[go: up one dir, main page]

WO2020118707A1 - Module d'alimentation électrique et son procédé de fabrication, et appareil de communication - Google Patents

Module d'alimentation électrique et son procédé de fabrication, et appareil de communication Download PDF

Info

Publication number
WO2020118707A1
WO2020118707A1 PCT/CN2018/121287 CN2018121287W WO2020118707A1 WO 2020118707 A1 WO2020118707 A1 WO 2020118707A1 CN 2018121287 W CN2018121287 W CN 2018121287W WO 2020118707 A1 WO2020118707 A1 WO 2020118707A1
Authority
WO
WIPO (PCT)
Prior art keywords
printed circuit
circuit board
magnetic core
plastic package
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/121287
Other languages
English (en)
Chinese (zh)
Inventor
潘伟健
王丁丁
江群
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to PCT/CN2018/121287 priority Critical patent/WO2020118707A1/fr
Publication of WO2020118707A1 publication Critical patent/WO2020118707A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Definitions

  • the present application relates to the technical field of power supply, in particular to a power supply module, a preparation method thereof, and a communication device.
  • the power supply module refers to a module provided in the communication device to supply power to the communication device, and is widely used in communication devices such as base stations, switches, or routers.
  • the power supply module usually includes a power supply body and a plastic package wrapped on the outside of the power supply body.
  • the power supply body includes an assembled printed circuit board (Printed Circuit Board + Assembly, PCBA), electronic components soldered on the surface of the PCBA, and assembled on the PCBA
  • PCBA printed Circuit Board + Assembly
  • the power pins on the side of the PCBA and the plastic package have an opening in the region corresponding to each magnetic core, and the side of each magnetic core away from the PCBA is exposed from the plastic package through the corresponding opening.
  • the magnetic core air gap there is a narrow gap between the two magnetic cores, which is called the magnetic core air gap, and the electrical performance of the power supply module can be controlled by controlling the width of the magnetic core air gap.
  • the existence of the plastic package causes the stress of the magnetic core to be large, and cracks easily occur when the magnetic core is stressed, so the reliability of the power module is low.
  • the embodiments of the present application provide a power module, a method for manufacturing the same, and a communication device, which can reduce the probability of a crack in a magnetic core and improve the reliability of the power module.
  • the technical scheme of this application is as follows:
  • the power supply module includes a power supply body and a plastic package wrapped around the power supply body.
  • the power supply body includes a printed circuit board and a magnetic core provided on the printed circuit board.
  • the region corresponding to the magnetic core has an opening, and the side of the magnetic core away from the board surface of the printed circuit board is exposed from the plastic package through the opening, and the region where the magnetic core is exposed from the plastic package has a gap. Since the magnetic core has a gap, the gap can release the stress on the magnetic core, reduce the stress of the magnetic core, thereby reducing the probability of cracks when the magnetic core is stressed, and improving the reliability of the power supply module.
  • the gap on the magnetic core can achieve the same function as the air gap of the magnetic core, so the gap can also be called the core air gap.
  • the cross section of the slit in a direction perpendicular to the board surface of the printed circuit board is stepped.
  • the power supply main body includes two magnetic cores arranged oppositely, the two magnetic cores are glued and fixed on the printed circuit board by glue, and the two surfaces of the two magnetic cores far away from the printed circuit board are located on different sides of the printed circuit board
  • the plastic package On the side of the board surface, the plastic package has an opening in the area corresponding to each magnetic core, the side of each magnetic core away from the printed circuit board is exposed from the plastic package through the corresponding opening, and each magnetic core is exposed from the area of the plastic package With a gap, the orthographic projections of the gaps on the two magnetic cores on the same surface of the printed circuit board coincide.
  • the colloid is a filler-free glue, specifically a glue without glass beads, such as epoxy resin glue, and the undoped glass beads in the colloid can avoid complicating the stress on the magnetic core and further reduce the stress on the magnetic core The probability of cracks increases the reliability of the power module.
  • the gap is filled with a protective medium, which may be a colloid.
  • the protective medium can protect the gap to prevent the gap from being contaminated or foreign objects falling into the gap.
  • the main body of the power supply further includes electronic components disposed on the surface of the printed circuit board, the plastic package wraps the surface of the printed circuit board, the magnetic core, and the electronic components, and the side of the printed circuit board starts from the plastic package It is exposed that the power module also includes power pins arranged on the side of the printed circuit board.
  • the power supply pin can facilitate the assembly of the power supply module and other modules in the communication device.
  • the method includes:
  • An opening is formed in the region corresponding to the magnetic core on the plastic package, and the side of the magnetic core away from the board surface of the printed circuit board is exposed from the plastic package through the opening;
  • a gap is formed in the area where the magnetic core is exposed from the plastic package.
  • the gap can release the stress on the magnetic core, reduce the stress of the magnetic core, thereby reducing the probability of cracks when the magnetic core is stressed, and improving the reliability of the power module .
  • the gap on the magnetic core can achieve the same function as the air gap of the magnetic core, so the gap can also be called the core air gap.
  • the cross section of the slit in a direction perpendicular to the board surface of the printed circuit board is stepped.
  • forming an opening in a region corresponding to the magnetic core on the plastic package includes: grinding the region corresponding to the magnetic core on the plastic package through a grinding process to form an opening;
  • Forming a gap in the area where the magnetic core is exposed from the plastic package includes cutting the area where the magnetic core is exposed from the plastic package to form a gap. Since the gap is obtained by cutting, the width of the gap can be freely controlled, and because the gap can be called a core air gap, the width of the gap can be freely controlled, that is, the width of the core air gap can be freely controlled.
  • setting a magnetic core on the printed circuit board includes: setting two magnetic cores on the printed circuit board, the two magnetic cores are glued and fixed on the printed circuit board by a glue, and the two magnetic cores are far away
  • the two sides of the printed circuit board are located on the side of the different board surfaces of the printed circuit board; wherein, the glue is a filler-free glue, which may specifically be a glue without glass beads, such as epoxy resin glue, the glue is not doped with glass beads, It can avoid the complication of the stress on the magnetic core, further reduce the probability of cracks when the magnetic core is stressed, and improve the reliability of the power module.
  • An opening is formed in the region corresponding to the magnetic core on the plastic package, and the side of the magnetic core away from the board surface of the printed circuit board is exposed from the plastic package through the opening, including: forming an opening in the region corresponding to each magnetic core on the plastic package, each The side of the magnetic core away from the printed circuit board is exposed from the plastic package through the corresponding opening;
  • Forming a gap in the area where the magnetic core is exposed from the plastic package including: forming a gap in the area where each magnetic core is exposed from the plastic package, the orthographic projection of the gap on the two cores on the same surface of the printed circuit board coincide.
  • the method further includes: filling a protective medium in the gap.
  • the protective medium can protect the gap to prevent the gap from being contaminated or foreign objects falling into the gap.
  • filling the gap with a protective medium includes: filling the gap with colloid, and curing the filled colloid.
  • the method further includes: providing electronic components on the surface of the printed circuit board;
  • a plastic package covering the power supply body is formed on the outside of the power supply body, including: forming a plastic package covering the board surface of the printed circuit board, magnetic core and electronic components on the outside of the power supply body, and the side of the printed circuit board is exposed from the plastic package ;
  • the method further includes: welding the power supply pins on the side of the printed circuit board.
  • a communication device in still another aspect, includes the power supply module provided in the first aspect or any optional manner of the first aspect.
  • the power module provided by the embodiments of the present application, a method for manufacturing the same, and a communication device.
  • the magnetic core has a gap, and the gap can release the stress of the magnetic core, so the probability of cracks in the magnetic core can be reduced and the power supply can be improved.
  • the two magnetic cores in the power module are bonded by glue without glass beads, which can avoid the complication of the stress on the magnetic core caused by the presence of the glass beads and further reduce the occurrence of cracks when the magnetic core is stressed Probability, improve the reliability of the power supply module; in addition, the gap on the magnetic core can achieve the same function as the core air gap, so the gap on the core can also be called the core air gap, because the width of the gap on the core It can be freely controlled, so the solution provided by the embodiments of the present application can freely control the width of the magnetic core air gap.
  • FIG. 1 is a front view of a power module provided by an embodiment of the present application.
  • FIG. 2 is a cross-sectional view of the A-A part of the power supply module shown in FIG. 1;
  • FIG. 3 is a flow chart of a method for preparing a power module provided by an embodiment of the present application.
  • FIG. 4 is a schematic diagram of an electronic component provided on a board surface of a printed circuit board provided by an embodiment of the present application
  • FIG. 5 is a schematic diagram of a magnetic core provided on a surface of a printed circuit board provided by an embodiment of the present application
  • FIG. 6 is a schematic diagram of a plastic package wrapped around a power supply body provided by an embodiment of the present application.
  • FIG. 7 is a top view of FIG. 6;
  • FIG. 8 is a schematic diagram of an opening provided in an area corresponding to a magnetic core on a plastic package provided by an embodiment of the present application;
  • FIG. 9 is a schematic diagram of a gap formed on a region where a magnetic core is exposed from a plastic package according to an embodiment of the present application.
  • Fig. 10 is a cross-sectional view taken along the line B-B shown in Fig. 9.
  • the power supply module refers to a module that is provided in the communication device to supply power to the communication device.
  • the power supply module usually exists in a rectangular parallelepiped shape similar to a brick, and the input voltage and output voltage of the power supply are usually isolated, so the power supply in the communication device
  • the module can also be called an isolated power brick module.
  • the traditional power supply module includes PCBA, electronic components soldered on the surface of PCBA, two magnetic cores assembled on PCBA and oppositely arranged, and power supply pins soldered on the side of PCBA.
  • the narrow gap is called the core air gap, and the electrical performance of the power module can be controlled by controlling the width of the core air gap.
  • the process of preparing the power module involves the assembly process of the magnetic core (refers to the process of assembling the magnetic core on the PCBA).
  • the industry generally sets glass bead glue or dielectric sheets between the two magnetic cores to control the width of the magnetic core air gap
  • the width of the magnetic core air gap cannot be freely controlled, and the width of the magnetic core air gap is easily too large or too small, resulting in process problems for the power module.
  • the width of the core air gap is controlled by setting glass bead glue or dielectric sheets
  • the width of the core air gap of different power modules may be different, making it difficult to realize the core air
  • the width of the gap is consistent, so after the core assembly process is completed, the electrical performance of the power module needs to be tested to screen out the unqualified power module and rework.
  • the power module is provided with a plastic package on the outside of the traditional power module.
  • Plastic molding process In addition, the glass
  • bead glue or dielectric sheet complicates the internal stress of the power module, resulting in a more complex stress on the magnetic core. This makes the magnetic core more prone to cracks when stressed, which further reduces the reliability of the power module.
  • Embodiments of the present application provide a power module, a manufacturing method thereof, and a communication device.
  • a gap is provided on the magnetic core, and the gap can release the stress of the magnetic core, reduce the probability of cracks in the magnetic core, and improve the power supply
  • the reliability of the module further, the two magnetic cores in the power module are bonded by glue without glass beads, which can avoid the complication of the stress on the magnetic core caused by the presence of the glass beads and further reduce the occurrence of cracks when the magnetic core is stressed Probability, improve the reliability of the power module; in addition, the gap on the magnetic core can achieve the same function as the air gap of the magnetic core (that is, the electrical performance of the power module can be controlled by controlling the width of the gap), so the gap can also be called It is a magnetic core air gap.
  • the width of the gap can be freely controlled, the width of the magnetic core air gap can be freely controlled.
  • the solution provided by the embodiments of the present application can reduce the probability of cracks in the magnetic core and improve the reliability of the power module under the condition of freely controlling the width of the air gap of the magnetic core.
  • FIG. 1 is a front view of a power module 0 provided by an embodiment of the present application
  • FIG. 2 is a cross-sectional view of the AA part of the power module 0 shown in FIG. 1, referring to FIGS. 1 and 2,
  • the power module 0 includes: a power supply The main body 01 and the plastic package 02 wrapped on the outside of the power supply body 01.
  • the power supply body 01 includes a printed circuit board 011 and a magnetic core 012 provided on the printed circuit board 011.
  • the area of the plastic package 02 corresponding to the magnetic core 012 has an opening (Both not shown in Figures 1 and 2), the side of the magnetic core 012 far away from the surface of the printed circuit board 011 is exposed from the plastic package 02 through the opening, and the magnetic core 012 has a gap in the area exposed from the plastic package 02 ( Figure 1 and 2 are not marked). Since the magnetic core 012 has a gap, which can release the stress of the magnetic core 012, the probability of cracks in the magnetic core 012 can be reduced and the separation of the magnetic core 012 from the plastic package 02 can be avoided, thereby improving the reliability of the power module 0. In addition, the gap 012 can achieve the same function as the magnetic core air gap, so the gap 012 can also be called a magnetic core air gap, and the electrical performance of the power module 0 can be controlled by controlling the width of the gap 012.
  • the printed circuit board 011 may be PCBA
  • the plastic package 02 is a plastic package formed by plastic through a plastic packaging process
  • the structure of the plastic package 02 is usually a cube
  • the plastic package 02 can protect the printed circuit board 011 and the magnetic core 012 and fixed.
  • the description of the printed circuit board 011 and the plastic package 02 in this article is only exemplary, and the structure and materials of the printed circuit board 011 and the plastic package 02 can be set according to the actual situation. There is no restriction on this.
  • the power source body 01 includes two magnetic cores 012 oppositely arranged, the two magnetic cores 012 are adhered by the glue R and fixed on the printed circuit board 011 by the glue R, each magnetic core 012 has a side far away from the printed circuit board 011, two sides of the two magnetic cores 012 far away from the printed circuit board 011 are located on different sides of the printed circuit board 011, and a region corresponding to each magnetic core 012 on the plastic package 02 With an opening, the side of each magnetic core 012 away from the printed circuit board 011 is exposed from the plastic package 02 through the corresponding opening, each magnetic core 012 has a gap in the area exposed from the plastic package 02, the gap on the two magnetic cores 012 The orthographic projections on the same surface of the printed circuit board 011 coincide.
  • each magnetic core 012 may have multiple slits (two are shown in FIGS. 1 and 2), and each slit is in a direction perpendicular to the board surface of the printed circuit board 011
  • the cross-section of can be stepped, and the orthographic projections of the gaps on the two magnetic cores 012 on the same board surface of the printed circuit board 011 coincide with each other.
  • the printed circuit board 011 is provided with a plurality of magnetic core mounting holes penetrating along the thickness direction of the printed circuit board 011 (both not shown in FIGS. 1 and 2 ),
  • Each magnetic core 012 has a plurality of magnetic core mounting feet (not shown in FIG. 1 and FIG.
  • the two magnetic cores 012 include upper magnetic layers
  • the core and the lower layer magnetic core, the side of the upper layer magnetic core close to the printed circuit board 011 is fixed on the board surface of the printed circuit board 011 by the glue R.
  • the thickness direction of the printed circuit board 011 is perpendicular to the surface of the printed circuit board 011.
  • the glue can be a filler-free glue, specifically a glue without glass beads, such as epoxy resin glue, and the mechanical properties of glue without glass beads.
  • the mechanical properties of the magnetic core 012 are more matched.
  • each gap of the magnetic core 012 is filled with a protective medium P, which may be a colloid, and may be glue without glass beads.
  • the protective medium P can protect the gap on the magnetic core 012 to prevent the gap from being contaminated or foreign objects falling into the gap.
  • the power supply body 01 further includes electronic components 013 disposed on the surface of the printed circuit board 011, a plastic enclosure 02 wrapping the surface of the printed circuit board 011, the magnetic core 012, and the electronics
  • the component 013, the side of the printed circuit board 011 (neither is shown in FIG. 2) is exposed from the plastic package 02.
  • electronic components 013 can be provided on both surfaces of the printed circuit board 011, and the electronic components 013 can be soldered on the surface of the printed circuit board 011.
  • each electronic component 013 may be an active component or a passive component, and multiple electronic components 013 may include and/or passive components (that is, the power module 0 may include active components and/or Passive components), active components are also called active components, passive components are also called passive components.
  • the power module 0 further includes a power pin 03 provided on the side of the printed circuit board 011, and a power pin 03 is provided on each side of the printed circuit board 011.
  • the pin 03 can be soldered on the side of the printed circuit board 011, and the power pin 03 is used to assemble the power module 0 in the communication device.
  • the power pin 03 described in the embodiment of the present application is provided on the side of the printed circuit board 011 is only exemplary, in practical applications, the power pin 03 can be provided at any position of the printed circuit board 011, as long as the guarantee The power pin 03 does not interfere with the operation of other devices on the printed circuit board 011 and can easily assemble the power module 0 in the communication device.
  • the plastic package 02 is formed by a plastic packaging process.
  • the plastic packaging material will enter the gap in the power supply body 01, for example, as shown in FIG. 2
  • the plastic encapsulant will enter the gap between the lower magnetic core and the surface of the printed circuit board 011.
  • the upper magnetic core and the lower magnetic core in the embodiments of the present application describe the two magnetic cores only from the orientation shown in the drawings, and the upper magnetic core and the lower magnetic core are relatively speaking, for example, For the power module 0 shown in FIG.
  • the upper magnetic core refers to the magnetic core located on the printed circuit board 011 and the side far away from the printed circuit board 011 is located above the printed circuit board 011 shown in FIG. 2
  • the lower magnetic core refers to the magnetic core located on the printed circuit board 011, and the side far away from the printed circuit board 011 is located under the printed circuit board 011 shown in FIG. 2, it is not difficult to understand, when shown in FIG. 2 After the power module 0 rotates 180 degrees, the upper magnetic core and the lower magnetic core are interchanged.
  • the solutions provided by the embodiments of the present application are mainly used to control the width of the magnetic core air gap of the power module. Therefore, the above embodiment only shows the structure related to the width of the magnetic core air gap in the power module.
  • the power supply module also includes other devices or structures, which are not described in detail in the embodiments of the present application.
  • the magnetic core has a gap, which can release the stress of the magnetic core, so the probability of cracks in the magnetic core can be reduced, and the reliability of the power module can be improved; further Ground, the two magnetic cores in the power module are bonded by glue without glass beads, which can avoid the complication of the stress on the magnetic core caused by the presence of the glass beads, further reduce the probability of cracks when the magnetic core is stressed, and improve the power module Reliability; in addition, the gap on the core can achieve the same function as the core air gap, so the gap on the core can also be called the core air gap, because the width of the gap on the core can be freely controlled, so this
  • the solution provided in the embodiments of the application can freely control the width of the air gap of the magnetic core.
  • the solution provided by the embodiments of the present application can avoid the use of glass bead glue and dielectric sheets, thereby avoiding complicating the stress of the magnetic core caused by the glass bead glue or dielectric sheets,
  • the power module provided by the embodiment of the present application may be used in the method described below.
  • FIG. 3 is a flowchart of a method for preparing a power module provided by an embodiment of the present application. This method can be used to prepare the power module 0 provided by the above embodiment. Referring to FIG. 3, the method includes the following steps:
  • Step 301 Set electronic components on the surface of the printed circuit board.
  • FIG. 4 is a schematic diagram of an electronic component 013 provided on the surface of a printed circuit board 011 provided by an embodiment of the present application.
  • the printed circuit board 011 has two opposite surfaces, each An electronic component 013 is provided on the surface, so that a plurality of electronic components 013 are provided on the surface of the printed circuit board 011.
  • the printed circuit board 011 may be a PCBA
  • the electronic component 013 may be an active component or a passive component
  • the plurality of electronic components 013 provided on the surface of the printed circuit board 011 may include an active component and/or a passive component.
  • the electronic component 013 may be soldered on the surface of the printed circuit board 011.
  • the printed circuit board 011 is provided with pads on the board surface, and the electronic component 01 and the pads on the printed circuit board 011 can be soldered by a welding process to form a board on the printed circuit board 011 Electronic components 013 are soldered on the surface. It should be noted that after the soldering is completed, the residual flux on the surface of the printed circuit board 011 can be cleaned to avoid the impact of the residual flux on the subsequent process and the performance of the power module.
  • Step 302 Set a magnetic core on the printed circuit board to obtain a power supply main body.
  • FIG. 5 is a schematic diagram of providing a magnetic core 012 on a printed circuit board 011 provided by an embodiment of the present application. After setting the magnetic core 012 on the printed circuit board 011, a power supply main body 011 can be obtained. Referring to FIG. 5, two magnetic cores 012 are provided on the printed circuit board 011, and the two magnetic cores 012 are opposite, and the orthographic projections of the two magnetic cores 012 on the same board surface of the printed circuit board 011 coincide.
  • each magnetic core 012 has a side away from the printed circuit board 011, and the two magnetic cores 012 are away from the printed circuit board 011 Both sides are located on the side of the different board surfaces of the printed circuit board 011.
  • the printed circuit board 011 is provided with a plurality of magnetic core mounting holes K penetrating along the thickness direction y of the printed circuit board 011, combined with FIGS. 4 and 5, each magnetic core 012 There are a plurality of magnetic core mounting feet that are in one-to-one correspondence with a plurality of magnetic core mounting holes K (both not shown in FIG. 4 and FIG.
  • the multiple magnetic core mounting feet of each magnetic core 012 correspond to In the magnetic core mounting hole K, the magnetic core mounting feet of the two magnetic cores 012 located in the same magnetic core mounting hole K are bonded through the glue R, and at least one of the two magnetic cores 012 is close to the side of the printed circuit board 011 It is fixed on the surface of the printed circuit board 011 by the colloid R, so that the two magnetic cores 012 are fixed on the printed circuit board 011.
  • the two magnetic cores 012 include an upper layer magnetic core and a lower layer magnetic core, and the side of the upper layer magnetic core close to the printed circuit board 011 is fixed on the board surface of the printed circuit board 011 by the glue R. As shown in FIG.
  • one side of the magnetic core 012 (for example, the upper magnetic core) with the magnetic core mounting foot may be coated with colloid R, and then the A plurality of magnetic core mounting feet of the magnetic core 012 (for example, the upper magnetic core) are correspondingly arranged in the plurality of magnetic core mounting holes K, and an adhesive force is applied to the magnetic core 012 (for example, the upper magnetic core), and then another A plurality of magnetic core mounting feet of a magnetic core 012 (for example, a lower layer magnetic core) are correspondingly arranged in the plurality of magnetic core mounting holes K, so that the magnetic core mounting feet of the two magnetic cores 012 are in one-to-one contact with each other
  • the magnetic core 012 exerts an adhesive force, and finally bake the colloid R to cure, so that two magnetic cores 012 are bonded, and one magnetic core 012 (for example, the upper core) is fixed on the printed circuit board 011 through the colloid R , So that the two magnetic cores
  • the colloid is a filler-free glue, which may specifically be a glue without glass beads.
  • the mechanical properties of the glue without glass beads are more matched with the mechanical properties of the magnetic core 012, and the glue without glass beads matching the mechanical properties of the magnetic core 012 is used.
  • the related art needs to consider the air gap of the magnetic core when setting the magnetic core on the surface of the printed circuit board, so the two magnetic cores are bonded with glass bead glue, or the medium is arranged between the two magnetic cores Chip, but this will make the internal stress of the finally prepared power module more complicated;
  • the magnetic core 012 is provided on the surface of the printed circuit board 011 in the embodiment of the present application, there is no need to consider the magnetic core air gap, so it can be passed without
  • the glue of the glass beads bonds the two magnetic cores 012, and there is no need to dispose a dielectric sheet between the two magnetic cores 012, so the internal stress of the power module finally prepared is relatively simple.
  • Step 303 Form a plastic package covering the power body on the outside of the power body.
  • FIG. 6 is a schematic view of a plastic enclosure 02 covering the power supply body formed on the outer side of the power supply body according to an embodiment of the present application.
  • FIG. 7 is a top view of FIG. 6. Referring to FIGS. 6 and 7, the plastic enclosure 02 is wrapped in printing. On the outer surface of the circuit board 011, the magnetic core 012, and the electronic component 013, the side surface of the printed circuit board 011 is exposed from the plastic package 02.
  • the structure of the plastic package 02 can be a cube, and the plastic package 02 can protect and fix the printed circuit board 011, the magnetic core 012, and the electronic component 013.
  • a plastic package 02 that wraps the printed circuit board 011, the magnetic core 012, and the electronic component 013 can be formed on the outside of the power supply body by a plastic packaging process, so that the side of the printed circuit board 011 is exposed from the plastic package 02
  • the plastic compound will enter the gap in the power source body 01.
  • the plastic compound will enter the gap between the lower magnetic core and the surface of the printed circuit board 011.
  • Step 304 An opening is formed in a region corresponding to the magnetic core on the plastic package. The side of the magnetic core away from the board surface of the printed circuit board is exposed from the plastic package through the opening.
  • FIG. 8 is a schematic diagram of an opening in a region corresponding to the magnetic core 012 on the plastic package 02 provided by an embodiment of the present application.
  • an opening in the region corresponding to each magnetic core 012 on the plastic package 02 is formed (FIG. (Not marked in 8), the side of each magnetic core 012 away from the printed circuit board 011 is exposed from the plastic package 012 through the corresponding opening.
  • a region corresponding to each magnetic core 012 on the plastic package 02 may be ground through a grinding process to form an opening corresponding to each magnetic core 012.
  • Step 305 Form a gap in the area where the magnetic core is exposed from the plastic package.
  • FIG. 9 is a schematic diagram of a gap Q formed on a region where the magnetic core 012 is exposed from the plastic package 02 according to an embodiment of the present application.
  • FIG. 10 is a cross-sectional view of the BB part shown in FIG. 9, see FIGS. 9 and 10 , A plurality of slits Q are formed in the area where the magnetic core 012 is exposed from the plastic package 02, and the cross section of each slit Q in the direction perpendicular to the board surface of the printed circuit board 011 is stepped, and the two magnetic cores 012 The orthographic projection of the gap Q on the same board surface of the printed circuit board 011 coincides.
  • the area where each magnetic core 012 is exposed from the plastic package 02 may be cut to form slits Q, and the cross section of each slit Q in the direction perpendicular to the board surface of the printed circuit board 011 is stepped.
  • the area where each magnetic core 012 is exposed from the plastic package 02 can be cut by laser or waterjet.
  • the gap Q can achieve the same function as the core air gap, so the gap Q can also be called a core air gap.
  • the gap Q Since the gap Q is obtained by cutting, it can be based on actual needs (such as a power module The efficiency of the working condition is optimized, the electrical performance requirements of the power module, etc.)
  • the gap Q with a width that meets the conditions is cut, that is, the air gap with the width that meets the conditions is cut. Therefore, the solution provided by the embodiments of the present application can achieve Free control of core air gap width.
  • Step 306 Fill the gap with a protective medium.
  • each gap Q may be filled with colloid, and then the filled colloid is cured to form the protective medium P.
  • curing the filled colloid may be, for example, heating the filled colloid or irradiated with ultraviolet rays, which may be determined according to the material of the filled glue, which will not be repeated in the embodiments of the present application.
  • Step 307 Weld the power pin on the side of the printed circuit board.
  • FIG. 1 for a schematic diagram after soldering the power pin 03 on the side of the printed circuit board 011.
  • a pad is provided on the side of the printed circuit board 011 (both in FIGS. 1 and 2 are not shown).
  • the power pin 03 may be soldered on the pad on the side of the printed circuit board 011 to solder the power pin 03 on the side of the printed circuit board 011.
  • the power pin 03 may be soldered on each side of the printed circuit board 011, or, as shown in FIG. 1, the power pin 03 may be soldered on two opposite sides of the printed circuit board 011, this application The embodiment does not limit this.
  • the embodiments of the present application are described by taking a power supply module as an example.
  • power supply modules are usually mass-produced.
  • the above steps 301 to 306 may be performed on a printed circuit board motherboard (including multiple On the basis of a printed circuit board), after step 306, the printed circuit board motherboard provided with electronic components, magnetic cores and plastic packages can be cut to obtain multiple initial power modules ( As shown in FIG. 9 and FIG. 10, the power supply pins are finally welded on the side of the printed circuit board of each initial power supply module to obtain a plurality of power supply modules, which will not be repeated in the embodiments of the present application.
  • the preparation method of the power module provided by the embodiment of the present application can improve the consistency of the specifications of the mass-produced power module and improve the electrical performance of the power module.
  • the manufacturing method of the power module provided by the embodiment of the present application has a gap in the magnetic core, which can release the stress of the magnetic core, so the probability of cracks in the magnetic core can be reduced and the reliability of the power module can be improved
  • the two magnetic cores in the power module are bonded by glue without glass beads, which can avoid the complication of the stress on the magnetic core caused by the presence of glass beads, further reduce the probability of cracks when the magnetic core is stressed, and improve The reliability of the power supply module;
  • the gap on the core can achieve the same function as the core air gap, so the gap on the core can also be called the core air gap, because the width of the gap on the core can be freely controlled Therefore, the solution provided by the embodiments of the present application can freely control the width of the air gap of the magnetic core.
  • the solution provided by the embodiments of the present application can avoid the use of glass bead glue and dielectric sheets, thereby avoiding complicating the stress of the magnetic core caused by the glass bead glue or dielectric sheets,
  • An embodiment of the present application also provides a communication device, which includes the power supply module 0 provided in the foregoing embodiment.
  • the communication device may be a communication device such as a base station, a switch, a router, or a repeater.
  • the solutions provided in the embodiments of the present application are mainly used for controlling the width of the magnetic core air gap of the power module.
  • the magnetic core air gap width control scheme can be applied not only to the power module, but also to any needs such as transformers.
  • the structure for controlling the width of the air gap of the magnetic core will not be repeated here.
  • the program may be stored in a computer-readable storage medium.
  • the mentioned storage medium may be a read-only memory, a magnetic disk or an optical disk, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

La présente invention concerne le domaine technique des alimentations électriques. La présente invention concerne un module d'alimentation électrique et son procédé de fabrication, et un appareil de communication. Le module d'alimentation électrique comprend un corps principal d'alimentation électrique et une enceinte en plastique logeant le corps principal d'alimentation électrique. Le corps principal d'alimentation électrique comprend une carte de circuit imprimé et un noyau magnétique placé au niveau de la carte de circuit imprimé. L'enceinte en plastique a une ouverture placée au niveau d'une région correspondant au noyau magnétique. Une surface du noyau magnétique éloignée d'une surface de la carte de circuit imprimé est exposée par l'enceinte en plastique à travers l'ouverture. Un espace est aménagé au niveau d'une région exposée du noyau magnétique à l'extérieur de l'enceinte en plastique. L'invention résout le problème selon lequel un noyau magnétique d'un module d'alimentation électrique se fissure facilement lorsqu'il est sollicité par une force, ce qui réduit ainsi le risque de formation de fissures dans un noyau magnétique, et améliore ainsi la fiabilité d'un module d'alimentation électrique.
PCT/CN2018/121287 2018-12-14 2018-12-14 Module d'alimentation électrique et son procédé de fabrication, et appareil de communication Ceased WO2020118707A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/121287 WO2020118707A1 (fr) 2018-12-14 2018-12-14 Module d'alimentation électrique et son procédé de fabrication, et appareil de communication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/121287 WO2020118707A1 (fr) 2018-12-14 2018-12-14 Module d'alimentation électrique et son procédé de fabrication, et appareil de communication

Publications (1)

Publication Number Publication Date
WO2020118707A1 true WO2020118707A1 (fr) 2020-06-18

Family

ID=71076758

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/121287 Ceased WO2020118707A1 (fr) 2018-12-14 2018-12-14 Module d'alimentation électrique et son procédé de fabrication, et appareil de communication

Country Status (1)

Country Link
WO (1) WO2020118707A1 (fr)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005502187A (ja) * 2001-05-04 2005-01-20 ノキア コーポレイション 電子部品組立体の熱機械的信頼性を向上するためにパッケージレベルで予め塗布されるアンダーフィル
US20110284273A1 (en) * 2010-05-18 2011-11-24 Endicott Interconnect Technologies, Inc. Power core for use in circuitized substrate and method of making same
CN102308346A (zh) * 2008-12-03 2012-01-04 平面磁性有限公司 具有嵌入磁芯的集成平面调压变压器
CN102790513A (zh) * 2012-07-30 2012-11-21 华为技术有限公司 电源模块和电源模块的封装方法
CN103050485A (zh) * 2012-12-21 2013-04-17 苏州日月新半导体有限公司 封装基板构造
CN104517944A (zh) * 2013-09-30 2015-04-15 日月光半导体制造股份有限公司 封装结构及其制造方法
CN104603892A (zh) * 2012-07-04 2015-05-06 阿尔斯通技术有限公司 变压器
CN104980007A (zh) * 2014-09-05 2015-10-14 胜美达电机（香港）有限公司 电源模块及其制造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005502187A (ja) * 2001-05-04 2005-01-20 ノキア コーポレイション 電子部品組立体の熱機械的信頼性を向上するためにパッケージレベルで予め塗布されるアンダーフィル
CN102308346A (zh) * 2008-12-03 2012-01-04 平面磁性有限公司 具有嵌入磁芯的集成平面调压变压器
US20110284273A1 (en) * 2010-05-18 2011-11-24 Endicott Interconnect Technologies, Inc. Power core for use in circuitized substrate and method of making same
CN104603892A (zh) * 2012-07-04 2015-05-06 阿尔斯通技术有限公司 变压器
CN102790513A (zh) * 2012-07-30 2012-11-21 华为技术有限公司 电源模块和电源模块的封装方法
CN103050485A (zh) * 2012-12-21 2013-04-17 苏州日月新半导体有限公司 封装基板构造
CN104517944A (zh) * 2013-09-30 2015-04-15 日月光半导体制造股份有限公司 封装结构及其制造方法
CN104980007A (zh) * 2014-09-05 2015-10-14 胜美达电机（香港）有限公司 电源模块及其制造方法

Similar Documents

Publication Publication Date Title
US7940146B2 (en) Boundary acoustic wave element, boundary acoustic wave device, and manufacturing methods for the same
CN100413070C (zh) 部件内置模块、配备部件内置模块的电子设备以及部件内置模块的制造方法
TWI512926B (zh) 電路板層疊封裝結構及其製作方法
JP4344952B2 (ja) 電子デバイスおよびその製造方法
US7807510B2 (en) Method of manufacturing chip integrated substrate
CN103814439B (zh) 模块基板
CN100444374C (zh) 印刷电路板和包括印刷电路板的电子设备
JPWO2018181708A1 (ja) モジュール
JP5604876B2 (ja) 電子装置及びその製造方法
CN101499456B (zh) 半导体器件及其制造方法
KR101109356B1 (ko) 임베디드 인쇄회로기판의 제조방법
CN103943573A (zh) 一种新型集成电路内部封装方法
JP4551461B2 (ja) 半導体装置とこれを備えた通信機器及び電子機器
CN111422819A (zh) 传感器封装结构及其封装方法、以及电子设备
US20120018201A1 (en) Circuit board and manufacturing method thereof, circuit device and manufacturing method thereof, and conductive foil provided with insulating layer
KR101677284B1 (ko) 내장 회로기판 및 그 제조 방법
TWI838816B (zh) 封裝結構及其製造方法
WO2020118707A1 (fr) Module d'alimentation électrique et son procédé de fabrication, et appareil de communication
JP2007207802A (ja) 電子回路モジュールとその製造方法
JP4203031B2 (ja) 積層型電子部品の製造方法
TWI720851B (zh) 晶片封裝結構及其製造方法
CN104465555A (zh) 半导体封装及其制造方法
JP3666576B2 (ja) 多層モジュールおよびその製造方法
CN110505372A (zh) 摄像模块的组装方法
JP4619807B2 (ja) 部品内蔵モジュールおよび部品内蔵モジュールを備えた電子機器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18942734

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18942734

Country of ref document: EP

Kind code of ref document: A1