b may be an optical member that add, to the processing light EL, the inverse aberration relative to the aberration generated by the beam split member 22. For example, a case an aberration such that “the condensed position of the processing light EL in a vertical direction is away from the condensed position of the processing light EL in the horizontal direction by a distance A (wherein, A is a constant indicating a real number) along a propagating direction of the processing light EL” is generated by the beam split member 22 transmitting the processing light EL will be described. In this case, the aberration reduction member 26b may add, to the processing light EL, an aberration such that “the condensed position of the processing light EL in the vertical direction is away from the condensed position of the processing light EL in the horizontal direction by a distance -A along the propagating direction of the processing light EL. As a result, the aberration reduction member 26b can cancel the aberration generated by the beam split member 22. Namely, the aberration reduction member 26b can reduce the aberration generated by the beam split member 22. Alternatively, the aberration reduction member 26b may add, to the processing light EL, an aberration such that “the condensed position of the processing light EL in the vertical direction is away from the condensed position of the processing light EL in the horizontal direction by a distance -B (wherein, B is a constant indicating a real number whose absolute value is smaller than the absolute value of A) along the propagating direction of the processing light EL. As a result, the aberration reduction member 26b can partially cancel the aberration generated by the beam split member 22. Namely, the aberration reduction member 26b can reduce the aberration generated by the beam split member 22.

As described above, the planar plate optical member (for example, the dichroic mirror) is one example of the beam split member 22. In this case, the aberration reduction member 26b may also be a planar plate optical member. Namely, the planar plate optical member may be used as one example of the aberration reduction member 26b.

In a case where the aberration reduction member 26b is the planar plate optical member, the aberration reduction member 26b may be aligned with the beam split member 22, which is also a planar plate optical member, to satisfy a predetermined alignment condition described below. In this case, the aberration reduction member 26b can generate the aberration inverse relative to the aberration generated by the beam split member 22 more properly, compared to a case where the arrangement condition is not satisfied.

For example, as illustrated in FIG. 7 that is a perspective view illustrating a positional relationship between the aberration reduction member 26b and the beam split member 22, the aberration reduction member 26b may be aligned with the beam split member 22 to satisfy such a first alignment condition that “a first plane at which a reflective surface 221 of the beam split member 22 is positioned and a second plane at which a surface 261b of the aberration reduction member 26b is positioned intersect with each other”. The reflective surface 221 of the beam split member 22 may include an optical surface of the beam split member 22 that reflects the observation light OL. The surface 261b of the aberration reduction member 26b may include an optical surface of the aberration reduction member 26b which the processing light EL enters (or is emitted from). For example, the aberration reduction member 26b may be aligned with the beam split member 22 to satisfy such a second alignment condition that “a first plane at which a reflective surface 221 of the beam split member 22 is positioned and a second plane at which a surface 261b of the aberration reduction member 26b is positioned are perpendicular to each other”. For example, the aberration reduction member 26b may be aligned with the beam split member 22 to satisfy such a third condition that “a direction D1 in which the reflective surface 221b of the beam split member 22 reflects the observation light OL and a direction D2 in which the surface 261b of the aberration reduction member 26b reflects the processing light EL are different along a rotational direction, which is around an axis along the propagating direction of the processing light EL entering the beam split member 22, by 90 degrees. For example, the aberration reduction member 26b may be aligned with the beam split member 22 to satisfy such a fourth condition that “a rotational angle of the direction D1 along the rotational direction, which is around the axis along the propagating direction of the processing light EL entering the beam split member 22, is different from a rotational angle of the direction D2 along the rotational direction, which is around the axis along the propagating direction of the processing light EL entering the beam split member 22, by 90 degrees. In the example illustrated in FIG. 6, the direction D1 is a direction along the Z-axis, the direction D2 is a direction along the X-axis, and the rotational direction around the axis along the propagating direction of the processing light EL entering the beam split member 22 is a rotational direction around the axis along the Y-axis.

An optical member having different optical powers (refractive powers) in two mutually orthogonal directions may be used as another example of the aberration reduction member 26b. Especially, an optical member having different optical powers (refractive powers) in two mutually orthogonal directions (for example, a vertical direction and a horizontal direction) that intersect with an optical axis of the optical member may be used as another example of the aberration reduction member 26b. One example of the optical member having the different optical powers (the refractive powers) in two mutually orthogonal directions is at least one of a cylindrical lens, a cylindrical mirror, a toric lens and a toric mirror.

The aberration reduction member 26b may be disposed in the optical path of the processing light EL between the condensing optical system 21 and the scanning optical member 23 as illustrated in FIG. 7. Especially, the aberration reduction member 26b may be disposed in the optical path of the processing light EL between the condensing optical system 21 and the beam split member 22. In a case where the aberration reduction member 26b is disposed in the optical path of the processing light EL between the condensing optical system 21 and the beam split member 22, the observation light OL passing through the aberration reduction member 26b is not received by the light receiving apparatus 24. In this case, the aberration reduction member 26b is freed from the design that the aberration reduction member 26b reduces the chromatic aberration caused by the difference between the wavelength bandwidth of the processing light EL and the wavelength bandwidth of the observation light OL (namely, the chromatic aberration caused by both the processing light EL and the observation light OL passing through the aberration reduction member 26b). Alternatively, the beam scanning apparatus 2b may include no optical member that reduces the chromatic aberration caused by both the processing light EL and the observation light OL passing through the aberration reduction member 26b.

A convergence angle of the processing light EL transmitted through the beam split member 22 may be equal to a convergence angle of the processing light EL transmitted through the aberration reduction member 26b. For example, in a case where each of the processing light EL transmitted through the beam split member 22 and the processing light EL transmitted through the aberration reduction member 26b is divergent light, the convergence angle of the processing light EL transmitted through the beam split member 22 may be equal to the convergence angle of the processing light EL transmitted through the aberration reduction member 26b. In this case, even in a case where the beam scanning apparatus 2b includes the aberration reduction member 26b, the condensing optical system 21 can condense the processing light EL properly without being affected by the aberration reduction member 26b.

A divergence angle of the processing light EL transmitted through the beam split member 22 may be equal to a divergence angle of the processing light EL transmitted through the aberration reduction member 26b. For example, in a case where each of the processing light EL transmitted through the beam split member 22 and the processing light EL transmitted through the aberration reduction member 26b is divergent light, the divergence angle of the processing light EL transmitted through the beam split member 22 may be equal to the divergence angle of the processing light EL transmitted through the aberration reduction member 26b. In this case, even in a case where the beam scanning apparatus 2b includes the aberration reduction member 26b, the condensing optical system 21 can condense the processing light EL properly without being affected by the aberration reduction member 26b.

A divergence angle or a convergence angle of the processing light EL transmitted through the beam split member 22 may be equal to divergence angle or a convergence angle of the processing light EL transmitted through the aberration reduction member 26b. In this case, even in a case where the beam scanning apparatus 2b includes the aberration reduction member 26b, the condensing optical system 21 can condense the processing light EL properly without being affected by the aberration reduction member 26b.

A numerical aperture (NA: Numerical Aperture) of the processing light EL transmitted through the beam split member 22 may be equal to a numerical aperture of the processing light EL transmitted through the aberration reduction member 26b. Note that the numerical aperture of the processing light EL may mean a sine value of half of the divergence or convergence angle of the processing light EL. The numerical aperture of the processing light EL may mean a value obtained by multiplying the sine value of half of the divergence or divergence angle of the processing light EL by a refractive index of medium in a space through which the processing light EL passes. In this case, even in a case where the beam scanning apparatus 2b includes the aberration reduction member 26b, the condensing optical system 21 can condense the processing light EL properly without being affected by the aberration reduction member 26b.

No optical member having an optical power (namely, having a refractive power) may be disposed in the optical path of the processing light EL between the aberration reduction member 26b and the beam split member 22. In this case, there is a high possibility that the convergence angle of the processing light EL transmitted through the beam split member 22 is equal to the convergence angle of the processing light EL transmitted through the aberration reduction member 26b. Similarly, there is a high possibility that the divergence angle of the processing light EL transmitted through the beam split member 22 is equal to the divergence angle of the processing light EL transmitted through the aberration reduction member 26b. Similarly, there is a high possibility that the open angle of the processing light EL transmitted through the beam split member 22 is equal to the open angle of the processing light EL transmitted through the aberration reduction member 26b. Similarly, there is a high possibility that the numerical aperture of the processing light EL transmitted through the beam split member 22 is equal to the numerical aperture of the processing light EL transmitted through the aberration reduction member 26b.

As described above, the beam scanning apparatus 2b in the second embodiment includes the aberration reduction member 26b. Thus, the beam scanning apparatus 2b can reduce the adverse effects of the astigmatism, which is caused by beam split member 22 transmitting the processing light EL, on the additive manufacturing performed by the processing apparatus 1b. Thus, compared to a case where the beam scanning apparatus 2b does not include the aberration reduction member 26b, the processing apparatus 1b can perform the additive manufacturing more properly. For example, the processing apparatus 1b can build the three-dimensional structural object with higher build accuracy.

Incidentally, there is a possibility that unnecessary light (for example, spurious light, Raman scattering light, seed light, etc.) UNL in a wavelength bandwidth that is different from the wavelength bandwidth of the processing light EL are emitted from the light source 4 coaxially with the processing light EL, in addition to the processing light EL. In this case, a dichroic mirror film may be formed on the surface (the optical surface) 261b of the aberration reduction member 26b to which the processing light EL enters. The dichroic mirror film formed on the surface 261b may transmit light in the wavelength bandwidth of the processing light EL and reflects light in a wavelength bandwidth different from the wavelength bandwidth of the processing light EL. In this case, as illustrated in FIG. 7, the unnecessary light UNL emitted from the light source 4 may be reflected by the aberration reduction member 26b. Furthermore, as illustrated in FIG. 7, a beam damper 262b to which the unnecessary light UNL enters may be disposed in the optical path of the unnecessary light UNL reflected by the aberration reduction member 26b. In this case, it is possible to prevent an undesired part from being irradiated with the unnecessary light UNL. In FIG. 7, the beam damper 262b is provided inside the housing 25, however, the beam damper 262b may be provided outside the housing 25. Note that the beam damper 262b may be cooled by a temperature adjustment apparatus 28d, which will be described later in a fourth embodiment.

(3) Processing Apparatus 1c in Third Embodiment
Next, the processing apparatus 1 in a third embodiment will be described. In the below-described description, the processing apparatus 1 in the third embodiment is referred to as a “processing apparatus 1c”. The processing apparatus 1c in the third embodiment is different from the above-described processing apparatus 1a in the first embodiment in that the processing apparatus 1c includes a beam scanning apparatus 2c instead of the beam scanning apparatus 2. Other features of the processing apparatus 1c may be same as other features of the processing apparatus 1a. Thus, in the below-described description, a configuration of the beam scanning apparatus 2c in the third embodiment will be described with reference to FIG. 8. FIG. 8 is a cross-sectional view that illustrates the configuration of the beam scanning apparatus 2c in the third embodiment.

As illustrated in FIG. 8, the beam scanning apparatus 2c in the third embodiment is different from the above-described beam scanning apparatus 2 in the first embodiment in that the beam scanning apparatus 2c includes an observation optical system 27c. Other features of the beam scanning apparatus 2c may be same as other features of the beam scanning apparatus 2.

The observation optical system 27c is disposed in the optical path of the observation light OL between the beam split member 22 and the light receiving apparatus 24. In this case, the light receiving apparatus 24 may optically receive the observation light OL through the observation optical system 27c. Although only one lens 271c of the observation optical system 27c is illustrated in FIG. 8, the observation optical system 27c may include a plurality of optical elements.

The observation optical system 27c may perform an adjustment of a focal point. For example, the observation optical system 27c may perform the adjustment of the focal point for adjusting the focal point of the observation optical system 27c (for example, for adjusting a focal length of the observation optical system 27c) so that the observation light OL is condensed on the light receiving apparatus 24. In this case, the light receiving apparatus 24 can properly receive the observation light OL. For example, in a case where the light receiving apparatus 24 is the imaging apparatus, the light receiving apparatus 24 can optically receive the observation light OL through the observation optical system 27c to generate the image in which the observation target is in focus.

In order to perform the adjustment of the focal point, the observation optical system 27c may include at least one movable lens 271c. The movable lens 271c is movable in a direction along an optical axis of the movable lens 271c. The movable lens 271c is movable in a direction along the optical path of the processing light EL transmitted through the movable lens 271c. The observation optical system 27c may adjust the focal point of the observation optical system 27c by moving at least one movable lens 271c under the control of the control apparatus 3. In order to perform the adjustment of the focal point, the observation optical system 27c may include one or more variable focus lenses. A liquid variable focus lens can be applied as such the variable focus lens.

Note that the light receiving apparatus 24 may include the observation optical system 27d. The observation optical system 27d may be built in the light receiving apparatus 24. An apparatus that includes the apparatus configured to optically receive the observation light OL and the observation optical system 27d may be referred to as the light receiving apparatus 24.

Moreover, the processing apparatus 1b in the second embodiment described above may include a feature unique to the processing apparatus 1c in the third embodiment. The feature unique to the processing apparatus 1c in the third embodiment may include a feature related to the observation optical system 27c.

(4) Processing Apparatus 1d in Fourth Embodiment
Next, the processing apparatus 1 in a fourth embodiment will be described. In the below-described description, the processing apparatus 1 in the fourth embodiment is referred to as a “processing apparatus 1d”. The processing apparatus 1d in the fourth embodiment is different from the above-described processing apparatus 1a in the first embodiment in that the processing apparatus 1d includes a beam scanning apparatus 2d instead of the beam scanning apparatus 2. Other features of the processing apparatus 1d may be same as other features of the processing apparatus 1a. Thus, in the below-described description, a configuration of the beam scanning apparatus 2d in the fourth embodiment will be described with reference to FIG. 9. FIG. 9 is a cross-sectional view that illustrates the configuration of the beam scanning apparatus 2d in the fourth embodiment.

As illustrated in FIG. 9, the beam scanning apparatus 2d in the fourth embodiment is different from the above-described beam scanning apparatus 2 in the first embodiment in that the beam scanning apparatus 2d includes a temperature adjustment apparatus 28d. Other features of the beam scanning apparatus 2d may be same as other features of the beam scanning apparatus 2.

The temperature adjustment apparatus 28d is an apparatus that is configured to adjust a temperature of at least a part of the beam scanning apparatus 2d. For example, the temperature adjustment apparatus 28d may be configured to adjust a temperature of at least one of the condensing optical system 21, the beam split member 22, the scanning optical member 23, and the optical windows 2510, 2520, and 2530 of the beam scanning apparatus 2d. For example, the temperature adjustment apparatus 28d may be configured to adjust a temperature of the containing space SP25 in which the condensing optical system 21, the beam split member 22, and the scanning optical member 23 are contained. For example, the temperature adjustment apparatus 28d may be configured to adjust a temperature of at least one of the actuators 2141, 2142 and 233, each of which is the driving member. The temperature adjustment apparatus 28d may be referred to as temperature controller.

There is a possibility that the temperature of at least one of the condensing optical system 21, the beam split member 22, and the scanning optical member 23 increases as a result of the irradiation of the processing light EL described above. This is because an energy of the processing light EL is absorbed by at least one of the condensing optical system 21, the beam split member 22, and the scanning optical member 23 when at least one of the condensing optical system 21, the beam split member 22, and the scanning optical member 23 transmits the processing light EL, resulting in an increase of the temperature of the condensing optical system 21, the beam split member 22, and the scanning optical member 23. In this case, the temperature adjustment apparatus 28d may cool at least one of the condensing optical system 21, the beam split member 22, and the scanning optical member 23. However, the temperature adjustment apparatus 28d may heat at least one of the condensing optical system 21, the beam split member 22, and the scanning optical member 23.

There is a possibility that the temperature of the containing space SP25 in which the condensing optical system 21, the beam split member 22, and the scanning optical member 23 are contained increases as a result of the irradiation of the processing light EL described above. This is because there is a possibility that the above-described increase of the temperature of at least one of the condensing optical system 21, the beam split member 22, and the scanning optical member 23 results in the increase of the temperature of the containing space SP25 in which at least one of the condensing optical system 21, the beam split member 22, and the scanning optical member 23 is contained. In this case, the temperature adjustment apparatus 28d may cool the containing space SP25. However, the temperature adjustment apparatus 28d may heat the containing space SP25.

There is a possibility that the temperature of at least one of the actuators 2141, 2142 and 233 increases as at least one of the actuators 2141, 2142 and 233 is driven. This is because, there is a possibility that at least one of the actuators 2141, 2142 and 233 generate heat as at least one of the actuators 2141, 2142 and 233 is driven. In this case, the temperature adjustment apparatus 28d may cool at least one of the actuators 2141, 2142, and 233. However, the temperature adjustment apparatus 28d may heat at least one of the actuators 2141, 2142 and 233.

The temperature adjustment apparatus 28d may use fluid to adjust the temperature of at least a part of the beam scanning apparatus 2d. For example, the temperature adjustment apparatus 28d may use gas to adjust the temperature of at least a part of the beam scanning apparatus 2d. For example, the temperature adjustment apparatus 28d may use liquid (for example, coolant) to adjust the temperature of at least a part of the beam scanning apparatus 2d.

As one example, as illustrated in FIG. 9, the temperature adjustment apparatus 28d may include a gas supply apparatus 281d. The gas supply apparatus 281d may be configured to adjust the temperature of at least one of the condensing optical system 21, the beam split member 22, and the scanning optical member 23 contained in the containing space SP25 by supplying the gas into the containing space SP25. The gas supply apparatus 281d may be configured to adjust the temperature of the containing space SP25 by supplying the gas to the containing space SP25. The gas supply apparatus 281d may be configured to adjust the temperature of at least one of the actuators 2141, 2142 and 233 contained in the containing space SP25 by supplying gas to the containing space SP25.

FIG. 9 illustrates an example of the temperature adjustment apparatus 28d that is configured to supply the gas to the containing space SP25. In this case, the temperature adjustment apparatus 28d may include the gas supply apparatus 281d, a gas supply pipe 282d, and a gas supply pipe 283d. The gas supply apparatus 281d may supply the gas to the containing space SP25 through the gas supply pipe 282d that connects the containing space SP25 and the gas supply apparatus 281d. The gas supply pipe 282d may be connected to the gas supply pipe 283d extending in the containing space SP25. As a result, the gas supplied to the gas supply pipe 282d may be supplied to the gas supply pipe 283d. The gas supply pipe 283d may extend to the vicinity of at least one of the condensing optical system 21, the beam split member 22, and the scanning optical member 23. The gas supply pipe 283d may extend to the vicinity of at least one of the actuators 2141, 2142, and 233. At least one gas supply port 284d may be formed in the gas supply pipe 283d. The gas supplied to the gas supply pipe 283d may be supplied (in other words, flow out) from the at least one gas supply port 284d to the containing space SP25. The gas supply pipe may be referred to as a gas supply tube or a gas supply duct.

The gas supply port 284d may be formed at a desired position of the gas supply pipe 283d so that the gas supplied from the gas supply port 284d is supplied toward or to at least one of the condensing optical system 21, the beam split member 22 and the scanning optical member 23. The gas supply port 284d may be formed at a desired position of the gas supply pipe 283d so that the gas supplied from the gas supply port 284d is supplied toward at least one of the actuators 2141, 2142 and 233. For example, a first gas supply port 284d may be formed at a first desired position of the gas supply pipe 283d so that the gas supplied from the first gas supply port 284d is supplied toward the condensing optical system 21. For example, a second gas supply port 284d may be formed at a second desired position of the gas supply pipe 283d so that the gas supplied from the second gas supply port 284d is supplied toward the beam split member 22. For example, a third gas supply port 284d may be formed at a third desired position of the gas supply pipe 283d so that the gas supplied from the third gas supply port 284d is supplied toward the scanning optical member 23. For example, a fourth gas supply port 284d may be formed at a fourth desired position of the gas supply pipe 283d so that the gas supplied from the fourth gas supply port 284d is supplied toward the actuator 2141. For example, a fifth gas supply port 284d may be formed at a fifth desired position of the gas supply pipe 283d so that the gas supplied from the fifth gas supply port 284d is supplied toward the actuator 2142. For example, a sixth gas supply port 284d may be formed at a sixth desired position of the gas supply pipe 283d so that the gas supplied from the sixth gas supply port 284d is supplied toward the actuator 233.

The gas supply pipe 283d may be disposed between a first optical member and a second optical member that is different from the first optical member. In this case, the gas supply pipe 283d may supply the gas toward the first optical member and the second optical member from a position between the first optical member and the second optical member. For example, the gas supply pipe 283d may be disposed between the first optical member and the second optical member disposed below the first optical member. In this case, two gas supply ports 284d may be formed in the gas supply pipe 283d so that the gas is supplied from the gas supply pipe 283d disposed between the first optical member and the second optical member upwardly and downwardly (namely, toward the first and second optical members). As one example, the condensing optical system 21 includes the front group optical system 211 and the rear group optical system 212 that is disposed below the front group optical system 211. In this case, as illustrated in FIG. 9, the gas supply pipe 283d may be disposed between the front group optical system 211 and the rear group optical system 212. The gas supply pipe 283d may supply the gas toward the front group optical system 211 and the rear group optical system 212 from a position between the front group optical system 211 and the rear group optical system 212. At least two gas supply ports 284d may be formed in the gas supply pipe 283d so that the gas is supplied from the gas supply pipe 283d upward and downward (namely, toward the front group optical system 211 and the rear group optical system 212). The gas supply pipe 283d may be arranged on the front side in FIG. 9 (+X-axis side). In this case, the gas supply ports 284d of the gas supply pipe 283d may supply the gas obliquely upward and obliquely downward so that the gas is supplied to the front group optical system 211 and the rear group optical system 212.

As another example, as illustrated in FIG 10, the temperature adjustment apparatus 28d may include a coolant supply apparatus 285d. The coolant supply apparatus 285d may be configured to supply coolant to a water jacket 287d surrounding at least one of the actuators 2141, 2142, and 233 through a coolant supply pipe. Namely, the coolant supply apparatus 285d may be configured to adjust the temperature of at least one of the actuators 2141, 2142, and 233 by using the coolant.

Alternatively, a heat generation source may be disposed outside the housing 25. In this case, a variation (typically, an increase) of the temperature of the containing space SP25 is reduced compared to a case where the heat generation source is disposed in the containing space SP25 inside the housing 25. Furthermore, a variation (typically, an increase) of the temperature of at least one of the condensing optical system 21, the beam split member 22, and the scanning optical member 23, which are contained in the containing space SP25, is reduced.

A control circuit (in other words, a control board) 20d for controlling at least one of the actuators 2141, 2142 and 233 is one example of the heat generation source. In this case, as illustrated in FIG. 10, the control circuit 20d may be disposed outside the housing 25. The control circuit 20d may generate control signals for controlling motion of at least one of actuators 2141 , 2142 and 233. At least one of the actuators 2141, 2142 and 233 is one example of the heat generation source. In this case, as illustrated in FIG. 10, at least one of the actuators 2141, 2142 and 233 may be disposed outside of the housing 25. The temperature adjustment apparatus 28d or another temperature adjustment apparatus may cool the heat generation source arranged external the housing 25.

At least one of the processing apparatus 1b in the second embodiment to the processing apparatus 1c in the third embodiment described above may include a feature unique to the processing apparatus 1d in the fourth embodiment. The feature unique to the processing apparatus 1d in the fourth embodiment may include a feature related to the temperature adjustment apparatus 28d.

(5) Processing Apparatus 1e in Fifth embodiment
Next, the processing apparatus 1 in a fifth embodiment will be described. In the below-described description, the processing apparatus 1 in the fifth embodiment is referred to as a “processing apparatus 1e”. The processing apparatus 1e in the fifth embodiment is different from the above-described processing apparatus 1a in the first embodiment in that the processing apparatus 1e includes a beam scanning apparatus 2e instead of the beam scanning apparatus 2. Other features of the processing apparatus 1e may be same as other features of the processing apparatus 1a. Thus, in the below-described description, a configuration of the beam scanning apparatus 2e in the fifth embodiment will be described with reference to FIG. 12A. FIG. 12A is a cross-sectional view that illustrates the configuration of the beam scanning apparatus 2e in the fifth embodiment.

As illustrated in FIG. 12A, the beam scanning apparatus 2e in the fifth embodiment is different from the above-described beam scanning apparatus 2 in the first embodiment in that the beam scanning apparatus 2e includes an intensity detection element 29e. Other features of the beam scanning apparatus 2e may be same as other features of the beam scanning apparatus 2.

The intensity detection element 29e is a light receiving element that is configured to optically receive the processing light EL. Especially, the intensity detection element is a detection element that is configured to detect the intensity of the processing light EL by optically receiving the processing light EL. For example, the intensity detection element 29e may be configured to detect the intensity of the processing light EL propagating in the beam scanning apparatus 2e. For example, the intensity detection element 29e may be configured to detect the intensity of the processing light EL entering the beam scanning apparatus 2e. For example, the intensity detection element 29e may be configured to detect the intensity of the processing light EL emitted from the beam scanning apparatus 2e. The intensity detection element 29e may be referred to as an intensity detector (or senser), a power detector (or senser), an energy detector (or senser), or a power meter. In addition to or in place of the intensity detection element 29e, a detector that monitors the power distribution, beam cross-sectional shape, etc. of the incident processing light EL may be used. Such the detector may include an array of intensity sensing elements, typically a CCD imager a CMOS imager, or the like. The array may be one-dimensional or two-dimensional. Since the arrayed intensity detector includes a plurality of light receiving elements capable of receiving the processing light EL, it may also be referred to as the intensity detection element.

A part of the processing light EL may enter the intensity detection element 29e. The intensity detection element 29e may detect the intensity of the processing light EL entering the intensity detection element 29e.

As one example, as illustrated in FIG. 12A, a part of the processing light EL reflected by the aberration reduction member 26b may enter the intensity detection element 29e as processing light ELr. Namely, the aberration reduction member 26b may reflect a part of the processing light EL, which has entered the aberration reduction member 26b, toward the intensity detection element 29e as the processing light ELr. In this case, the processing light ELr reflected by the aberration reduction member 26b may enter the intensity detection element 29e, which is disposed outside the housing 25, through an unillustrated opening formed in the side wall 2550 (the side surface 2551) of the housing 25. Incidentally, as with the opening 251 to the opening 253, an optical window that transmits the processing light ELr may be disposed in the opening through which the processing light ELr passes. However, in a case where the intensity detection element 29e is disposed in the containing space SP25 inside the housing 25, the opening through which the processing light ELr passes need not be formed in the housing 25.

As another example, as illustrated in FIG. 12A, a part of the processing light EL transmitted through the reflective mirror 2131 of the condensing optical system 21 may enter the intensity detection element 29e as processing light et. Namely, the reflective mirror 2131 may transmit a part of the processing light EL, which has entered the reflective mirror 2131, as the processing light et. The processing light et transmitted through the reflective mirror 2131 may enter the intensity detection element 29e disposed outside the housing 25 through a reflective mirror 291e and an opening 253e formed in the top wall 2560 (the top surface 2561) of the housing 25. Incidentally, as with the opening 251 to the opening 253, an optical window 2530e through that transmits the processing light et may be disposed in the opening 253e. However, in a case where the intensity detection element 29e is disposed in the containing space SP25 inside the housing 25, the opening 253e through which the processing light et passes need not be formed in the housing 25.

Incidentally, for convenience of illustration, FIG. 12A illustrates both of the first intensity detection element 29e to which the processing light ELr reflected by the aberration reduction member 26b enters and the second intensity detection element 29e to which the processing light et transmitted through the reflective mirror 2131 enters. In this case, the beam scanning apparatus 2e may include both of the first and second intensity detection elements 29e. The beam scanning apparatus 2e may include either one of the first and second intensity detection elements 29e and need not include the other one of the first and second intensity detection elements 29e. Alternatively, the beam scanning apparatus 2e may include, in addition to or instead of at least one of the first and second intensity detection elements 29e, an intensity detection element 29e to which both of the processing light ELr reflected by the aberration reduction member 26b and the processing light et transmitted through the reflective mirror 2131 enter.

A detected result of the intensity of the processing light EL by the intensity detection element 29e is outputted to the control apparatus 3. The control apparatus 3 may control the processing apparatus 1e based on the detected result of the intensity of the processing light EL by the intensity detection element 29e. For example, the control apparatus 3 may control the processing apparatus 1e based on the detected result of the intensity of the processing light EL by the intensity detection element 29e so that the intensity of the processing light EL propagating in the beam scanning apparatus 2e is a desired intensity. For example, the control apparatus 3 may control the processing apparatus 1e based on the detected result of the intensity of the processing light EL by the intensity detection element 29e so that the intensity of the processing light EL emitted from the beam scanning apparatus 2e is a desired intensity. For example, the control apparatus 3 may control the processing apparatus 1e based on the detected result of the intensity of the processing light EL by the intensity detection element 29e so that the intensity of the processing light EL entering the beam scanning apparatus 2e is a desired intensity. As a result, there is a low possibility that the intensity of the processing light EL emitted from the beam scanning apparatus 2e varies beyond an acceptable amount. Thus, the processing apparatus 1e can properly perform the additive manufacturing. For example, the processing apparatus 1e can build the three-dimensional structural object with high build accuracy.

As illustrated in FIG. 12B, the reflective mirror may be a dichroic mirror that has a dichroic film which reflects light with the wavelength bandwidth of the processing light EL and which transmits light with the wavelength bandwidth of the unnecessary light UNL. The beam damper 262b to which the unnecessary light UNL enters may be provided in an optical path of the unnecessary light UNL. Note that the beam damper 262b may be cooled by the temperature adjustment apparatus 28d, which is described in the fourth embodiment.

As illustrated in FIG. 12C, a light irradiation apparatus 30e which irradiates the aberration reduction member 26b with light may be provided. The light from the light irradiation apparatus 30e may be reflected by the aberration reduction member 26b, transmitted through the beam split member 22, and directed to the material layer ML via the scanning optical member 23. The light irradiation apparatus 30e may be provided inside the housing 25 or may be provided outside the housing 25. In the case of the light irradiation apparatus 30e is provided outside the housing 25, the light from the light irradiation apparatus 30e may enter the aberration reduction member 26b through an opening or an optical window provided in the housing 25. The light from the light irradiation apparatus 30e is scanned on the material layer ML together with the processing light EL. At this case, the irradiation position of the processing light EL and the irradiation position of the light from the light irradiation apparatus 30e may be same or different positions on the material layer ML. Further, on the material layer ML, the size or shape of the processing light EL and the size or shape of the light from the light irradiation apparatus 30e may be same or different size or shape. Here, the light from the light irradiation apparatus 30e may pre-heat and/or post-heat the material layer ML.

Furthermore, light from the material layer ML may enter the light irradiation apparatus 30e. At this case, the light irradiation apparatus 30e may include a light receiver that receives the light from the material layer ML. In the case of the light irradiation apparatus 30e transmits and receives the light, the light irradiation apparatus 30e may be referred to as a light transmission and receiver, and as an example, the light irradiation apparatus 30e may be a TOF distance measuring apparatus such as LiDAR, or an interferometer such as OCT. The light irradiation apparatus may only receive the light. In this case, the light irradiation apparatus 30e may be referred to as a light reception apparatus, and as an example, the light irradiation apparatus 30e may be a melt pool monitor or thermometer. The light receiving area of the light receiver or the light transmission and reception apparatus on the material layer ML may be larger than, the same as, or smaller than the irradiation area of the processing light EL irradiated onto the material layer ML. Note that this light receiving area is moved by the scanning operation of the scanning optical apparatus 23. Such the light irradiation apparatus (light receiver, the light transmission and reception apparatus) 30e may be provided to the location where the light receiving apparatus 24 is provided.

Incidentally, at least one of the processing apparatus 1b in the second embodiment to the processing apparatus 1d in the fourth embodiment described above may include a feature unique to the processing apparatus 1e in the fifth embodiment. The feature unique to the processing apparatus 1e in the fifth embodiment may include a feature related to the intensity detection element 29e.

(6) Processing Apparatus 1f in Sixth embodiment
Next, the processing apparatus 1 in a sixth embodiment will be described. In the below-described description, the processing apparatus 1 in the sixth embodiment is referred to as a “processing apparatus 1f”. The processing apparatus 1f in the sixth embodiment is different from the above-described processing apparatus 1a in the first embodiment in that the processing apparatus 1f includes a beam scanning apparatus 2f instead of the beam scanning apparatus 2. Other features of the processing apparatus 1f may be same as other features of the processing apparatus 1a. The beam scanning apparatus 2f in the sixth embodiment is different from the above-described beam scanning apparatus 2 in the first embodiment in that the beam scanning apparatus 2f includes a condensing optical system 21f instead of the condensing optical system 21. Other features of the beam scanning apparatus 2f may be same as other features of the beam scanning apparatus 2.

Thus, in the below-described description, a configuration of the condensing optical system 21f in the sixth embodiment will be described. Incidentally, in the below-described description, five condensing optical systems 21f#1 to 21f#5 will be described as examples of the condensing optical system 21f in the sixth embodiment.

(6-1) Configuration of Condensing Optical System 21f#1
Firstly, with reference to FIG. 13, the configuration of the condensing optical system 21f#1, which is one example of the condensing optical system 21f in the sixth embodiment, will be described. FIG. 13 is a cross-sectional view that illustrates the configuration of the condensing optical system 21f#1, which is one example of the condensing optical system 21f in the sixth embodiment.

As illustrated in FIG. 13, the condensing optical system 21f#1 is different from the condensing optical system 21 in that the condensing optical system 21f#1 includes a front group optical system 211f#1 instead of the front group optical system 211. Other features of the condensing optical system 21f#1 may be same as other features of the condensing optical system 21. The front group optical system 211f#1 is different from the front group optical system 211 in that the front group optical system 211f#1 may include no fixed lens 2112. This condensing optical system 21f#1 can enjoy the effect of having fewer optical elements, compared to the condensing optical system 21. Other features of the front group optical system 211f#1 may be same as other features of the front group optical system 211.

However, the above-described condensing optical system 21, which includes the fixed lens 2112, has a better ability to correct aberration than the condensing optical system 21f#1, which does not include the fixed lens 2112, because the fixed lens 2112 is used.

(6-2) Configuration of Condensing Optical System 21f#2
Next, with reference to FIG. 14, the configuration of the condensing optical system 21f#2, which is one example of the condensing optical system 21f in the sixth embodiment, will be described. FIG. 14 is a cross-sectional view that illustrates the configuration of the condensing optical system 21f#2, which is one example of the condensing optical system 21f in the sixth embodiment.

As illustrated in FIG. 14, the condensing optical system 21f#2 is different from the condensing optical system 21f in that the condensing optical system 21f#2 includes a collimator lens 214f#2. Furthermore, the condensing optical system 21f#2 is different from the condensing optical system 21f in that the condensing optical system 21f#2 includes a front group optical system 211f#2 instead of the front group optical system 211. Other features of the condensing optical system 21f#2 may be same as other features of the condensing optical system 21f.

The processing light EL entering the beam scanning apparatus 2f through the optical window 2520 enters the collimator lens 214f#2. The collimator lens 214f#2 converts the processing light EL, which is in the divergent state, into a collimated light. The processing light EL transmitted through the collimator lens 214f#2 enters the front group optical system 211f#2. In this case, since the processing light EL transmitted through the collimator lens 214f#2 is the collimated light, an optical element 215f#2 for manipulating the beam shape and / or beam direction such as a diffractive optical element (DOE) can be disposed in the optical path of the processing light EL between the collimator lens 214f#2 and the front group optical system 211f#2. The optical element 215f#2 may be used to divide the processing light EL into a plurality of processing lights EL. The optical element 215f#2 may be used to convert a shape or an intensity profile of the processing light EL (especially, a shape or an intensity profile of the processing light EL in a plane intersecting with the propagating direction of the processing light EL) into a desired shape or a desired profile. The optical element 215f#2 may convert the light intensity profile of the processing light EL irradiated onto the uppermost material layer ML into a top hat profile, a ring beam profile, or an arbitrary profile. The optical element 215f#2 may divide the processing light EL so that the upmost material layer ML is irradiated with a plurality of processing lights EL simultaneously. The optical element 215f#2 may be used to reflect or transmit the processing light EL toward the intensity detection element 29e described in the fifth embodiment.

Moreover, the front group optical system 211f#2 is different from the front group optical system 211, in which the movable lens 2111 transmits the processing light EL and then the fixed lens 2112 transmits the processing light EL, in that the fixed lens 2112 transmits the processing light EL and then the movable lens 2111 transmits the processing light EL in the front group optical system 211f#2. Other features of the front group optical system 211f#2 may be same as other features of the front group optical system 211.

(6-3) Configuration of Condensing Optical System 21f#3
Next, with reference to FIG. 15, the configuration of the condensing optical system 21f#3, which is one example of the condensing optical system 21f in the sixth embodiment, will be described. FIG. 15 is a cross-sectional view that illustrates the configuration of the condensing optical system 21f#3, which is one example of the condensing optical system 21f in the sixth embodiment.

As illustrated in FIG. 15, the condensing optical system 21f#3 is different from the condensing optical system 21f#2 in that the condensing optical system 21f#3 includes a front group optical system 211f#3 instead of the front group optical system 211f#2. Other features of the condensing optical system 21f#3 may be same as other features of the condensing optical system 21f#2.

The front group optical system 211f#3 is different from the front group optical system 211f#2 in that the front group optical system 211f#3 may include no fixed lens 2112. This condensing optical system 21f#3 can benefit from the effect of having fewer optical elements, compared to the condensing optical system 21f#2. Other features of the front group optical system 211f#3 may be same as other features of the front group optical system 211f#2.

However, the above-described condensing optical system 21f#2, which includes the fixed lens 2112, has a better ability to correct aberration than the condensing optical system 21f#3, which does not include the fixed lens 2112, because the divergence angle of the processing light EL can be increased by using the fixed lens 2112 that is the negative lens.

(6-4) Configuration of Condensing Optical System 21f#4
Next, with reference to FIG. 16, the configuration of the condensing optical system 21f#4, which is one example of the condensing optical system 21f in the sixth embodiment, will be described. FIG. 16 is a cross-sectional view that illustrates the configuration of the condensing optical system 21f#4, which is one example of the condensing optical system 21f in the sixth embodiment.

As illustrated in FIG. 16, the condensing optical system 21f #4 is different from the condensing optical system 21 in that the fixed lens 2122 is disposed at the emission side of the beam split member 22. Even this condensing optical system 21f#4 can condense the processing light EL properly. In this condensing optical system 21f#4 , the movable lenses 2111 and 2121 of the condensing optical system 21f#4 are arranged between the side wall 2550 and the beam split member 22. Other features of the condensing optical system 21f#4 may be same as other features of the condensing optical system 21.
Incidentally, in at least one of the above-described condensing optical systems 21f#1 to 21f#3, the fixed lens 2122 may be disposed at the emission side of the beam split member 22.

(6-5) Configuration of Condensing Optical System 21f#5
Next, with reference to FIG. 17, the configuration of the condensing optical system 21f#5, which is one example of the condensing optical system 21f in the sixth embodiment, will be described. FIG. 17 is a cross-sectional view that illustrates the configuration of the condensing optical system 21f#5, which is one example of the condensing optical system 21f in the sixth embodiment.

As illustrated in FIG. 17, the condensing optical system 21f #5 is different from the condensing optical system 21f in that the condensing optical system 21f#5 may include no reflective mirrors 2131 and 2132. Even this condensing optical system 21f#5 can condense the processing light EL properly. Other features of the condensing optical system 21f #5 may be same as other features of the condensing optical system 21.

In a case where the condensing optical system 21f#5 does not include the reflective mirrors 2131 and 2132, the size of the condensing optical system 21f #5 is smaller, compared to a case where the condensing optical system 21f #5 includes the reflective mirrors 2131 and 2132. Specifically, the size of the condensing optical system 21f#5 along the direction intersecting with the optical axis of the condensing optical system 21f#5 (in the example illustrated in FIG. 17, the Z-axis direction) is smaller. As a result, the size of the housing 25 that contains the condensing optical system 21f#5 is also smaller. Namely, a height of the housing 25 is relatively low. As a result, the beam scanning apparatus 2f disposed on the carrier plate 133 is less to external disturbances compared to a case where the height of the housing 25 is relatively high. For example, the beam scanning apparatus 2f disposed on the carrier plate 133 is less likely to vibrate in at least horizontal direction due to the influence of the external disturbances. As a result, the beam scanning apparatus 2f can be disposed stably.

In addition, at least one of the above-described condensing optical system 21#1 to 21#4 may include no reflective mirrors 2131 and 2132, as with the condensing optical system 21#5.

Moreover, at least one of the processing apparatus 1b in the second embodiment to the processing apparatus 1e in the fifth embodiment described above may include a feature unique to the processing apparatus 1f in the sixth embodiment. The feature unique to the processing apparatus 1f in the sixth embodiment may include a feature related to the condensing optical system 21f. Namely, at least one of the processing apparatus 1b in the second embodiment to the processing apparatus 1e in the fifth embodiment described above may include the condensing optical system 21f instead of condensing optical system 21.

(7) Processing Apparatus 1g in Seventh embodiment
Next, the processing apparatus 1 in a seventh embodiment will be described. In the below-described description, the processing apparatus 1 in the seventh embodiment is referred to as a “processing apparatus 1g”. The processing apparatus 1g in the seventh embodiment is different from the above-described processing apparatus 1a in the first embodiment in that the processing apparatus 1g includes a beam scanning apparatus 2g instead of the beam scanning apparatus 2. Other features of the processing apparatus 1g may be same as other features of the processing apparatus 1a. Thus, in the below-described description, a configuration of the beam scanning apparatus 2g in the seventh embodiment will be described with reference to FIG. 18. FIG. 18 illustrates a cross-section (specifically, a cross-section along the XY plane) of the beam scanning apparatus 2g in the seventh embodiment and the side surface 2551 (specifically, the side surface along the XZ plane) of the beam scanning apparatus 2g in the seventh embodiment.

As illustrated in FIG. 18, the beam scanning apparatus 2g in the seventh embodiment differs from the above-described beam scanning apparatus 2 in the first embodiment in that the connecting member 2552 to which the optical fiber 5 is connected is disposed at a position that is away from a center line C on the side surface 2551 of the housing 25 in the beam scanning apparatus 2g. FIG. 18 illustrates an example in which the connecting member 2552 is disposed at a position that is decentered in the horizontal direction from the center line C on the side surface 2551. Specifically, FIG. 18 illustrates an example in which the connecting member 2552 is disposed at a position that is away toward the +X side along the X-axis direction from the center line C on the side surface 2551 in the X-axis direction.

Note that it can be said that the opening 252 is formed at a position that is away from the center line C on the side surface 2551 of the housing 25 because the connecting member 2552 is attached to the side surface 2551 so that the connecting member 2552 is connected to the opening 252. FIG. 18 illustrates an example in which the opening 252 is formed at a position that is away sideways from the center line C on the side surface 2551. Specifically, FIG. 18 illustrates an example in which the opening 252 is formed at a position that is away toward the +X side along the X-axis direction from the center line C on the side surface 2551 in the X-axis direction. Although FIG. 18 illustrates an example in which the entire opening 252 (entire connecting member 2552) formed at a position off the center line C, the center of the opening 252 (the center of the connecting member 2552) may be off the center line C as well. That is, the center line C may pass through the opening 252 (the connecting member 2552).

In this case, as illustrated in FIG. 18, a first space SP25-1 of the containing space SP25 inside the housing 25 may be used as a space through which the processing light EL passes. The condensing optical system 21, the beam split member 22, and the scanning optical member 23 may be contained in the first space SP25-1. On the other hand, a second space SP25-2, which is different from the first space SP25-1, of the containing space SP25 inside the housing 25 may be used as a space through which the processing light EL does not pass. Specifically, the second space SP25-2 adjacent to the first space SP25-1 along the X-axis direction out of the containing space SP25 may be used as a space through which the processing light EL does not pass. The actuators 2141, 2142 and 233 may be contained in the second space SP25-2.

In the seventh embodiment, the beam scanning apparatus 2g can be downsized, compared to a case where the connecting member 2552 is disposed on the center line C on the side surface 2551 of the housing 25. In the example illustrated in FIG. 18, the beam scanning apparatus 2g can be downsized in the X-axis direction. Specifically, FIG. 19 illustrates a beam scanning apparatus 2z in which the connecting member 2552 is disposed on the center line C on the side surface 2551 of the housing 25. In this case, two spaces, each of which is usable as the space through which the processing light EL does not pass, are formed on both sides (the +X side and the -X side in the example illustrated in FIG. 19) of the first space SP25-1, which is usable as the space through which the processing light EL passes, in the containing space SP25 inside the housing 25. One of these two spaces may be used as the second space SP25-2 in which the actuators 2141, 2142 and 233 are contained as described above. However, there is a possibility that the other of the two spaces is a space SP25-3 that cannot be utilized effectively. As a result, in the beam scanning apparatus 2z, the size of the housing 25 may be larger than necessary because the space SP25-3 that cannot be effectively utilized is relatively large. In the seventh embodiment, however, as illustrated in FIG. 18, the space SP25-3 that cannot be effectively utilized does not become excessively large. FIG. 18 illustrates an example in which the space SP25-3 that cannot be effectively utilized does not exist at the -X side of the first space SP25-1. As a result, the size of the housing 25 does not become excessively large. Thus, the beam scanning apparatus 2g can be downsized. As described above, when the center of the opening 252 (the connection member 2552) is decentered from the center line C on the side surface 2551 of the housing 25, the size reduction effect of this embodiment can be obtained.

Incidentally, at least one of the processing apparatus 1b in the second embodiment to the processing apparatus 1f in the sixth embodiment described above may include a feature unique to the processing apparatus 1g in the seventh embodiment. The feature unique to the processing apparatus 1g in the seventh embodiment may include a feature related to the position at which the connecting member 2552 is disposed.

(8) Processing Apparatus 1h in Eighth embodiment
Next, with reference to FIG. 20 to FIG. 23, the processing apparatus 1 in an eighth embodiment will be described. FIG. 20 is a cross-sectional view that illustrates a configuration of the processing apparatus 1 in the eighth embodiment. FIG. 21 is a perspective view that illustrates an exterior appearance of the processing apparatus 1 in the eighth embodiment. FIG. 22 is a top view that illustrates an exterior appearance of the processing apparatus 1 in the eighth embodiment. FIG. 23 is a bottom view that illustrates an exterior appearance of the processing apparatus 1 in the eighth embodiment. Incidentally, in the below-described description, the processing apparatus 1 in the eighth embodiment is referred to as a “processing apparatus 1h”.

As illustrated in FIG. 20 to FIG. 23, the processing apparatus 1h in the eighth embodiment is different from the above-described processing apparatus 1a in the first embodiment in that the processing apparatus 1h includes a plurality of beam scanning apparatuses 2. Other features of the processing apparatus 1h may be same as other features of the processing apparatus 1a.

The processing apparatus 1h may irradiate at least a part of the material layer ML formed on the carrier 111 with a plurality of processing lights EL emitted from the plurality of beam scanning apparatuses 2, respectively. Especially, the processing apparatus 1h may irradiate at least a part of the material layer ML with the plurality of processing lights EL simultaneously. Namely, the processing apparatus 1h may scan at least a part of the material layer ML with the plurality of processing lights EL simultaneously. In this case, an area scanned with one processing light EL and an area scanned with another processing light EL that is different from the one processing light EL may be overlapped at least partially or need not be overlapped.

Thus, the processing apparatus 1h can perform the additive manufacturing by using the plurality of processing lights EL. Thus, a throughput of the additive manufacturing improves compared to a case where the additive manufacturing is performed using a single processing light EL. For example, a time required to form a three-dimensional structural object is reduced.

In a case where the processing apparatus 1h includes the plurality of beam scanning apparatuses 2, the plurality of beam scanning apparatuses 2 may be disposed on the carrier plate 133 in an arrangement aspect described below. The plurality of beam scanning apparatuses 2 may be supported by a member other than the carrier plate 133.

For example, as illustrated in FIG. 21 to FIG. 23, a first group of a plurality of first beam scanning apparatuses 2, which are a part of the plurality of beam scanning apparatuses 2, may be disposed along a first row R1 on the carrier plate 133. In the below-described description, each of the plurality of first beam scanning apparatuses 2 in the first group is referred to as a first beam scanning apparatus 2#1. Furthermore, as illustrated in FIG. 21, a second group of a plurality of second beam scanning apparatuses 2, which are another part of the plurality of beam scanning apparatuses 2 and which are different from the first group of the plurality of first beam scanning apparatuses 2, may be disposed along a second row R2 on the carrier plate 133. In the below-described description, each of the plurality of second beam scanning apparatuses 2 in the second group is referred to as a second beam scanning apparatus 2#2. The second row R2 is a row different from the first row R1. The first row R1 and the second row R2 may be aligned along a direction that intersects with each of the first row R1 and the second row R2. In the example illustrated in FIG. 21, each of the first row R1 and the second row R2 is a row along the X-axis direction, and the first row R1 and the second row R2 may be aligned along a direction (the Y-axis direction) that intersects with the X-axis direction that is the direction of each of the first row R1 and the second row R2.

The plurality of beam scanning apparatuses 2 may be disposed on the carrier plate 133 so that the plurality of connecting members 2552, which are respectively included in the plurality of beam scanning apparatuses 2, face outwardly. Specifically, the plurality of first beam scanning apparatuses 2#1 in the first group may be disposed on the carrier plate 133 so that the plurality of connecting members 2552, which are respectively included in the plurality of first beam scanning apparatuses 2#1 in the first group, face away from the plurality of second beam scanning apparatuses 2#2 in the second group. In the example illustrated in FIG. 21 to FIG. 23, the plurality of second beam scanning apparatuses 2#2 in the second group are disposed at the +Y side of the plurality of first beam scanning apparatuses 2#1 in the first group and the plurality of connecting members 2552, which are respectively included in the plurality of first beam scanning apparatuses 2#1 in the first group, face toward the -Y side. Furthermore, the plurality of second beam scanning apparatuses 2#2 in the second group may be disposed on the carrier plate 133 so that the plurality of connecting members 2552, which are respectively included in the plurality of second beam scanning apparatuses 2#2 in the second group, face away from the plurality of first beam scanning apparatuses 2#1 in the first group. In the example illustrated in FIG. 21 to FIG. 23, the plurality of first beam scanning apparatuses 2#1 in the first group are disposed at the -Y side of the plurality of second beam scanning apparatuses 2#2 in the second group and the plurality of connecting members 2552, which are respectively included in the plurality of second beam scanning apparatuses 2#2 in the second group, face toward the +Y side. In this case, the plurality of optical fibers 5, which are respectively connected to the plurality of beam scanning apparatuses 2, are less likely to interfere with the plurality of beam scanning apparatuses 2. Namely, the optical fiber 5 connected to one beam scanning apparatus 2 is less likely to interfere with another beam scanning apparatus 2 that are different from the one beam scanning apparatus 2. Therefore, the plurality of optical fibers 5 can be properly connected to the plurality of beam scanning apparatuses 2, respectively.

As illustrated in FIG. 23, the plurality of beam scanning apparatuses 2 may be disposed on the carrier plate 133 so that the plurality of optical windows 2510 that are included in the plurality of first beam scanning apparatuses 2#1 in the first group, respectively, are located lateral to the plurality of optical windows 2510 that are included in the plurality of second beam scanning apparatuses 2#2 in the second group, respectively. Namely, the plurality of beam scanning apparatuses 2 may be disposed on the carrier plate 133 so that the plurality of optical windows 2510 that are included in the plurality of first beam scanning apparatuses 2#1 in the first group, respectively, are located near the plurality of optical windows 2510 that are included in the plurality of second beam scanning apparatuses 2#2 in the second group, respectively. Furthermore, as illustrated in FIG. 23, the plurality of beam scanning apparatuses 2 may be disposed on the carrier plate 133 so that the plurality of optical windows 2510 that are included in the plurality of second beam scanning apparatuses 2#2 in the second group, respectively, are located lateral to the plurality of optical windows 2510 that are included in the plurality of first beam scanning apparatuses 2#1 in the first group, respectively. Namely, the plurality of beam scanning apparatuses 2 may be disposed on the carrier plate 133 so that the plurality of optical windows 2510 that are included in the plurality of second beam scanning apparatuses 2#2 in the second group, respectively, are located near the plurality of optical windows 2510 that are included in the plurality of first beam scanning apparatuses 2#1 in the first group, respectively. In this case, the optical windows 2510 that are included in the plurality of beam scanning apparatuses 2, respectively, are regularly disposed. For example, the optical windows 2510 that are included in the plurality of first beam scanning apparatuses 2#1 in the first group, respectively, are disposed along the first row R1, and the optical windows 2510 that are included in the plurality of second beam scanning apparatuses 2#2 in the second group, respectively, are disposed along the second row R2. Thus, the processing apparatus 1h can emit the plurality of processing lights EL from the plurality of optical windows 2510 that are regularly disposed, respectively. FIG. 20 to FIG. 23 illustrate examples in which each of the plurality of beam scanning apparatuses 2#1 in the first group and each of the plurality of beam scanning apparatuses 2#2 in the second group are at the same position in the X-axis direction (position in the direction of the first row R1 and the second row R2). However, positions in the X-axis direction (positions in the direction of the first row R1 and the second row R2) of one or more beam scanning apparatuses 2#1 of the plurality of beam scanning apparatuses 2#1 in the first group and one or more beam scanning apparatuses 2#2 of the plurality of beam scanning apparatuses 2#2 in the second group need not be the same.

In FIG. 24A, the locations along the X-axis direction of one beam scanning apparatus 2 and other beam scanning apparatus 2 are different, for example. As is clear from FIG. 24A, the arrangement of the plurality of beam scanning apparatus 2 is not limited to two rows arrangement. Here, in case of other beam scanning apparatus 2 is located on the side of the optical window 2550 where the processing light EL enters in the beam scanning apparatus 2, as illustrated in FIG. 24B, an optical path deflection member 2553 which fold an optical path of the entering processing light EL may apply the beam scanning apparatus 2.

The plurality of beam scanning apparatus 2 may be arranged in a grid pattern (two-dimensional matrix pattern), for example, as illustrated in FIG. 25, or in a cross pattern, as illustrated in FIG. 26. As illustrated in FIG. 27, a plurality of beam scanning apparatus 2 arranged in a cross pattern may be side by side. Furthermore, as illustrated in FIG. 28, the arrangement may be such that the angle between the two of the plurality of beam scanning apparatus 2 is smaller than 180 degrees, typically smaller than 90 degrees. The arrangement illustrated in FIG. 28 may be understood to mean that a plurality of beam scanning apparatus 2 are arranged along a plurality of lines extending radially from a predetermined location.

The plurality of beam scanning apparatus 2 do not have to be arranged parallel to the uppermost layer of the material layer ML, which may be referred as a processing surface. For example, as illustrated in FIG. 29A, a plurality of beam scanning apparatus 2 may be arranged in tilt in the YZ cross section. When the line connecting the scanning optical member 23 and the center of the scanning range of the processing light EL by the scanning optical member 23 of each beam scanning apparatus 2 is referred to as the optical axis, it can be considered that the beam scanning apparatus 2 are arranged such that as the optical axes close each other as separating from the beam scanning apparatus 2, The inclination of each beam scanning apparatus 2 is not limited to one cross section. For example, as illustrated in FIG. 29B, a plurality of beam scanning apparatus 2 may be arranged in tilt in the XZ cross section.

Incidentally, at least one of the processing apparatus 1b in the second embodiment to the processing apparatus 1g in the seventh embodiment described above may include a feature unique to the processing apparatus 1h in the eighth embodiment. The feature unique to the processing apparatus 1h in the eighth embodiment may include a feature related to the plurality of beam scanning apparatuses 2. Namely, at least one of the processing apparatus 1b in the second embodiment to the processing apparatus 1g in the seventh embodiment described above may include the plurality of beam scanning apparatuses 2.

(9) Modified Example
Although the beam split member 22 of the beam scanning apparatus 2 described above splits the wavelength or polarization of incident light, the beam split member 22 is not limited thereto. As the beam split member 22, a mirror 22a with an aperture may be used to split incident light into different locations as illustrated in FIG. 30 for example. The processing beam EL directed from the condensing optical system 21 toward the mirror 22a may be condensed by the condensing optical system 21 so as to have a diameter that passes through the aperture of the mirror 22a. The light (the observation light OL) traveling from the processing surface (the surface of the material layer ML) to the mirror 22a via the scanning optical member 23 is directed through a reflective surface formed around the aperture of the substrate of the mirror 22a, so that its traveling direction can be changed. And then, the light reflected by the reflective surface of the mirror 22a may be directed toward the light receiving apparatus 24.

The configuration of the processing apparatus 1 illustrated in FIG. 1 is only one example. Thus, the processing apparatus 1 may have a configuration different from the configuration illustrated in FIG. 1. For example, the processing apparatus 1 may have any configuration as long as the processing apparatus 1 includes the beam scanning apparatus 2 (including the modified example thereof). For example, the processing apparatus 1 may have any configuration as long as the processing apparatus 1 is configured to perform the additive manufacturing by using the processing light EL from the beam scanning apparatus 2 (including the modified example thereof).

For example, the processing apparatus 1 may include a processing head which is movable by a manipulator. The manipulator may move the processing head in one or more direction among the three directions of X, Y, and Z and three (rotational) directions of the θX, the θY, and the θZ. The processing head may include one or more beam scanning apparatuses 2. The processing apparatus 1 may move one or more scanning apparatuses 2 by the manipulator. The processing apparatus 1 may include one or more shield members that cover the optical path of the processing light EL from the beam scanning apparats 2. At least a part of the one or more shield members may be moved by the manipulator. At least the part of the shield member and the beam scanning apparatus 2 may be moved together by the manipulator. The shield member may include one or more gas input/output ports which form gas flow in a space within the shield member. The processing head may optionally include the material application apparatus 112 and a recoater. Such processing apparatus 1 can perform additive manufacturing on a workpiece that are lager in size than the processing apparatus 1, typically the size of the shield member, or can form a build object of a size lager than the size of the shield member. Such processing apparatus is disclosed in United States Patent No. 11,548,217, and United States Patent Application Nos. 2022/0055115 and 2019/0255768.

The light transmitting members such as the optical windows and the lenses in the above-described description may be reflecting members. Also, the reflecting member such as the mirror in the above-described description may be a light transmitting member.

In the above-described description, the processing apparatus 1 melts the material layer ML by irradiating the material layer ML with the processing light EL. However, the processing apparatus 1 may melt the material layer ML by irradiating the material layer ML with any energy beam. At least one of a charged particle beam, an electromagnetic wave, and so on is one example of the arbitrary energy beam. At least one of an electron beam, an ion beam, and so on is one example of the charged particle beam.

In the above-described description, the processing apparatus 1 builds the three-dimensional structural object by performing the additive manufacturing based on the Powder Bed Fusion method (PBF). However, the processing apparatus 1 may build the three-dimensional structural object by performing the additive manufacturing based on another method capable of building the three-dimensional structural object. At least one of a cladding method (DED: Directed Energy Deposition) such as a Laser Metal Deposition method (LMD), a Binder Jetting method, a Material Jetting method, a stereolithography method, and a Laser Metal Fusion method (LMF).

In the above-described description, the processing apparatus 1 performs the additive manufacturing by using the processing light EL emitted from the beam scanning apparatus 2. However, the processing apparatus 1 may perform a removal processing by using the processing light EL emitted from the beam scanning apparatus 2. For example, the processing apparatus 1 may perform the removal processing to remove a part of a workpiece by irradiating the workpiece with the processing light EL emitted from the beam scanning apparatus 2.

The processing apparatus 1 may perform a remelt processing in addition to at least one of the additive manufacturing and the removal processing. The remelt processing may include a processing for reducing a flatness of a surface of an object processed by at least one of the additive manufacturing and the removal processing (for example, the three-dimensional structural object built by the additive manufacturing or the workpiece a part of which has been removed by the removal processing). Reducing the flatness of the surface of the object may be equivalent to at least one of reducing a surface roughness of the surface of the object and bringing the surface of the object closer to a flat surface.

With respect to the embodiments described above, further embodiments are disclosed in the list of numbered embodiments bellow:

Embodiment 1

A beam scanning apparatus configured to perform a scanning of a processing beam that is used by a processing apparatus, the beam scanning apparatus comprising:
a condensing optical system that condenses the processing beam entering the beam scanning apparatus; and
a scanning optical member which scans the processing beam from the condensing optical system,
wherein the condensing optical system includes: a first optical system that condenses the processing beam entering the first optical system; folding members that fold the processing beam from the first optical system; and a second optical system that condenses the processing beam from the first optical system via the folding members and that directs condensed processing beam toward the scanning optical member, and
wherein an optical path of the processing beam propagating inter-folding member is located between the first optical system and the second optical system.

Embodiment 2

The beam scanning apparatus of embodiment 1, further comprising:
a housing that contains the condensing optical system and the scanning optical member in containing space; and
a temperature adjustment apparatus that adjusts a temperature of at least one of the containing space and a member disposed in the containing space.

Embodiment 3

The beam scanning apparatus of embodiment 2, wherein the temperature adjustment apparatus supplies gas from a position that is between the first optical system and the second optical system toward the first optical system and the second optical system.

Embodiment 4

A beam scanning apparatus configured to perform a scanning of a processing beam that is used by a processing apparatus, the beam scanning apparatus comprising:
a condensing optical system that condenses the processing beam entering the beam scanning apparatus;
a scanning optical member which scans the processing beam from the condensing optical system;
a housing that contains the condensing optical system and the scanning optical system; and
a connection member which is provided at the housing and which is connected an optical fiber through which the processing beam from a light source,
wherein the connection member is disposed at a position that is decentered from a center line of a side surface of the housing at which the connection member is provided.

Embodiment 5

The beam scanning apparatus of embodiment 4, further comprising a driving member that drives one or more movable optical members of the condensing optical system,
wherein the driving member is provided in a space on the side opposite to the decenter direction of the connection member with respect to the condensing optical system.

Embodiment 6

A beam scanning apparatus configured to perform a scanning of a processing beam that is used by a processing apparatus, the beam scanning apparatus comprising:
a condensing optical system that condenses the processing beam entering the beam scanning apparatus;
a scanning optical member which scans the processing beam from the condensing optical system;
a driving member that drives one or more movable optical members of the condensing optical system;
a housing that contains the condensing optical system, the scanning optical system, and the driving member in containing space; and
a control board which generates a control signal that controls the motion of the driving member,
wherein the control board is provided exterior of the housing.

Embodiment 7

The beam scanning apparatus of embodiment 6, further comprising a temperature adjustment apparatus that adjusts a temperature of at least one of the containing space and a member disposed in the containing space.

Embodiment 8

A processing apparatus processing an object with processing beams, the apparatus comprising:
a processing chamber in which the object is processed; and
a plurality of beam scanning apparatuses which are disposed above the processing chamber, each beam scanning apparatus scans the processing beam,
wherein a first group of beam scanning apparatuses of the plurality of beam scanning apparatuses are disposed along a first row above the processing chamber,
a second group of beam scanning apparatuses of the plurality of beam scanning apparatuses are disposed along a second row, which is different from the first row, above the processing chamber,
the first and second rows are arranged along a direction intersecting with a direction of the first row,
each of the plurality of beam scanning apparatuses includes a connection member to which an emission end of an optical fiber is connected, the processing beam from a light source propagates through the optical fiber, and
the connection members of the plurality of beam scanning apparatuses are directed outwardly.

Embodiment 9

A processing apparatus processing an object with processing beams, the apparatus comprising:
a processing chamber in which the object is processed;
a beam scanning apparatus, arranged above the processing chamber, which scans the processing beam; and
a support member, arranged between the processing chamber and the beam scanning apparatus, which supports the beam scanning apparatus.

Embodiment 10

The processing apparatus of embodiment 9, wherein
the processing chamber comprising a top wall, and
wherein the support member is arranged apart from the top wall.

At least a part of the features of each embodiment described above may be properly combined with at least another part of the features of each embodiment described above. A part of the features of each embodiment described above may not be used. Moreover, the disclosures of all publications and United States patents that are cited in each embodiment described above are incorporated in the disclosures of the present application by reference if it is legally permitted.

The present invention is allowed to be changed, if desired, without departing from the essence or spirit of the invention which can be read from the claims and the entire specification, and a beam scanning apparatus, a processing apparatus, and a processing method, which involve such changes, are also intended to be within the technical scope of the present invention.

Description of Reference Codes

1 processing apparatus
111 carrier
133 carrier plate
2 beam scanning apparatus
21 condensing optical system
2111, 2121 movable lens
2112, 2122 fixed lens
2131, 2132 reflective mirror
2141, 2142 actuator
22 beam split member
23 scanning optical member
231, 232 scanning mirror
233 actuator
24 light receiving apparatus
25 housing
251, 252, 253 opening
2510, 2520, 2530 optical window
2521 entrance surface
2540 bottom wall
2541 bottom surface
2550 side wall
2551 side surface
2552 connecting member
2560 top wall
2561 top surface
26b aberration reduction member
27c observation optical system
271c movable lens
28d temperature adjustment apparatus
3 control apparatus
31 arithmetic apparatus
32 storage apparatus
4 light source
5 optical fiber
ML material layer
SL structural layer
SP25 containing space
EL processing light

Claims

A beam scanning apparatus configured to perform a scanning of a processing beam that is used by a processing apparatus,
the beam scanning apparatus comprising:
a condensing optical system that condenses the processing beam entering the beam scanning apparatus in a divergent state;
a beam split member that transmits the processing beam from the condensing optical system; and
a scanning optical member which scans the processing beam from the beam split member,
the beam split member reflecting light that enters the beam split member via the scanning optical member to direct the light into an optical path different from an optical path of the processing beam.
The beam scanning apparatus according to claim 1, wherein
the light from the scanning optical member via the beam split member is direct toward a light receiving apparatus.
The beam scanning apparatus according to claim 1 or 2, wherein
the beam split member includes a dichroic mirror, which transmits the processing beam at a first wavelength bandwidth from the condensing optical system, and which reflects the light at a second wavelength bandwidth that enters the beam split member through the scanning optical member.
The beam scanning apparatus according to claim 3, wherein
the first wavelength band is a wavelength band different from the second wavelength band.
The beam scanning apparatus according to claim 4, wherein
the first wavelength band is longer than the second wavelength band.
The beam scanning apparatus according to any one of claims 1 to 5, wherein
the processing beam which enters the beam scanning apparatus is linearly polarized light.
The beam scanning apparatus according to claim 6, wherein
the beam split member transmits the linearly polarized processing beam, and reflects at least part of the light that enters the beam split member via the scanning optical member.
The beam scanning apparatus according to claim 7, wherein
a direction of the linearly polarized processing beam which transmits the beam split member is a first linearly polarization direction,
the beam split member reflects a component of a second linearly polarization direction differ from the first linearly polarization direction, among the light that enters the beam split member via the scanning optical member.
The beam scanning apparatus according to any one of claims 1 to 8, wherein
the beam split member comprises an optical member with a reflecting surface which reflects the light that enters the beam split member via the scanning optical member,
an opening which transmits the processing beam from the condensing optical system is formed in the optical member.
The beam scanning apparatus according to claim 9, wherein
the condensing optical system condenses the processing beam into a size smaller than the aperture of the optical member of the beam split member.
The beam scanning apparatus according to any one of claims 1 to 10, wherein
the condensing optical system includes at least two movable optical members that are movable along an optical path of the processing beam in the condensing optical system.
The beam scanning apparatus according to claim 11, further comprising at least one driving member that moves at least one of the at least two movable optical members,
wherein the beam scanning apparatus moves at least one of the at least two movable optical members along the optical path of the processing beam in the condensing optical system by using the at least one of the driving member to thereby change at least one of a condensed position of the processing beam and a size of an irradiation area that is irradiated with the processing beam on a surface of a workpiece by using the driving member.
The beam scanning apparatus according to claim 11 or 12, wherein
the at least two movable optical members of the condensing optical system are disposed between an entrance position at which the processing beam enters the beam scanning apparatus and the beam split member.
The beam scanning apparatus according to any one of claims 1 to 13, further comprising
an aberration reduction member that is disposed in an optical path of the processing beam between the condensing optical system and the scanning optical member and that reduces an aberration generated by the processing beam transmitted through the beam split member.
The beam scanning apparatus according to claim 14, wherein
each of the beam split member and the aberration reduction member is an optical member having a planar plate shape.
The beam scanning apparatus according to any one of claims 1 to 13, wherein
the beam split member is an optical member having a planar plate shape,
the beam scanning apparatus further comprises an optical member that is disposed in an optical path of the processing beam between the condensing optical system and the scanning optical member and that has a planar plate shape.
The beam scanning apparatus according to claim 15 or 16, wherein
planes to which optical surfaces of the optical members are aligned intersect with each other.
The beam scanning apparatus according to claim 15 or 16, wherein
planes to which optical surfaces of the optical members are aligned are perpendicular to each other.
The beam scanning apparatus according to any one of claims 14 to 18, wherein
a divergence angle or a convergence angle of the processing beam transmitted through the beam split member is equal to a divergence angle or a convergence angle of the processing beam that passes through the aberration reduction member.
The beam scanning apparatus according to any one of claims 14 to 19, wherein
an optical member having an optical power is not interposed between the beam split member and the aberration reduction member.
The beam scanning apparatus according to any one of claims 14 to 20, wherein
the aberration reduction member transmits the processing beam entering the aberration reduction member to direct the processing beam toward the beam split member and reflects the processing beam toward an intensity detection element that detects an intensity of the processing beam.
The beam scanning apparatus according to any one of claims 14 to 21, wherein
the aberration reduction member comprising a dichroic mirror that transmits the processing beam entering the aberration reduction member to direct the processing beam toward the beam split member and which reflects a light entering the aberration reduction member, the light entering the aberration reduction member has a wavelength bandwidth that differs from a wavelength bandwidth of the processing beam.
The beam scanning apparatus according to claim 22, further comprising a beam damper into which a reflected light from the dichroic mirror of the aberration reduction member.
The beam scanning apparatus according to claims 22 or 23, further comprising a beam INOUT into which a light can be directed to the dichroic mirror of the aberration reduction member and overlapped with the processing beam, thus directed to a process surface.
The beam scanning apparatus according to any one of claims 11 to 13, wherein
the condensing optical system includes:
a first optical system that includes a first movable optical member of the at least two movable optical members and that condenses the processing beam entering the first optical system in the divergent state; and
a second optical system that includes a second movable optical member of the at least two movable optical members and that condenses the processing beam from the first optical system.
The beam scanning apparatus according to claim 25, wherein
the first movable optical member has a positive optical power,
the second movable optical member has a negative optical power.
The beam scanning apparatus according to claim 25 or 26, wherein
a distance between the second movable optical member and the first movable optical member in a direction along an optical path of the processing beam is longer than a distance between a terminal optical member of the second optical system and the second movable optical member in a direction along the optical path of the processing beam.
The beam scanning apparatus according to any one of claims 25 to 27, wherein the condensing optical system includes: a first reflective member having a first reflective member that reflects the processing beam from the first optical system; and a second reflective member having a second reflective member that reflects the processing beam from the first reflective member,
an optical path of the processing beam propagating from the first reflective member to the second reflective member is located between the first optical system and the second optical system.
The beam scanning apparatus according to claim 28, wherein
the processing beam transmitted through the first reflective member enters an intensity detection element.
The beam scanning apparatus according to any one of claims 11 to 13 and 25 to 27, wherein
the condensing optical system includes a terminal optical member that is disposed at a position closest to an emission side among optical members disposed in an optical path of the processing beam in the condensing optical system,
the terminal optical member is static relative to the optical path of the processing beam.
The beam scanning apparatus according to claim 30, wherein
the beam split member is disposed between the terminal optical member and the scanning optical member.
The beam scanning apparatus according to any one of claims 1 to 31, further comprising:
a reflective member which is arranged in an optical path of at least one of the processing beam and the light via the scanning optical member and which reflects at least one of the processing beam and the light via the scanning optical member; and
a detector which detects light which transmits the reflective member.
The beam scanning apparatus according to any one of claims 1 to 32, wherein
the condensing optical system forms no condensed point between an entrance optical member that is disposed at a position closest to an entrance side among optical members disposed in an optical path of the processing beam in the condensing optical system and a terminal optical member that is disposed at a position closest to an emission side among the optical members disposed in the optical path of the processing beam in the condensing optical system.
The beam scanning apparatus according to any one of claims 1 to 33, further comprising a housing that contains the condensing optical system,
wherein the beam split member and the scanning optical member in a containing space.
The beam scanning apparatus according to claim 34, further comprising:
a first optical window that is located on an optical path of the processing beam emitted from the scanning optical member and that is disposed at a first surface of the housing; and
a second optical window that is located on an optical path of the processing beam entering the condensing optical system in the divergent state and that is disposed at a second surface of the housing.
The beam scanning apparatus according to claim 35, wherein
the first surface face toward a downward direction,
the second surface faces toward a lateral direction.
The beam scanning apparatus according to claim 35 or 36, wherein
a normal of the first surface and a normal of the second surface intersect each other.
The beam scanning apparatus according to any one of claims 35 to 37, wherein
a normal of the first surface and a normal of the second surface intersect at right angles.
The beam scanning apparatus according to any one of claims 35 to 38, further comprising a third optical window that is located on an optical path of the light, which is from the scanning optical member and is reflected by the beam split member, and that is disposed at a third surface of the housing.
The beam scanning apparatus according to claim 39, wherein
the third surface face toward an upward direction.
The beam scanning apparatus according to claim 39 or 40, wherein
the light receiving apparatus is attached to the third surface.
The beam scanning apparatus according to claim 41, wherein
the light receiving apparatus performs an adjustment of a focal point.
The beam scanning apparatus according to any one of claims 35 to 42, further comprising a connection member which is disposed at the housing and which is connected an optical fiber through which the processing beam from a light source.
The beam scanning apparatus according to claim 43, wherein the processing beam emitted from an emission end of the optical fiber that is connected to the connection member enters an entrance surface of the second optical window.
The beam scanning apparatus according to claims 43 or 44, wherein
the emission end of the optical fiber is connected to the connection member along a lateral direction.
The beam scanning apparatus according to any one of claims 43 to 45, wherein
the connection member is disposed at a position that is away from a center line of the second surface of the housing.
The beam scanning apparatus according to any one of claims 1 to 46, further comprising a temperature adjustment apparatus that adjusts a temperature of at least one of the containing space and a member disposed in the containing space.
The beam scanning apparatus according to claim 47, wherein
the temperature adjustment apparatus supplies gas to the containing space to thereby adjust a temperature of at least one of the condensing optical system, the beam split member, the scanning optical member and the first and second optical windows.
The beam scanning apparatus according to claim 48, wherein
the condensing optical system includes: a first optical system that condenses the processing beam entering the first optical system in the divergent state; and a second optical system that condenses the processing beam from the first optical system,
the second optical system is disposed at a position that is closer to a first optical window than the first optical system is in a direction along an optical path of the light reflected by the beam split member.
The beam scanning apparatus according to claim 49, wherein
the temperature adjustment apparatus supplies the gas from a position that is between the first optical system and the second optical system in the direction along the optical path of the light reflected by the beam split member.
The beam scanning apparatus according to any one of claims 47 to 50, further comprising:
a first driving apparatus that drives the scanning optical member; and
a second driving apparatus that drives a movable optical member that is movable along an optical path of the processing beam in the condensing optical system,
wherein the temperature adjustment apparatus adjusts a temperature of at least one of the first and second driving apparatuses by fluid.
The beam scanning apparatus according to any one of claims 35 to 51, further comprising:
a first driving apparatus that drives the scanning optical member;
a second driving apparatus that drives a movable optical member that is movable along an optical path of the processing beam in the condensing optical system; and
a control circuit configured to control the first and second driving apparatuses,
wherein the control circuit is disposed outside the housing.
The beam scanning apparatus according to any one of claims 1 to 52, further comprising a moving optical member that is disposed in an optical path between the beam split member and the light receiving apparatus and that is movable in a direction along the optical path.
A beam scanning apparatus configured to perform a scanning of a processing beam that is used by a processing apparatus,
the beam scanning apparatus comprising:
a condensing optical system that condenses the processing beam entering the beam scanning apparatus;
a beam split member that transmits the processing beam from the condensing optical system;
a scanning optical member which scans the processing beam from the beam split member; and
an aberration reduction member that is disposed in an optical path of the processing beam between the condensing optical system and the scanning optical member and that reduces an aberration generated by the processing beam transmitted through the beam split member.
A processing apparatus comprising the beam scanning apparatus according to any one of claims 1 to 54,
the processing apparatus processing an object by using the processing beam from the beam scanning apparatus.
The processing apparatus according to claim 55, wherein
the processing apparatus builds an build object by using the processing beam from the beam scanning apparatus.
The processing apparatus according to claim 55 or 56, wherein
an irradiation position of the processing beam is located below the beam scanning apparatus.
The processing apparatus according to any one of claims 55 to 57, further comprising:
a processing chamber in which the processing beam passed.
The processing apparatus according to claim 58, wherein
the beam scanning apparatus is disposed above at least part of the processing chamber or in a top wall of the processing chamber.
The processing apparatus according to any one of claims 55 to 59, further comprising:
a plurality of the beam scanning apparatuses.
The processing apparatus according to claim 60, further comprising:
a processing chamber in which a plurality of the processing beams passed,
wherein the beam scanning apparatuses are disposed above at least part of the processing chamber or in a top wall of the processing chamber.
The processing apparatus according to claim 60 or 61, wherein
a first set of beam scanning apparatuses of the plurality of beam scanning apparatuses are disposed along a first row above the processing chamber,
a second set of beam scanning apparatuses of the plurality of beam scanning apparatuses are disposed along a second row, which is different from the first row, above the processing chamber,
the first and second rows are arranged along a direction intersecting with a direction of the first row.
The processing apparatus according to claim 62, wherein
each of the plurality of beam scanning apparatuses includes a connection member to which an emission end of an optical fiber is connected, the processing beam from a light source propagates through the optical fiber,
the connection members of the plurality of beam scanning apparatuses are directed outwardly.
The processing apparatus according to claim 62 or 63, wherein
each of the plurality of beam scanning apparatus includes a first optical window that is located on an optical path of the processing beam emitted from the scanning optical member.
The processing apparatus according to claim 64, wherein
the first optical windows of the beam scanning apparatuses disposed along the first row are located lateral to the first optical windows of the beam scanning apparatuses disposed along the second row,
the first optical windows of the beam scanning apparatuses disposed along the second row are located lateral to the first optical windows of the beam scanning apparatuses disposed along the first row.
A processing method comprising:
emitting the processing beam from the beam scanning apparatus according to any one of claims 1 to 54; and
processing an object by performing a scanning of the processing beam from the beam scanning apparatus.

[Claim 67] A processing method comprising:
emitting the processing beam from the processing apparatus according to any one of claims 55 to 65; and
processing by the processing beam.