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WO2020095733A1 - Résistance - Google Patents

Résistance Download PDF

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Publication number
WO2020095733A1
WO2020095733A1 PCT/JP2019/042044 JP2019042044W WO2020095733A1 WO 2020095733 A1 WO2020095733 A1 WO 2020095733A1 JP 2019042044 W JP2019042044 W JP 2019042044W WO 2020095733 A1 WO2020095733 A1 WO 2020095733A1
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WO
WIPO (PCT)
Prior art keywords
resistor
island portion
heat dissipation
pair
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2019/042044
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English (en)
Japanese (ja)
Inventor
泰治 木下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
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Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Priority to JP2020555967A priority Critical patent/JPWO2020095733A1/ja
Publication of WO2020095733A1 publication Critical patent/WO2020095733A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C13/00—Resistors not provided for elsewhere

Definitions

  • the present disclosure relates to a resistor including a high-power metal plate used as a resistor for detecting a current value of various electronic devices.
  • a conventional resistor of this type has a resistor 1 made of a plate-shaped metal, a pair of electrodes 2 formed at both ends of the resistor 1, and a resistor 1
  • the heat dissipation layer 3 formed was provided.
  • the heat dissipation layer 3 was a metal plate formed via an insulating layer 4 such as an epoxy resin or an adhesive.
  • Patent Document 1 is known.
  • the heat conductivity of the insulating layer 4 is low, so the heat generated in the resistor 1 cannot be efficiently released to the heat dissipation layer 3. As a result, the temperature of the surface of the resistor 1 becomes high, which causes a problem that long-term reliability deteriorates.
  • the present disclosure solves the above-mentioned conventional problems, and an object thereof is to provide a resistor capable of improving long-term reliability.
  • the resistor according to the first aspect of the present disclosure includes a resistor made of metal, and a pair of electrodes located at both ends of the resistor. And it has an island part which is located on the same plane as the resistor and is made of metal, and the island part is connected to the heat dissipation terminal.
  • the through conductor made of a metal having high thermal conductivity connects the resistor and the heat sink, a large amount of heat generated by the resistor can be released to the heat sink. As a result, heat can be dispersed, so that the temperature of the surface of the resistor can be lowered, and as a result, long-term reliability can be improved.
  • Sectional drawing of the resistor in 1st Embodiment of this indication Top view of the main part of the resistor Sectional view of another example of the same resistor Sectional drawing of the other example of the same resistor.
  • Top view of another example of the main part of the same resistor Top view of still another example of the main part of the same resistor Sectional drawing of the resistor in 2nd Embodiment of this indication.
  • Top view of the main part of the resistor Top view of another example of the main part of the same resistor Sectional view of another example of the same resistor Sectional drawing of the other example of the same resistor. Sectional drawing of the resistor in 3rd Embodiment of this indication.
  • FIG. 1 is a sectional view of a resistor 100 according to the first embodiment of the present disclosure
  • FIG. 2 is a top view of a main part of the resistor 100.
  • the horizontal direction of the paper (direction from the left side to the right of the paper) is the x-axis
  • the vertical direction of the paper is the y-axis
  • the direction perpendicular to the plane of the paper is the z axis.
  • the resistor 100 includes a resistor 11 made of metal, and a pair of electrodes 12 located at both ends of the lower surface of the resistor 11.
  • the insulating layer 13 is provided on the upper surface of the resistor 11, and the heat dissipation plate 14 is provided on the upper surface of the insulating layer 13 so as to cover at least a part of the resistor 11.
  • the through conductor 15 made of metal is provided on the insulating layer 13, and the upper surface of the resistor 11 and the heat dissipation plate 14 are connected via the through conductor 15.
  • the resistor 11 is made of plate-shaped CuNi.
  • the resistor 11 may be provided with one or more trimming grooves (not shown) by punching or the like to adjust the resistance value.
  • the size of the resistor 11 is 1.6 mm in length, 3.2 mm in width, and 0.7 mm in thickness.
  • the resistor 11 is not limited to a plate shape and may be a foil shape.
  • a metal such as CuMn or NiCr may be used as the material of the resistor 11.
  • the thickness of the resistor 11 can take a value of 0.5 mm to 0.58 mm.
  • the pair of electrodes 12 are formed on both ends of the lower surface of the resistor 11.
  • the thickness of the pair of electrodes 12 is 0.05 mm.
  • the pair of electrodes 12 is formed by welding or clad-bonding a separate metal plate containing Cu as a main component to the resistor 11.
  • the pair of electrodes 12 may be formed by directly plating, sputtering or printing a metal material on the resistor 11.
  • the distance W17a between the opposite ends of the pair of electrodes 12 is 2.2 mm.
  • each of the pair of electrodes 12 is 1.4 mm in length (y direction) and 0.5 mm in width (x direction).
  • the pair of electrodes 12 is provided at the center of the resistor 11 in the vertical direction (y direction).
  • a plating layer 16 made of nickel plating is formed on the exposed surfaces around the pair of electrodes 12 and both end surfaces of the resistor 11 (the surfaces exposed in the current flow direction).
  • the plating layer 16 may be formed by tin plating instead of nickel plating.
  • the thickness of the plating layer 16 is several ⁇ m.
  • the insulating layer 13 is a resin substrate made of glass epoxy and is bonded to the upper surface of the resistor 11.
  • the glass epoxy is a resin containing glass in an epoxy resin.
  • the insulating layer 13 may contain alumina powder or the like to improve heat dissipation.
  • a resin substrate other than glass epoxy may be used as the insulating layer 13.
  • the layer thickness of the insulating layer 13 is 0.06 mm.
  • One heat radiating plate 14 is provided on the upper surface of the insulating layer 13 and is made of plate-shaped copper.
  • the heat radiating plate 14 and the resistor 11 are separated by a constant distance of about 0.1 mm so as not to be directly electrically connected except the through conductor 15.
  • the heat sink 14 covers a part of the resistor 11.
  • the heat radiating plate 14 preferably covers 2 ⁇ 3 or more of the area of the resistor 11, and more preferably covers almost the entire surface of the resistor 11.
  • the thickness of the heat dissipation plate 14 is 0.07 mm.
  • a protective film 17 made of epoxy resin is formed so as to cover the heat dissipation plate 14.
  • the protective film 17 covers the entire surface of the heat dissipation plate 14, the resistor 11 not covered by the heat dissipation plate 14, and a part of the insulating layer 13. Thereby, the heat dissipation plate 14 is not exposed to the outside, and the insulation between the heat dissipation plate 14 and the pair of electrodes 12 and the plating layer 16 can be maintained.
  • the protective film 17 has a thickness of 0.2 mm.
  • the thickness of the protective film 17 can take a value of 0.19 mm to 0.26 mm.
  • another protective film 17a may be provided between the pair of electrodes 12 on the lower surface of the resistor 11.
  • the other protective film 17a is made of an epoxy resin and has a film thickness of 0.1 mm.
  • FIG. 2 is a top view without the protective film 17.
  • the heat dissipation plate 14 also has a role as a support plate so that the resistor 11 is not deformed even when bending stress is applied.
  • the through conductor 15 is formed by providing through holes in the insulating layer 13 and the heat dissipation plate 14 and filling the through holes with copper paste.
  • the through conductor 15 is directly connected to the upper surface of the resistor 11 and the heat dissipation plate 14. Therefore, the resistor 11 and the heat sink 14 are electrically and thermally connected to each other through the penetrating conductor 15.
  • the through conductor 15 is connected to the hot spot in the central portion of the resistor 11.
  • the width W15 of the through conductor 15 on the upper surface of the heat dissipation plate 14 is 0.20 mm.
  • the width of the through conductor 15 is widest on the upper surface of the heat dissipation plate 14 and becomes narrower toward the insulating layer 13. This is to prevent current from flowing through the through conductor 15.
  • the depth (length in the z-axis direction) of the penetrating conductor 15 is 0.13 mm.
  • Table 1 summarizes the materials and layer thicknesses of the layers that make up the resistor 100 described above.
  • the resistance of the resistor 100 described above was measured, it was 100 m ⁇ , and it was possible to obtain a desired resistance value for the resistor 100.
  • the through conductor 15 may be formed only on the insulating layer 13, and the upper surface of the resistor 11 and the lower surface of the heat dissipation plate 14 may be connected to each other. Further, the number of penetrating conductors 15 may be two or more instead of one. When the number of electrodes is two or more, they are provided at positions where they become equipotential when a voltage is applied between the pair of electrodes 12.
  • connection area with the resistor 11 is widened by lengthening it in a direction substantially orthogonal to the current flow direction (x-axis direction).
  • the through conductor 15 may be made of a metal having a high thermal conductivity such as silver other than copper.
  • the resistor 100 is connected to the land 19 formed on the mounting board 18 via the mounting solder 20. At this time, the mounting solder 20 is connected to the plating layer 16. The heat sink 14 is not connected to the mounting solder 20.
  • the direction in which the mounting substrate 18 is located with respect to the resistor is referred to as the lower side in this specification.
  • the land 19 is made of copper
  • the mounting solder 20 is made of a metal whose main component is tin.
  • the heat dissipation plate 14 is not limited to one, and a plurality of heat dissipation plates 14 may be formed as shown in FIG.
  • the through-hole conductors 15 are connected to the plurality of heat-dissipating plates 14 so that the protective film 17 is buried between the through-hole conductors 15 adjacent to each other, and the heat-dissipating plates 14 are not connected to each other.
  • another heat radiating plate 14a may be further formed on the upper layer of the heat radiating plate 14. If the other heat dissipation plate 14a is connected to the mounting solder 20, the heat absorbed by the other heat dissipation plate 14a can be released to the mounting board 18 via the mounting solder 20. At this time, a part of the other heat dissipation plate 14a faces the heat dissipation plate 14 with the other insulating layer 13a interposed therebetween.
  • the through conductor 15 made of copper having a high thermal conductivity connects the resistor 11 and the heat dissipation plate 14, so that the heat generated in the resistor 11 is radiated. Since more heat can be released to the plate 14 and heat can be dispersed, the temperature of the surface of the resistor 11 can be lowered, and as a result, long-term reliability can be improved. can get.
  • the resistor 11 may be formed with an island portion 21 and a connecting portion 22 that connects the resistor body 11 and the island portion 21.
  • the resistor 11 island portion 21, connection portion 22
  • the pair of electrodes 12 are shown for simplicity of description.
  • the horizontal direction of the paper (the direction from the left side to the right of the paper) is the x-axis
  • the vertical direction of the paper is the y-axis.
  • the direction perpendicular to the plane of the paper is the z axis.
  • the island portions 21 are provided at the upper and lower ends in FIG. 5, and are provided near the center in FIG.
  • the size of the island portion 21 is 0.5 mm in length (y direction) and 1.4 mm in width (x direction) respectively, and in the case of FIG. 6, 1.0 mm in length (y direction) and width ( x direction) 1.4 mm.
  • the width W22 of the connecting portion 22 is 0.16 mm in the case of FIG. 5 and 0.08 mm in the case of FIG.
  • the width of the slit 23 is 0.05 mm.
  • the resistor 11 and the island portion 21 are electrically connected in a direction substantially orthogonal to the direction in which the current flows near the connection portion 22. Further, as shown in FIG. 5, if there is only one connecting portion 22 for one island portion 21, almost no current will flow through the island portion 21. In FIG. 6, there are two connection portions 22 for one island portion 21. However, since the connection portions 22 are arranged at locations having the same potential, almost no current flows through the island portion 21.
  • the island portion 21 is preferably formed near the hot spot in the central portion of the resistor 11.
  • two L-shaped slits 23 are formed so as to face one side surface of the central portion of the resistor 11, and an island portion 21 and a connection portion 22 are provided.
  • two U-shaped slits 23 are formed in the central portion of the resistor 11 so as to face each other, and an island portion 21 and a connecting portion 22 are provided.
  • the island portion 21 and the through conductor 15 are connected inside the island portion 21, and the island portion 21 and the heat sink 14 are connected.
  • the island portion 21 is connected to the resistor 11, a large amount of heat generated in the resistor 11 can be released to the heat dissipation plate 14 via the island portion 21 and the through conductor 15. Further, since almost no current flows through the island portion 21, even if the number of the through conductors 15 connected to the island portion 21 is two or more, the influence on the electrical characteristics is small.
  • FIG. 7 is a cross-sectional view of the resistor 200 according to the second embodiment of the present disclosure
  • FIG. 8 is a top view of the main part of the resistor 200.
  • FIG. 7 is a sectional view taken along line VII-VII of FIG.
  • the horizontal direction of the paper (the direction from the left side of the paper to the right) is the x-axis
  • the vertical direction of the paper is the y-axis
  • the direction perpendicular to the plane of the paper is the z axis.
  • the resistor 200 includes a resistor 24 made of metal and a pair of electrodes 25 located at both ends of the lower surface of the resistor 24. And an insulating layer 26 provided on the upper surface of the resistor 24.
  • the resistor 24 is provided with the narrow portion 27, and the island portion 28 which is not electrically connected to the resistor 24 and is made of metal is arranged adjacent to the narrow portion 27. There is.
  • the resistor 24 is made of plate-shaped CuNi.
  • the size of the resistor 24 is 1.6 mm in length, 3.2 mm in width, and 0.7 mm in thickness.
  • the resistor 24 is not limited to a plate shape and may be a foil shape.
  • a metal such as CuMn or NiCr may be used as the material of the resistor 24.
  • the thickness of the resistor 24 can take a value of 0.5 mm to 0.58 mm.
  • a groove 29 is provided at the center of the side surface of the resistor 24 by punching, laser irradiation, etching or the like.
  • the groove portion 29 forms the narrow portion 27, and at the same time, the groove portion 29 provides the island portion 28 separated from the resistor 24.
  • the groove portion 29 is located between the island portion 28 and the narrow portion 27, and the island portion 28 and the narrow portion 27 are separated by the width of the groove portion 29.
  • the island portion 28 and the resistor 24 are not electrically connected by the groove portion 29.
  • the island portion 28 is formed via a groove portion 29 at a location adjacent to the narrow portion 27 which is a hot spot in the central portion of the resistor 24.
  • the island portion 28 can be easily formed at a position adjacent to the narrow width portion 27 only by forming the groove portion 29 by performing punching, laser irradiation, etching or the like on the resistor 24.
  • a square-shaped groove portion 29 is formed in the central portion of the resistor 24, and an island portion 28 is provided. Further, as shown in FIG. 9, the island portion 28 may be formed by forming U-shaped groove portions 29 on both side surfaces of the central portion of the resistor 24.
  • the size of the island portion 28 is 0.6 mm in length (y direction) and 0.7 mm in width (x direction, W28) in both cases of FIG. 8 and FIG.
  • the width of the groove 29 is 0.05 mm.
  • the width W27 of the narrow portion 27 is 0.5 mm in the case of FIG. 8 and 0.6 mm in the case of FIG.
  • the pair of electrodes 25 are formed on both ends of the lower surface of the resistor 24.
  • the pair of electrodes 25 is formed by welding a separate metal plate containing Cu as a main component to the resistor 24 and clad bonding.
  • the pair of electrodes 25 may be formed by directly plating, sputtering, or printing a metal material on the resistor 24.
  • the distance between the opposite ends of the pair of electrodes 25 is 2.2 mm.
  • the size of each of the pair of electrodes 25 is 1.4 mm in length (y direction) and 0.5 mm in width (x direction).
  • the pair of electrodes 25 are provided at the center of the resistor 24 in the vertical direction (y direction).
  • a plating layer 30 made of nickel plating is formed on the exposed surfaces around the pair of electrodes 25 and both end surfaces of the resistor 24 (the surfaces exposed in the current flow direction).
  • the plating layer 30 may be formed by tin plating instead of nickel plating.
  • the thickness of the plating layer 30 is several ⁇ m.
  • the insulating layer 26 is a resin substrate made of glass epoxy and is bonded to the upper surface of the resistor 24. Alumina powder or the like may be contained in the insulating layer 26 to improve heat dissipation. Further, as the insulating layer 26, a resin substrate other than glass epoxy, for example, a substrate made of epoxy may be used. The layer thickness of the insulating layer 26 is 0.06 mm. 8 and 9, the insulating layer 26 is omitted and only the resistor 24 (island portion 28, groove portion 29) and the pair of electrodes 25 are shown for the sake of simplicity.
  • another protective film 31 may be provided between the pair of electrodes 25 on the lower surface of the resistor 24.
  • the thickness of the other protective film 31 is 0.2 mm.
  • the thickness of the other protective film 31 can take a value of 0.19 mm to 0.26 mm.
  • the resistor 200 is connected to the land 33 formed on the mounting substrate 32 via the mounting solder 34. At this time, the mounting solder 34 is connected to the plating layer 30.
  • the direction in which the mounting substrate 32 is located with respect to the resistor is referred to as the lower side in this specification.
  • the island portion 28 made of a metal having high thermal conductivity is adjacent to the narrow portion 27, which is a hot spot of the resistor 24, via the groove portion 29.
  • the heat generated in the resistor 24 can be easily dissipated to the island portion 28, whereby the heat can be dispersed. Therefore, the temperature of the surface of the resistor 24 can be lowered, and as a result, long-term reliability can be improved.
  • the narrow groove portion 29 is formed between the island portion 28 and the narrow portion 27, and since the narrow portion 27 has a high temperature at a hot spot, the heat of the resistor 24 (narrow portion 27) is generated by the island. It is easy to reach the part 28.
  • the island portion 28 may be connected to a heat sink 35 provided separately.
  • the heat dissipation plate 35 is provided on the upper surface of the insulating layer 26 and is made of plate-shaped copper.
  • the heat dissipation plate 35 and the resistor 24 are electrically and thermally connected to each other via a through conductor 36.
  • the heat radiating plate 35 covers a part of the resistor 24, preferably 2/3 or more of the area of the resistor 24, and more preferably substantially the entire surface of the resistor 24.
  • a protective film 37 made of epoxy resin is formed so as to cover the heat sink 35.
  • the protective film 37 covers the entire surface of the heat dissipation plate 35, the resistor 24 not covered by the heat dissipation plate 35, and a part of the insulating layer 26. As a result, the heat dissipation plate 35 is not exposed to the outside, and insulation between the heat dissipation plate 35 and the pair of electrodes 25, the plating layer 30, and the mounting solder 34 can be ensured.
  • the protective film 37 has a thickness of 0.2 mm. The thickness of the protective film 37 can take a value of 0.19 mm to 0.26 mm.
  • the heat dissipation plate 35 also has a role as a support plate so that the resistor 24 is not deformed even when bending stress is applied.
  • the through conductor 36 is formed by providing through holes in the insulating layer 26 and the heat dissipation plate 35 and filling the through holes with copper paste.
  • the through conductor 36 is directly connected to the island portion 28 and the heat dissipation plate 35. Therefore, the island portion 28 and the heat dissipation plate 35 are electrically and thermally connected to each other through the penetrating conductor 36.
  • the through conductor 36 may be formed only on the insulating layer 26 so that the upper surface of the island portion 28 and the lower surface of the heat dissipation plate 35 are connected to each other. Further, the number of through conductors 36 may be two or more instead of one. Furthermore, the through conductor 36 should have a large connection area with the resistor 24.
  • the through conductor 36 may be made of a metal having a high thermal conductivity such as silver other than copper.
  • two or more heat sinks 35 may be formed. At this time, one heat dissipation plate 35 is not electrically connected to both the pair of electrodes 25. By connecting one heat dissipation plate 35 to one of the pair of electrodes 25, heat dissipation is improved.
  • FIG. 11 shows that two heat sinks 35 are formed. The ends of the two heat dissipation plates 35 are exposed and are not in contact with each other. Further, the two heat radiation plates 35 are connected to each other by separate island portions 28 and through conductors 36.
  • the heat dissipation plate 35 By connecting the heat dissipation plate 35 to the mounting solder 34, the heat absorbed by the heat dissipation plate 35 can be released to the mounting board 32 via the mounting solder 34.
  • FIG. 12 is a cross-sectional view of the resistor 300 according to the third embodiment of the present disclosure
  • FIG. 13 is a top view of the main part of the resistor.
  • FIG. 12 is a sectional view taken along the line XII-XII in FIG.
  • the horizontal direction of the paper (direction from the left side of the paper to the right) is the x-axis
  • the vertical direction of the paper is the y-axis.
  • the direction perpendicular to the plane of the paper is the z axis.
  • a resistor As shown in FIGS. 12 and 13, a resistor according to an embodiment of the present disclosure includes a resistor 38 made of metal, a pair of electrodes 39 located at both ends of the lower surface of the resistor 38, and a resistor.
  • the protective film 40 is provided on the upper surface of the body 38.
  • the resistor 38 is provided with the narrow portion 41, and the island portion 42 which is not electrically connected to the resistor 38 and is made of metal is arranged at a position adjacent to the narrow portion 41. There is.
  • an island portion 42 is formed on the same surface of the resistor 38 and the protective film 40, and the island portion 42 is connected to the heat dissipation terminal 43.
  • the resistor 38 is made of plate-shaped CuNi.
  • the size of the resistor 38 is 1.6 mm in length, 3.2 mm in width, and 0.7 mm in thickness.
  • the resistor 38 is not limited to the plate shape and may be a foil shape.
  • a metal such as CuMn or NiCr may be used as the material of the resistor 38.
  • the thickness of the resistor 38 can take a value of 0.5 mm to 0.58 mm.
  • a groove 44 is provided at the center of the side surface of the resistor 38 by punching, laser irradiation, etching or the like.
  • a narrow portion 41 is formed in the resistor 38 by the groove 44, and at the same time, an independent island portion 42 separated from the resistor 38 by the groove 44 is provided.
  • the groove portion 44 is located between the island portion 42 and the narrow portion 41, the island portion 42 and the narrow portion 41 are adjacent to each other via the groove portion 44, and are apart from each other by the width dimension of the groove portion 44.
  • the island 42 and the resistor 38 are not electrically connected by the groove 44.
  • the island portion 42 is formed via a groove portion 44 at a location adjacent to the narrow portion 41 which is a hot spot in the central portion of the resistor 38.
  • the island portion 42 can be easily formed at a position adjacent to the narrow width portion 41 only by forming the groove portion 44 by performing punching, laser irradiation, etching or the like on the resistor 38.
  • a square-shaped groove portion 44 is formed in the central portion of the resistor 38, and the island portion 42 is provided. Further, as shown in FIG. 14, the island portion 42 may be formed by forming U-shaped groove portions 44 on both side surfaces of the central portion of the resistor 38.
  • the horizontal direction of the paper (the direction from the left side of the paper to the right) is the x-axis
  • the vertical direction of the paper is the y-axis
  • the direction perpendicular to the plane of the paper is the z axis.
  • the size of the island portion 42 is 0.6 mm in length (y direction) and 0.7 mm in width (x direction, W42) both in the case of FIG. 13 and the case of FIG.
  • the width of the groove portion 44 is 0.05 mm. Further, the width W41 of the narrow portion 41 is 0.5 mm in the case of FIG. 13 and 1.0 mm in the case of FIG.
  • the pair of electrodes 39 are connected to both ends of the lower surface of the resistor 38.
  • the pair of electrodes 39 is formed by welding or clad-bonding a separate metal plate containing Cu as a main component to the resistor 38.
  • the pair of electrodes 39 may be formed by directly plating, sputtering, or printing a metal material on the resistor 38.
  • the distance between the opposite ends of the pair of electrodes 39 is 2.2 mm.
  • the size of each of the pair of electrodes 39 is 1.4 mm in length (y direction) and 0.5 mm in width (x direction).
  • the pair of electrodes 39 is provided at the center of the resistor 38 in the vertical direction (y direction).
  • a plating layer 45a formed by nickel plating is formed on the exposed surfaces around the pair of electrodes 39 and both end surfaces of the resistor 38 (the surfaces exposed in the current flow direction).
  • the plating layer 45a may be formed by tin plating instead of nickel plating.
  • the thickness of the plating layer 45a is several ⁇ m.
  • the protective film 40 is an insulating substrate made of glass epoxy and is adhered to the upper surface of the resistor 38.
  • the protective film 40 may contain alumina powder or the like to improve heat dissipation.
  • a resin substrate other than glass epoxy for example, an epoxy substrate may be used.
  • the protective film 40 is omitted and only the resistor 38 (island portion 42, groove portion 44), the pair of electrodes 39, and the heat dissipation terminal 43 are shown for simplicity of description.
  • the width of the protective layer 40 (resistor) and the width of the resistor 38 are equal.
  • the width means a dimension in a direction orthogonal to a direction connecting the pair of electrodes 39.
  • the heat dissipation terminal 43 is formed by welding or clad bonding a separate metal plate containing Cu as a main component to the lower surface of the island portion 42 in the lower surface direction of the resistor 38.
  • the heat dissipation terminal 43 may be formed by directly plating, sputtering, or printing a metal material on the resistor 38.
  • the size of the heat dissipation terminal 43 is 0.5 mm in the vertical direction (y direction) and 0.6 mm in the horizontal direction (x direction).
  • a plating layer 45b made of nickel plating is formed on the exposed surface around the heat dissipation terminal 43.
  • the plating layer 45b may be formed by tin plating instead of nickel plating.
  • the thickness of the plating layer 45b is several ⁇ m.
  • the heat dissipation terminal 43 is not directly electrically connected to the resistor 38 and the pair of electrodes 39. Further, the heat dissipation terminal 43 and the pair of electrodes 39 are arranged on an axis passing through the center of the resistor 300 (an axis parallel to the z axis in FIGS. 13 and 14) so that the resistor 300 is located at the same position even if the resistor 300 is rotated 180 degrees. It is located at a location that is rotationally symmetrical with respect to it, so that mounting is easy.
  • the insulating layer 46 is provided at a location where the resistor 38, the pair of electrodes 39 on the lower surface of the island portion 42, and the heat dissipation terminal 43 are not formed.
  • this resistor is connected to the lands 48a and 48b formed on the mounting board 47 via the mounting solder 49.
  • the mounting solder 49 is connected to the plating layers 45a and 45b.
  • the direction in which the mounting substrate 47 is located with respect to the resistor is referred to as the lower side in this specification.
  • the pair of electrodes 39 and the heat dissipation terminal 43 are both provided on the lower surface of the resistor 38, and since the heat dissipation terminal 43 is located on the mounting substrate 47 side of the resistor 38, it is mounted on the heat dissipation terminal 43.
  • the distance to the substrate 47 is short.
  • the land 48a connected to the pair of electrodes 39 and the land 48b connected to the heat dissipation terminal 43 are prevented from being directly electrically connected.
  • the island portion 42 made of a metal having a high thermal conductivity is adjacent to the narrow portion 41, which is a hot spot of the resistor 38, via the groove portion 44, and therefore the resistance is high.
  • the heat generated in the body 38 can be easily released to the island portion 42.
  • the narrow groove portion 44 is formed between the island portion 42 and the narrow portion 41, and since the narrow portion 41 has a high temperature in a hot spot, the heat of the resistor 38 (narrow portion 41) is generated by the island. It is easy to reach the part 42.
  • the island portion 42 and the heat dissipation terminal 43 function as a heat radiator, and the distance between the heat dissipation terminal 43 and the mounting substrate 47 is short, the heat generated by the resistor 38 is transmitted through the island portion 42 and the heat dissipation terminal 43.
  • the mounting substrate 47 can effectively dissipate the heat, and the heat can be dispersed. Therefore, the temperature of the surface of the resistor 38 can be lowered, and as a result, the long-term reliability can be improved. The effect that can be obtained is obtained.
  • the island portion 42 may be electrically connected to the resistor 38 (narrow width portion 41) via the connection portion 50.
  • the horizontal direction of the paper surface (the direction from the left side to the right side of the paper surface) is the x-axis
  • the vertical direction of the paper surface (the direction from the bottom to the top of the paper surface) is the y-axis.
  • the direction perpendicular to the plane of the paper is the z axis.
  • the island portion 42 is connected to the resistor 38 by the connecting portion 50 made of a metal material having a high thermal conductivity, the heat generated in the resistor 38 is transferred via the island portion 42 and the heat dissipation terminal 43. A large amount can be released to the mounting substrate 47.
  • the resistor 38 and the island portion 42 are electrically connected to each other through the connecting portion 50 in a direction substantially orthogonal to the direction of current flow. As a result, almost no current flows through the island portion 42, so that the electrical characteristics are not significantly affected.
  • the width of the protective layer 40 (resistor 300) and the width of the resistor 38 are equal, but as shown in FIG. May be narrower than the width of the protective film 40.
  • the horizontal direction of the paper (direction from the left side of the paper to the right) is the x-axis
  • the vertical direction of the paper is the y-axis
  • the direction perpendicular to the plane of the paper is the z axis.
  • the island portion 42 and the heat dissipation terminal 43 have the same surface as the side surface of the protective film 40, and from the side surface of the protective film 40 (the surface which is orthogonal to the current flowing direction and is parallel to the line connecting the pair of electrodes 39).
  • the exposed resistor 38 and the pair of electrodes 39 are covered with an insulating layer 46 so as not to be exposed from the side surface of the protective film 40.
  • the layer thickness, material and size of each layer are not limited to the above, but can be changed as appropriate depending on the value of the resistance of the resistors 100 to 300.
  • the size of the resistor 100 is 1.6 mm in length and 3.2 mm in width, but the size is not limited to this, and it may be 2.5 mm in length and 5.0 mm in width.
  • the resistor according to the present disclosure has an effect of being able to improve long-term reliability, and in particular, a resistor using a high-power metal plate used for current value detection of various electronic devices as a resistor. It is useful when applied to etc.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Resistors (AREA)

Abstract

L'objectif de la présente invention est de fournir une résistance ayant une meilleure fiabilité à long terme. La résistance de la présente invention comprend : un corps résistif (11) comprenant du métal ; une paire d'électrodes (12) positionnées aux deux extrémités d'une surface du corps résistif (11) ; une couche isolante (13) positionnée sur une autre surface du corps résistif (11) en regard de ladite surface ; et une plaque de dissipation de chaleur (14) disposée sur la couche isolante (13) de manière à recouvrir au moins une partie du corps résistif (11). Un conducteur traversant (15) disposé sur la couche isolante (13) et comprenant du métal connecte l'autre surface du corps résistif (11) et la plaque de dissipation de chaleur (14).
PCT/JP2019/042044 2018-11-06 2019-10-25 Résistance Ceased WO2020095733A1 (fr)

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JP2018208524 2018-11-06
JP2018-217848 2018-11-21
JP2018217848 2018-11-21
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JP2018232570 2018-12-12

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021235229A1 (fr) * 2020-05-19 2021-11-25 Koa株式会社 Résistance shunt et son procédé de fabrication
CN116858408A (zh) * 2023-03-03 2023-10-10 武汉飞恩微电子有限公司 一种轴力传感器

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JPS56147401A (en) * 1980-04-18 1981-11-16 Hitachi Ltd Resistor
JPS62152402U (fr) * 1986-03-19 1987-09-28
JPH01154304A (ja) * 1987-12-11 1989-06-16 Nippon Hoso Kyokai <Nhk> 磁気記録再生方式
JPH0733514A (ja) * 1993-07-19 1995-02-03 Nippondenso Co Ltd アルミナ基板及びこれを用いた多層基板
JPH08274422A (ja) * 1995-03-29 1996-10-18 Sumitomo Kinzoku Electro Device:Kk 回路基板
JP2009052898A (ja) * 2007-08-23 2009-03-12 Mitsubishi Electric Corp 電流検出基板
JP2011228453A (ja) * 2010-04-19 2011-11-10 Jtekt Corp 多層回路基板、モータ制御装置及び車両用操舵装置
JP2015002333A (ja) * 2013-06-18 2015-01-05 株式会社村田製作所 抵抗内蔵基板およびこれを備える電流検出モジュール
JP2015103472A (ja) * 2013-11-27 2015-06-04 株式会社デンソー 電流測定装置

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Publication number Priority date Publication date Assignee Title
JPS6454304U (fr) * 1987-09-30 1989-04-04

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56147401A (en) * 1980-04-18 1981-11-16 Hitachi Ltd Resistor
JPS62152402U (fr) * 1986-03-19 1987-09-28
JPH01154304A (ja) * 1987-12-11 1989-06-16 Nippon Hoso Kyokai <Nhk> 磁気記録再生方式
JPH0733514A (ja) * 1993-07-19 1995-02-03 Nippondenso Co Ltd アルミナ基板及びこれを用いた多層基板
JPH08274422A (ja) * 1995-03-29 1996-10-18 Sumitomo Kinzoku Electro Device:Kk 回路基板
JP2009052898A (ja) * 2007-08-23 2009-03-12 Mitsubishi Electric Corp 電流検出基板
JP2011228453A (ja) * 2010-04-19 2011-11-10 Jtekt Corp 多層回路基板、モータ制御装置及び車両用操舵装置
JP2015002333A (ja) * 2013-06-18 2015-01-05 株式会社村田製作所 抵抗内蔵基板およびこれを備える電流検出モジュール
JP2015103472A (ja) * 2013-11-27 2015-06-04 株式会社デンソー 電流測定装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021235229A1 (fr) * 2020-05-19 2021-11-25 Koa株式会社 Résistance shunt et son procédé de fabrication
JP7500271B2 (ja) 2020-05-19 2024-06-17 Koa株式会社 シャント抵抗器およびその製造方法
US12248005B2 (en) 2020-05-19 2025-03-11 Koa Corporation Shunt resistor and manufacturing method thereof
CN116858408A (zh) * 2023-03-03 2023-10-10 武汉飞恩微电子有限公司 一种轴力传感器

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