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WO2023021749A1 - Dispositif d'éclairage pour une inspection - Google Patents

Dispositif d'éclairage pour une inspection Download PDF

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Publication number
WO2023021749A1
WO2023021749A1 PCT/JP2022/009782 JP2022009782W WO2023021749A1 WO 2023021749 A1 WO2023021749 A1 WO 2023021749A1 JP 2022009782 W JP2022009782 W JP 2022009782W WO 2023021749 A1 WO2023021749 A1 WO 2023021749A1
Authority
WO
WIPO (PCT)
Prior art keywords
rigid substrate
inspection
light
soldered
lighting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/009782
Other languages
English (en)
Japanese (ja)
Inventor
直人 松本
大祐 杉原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leimac Ltd
Original Assignee
Leimac Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leimac Ltd filed Critical Leimac Ltd
Priority to JP2023542201A priority Critical patent/JPWO2023021749A1/ja
Publication of WO2023021749A1 publication Critical patent/WO2023021749A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/10—Light sources with three-dimensionally disposed light-generating elements on concave supports or substrates, e.g. on the inner side of bowl-shaped supports
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an inspection illumination device for irradiating an article with light from a plurality of LEDs in order to inspect the article.
  • inspection An inspection apparatus has been used to perform visual inspection for defects, scratches, stains, foreign matter, etc.).
  • Various inspection lighting devices are used depending on the article to be inspected. There are also those that irradiate the article from a direction close to the horizontal direction.
  • FIG. 3 of Patent Document 1 discloses an inspection lighting device in which a plurality of bullet-shaped LEDs (light-emitting elements) are arranged inwardly in an annular manner and slightly inclined toward the article side.
  • This inspection lighting device has a light reflecting surface inside the LED and on the side of the camera (illumination detection device). Irradiate the article.
  • FIG. 4 discloses an inspection illumination device in which a plurality of bullet-shaped LEDs are circularly arranged inward without being inclined toward the article.
  • This inspection illuminator has no light-reflecting surface and has a diffuser with a particularly high diffusing power inside the LEDs, which illuminates the article with light from the LEDs through this diffuser towards the article.
  • the inspection illumination device disclosed in FIGS. 3 and 4 illuminates a component attached to a substantially flat surface as an inspection object from a nearly horizontal direction.
  • the LEDs are slightly tilted toward the article side, and a diffuser having a particularly high diffusion capability is arranged.
  • the configuration is not simple, and the range of the distance between the inspection illumination device and the article, which can inspect the article, is limited.
  • the present invention has been made in view of the above circumstances, and an object of the present invention is to provide an inspection lighting device capable of widening the distance between an inspection lighting device capable of inspecting an article and an article with a simple configuration. It is to provide a device.
  • an inspection illumination device comprises a housing having an article-side light passage portion and a camera-side light passage portion; a long rigid substrate arranged in the length direction and soldered to the surface and bent into an annular shape so that the surface faces inward; An anode-side soldering portion to which the anode-side terminals of each of the plurality of chip LEDs are soldered, and cathode-side terminals of each of the plurality of chip LEDs are soldered to the surface of the rigid substrate.
  • the respective anode side soldering section and the respective cathode side soldering section extend parallel to each other in the longitudinal direction of the rigid substrate.
  • the light reflecting layer can be white or specular.
  • the rigid substrate may be a glass epoxy substrate or a glass composite substrate on which a conductor pattern is formed.
  • the inspection illumination device may further include a heat radiation sheet that is bent into a ring shape and is in contact with the rigid substrate.
  • the inspection lighting device of the present invention it is possible to widen the distance between the inspection lighting device capable of inspecting the article and the article with a simple configuration.
  • FIG. 1B is a cross-sectional view (a cross-sectional view taken along the line AA in FIG. 1B) showing the inspection illumination device according to the embodiment of the present invention; It is a bottom view which shows the lighting apparatus for an inspection same as the above, and is in the state which removed the housing bottom plate part.
  • FIG. 4 is a circuit diagram showing an example of a circuit realized by a rigid board of the inspection lighting device;
  • FIG. 3 is an external view showing the surface of the rigid substrate before the chip LED of the inspection lighting device is soldered;
  • FIG. 10 is an explanatory diagram for explaining the state of light in the inspection lighting device same as the above in a cross-sectional view, in the case where the distance between the inspection lighting device and the article is narrow.
  • FIG. 10 is an explanatory diagram for explaining the state of light in the same inspection illumination device with a cross-sectional view, in the case where the distance between the inspection illumination device and the article is wide.
  • An inspection illumination device 1 includes a housing 2 and a rigid board 3, as shown in FIGS. 1A and 1B.
  • the inspection illumination device 1 can be used with the article M to be inspected positioned below and the camera C for photographing the article M positioned above (see FIGS. 4 and 5 described later).
  • the inspection illumination device 1 has a cable 1a, and is used by connecting a connector 1b of the cable 1a to a light control device or the like (not shown).
  • the housing 2 supports the rigid board 3.
  • the housing 2 has an article-side light passage portion 2a through which light passes on the article M side, and a camera-side light passage portion 2b through which light passes on the camera C side.
  • the housing 2 can be configured by a housing body portion 2c and a housing bottom plate portion 2d below it.
  • the article-side light passage portion 2a is formed in the housing bottom plate portion 2d.
  • the housing 2 can be generally cylindrical with a low height.
  • the housing 2 is made of a metal material such as aluminum or copper, a resin material, or the like.
  • the housing 2 has a light reflecting layer 21 between the peripheral edge of the camera-side light passing portion 2b and the rigid substrate 3.
  • the light reflecting layer 21 reflects light and is white or specular, for example.
  • the light reflecting layer 21 may be a separate member from the rest of the housing 2 and attached, or may be coated on the housing 2 .
  • the rigid board 3 is arranged inside the housing 2 .
  • the rigid board 3 is a long one in which a plurality of chip LEDs 30 are arranged in the longitudinal direction and soldered to the surface, and is bent into an annular shape so that the surface faces inward (see FIG. 1B).
  • the rigid substrate 3 is thin enough to be bent into a circular shape.
  • a circularly bent heat dissipation sheet 4 can be provided around the rigid substrate 3, as shown in FIGS. 1A and 1B.
  • the heat dissipation sheet 4 can be in contact with the rigid board 3 .
  • the reference numeral 30 of the LED 30 is attached only to the central LED 30 in FIG. 1A and the left and right cross-sectional LEDs.
  • the side surfaces (surfaces in the thickness direction) of the LEDs 30 gradually become visible as they are arranged leftward or rightward from the center.
  • FIG. 2 shows a specific circuit example of the rigid substrate 3.
  • the number of chip LEDs 30 soldered to the rigid substrate 3 is 36, and 12 of the three chip LEDs 30 connected in series are connected in parallel.
  • a resistor 31 is also connected in series to each of the three chip LEDs 30 connected in series.
  • Each of the series-connected three chip LEDs 30 and the resistor 31 is connected to the plus side power supply wiring cord 1aa (more specifically, the conductor therein) and the minus side power supply wiring cord 1ab (more specifically, the conductor in it) included in the cable 1a. conductors) are connected to power wiring cord connection portions 32 and 33 connected by soldering or the like.
  • Reference numerals 34 and 35 respectively denote an anode-side soldering portion to which the anode-side terminal of the chip LED 30 is soldered, and a cathode-side soldering portion to which the cathode-side terminal of the chip LED 30 is soldered.
  • 37 designates the resistor soldering points to which the two terminals of the resistor 31 are soldered.
  • the rigid board 3 a long board such as a glass epoxy board or a glass composite board is used, in which conductor patterns are formed on the front and back surfaces of the board body.
  • the portions to be soldered (soldered portions) in the conductor pattern are exposed, and the portions other than the soldered portions are covered with a solder resist or the like.
  • FIG. 3 corresponds to FIG. 2 and shows an example of a specific appearance of the surface of the rigid substrate 3 before the chip LED 30 is soldered.
  • the conductor pattern on the surface is indicated by dashed lines, and the soldered portion is indicated by solid lines.
  • anode-side soldering portions 34 to which the anode-side terminals of the chip LEDs 30 are soldered, and cathode-side soldering portions 35 to which the cathode-side terminals of the chip LEDs 30 are soldered are respectively arranged according to the number of the chip LEDs 30 ( For example, 36) are provided.
  • each anode-side soldering portion 34 and each cathode-side soldering portion 35 extend parallel to each other in the longitudinal direction of the rigid substrate 3 (the direction in which the long rigid substrate 3 extends).
  • the anode-side soldering portion 34 and the cathode-side soldering portion 35 have different widths (dimensions in the direction perpendicular to the length direction), but they may be the same.
  • the resistor 31 can be soldered to the resistor soldering portions 36 and 37 provided on the back surface of the rigid substrate 3 .
  • the power wiring cord connection portions 32 and 33 can be provided on the back surface of the rigid substrate 3 .
  • the resistor 31 is omitted in FIGS. 1A and 1B.
  • the rigid substrate 3 is bent in the length direction after soldering the chip LED 30 and the like. At this time, the rigid substrate 3 is bent with a considerably large curvature, but each of the chip LEDs 30 is soldered at the anode side soldering portion 34 and the cathode side soldering portion 35 extending in the longitudinal direction of the rigid substrate 3. Therefore, stress due to bending can be alleviated, and as a result, cracking can be prevented.
  • the rigid board 3 is formed into a ring shape and placed in the housing 2 with both ends 3a and 3b coupled (see FIG. 1B). Before and after that, the positive side power supply wiring cord 1aa (more specifically, the conductor therein) and the negative side power supply wiring cord 1ab (more specifically, the conductor therein) included in the cable 1a are connected to the power supply wiring cord connection portion 32, 33 by soldering or the like.
  • the positions of the connecting portions 3a and 3b of the rigid board 3 and the positions of the power wiring cord connecting portions 32 and 33 in the housing 2 are not limited to the positions shown in FIG. 1B.
  • the inspection lighting device 1 when voltage and current are supplied through the cable 1a (the positive side power wiring cord 1aa and the negative side power wiring cord 1ab), the current flows through each of the chip LEDs 30, as shown in FIGS.
  • light (schematically indicated by dashed lines with arrows in FIGS. 4 and 5) is emitted from the plurality of LEDs 30 on the rigid substrate 3 at a predetermined directivity angle (angle at which the light spreads) centering on the horizontal direction. be radiated.
  • the light from the chip LED 30 that passes through the article-side light passage portion 2a and travels directly toward the article M and the light reflected by the light reflecting layer 21 pass through the article-side light passage portion 2a.
  • the article M is illuminated by light directed towards it. Reflected light from the article M (schematically indicated by the dashed-dotted lines with arrows in FIGS. 4 and 5) passes through the article-side light passage portion 2a and the camera-side light passage portion 2b and is arranged upward. incident on camera C. Thus, the article M is photographed by the camera C and inspected.
  • the inspection illumination device 1 can be easily made to have high brightness by using the chip LEDs 30 .
  • the inspection illumination device 1 generally has a large directivity angle of the chip LED 30, it is possible to inspect the article M by using the light that is directed directly toward the article M and the light that is reflected by the light reflecting layer 21 and then directed toward the article M.
  • the distance G (see FIGS. 4 and 5) between the inspection illumination device 1 and the article M can be widened. It is possible to make the amount of light that directly passes through (leaks from) the camera-side light passage portion 2b among the light emitted from the chip LED 30 extremely small.
  • the inspection illumination device 1 can widen the distance G between the inspection illumination device 1 capable of inspecting the article M and the article M with a simple configuration.

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

L'invention concerne un dispositif d'éclairage pour une inspection à l'aide duquel il est possible, au moyen d'une configuration simple, d'élargir la plage de distances entre un objet et le dispositif d'éclairage pour une inspection dans laquelle une inspection de l'objet est possible. Ce dispositif d'éclairage (1) pour une inspection comprend : un boîtier (2) qui présente une partie de transmission de lumière côté objet (3a) et une partie de transmission de lumière côté caméra (2b) ; et un substrat rigide allongé (3) qui est disposé dans le boîtier (2), présente une pluralité de DEL à puce (30) agencées en ligne dans la direction de la longueur et brasées à une surface de cette dernière et est plié sous la forme d'un anneau de sorte que ladite surface se trouve sur le côté interne. Le boîtier (2) présente une couche de réflexion de lumière (21) entre le bord de la partie de transmission de lumière côté caméra (2b) et le substrat rigide (3). Des parties brasées côté anode (34) auxquelles des bornes côté anode respectives de la pluralité de DEL à puce (30) sont brasées et des parties brasées côté cathode (35) auxquelles des bornes côté cathode respectives de la pluralité de DEL à puce (30) sont brasées sont disposées sur la surface du substrat rigide (3). Les parties brasées côté anode (34) et les parties brasées côté cathode (35) s'étendent parallèlement les unes aux autres dans la direction de la longueur du substrat rigide (3).
PCT/JP2022/009782 2021-08-17 2022-03-07 Dispositif d'éclairage pour une inspection Ceased WO2023021749A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023542201A JPWO2023021749A1 (fr) 2021-08-17 2022-03-07

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021133000 2021-08-17
JP2021-133000 2021-08-17

Publications (1)

Publication Number Publication Date
WO2023021749A1 true WO2023021749A1 (fr) 2023-02-23

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PCT/JP2022/009782 Ceased WO2023021749A1 (fr) 2021-08-17 2022-03-07 Dispositif d'éclairage pour une inspection

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JP (1) JPWO2023021749A1 (fr)
WO (1) WO2023021749A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003031005A (ja) * 2001-07-18 2003-01-31 Rabo Sufia Kk 発光ダイオード照明装置
JP2005122918A (ja) * 2003-10-14 2005-05-12 Kyoto Denkiki Kk 照明装置及びその製造方法
WO2009125618A1 (fr) * 2008-04-11 2009-10-15 ハリソン東芝ライティング株式会社 Dispositif électroluminescent
DE102012109146A1 (de) * 2012-09-27 2014-03-27 Osram Opto Semiconductors Gmbh Ringlichtmodul und Verfahren zur Herstellung eines Ringlichtmoduls
JP2017147180A (ja) * 2016-02-19 2017-08-24 ローム株式会社 Ｌｅｄ照明装置、および、検査装置
WO2019131916A1 (fr) * 2017-12-28 2019-07-04 シーシーエス株式会社 Dispositif électroluminescent et son procédé de fabrication

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003031005A (ja) * 2001-07-18 2003-01-31 Rabo Sufia Kk 発光ダイオード照明装置
JP2005122918A (ja) * 2003-10-14 2005-05-12 Kyoto Denkiki Kk 照明装置及びその製造方法
WO2009125618A1 (fr) * 2008-04-11 2009-10-15 ハリソン東芝ライティング株式会社 Dispositif électroluminescent
DE102012109146A1 (de) * 2012-09-27 2014-03-27 Osram Opto Semiconductors Gmbh Ringlichtmodul und Verfahren zur Herstellung eines Ringlichtmoduls
JP2017147180A (ja) * 2016-02-19 2017-08-24 ローム株式会社 Ｌｅｄ照明装置、および、検査装置
WO2019131916A1 (fr) * 2017-12-28 2019-07-04 シーシーエス株式会社 Dispositif électroluminescent et son procédé de fabrication

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JPWO2023021749A1 (fr) 2023-02-23

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