WO2020090746A1 - 樹脂組成物、感光性樹脂組成物、硬化膜、硬化膜の製造方法、パターン硬化膜およびパターン硬化膜の作製方法 - Google Patents
樹脂組成物、感光性樹脂組成物、硬化膜、硬化膜の製造方法、パターン硬化膜およびパターン硬化膜の作製方法 Download PDFInfo
- Publication number
- WO2020090746A1 WO2020090746A1 PCT/JP2019/042183 JP2019042183W WO2020090746A1 WO 2020090746 A1 WO2020090746 A1 WO 2020090746A1 JP 2019042183 W JP2019042183 W JP 2019042183W WO 2020090746 A1 WO2020090746 A1 WO 2020090746A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- group
- carbon atoms
- formula
- resin composition
- alkyl group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 0 CCC(C)(**)c1ccccc1 Chemical compound CCC(C)(**)c1ccccc1 0.000 description 6
- QHPKIUDQDCWRKO-UHFFFAOYSA-N CC(C)(C)c(cc(C(C)(C)c(cc1C(C)(C)C)cc(C(C)(C)C)c1O)cc1C(C)(C)C)c1O Chemical compound CC(C)(C)c(cc(C(C)(C)c(cc1C(C)(C)C)cc(C(C)(C)C)c1O)cc1C(C)(C)C)c1O QHPKIUDQDCWRKO-UHFFFAOYSA-N 0.000 description 1
- WXYSZTISEJBRHW-UHFFFAOYSA-N CC(C)(c1ccc(C(C)(c(cc2)ccc2O)c(cc2)ccc2O)cc1)c(cc1)ccc1O Chemical compound CC(C)(c1ccc(C(C)(c(cc2)ccc2O)c(cc2)ccc2O)cc1)c(cc1)ccc1O WXYSZTISEJBRHW-UHFFFAOYSA-N 0.000 description 1
- VHLLJTHDWPAQEM-UHFFFAOYSA-N CC(C)CC(C)(c(cc1)ccc1O)c(cc1)ccc1O Chemical compound CC(C)CC(C)(c(cc1)ccc1O)c(cc1)ccc1O VHLLJTHDWPAQEM-UHFFFAOYSA-N 0.000 description 1
- CYLXQYQUDYFWAH-UHFFFAOYSA-N CC(c1ccccc1)(c(cc1)ccc1O)c(cc1)cc(O)c1O Chemical compound CC(c1ccccc1)(c(cc1)ccc1O)c(cc1)cc(O)c1O CYLXQYQUDYFWAH-UHFFFAOYSA-N 0.000 description 1
- HTVITOHKHWFJKO-UHFFFAOYSA-N CCC(C)(c(cc1)ccc1O)c(cc1)ccc1O Chemical compound CCC(C)(c(cc1)ccc1O)c(cc1)ccc1O HTVITOHKHWFJKO-UHFFFAOYSA-N 0.000 description 1
- BATCUENAARTUKW-UHFFFAOYSA-N Oc1ccc(C(c2ccccc2)(c2ccccc2)c(cc2)ccc2O)cc1 Chemical compound Oc1ccc(C(c2ccccc2)(c2ccccc2)c(cc2)ccc2O)cc1 BATCUENAARTUKW-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
- C08F299/08—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
Definitions
- the present invention relates to a resin composition, a photosensitive resin composition, a cured film, a method for producing a cured film, a pattern cured film, and a method for producing a pattern cured film.
- a polymer compound containing a siloxane bond (hereinafter sometimes referred to as polysiloxane) takes advantage of its high heat resistance and transparency, and is used as a coating material for liquid crystal displays and organic EL displays, a coating material for image sensors, and the semiconductor field. Used as a sealing material in. Further, since it has high oxygen plasma resistance, it is also used as a hard mask material for a multilayer resist. In order to use polysiloxane as a photosensitive material capable of patterning, it is required to be soluble in an alkaline aqueous solution such as an alkaline developing solution.
- Examples of means for making it soluble in an alkaline developer include using a silanol group in polysiloxane and introducing an acidic group into polysiloxane.
- Examples of such an acidic group include a phenol group, a carboxyl group and a fluorocarbinol group.
- Patent Document 1 discloses a polysiloxane having a silanol group as a soluble group in an alkali developing solution.
- Patent Document 2 discloses a polysiloxane having a phenol group introduced therein
- Patent Document 3 discloses a polysiloxane having a carboxyl group introduced therein.
- These polysiloxanes are alkali-soluble resins and are used as a positive resist composition in combination with a photosensitive compound having a quinonediazide group or a photoacid generator.
- the polysiloxane has a fluorocarbinol group, which is an acidic group, such as a hexafluoroisopropanol group (2-hydroxy-1,1,1,3,3,3-fluoroisopropyl group [—C (CF 3 ) 2 OH],
- a fluorocarbinol group which is an acidic group, such as a hexafluoroisopropanol group (2-hydroxy-1,1,1,3,3,3-fluoroisopropyl group [—C (CF 3 ) 2 OH]
- a siloxane bond Si—O—Si
- the cured film is transparent and heat resistant. Excellent in resistance and acid resistance.
- the polysiloxane before being cured can be made to have alkali solubility (which means solubility in an alkaline aqueous solution), which is essential for development processing.
- alkali solubility which means solubility in an alkaline aqueous solution
- the polysiloxanes described in Patent Documents 4 and 5 are excellent balanced materials.
- a positive type photosensitive resin composition obtained by further adding a photoacid generator or a quinonediazide compound to the polysiloxane is also disclosed in the patent document.
- Patent Document 6 when polysiloxane is used as a protective film for a liquid crystal display or an organic EL display, in addition to heat resistance and transparency, an acidic or alkaline resist stripping solution used in the steps until the display panel is completed, N- From the viewpoint of resistance to chemicals such as methylpyrrolidone (hereinafter sometimes referred to as NMP) and environmental friendliness, it is necessary to reduce the amount of benzene generated in the process, and the naphthalene structure is introduced into the polysiloxane structure. It is disclosed that doing so is effective.
- NMP methylpyrrolidone
- a polysiloxane having an HFIP group introduced as an acidic group that is, one obtained by heating and curing the polysiloxane described in Patent Documents 4 and 5 as a film has both transparency, heat resistance, and acid resistance, and Since the polysiloxane before being cured has an alkali solubility (which means solubility in an alkaline aqueous solution), it is suitable for development processing and is excellent in these points.
- the film obtained by curing the polysiloxane in the curing step is an organic solvent such as NMP or propylene glycol monomethyl ether acetate (hereinafter sometimes referred to as PGMEA) used in the manufacturing process of liquid crystal displays and organic EL displays.
- PGMEA propylene glycol monomethyl ether acetate
- component (A) component A structural unit represented by formula (1), A structural unit of at least one of formulas (2) and (3), Containing polysiloxane compound
- R 1 is a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, a phenyl group, a hydroxy group, an alkoxy group having 1 to 3 carbon atoms or a fluoroalkyl group having 1 to 3 carbon atoms
- b is 1 to 3 is an integer
- m is an integer of 0 to 2
- n is an integer of 1 to 3
- b + m + n 4.
- R y is a monovalent organic group having 1 to 30 carbon atoms and containing any of an epoxy group, an oxetane group, an acryloyl group, and a methacryloyl group.
- R 2 is a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, a phenyl group, a hydroxy group, an alkoxy group having 1 to 3 carbon atoms, or a fluoroalkyl group having 1 to 3 carbon atoms
- c is 1 to 3 is an integer
- p is an integer of 0 to 2
- q is an integer of 1 to 3
- c + p + q 4.
- the resin composition having such a structure forms a cured film by being applied to a base material and subjected to heat treatment (curing step), but the thermal stability of the cured film.
- Transparency refers to resistance to acidic solutions), while maintaining a level comparable to (substantially equivalent to) the polysiloxane compounds described in Patent Documents 4 and 5, further resistant to organic solvents (to organic solvents) It has been found that it is an excellent material that is well-balanced as a whole.
- the alkali solubility of "polysiloxane before curing treatment” was at the same level as the polysiloxanes described in Patent Documents 4 and 5, and it was found that there is no problem in developing treatment.
- the "(A) component polysiloxane compound” includes both the following types a and b.
- ⁇ Type a> A siloxane monomer giving a constitutional unit represented by the formula (1), At least one of a siloxane monomer giving the constitutional unit of formula (2) and a siloxane monomer giving the structural unit of formula (3), A polysiloxane compound obtained by copolymerizing ⁇ Type b> A polymer in which only a certain number of structural units represented by formula (1) are connected; The constitutional unit of the formula (2) and the polymer in which at least one of the structural units of the formula (3) is connected in a fixed number are combined at at least one site in the molecule with, for example, a Si—O—Si bond. A so-called block copolymer type polysiloxane compound which is formed into a single polymer by being formed.
- Patent Documents 4 and 5 do not disclose a polysiloxane containing a structural unit represented by the formula (2) or a structural unit represented by the formula (3).
- the present inventor has at least one of the structural units represented by the formula (2) and the structural unit represented by the formula (3) with respect to the structural unit represented by the formula (1).
- a polysiloxane composition having dramatically improved chemical resistance to an organic solvent, and a cured film of the polysiloxane can be obtained by further containing the compound.
- the resin composition becomes a resin composition for forming a positive pattern, which will be described later. It was found that by performing the first to fourth steps, the cured film having a good positive pattern can be obtained.
- a photosensitizer such as quinonediazide, a photoacid generator, a radical generator, etc.
- the present inventors have found a resin composition containing the following components (A1) and (A2) and the component (B).
- Component (A1) A polymer containing the constitutional unit represented by the formula (1) but not containing the constitutional unit of the formula (2).
- Component (A2) A polymer containing the structural unit of the formula (2) and at least one structural unit of the structural unit of the formula (3), but not containing the structural unit represented by the formula (1).
- a resin composition having such a configuration (“a resin composition containing a component (A1), a component (A2) and a component (B)”) is adopted, the above “component (A) and component (B)” is used.
- the first stage of the resin composition it is a blend (mixture) of different kinds of polymers.
- the “resin composition containing the component (A1), the component (A2) and the component (B)” is applied on a substrate and heat-treated, an epoxy group, an acryloyl group or a methacryloyl group can be obtained.
- a cured film is formed through the curing reaction and the reaction between silanol groups of different molecules.
- a resin containing the constitutional unit represented by the formula (1) and the constitutional unit represented by the formula (2) or the constitutional unit represented by the formula (3) is produced in the form of a "cured film".
- a polymer polysiloxane compound
- the “resin composition containing the component (A1), the component (A2), and the component (B)” also functions as a composition for a positive resist if the above-mentioned component (C) is further added.
- the present invention includes the following inventions 1 to 11.
- a resin composition comprising the following component (A) and component (B).
- component (A) component A structural unit represented by formula (1), A structural unit of at least one of formulas (2) and (3), Containing a polysiloxane compound.
- R 1 is a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, a phenyl group, a hydroxy group, an alkoxy group having 1 to 3 carbon atoms or a fluoroalkyl group having 1 to 3 carbon atoms, and b is 1 to 3
- M is an integer of 0 to 2
- n is an integer of 1 to 3
- b + m + n 4.
- R y is a monovalent organic group having 1 to 30 carbon atoms and containing any of an epoxy group, an oxetane group, an acryloyl group, and a methacryloyl group.
- R 2 is a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, a phenyl group, a hydroxy group, an alkoxy group having 1 to 3 carbon atoms, or a fluoroalkyl group having 1 to 3 carbon atoms
- c is 1 to 3 is an integer
- p is an integer of 0 to 2
- q is an integer of 1 to 3
- c + p + q 4.
- R g , R h , R i , R j, and R k each independently represent a linking group or a divalent organic group.
- the broken line represents a bond).
- Solvents are propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, cyclohexanone, ethyl lactate, ⁇ -butyrolactone, diacetone alcohol, diglyme, methyl isobutyl ketone, 3-methoxybutyl acetate, 2-heptanone, N, N-dimethylformamide , N, N-dimethylacetamide, N-methylpyrrolidone, glycols and glycol ethers, a solvent containing at least one compound selected from the group consisting of glycol ether esters), any one of inventions 1 to 3
- a resin composition comprising the following component (A1), component (A2), and component (B).
- Component (A1) A polymer containing the constitutional unit represented by the formula (1), but containing neither the constitutional unit of the formula (2) nor the constitutional unit of the formula (3).
- Component (A2) A polymer containing the structural unit of the formula (2) and at least one structural unit of the structural unit of the formula (3), but not containing the structural unit represented by the formula (1).
- R 1 is a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, a phenyl group, a hydroxy group, an alkoxy group having 1 to 3 carbon atoms or a fluoroalkyl group having 1 to 3 carbon atoms, and b is 1 to 3
- M is an integer of 0 to 2
- n is an integer of 1 to 3
- b + m + n 4.
- R y is a monovalent organic group having 1 to 30 carbon atoms and containing any of an epoxy group, an oxetane group, an acryloyl group, and a methacryloyl group.
- R 2 is a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, a phenyl group, a hydroxy group, an alkoxy group having 1 to 3 carbon atoms, or a fluoroalkyl group having 1 to 3 carbon atoms
- c is 1 to 3 is an integer
- p is an integer of 0 to 2
- q is an integer of 1 to 3
- c + p + q 4.
- Component (B) solvent.
- a resin composition according to any one of inventions 1 to 5 A photosensitive resin composition comprising, as the component (C), a quinonediazide compound, a photoacid generator, and a photosensitizer selected from a photoradical generator.
- invention 7 A cured film of the resin composition according to any one of inventions 1 to 5.
- invention 8 A method for producing a cured film, which comprises applying the resin composition according to any one of Inventions 1 to 5 onto a substrate and then heating at a temperature of 100 to 350 ° C.
- a method for producing a patterned cured film which comprises the following first to fourth steps.
- First step a step of forming a photosensitive resin film by coating and drying the photosensitive resin composition according to the invention 6 on a substrate.
- Second step a step of exposing the photosensitive resin film to light.
- Third step a step of developing the photosensitive resin film after exposure to form a pattern resin film.
- Fourth step a step of heating the patterned resin film, thereby curing the patterned resin film and converting it into a patterned cured film.
- invention 11 The method for producing a patterned cured film according to invention 10, characterized in that the wavelength of light used for exposure in the second step is 100 to 600 nm.
- the hydrogen atom of the hydroxy group of the alkoxysilane represented by the following formula (7) or formula (7-1) is converted into an acid labile group as the polysiloxane compound as the component (A). 5.
- each R 1 independently represents a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, a phenyl group, a hydroxy group, an alkoxy group having 1 to 3 carbon atoms, or an alkyl group having 1 to 3 carbon atoms.
- R 12's are each independently a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, a phenyl group, a hydroxy group, an alkoxy group having 1 to 3 carbon atoms, or 1 to 3 carbon atoms.
- an alkoxysilane represented by the following formula (7) or formula (7-1) is hydrolyzed and polycondensed to form a polymer, and then The method for producing a resin composition according to any one of Inventions 1 to 4, which uses a polysiloxane compound obtained by converting a hydrogen atom of a hydroxy group in a polymer into an acid labile group.
- each R 1 independently represents a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, a phenyl group, a hydroxy group, an alkoxy group having 1 to 3 carbon atoms, or an alkyl group having 1 to 3 carbon atoms.
- R 12's are each independently a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, a phenyl group, a hydroxy group, an alkoxy group having 1 to 3 carbon atoms, or 1 to 3 carbon atoms.
- each R 1 independently represents a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, a phenyl group, a hydroxy group, an alkoxy group having 1 to 3 carbon atoms, or an alkyl group having 1 to 3 carbon atoms.
- R 12's are each independently a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, a phenyl group, a hydroxy group, an alkoxy group having 1 to 3 carbon atoms, or 1 to 3 carbon atoms.
- each R 1 independently represents a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, a phenyl group, a hydroxy group, an alkoxy group having 1 to 3 carbon atoms, or an alkyl group having 1 to 3 carbon atoms.
- R 12's are each independently a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, a phenyl group, a hydroxy group, an alkoxy group having 1 to 3 carbon atoms, or 1 to 3 carbon atoms.
- the resin composition of the present invention becomes a cured film by being applied to a substrate and subjected to heat treatment (curing step).
- the cured film has thermal stability, transparency, and acid resistance (resistance to acidic solutions).
- the organic solvent resistance referred to as resistance to an organic solvent
- the organic solvent resistance is significantly improved.
- the resin composition becomes a resin composition for forming a positive pattern, The cured film having a favorable positive pattern is obtained.
- a photosensitizer such as quinonediazide, a photoacid generator, a radical generator, etc.
- Resin composition containing (A) component and (B) component ⁇ 2> Photosensitive resin composition containing (C) component ⁇ 3> Curing of resin composition Film production method ⁇ 4> Patterning method using photosensitive resin composition ⁇ 5>
- the broken line in the chemical formula represents a bond.
- Resin composition containing (A) component and (B) component
- the resin composition is characterized by containing the following (A) component and (B) component.
- (A) component A structural unit represented by formula (1), A structural unit of at least one of formulas (2) and (3), Containing a polysiloxane compound.
- R 1 is a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, a phenyl group, a hydroxy group, an alkoxy group having 1 to 3 carbon atoms or a fluoroalkyl group having 1 to 3 carbon atoms, and b is 1 to 3
- M is an integer of 0 to 2
- n is an integer of 1 to 3
- b + m + n 4.
- R y is a monovalent organic group having 1 to 30 carbon atoms and containing any of an epoxy group, an oxetane group, an acryloyl group, and a methacryloyl group.
- R 2 is a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, a phenyl group, a hydroxy group, an alkoxy group having 1 to 3 carbon atoms, or a fluoroalkyl group having 1 to 3 carbon atoms
- c is 1 to 3 is an integer
- p is an integer of 0 to 2
- q is an integer of 1 to 3
- c + p + q 4.
- the HFIP group or the hydroxyl group of the HFIP group is chemically modified with an acid labile group.
- an acid labile group As described above, by introducing the HFIP group into the polysiloxane compound, solubility in an alkali developing solution can be exhibited.
- the HFIP group is a polar group containing a fluorine atom and a hydroxyl group, and has excellent solubility in a general-purpose coating solvent.
- O n / 2 in the formula (1) is generally used as a notation of a polysiloxane compound, and in the following formula (1-1), n is 1 and formula (1-2) is The formula (1-3) represents the case where n is 2 and n is 3. When n is 1, it is located at the end of the polysiloxane chain in the polysiloxane compound.
- R x has the same meaning as R x in formula (1)
- R a, R b are independently the same R x in the formula (1)
- Broken line is a bond Represents).
- O n / 2 in the formula (2) is the same as described above, where n is 1 in the following formula (2-1), n is 2 in the formula (2-2), and n is 2 in the formula (2-3). 3 represents the case of 3. When n is 1, it is located at the end of the polysiloxane chain in the polysiloxane compound.
- R y has the same meaning as R y in formula (2)
- R a, R b are each independently R y in formula (2)
- Broken line represents a bond Represents).
- R 1 is a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, a phenyl group, a hydroxy group, an alkoxy group having 1 to 3 carbon atoms or a fluoroalkyl group having 1 to 3 carbon atoms, and b is 1 to 3
- M is an integer of 0 to 2
- n is an integer of 1 to 3
- b + m + n 4.
- R 1 in the formula (1) include a hydrogen atom, a methyl group, an ethyl group, a 3,3,3-trifluoropropyl group, and a phenyl group.
- b is preferably 1 or 2.
- m is preferably 0 or 1.
- n is preferably 2 or 3. It is preferable that a is 1 or 2.
- the number of the HFIP group-containing aryl groups represented by the formula (1a) in the formula (1) is 1, that is, b is 1 as the structural unit represented by the formula (1) from the viewpoint of ease of production. It is an example of a particularly preferable structural unit.
- the acid labile group is a group that is eliminated by the action of a so-called acid, and may partially include an oxygen atom, a carbonyl bond, or a fluorine atom.
- the acid labile group can be used without particular limitation as long as it is a group that is eliminated by the effect of a photoacid generator or hydrolysis, but specific examples include an alkyl group and an alkyloxy group. Examples thereof include a carbonyl group, an acetal group, a silyl group and an acyl group.
- alkyl group tert-butyl group, tert-amyl group, 1,1-dimethylpropyl group, 1-ethyl-1-methylpropyl group, 1,1-dimethylbutyl group, allyl group, 1-pyrenylmethyl group, 5 -Dibenzosuberyl group, triphenylmethyl group, 1-ethyl-1-methylbutyl group, 1,1-diethylpropyl group, 1,1-dimethyl-1-phenylmethyl group, 1-methyl-1-ethyl-1- Phenylmethyl group, 1,1-diethyl-1-phenylmethyl group, 1-methylcyclohexyl group, 1-ethylcyclohexyl group, 1-methylcyclopentyl group, 1-ethylcyclopentyl group, 1-isobornyl group, 1-methyladamantyl group , 1-ethyladamantyl group, 1-isopropyladamantyl group, 1-isopropyln
- the alkyl group is preferably a tertiary alkyl group, more preferably a group represented by —CR p R q R r (R p , R q and R r are each independently linear or branched alkyl. Group, a monocyclic or polycyclic cycloalkyl group, an aryl group or an aralkyl group, and two of R p , R q and R r may combine to form a ring structure).
- Examples of the alkoxycarbonyl group include a tert-butoxycarbonyl group, a tert-amyloxycarbonyl group, a methoxycarbonyl group, an ethoxycarbonyl group and an i-propoxycarbonyl group.
- the acetal group methoxymethyl group, ethoxyethyl group, butoxyethyl group, cyclohexyloxyethyl group, benzyloxyethyl group, phenethyloxyethyl group, ethoxypropyl group, benzyloxypropyl group, phenethyloxypropyl group, ethoxybutyl group, Examples thereof include an ethoxyisobutyl group.
- silyl group examples include trimethylsilyl group, ethyldimethylsilyl group, methyldiethylsilyl group, triethylsilyl group, i-propyldimethylsilyl group, methyldi-i-propylsilyl group, tri-i-propylsilyl group, t-butyl.
- examples thereof include a dimethylsilyl group, a methyldi-t-butylsilyl group, a tri-t-butylsilyl group, a phenyldimethylsilyl group, a methyldiphenylsilyl group and a triphenylsilyl group.
- acyl group acetyl group, propionyl group, butyryl group, heptanoyl group, hexanoyl group, valeryl group, pivaloyl group, isovaleryl group, lauriloyl group, myristoyl group, palmitoyl group, stearoyl group, oxalyl group, malonyl group, succinyl group, Glutaryl group, adipoyl group, piperoyl group, suberoyl group, azelayl group, sebacoyl group, acryloyl group, propioloyl group, methacryloyl group, crotonoyl group, oleoyl group, maleoyl group, fumaroyl group, mesaconoyl group, campholoyl group, benzoyl group, phthaloyl group Group, isophthaloyl group, terephthaloyl group, naphthoyl group, tolu
- a tert-butoxycarbonyl group, a methoxymethyl group, an ethoxyethyl group, and a trimethylsilyl group are versatile and preferable. Furthermore, it is also possible to use those in which some or all of the hydrogen atoms of these acid labile groups have been replaced with fluorine atoms. These acid labile groups may be used alone or in combination of two or more.
- AAG-1 As a particularly preferred structure of the acid labile group, a structure represented by the following general formula (ALG-1) and a structure represented by the following general formula (ALG-2) can be mentioned.
- R 11 represents a linear alkyl group having 1 to 10 carbon atoms, a branched alkyl group having 3 to 10 carbon atoms, or a cyclic alkyl group having 3 to 10 carbon atoms, an aryl group having 6 to 20 carbon atoms, or a carbon atom having 7 carbon atoms. -21 aralkyl groups.
- R 12 is a hydrogen atom, a linear alkyl group having 1 to 10 carbon atoms, a branched alkyl group having 3 to 10 carbon atoms, or a cyclic alkyl group having 3 to 10 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an alkyl group having 7 to 7 carbon atoms.
- R 13 , R 14 and R 15 are each independently a straight chain alkyl group having 1 to 10 carbon atoms, a branched alkyl group having 3 to 10 carbon atoms or a cyclic alkyl group having 3 to 10 carbon atoms, and an aryl group having 6 to 20 carbon atoms. It is a group or an aralkyl group having 7 to 21 carbon atoms.
- Two of R 13 , R 14 and R 15 may combine with each other to form a ring structure. * Represents a binding site with an oxygen atom. ]
- the group represented by the formula (1a) in the formula (1) is particularly preferably any of the groups represented by the following formulas (1aa) to (1ad).
- R y is a monovalent organic group having 1 to 30 carbon atoms and containing any of an epoxy group, an oxetane group, an acryloyl group, and a methacryloyl group.
- R 2 is a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, a phenyl group, a hydroxy group, an alkoxy group having 1 to 3 carbon atoms, or a fluoroalkyl group having 1 to 3 carbon atoms
- c is 1 to 3 is an integer
- p is an integer of 0 to 2
- q is an integer of 1 to 3
- c + p + q 4.
- p is preferably 0 or 1.
- q is preferably 2 or 3.
- the value of c is particularly preferably 1.
- the structural unit in which c is 1, p is 0, and q is 3 is an example of a particularly preferable structural unit of the formula (2).
- R 2 include a hydrogen atom, a methyl group, an ethyl group, a phenyl group, a methoxy group, an ethoxy group, and a propoxy group.
- the cured film obtained from the resin composition is well compatible with various base materials such as silicon, glass and resin. Adhesion can be imparted. Further, when the R y group contains an acryloyl group or a methacryloyl group, a cured film having high curability is obtained, and good solvent resistance is obtained.
- the R y group is preferably a group represented by the following formulas (2a), (2b) and (2c).
- R g , R h , and R i each independently represent a linking group or a divalent organic group.
- the broken line represents a bond).
- examples of the divalent organic groups include alkylene groups having 1 to 20 carbon atoms, which form an ether bond. It may include one or more sites. When the number of carbon atoms is 3 or more, the alkylene group may be branched, or distant carbons may be connected to each other to form a ring. When the number of alkylene groups is 2 or more, oxygen may be inserted between carbon and carbon to include one or more sites forming an ether bond. As a divalent organic group, these are This is a preferable example.
- 3-glycidoxypropyltrimethoxysilane manufactured by Shin-Etsu Chemical Co., Ltd., product name: KBM-403.
- 3-glycidoxypropyltriethoxysilane the same product name: KBE-403
- 3-glycidoxypropylmethyldiethoxysilane the same product name: KBE-402
- 3-glycidoxypropylmethyl Dimethoxysilane Product name: KBM-402
- 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane Product name: KBM-303
- 2- (3,4-Epoxycyclohexyl) ethyltri Ethoxysilane 8-glycidoxyoctyltrimethoxysilane (Product name: KBM-4803), [(3 Ethyl-3-oxetanyl) methoxy] propy
- R y group contains an acryloyl group or a methacryloyl group, it is preferably a group selected from the following formula (3a) or (4a).
- R j and R k each independently represent a linking group or a divalent organic group.
- the broken line represents a bond).
- R j and R k are divalent organic groups are the same as those mentioned above as preferable groups for R g , R h , R i , R j and R k .
- repeating units of the formula (2) particularly preferable ones are exemplified by the starting alkoxysilane, 3-methacryloxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name: KBM-503), 3-methacryloxypropyltriethoxysilane (Product name: KBE-503), 3-methacryloxypropylmethyldimethoxysilane (Product name: KBM-502), 3-methacryloxypropylmethyldiethoxysilane (Product name: KBE-503) Product name: KBE-502), 3-acryloxypropyltrimethoxysilane (the same product name: KBM-5103), 8-methacryloxyoctyltrimethoxysilane (the same product name: KBM-5803) and the like.
- the constitutional unit represented by the formula (3) has a structure close to SiO 2 in which organic components are excluded as much as possible, heat resistance and transparency can be imparted to the cured film obtained from the resin composition. Further, as described above, the resin composition in which the polysiloxane compound is formed in combination with the structural unit represented by the formula (1) has excellent organic solvent resistance.
- the constitutional unit represented by the formula (3) is tetraalkoxysilane, tetrahalosilane (eg, tetrachlorosilane, tetramethoxysilane, tetraethoxysilane, tetra-n-propoxysilane, tetraisopropoxysilane, etc.), or an oligomer thereof. It can be obtained by using as a raw material, hydrolyzing this, and then polymerizing it (see “Polymerization method” described later).
- tetraalkoxysilane eg, tetrachlorosilane, tetramethoxysilane, tetraethoxysilane, tetra-n-propoxysilane, tetraisopropoxysilane, etc.
- silicate 40 (average pentamer, manufactured by Tama Chemical Industry Co., Ltd.), ethyl silicate 40 (average pentamer, manufactured by Colcoat Co., Ltd.), silicate 45 (average pentamer, manufactured by Tama Chemical Industry Co., Ltd.) ), M silicate 51 (average tetramer, Tama Chemical Industry Co., Ltd.), methyl silicate 51 (average tetramer, Colcoat Co., Ltd.), methyl silicate 53A (average 7 mer, Colcoat Co., Ltd.), ethyl Examples thereof include silicate compounds such as silicate 48 (average decamer, Colcoat Co., Ltd.), EMS-485 (mixed product of ethyl silicate and methyl silicate, manufactured by Colcoat Co., Ltd.). From the viewpoint of easy handling, the silicate compound is preferably used.
- the ratio of the constituent units represented by the formula (1), the formula (2) and the formula (3) to the Si atom when the total Si atom of the polysiloxane compound of the component (A) is 100 mol% is It is preferable that the formula (1) is 1 to 80 mol%, the formula (2) is 1 to 80 mol%, and the formula (3) is 1 to 80 mol%. More specifically, the ranges of 2 to 60 mol% of the formula (1), 2 to 70 mol% of the formula (2), and 5 to 70 mol% of the formula (3) are preferable. More preferably, the formula (1) is 5 to 55 mol%, the formula (2) is 5 to 40 mol%, and the formula (3) is 5 to 40 mol%.
- the mol% of the Si atoms can be obtained from the peak area ratio in 29 Si-NMR, for example.
- chlorosilane examples include dimethyldichlorosilane, diethyldichlorosilane, dipropyldichlorosilane, diphenyldichlorosilane, bis (3,3,3-trifluoropropyl) dichlorosilane, and methyl (3,3,3- Trifluoropropyl) dichlorosilane, methyltrichlorosilane, ethyltrichlorosilane, propyltrichlorosilane, isopropyltrichlorosilane, phenyltrichlorosilane, methylphenyltrichlorosilane, trifluoromethyltrichlorosilane, pentafluoroethyltrichlorosilane, 3,3,3- Examples thereof include trifluoropropyltrichlorosilane and the like.
- alkoxysilane examples include dimethyldimethoxysilane, dimethyldiethoxysilane, dimethyldipropoxysilane, dimethyldiphenoxysilane, diethyldimethoxysilane, diethyldiethoxysilane, diethyldipropoxysilane, diethyldiphenoxysilane, and disilane.
- the chlorosilanes or alkoxysilanes may be used alone or in combination of two or more.
- phenyltrimethoxysilane, phenyltriethoxysilane, methylphenyldimethoxysilane, methylphenyldiethoxysilane for increasing the flexibility when formed into a cured film, and cracks to enhance the heat resistance and transparency when formed into a cured film.
- Dimethyldimethoxysilane and dimethyldiethoxysilane are preferred for the purpose of preventing such problems.
- the proportion of the constituent units obtained from these other Si monomers, chlorosilane and alkoxysilane, is 100 to 100 mol% based on the total Si atoms of the polysiloxane compound as the component (A), for example, 0 to 95 mol%. It is preferably 10 to 85 mol%.
- Example 22 using 85 mol% of phenyltriethoxysilane in Si atom
- Example 23 the same: 90 mol%), which will be described later, they are resistant to PGMEA and NMP, but Comparative Example 3 which is outside the scope of the present invention. (The same: 90 mol%) does not show the said tolerance. That is, even if the constitutional unit obtained from phenyltriethoxysilane other than the constitutional units other than the constitutional units other than the formulas (1), (2) and (3) is as high as 85 to 90 mol%, the effect of the present invention is obtained. It is clear from the data.
- the molecular weight of the polysiloxane compound as the component (A) is in the range of usually 700 to 100,000, preferably 800 to 10000, and more preferably 1000 to 6000 in terms of weight average molecular weight.
- the molecular weight can be controlled basically by adjusting the amount of catalyst and the temperature of the polymerization reaction.
- This hydrolysis polycondensation reaction can be carried out by a general method in the hydrolysis and condensation reaction of halosilanes (preferably chlorosilane) and alkoxysilane.
- halosilanes preferably chlorosilane
- alkoxysilane preferably chlorosilane
- the halosilane and the alkoxysilane are placed in a reaction vessel at room temperature (in particular, an atmospheric temperature at which heating or cooling is not performed, usually about 15 ° C. or more and about 30 ° C. or less. The same applies hereinafter).
- room temperature in particular, an atmospheric temperature at which heating or cooling is not performed, usually about 15 ° C. or more and about 30 ° C. or less.
- water for hydrolyzing the halosilanes and alkoxysilanes a catalyst for advancing the polycondensation reaction, and optionally a reaction solvent are added to the reactor to form a reaction solution.
- the order of introducing the reaction materials at this time is not limited to this, and the reaction solution can be prepared by adding in any order.
- the reaction solution can be prepared by adding in any order.
- other Si monomer it may be added to the reactor in the same manner as the halosilanes and the alkoxysilane.
- the polysiloxane compound as the component (A) can be obtained by allowing the hydrolysis and condensation reaction to proceed at a predetermined temperature for a predetermined time while stirring the reaction solution.
- the time required for the hydrolytic condensation depends on the kind of the catalyst, but is usually 3 hours or more and 24 hours or less, and the reaction temperature is room temperature (25 ° C.) or more and 200 ° C. or less.
- reaction vessel When heating, in order to prevent the unreacted raw materials, water, reaction solvent and / or catalyst in the reaction system from being distilled out of the reaction system, make the reaction vessel a closed system or reflux a condenser or the like. It is preferable to attach a device to reflux the reaction system.
- a device After the reaction, from the viewpoint of handling the polysiloxane compound which is the component (A), it is preferable to remove the water, alcohol generated and the catalyst remaining in the reaction system.
- the water, alcohol and catalyst may be removed by an extraction operation, or a solvent that does not adversely affect the reaction such as toluene may be added to the reaction system and azeotropically removed by a Dean-Stark tube.
- the amount of water used in the hydrolysis and condensation reaction is not particularly limited. From the viewpoint of reaction efficiency, it is 0.5 times or more and 5 times or less with respect to the total number of moles of the hydrolyzable groups (alkoxy groups and halogen atom groups) contained in the raw material alkoxysilane and halosilane. preferable.
- the catalyst for advancing the polycondensation reaction is not particularly limited, but an acid catalyst or a base catalyst is preferably used.
- the acid catalyst include hydrochloric acid, nitric acid, sulfuric acid, hydrofluoric acid, phosphoric acid, acetic acid, oxalic acid, trifluoroacetic acid, methanesulfonic acid, trifluoromethanesulfonic acid, camphorsulfonic acid, benzenesulfonic acid, tosylic acid, formic acid, Examples thereof include polyvalent carboxylic acids or their anhydrides.
- the base catalyst include triethylamine, tripropylamine, tributylamine, tripentylamine, trihexylamine, triheptylamine, trioctylamine, diethylamine, triethanolamine, diethanolamine, sodium hydroxide, potassium hydroxide, carbonic acid. Examples thereof include sodium and tetramethylammonium hydroxide.
- the amount of the catalyst used is 1.0 ⁇ 10 ⁇ 5 times or more the total number of moles of the hydrolyzable groups (alkoxy groups and halogen atom groups) contained in the raw material alkoxysilane and halosilane. It is preferably 0 ⁇ 10 ⁇ 1 times or less.
- reaction solvent In the hydrolysis and condensation reaction, it is not always necessary to use a reaction solvent, and the raw material compound, water, and a catalyst can be mixed and hydrolyzed and condensed.
- a reaction solvent when a reaction solvent is used, its type is not particularly limited. Of these, polar solvents are preferable, and alcohol solvents are more preferable, from the viewpoint of solubility in the raw material compounds, water, and catalyst. Specific examples include methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, diacetone alcohol, propylene glycol monomethyl ether and the like.
- the reaction solvent it can be used in any amount necessary for the hydrolysis-condensation reaction to proceed in a homogeneous system. Moreover, you may use the solvent which is the below-mentioned (B) component as a reaction solvent.
- a polysiloxane compound which is the component (A), a quinonediazide compound which is the component (C) described later a photosensitizer selected from an acid generator and a radical generator can be dissolved. It is not particularly limited.
- propylene glycol monomethyl ether acetate propylene glycol monomethyl ether, cyclohexanone, ethyl lactate, ⁇ -butyrolactone, diacetone alcohol, diglyme, methyl isobutyl ketone, 3-methoxybutyl acetate, 2-heptanone, N, N- Examples thereof include dimethylformamide, N, N-dimethylacetamide, N-methylpyrrolidone, glycols and glycol ethers, and glycol ether esters, but are not limited thereto.
- glycol, glycol ether, and glycol ether ester include Sertole (registered trademark) manufactured by Daicel Corporation and Hisolve (registered trademark) manufactured by Toho Chemical Industry Co., Ltd. Specifically, cyclohexanol acetate, dipropylene glycol dimethyl ether, propylene glycol diacetate, dipropylene glycol methyl-n-propyl ether, dipropylene glycol methyl ether acetate, 1,4-butanediol diacetate, 1,3-butylene Glycol diacetate, 1,6-hexanediol diacetate, 3-methoxybutyl acetate, ethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, triacetin, 1,3-butylene glycol, propylene glycol-n -Propyl ether, propylene glycol-
- the composition ratio of the solvent as the component (B) in the resin composition is usually 40% by mass or more and 95% by mass or less, preferably 50% by mass or more and 90% by mass or less.
- the resin composition may contain the following components as additives within a range that does not significantly impair the above-mentioned excellent properties of the resin composition.
- an additive such as a surfactant can be blended for the purpose of improving the coating property, leveling property, film forming property, storage stability, defoaming property and the like.
- a surfactant can be blended for the purpose of improving the coating property, leveling property, film forming property, storage stability, defoaming property and the like.
- commercially available surfactants product name Megafac, product number F142D, F172, F173 or F183, manufactured by DIC Corporation, product name Florard, product number, FC-135, manufactured by Sumitomo 3M Limited, FC-170C, FC-430 or FC-431, product name Surflon manufactured by AGC Seimi Chemical Co., product number S-112, S-113, S-131, S-141 or S-145, or Toray Dow Corning Silicone
- surfactants are not essential components of the resin composition, but if they are added, the compounding amount is usually 0.001 part by mass with respect to 100 parts by mass of the polysiloxane compound as the component (A). The amount is 10 parts by mass or less.
- Megafac is the trade name of DIC's fluorine-based additives (surfactants and surface modifiers), Florard is the trade name of Sumitomo 3M's fluorosurfactants, and Surflon is the AGC Seimi Chemical stock. It is the trade name of the company's fluorine-based surfactant, and is registered as a trademark.
- a curing agent can be added for the purpose of improving the chemical resistance of the cured film.
- the curing agent include a melamine curing agent, a urea resin curing agent, a polybasic acid curing agent, an isocyanate curing agent and an epoxy curing agent. It is considered that the curing agent mainly reacts with the repeating unit “—OH” of the polysiloxane compound as the component (A) to form a crosslinked structure.
- isophorone diisocyanate hexamethylene diisocyanate
- isocyanates such as tolylene diisocyanate or diphenylmethane diisocyanate
- isocyanurates blocked isocyanates or buretates
- alkylated melamine methylolmelamine
- melamine resins such as iminomelamine or urea.
- An epoxy curing agent having two or more epoxy groups obtained by the reaction of an amino compound such as a resin or a polyhydric phenol such as bisphenol A with epichlorohydrin can be exemplified.
- a curing agent having a structure represented by formula (8) is more preferable, and specifically, a melamine derivative and a urea derivative represented by formulas (8a) to (8d) (trade name, Sanwa Chemical ( Manufactured by Co., Ltd.) (note that the broken line means a bond in the formula (8)).
- curing agents are not essential components of the resin composition, but if they are added, the compounding amount thereof is usually 0.001 part by mass or more based on 100 parts by mass of the polysiloxane compound which is the component (A). It is 10 parts by mass or less.
- a photosensitive resin composition characterized by further containing a component (C)
- a component (C) In addition to the “resin composition containing a component (A) and a component (B)”, a quinonediazide compound as a component (C), A photosensitive resin composition can be obtained by containing a photosensitizer selected from a photoacid generator and a photoradical generator. The quinonediazide compound, the photoacid generator, and the photoradical generator are described below in this order.
- the photosensitive resin composition containing the quinonediazide compound has a contrast of solubility in an alkali developing solution between the unexposed portion and the exposed portion, and can form a positive pattern.
- the type of quinonediazide compound There is no particular limitation on the type of quinonediazide compound.
- a quinonediazide compound in which naphthoquinonediazidesulfonic acid is ester-bonded to a compound having at least a phenolic hydroxy group is used.
- the ortho and para positions of the phenolic hydroxy group are each independently a hydrogen atom, a hydroxy group or the formula (9):
- R c , R d , and R e in the formula (9) each independently represent one of an alkyl group having 1 to 10 carbon atoms, a carboxyl group, a phenyl group, and a substituted phenyl group.
- the alkyl group having 1 to 10 carbon atoms may be unsubstituted or substituted.
- Specific examples of the alkyl group include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, t-butyl group, n-hexyl group, cyclohexyl group, n-heptyl group, n -Octyl group, trifluoromethyl group, 2-carboxyethyl group and the like can be mentioned.
- examples of the substituent of the substituted phenyl group include a hydroxy group and a methoxy group.
- the number and position of these substituents are not particularly limited.
- quinonediazide compounds can be synthesized by a known esterification reaction between a compound having at least a phenolic hydroxy group and naphthoquinonediazide sulfonic acid chloride.
- Specific examples of the compound having at least a phenolic hydroxy group include the following compounds.
- naphthoquinone diazide sulfonic acid chloride 5-naphthoquinone diazide sulfonic acid chloride represented by the following formula (11-1) or 4-naphthoquinone diazide sulfonic acid chloride represented by the formula (11-2) below is used.
- a compound synthesized by an esterification reaction of 4-naphthoquinone diazide sulfonic acid chloride and the compound having at least the phenolic hydroxy group may be referred to as "4-naphthoquinone diazide sulfonic acid ester compound".
- a compound synthesized by an esterification reaction of 5-naphthoquinonediazidesulfonic acid chloride and the compound having at least the phenolic hydroxy group may be referred to as "5-naphthoquinonediazidesulfonic acid chloride".
- the 4-naphthoquinonediazide sulfonic acid ester compound is suitable for i-line exposure because it has absorption in the i-line (wavelength 365 nm) region. Further, the 5-naphthoquinonediazide sulfonic acid ester compound has absorption in a wide wavelength range, and is therefore suitable for exposure in a wide wavelength range.
- the quinonediazide compound is preferably selected from the 4-naphthoquinonediazidesulfonic acid ester compound or the 5-naphthoquinonediazidesulfonic acid ester compound depending on the wavelength of light to be exposed.
- the 4-naphthoquinone diazide sulfonic acid ester compound and the 5-naphthoquinone diazide sulfonic acid ester compound may be mixed and used.
- Preferred examples of the quinonediazide compound include compounds of the formulas (10-1), (10-2), (10-3), (10-4), (10-17), (10-19) and (10-21).
- quinonediazide compounds are commercially available, and if specifically exemplified, NT series (manufactured by Toyo Gosei Co., Ltd.), 4NT series (same), PC-5 (same), TKF series (Sanbo Co., Ltd.). Chemical Laboratory), PQ-C (the same) and the like.
- composition ratio of the quinonediazide compound as the component (C) in the photosensitive resin composition is not necessarily limited, but when the polysiloxane compound as the component (A) is 100% by mass, the composition ratio is, for example, 2% by mass. As described above, 40% by mass or less is preferable, and 5% by mass or more and 30% by mass or less is a more preferable embodiment. By using an appropriate amount of quinonediazide compound, it is easy to achieve both sufficient patterning performance and storage stability of the composition.
- the photoacid generator is a compound that generates an acid upon irradiation with light, and the acid generated at the exposed site acts on the acid labile group introduced into the X group in the above formula (1) to give X.
- the group is converted into a hydrogen group and becomes soluble in an alkali developing solution.
- the unexposed portion does not have this effect and is insoluble in the alkaline developer, so that a pattern is formed.
- photoacid generator examples include sulfonium salt, iodonium salt, sulfonyldiazomethane, N-sulfonyloxyimide and oxime-O-sulfonate. These photo-acid generators may be used alone or in combination of two or more.
- composition ratio of the photoacid generator as the component (C) in the photosensitive resin composition is not necessarily limited, but when the polysiloxane compound as the component (A) is 100% by mass, it may be, for example, 0. It is preferably 0.01% by mass or more and 10% by mass or less, and more preferably 0.05% by mass or more and 5% by mass or less. By using an appropriate amount of the photo-acid generator, it is easy to achieve both sufficient patterning performance and storage stability of the composition.
- the photoradical generator is a compound that generates a radical upon irradiation with light, and the radical generated at the exposed site radical-polymerizes the carbon-carbon double bond in the acryloyl group or methacryloyl group contained in Ry in the formula (2). By doing so, the crosslinking reaction proceeds, and the cured film is provided with good chemical resistance.
- photo radical initiator examples include acetophenone, propiophenone, benzophenone, xanthol, fluorein, benzaldehyde, anthraquinone, triphenylamine, carbazole, 3-methylacetophenone, 4-methylacetophenone, 3-pentyl.
- a photo-radical initiator having two or more photodegradable groups in the molecule as a species of an initiator capable of suppressing oxygen inhibition on the surface of a cured product, 2-hydroxy-1- [4- [4- (2- Hydroxy-2-methyl-propionyl) -benzyl] phenyl] -2-methyl-propan-1-one (trade name IRGACURE 127, manufactured by BASF Japan), 1- [4- (4-benzoxylphenylsulfanyl) phenyl] -2-Methyl-2- (4-methylphenylsulfonyl) propan-1-one (product name ESURE1001M), methylbenzoyl formate (product name SPEEDCURE MBF LAMBSON), O-ethoxyimino-1-phenylpropane-1 -On (product name SPEEDCURE PDO LAMBSON), oligo [2- Droxy-2-methyl- [4- (1-methylvinyl) phenyl] propanone (product name
- 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide (trade name DAROCUR TPO, manufactured by BASF Japan) and bis (2,4,6-trimethylbenzoyl) -phenylphosphine characterized by improved deep-curing properties
- examples thereof include acylphosphine oxide-based photoradical initiators such as oxide (trade name IRGACURE819, manufactured by BASF Japan) and bis (2,6-dimethylbenzoyl) -2,4,4-trimethyl-pentylphosphine oxide.
- photo radical initiators may be used alone or in combination of two or more, or may be used in combination with other compounds.
- combination with other compounds include 4,4′-bis (dimethylamino) benzophenone, 4,4′-bis (diethylamino) benzophenone, diethanolmethylamine, dimethylethanolamine, triethanolamine, ethyl. -4-dimethylaminobenzoate, 2-ethylhexyl-4-dimethylaminobenzoate and the like in combination with an amine, further combined with an iodonium salt such as diphenyliodonium chloride, in combination with a dye and amine such as methylene blue Can be mentioned.
- an iodonium salt such as diphenyliodonium chloride
- composition ratio of the photoradical generator as the component (C) in the photosensitive resin composition is not necessarily limited, but when the content of the polysiloxane compound as the component (A) is 100% by mass, it is, for example, 0. It is preferably 0.01% by mass or more and 10% by mass or less, and more preferably 0.05% by mass or more and 5% by mass or less.
- the photoradical generator in the amount shown here, it is possible to further improve the balance between the chemical resistance of the cured film and the storage stability of the composition.
- the photosensitive resin composition may contain additives such as coating properties, leveling properties, film forming properties, and surfactants listed in ⁇ 1> above.
- additives such as coating properties, leveling properties, film forming properties, and surfactants listed in ⁇ 1> above.
- the kinds and amounts of the respective preferable compounds those described in the above ⁇ 1> can be mentioned again.
- a base material made of silicon wafer, metal, glass, ceramic, or plastic is used depending on the use of the formed cured film. To be selected.
- coating method known coating methods such as spin coating, dip coating, spray coating, bar coating, applicator, inkjet or roll coater can be used without particular limitation.
- the substrate coated with the composition is usually heated at 80 to 120 ° C. for 30 seconds or more and 5 minutes or less to obtain a resin film.
- a cured film can be obtained by further heat-treating the resin film.
- the heat treatment temperature is usually 350 ° C. or lower. It is not necessary to heat at 350 ° C or higher, and a more preferable temperature is 150 ° C or higher and 280 ° C or lower, although it depends on the boiling point of the solvent.
- a cured film can be obtained by a dehydration condensation reaction of the silanol group of the polysiloxane compound as the component (A) or a curing reaction of the epoxy group or the oxetane group.
- the heating time is 30 seconds or more and 90 minutes or less. If it is shorter than 30 seconds, the solvent may remain in the cured film, while it is not necessary to heat it for more than 90 minutes.
- the photosensitive resin composition may further contain a sensitizer.
- a sensitizer By containing the sensitizer, the reaction of the photosensitizer, which is the component (C), is promoted in the exposure process, and the sensitivity and pattern resolution are improved.
- the sensitizer is not particularly limited, but it is preferable to use a sensitizer that is vaporized by heat treatment and that is discolored by light irradiation.
- This sensitizer needs to have light absorption at the exposure wavelength (for example, 365 nm (i-line), 405 nm (h-line), 436 nm (g-line)) in the exposure process, but it is directly applied to the cured film. If it remains, the transparency is lowered because of the absorption in the visible light region. Therefore, in order to prevent the decrease in transparency due to the sensitizer, the sensitizer used is preferably a compound that is vaporized by heat treatment such as thermosetting, or a compound that is discolored by light irradiation such as bleaching exposure described later.
- sensitizers are not essential components of the photosensitive resin composition, but if added, the compounding amount is usually 0.001 with respect to 100 parts by mass of the polysiloxane compound as the component (A). It is from 10 parts by mass to 10 parts by mass.
- a photosensitizer selected from a quinonediazide compound, a photoacid generator and a photoradical generator is used as the component (C) in the photosensitive resin composition, each of them is used alone, or two or more kinds thereof are used in combination. Can be appropriately determined by those skilled in the art according to the application, the use environment and the limitation.
- Patterning Method using the photosensitive resin composition (also referred to as “pattern forming method” or “pattern cured film manufacturing method” in the present specification) ) Will be described.
- the patterned cured film requires an exposure step, and therefore differs from the method for producing a cured film obtained from the resin composition described above. This will be described below.
- the method for producing the patterned cured film can include the following first to fourth steps.
- First step a step of forming a photosensitive resin film by coating and drying the photosensitive resin composition according to the invention 6 on a substrate.
- Second step a step of exposing the photosensitive resin film to light.
- Third step a step of developing the photosensitive resin film after exposure to form a pattern resin film.
- Fourth step a step of heating the patterned resin film, thereby curing the patterned resin film and converting it into a patterned cured film.
- the base material to which the photosensitive resin composition is applied is selected from silicon wafer, metal, glass, ceramic and plastic base materials depending on the intended use of the cured film to be formed.
- known coating methods such as spin coating, dip coating, spray coating, bar coating, applicator, inkjet or roll coater can be used without particular limitation.
- the substrate coated with the photosensitive resin composition is usually heated at 80 to 120 ° C. for 30 seconds or more and 5 minutes or less to obtain a photosensitive resin film.
- the photosensitive resin film obtained in the first step is exposed to light by a light-shielding plate (mask) having a desired shape for forming a target pattern, and is subjected to an exposure treatment. A resin film is obtained.
- a light-shielding plate mask having a desired shape for forming a target pattern
- a known method can be used for the exposure process.
- a light source having a light source wavelength in the range of 100 to 600 nm can be used.
- a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a KrF excimer laser (wavelength 248 nm), an ArF excimer laser (wavelength 193 nm), or the like can be used.
- the exposure amount can be adjusted according to the type and amount of the photosensitizer used, the manufacturing process and the like, and is not particularly limited, but is about 1 to 10000 mJ / cm 2 , preferably 10 to 5000 mJ / cm 2. It is preferably about the same.
- post-exposure heating can be performed before the development process.
- the temperature of post-exposure heating is preferably 60 to 180 ° C., and the time of post-exposure heating is preferably 0.5 to 10 minutes.
- the exposed photosensitive resin film obtained in the second step may be developed to form a film having a desired pattern shape (hereinafter, also referred to as “patterned resin film”). it can.
- the developing solution used is not particularly limited as long as it can remove the photosensitive resin film in the exposed area by a predetermined developing method.
- Specific examples include an alkaline aqueous solution using an inorganic alkali, a primary amine, a secondary amine, a tertiary amine, an alcohol amine, a quaternary ammonium salt, and a mixture thereof.
- More specific examples include alkaline aqueous solutions of potassium hydroxide, sodium hydroxide, ammonia, ethylamine, diethylamine, triethylamine, triethanolamine, tetramethylammonium hydroxide (abbreviation: TMAH), and the like. Above all, it is preferable to use the TMAH aqueous solution, and it is particularly preferable to use the TMAH aqueous solution of 0.1% by mass or more and 5% by mass or less, and more preferably 2% by mass or more and 3% by mass or less.
- a known method such as a dipping method, a paddle method, or a spray method can be used.
- the developing time is usually 0.1 minutes or longer and 3 minutes or shorter, and 0.5 minutes or longer and 2 minutes or shorter. Preferably. Thereafter, if necessary, washing, rinsing, drying and the like can be performed to form an intended patterned film (hereinafter, “patterned resin film”) on the substrate.
- patterned resin film an intended patterned film
- a quinonediazide compound is used as the component (C)
- the purpose is to improve the transparency of the finally obtained patterned cured film by photolyzing the quinonediazide compound remaining in the patterned resin film (so-called unexposed region).
- the same exposure process as in the second step can be performed.
- the patterned resin film obtained in the third step is heat-treated to obtain a final patterned cured film.
- the heat treatment it is possible to condense the alkoxy group or silanol group remaining as an unreactive group in the polysiloxane compound of the component (A), and sufficiently cure the epoxy group, oxetane group, methacryloyl group and acryloyl group. Become.
- the polysiloxane compound has an acid labile group, it is possible to remove the remaining photosensitizer by thermal decomposition.
- the heating temperature at this time is preferably 80 ° C. or higher and 400 ° C.
- the heat treatment time is usually from 1 minute to 90 minutes, and preferably from 5 minutes to 60 minutes.
- the heating temperature is lower than 80 ° C, the condensation and the curing reaction, the acid labile group and the thermal decomposition of the photosensitizer are insufficient and the chemical resistance and the transparency are deteriorated.
- the heating temperature is higher than 350 ° C, There is a possibility that thermal decomposition of the polysiloxane compound or cracking of the film may occur. By this heat treatment, the desired pattern cured film can be formed on the substrate.
- Resin composition containing component (A1), component (A2), and component (B) is the following component (A1), (A2).
- Component (A1) A polymer containing the structural unit represented by the formula (1), but containing neither the structural unit of the formula (2) nor the structural unit of the formula (3).
- Component (A2) A polymer containing the structural unit of the formula (2) and at least one structural unit of the structural unit of the formula (3), but not containing the structural unit represented by the formula (1).
- the constitutional unit represented by the formula (1) constitutes a polymer called the component (A1)
- the constitutional unit represented by the formula (2) or the formula (3) is referred to as the component (A2)
- the polymer of the component (A1) is a known substance according to Patent Document 4, and can be synthesized according to the polymerization method described in the document or the polymerization method described in ⁇ 1> above.
- the polymer of the component (A2) can also be synthesized by a known method of hydrolysis polycondensation or the polymerization method described in ⁇ 1> above.
- the resin composition having such a configuration is different from the “resin composition containing the component (A) and the component (B)” described in the above ⁇ 1>, and in the state of the “resin composition”, a different kind of polymer is used. It is a blend (mixture) of. However, if the “resin composition containing the component (A1), the component (A2), and the component (B)” is applied on a substrate and a heat treatment (curing step) is performed, silanol groups of different molecules are bound to each other. Reaction (formation of siloxane bond), a curing reaction of an epoxy group, an acryloyl group and a methacryloyl group occurs, and a cured film is formed. In this case, the final cured film is “resin containing the constitutional unit represented by the formula (1) and the constitutional unit represented by the formula (2) or the constitutional unit represented by the formula (3)”.
- the film physical properties, the alkali developability, and other physical properties can be easily adjusted only by adjusting the compounding ratio of the component (A1) and the component (A2) according to the desired performance.
- the compounding ratio of the component (A1) and the component (A2) according to the desired performance.
- a resin composition containing the component (A1), the component (A2) and the component (B) as well, if the component (C) described above is further added, it functions as a composition for a positive resist.
- component (C) when the component (C) is added to form a photosensitive resin composition, the description of the type and amount of the component (C) is given in “Component (A) and Component (B)” described in ⁇ 1> above.
- the method and conditions described in the above ⁇ 4> can be mentioned again.
- the molecular weight of the polysiloxane compound which is the component (A1) is a weight average molecular weight of usually 700 to 100,000, preferably 800 to 10,000, and more preferably 1,000 to 6,000.
- the molecular weight can be controlled basically by adjusting the amount of catalyst and the temperature of the polymerization reaction.
- the molecular weight of the polysiloxane compound as the component (A2) is preferably in the same range as the molecular weight of the component (A1).
- the composition ratio of the polymer as the component (A) in the resin composition is usually 5% by mass or more and 60% by mass or less, preferably 10% by mass or more and 50% by mass or less.
- the formula (7) is a known compound according to Patent Documents 4 and 5, and may be synthesized according to the description in these documents.
- Patent Documents 4 and 5 The formula (7) is a known compound according to Patent Documents 4 and 5, and may be synthesized according to the description in these documents.
- the inventors have found a more preferable method for synthesizing these compounds, and have already applied for the finding as Japanese Patent Application No. 2018-35470.
- the synthetic method has not been published at the stage of the present application. Therefore, as a precaution, the method for synthesizing the compounds of formula (7) and formula (6) will be described below, including this unpublished method.
- each R 1 is independently a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, a phenyl group, a hydroxy group, an alkoxy group having 1 to 3 carbon atoms, or a fluoroalkyl group having 1 to 3 carbon atoms.
- the step A for obtaining the HFIP group-containing aromatic halosilane (6) from the aromatic halosilane (5) as a raw material will be described. Specifically, the aromatic halosilane (5) and the Lewis acid catalyst are sampled and mixed in a reaction vessel, and hexafluoroacetone is introduced to carry out a reaction. (6) can be obtained.
- the step A will be described in detail below.
- the aromatic halosilane used as a raw material is represented by the formula (5) and has a structure in which a phenyl group that reacts with hexafluoroaceron and a halogen atom are directly bonded to a silicon atom.
- the aromatic halosilane has a substituent R 1 directly bonded to a silicon atom, and examples of the substituent R 1 include a hydrogen atom, a methyl group, an ethyl group, a propyl group, a butyl group, an isobutyl group and a t-butyl group. , Neopentyl group, octyl group, cyclohexyl group, trifluoromethyl group, perfluorohexyl group, perfluorooctyl group and the like. Among them, a methyl group is preferable as the substituent R 1 because of easy availability.
- halogen atom X x in the aromatic halosilane examples include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom, but it is preferable that X x is a chlorine atom in view of availability and stability of the compound.
- aromatic halosilane represented by the formula (5) include the following compounds.
- the Lewis acid catalyst used in this reaction is not particularly limited, and examples thereof include aluminum chloride, iron (III) chloride, zinc chloride, tin (II) chloride, titanium tetrachloride, aluminum bromide, boron trifluoride, and boron trifluoride diethyl. Examples thereof include ether complexes, antimony fluoride, zeolites and complex oxides. Among them, aluminum chloride, iron (III) chloride, and boron trifluoride are preferable, and aluminum chloride is most preferable because it has high reactivity in this reaction.
- the amount of the Lewis acid catalyst used is not particularly limited, but is preferably 0.01 mol or more and 1.0 mol or less with respect to 1 mol of the aromatic halosilane (1).
- Organic solvent In this reaction, when the raw material aromatic halosilane is a liquid, the reaction can be performed without using an organic solvent, but when the raw material aromatic halosilane is a solid or when the aromatic halosilane is highly reactive.
- an organic solvent may be used.
- the organic solvent is not particularly limited as long as it is a solvent in which aromatic halosilane is dissolved and does not react with a Lewis acid catalyst or hexafluoroacetone, and pentane, hexane, heptane, octane, acetonitrile, nitromethane, chlorobenzenes, nitrobenzene, etc. are used. be able to. You may use these solvent individually or in mixture.
- hexafluoroacetone examples of the type of hexafluoroacetone used in this reaction include hydrates such as hexafluoroacetone and hexafluoroacetone trihydrate. However, if water is mixed in during the reaction, the yield will decrease. Preference is given to using hexafluoroacetone as gas.
- the amount of hexafluoroacetone to be used depends on the number of HFIP groups introduced into the aromatic ring, but is 1 mol equivalent or more, 6 mol or more with respect to 1 mol of the phenyl group contained in the aromatic halosilane (5) as a raw material. The equivalent or less is preferable.
- the amount of hexafluoroacetone to be used depends on the aromatic halosilane of the raw material. It is more preferable that the amount of HFIP group introduced into the phenyl group is 2 or less so as to be 2.5 molar equivalents or less relative to 1 mole of the phenyl group contained in (5).
- reaction conditions When synthesizing the HFIP group-containing aromatic halosilane (6), since the boiling point of hexafluoroacetone is ⁇ 28 ° C., use a cooling device or a sealed reactor to keep hexafluoroacetone in the reaction system. Is preferred, and it is particularly preferred to use a sealed reactor.
- a sealed reactor autoclave
- first put the aromatic halosilane (5) and the Lewis acid catalyst in the reactor and then make sure that the pressure in the reactor does not exceed 0.5 MPa. It is preferable to introduce a gas of hexafluoroacetone into.
- the optimal reaction temperature in this reaction varies greatly depending on the type of the aromatic halosilane (5) used as the starting material, but it is preferably carried out in the range of -20 ° C to 80 ° C. Further, it is desirable to perform the reaction at a lower temperature for a raw material having a higher electron density on the aromatic ring and a higher electrophilicity. By carrying out the reaction at a temperature as low as possible, the cleavage of the Ph-Si bond during the reaction can be suppressed, and the yield of the HFIP group-containing aromatic halosilane (6) is improved.
- reaction time of the reaction is appropriately selected depending on the amount of HFIP group introduced, the temperature, the amount of catalyst used, and the like. Specifically, from the viewpoint of allowing the reaction to proceed sufficiently, 1 to 24 hours after the introduction of hexafluoroacetone is preferable.
- the HFIP group-containing aromatic halosilane (6) can be obtained by removing the Lewis acid catalyst by means of filtration, extraction, distillation or the like.
- the X group may be converted from a hydrogen atom to an acid labile group. ..
- HFIP group-containing aromatic halosilane represented by formula (6) The HFIP group-containing aromatic halosilane obtained by the above method is represented by the formula (6) and has a structure in which the HFIP group and a silicon atom are directly bonded to the aromatic ring.
- the HFIP group-containing aromatic halosilane (6) is obtained as a mixture having a plurality of isomers having different substitution numbers and substitution positions of the HFIP group.
- the number of HFIP group substitutions and the types of isomers with different substitution positions and their abundance ratios differ depending on the structure of the starting aromatic halosilane (5) and the equivalent amount of reacted hexafluoroacetone. It has (1aa) to (1ad).
- each R 1 is independently a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, a phenyl group, a hydroxy group, an alkoxy group having 1 to 3 carbon atoms, or a fluoroalkyl group having 1 to 3 carbon atoms.
- each R 21 is independently a straight-chain or branched-chain C 3 -C 4 alkyl group having 1 to 4 carbon atoms, and all or some of the hydrogen atoms in the alkyl group are fluorine atoms.
- Step B of obtaining the HFIP group-containing aromatic alkoxysilane (7) using the HFIP group-containing aromatic halosilane (6) obtained in Step A as a raw material will be described. Specifically, halosilane (6) and alcohol (referring to R 21 OH described in step B) are collected and mixed in a reaction vessel, a reaction for converting chlorosilane to alkoxysilane is performed, and a reaction product is purified by distillation. As a result, the HFIP group-containing aromatic alkoxysilane (7) can be obtained.
- the step B will be described in detail below.
- HFIP group-containing aromatic halosilane represented by formula (6) which is a raw material
- the HFIP group-containing aromatic halosilane (6) used as a raw material in step B the one obtained in step A can be used.
- the HFIP group-containing aromatic halosilane (6) may be various isomers separated by performing precision distillation or the like, or an isomer mixture as it is may be used without isomer separation.
- the alcohol is selected according to the desired alkoxysilane. Specifically, methanol, ethanol, 1-propanol, 2-propanol, 2-fluoroethanol, 2,2,2-trifluoroethanol, 3-fluoropropanol, 3,3-difluoropropanol, 3,3,3- Trifluoropropanol, 2,2,3,3-tetrafluoropropanol, 2,2,3,3,3-pentafluoropropanol, 1,1,1,3,3,3-hexafluoroisopropanol, etc. can be used, Particularly preferred is methanol or ethanol (that is, R 21 in formula (7) indicates a methyl group or an ethyl group).
- an alcohol containing a small amount of water it is preferably 5 wt% or less, more preferably 1 wt% or less.
- reaction conditions The reaction method for synthesizing the HFIP group-containing aromatic alkoxysilane (7) is not particularly limited, but as a typical example, the reaction is carried out by dropping alcohol into the HFIP group-containing aromatic halosilane (6). Or a method in which the HFIP group-containing aromatic halosilane (6) is added dropwise to the alcohol and reacted.
- the reactivity of the alcohol with the HFIP group-containing aromatic halosilane (6) is high, and the halogenosilyl group is quickly converted into an alkoxysilyl group.
- hydrogen halide generated during the reaction is generated. May be removed.
- scavengers such as amine compounds, orthoesters, sodium alkoxides, epoxy compounds, and olefins
- hydrogen halide gas generated by heating or bubbling dry nitrogen is removed from the system. There is a way to remove it. These methods may be performed alone or in combination.
- the reaction of the alcohol and the HFIP group-containing aromatic halosilane (6) may be diluted with a solvent.
- the solvent to be used is not particularly limited as long as it does not react with the alcohol to be used and the HFIP group-containing aromatic halosilane (6), and pentane, hexane, heptane, octane, toluene, xylene, tetrahydrofuran, diethyl ether, dibutyl ether, diisopropyl ether, 1 , 2-dimethoxyethane, 1,4-dioxane and the like can be used. You may use these solvent individually or in mixture.
- the amount of alcohol used in step B is not particularly limited, but from the viewpoint of efficient reaction, 1 molar equivalent to 10 molar equivalents relative to the Si—X x bond contained in the HFIP group-containing aromatic halosilane (6). Is preferable, and 1 to 3 molar equivalents is more preferable.
- reaction temperature The addition time of the alcohol or the HFIP group-containing aromatic halosilane (6) is not particularly limited, but is preferably 10 minutes to 24 hours, more preferably 30 minutes to 6 hours.
- the reaction temperature during dropping is also not particularly limited and is preferably 0 ° C to 80 ° C.
- the reaction can be completed by performing aging while continuing stirring after the dropping.
- the aging time is not particularly limited and is preferably 30 minutes to 6 hours from the viewpoint of allowing the desired reaction to proceed sufficiently.
- the reaction temperature during aging is preferably the same as that during the dropping or higher than that during the dropping. It is preferable to terminate the reaction after confirming that the raw materials are sufficiently consumed by a general-purpose analysis means such as gas chromatography.
- the HFIP group-containing aromatic alkoxysilane (7) can be obtained by carrying out purification by means such as filtration, extraction, distillation and the like.
- each R 12 is independently a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, a phenyl group, a hydroxy group, an alkoxy group having 1 to 3 carbon atoms, or a fluoroalkyl group having 1 to 3 carbon atoms.
- R 22's each independently represent a straight-chain or branched-chain alkyl group having 1 to 4 carbon atoms and having 3 or 4 carbon atoms, in which all or some of the hydrogen atoms in the alkyl group are fluorine atoms.
- the polysiloxane compound of the component (A) first converts the hydrogen atom of the hydroxy group of the alkoxysilane represented by the above formula (7) or (7-1) into an acid labile group. Acid-labile group-containing alkoxysilane, and then the acid-labile group-containing alkoxysilane is hydrolyzed and polycondensed. Then, the resin composition can be produced by using the polysiloxane compound of the component (A) thus obtained and the solvent. Similarly, the polymer as the component (A1) is first acid-labile by converting the hydrogen atom of the hydroxy group of the alkoxysilane represented by the above formula (7) or formula (7-1) into an acid labile group.
- a group-containing alkoxysilane can be obtained, and then the acid-labile group-containing alkoxysilane is hydrolyzed and polycondensed. Then, the resin composition can be produced using the polymer of the component (A1), the polymer of the component (A2), and the solvent thus obtained.
- the X group is converted from a hydrogen atom to an acid anxiety. It may be converted into a qualitative group.
- the polysiloxane compound as the component (A) is obtained by hydrolyzing and polycondensing an alkoxysilane represented by the above formula (7) or formula (7-1) to give a polymer, and then adding It can be obtained by converting the hydrogen atom of a hydroxy group into an acid labile group.
- the resin composition can be produced by using the polysiloxane compound of the component (A) thus obtained and the solvent.
- the polymer of the component (A1) is hydrolyzed and polycondensed with an alkoxysilane represented by the above formula (7) or formula (7-1) to give a polymer, and then hydrogen of a hydroxy group in the polymer. It can be obtained by converting an atom into an acid labile group.
- the resin composition can be produced using the polymer of the component (A1), the polymer of the component (A2), and the solvent thus obtained.
- any of the above (i) and (ii) as a method of converting the X group from a hydrogen atom into an acid labile group, a known method of introducing an acid labile group into an alcohol compound can be adopted. In the examples described below, a method for introducing an acid labile group will be specifically described.
- the preferable weight average molecular weight of the polysiloxane compound is as described above.
- the preferable weight average molecular weight of the polymer is as described above.
- GC measurement For the GC measurement, Shimadzu Corporation's trade name Shimadzu GC-2010 was used, and the column was measured using a capillary column DB1 (60 mm ⁇ 0.25 mm ⁇ ⁇ 1 ⁇ m).
- Thermogravimetric measurement (TG / DTA) STA7200 manufactured by Hitachi High-Tech Science Co., Ltd. was used to perform thermogravimetric measurement under air, and the temperature at which there was a 5% weight loss relative to the initial weight was measured.
- the thermal decomposition temperature (Td 5 ) was used.
- the photosensitive resin film obtained from the photosensitive resin composition was subjected to an exposure treatment using an exposure device manufactured by SUSS Microtec Co., Ltd., device name MA6.
- a 4-necked flask equipped with a thermometer, a mechanical stirrer, and a Dimroth reflux tube and having a capacity of 200 mL, which was replaced under a dry nitrogen atmosphere, was synthesized according to the method shown in Synthesis Example 1 to 3- (2-hydroxy-1,1,1, A mixture of 3,3,3-hexafluoroisopropyl) -trichlorosilylbenzene and 4- (2-hydroxy-1,1,1,3,3,3-hexafluoroisopropyl) -trichlorosilylbenzene (GCrea ratio 1-3) Substitute: 1-4 Substitute 96: 4) (113.27 g) was charged, and the contents of the flask were heated to 60 ° C.
- the crude product obtained is subjected to precision distillation to obtain 3- (2-hydroxy-1,1,1,3,3,3-hexafluoro represented by the formula (ME-1) as a colorless transparent liquid.
- Ethoxysilylbenzene GC purity 95%) was obtained. ..
- a 2-necked 2- (2-hydroxy-1,1,1,) was synthesized according to the method shown in Synthesis Example 2 in a four-necked flask equipped with a thermometer, a mechanical stirrer, and a Dimroth reflux tube and having a volume of 300 mL replaced with a dry nitrogen atmosphere.
- the obtained crude product is subjected to precision distillation (distillation plate number: 10 plates, reflux ratio: 10, pressure: 0.3 kPa, temperature: 150 ° C.) to obtain a colorless transparent liquid represented by the formula (ME-4). 3- (2-hydroxy-1,1,1,3,3,3-hexafluoroisopropyl) -diethoxymethylsilylbenzene GC purity 98%) was obtained.
- ME-1 obtained in Synthesis Example 4 9.14 g (22.5 mmol), phenyltriethoxysilane 5.41 g (22.5 mmol), 3-glycidoxypropyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd. KBM-403) 1.18 g (5 mmol), water 2.84 g (158 mmol) and acetic acid 0.15 g (2.5 mmol) were added, and the mixture was stirred at 100 ° C. for 2 hours. Then, 10 g of toluene was added, and the fraction was removed with a Dean-Stark distiller at 150 ° C for 4 hours.
- ME-1 obtained in Synthesis Example 4 4.06 g (10 mmol), phenyltriethoxysilane 8.42 g (35 mmol), 3-glycidoxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd. KBM ⁇ 403) 1.18 g (5 mmol), water 2.84 g (158 mmol), acetic acid 0.15 g (2.5 mmol) were added, and the mixture was stirred at 100 ° C. for 2 hours.
- the resin film obtained from the solution composition of P-1 to P-13, P-17 to P-20, P-22, P-23 and CP-1 to 3 should be heat-treated at 250 ° C. for 1 hour. Thus, a cured film having a film thickness of 1.5 to 3.0 ⁇ m was obtained.
- the resin film obtained from the solution composition of P-16 was exposed to light at 200 mJ / cm 2 and then heat-treated at 250 ° C. for 1 hour to obtain a cured film having a thickness of 1.7 ⁇ m.
- the cured film obtained above was evaluated for the following thermal decomposition temperature, solvent resistance, acid resistance and alkali resistance.
- Resistance to PGMEA ⁇ (very good): No unevenness is observed, or even if observed, less than 1% of the entire area. ⁇ (Good): Peeling and at least one streak are observed, but 1% or more and less than 10% of the entire area.
- Resistance to NMP ⁇ (very good): No unevenness is observed, or even if observed, less than 1% of the entire area. ⁇ (Good): Peeling and at least one streak are observed, but 1% or more and less than 10% of the entire area.
- X (bad) The film is dissolved.
- Acid resistance ⁇ (very good): No unevenness is observed, or even if observed, less than 1% of the entire area. ⁇ (Good): Peeling and at least one streak are observed, but 1% or more and less than 10% of the entire area.
- Td 5 of the cured film obtained from the solution compositions P-1 to 13, P-16 to 20, P-22 and P-23 obtained in Examples 1 to 13, 16 to 20, 22 and 23. was observed in the range of 370 to 435 ° C., all the transmittances exceeded 95%, and the resistances to acid and alkali were all “ ⁇ ”.
- Td 5 of the cured films of Comparative Examples 1, 2, and 3 were observed at 360 ° C., 400 ° C., and 430 ° C., respectively, the transmittances were all over 95%, and the resistance to acid and alkali was “ ⁇ . Or "x". That is, with respect to the thermal stability (Td 5 ), the transparency, the acid resistance, and the alkali resistance, the resin compositions of Examples had the same or higher performance than the resin compositions of Comparative Examples 1 to 3. Is shown.
- the cured films of the resin compositions of Examples have the same or higher thermal decomposition temperature, that is, heat resistance, transparency, acid resistance, and alkali resistance as the cured films of Comparative Examples 1, 2, and 3. It was found that, in addition to showing the physical properties, the organic solvent resistance was remarkably superior to the cured films of Comparative Examples 1, 2 and 3, and as a result, an excellent cured film having a good balance of performances was obtained. ..
- Adhesion was evaluated according to JIS K 5400 (cross-cut test method). Specifically, 100 squares of a 1 mm square grid were formed on the cured film with a cutter knife, and then held in an environment of 85 ° C. and 85% relative humidity for 3 days. Cellophane tape was attached to the lattice portion of the obtained cured film, and then peeled off and visually confirmed. No peeling was observed in any of the cured films, and it was found that sufficient adhesion was exhibited.
- the obtained photosensitive solution composition was applied onto a silicon wafer by spin coating (1500 rpm for 1 minute), and then heat-treated at 100 ° C. for 1 minute to obtain a photosensitive resin film.
- the photosensitive resin film was subjected to an exposure treatment from above the photomask under the condition of 150 mJ / cm 2 with an exposure device, then immersed in a 2.38 wt% tetramethylammonium hydroxide aqueous solution for 1 minute, and then immersed in water. It was immersed for 30 seconds and washed. After that, the whole surface is exposed with an exposure device under the condition of 300 mJ / cm 2 , followed by heat treatment at 110 ° C. for 1.5 minutes, and then at 230 ° C. for 1 hour to obtain a pattern-cured film having a positive pattern.
- Got The line and space pattern resolution was 10 to 20 ⁇ m, and the film thickness was 1 to 2 ⁇ m.
- the obtained photosensitive solution composition was applied onto a silicon wafer by spin coating (1500 rpm for 1 minute), and then heat-treated at 100 ° C. for 1 minute to obtain a photosensitive resin film.
- the photosensitive resin film was subjected to an exposure treatment from above the photomask under the condition of 105 mJ / cm 2 by an exposure device, and then again subjected to a heat treatment at 100 ° C. for 1 minute, and then 2.38% by weight of tetramethylammonium. It was immersed in an aqueous solution of hydroxide for 1 minute and then immersed in water for 30 seconds for cleaning. After that, heat treatment was performed at 110 ° C. for 1.5 minutes and then at 230 ° C. for 1 hour to obtain a pattern-cured film having a positive pattern.
- the line and space pattern resolution was 10 to 20 ⁇ m, and the film thickness was 1 to 2 ⁇ m.
- the cured film obtained from the resin composition of Example has a high thermal decomposition temperature, that is, high heat resistance, is excellent in transparency, is excellent in resistance to general-purpose organic solvents such as NMP and PGMEA, acids and alkalis, and is silicon. It was found that the adhesion to the substrate was also good. Further, from a photosensitive resin composition obtained by adding a photosensitizer such as a naphthoquinonediazide compound or an acid generator to the composition (this is also an embodiment of the present invention), a cured film having a positive pattern is formed. It was also found that
- Example 24 unlike Examples 14, 15 and 21, a polysiloxane compound was produced using an alkoxysilane (monomer) into which an acid labile group had been introduced in advance (in Examples 14, 15 and 21, First, a polysiloxane compound was obtained, and then an acid labile group was introduced). And the solution composition was manufactured using the manufactured polysiloxane compound. The details will be described below.
- HFA-Si- a compound represented by the following chemical formula (HFA-Si-) is used as an alkoxysilane (monomer) having an acid labile group introduced in advance by the method described below (Production of a monomer having an acid labile group introduced).
- MOM Metal Organic Chemical Model
- a solution composition (P-24) was produced as follows (polymerization reaction and production of solution composition).
- a solution composition (P-25) was obtained in the same manner as in Example 24 except that the molar ratio of the raw materials (monomers) charged in the polymerization reaction was changed as described in the table below.
- a solution composition (P-26) was obtained in the same manner as in Example 24, except that the charged molar ratio of the raw materials (monomers) in the polymerization reaction was changed as described in the table below.
- a solution composition (P-27) was obtained in the same manner as in Example 24, except that the types of raw materials (monomers) and the charged molar ratio in the polymerization reaction were changed as described in the table below.
- a solution composition (P-28) was obtained in the same manner as in Example 24, except that the kinds of raw materials (monomers) and the charged molar ratio in the polymerization reaction were changed as described in the table below.
- Ph-Si is phenyltriethoxysilane
- KBM-5103 is 3-acryloxypropyltrimethoxysilane manufactured by Shin-Etsu Chemical Co., Ltd.
- ethyl polysilicate is silicate 40 (trade name) manufactured by Tama Chemical Co., Ltd. Is. Other notations are as described above.
- the cured films obtained from the solution compositions P-24 to P-28 all had a transmittance of light having a wavelength of 400 nm in terms of a film thickness of 2 ⁇ m of more than 90%.
- the cured film obtained from the solution composition P-28 had a transmittance of light having a wavelength of 350 nm in terms of a film thickness of 2 ⁇ m of more than 90%.
- the polysiloxane compound produced by using an alkoxysilane (monomer) into which an acid labile group has been introduced in advance has a good light transmission property of a wavelength of 350 to 400 nm. It can be said that it is preferably applicable to coating materials such as liquid crystal displays and CMOS image sensors.
- the obtained photosensitive resin film was irradiated with light from a high pressure mercury lamp of 108 mJ / cm 2 through a photomask using an exposure device. Then, it heat-processed at 150 degreeC for 1 minute with a hot plate. After that, the film was immersed in a 2.38 mass% tetramethylammonium hydroxide aqueous solution for 1 minute for development, and immersed in water for 30 seconds for cleaning. After washing, it was baked in an oven at 230 ° C. for 1 hour in the air. As described above, a patterned cured film having a positive pattern was obtained. Line-and-space resolutions of 10-20 ⁇ m were obtained for all of the photosensitive solution compositions PP-24-PP-28.
- a polysiloxane compound is synthesized by using an alkoxysilane (monomer) into which an acid labile group is introduced in advance, and a photosensitive resin composition is produced by using the synthesized polysiloxane compound. It was possible to obtain the photosensitive resin composition of.
- Example 29 the usefulness of the resin composition containing the component (A1), the component (A2) and the component (B) will be shown through some embodiments.
- PMEA propylene glycol monomethyl ether acetate
- the resin composition containing the component (A1), the component (A2), and the component (B) by using the resin composition containing the component (A1), the component (A2), and the component (B), the resin containing the component (A) and the component (B) can be used. It has been found that, like the composition, an excellent cured film is obtained.
- the resin composition obtained by the present invention can be made into a photosensitive resin composition having patterning performance by alkali development by adding a photosensitizer to the composition, and a cured film obtained from both the compositions. Is excellent in heat resistance, transparency, chemical resistance, and adhesion, so it can be used as a protective film for semiconductors, a protective film for organic EL and liquid crystal displays, a coating material for image sensors, a planarizing material and a microlens material, and a touch panel.
- insulating protective film material a liquid crystal display TFT flattening material, an optical waveguide core or clad forming material, an electron beam resist, an intermediate film for a multilayer resist, a lower layer film, an antireflection film, and the like.
- fine particles of polytetrafluoroethylene, silica, titanium oxide, zirconium oxide, magnesium fluoride, etc. are used at an arbitrary ratio for the purpose of adjusting the refractive index. Can be mixed and used.
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Materials For Photolithography (AREA)
- Silicon Polymers (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
(A)成分:
式(1)で表される構成単位と、
式(2)および式(3)の少なくとも一方の構成単位と、
を含むポリシロキサン化合物
で表される一価の基である。R1は、水素原子、炭素数1以上3以下のアルキル基、フェニル基、ヒドロキシ基、炭素数1以上3以下のアルコキシ基または炭素数1以上3以下のフルオロアルキル基であり、bは1~3の整数、mは0~2の整数、nは1~3の整数であり、b+m+n=4である。Rx、R1が複数個あるときは、それぞれは独立して上記置換基の何れかを取ることができる。]
溶剤。
本発明において、「(A)成分のポリシロキサン化合物」としては、次のタイプa、タイプbが、ともに含まれる。
<タイプa>
式(1)で表される構成単位を与えるシロキサンモノマーと、
式(2)の構成単位を与えるシロキサンモノマーおよび式(3)構造単位を与えるシロキサンモノマーの少なくとも一方と、
を、共重合させて得られるポリシロキサン化合物。
<タイプb>
式(1)で表される構成単位のみが一定数連なったポリマーと、
式(2)の構成単位、及び、式(3)の構造単位の少なくとも一方のみが一定数連なったポリマーと、を、分子中の少なくとも1か所の部位で、例えばSi-O-Si結合を形成することで、結合して1つの高分子となった、いわゆるブロック共重合体タイプのポリシロキサン化合物。
(A1)成分:式(1)で表される構成単位を含むが、式(2)の構成単位も式(3)の構成単位を含まないポリマー。
(A2)成分:式(2)の構成単位、及び、式(3)の構造単位の少なくとも一方の構成単位を含むが、式(1)で表される構成単位を含まないポリマー。
(B)成分:溶剤。
しかし、当該「(A1)成分と、(A2)成分と、(B)成分を含む樹脂組成物」を、基材上に塗布し、加熱処理を行えば、エポキシ基、アクリロイル基やメタクリロイル基の硬化反応、異分子のシラノール基どうしの反応を通じて硬化膜が形成される。この場合、硬化工程後に、「式(1)で表される構成単位と、式(2)の構成単位または式(3)の構成単位と、を含む樹脂」が「硬化膜」の形で生成する。このようなポリマー(ポリシロキサン化合物)が優れた物性を持つため、「(A)成分と(B)成分を含む樹脂組成物」と同様のメリットを、こちらの実施態様においても得ることができる。「(A1)成分と、(A2)成分と、(B)成分を含む樹脂組成物」についても、前記した(C)成分をさらに加えれば、ポジ型レジスト用の組成物として機能する。これらについては、明細書において「別の実施態様」なる項目を設け、詳述する。
下記の(A)成分と、(B)成分と、を含む樹脂組成物。
(A)成分:
式(1)で表される構成単位と、
式(2)および式(3)の少なくとも一方の構成単位と、
を含むポリシロキサン化合物。
で表される一価の基である。R1は水素原子、炭素数1以上3以下のアルキル基、フェニル基、ヒドロキシ基、炭素数1以上3以下のアルコキシ基または炭素数1以上3以下のフルオロアルキル基であり、bは1~3の整数、mは0~2の整数、nは1~3の整数であり、b+m+n=4である。Rx、R1が複数個あるときは、それぞれは独立して上記置換基の何れかを取ることができる。]
溶剤。
式(1a)で表される基が、次の式(1aa)~(1ad)で表される基の何れかである、
発明1に記載の樹脂組成物。
前記一価の有機基Ryが、次の式(2a)、(2b)、(2c)、(3a)もしくは(4a)で表される基である、発明1又は発明2に記載の樹脂組成物。
溶剤が、プロピレングルコールモノメチルエーテルアセテート、プロピレングリコールモノメチルエーテル、シクロヘキサノン、乳酸エチル、γ―ブチロラクトン、ジアセトンアルコール、ジグライム、メチルイソブチルケトン、酢酸3-メトキシブチル、2-ヘプタノン、N、N-ジメチルホルムアミド、N、N-ジメチルアセトアミド、N-メチルピロリドン、グリコール類及びグリコールエーテル類、グルコールエーテルエステル類からなる群から選ばれる少なくとも1種の化合物を含む溶剤である)、発明1~発明3の何れかに記載の樹脂組成物。
次の(A1)成分と、(A2)成分と、(B)成分と、を含む樹脂組成物。
(A1)成分:式(1)で表される構成単位を含むが、式(2)の構成単位も式(3)の構成単位の何れをも含まないポリマー。
(A2)成分:式(2)の構成単位、及び、式(3)の構造単位の少なくとも一方の構成単位を含むが、式(1)で表される構成単位を含まないポリマー。
発明1~5の何れかに記載の樹脂組成物と、
(C)成分として、キノンジアジド化合物、光酸発生剤、光ラジカル発生剤から選択される感光剤と、を含む、感光性樹脂組成物。
発明1~5の何れかに記載の樹脂組成物の硬化膜。
発明1~5の何れかに記載の樹脂組成物を基材上に塗布した後、100~350℃の温度で加熱することを特徴とする硬化膜の製造方法。
発明6に記載の感光性樹脂組成物のパターン硬化膜。
次の第1~第4工程を含む、パターン硬化膜の製造方法。
第1工程:発明6に記載の感光性樹脂組成物を基材上に塗布および乾燥して感光性樹脂膜を形成する工程。
第2工程:前記感光性樹脂膜を露光する工程。
第3工程:露光後の前記感光性樹脂膜を現像して、パターン樹脂膜を形成する工程。
第4工程:前記パターン樹脂膜を加熱し、それによって前記パターン樹脂膜を硬化させてパターン硬化膜に転化させる工程。
第2工程の露光に用いる光の波長が100~600nmであることを特徴とする、発明10に記載の、パターン硬化膜の製造方法。
樹脂組成物を製造するに際して、前記(A)成分のポリシロキサン化合物として、以下式(7)または式(7-1)で表されるアルコキシシランのヒドロキシ基の水素原子を酸不安定性基に変換して酸不安定性基含有アルコキシシランとし、その後、その酸不安定性基含有アルコキシシランを加水分解重縮合することで得られたポリシロキサン化合物を用いる、発明1~4の何れかに記載の樹脂組成物の製造方法。
式(7-1)中、R12はそれぞれ独立に、水素原子、炭素数1以上3以下のアルキル基、フェニル基、ヒドロキシ基、炭素数1以上3以下のアルコキシ基または炭素数1以上3以下のフルオロアルキル基であり、R22は、それぞれ独立に、炭素数1~4の直鎖状または炭素数3、4の分岐状のアルキル基であり、アルキル基中の水素原子の全てまたは一部がフッ素原子と置換されていてもよく、aは1~5、mは0~2、rは1~3の整数であり、m+r=3である。]
樹脂組成物を製造するに際して、前記(A)成分のポリシロキサン化合物として、以下式(7)または式(7-1)で表されるアルコキシシランを加水分解重縮合してポリマーとし、その後、そのポリマー中のヒドロキシ基の水素原子を酸不安定性基に変換することで得られたポリシロキサン化合物を用いる、発明1~4の何れかに記載の樹脂組成物の製造方法。
式(7-1)中、R12はそれぞれ独立に、水素原子、炭素数1以上3以下のアルキル基、フェニル基、ヒドロキシ基、炭素数1以上3以下のアルコキシ基または炭素数1以上3以下のフルオロアルキル基であり、R22は、それぞれ独立に、炭素数1~4の直鎖状または炭素数3、4の分岐状のアルキル基であり、アルキル基中の水素原子の全てまたは一部がフッ素原子と置換されていてもよく、aは1~5、mは0~2、rは1~3の整数であり、m+r=3である。]
樹脂組成物を製造するに際して、前記(A1)成分のポリマーとして、以下式(7)または式(7-1)で表されるアルコキシシランのヒドロキシ基の水素原子を酸不安定性基に変換して酸不安定性基含有アルコキシシランとし、その後、その酸不安定性基含有アルコキシシランを加水分解重縮合することで得られたポリマーを用いる、発明5に記載の樹脂組成物の製造方法。
式(7-1)中、R12はそれぞれ独立に、水素原子、炭素数1以上3以下のアルキル基、フェニル基、ヒドロキシ基、炭素数1以上3以下のアルコキシ基または炭素数1以上3以下のフルオロアルキル基であり、R22は、それぞれ独立に、炭素数1~4の直鎖状または炭素数3、4の分岐状のアルキル基であり、アルキル基中の水素原子の全てまたは一部がフッ素原子と置換されていてもよく、aは1~5、mは0~2、rは1~3の整数であり、m+r=3である。]
樹脂組成物を製造するに際して、前記(A1)成分のポリマーとして、以下式(7)または式(7-1)で表されるアルコキシシランを加水分解重縮合してポリマーとし、その後、そのポリマー中のヒドロキシ基の水素原子を酸不安定性基に変換することで得られたポリマーを用いる、請求項5に記載の樹脂組成物の製造方法。
式(7-1)中、R12はそれぞれ独立に、水素原子、炭素数1以上3以下のアルキル基、フェニル基、ヒドロキシ基、炭素数1以上3以下のアルコキシ基または炭素数1以上3以下のフルオロアルキル基であり、R22は、それぞれ独立に、炭素数1~4の直鎖状または炭素数3、4の分岐状のアルキル基であり、アルキル基中の水素原子の全てまたは一部がフッ素原子と置換されていてもよく、aは1~5、mは0~2、rは1~3の整数であり、m+r=3である。]
<1>(A)成分と(B)成分を含むことを特徴とする樹脂組成物
<2>さらに(C)成分を含むことを特徴とする感光性樹脂組成物
<3>樹脂組成物の硬化膜の製造方法
<4>感光性樹脂組成物を用いたパターニング方法
<5>別の実施態様:(A1)成分と、(A2)成分と、(B)成分を含む樹脂組成物
<6>式(1)の構成単位の原料化合物の合成方法
なお、以下、本明細書において、化学式の中の破線は結合手を表す。
該樹脂組成物は、下記(A)成分および(B)成分を含むことを特徴とする。
(A)成分:
式(1)で表される構成単位と、
式(2)および式(3)の少なくとも一方の構成単位と、
を含むポリシロキサン化合物。
で表される一価の基である。R1は水素原子、炭素数1以上3以下のアルキル基、フェニル基、ヒドロキシ基、炭素数1以上3以下のアルコキシ基または炭素数1以上3以下のフルオロアルキル基であり、bは1~3の整数、mは0~2の整数、nは1~3の整数であり、b+m+n=4である。Rx、R1が複数個あるときは、それぞれは独立して上記置換基の何れかを取ることができる。]
溶剤。
で表される一価の基である。R1は水素原子、炭素数1以上3以下のアルキル基、フェニル基、ヒドロキシ基、炭素数1以上3以下のアルコキシ基または炭素数1以上3以下のフルオロアルキル基であり、bは1~3の整数、mは0~2の整数、nは1~3の整数であり、b+m+n=4である。Rx、R1が複数個あるときは、それぞれは独立して上記置換基の何れかを取ることができる]。
アルキル基としては、tert-ブチル基、tert-アミル基、1,1-ジメチルプロピル基、1-エチル-1-メチルプロピル基、1,1-ジメチルブチル基、アリル基、1-ピレニルメチル基、5-ジベンゾスベリル基、トリフェニルメチル基、1-エチル-1-メチルブチル基、1,1-ジエチルプロピル基、1,1-ジメチル-1-フェニルメチル基、1-メチル-1-エチル-1-フェニルメチル基、1,1-ジエチル-1-フェニルメチル基、1-メチルシクロヘキシル基、1-エチルシクロヘキシル基、1-メチルシクロペンチル基、1-エチルシクロペンチル基、1-イソボルニル基、1-メチルアダマンチル基、1-エチルアダマンチル基、1-イソプロピルアダマンチル基、1-イソプロピルノルボルニル基、1-イソプロピル-( 4-メチルシクロヘキシル) 基等が挙げられる。アルキル基は好ましくは第3級アルキル基であり、より好ましくは-CRpRqRrで表される基である(Rp、RqおよびRrは、それぞれ独立に、直鎖または分岐アルキル基、単環または多環のシクロアルキル基、アリール基またはアラルキル基であり、Rp、RqおよびRrのうち2つが結合して環構造を形成してもよい)。
アルコキシカルボニル基としては、tert-ブトキシカルボニル基、tert-アミルオキシカルボニル基、メトキシカルボニル基、エトキシカルボニル基、i-プロポキシカルボニル基等を例示できる。アセタール基としては、メトキシメチル基、エトキシエチル基、ブトキシエチル基、シクロヘキシルオキシエチル基、ベンジルオキシエチル基、フェネチルオキシエチル基、エトキシプロピル基、ベンジルオキシプロピル基、フェネチルオキシプロピル基、エトキシブチル基、エトキシイソブチル基などが挙げられる。
シリル基としては、例えば、トリメチルシリル基、エチルジメチルシリル基、メチルジエチルシリル基、トリエチルシリル基、i-プロピルジメチルシリル基、メチルジ-i-プロピルシリル基、トリ-i-プロピルシリル基、t-ブチルジメチルシリル基、メチルジ-t-ブチルシリル基、トリ-t-ブチルシリル基、フェニルジメチルシリル基、メチルジフェニルシリル基、トリフェニルシリル基等を挙げることができる。
アシル基としては、アセチル基、プロピオニル基、ブチリル基、ヘプタノイル基、ヘキサノイル基、バレリル基、ピバロイル基、イソバレリル基、ラウリロイル基、ミリストイル基、パルミトイル基、ステアロイル基、オキサリル基、マロニル基、スクシニル基、グルタリル基、アジポイル基、ピペロイル基、スベロイル基、アゼラオイル基、セバコイル基、アクリロイル基、プロピオロイル基、メタクリロイル基、クロトノイル基、オレオイル基、マレオイル基、フマロイル基、メサコノイル基、カンホロイル基、ベンゾイル基、フタロイル基、イソフタロイル基、テレフタロイル基、ナフトイル基、トルオイル基、ヒドロアトロポイル基、アトロポイル基、シンナモイル基、フロイル基、テノイル基、ニコチノイル基、イソニコチノイル基等を挙げることができる。
中でも、tert-ブトキシカルボニル基、メトキシメチル基、エトキシエチル基およびトリメチルシリル基が汎用で好ましい。更に、これらの酸不安定基の水素原子の一部または全部がフッ素原子で置換されたものを使用することもできる。これらの酸不安定性基は単種類を用いてもよいし、複数種類を用いてもよい。
Ry基が、エポキシ基、オキセタン基を含む場合、Ry基は、次の式(2a)、(2b)、(2c)で表される基であることが好ましい。
(A)成分のポリシロキサン化合物において、前記した式(1)、式(2)および式(3)で表される構成単位以外に、(B)成分である溶剤への溶解性や硬化膜としたときの耐熱性、透明性などの調整の目的で、Si原子を含む他の構成単位を含んでもよい。該構成単位を、クロロシランまたはアルコキシシランで例示すると以下のとおりである。前記クロロシラン、アルコキシシランを「その他のSiモノマー」と呼ぶことがある。
次に、(A)成分であるポリシロキサン化合物を得るための、重合方法について説明する。前記の式(1)、式(2)および式(3)で表される構成単位を得るための式(6)で表されるハロシラン類、式(7)で表されるアルコキシシラン、およびその他のSiモノマーを用いた加水分解重縮合反応により、(A)成分であるポリシロキサン化合物が得られる。
(B)成分である溶剤としては、(A)成分であるポリシロキサン化合物、後述する(C)成分であるキノンジアジド化合物、酸発生剤、ラジカル発生剤から選択される感光剤を溶解させることができれば、特に限定されるものではない。具体的には、プロピレングルコールモノメチルエーテルアセテート、プロピレングリコールモノメチルエーテル、シクロヘキサノン、乳酸エチル、γ―ブチロラクトン、ジアセトンアルコール、ジグライム、メチルイソブチルケトン、酢酸3-メトキシブチル、2-ヘプタノン、N、N-ジメチルホルムアミド、N、N-ジメチルアセトアミド、N-メチルピロリドン、グリコール類及びグリコールエーテル類、グルコールエーテルエステル類等を例示することができるが、これらに限定されるものではない。
樹脂組成物には、当該樹脂組成物の前述した優れた特性を著しく損なわない範囲において、下記の成分を添加剤として含有することが出来る。
具体的には、式(8)で表される構造を有する硬化剤がより好ましく、具体的には式(8a)~(8d)で示されるメラミン誘導体や尿素誘導体(商品名、三和ケミカル(株)製)が挙げられる(なお式(8)中、破線は結合手を意味する)。
「(A)成分と(B)成分を含む樹脂組成物」に対し、さらに、(C)成分として、キノンジアジド化合物、光酸発生剤、光ラジカル発生剤から選択される感光剤を含有させることで、感光性樹脂組成物とすることができる。以下に、キノンジアジド化合物、光酸発生剤、光ラジカル発生剤の順に説明する。
前記の樹脂組成物を塗布する基材として、形成される硬化膜の用途に応じて、シリコンウェハ、金属、ガラス、セラミック、プラスチック製の基材から選択される。
次に、感光性樹脂組成物を用いたパターニング方法(本明細書において、「パターン形成法」「パターン硬化膜の作製方法」とも呼ぶことがある)について説明する。
当該パターン硬化膜は、露光工程が必要となるから、前記した樹脂組成物から得られる硬化膜の作製方法とは異なる。以下に説明する。
第1工程:発明6に記載の感光性樹脂組成物を基材上に塗布および乾燥して感光性樹脂膜を形成する工程。
第2工程:前記感光性樹脂膜を露光する工程。
第3工程:露光後の前記感光性樹脂膜を現像して、パターン樹脂膜を形成する工程。
第4工程:前記パターン樹脂膜を加熱し、それによって前記パターン樹脂膜を硬化させてパターン硬化膜に転化させる工程。
感光性樹脂組成物を塗布する基材としては、形成される硬化膜の用途に応じて、シリコンウェハ、金属、ガラス、セラミック、プラスチック製の基材から選択される。該基材上への塗布方法としては、スピンコート、ディップコート、スプレーコート、バーコート、アプリケーター、インクジェットまたはロールコーター等、公知の塗布方法を特に制限無く用いることが出来る。
次に、第1工程で得られた該感光性樹脂膜を、目的のパターンを形成するための所望の形状の遮光板(マスク)で遮光して、露光処理することで、露光後の感光性樹脂膜が得られる。
次に、第2工程で得られた、露光後の感光性樹脂膜を現像することで、所望のパターン形状を有する膜(以下、「パターン樹脂膜」と呼びことがある)を作成することができる。
次に第3工程で得られた該パターン樹脂膜(および、前記ブリーチング露光したパターン樹脂膜も含む)を加熱処理することで、最終的なパターン硬化膜が得られる。該加熱処理により、(A)成分のポリシロキサン化合物において未反応性基として残存するアルコキシ基やシラノール基を縮合させ、エポキシ基、オキセタン基、メタクリロイル基およびアクリロイル基を十分に硬化させることが可能となる。また、ポリシロキサン化合物が酸不安定性基を有する場合や、残存する感光剤を熱分解により除去することが可能となる。
この際の加熱温度としては、80℃以上400℃以下が好ましく、100℃以上350℃以下がより好ましい。加熱処理時間としては、通常、1分間以上90分間以下で行い、5分間以上60分間以下が好ましい。加熱温度が80℃より低いと、該縮合および該硬化反応、該酸不安定性基や該感光剤の熱分解不十分で薬液耐性や透明性の低下がおこり、加熱温度が350℃より高いと、ポリシロキサン化合物の熱分解や膜の亀裂(クラック)がおこる可能性がある。この加熱処理により基材上に目的のパターン硬化膜を形成させることができる。
本発明の「別の実施態様」は、次の(A1)成分、(A2)成分と、前記(B)成分を含む樹脂組成物である。
(A1)成分:式(1)で表される構成単位を含むが、式(2)の構成単位と式(3)の構成単位の何れも含まないポリマー。
(A2)成分:式(2)の構成単位、及び、式(3)の構造単位の少なくとも一方の構成単位を含むが、式(1)で表される構成単位を含まないポリマー。
(B)成分:溶剤。
一方、「(A1)成分と、(A2)成分と、(B)成分を含む樹脂組成物」は、前記<1>で説明した「(A)成分と(B)成分を含む樹脂組成物」に比べて、性能調整が容易であるというメリットを有する。具体的には、所望の性能に応じて(A1)成分と(A2)成分との配合比を調整するだけで、膜物性、アルカリ現像性、その他諸物性を簡便に調整することが可能である(「(A)成分と(B)成分を含む樹脂組成物」においては、性能調整のためには新たな重合を行う必要がある)。
説明した「構成単位間の量比」を「(A1)成分と(A2)成分の量比」に読み替えて、再び挙げることができる。
次に、樹脂組成物のうち、(A)成分及び(A1)成分のうち式(1)の構成単位を与えるための重合原料たる、式(7)で表されるアルコキシシラン類、および、式(6)で表されるハロシラン類の製造方法について、説明する。
<工程A>
原料として用いられる芳香族ハロシランは式(5)で表され、ヘキサフルオロアセロンと反応するフェニル基、およびハロゲン原子が珪素原子に直接結合した構造を有する。
本反応に用いるルイス酸触媒は特に限定はなく、例えば塩化アルミニウム、塩化鉄(III)、塩化亜鉛、塩化スズ(II)、四塩化チタン、臭化アルミニウム、三フッ化ホウ素、三フッ化ホウ素ジエチルエーテル錯体、フッ化アンチモン、ゼオライト類、複合酸化物等が挙げられる。その中でも塩化アルミニウム、塩化鉄(III)、三フッ化ホウ素が好ましく、さらに本反応での反応性が高いことから、塩化アルミニウムがもっとも好ましい。ルイス酸触媒の使用量は、特に限定されるものではないが、芳香族ハロシラン(1)1モルに対して、0.01モル以上、1.0モル以下が好ましい。
本反応では原料の芳香族ハロシランが液体の場合は、特に有機溶媒を使用せずに反応を行うことができるが、原料の芳香族ハロシランが固体の場合や芳香族ハロシランの反応性が高い場合は、有機溶媒を用いてもよい。有機溶剤としては、芳香族ハロシランが溶解し、ルイス酸触媒やヘキサフルオロアセトンと反応しない溶媒であれば特に制限はなく、ペンタン、ヘキサン、ヘプタン、オクタン、アセトニトリル、ニトロメタン、クロロベンゼン類、ニトロベンゼン等を用いることができる。これらの溶媒を単独で、または混合して用いてもよい。
本反応に用いるヘキサフルオロアセトンの種類については、ヘキサフルオロアセトン、ヘキサフルオロアセトン三水和物等の水和物が挙げられるが、反応の際に水分が混入すると収率が低下することから、中でもヘキサフルオロアセトンをガスとして使用することが好ましい。使用するヘキサフルオロアセトンの量は、芳香環に導入するHFIP基の数にもよるが、原料の芳香族ハロシラン(5)中に含まれるフェニル基1モルに対して、1モル当量以上、6モル当量以下が好ましい。また、フェニル基中にHFIP基を3個以上導入しようとする場合、過剰のヘキサフルオロアセトンや多量の触媒、長い反応時間を必要とするため、使用するヘキサフルオロアセトンの量は原料の芳香族ハロシラン(5)中に含まれるフェニル基1モルに対して、2.5モル当量以下にし、フェニル基へのHFIP基導入数を2個以下に抑えることがより好ましい。
HFIP基含有芳香族ハロシラン(6)を合成する際は、ヘキサフルオロアセトンの沸点が-28℃であるので、ヘキサフルオロアセトンを反応系内に留めるために、冷却装置または密封反応器を使用することが好ましく、特に密封反応器を使用することが好ましい。密封反応器(オートクレーブ)を使用して反応を行う場合は、最初に芳香族ハロシラン(5)とルイス酸触媒を反応器内に入れ、次いで、反応器内の圧力が0.5MPaを越えないようにヘキサフルオロアセトンのガスを導入することが好ましい。
次に、式(1)中のXが酸不安定性基である構成単位を含むポリシロキサン化合物について説明する。具体的には、式(6)で表されるHFIP基含有ハロシランのX基を、水素原子から酸不安定性基に変換した後に、加水分解重縮合することで、目的とする「Xが酸不安定性基であるポリシロキサン化合物」が得られる。
上記の方法で得られるHFIP基含有芳香族ハロシランは式(6)で表され、HFIP基および珪素原子が芳香環に直接結合した構造を有する。
<工程B>
工程Bの原料として用いられるHFIP基含有芳香族ハロシラン(6)は工程Aで得られたものを使用できる。HFIP基含有芳香族ハロシラン(6)は、精密蒸留等を行ない分離した各種異性体のほか、異性体分離をせずに異性体混合物そのままを用いることもできる。
アルコールは目的とするアルコキシシランによって、選択される。具体的には、メタノール、エタノール、1-プロパノール、2-プロパノール、2-フルオロエタノール、2,2,2-トリフルオロエタノール、3-フルオロプロパノール、3,3-ジフルオロプロパノール、3,3,3-トリフルオロプロパノール、2,2,3,3-テトラフルオロプロパノール、2,2,3,3,3-ペンタフルオロプロパノール、1,1,1,3,3,3-ヘキサフルオロイソプロパノールなどが使用でき、特にメタノールまたはエタノールが好ましい(すなわち、式(7)のR21がメチル基またはエチル基を指す)。アルコールを反応させる際に、水分が混入していると、HFIP基含有芳香族ハロシラン(4)の加水分解反応や縮合反応が進行してしまい、目的のHFIP基含有芳香族アルコキシシラン(3)の収率が低下することから、含有する水分量の少ないアルコールを用いることが好ましい。具体的には5wt%以下が好ましく、1wt%以下がさらに好ましい。
HFIP基含有芳香族アルコキシシラン(7)を合成する際の反応方法は、特に限定されることはないが、典型的な例としてはHFIP基含有芳香族ハロシラン(6)にアルコールを滴下して反応させる方法、またはアルコールにHFIP基含有芳香族ハロシラン(6)を滴下して反応させる方法がある。
アルコールとHFIP基含有芳香族ハロシラン(6)の反応は、溶媒で希釈してもよい。用いる溶媒は、用いるアルコールおよびHFIP基含有芳香族ハロシラン(6)と反応しないものなら特に制限はなく、ペンタン、ヘキサン、ヘプタン、オクタン、トルエン、キシレン、テトラヒドロフラン、ジエチルエーテル、ジブチルエーテル、ジイソプロピルエーテル、1,2-ジメトキシエタン、1,4-ジオキサン等を用いることができる。これらの溶媒を単独で、または混合して用いてもよい。
工程Bで使用するアルコールの量は特に制限はないが、反応が効率よく進行する点で、HFIP基含有芳香族ハロシラン(6)に含まれるSi-Xx結合に対し1モル当量~10モル当量が好ましく、1モル当量~3モル当量がさらに好ましい。
アルコールまたはHFIP基含有芳香族ハロシラン(6)の添加時間には特に制限はないが、10分~24時間が好ましく、30分~6時間がさらに好ましい。また、滴下中の反応温度についても特に制限はなく、0℃~80℃が好ましい。
滴下終了後に撹拌を継続しながら熟成を行うことで、反応を完結させることができる。熟成時間には特に制限はなく、望みの反応を十分進行させる点で、30分~6時間が好ましい。また熟成時の反応温度は、滴下時と同じか、滴下時よりも高いことが好ましい。ガスクロマトグラフィー等、汎用の分析手段により、原料が十分消費されたことを確認した後、反応を終了することが好ましい。反応終了後、ろ過、抽出、蒸留等の手段により、精製を行なうことで、HFIP基含有芳香族アルコキシシラン(7)を得ることができる。
式(7)で表されるHFIP基含有芳香族アルコキシシランの内、芳香環を1つ含有する(即ち、式(7)のbが1である)式(7-1)は、特開2014-156461に記載の製造方法に従い、HFIP基とY基が置換したベンゼンと、アルコキシヒドロシランを原料とし、ロジウム、ルテニウム、イリジウムなどの遷移金属触媒を用いたカップリング反応でも製造出来る。
次に、式(1)中のXが酸不安定性基である構成単位を含むポリシロキサン化合物について説明する。具体的には、式(7)または式(7-1)で表されるHFIP基含有アルコキシシランのX基を、水素原子から酸不安定性基に変換した後に、加水分解重縮合することで、目的とする「Xが酸不安定性基であるポリシロキサン化合物」が得られる。
別の言い方として、(A)成分のポリシロキサン化合物は、まず、前掲の式(7)または式(7-1)で表されるアルコキシシランのヒドロキシ基の水素原子を酸不安定性基に変換して酸不安定性基含有アルコキシシランとし、その後、その酸不安定性基含有アルコキシシランを加水分解重縮合することで得ることができる。そして、そのようにして得た(A)成分のポリシロキサン化合物と溶剤とを用いて、樹脂組成物を製造することができる。
同様に、(A1)成分のポリマーは、まず、前掲の式(7)または式(7-1)で表されるアルコキシシランのヒドロキシ基の水素原子を酸不安定性基に変換して酸不安定性基含有アルコキシシランとし、その後、その酸不安定性基含有アルコキシシランを加水分解重縮合することで得ることができる。そして、そのようにして得た(A1)成分のポリマーと、(A2)成分のポリマーと、溶剤とを用いて、樹脂組成物を製造することができる。
別の言い方として、(A)成分のポリシロキサン化合物は、前掲の式(7)または式(7-1)で表されるアルコキシシランを加水分解重縮合してポリマーとし、その後、そのポリマー中のヒドロキシ基の水素原子を酸不安定性基に変換することで得ることができる。そして、そのようにして得た(A)成分のポリシロキサン化合物と溶剤とを用いて、樹脂組成物を製造することができる。
同様に、(A1)成分のポリマーは、前掲の式(7)または式(7-1)で表されるアルコキシシランを加水分解重縮合してポリマーとし、その後、そのポリマー中のヒドロキシ基の水素原子を酸不安定性基に変換することで得ることができる。そして、そのようにして得た(A1)成分のポリマーと、(A2)成分のポリマーと、溶剤とを用いて、樹脂組成物を製造することができる。
ちなみに、上記(i)(ii)いずれの方法で(A)成分であるポリシロキサン化合物を得る場合であっても、そのポリシロキサン化合物の好ましい重量平均分子量は、前述のとおりである。同様に、上記(i)(ii)いずれの方法で(A1)成分のポリマーを得る場合であっても、そのポリマーの好ましい重量平均分子量は、前述のとおりである。
以下、実施例により本発明の実施態様を具体的に説明するが、本発明はこれらの実施例によって限定されるものではない。
共鳴周波数400MHzの核磁気共鳴装置(日本電子株式会社製、JNM-ECA400)を使用し、1H-NMR、19F-NMRの測定を行った。
GC測定は島津製作所(株)製、商品名Shimadzu GC-2010を用い、カラムはキャピラリーカラム DB1(60mm×0.25mmφ×1μm)を用いて測定を行なった。
重合物の分子量はゲル浸透クロマトグラフ(東ソー株式会社製、HLC-8320GPC)を使用してGPCを測定し、ポリスチレン換算により、重量平均分子量(Mw)を算出した。
株式会社日立ハイテクサイエンス製の示差熱熱重量同時測定装置(TG/DTA)STA7200を用いて、空気下で熱重量測定を実施し、初期の重量に対して5%の重量損失があった温度を熱分解温度(Td5)とした。
株式会社日立ハイテクサイエンス製の分光光度計U-4100を用いて、透明膜を形成していないガラス基板をリファレンスとして光透過率を測定した。
ズース・マイクロテック株式会社製の露光装置、機器名MA6を用いて、感光性樹脂組成物から得られる感光性樹脂膜を露光処理した。
1H-NMR(溶媒CDCl3,TMS):δ 8.17(s,1H),7.96-7.89(m,2H),7.64-7.60(dd,J=7.8Hz,1H),3.42(s,1H)
19F-NMR(溶媒CDCl3,CCl3F):δ -75.44(s,12F)。
1H-NMR(溶媒CDCl3,TMS):δ7.98(s,1H), 7.82-7.71(m,2H),7.52-7.45(dd,J=7.8 Hz,1H),3.61(s,9H),
19F-NMR(溶媒CDCl3,CCl3F):δ-75.33(s,12F)。
1H-NMR(溶媒CDCl3,TMS):δ8.00(s,1H), 7.79-7.76(m,2H),7.47(t,J=7.8 Hz,1H),3.87(q,J=6.9 Hz,6H),3.61(s,1H),1.23(t,J=7.2 Hz,9H)
19F-NMR(溶媒CDCl3,CCl3F):δ-75.99(s,6F)
得られた4-(2-ヒドロキシ-1,1,1,3,3,3-ヘキサフルオロイソプロピル)-トリエトキシシリルベンゼンの1H-NMR、19F-NMR測定結果を以下に示す。
1H-NMR(溶媒CDCl3,TMS):δ7.74(4H,dd,J=18.6,8.3Hz),3.89(6H,q,J=7.0Hz),3.57(1H,s),1.26(9H,t,J=7.0Hz)
19F-NMR(溶媒CDCl3,CCl3F):δ-75.94(s,6F)。
1H-NMR(溶媒CDCl3,TMS):δ7.96(s,1H), 7.76-7.73(m,2H),7.47(t,J=7.8 Hz,1H),3.86-3.75(m,6H),3.49(s,1H),1.23(t,J=7.2 Hz,6H),0.37(s,3H)
19F-NMR(溶媒CDCl3,CCl3F):δ-75.96(s,6F)。
特許文献4(特開2014-156461号公報)の実施例1の記載に従い、式(ME-1-1)で表される、3、5-ジ(2-ヒドロキシ-1,1,1,3,3,3-ヘキサフルオロイソプロピル)-トリエトキシシリルベンゼンを得た。
50mLのフラスコに、合成例4で得られたME-1 20.23g(50mmol)、水 2.84g(158mmol)、酢酸 0.15g(2.5mmol)を加え、100℃で2時間攪拌させた。その後、実施例1と同様の手法にて、固形分濃度25質量%の溶液組成物(CP-1) 10.0gを得た。GPC測定の結果は、Mw=1850であった。
50mLのフラスコに、合成例4で得られたME-1 10.12g(25mmol)、フェニルトリエトキシシラン 6.01g(25mmol)、水 2.84g(158mmol)、酢酸 0.15g(2.5mmol)を加え、100℃で2時間攪拌させた。その後、実施例1と同様の手法にて、固形分濃度25質量%の溶液組成物(CP-2) 10.0gを得た。GPC測定の結果は、Mw=1850であった。
50mLのフラスコに、合成例4で得られたME-1 1.01g(2.5mmol)、フェニルトリエトキシシラン 10.82g(45mmol)、水 2.84g(158mmol)、酢酸 0.15g(2.5mmol)を加え、100℃で2時間攪拌させた。その後、実施例1と同様の手法にて、固形分濃度25質量%の溶液組成物(CP-3) 10.0gを得た。GPC測定の結果は、Mw=2050であった。
実施例1~13、16~20で得られた溶液組成物P-1~P-13、P-16~20、P-22、P-23、および比較例1、2で得られた溶液組成物CP-1~3を4インチシリコンウェハー上に、1500rpmで1分間スピンコート製膜した後、100℃で1分間加熱処理し、樹脂膜を得た。
前記で得られた硬化膜に対して、以下の熱分解温度、溶剤耐性、酸に対する耐性、アルカリに対する耐性の各評価を実施した。
前記で得られた硬化膜をスパチュラで削り取り、熱分解温度(Td5:5%重量減少温度)の測定を行った。その結果を表1に示す。
前記で得られた該硬化膜を、室温下にて、PGMEA、NMPにそれぞれ室温で一分間浸漬させた。浸漬処理後の膜を目視観察した。その結果を表1に示す。
前記で得られた硬化膜を、室温下にて、濃塩酸:98%硝酸:水(50:7.5:42.5、質量比)の混合液にそれぞれ室温で一分間浸漬させた。浸漬処理後の膜を目視観察した。その結果を表2に示す。
前記で得られた硬化膜を、室温下にて、ジメチルスルホキシド:モノエタノールアミン:水(1:1:2、質量比)の混合液にそれぞれ室温で一分間させた。浸漬処理後の膜を目視観察した。その結果を表2に示す。
前記の樹脂膜、硬化膜の作製を、4インチシリコンウェハーの代わりに、4インチガラス基板を用いたこと以外は同様に実施し、実施例1~13、16~20、22、23で得られた溶液組成物P-1~P-13、P-16~P-20、P-22、P-23、および比較例1~3で得られた溶液組成物CP-1~3から、4インチガラス基板上に作製した膜厚1.5~3.0μmの硬化膜を得た。該硬化膜の透過スペクトルを測定し、波長400nmの膜厚2μm換算での透過率を表1に示す。
◎(とても良い):ムラが観察されないか、観測されても面積全体の1%未満。
〇(良い):剥がれ、スジの少なくとも1つが観察されるが、面積全体の1%以上、10%未満。
×(悪い):膜が溶解。
NMPに対する耐性:
◎(とても良い):ムラが観察されないか、観測されても面積全体の1%未満。
〇(良い):剥がれ、スジの少なくとも1つが観察されるが、面積全体の1%以上、10%未満。
×(悪い):膜が溶解。
◎(とても良い):ムラが観察されないか、観測されても面積全体の1%未満。
〇(良い):剥がれ、スジの少なくとも1つが観察されるが、面積全体の1%以上、10%未満。
×(悪い):膜が溶解。
アルカリに対する耐性:
◎(とても良い):ムラが観察されないか、観測されても面積全体の1%未満。
〇(良い):剥がれ、スジの少なくとも1つが観察されるが、面積全体の1%以上、10%未満。
×(悪い):膜が溶解。
前記の溶液組成物P-2~P-4、P-7~P-9、P-13、P-16~P-20、P-22、P-23から得られた硬化膜に対して、JIS K 5400(碁盤目試験法)に従い密着性を評価した。具体的には、該硬化膜に、カッターナイフにて1mm四方の格子を100マス形成した後、85℃、85%相対湿度の環境で3日間保持した。得られた硬化膜の格子部にセロハンテープを付着し、次いで引き剥がして目視確認した。全ての硬化膜において、剥がれは観測されず、十分な密着性を示すことが判った。
実施例1~4、7~9、11、13、17~20、22、23で得られた溶液組成物P-1~P-4、P-7~P-9、P-11、P-13、P-17~P-20、P-22、P-23の各10gに対して、感光剤としてナフトキノンジアジド化合物 TKF-528(株式会社三宝化学研究所製)を各0.5g添加し、攪拌後、均一な感光性溶液組成物PP-1~PP-4、PP-7~PP-9、PP-11、PP-13、PP-17~PP-20、PP-22、PP-23を得た。
実施例14、15、21で得られた溶液組成物P-14、P-15、P-21の各10gに対して、光酸発生剤であるIrgacure 121(米国BASF社製) 0.03gを添加し、攪拌後、均一な感光性溶液組成物PP-14、PP-15、PP-21を得た。
氷浴につけた三口フラスコ中のTHF(150g)およびNaH(16.2g、0.41mol)の混合液に、合成例4で得られた式(ME-1)で表される化合物(150g、0.37mol)を滴下し、その後、クロロメチルメチルエーテル(32.6g、0.38mol)を滴下した。その後、室温で20時間攪拌した。
上記の攪拌終了後、エバポレーターで反応液を濃縮した。濃縮された反応液に、トルエン300gと水150gとを投入して攪拌した。攪拌後にしばらく静置して二層分離後、下層の水層を除去した。得られた上層の有機層に対して、さらに水150g投入して、同様の操作を繰り返した。最終的に得られた上層の有機層をエバポレーターで濃縮して、180gの粗体を得た。
得られた粗体を単蒸留(減圧度2.5kPa、バス温200~220℃、トップ温170℃)して、HFA-Si-MOMを145g得た。
容量50mLのフラスコに、上記で製造したHFA-Si-MOM(3g,6.7mmol)、フェニルトリエトキシシラン(12.8g,53mmol)、他の実施例でも用いたKBM-303(1.6g,7mmol)、水(3.8g,210mmol)、EtOH(10g)、25質量%TMAH水溶液0.24g(TMAH換算として0.06g,0.7mmol)を加え、60℃で4時間攪拌させた。
反応液にトルエン(5g)を加え、105℃、20時間、ディーン・スターク装置を付け還流させ水、EtOHを留去した。水洗を3回(各回水を2g使用)行い、その後有機層をエバポレーターで濃縮(30hPa,60℃,30min)し、ポリシロキサン化合物を10g得た。
ポリシロキサン化合物をプロピレングリコールモノメチルエーテルアセテート20gで溶解し、固形分濃度33質量%の溶液組成物(P-24)を得た。GPC測定によるポリシロキサン化合物のMwは1700であった。
溶液組成物P-24~P-28を、それぞれ、4インチガラス基板上に、回転数500rpmでスピンコートした。その後、基板をホットプレート上で100℃、3分間乾燥させた。さらにその後、230℃で1時間焼成させた。このようにしてガラス基板上に膜厚1~2μmのポリシロキサンの硬化膜を得た。そして、硬化膜の透過スペクトルを測定した。
溶液組成物P-24~P-28それぞれ3gに対して、光酸発生剤CP-100TF(サンアプロ社製)0.04gを添加し、攪拌して均一な感光性溶液組成物PP-24~PP-28を作成した。
得られた感光性溶液組成物を、株式会社SUMCO製の直径4インチ、厚み525μmのシリコンウエハー上に回転数500rpmでスピンコートで塗布した。その後、シリコンウエハーをホットプレート上で100℃、3分間加熱処理し、膜厚1~2μmの感光性樹脂膜を得た。
得られた感光性樹脂膜に対して、露光装置を用いて、フォトマスクを介して108mJ/cm2の高圧水銀灯からの光を照射した。その後、ホットプレートで150℃、1分間加熱処理した。さらにその後、2.38質量%テトラメチルアンモニウムヒドロキシド水溶液に1分間浸漬して現像し、水に30秒浸漬して洗浄した。洗浄後、大気下、230℃で1時間、オーブンで焼成した。以上により、ポジ型パターンが形成されたパターン硬化膜を得た。
感光性溶液組成物PP-24~PP-28のすべてにおいて、10~20μmのラインアンドスペースの解像度が得られた。すなわち、酸不安定性基があらかじめ導入されたアルコキシシラン(モノマー)を用いてポリシロキサン化合物を合成し、その合成されたポリシロキサン化合物を用いて感光性樹脂組成物を製造することで、良好な性能の感光性樹脂組成物を得ることができた。
・P-HFA-Si:合成例4で得られた式(ME-1)で表される化合物を単独で、実施例1と同様の酢酸触媒条件で縮重合したもの、Mw=2100
・P-HFA-Si-MOM:実施例24で合成したHFA-Si-MOM(酸不安定性基含有モノマー)を単独で縮重合したもの、Mw=2100
・P-HFA-Si-BOC:以下のようにして合成したHFA-Si-BOC(酸不安定性基含有モノマー)を単独で縮重合したもの、Mw=1800
氷浴につけた三口フラスコ中に、THF(10g)、NaH(1.2g、0.03mol)、合成例4に記載の式(ME-1)で表される化合物(10g、0.025mol)を加え、30分攪拌した。その後、フラスコ中に二炭酸ジ-tert-ブチル(5.2g、0.027mol)およびテトラブチルアンモニウムヨージド(0.3g、0.001mol)を加え、室温で18時間攪拌した。
得られた反応生成物に、ジイソフロピルエーテル(20g)と水(10g)を加え、攪拌し、その後しばらく静置した。静置して二層分離した後の下層の水層を除去した。得られた上層の有機層を硫酸マグネシウムで乾燥し、その後、エバポレーターで濃縮して、HFA-Si-BOC 10g(収率83%、GC純度95%)を得た。
参考のため、HFA-Si-BOCの化学式を以下に示す。
・P-KBM-303:2-(3,4-エポキシシクロヘキシルエチルトリメトキシシラン)(信越化学工業株式会社製 KBM―303)を単独で縮重合したもの、Mw=1900
・P-KBM-5103:3-アクリロキシプロピルトリメトキシシラン(信越化学工業株式会社製 KBM-5103)を単独で縮重合したもの、Mw=2200
・P-KBM-303/エチルポリシリケート(8/2:モル比):2-(3,4-エポキシシクロヘキシルエチルトリメトキシシラン)(信越化学工業株式会社製 KBM―303)と、エチルポリシリケート(多摩化学工業株式会社製、シリケート40)を共重合したもの、Mw=2000
・P-Ph-Si:フェニルトリエトキシシランを単独で縮重合したもの、Mw=2500
下表において、ポリマーの組成比(混合比率)については、ポリマーを合成する際に用いたモノマーの使用モル数(仕込みモル数)に換算した値で示している。
Claims (15)
- 下記の(A)成分と、(B)成分と、を含む樹脂組成物。
(A)成分:
式(1)で表される構成単位と、
式(2)および式(3)の少なくとも一方の構成単位と、
を含むポリシロキサン化合物。
[式中、Rxは、式(1a)
(Xは水素原子または酸不安定性基であり、aは1~5の整数である。破線は結合手を表す)
で表される一価の基である。R1は水素原子、炭素数1以上3以下のアルキル基、フェニル基、ヒドロキシ基、炭素数1以上3以下のアルコキシ基または炭素数1以上3以下のフルオロアルキル基であり、bは1~3の整数、mは0~2の整数、nは1~3の整数であり、b+m+n=4である。Rx、R1が複数個あるときは、それぞれは独立して上記置換基の何れかを取ることができる。]
[式中、Ryは、エポキシ基、オキセタン基、アクリロイル基、メタクリロイル基のいずれかを含む炭素数1~30の一価の有機基である。R2は、水素原子、炭素数1以上3以下のアルキル基、フェニル基、ヒドロキシ基、炭素数1以上3以下のアルコキシ基または炭素数1以上3以下のフルオロアルキル基であり、cは1~3の整数、pは0~2の整数、qは1~3の整数であり、c+p+q=4である。Ry、R2が複数個あるときは、それぞれは独立して上記置換基の何れかを取ることができる。]
(B)成分:
溶剤。 - 溶剤が、プロピレングルコールモノメチルエーテルアセテート、プロピレングリコールモノメチルエーテル、シクロヘキサノン、乳酸エチル、γ―ブチロラクトン、ジアセトンアルコール、ジグライム、メチルイソブチルケトン、酢酸3-メトキシブチル、2-ヘプタノン、N、N-ジメチルホルムアミド、N、N-ジメチルアセトアミド、N-メチルピロリドン、グリコール類及びグリコールエーテル類、グルコールエーテルエステル類からなる群から選ばれる少なくとも1種の化合物を含む溶剤である、請求項1~3の何れか1項に記載の樹脂組成物。
- 次の(A1)成分と、(A2)成分と、(B)成分と、を含む樹脂組成物。
(A1)成分:式(1)で表される構成単位を含むが、式(2)の構成単位も式(3)の構成単位の何れをも含まないポリマー。
(A2)成分:式(2)の構成単位、及び、式(3)の構造単位の少なくとも一方の構成単位を含むが、式(1)で表される構成単位を含まないポリマー。
[式中、Rxは、式(1a)
(Xは水素原子または酸不安定性基であり、aは1~5の整数である。破線は結合手を表す)
で表される一価の基である。R1は水素原子、炭素数1以上3以下のアルキル基、フェニル基、ヒドロキシ基、炭素数1以上3以下のアルコキシ基または炭素数1以上3以下のフルオロアルキル基であり、bは1~3の整数、mは0~2の整数、nは1~3の整数であり、b+m+n=4である。Rx、R1が複数個あるときは、それぞれは独立して上記置換基の何れかを取ることができる。]
[式中、Ryは、エポキシ基、オキセタン基、アクリロイル基、メタクリロイル基のいずれかを含む炭素数1~30の一価の有機基である。R2は、水素原子、炭素数1以上3以下のアルキル基、フェニル基、ヒドロキシ基、炭素数1以上3以下のアルコキシ基または炭素数1以上3以下のフルオロアルキル基であり、cは1~3の整数、pは0~2の整数、qは1~3の整数であり、c+p+q=4である。Ry、R2が複数個あるときは、それぞれは独立して上記置換基の何れかを取ることができる。]
(B)成分:溶剤。 - 請求項1~5の何れか1項に記載の樹脂組成物と、
(C)成分として、キノンジアジド化合物、光酸発生剤、光ラジカル発生剤から選択される感光剤と、を含む、感光性樹脂組成物。 - 請求項1~5の何れか1項に記載の樹脂組成物の硬化膜。
- 請求項1~5の何れか1項に記載の樹脂組成物を基材上に塗布した後、100~350℃の温度で加熱することを特徴とする硬化膜の製造方法。
- 請求項6に記載の感光性樹脂組成物のパターン硬化膜。
- 次の第1~第4工程を含む、パターン硬化膜の製造方法。
第1工程:請求項6に記載の感光性樹脂組成物を基材上に塗布および乾燥して感光性樹脂膜を形成する工程。
第2工程:前記感光性樹脂膜を露光する工程。
第3工程:露光後の前記感光性樹脂膜を現像して、パターン樹脂膜を形成する工程。
第4工程:前記パターン樹脂膜を加熱し、それによって前記パターン樹脂膜を硬化させてパターン硬化膜に転化させる工程。 - 第2工程の露光に用いる光の波長が100~600nmであることを特徴とする、請求項10に記載のパターン硬化膜の製造方法。
- 樹脂組成物を製造するに際して、前記(A)成分のポリシロキサン化合物として、以下式(7)または式(7-1)で表されるアルコキシシランのヒドロキシ基の水素原子を酸不安定性基に変換して酸不安定性基含有アルコキシシランとし、その後、その酸不安定性基含有アルコキシシランを加水分解重縮合することで得られたポリシロキサン化合物を用いる、請求項1~4の何れか1項に記載の樹脂組成物の製造方法。
[式(7)中、R1はそれぞれ独立に、水素原子、炭素数1以上3以下のアルキル基、フェニル基、ヒドロキシ基、炭素数1以上3以下のアルコキシ基または炭素数1以上3以下のフルオロアルキル基であり、R21は、それぞれ独立に、炭素数1~4の直鎖状または炭素数3、4の分岐状のアルキル基であり、アルキル基中の水素原子の全てまたは一部がフッ素原子と置換されていてもよく、aは1~5、bは1~3、mは0~2、sは1~3の整数であり、b+m+s=4である。
式(7-1)中、R12はそれぞれ独立に、水素原子、炭素数1以上3以下のアルキル基、フェニル基、ヒドロキシ基、炭素数1以上3以下のアルコキシ基または炭素数1以上3以下のフルオロアルキル基であり、R22は、それぞれ独立に、炭素数1~4の直鎖状または炭素数3、4の分岐状のアルキル基であり、アルキル基中の水素原子の全てまたは一部がフッ素原子と置換されていてもよく、aは1~5、mは0~2、rは1~3の整数であり、m+r=3である。] - 樹脂組成物を製造するに際して、前記(A)成分のポリシロキサン化合物として、以下式(7)または式(7-1)で表されるアルコキシシランを加水分解重縮合してポリマーとし、その後、そのポリマー中のヒドロキシ基の水素原子を酸不安定性基に変換することで得られたポリシロキサン化合物を用いる、請求項1~4の何れか1項に記載の樹脂組成物の製造方法。
[式(7)中、R1はそれぞれ独立に、水素原子、炭素数1以上3以下のアルキル基、フェニル基、ヒドロキシ基、炭素数1以上3以下のアルコキシ基または炭素数1以上3以下のフルオロアルキル基であり、R21は、それぞれ独立に、炭素数1~4の直鎖状または炭素数3、4の分岐状のアルキル基であり、アルキル基中の水素原子の全てまたは一部がフッ素原子と置換されていてもよく、aは1~5、bは1~3、mは0~2、sは1~3の整数であり、b+m+s=4である。
式(7-1)中、R12はそれぞれ独立に、水素原子、炭素数1以上3以下のアルキル基、フェニル基、ヒドロキシ基、炭素数1以上3以下のアルコキシ基または炭素数1以上3以下のフルオロアルキル基であり、R22は、それぞれ独立に、炭素数1~4の直鎖状または炭素数3、4の分岐状のアルキル基であり、アルキル基中の水素原子の全てまたは一部がフッ素原子と置換されていてもよく、aは1~5、mは0~2、rは1~3の整数であり、m+r=3である。] - 樹脂組成物を製造するに際して、前記(A1)成分のポリマーとして、以下式(7)または式(7-1)で表されるアルコキシシランのヒドロキシ基の水素原子を酸不安定性基に変換して酸不安定性基含有アルコキシシランとし、その後、その酸不安定性基含有アルコキシシランを加水分解重縮合することで得られたポリマーを用いる、請求項5に記載の樹脂組成物の製造方法。
[式(7)中、R1はそれぞれ独立に、水素原子、炭素数1以上3以下のアルキル基、フェニル基、ヒドロキシ基、炭素数1以上3以下のアルコキシ基または炭素数1以上3以下のフルオロアルキル基であり、R21は、それぞれ独立に、炭素数1~4の直鎖状または炭素数3、4の分岐状のアルキル基であり、アルキル基中の水素原子の全てまたは一部がフッ素原子と置換されていてもよく、aは1~5、bは1~3、mは0~2、sは1~3の整数であり、b+m+s=4である。
式(7-1)中、R12はそれぞれ独立に、水素原子、炭素数1以上3以下のアルキル基、フェニル基、ヒドロキシ基、炭素数1以上3以下のアルコキシ基または炭素数1以上3以下のフルオロアルキル基であり、R22は、それぞれ独立に、炭素数1~4の直鎖状または炭素数3、4の分岐状のアルキル基であり、アルキル基中の水素原子の全てまたは一部がフッ素原子と置換されていてもよく、aは1~5、mは0~2、rは1~3の整数であり、m+r=3である。] - 樹脂組成物を製造するに際して、前記(A1)成分のポリマーとして、以下式(7)または式(7-1)で表されるアルコキシシランを加水分解重縮合してポリマーとし、その後、そのポリマー中のヒドロキシ基の水素原子を酸不安定性基に変換することで得られたポリマーを用いる、請求項5に記載の樹脂組成物の製造方法。
[式(7)中、R1はそれぞれ独立に、水素原子、炭素数1以上3以下のアルキル基、フェニル基、ヒドロキシ基、炭素数1以上3以下のアルコキシ基または炭素数1以上3以下のフルオロアルキル基であり、R21は、それぞれ独立に、炭素数1~4の直鎖状または炭素数3、4の分岐状のアルキル基であり、アルキル基中の水素原子の全てまたは一部がフッ素原子と置換されていてもよく、aは1~5、bは1~3、mは0~2、sは1~3の整数であり、b+m+s=4である。
式(7-1)中、R12はそれぞれ独立に、水素原子、炭素数1以上3以下のアルキル基、フェニル基、ヒドロキシ基、炭素数1以上3以下のアルコキシ基または炭素数1以上3以下のフルオロアルキル基であり、R22は、それぞれ独立に、炭素数1~4の直鎖状または炭素数3、4の分岐状のアルキル基であり、アルキル基中の水素原子の全てまたは一部がフッ素原子と置換されていてもよく、aは1~5、mは0~2、rは1~3の整数であり、m+r=3である。]
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020217016485A KR102593420B1 (ko) | 2018-10-30 | 2019-10-28 | 수지 조성물, 감광성 수지 조성물, 경화막, 경화막의 제조 방법, 패턴 경화막 및 패턴 경화막의 제작 방법 |
| US17/289,471 US20210395461A1 (en) | 2018-10-30 | 2019-10-28 | Resin composition, photosensitive resin composition, cured film, method for manufacturing cured film, patterned cured film, method for producing patterned cured film |
| CN201980071895.9A CN113166548A (zh) | 2018-10-30 | 2019-10-28 | 树脂组合物、感光性树脂组合物、固化膜、固化膜的制造方法、图案固化膜和图案固化膜的制造方法 |
| JP2020553896A JP7510060B2 (ja) | 2018-10-30 | 2019-10-28 | 樹脂組成物、感光性樹脂組成物、硬化膜、硬化膜の製造方法、パターン硬化膜およびパターン硬化膜の作製方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-204332 | 2018-10-30 | ||
| JP2018204332 | 2018-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2020090746A1 true WO2020090746A1 (ja) | 2020-05-07 |
Family
ID=70464447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2019/042183 Ceased WO2020090746A1 (ja) | 2018-10-30 | 2019-10-28 | 樹脂組成物、感光性樹脂組成物、硬化膜、硬化膜の製造方法、パターン硬化膜およびパターン硬化膜の作製方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20210395461A1 (ja) |
| JP (1) | JP7510060B2 (ja) |
| KR (1) | KR102593420B1 (ja) |
| CN (1) | CN113166548A (ja) |
| TW (1) | TWI877121B (ja) |
| WO (1) | WO2020090746A1 (ja) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2020045024A1 (ja) * | 2018-08-27 | 2020-12-17 | 互応化学工業株式会社 | 感光性樹脂組成物、ドライフィルム、及びプリント配線板 |
| WO2021085262A1 (ja) * | 2019-10-28 | 2021-05-06 | セントラル硝子株式会社 | ケイ素化合物、反応性材料、樹脂組成物、感光性樹脂組成物、硬化膜、硬化膜の製造方法、パターン硬化膜およびパターン硬化膜の製造方法 |
| WO2022131278A1 (ja) * | 2020-12-15 | 2022-06-23 | セントラル硝子株式会社 | 光学部材用の塗布液、重合体、硬化膜、感光性塗布液、パターン硬化膜、光学部材、固体撮像素子、表示装置、ポリシロキサン化合物、塗布液に用いる安定化剤、硬化膜の製造方法、パターン硬化膜の製造方法、及び重合体の製造方法 |
| WO2022168735A1 (ja) * | 2021-02-05 | 2022-08-11 | セントラル硝子株式会社 | ヘキサフルオロイソプロパノール基を含むケイ素化合物、ケイ素化合物の製造方法、ポリシロキサン及びポリシロキサンの製造方法 |
| WO2022181350A1 (ja) * | 2021-02-24 | 2022-09-01 | 東レ株式会社 | 感光性樹脂組成物、硬化物、積層体、表示装置、および表示装置の製造方法 |
| JP2022159148A (ja) * | 2021-03-31 | 2022-10-17 | セントラル硝子株式会社 | ヘキサフルオロイソプロパノール基を含む医療用樹脂組成物 |
| CN116457363A (zh) * | 2020-11-24 | 2023-07-18 | 中央硝子株式会社 | 含硅单体、混合物、聚硅氧烷和它们的制造方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI836780B (zh) * | 2022-12-09 | 2024-03-21 | 明基材料股份有限公司 | 低折射率光學樹脂 |
| CN118222176A (zh) * | 2022-12-21 | 2024-06-21 | 明基材料股份有限公司 | 低折射率光学树脂 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011078106A1 (ja) * | 2009-12-22 | 2011-06-30 | 東レ株式会社 | ポジ型感光性樹脂組成物、それから形成された硬化膜、および硬化膜を有する素子 |
| JP2012168289A (ja) * | 2011-02-10 | 2012-09-06 | Jsr Corp | ポジ型感放射線性樹脂組成物、表示素子用層間絶縁膜及びその形成方法 |
| JP2015129908A (ja) * | 2013-11-01 | 2015-07-16 | セントラル硝子株式会社 | ポジ型感光性樹脂組成物、それを用いた膜の製造方法および電子部品 |
| WO2015122293A1 (ja) * | 2014-02-13 | 2015-08-20 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化膜の製造方法、硬化膜、液晶表示装置、有機el表示装置、タッチパネル表示装置 |
| JP2017049327A (ja) * | 2015-08-31 | 2017-03-09 | 富士フイルム株式会社 | 感光性組成物、硬化膜の製造方法、液晶表示装置の製造方法、有機エレクトロルミネッセンス表示装置の製造方法、およびタッチパネルの製造方法 |
| WO2019167771A1 (ja) * | 2018-02-28 | 2019-09-06 | セントラル硝子株式会社 | 珪素含有層形成組成物およびそれを用いたパターン付き基板の製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2567984B2 (ja) | 1990-09-21 | 1996-12-25 | 東京応化工業株式会社 | ポジ型レジスト組成物 |
| JP2005330488A (ja) | 2005-05-19 | 2005-12-02 | Tokyo Ohka Kogyo Co Ltd | アルカリ可溶性ポリシロキサン樹脂 |
| TWI516527B (zh) * | 2009-12-10 | 2016-01-11 | 信越化學工業股份有限公司 | 光固化性樹脂組成物,圖案形成法和基板保護膜,以及使用該組成物之膜狀黏著劑及黏著片 |
| JP5524037B2 (ja) * | 2010-01-19 | 2014-06-18 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化膜、硬化膜の形成方法、有機el表示装置、及び、液晶表示装置 |
| JP5726632B2 (ja) | 2011-05-19 | 2015-06-03 | メルクパフォーマンスマテリアルズIp合同会社 | 感光性シロキサン樹脂組成物 |
| JP6281288B2 (ja) | 2013-01-21 | 2018-02-21 | セントラル硝子株式会社 | ヘキサフルオロイソプロパノール基を含む珪素化合物およびその製造方法、並びにそれが重合してなる高分子化合物 |
| JP2014149330A (ja) | 2013-01-31 | 2014-08-21 | Toray Ind Inc | 感光性シロキサン組成物、硬化膜及び素子 |
-
2019
- 2019-10-28 KR KR1020217016485A patent/KR102593420B1/ko active Active
- 2019-10-28 WO PCT/JP2019/042183 patent/WO2020090746A1/ja not_active Ceased
- 2019-10-28 US US17/289,471 patent/US20210395461A1/en not_active Abandoned
- 2019-10-28 CN CN201980071895.9A patent/CN113166548A/zh active Pending
- 2019-10-28 JP JP2020553896A patent/JP7510060B2/ja active Active
- 2019-10-30 TW TW108139255A patent/TWI877121B/zh active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011078106A1 (ja) * | 2009-12-22 | 2011-06-30 | 東レ株式会社 | ポジ型感光性樹脂組成物、それから形成された硬化膜、および硬化膜を有する素子 |
| JP2012168289A (ja) * | 2011-02-10 | 2012-09-06 | Jsr Corp | ポジ型感放射線性樹脂組成物、表示素子用層間絶縁膜及びその形成方法 |
| JP2015129908A (ja) * | 2013-11-01 | 2015-07-16 | セントラル硝子株式会社 | ポジ型感光性樹脂組成物、それを用いた膜の製造方法および電子部品 |
| WO2015122293A1 (ja) * | 2014-02-13 | 2015-08-20 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化膜の製造方法、硬化膜、液晶表示装置、有機el表示装置、タッチパネル表示装置 |
| JP2017049327A (ja) * | 2015-08-31 | 2017-03-09 | 富士フイルム株式会社 | 感光性組成物、硬化膜の製造方法、液晶表示装置の製造方法、有機エレクトロルミネッセンス表示装置の製造方法、およびタッチパネルの製造方法 |
| WO2019167771A1 (ja) * | 2018-02-28 | 2019-09-06 | セントラル硝子株式会社 | 珪素含有層形成組成物およびそれを用いたパターン付き基板の製造方法 |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2020045024A1 (ja) * | 2018-08-27 | 2020-12-17 | 互応化学工業株式会社 | 感光性樹脂組成物、ドライフィルム、及びプリント配線板 |
| JP7197924B2 (ja) | 2018-08-27 | 2022-12-28 | 互応化学工業株式会社 | 感光性樹脂組成物、ドライフィルム、及びプリント配線板 |
| WO2021085262A1 (ja) * | 2019-10-28 | 2021-05-06 | セントラル硝子株式会社 | ケイ素化合物、反応性材料、樹脂組成物、感光性樹脂組成物、硬化膜、硬化膜の製造方法、パターン硬化膜およびパターン硬化膜の製造方法 |
| CN114585630A (zh) * | 2019-10-28 | 2022-06-03 | 中央硝子株式会社 | 硅化合物、反应性材料、树脂组合物、感光性树脂组合物、固化膜、固化膜的制造方法、图案固化膜及图案固化膜的制造方法 |
| US20230322818A1 (en) * | 2019-10-28 | 2023-10-12 | Central Glass Company, Limited | Silicon compound, reactive material, resin composition, photosensitive resin composition, cured film, method of manufacturing cured film, patterned cured film, and method of manufacturing patterned cured film |
| CN116457363A (zh) * | 2020-11-24 | 2023-07-18 | 中央硝子株式会社 | 含硅单体、混合物、聚硅氧烷和它们的制造方法 |
| WO2022131278A1 (ja) * | 2020-12-15 | 2022-06-23 | セントラル硝子株式会社 | 光学部材用の塗布液、重合体、硬化膜、感光性塗布液、パターン硬化膜、光学部材、固体撮像素子、表示装置、ポリシロキサン化合物、塗布液に用いる安定化剤、硬化膜の製造方法、パターン硬化膜の製造方法、及び重合体の製造方法 |
| CN116601244A (zh) * | 2020-12-15 | 2023-08-15 | 中央硝子株式会社 | 光学构件用涂布液、聚合物、固化膜、感光性涂布液、图案固化膜、光学构件、固体摄像元件、显示装置、聚硅氧烷化合物、涂布液中使用的稳定剂、固化膜的制造方法、图案固化膜的制造方法和聚合物的制造方法 |
| WO2022168735A1 (ja) * | 2021-02-05 | 2022-08-11 | セントラル硝子株式会社 | ヘキサフルオロイソプロパノール基を含むケイ素化合物、ケイ素化合物の製造方法、ポリシロキサン及びポリシロキサンの製造方法 |
| CN116802186A (zh) * | 2021-02-05 | 2023-09-22 | 中央硝子株式会社 | 包含六氟异丙醇基的硅化合物、硅化合物的制造方法、聚硅氧烷和聚硅氧烷的制造方法 |
| WO2022181350A1 (ja) * | 2021-02-24 | 2022-09-01 | 東レ株式会社 | 感光性樹脂組成物、硬化物、積層体、表示装置、および表示装置の製造方法 |
| JP2022159148A (ja) * | 2021-03-31 | 2022-10-17 | セントラル硝子株式会社 | ヘキサフルオロイソプロパノール基を含む医療用樹脂組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7510060B2 (ja) | 2024-07-03 |
| TWI877121B (zh) | 2025-03-21 |
| TW202033622A (zh) | 2020-09-16 |
| JPWO2020090746A1 (ja) | 2021-10-14 |
| US20210395461A1 (en) | 2021-12-23 |
| CN113166548A (zh) | 2021-07-23 |
| KR102593420B1 (ko) | 2023-10-25 |
| KR20210084595A (ko) | 2021-07-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7510060B2 (ja) | 樹脂組成物、感光性樹脂組成物、硬化膜、硬化膜の製造方法、パターン硬化膜およびパターン硬化膜の作製方法 | |
| JP6323225B2 (ja) | ポジ型感光性樹脂組成物、それを用いた膜の製造方法および電子部品 | |
| TWI393746B (zh) | 矽氧烷樹脂組成物及其製法 | |
| JPWO2011078106A1 (ja) | ポジ型感光性樹脂組成物、それから形成された硬化膜、および硬化膜を有する素子 | |
| TW201234107A (en) | Photosensitive resin composition, overcoat layer and electronic device using the same | |
| JP2013114238A (ja) | ポジ型感光性組成物、そのポジ型感光性組成物から形成された硬化膜、およびその硬化膜を有する素子。 | |
| JP7269503B2 (ja) | 珪素含有層形成組成物およびそれを用いたパターン付き基板の製造方法 | |
| JP2014119643A (ja) | ポジ型感光性樹脂組成物、それを用いた硬化パターンの製造方法、それから得られる凸パターン基板およびそれから得られる発光素子 | |
| JP2012053381A (ja) | ポジ型感光性組成物、それから形成された硬化膜、および硬化膜を有する素子 | |
| US20230244145A1 (en) | Silicon-containing monomer mixture, polysiloxane, resin composition, photosensitive resin composition, cured film, production method for cured film, patterned cured film, and production method for patterned cured film | |
| JPWO2022059506A5 (ja) | ||
| US20230037301A1 (en) | Negative photosensitive resin composition, pattern structure and method for producing patterned cured film | |
| US20230333468A1 (en) | Resin composition, cured film, method for manufacturing cured film, substrate having multilayer film, method for producing patterned substrate, photosensitive resin composition, method for producing pattern cured film, method for producing polymer, and method for producing resin composition | |
| JP6022870B2 (ja) | 感光性樹脂組成物 | |
| JPWO2021187324A5 (ja) | ||
| JP6186766B2 (ja) | 感光性シロキサン組成物、それから形成された硬化膜、およびその硬化膜を有する素子 | |
| JPWO2022131277A5 (ja) | ||
| JP7620218B2 (ja) | ケイ素化合物、反応性材料、樹脂組成物、感光性樹脂組成物、硬化膜、硬化膜の製造方法、パターン硬化膜およびパターン硬化膜の製造方法 | |
| JP2023057817A (ja) | シラン化合物、シロキサン化合物、その製造方法、及び、硬化性樹脂組成物 | |
| KR20230113808A (ko) | 광학 부재용의 도포액, 중합체, 경화막, 감광성 도포액,패턴 경화막, 광학 부재, 고체 촬상 소자, 표시 장치, 폴리실록산 화합물, 도포액에 이용하는 안정화제, 경화막의 제조 방법, 패턴 경화막의 제조 방법, 및 중합체의 제조 방법 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 19880436 Country of ref document: EP Kind code of ref document: A1 |
|
| ENP | Entry into the national phase |
Ref document number: 2020553896 Country of ref document: JP Kind code of ref document: A |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| ENP | Entry into the national phase |
Ref document number: 20217016485 Country of ref document: KR Kind code of ref document: A |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 19880436 Country of ref document: EP Kind code of ref document: A1 |