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WO2020038776A1 - Dispositif optoélectronique et procédé de commande d'un dispositif optoélectronique - Google Patents

Dispositif optoélectronique et procédé de commande d'un dispositif optoélectronique Download PDF

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Publication number
WO2020038776A1
WO2020038776A1 PCT/EP2019/071712 EP2019071712W WO2020038776A1 WO 2020038776 A1 WO2020038776 A1 WO 2020038776A1 EP 2019071712 W EP2019071712 W EP 2019071712W WO 2020038776 A1 WO2020038776 A1 WO 2020038776A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing
circuit
carrier
optoelectronic device
optoelectronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2019/071712
Other languages
German (de)
English (en)
Inventor
Frank Singer
Hubert Halbritter
Luca HAIBERGER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram Oled GmbH
Original Assignee
Osram Oled GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Oled GmbH filed Critical Osram Oled GmbH
Publication of WO2020038776A1 publication Critical patent/WO2020038776A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/06825—Protecting the laser, e.g. during switch-on/off, detection of malfunctioning or degradation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/04—Systems determining the presence of a target
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/88—Lidar systems specially adapted for specific applications
    • G01S17/89—Lidar systems specially adapted for specific applications for mapping or imaging
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]

Definitions

  • German patent application No. 10 2018 120 508.2 which was filed on August 22, 2018 with the German Patent and Trademark Office.
  • the disclosure content of German patent application No. 10 2018 120 508.2 is hereby incorporated into the disclosure content of the present application.
  • the present invention relates to an optoelectronic device and to a method for controlling an optoelectronic device.
  • the adhesion of an optical element such as diffractive optics to the housing is ensured by two independent measures.
  • the diffractive optics are glued to the housing and additionally held firmly by a mechanical holder.
  • the present invention is based, inter alia, on the object of creating an optoelectronic device with an optoelectronic component for generating laser radiation and an optical element, it being ensured that the optoelectronic component only generates laser radiation testifies when the optical element is arranged in the beam path of the laser radiation. Furthermore, a method for controlling an optoelectronic device is to be specified.
  • An object of the invention is achieved by an optoelectronic device having the features of claim 1.
  • a task of the invention is also achieved by a method having the features of independent claim 17. Preferred embodiments and developments of the invention are in the dependent Claims specified.
  • An optoelectronic device comprises an optoelectronic component for generating laser radiation, a housing in which the optoelectronic component is accommodated, and a carrier which can be attached to the housing.
  • the carrier carries one or more optical elements and also has one or more electrically conductive or conductive lines.
  • the optoelectronic device comprises a circuit which runs partially in the housing.
  • the electrically conductive line attached to the carrier forms part of the circuit. Consequently, it is necessary to close the circuit to attach the carrier to the housing.
  • the optical element and the electrically conductive line are positioned on the carrier such that the circuit can only be closed when the carrier is attached to the housing in such a way that the optical element is arranged in the beam path of the laser radiation.
  • the circuit is not closed and thus it is not ensured that the optical element is in the beam path of the laser radiation after the optoelectronic component has been switched on, the generation of laser radiation by the optoelectronic component is prevented. It is therefore necessary for the generation of the laser radiation that a line interruption in the circuit is previously closed by the line attached to the carrier. Furthermore, if the carrier is removed from the housing during the generation of laser radiation by the optoelectronic component, the generation of the laser radiation is stopped.
  • the standards on eye safety can be complied with, since it is ensured that the laser radiation is not generated if the optical element for protecting the eyes of users of the device is not in front of the optoelectronic component which generates the laser radiation.
  • the circuit is not closed even if the electrically conductive line attached to the carrier is not intact. It is consequently excluded that the carrier is properly fastened to the housing, but the carrier and thus the electrically conductive line and possibly also the optical element are damaged and laser radiation is nevertheless generated.
  • the optoelectronic device can be manufactured in just a few process steps and therefore enables low production costs. Furthermore, the optoelectronic device has a compact design.
  • the circuit may have further line interruptions, which must be closed by suitable circuits outside the housing. It can be provided that the laser radiation can only be generated when all line interruptions in the circuit are closed.
  • the carrier can have exactly one electrically conductive line or a plurality of electrically conductive lines. In the latter case, it can be provided that the multiple lines of the carrier must close several line interruptions in the circuit in order to be able to generate laser radiation with the aid of the optoelectronic component.
  • the electrically conductive lines of the carrier and in particular the rest of the circuit can be made of a suitable metal, an alloy or another electrically conductive material, such as an electrically conductive polymer.
  • the electrically conductive line can be applied to a surface of the carrier as a conductor track or metallization.
  • the electrically conductive line can also run at least partially inside the carrier.
  • conductor tracks or metallizations can also be applied to one or more surfaces of the housing or lines can be at least partially integrated into the interior of the housing.
  • the carrier can be made from a suitable material, in particular a material that is essentially transparent to the laser radiation generated by the optoelectronic component.
  • the carrier can be made of glass.
  • the optical element can be formed in one piece with the carrier.
  • the optical element can comprise one or more lenses and / or one or more diffractive optical elements.
  • a diffractive optical element (English: diffrative optical element, DOE) is an optical element for shaping a light beam, in particular a laser beam.
  • the physical principle is diffraction, also called diffraction, on one optical grating.
  • a regular arrangement, also called an array, of lenses and / or diffractive optical elements can be used, for example a microlens array (English: micro lens array, MLA).
  • the optoelectronic component can be a laser diode, for example. that is, a semiconductor device that generates laser radiation.
  • the optoelectronic component can be a VCSEL, also called a surface emitter.
  • a VCSEL is a laser diode in which the light is emitted perpendicular to the plane of the semiconductor chip, in contrast to the edge emitting laser diode in which the light emerges on one or two flanks of the semiconductor chip.
  • the use of a kantenemit laser diode as an optoelectronic component is also possible.
  • the laser radiation emitted by the optoelectronic component can be, for example, laser radiation in the visible range, ultraviolet (UV) light and / or infrared (IR) light.
  • the optoelectronic component can also be part of an integrated circuit.
  • the housing also called a package
  • the housing can be a QFN (English: quad flat no leads package), a ceramic housing or another suitable housing.
  • the optoelectronic device described here can be used, for example, in consumer products, also called consumer goods or consumer products.
  • the optoelectronic device can be used in ToF (English: time of flight) cameras or sensors with which three-dimensional images can be taken.
  • ToF English: time of flight
  • the viewed scene is illuminated by means of a light or laser pulse, and the camera or sensor measures for each pixel the time it takes for the light to reach the object and back again.
  • the time required is directly proportional to the distance. The distance of the object depicted on it is thus provided for each pixel.
  • the optoelectronic device can be used in devices for iris recognition.
  • Iris detection is a method of biometrics for the purpose of authenticating or identifying people.
  • images of the iris of the eye are recorded with special cameras and in particular with the aid of a laser beam, the characteristic features of the respective iris are identified using algorithmic methods and compared with previously stored data sets.
  • Another area of application is proximity switches, also called proximity initiators, proximity switches or (proximity) sensors. These are sensors that react to the approach of an object without contact. The approach can be measured with a laser beam, in particular the reflection of the laser beam. Proximity switches are used, for example, as triggers for safety measures and in technical processes for position detection of workpieces and tools.
  • the use of the optoelectronic device in devices for facial recognition is also possible.
  • the expression of visible features in the area of the frontal head given by the geometric arrangement and texture properties of the surface, is analyzed.
  • LFA laser flash analysis
  • the housing has a first and a second electrical contact element.
  • the electrically conductive line seen on the carrier is designed such that it connects the first and second contact elements to one another when the carrier is attached to the housing in such a way that the optical element is arranged in the beam path of the laser radiation. Consequently, if the carrier is not properly attached to the housing, the circuit break between the first and the second electrical contact element cannot be closed and the optoelectronic component does not generate any laser radiation.
  • the electrically conductive line can be attached to the first and the second electrical contact element, for example, by means of electrically conductive adhesive.
  • the carrier can have a first and a second electrical contact element, which are designed for connection to the first and second electrical contact element of the housing.
  • the electrically conductive line can be on the carrier run between the first and the second electrical contact element of the carrier in a direct or rectilinear way, ie the shortest possible way, or in a non-rectilinear way, ie not in the shortest possible way. In the latter case, the electrically conductive line can run in a zigzag course, for example. Furthermore, the electrically conductive line can be routed over as many areas of the carrier as possible. This has the advantage that damage in an area of the carrier is reliably recognized, since in this case the line is most likely interrupted.
  • a first plated-through hole can lead from the first electrical contact element to an underside of the housing.
  • a second via can extend from the second electrical contact element to the underside of the housing.
  • the contact surfaces of the first and second through contacts on the underside of the housing are not connected to one another, so that it is necessary to fasten or solder the housing to a circuit board in order to close the circuit through a corresponding conductor track on the circuit board conclude .
  • the circuit can be designed to supply power to the optoelectronic component. Unless the carrier is attached to the housing, the optoelectronic component is consequently not supplied with operating current and cannot generate laser radiation.
  • a control signal can be measured on the circuit.
  • the optoelectronic device can have a control unit which is designed such that it determines in particular by measuring the control signal whether the circuit is closed. If the circuit is not closed, the control unit prevents the generation of Laser radiation through the optoelectronic component.
  • the control unit can measure the contact resistance between the circuit in the housing and the electrically conductive line of the carrier in order to determine whether the carrier is attached to the housing or intact.
  • the control unit can measure an electrical potential against a reference potential or a voltage at a point or a line of the circuit and determine whether the circuit is closed by the measurement.
  • the optoelectronic device can have a switching unit which is designed such that the switching unit switches the optoelectronic component off or does not switch it on when the circuit is not closed.
  • the control unit can control the switching unit in order to switch the optoelectronic component on or not to switch it on in the event of a circuit which is not closed by the control unit.
  • the switching unit can be, for example, a switch, a transistor, in particular a field effect transistor (FET), or an integrated circuit (English: integrated circuit, IC).
  • the switching unit can be connected in series with the optoelectronic component.
  • a resistor can optionally be arranged between the optoelectronic component and the switching unit.
  • a capacitor can be connected in parallel to the series circuit comprising the optoelectronic component and the switching unit.
  • the switching unit can be accommodated in the housing or can be located outside the housing.
  • the housing can be designed with a particularly low induction with a first, a second and a third external contact connection his.
  • the three external contact connections can be contacted from outside the housing and are located in particular on one or more outer surfaces of the housing.
  • the first external contact connection can be connected to a first connection, in particular an anode connection, of the optoelectronic component and the second external contact connection can be connected to a second connection, in particular a cathode connection, of the optoelectronic component.
  • the third external contact connection can be designed such that it is connected to the first connection of the optoelectronic component via the electrically conductive line if the carrier is attached to the housing in such a way that the optical element is arranged in the beam path of the laser radiation. If the carrier is not properly attached to the housing, the third external contact connection is consequently not connected to the first connection of the optoelectronic component. According to one embodiment, a supply voltage is applied to the third external contact connection of the housing. If the carrier is not fastened to the housing, the optoelectronic component is consequently not supplied with current. According to an alternative embodiment, the supply voltage is applied to the first external contact connection of the housing and the control unit measures an electrical potential at the third external contact connection or a line connected to it.
  • the third external contact connection can be coupled to a reference potential, in particular a ground potential, via a resistor. If the control unit determines that a predetermined voltage is not present at the third external contact connection or the line connected to it, the control unit can determine that the Circuit is not closed and, in particular, the switching unit described above instruct that the optoelectronic component be switched off or not switched on.
  • the switching unit can be located outside the housing and can be switched to the second external contact connection of the housing.
  • the optoelectronic component and the switching unit can be connected in series and a capacitor can be connected in parallel with the series circuit comprising the optoelectronic component and the switching unit.
  • the capacitor can also be connected only in parallel to the optoelectronic component.
  • the capacitor can be integrated in the housing or can be located outside the housing.
  • the housing can have an opening through which the laser radiation generated by the optoelectronic component emerges and into which the carrier can be inserted.
  • the carrier can be shaped such that it can be inserted into the opening with a precise fit. Furthermore, the carrier can be supported on a projection in the opening and lateral walls of the opening can prevent shear forces on the carrier.
  • the optoelectronic component can be designed such that it generates pulsed laser radiation.
  • the frequency with which the laser pulses are repeated can be in the radio frequency (RF) range and in particular in the range from approximately 10 kHz to approximately 300 GHz.
  • the optoelectronic device comprises an optoelectronic component for generating laser radiation, a housing in which the optoelectronic component is accommodated, a carrier which can be attached to the housing and which is a Optical element and an electrically conductive line, and a circuit that runs partially in the housing ver.
  • the electrically conductive line of the carrier is part of the circuit.
  • the carrier is necessarily attached to the housing such that the optical element is arranged in the beam path of the laser radiation.
  • the procedure includes checking whether the circuit is closed.
  • the optoelectronic component generates laser radiation only when the circuit is closed.
  • the method for controlling the optoelectronic device can have the above-described configurations of the optoelectronic device. Exemplary embodiments of the invention are explained in more detail below with reference to the attached drawings. These show schematically:
  • FIGS. 1A to IC are perspective representations of an exemplary embodiment of an optoelectronic
  • Fig. 3 shows a circuit diagram of a further embodiment example of an optoelectronic device
  • 4 is a circuit diagram of yet another exemplary embodiment of an optoelectronic device
  • 5A to 5F representations of an embodiment of a housing for accommodating an opto-electronic component.
  • FIG. 1A to IC show schematically an optoelectronic device 10 in front in perspective representations.
  • the optoelectronic device 10 comprises a housing 11 shown in FIG. 1A with an optoelectronic component in the form of a VCSEL 12 for generating laser radiation, and a carrier 13, the front and back of which are shown in FIG. 1B or IC.
  • Metallizations 14, which form part of a circuit 15, are applied to the surface of the housing 11. Furthermore, electrically conductive lines 16 in the form of metallizations are applied to the back of the carrier 13, which also form part of the circuit 15. The part of the circuit 15 applied to the housing 11 contains circuit interruptions 17 which can only be closed by the lines 16 applied to the carrier 13 if the carrier 13 is applied to the housing 11 with its rear side.
  • the VCSEL 12 is soldered with its cathode connection to one of the metallizations 14 and its anode connection is connected to a further metallization 14 via a bonding wire 18.
  • the carrier 13 is made of glass. At the front of the carrier 13, an optical element 19 in the form of a microlens array is integrated into the glass. If the carrier 13 is mounted on the housing 11 such that the circuit interruptions 17 in the circuit 15 are closed by the lines 16 applied to the carrier 13, the microlens array is located in the beam path of the laser radiation generated by the VCSEL 12.
  • the optoelectronic device 10 is configured such that the VCSEL 12 can only generate laser radiation when the circuit 15 is closed. If the carrier 13 is not mounted on the housing 11, the generation of laser radiation is consequently prevented.
  • FIG. 2A shows a schematic circuit diagram of an optoelectronic device 20.
  • the optoelectronic device 20 contains a laser diode 21, an optional resistor 22, a field effect transistor 23 and a capacitor 24.
  • the laser diode 21, the resistor 22 and the drain-source path of the Field effect transistors 23 are connected in series and form part of a circuit 15.
  • the capacitor 24 is arranged parallel to the series circuit.
  • the series Circuit connected between a supply voltage V LASER and a reference or ground potential GND, the supply voltage V LASER being applied to the anode connection of the laser diode 21.
  • the optoelectronic device 20 contains a carrier 13 (not shown in FIG. 2A) with at least one electrically conductive line 16.
  • the components of the optoelectronic device 20 shown in FIG. 2A can be integrated into a housing 11. However, it can also be provided that, for example, only the laser diode 21 is accommodated in the housing 11 and all other components are arranged outside the housing 11. The latter case has the advantage that the resistor 22, the field effect transistor 23 and the capacitor 24 can be selected in an application-specific manner.
  • FIG. 2A possible points for a line interruption 17 are shown which, as in the exemplary embodiment from FIGS. 1A to IC, have to be closed by a line 16 attached to the carrier 13. If the line interruption (s) 17 is / are not closed, the laser diode 21 is not supplied with current and accordingly cannot generate any laser radiation. Instead of an interruption in the power supply, the contact resistance between the circuit 15 in the housing 11 and the line 16 attached to the carrier 13 can also be measured. This is symbolically illustrated in FIG. 2B by an optoelectronic device 26 with a laser diode 21 and a carrier 13. The laser diode 21 can only emit laser radiation if the contact resistance between the circuit 15 in the housing 11 and the line 16 of the carrier 13 is low.
  • FIG. 2C shows an exemplary embodiment of a carrier 13 in a plan view from below.
  • the carrier 13 comprises on its back two electrical contact elements 27 and a line 16 connecting the two electrical contact elements 27 to one another.
  • the electrical contact elements 27 are arranged on the carrier 13 such that they can be placed on corresponding electrical contact elements of the housing 11.
  • the line 16 connects the two electrical contact elements 27 in a zigzag pattern across the carrier 13. Accordingly, not only can it be detected whether the carrier 13 has been mounted on the housing 11, but also a breakage of the carrier 13 can be detected be because this would interrupt line 16 Chen.
  • the electrical contact elements 27 can be connected to the corresponding electrical contact elements of the housing 11 with the aid of an electrically conductive adhesive.
  • further adhesive dots with non-conductive adhesive material can be applied to the carrier 13 in order to fasten the carrier 13 to the housing 11.
  • the adhesive can be applied using screen printing.
  • the optoelectronic devices 20, 26 shown in FIGS. 2A to 2C can be operated with laser diodes or VCSEL 12, which generate short laser pulses in the high-frequency range.
  • 3 and 4 show further variants for even lower induction housings.
  • the optoelectronic device 30 comprises a housing 11 with exactly three external contact connections, a first external contact connection 31, a second external contact connection 32 and a third external contact connection 33 Housing 11 houses a laser diode 21.
  • the first and the second external contact connection 31, 32 are connected to the anode or cathode connection of the laser diode 12.
  • the third external contact connection 33 is connected to the anode connection of the laser diode 21 via the electrically conductive line of the carrier 13 when the carrier 13 is attached to the housing 11 in such a way that the optical element 19 is arranged in the beam path of the laser radiation.
  • the supply voltage V LASER is applied to the third external contact connection 33 of the housing 11. If the carrier 13 is not fastened, the circuit 15 is not closed and the laser diode 12 is accordingly not supplied with current.
  • the capacitor 24 and the field effect transistor 23 are mounted on one or more printed circuit boards outside the housing 11, the capacitor 24 being connected to the first external contact terminal 31 and the field effect transistor 32 being connected to the second external contact terminal 32.
  • the capacitor 24 can optionally also be accommodated in the housing 11.
  • the carrier 13 shown in FIG. 2C can be used as the carrier 13 of the optoelectronic device 30, for example.
  • FIG. 4 An even lower-induction variant for use in laser pulse operation is shown in FIG. 4.
  • the illustrated in Fig. 4 Darge optoelectronic device 35 comprises a housing 11, which has the same structure as the housing 11 of FIG. 3. However, in the variant according to FIG. 4, the supply voltage V LASER is applied to the first external contact connection 31 of the housing 11. The third external contact connection 33 is connected to the ground potential GND via a resistor 36. Furthermore, the optoelectronic device 35 contains a control unit 37, which measures the voltage at the third external contact terminal 33 of the housing 11. Via this measurement solution, the control unit 37 can determine whether the carrier 13 has been properly mounted on the housing 11.
  • the control unit 37 sends a control signal 38 to the field effect transistor 23, which is operated as a switching unit. If the carrier 13 is properly attached to the housing 11, the gate connection of the field effect transistor 23 is driven such that its drain-source path is low-resistance and the laser diode 21 generates laser radiation. If the carrier 13 is not mounted on the housing 11 or is damaged, the field-effect transistor 23 is driven in such a way that its drain-source path is high-resistance and, accordingly, the laser diode 21 does not generate any laser radiation.
  • FIG. 5A shows an exemplary embodiment of the housing 11, in which a laser diode or a VCSEL can be accommodated.
  • a projection 41 is provided, on which the carrier 13 can be set up.
  • the carrier 13 is shaped such that it can be inserted into the opening 40 with a precise fit.
  • Vias 43, 44 also lead from the projection 41 to the underside of the housing 11.
  • the housing 11 can be mounted on a printed circuit board and the contact surfaces of the vias 43, 44 on the underside of the housing 11 can be connected to the printed circuit board via corresponding conductor tracks be electrically connected.
  • the electrically conductive line 16 on the underside of the carrier 13 can be electrically connected to the through contacts 43 and 44 via electrically conductive adhesive 45.
  • contact elements 46 for contacting the laser diode or the VCSEL with the printed circuit board are introduced into the housing 11.
  • 5B to 5F show various exemplary embodiments of a carrier 13 provided for the housing 11 shown in FIG. 5A.
  • two point-shaped electrical contact elements 27 are provided on the underside of the carrier 13, which are connected to one another by a direct or a zigzag-shaped electrically conductive line 16.
  • the electrical contact elements 27 are not punctiform, but extend over a respective side of the carrier 13.
  • Fig. 5F two point-shaped electrical contact elements 27 are provided on one side of the carrier 13 and on the opposite side there is an electrical contact element 27 which extends over the entire side length. This electrical contact element 27 is connected to the two point-shaped contact elements 27 via a respective line 16.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)

Abstract

L'invention concerne un dispositif optoélectronique (10) comprenant un composant (12) optoélectronique destiné à produire un rayonnement laser, un boîtier (11), dans lequel le composant (12) optoélectronique est logé, un support (13) qui peut être monté sur le boîtier (11) et qui présente un élément optique (19) et une ligne électro-conductrice (16), et un circuit (15), qui s'étend en partie dans le boîtier (11), la ligne électro-conductrice (16) du support (13) faisant partie du circuit (15), le support (13), pour la fermeture du circuit (15), étant nécessairement monté sur le boîtier (11) de telle sorte que l'élément optique (19) est disposé dans le faisceau du rayonnement laser, et la génération du rayonnement laser par le composant opto-électronique (12) étant empêchée lorsque le circuit (15) n'est pas fermé.
PCT/EP2019/071712 2018-08-22 2019-08-13 Dispositif optoélectronique et procédé de commande d'un dispositif optoélectronique Ceased WO2020038776A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018120508.2A DE102018120508A1 (de) 2018-08-22 2018-08-22 Optoelektronische Vorrichtung und Verfahren zum Steuern einer optoelektronischen Vorrichtung
DE102018120508.2 2018-08-22

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