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WO2020065873A1 - Composition de résine pour encapsulation, dispositif à composant électronique et procédé de fabrication de dispositif à composant électronique - Google Patents

Composition de résine pour encapsulation, dispositif à composant électronique et procédé de fabrication de dispositif à composant électronique Download PDF

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Publication number
WO2020065873A1
WO2020065873A1 PCT/JP2018/036100 JP2018036100W WO2020065873A1 WO 2020065873 A1 WO2020065873 A1 WO 2020065873A1 JP 2018036100 W JP2018036100 W JP 2018036100W WO 2020065873 A1 WO2020065873 A1 WO 2020065873A1
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WIPO (PCT)
Prior art keywords
resin composition
sealing resin
electronic component
epoxy resin
component device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/JP2018/036100
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English (en)
Japanese (ja)
Inventor
徹 馬場
貴大 齋藤
格 山浦
実佳 田中
児玉　俊輔
勇磨 竹内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to PCT/JP2018/036100 priority Critical patent/WO2020065873A1/fr
Priority to CN202510225573.2A priority patent/CN120025658A/zh
Priority to JP2020547759A priority patent/JPWO2020065873A1/ja
Priority to CN201880098074.XA priority patent/CN112752795A/zh
Priority to CN202411608903.8A priority patent/CN119371775A/zh
Priority to TW108134688A priority patent/TWI816889B/zh
Publication of WO2020065873A1 publication Critical patent/WO2020065873A1/fr
Anticipated expiration legal-status Critical
Priority to JP2023017064A priority patent/JP7537540B2/ja
Priority to JP2024129178A priority patent/JP2024149696A/ja
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H10W74/10—
    • H10W74/40—
    • H10W76/05—
    • H10W76/47—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Definitions

  • the present invention relates to a sealing resin composition, an electronic component device, and a method for manufacturing an electronic component device.
  • the amount of transmission loss caused by heat conversion of radio waves transmitted for communication in a dielectric is expressed as the product of the frequency, the square root of the relative permittivity, and the dielectric loss tangent.
  • a transmission signal is likely to change into heat in proportion to the frequency. Therefore, in order to suppress transmission loss, a material of a communication member is required to have a lower dielectric property in a higher frequency band.
  • Patent Documents 1 and 2 disclose a thermosetting resin composition containing an active ester resin as a curing agent for an epoxy resin, and it is said that the dielectric loss tangent of a cured product can be suppressed.
  • the present disclosure relates to a sealing resin composition having an excellent narrow-path filling property and a low dielectric loss tangent of a cured product, an electronic component device sealed using the same, and manufacturing of an electronic component device sealed using the same. It is an object to provide a method.
  • a seal for use in narrow-path filling which contains an epoxy resin, a curing agent, and an inorganic filler, wherein the curing agent contains an active ester compound, and the inorganic filler has an average particle size of less than 10 ⁇ m.
  • Resin composition [2] The sealing resin composition according to [1], wherein the inorganic filler has a maximum particle size of less than 20 ⁇ m.
  • Electronic component device comprising: a cured product. [5] a step of arranging the element on a support member, and a step of filling a narrow path around the element with the sealing resin composition according to any one of [1] to [3].
  • Manufacturing method of electronic component device including:
  • a sealing resin composition having excellent narrow-path filling property and a low dielectric loss tangent of a cured product, an electronic component device sealed using the same, and an electronic component device sealed using the same Is provided.
  • FIG. 2 is a top view (partially transparent view) illustrating a test chip used in an example.
  • FIG. 3 is a cross-sectional view illustrating a test chip used in an example.
  • the term "step” includes, in addition to a step independent of other steps, even if the purpose of the step is achieved even if it cannot be clearly distinguished from the other steps, the step is also included.
  • the numerical ranges indicated by using “to” include the numerical values described before and after “to” as the minimum value and the maximum value, respectively.
  • the upper limit or lower limit described in one numerical range may be replaced with the upper limit or lower limit of the numerical range described in other stages.
  • the upper limit or the lower limit of the numerical range may be replaced with the value shown in the embodiment.
  • each component may include a plurality of corresponding substances.
  • the content or content of each component is, unless otherwise specified, the total content or content of the plurality of substances present in the composition. Means quantity.
  • a plurality of types of particles corresponding to each component may be included.
  • the particle size of each component means a value of a mixture of the plurality of types of particles present in the composition unless otherwise specified.
  • the sealing resin composition of the present disclosure contains an epoxy resin, a curing agent, and an inorganic filler, wherein the curing agent contains an active ester compound, and the average particle size of the inorganic filler is less than 10 ⁇ m. It is a sealing resin composition for road filling.
  • a narrow path in which the sealing resin composition of the present disclosure is used refers to a gap in which at least one of the height and the width is 100 ⁇ m or less.
  • Examples of the narrow path include a gap between the support member and the element, a gap between adjacent elements, and the like.
  • the sealing resin composition of the present disclosure is used for filling a narrow path included in an electronic component device, and is used for sealing a part of a space other than the narrow path in the electronic component device or an entire electronic component device. It may be a resin composition for use. Examples of the above embodiments include a sealing resin composition for a mold underfill (MUF) that seals an element disposed on a support member and fills a gap between the support member and the element; (System in a package).
  • UMF mold underfill
  • the active ester compound in the present disclosure refers to a compound having one or more ester groups in one molecule that reacts with an epoxy group, and has a curing action of an epoxy resin.
  • a phenol curing agent, an amine curing agent, and the like are generally used as a curing agent for an epoxy resin, but a secondary hydroxyl group is generated in a reaction between an epoxy resin and a phenol curing agent or an amine curing agent.
  • an ester group is generated instead of the secondary hydroxyl group. Since the ester group has a lower polarity than the secondary hydroxyl group, the sealing resin composition of the present disclosure is compared with a sealing resin composition containing only a curing agent that generates a secondary hydroxyl group as a curing agent. The dielectric loss tangent of the cured product can be kept low.
  • the sealing resin composition of the present disclosure is excellent in narrow-path filling property because the average particle diameter of the inorganic filler contained is less than 10 ⁇ m. This is presumed to be due to the fact that the inorganic filler is unlikely to close the narrow passage when the melt of the sealing resin composition flows through the narrow passage.
  • the lower limit of the average particle size of the inorganic filler is not particularly limited.
  • the thickness is preferably 3 ⁇ m or more from the viewpoint of suppressing aggregation between the inorganic fillers.
  • epoxy resin The type of the epoxy resin is not particularly limited as long as it has an epoxy group in the molecule.
  • the epoxy resin include at least one selected from the group consisting of phenol compounds such as phenol, cresol, xylenol, resorcin, catechol, bisphenol A and bisphenol F and naphthol compounds such as ⁇ -naphthol, ⁇ -naphthol and dihydroxynaphthalene.
  • Novolak epoxy resin (phenol novolak type) obtained by epoxidizing a novolak resin obtained by condensing or co-condensing a phenolic compound of a type with an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, propionaldehyde, etc. under an acidic catalyst.
  • the epoxy equivalent (molecular weight / number of epoxy groups) of the epoxy resin is not particularly limited. From the viewpoint of the balance of various properties such as moldability, reflow resistance and electrical reliability, it is preferably from 100 g / eq to 1000 g / eq, more preferably from 150 g / eq to 500 g / eq.
  • the epoxy equivalent of the epoxy resin is a value measured by a method according to JIS K7236: 2009.
  • the epoxy resin is a solid, its softening point or melting point is not particularly limited.
  • the temperature is preferably from 40 ° C. to 180 ° C. from the viewpoints of moldability and reflow resistance, and more preferably from 50 ° C. to 130 ° C. from the viewpoint of handleability in preparing the sealing resin composition.
  • the melting point or softening point of the epoxy resin is a value measured by a differential scanning calorimetry (DSC) or a method (ring and ball method) according to JIS K 7234: 1986.
  • the content of the epoxy resin in the encapsulating resin composition is preferably 0.5% by mass to 50% by mass, and more preferably 2% by mass to 30% by mass in view of strength, fluidity, heat resistance, moldability and the like. % Is more preferable.
  • the sealing resin composition of the present disclosure contains at least an active ester compound as a curing agent.
  • the sealing resin composition of the present disclosure may include a curing agent other than the active ester compound.
  • the sealing resin composition of the present disclosure can reduce the dielectric loss tangent of a cured product by using an active ester compound as a curing agent.
  • the polar group in the cured product enhances the water absorption of the cured product.
  • the concentration of the polar group in the cured product can be suppressed, and the water absorption of the cured product can be suppressed. it can.
  • the dielectric loss tangent of the cured product can be further reduced.
  • the water absorption of the cured product is preferably 0% to 0.35%, more preferably 0% to 0.30%, and still more preferably 0% to 0.25%.
  • the water absorption of the cured product is a mass increase rate determined by a pressure cooker test (121 ° C., 2.1 atm, 24 hours).
  • the type of the active ester compound is not particularly limited as long as it has at least one ester group in the molecule that reacts with the epoxy group.
  • Examples of the active ester compound include phenol ester compounds, thiophenol ester compounds, N-hydroxyamine ester compounds, and esterified products of heterocyclic hydroxy compounds.
  • the active ester compound examples include an ester compound obtained from at least one kind of aliphatic carboxylic acid and aromatic carboxylic acid and at least one kind of aliphatic hydroxy compound and aromatic hydroxy compound.
  • An ester compound containing an aliphatic compound as a component of polycondensation tends to have excellent compatibility with an epoxy resin due to having an aliphatic chain.
  • An ester compound containing an aromatic compound as a component of polycondensation tends to have excellent heat resistance due to having an aromatic ring.
  • the active ester compound examples include an aromatic ester obtained by a condensation reaction between an aromatic carboxylic acid and a phenolic hydroxyl group.
  • an aromatic carboxylic acid component in which 2 to 4 hydrogen atoms of an aromatic ring such as benzene, naphthalene, biphenyl, diphenylpropane, diphenylmethane, diphenyl ether, and diphenylsulfonic acid are substituted with a carboxy group
  • a mixture of an aromatic carboxylic acid and a phenolic hydroxyl group is obtained by using a mixture of a monohydric phenol in which one of the above is substituted with a hydroxyl group and a polyhydric phenol in which 2 to 4 of the hydrogen atoms of the aromatic ring are substituted with a hydroxyl group as a raw material.
  • Aromatic esters obtained by a condensation reaction are preferred. That is, an aromatic ester having a structural unit derived from the aromatic carboxylic acid component, a structural unit derived from the monohydric phenol, and a structural unit derived from the polyhydric phenol is preferable.
  • the active ester compound examples include a phenol resin having a molecular structure in which a phenol compound is knotted via an aliphatic cyclic hydrocarbon group, described in JP-A-2012-246467, and an aromatic dicarboxylic acid or An active ester resin having a structure obtained by reacting the halide with an aromatic monohydroxy compound is exemplified.
  • the active ester resin a compound represented by the following structural formula (1) is preferable.
  • R 1 is an alkyl group having 1 to 4 carbon atoms
  • X is a benzene ring, a naphthalene ring, a benzene ring or a naphthalene ring substituted with an alkyl group having 1 to 4 carbon atoms, or a biphenyl group
  • Y is a benzene ring, a naphthalene ring, or a benzene ring or a naphthalene ring substituted with an alkyl group having 1 to 4 carbon atoms
  • k is 0 or 1
  • n is an average of the number of repetitions. 25 to 1.5.
  • Specific examples of the compound represented by the structural formula (1) include, for example, the following exemplified compounds (1-1) to (1-10).
  • T-Bu in the structural formula is a tert-butyl group.
  • active ester compound examples include a compound represented by the following structural formula (2) and a compound represented by the following structural formula (3) described in JP-A-2014-114352. No.
  • R 1 and R 2 are each independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms
  • Z is a benzoyl group, a naphthoyl group
  • An ester-forming structural site (z1) selected from the group consisting of a benzoyl group or a naphthoyl group substituted with an alkyl group of Formulas 1 to 4, and an acyl group having 2 to 6 carbon atoms, or a hydrogen atom (z2); At least one is an ester forming structural site (z1).
  • R 1 and R 2 are each independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms
  • Z is a benzoyl group, a naphthoyl group
  • An ester-forming structural site (z1) selected from the group consisting of a benzoyl group or a naphthoyl group substituted with an alkyl group of Formulas 1 to 4, and an acyl group having 2 to 6 carbon atoms, or a hydrogen atom (z2); At least one is an ester forming structural site (z1).
  • Specific examples of the compound represented by the structural formula (2) include, for example, the following exemplified compounds (2-1) to (2-6).
  • Specific examples of the compound represented by the structural formula (3) include, for example, the following exemplified compounds (3-1) to (3-6).
  • active ester compound A commercial product may be used as the active ester compound.
  • Commercially available active ester compounds include "EXB9451”, “EXB9460”, “EXB9460S”, “HPC-8000-65T” (manufactured by DIC Corporation) as active ester compounds having a dicyclopentadiene-type diphenol structure; "EXB9416-70BK”, “EXB-8", “EXB-9425” (manufactured by DIC Corporation) as an active ester compound having a structure; “DC808” (Mitsubishi Chemical Corporation) as an active ester compound containing an acetylated product of phenol novolak "YLH1026” (manufactured by Mitsubishi Chemical Corporation) as an active ester compound containing benzoylated phenol novolak.
  • the active ester compound may be used alone or in combination of two or more.
  • the ester group equivalent of the active ester compound is not particularly limited. From the viewpoint of the balance of various characteristics such as moldability, reflow resistance, and electrical reliability, 150 g / eq to 400 g / eq is preferable, 170 g / eq to 300 g / eq is more preferable, and 200 g / eq to 250 g / eq is preferable. More preferred.
  • the ester group equivalent of the active ester compound is a value measured by a method according to JIS K 0070: 1992.
  • the equivalent ratio of the epoxy resin to the active ester compound is preferably 0.9 or more, more preferably 0.95 or more, and 0.97 or more, from the viewpoint of keeping the dielectric loss tangent of the cured product low. Is more preferred.
  • the equivalent ratio (ester group / epoxy group) between the epoxy resin and the active ester compound is preferably 1.1 or less, more preferably 1.05 or less, from the viewpoint of suppressing the unreacted component of the active ester compound. 03 or less is more preferable.
  • the curing agent may contain other curing agents other than the active ester compound.
  • the type of the other curing agent is not particularly limited, and can be selected according to the desired characteristics of the sealing resin composition.
  • Other curing agents include phenol curing agents, amine curing agents, acid anhydride curing agents, polymercaptan curing agents, polyaminoamide curing agents, isocyanate curing agents, and blocked isocyanate curing agents.
  • phenol curing agent examples include polyphenol compounds such as resorcin, catechol, bisphenol A, bisphenol F, and substituted or unsubstituted biphenol; phenol, cresol, xylenol, resorcin, catechol, bisphenol A, bisphenol F, and phenylphenol.
  • Phenolic compounds such as aminophenols, aminophenols and the like and at least one phenolic compound selected from the group consisting of naphthol compounds such as ⁇ -naphthol, ⁇ -naphthol and dihydroxynaphthalene, and aldehyde compounds such as formaldehyde, acetaldehyde and propionaldehyde
  • Novolak-type phenolic resin obtained by condensation or co-condensation under the following conditions: the above-mentioned phenolic compound, dimethoxyparaxylene, bis (methoxymethyl) biffe Phenol aralkyl resins such as phenol aralkyl resins, naphthol aralkyl resins, etc .; para-xylylene-modified phenol resins, meta-xylylene-modified phenol resins; melamine-modified phenol resins; terpene-modified phenol resins; A dicyclopentadiene-type phenol
  • the functional group equivalent of other curing agents is not particularly limited. From the viewpoint of the balance of various properties such as moldability, reflow resistance, and electrical reliability, it is preferably from 70 g / eq to 1000 g / eq, more preferably from 80 g / eq to 500 g / eq.
  • the temperature is preferably from 40 ° C. to 180 ° C., and from the viewpoint of handleability during the production of the sealing resin composition, it is more preferably from 50 ° C. to 130 ° C. .
  • the melting point or softening point of the curing agent is a value measured in the same manner as the melting point or softening point of the epoxy resin.
  • the number of functional groups is not particularly limited. From the viewpoint of minimizing the amount of each unreacted component, it is preferably set in the range of 0.5 to 2.0, and more preferably in the range of 0.6 to 1.3. From the viewpoint of moldability and reflow resistance, it is more preferable to set the ratio in the range of 0.8 to 1.2.
  • the content of the active ester compound with respect to the total mass of the active ester compound and other curing agents is preferably 80% by mass or more, more preferably 85% by mass or more, from the viewpoint of keeping the dielectric loss tangent of the cured product low. More preferably, it is 90% by mass or more.
  • the total content of the epoxy resin and the active ester compound with respect to the total mass of the epoxy resin, the active ester compound and the other curing agent is preferably 70% by mass or more, from the viewpoint of suppressing the dielectric loss tangent of the cured product to 80% by mass. %, More preferably at least 85% by mass.
  • the sealing resin composition may include a curing accelerator.
  • the type of the curing accelerator is not particularly limited, and can be selected according to the type of the epoxy resin or the curing agent, the desired characteristics of the sealing resin composition, and the like.
  • curing accelerator examples include diazabicycloalkenes such as 1,5-diazabicyclo [4.3.0] nonene-5 (DBN) and 1,8-diazabicyclo [5.4.0] undecene-7 (DBU); Cyclic amidine compounds such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-heptadecylimidazole; derivatives of the cyclic amidine compounds; phenol novolak salts of the cyclic amidine compounds or derivatives thereof; To maleic anhydride, 1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1 , 4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1 Quinone compounds such as 4-benzo
  • the amount is preferably from 0.1 to 30 parts by mass based on 100 parts by mass of the resin component (the total amount of the epoxy resin and the curing agent). And more preferably 1 to 15 parts by mass.
  • the amount of the curing accelerator is 0.1 parts by mass or more based on 100 parts by mass of the resin component, the curing tends to be performed well in a short time. If the amount of the curing accelerator is 30 parts by mass or less based on 100 parts by mass of the resin component, the curing rate tends to be too high and a good molded product tends to be obtained.
  • the average particle size of the included inorganic filler is less than 10 ⁇ m.
  • the average particle size of the inorganic filler is less than 10 ⁇ m, and preferably less than 9 ⁇ m, from the viewpoint of improving narrow-path filling property.
  • the average particle size of the inorganic filler is preferably 3 ⁇ m or more, more preferably 5 ⁇ m or more, from the viewpoint of suppressing aggregation between the inorganic fillers.
  • the maximum particle size of the included inorganic filler is preferably less than 30 ⁇ m, more preferably less than 25 ⁇ m, and more preferably 20 ⁇ m. More preferably, it is less than.
  • the average particle diameter of the inorganic filler in the image taken by a scanning electron microscope of a thin sample of the sealing resin composition or a cured product thereof, by measuring the major axis of 100 randomly selected inorganic fillers, It is the value obtained by arithmetically averaging it.
  • the maximum particle diameter of the inorganic filler is the maximum value among the above-mentioned 100 long diameters.
  • the type of the inorganic filler is not particularly limited. Specifically, inorganic materials such as fused silica, crystalline silica, glass, alumina, talc, clay, and mica are exemplified. An inorganic filler having a flame-retardant effect may be used. Examples of the inorganic filler having a flame-retardant effect include aluminum hydroxide, magnesium hydroxide, a composite metal hydroxide such as a composite hydroxide of magnesium and zinc, and zinc borate.
  • silica such as fused silica is preferred from the viewpoint of reducing the coefficient of linear expansion, and alumina is preferred from the viewpoint of high thermal conductivity.
  • One inorganic filler may be used alone, or two or more inorganic fillers may be used in combination. Examples of the form of the inorganic filler include powder, beads obtained by making the powder spherical, fibers, and the like.
  • the content of the inorganic filler contained in the sealing resin composition is not particularly limited. From the viewpoints of fluidity and strength, the content is preferably 30% by volume to 90% by volume, more preferably 35% by volume to 80% by volume, and more preferably 40% by volume to 70% by volume of the entire sealing resin composition. % Is more preferable.
  • the content of the inorganic filler is 30% by volume or more of the entire sealing resin composition, properties such as a thermal expansion coefficient, a thermal conductivity, and an elastic modulus of the cured product tend to be further improved.
  • the content of the inorganic filler is 90% by volume or less of the entire sealing resin composition, an increase in the viscosity of the sealing resin composition is suppressed, the flowability is further improved, and the moldability is more improved. Tend to be.
  • the sealing resin composition may contain various additives such as a coupling agent, an ion exchanger, a release agent, a flame retardant, and a coloring agent exemplified below, in addition to the above components.
  • the sealing resin composition may contain various additives known in the art as needed, in addition to the additives exemplified below.
  • the sealing resin composition may include a coupling agent.
  • the sealing resin composition preferably contains a coupling agent.
  • the coupling agent include known silane compounds such as epoxy silane, mercapto silane, amino silane, alkyl silane, ureido silane, vinyl silane, and disilazane, titanium compounds, aluminum chelate compounds, and aluminum / zirconium compounds. No.
  • the amount of the coupling agent is preferably 0.05 to 5 parts by mass, and more preferably 0.1 part by mass, based on 100 parts by mass of the inorganic filler. More preferably, it is 2.5 parts by mass.
  • the amount of the coupling agent is 0.05 parts by mass or more based on 100 parts by mass of the inorganic filler, the adhesiveness to the frame tends to be further improved.
  • the amount of the coupling agent is 5 parts by mass or less based on 100 parts by mass of the inorganic filler, the moldability of the package tends to be further improved.
  • the sealing resin composition may include an ion exchanger.
  • the sealing resin composition preferably contains an ion exchanger from the viewpoint of improving the moisture resistance and high-temperature storage characteristics of the electronic component device including the element to be sealed.
  • the ion exchanger is not particularly limited, and a conventionally known ion exchanger can be used. Specific examples include a hydrotalcite compound and a hydrated oxide of at least one element selected from the group consisting of magnesium, aluminum, titanium, zirconium and bismuth.
  • One type of ion exchanger may be used alone, or two or more types may be used in combination. Among them, hydrotalcite represented by the following general formula (A) is preferable.
  • the sealing resin composition contains an ion exchanger
  • its content is not particularly limited as long as it is an amount sufficient to capture ions such as halogen ions.
  • the amount is preferably from 0.1 to 30 parts by mass, more preferably from 1 to 10 parts by mass, per 100 parts by mass of the resin component (total amount of the epoxy resin and the curing agent).
  • the sealing resin composition may include a release agent from the viewpoint of obtaining good releasability from a mold during molding.
  • the release agent is not particularly limited, and a conventionally known release agent can be used. Specific examples include carnauba wax, higher fatty acids such as montanic acid and stearic acid, higher fatty acid metal salts, ester waxes such as montanic acid esters, and polyolefin waxes such as polyethylene oxide and non-oxidized polyethylene.
  • One type of release agent may be used alone, or two or more types may be used in combination.
  • the amount is preferably from 0.01 to 10 parts by mass, more preferably from 0.1 to 10 parts by mass, per 100 parts by mass of the resin component (total amount of the epoxy resin and the curing agent). More preferred is from 5 parts by mass to 5 parts by mass.
  • the amount of the release agent is 0.01 part by mass or more based on 100 parts by mass of the resin component, there is a tendency that sufficient releasability is obtained.
  • the amount is 10 parts by mass or less, better adhesiveness tends to be obtained.
  • the sealing resin composition may contain a flame retardant.
  • the flame retardant is not particularly limited, and a conventionally known one can be used. Specifically, an organic or inorganic compound containing a halogen atom, an antimony atom, a nitrogen atom or a phosphorus atom, a metal hydroxide and the like can be mentioned.
  • the flame retardants may be used alone or in combination of two or more.
  • the sealing resin composition contains a flame retardant
  • its amount is not particularly limited as long as it is an amount sufficient to obtain a desired flame retardant effect.
  • it is preferably from 1 to 30 parts by mass, more preferably from 2 to 20 parts by mass, based on 100 parts by mass of the resin component (total amount of the epoxy resin and the curing agent).
  • the sealing resin composition may include a coloring agent.
  • the coloring agent include known coloring agents such as carbon black, organic dyes, organic pigments, titanium oxide, lead red, and red iron oxide.
  • the content of the coloring agent can be appropriately selected according to the purpose and the like.
  • the colorant may be used alone or in combination of two or more.
  • the method for preparing the sealing resin composition is not particularly limited.
  • a general method there can be mentioned a method in which components of a predetermined compounding amount are sufficiently mixed by a mixer or the like, then melt-kneaded by a mixing roll, an extruder, or the like, cooled, and pulverized. More specifically, for example, a method of uniformly stirring and mixing predetermined amounts of the above-described components, kneading with a kneader, roll, extruder or the like which has been heated to 70 ° C. to 140 ° C., cooling, and pulverizing. Can be mentioned.
  • the sealing resin composition is preferably solid at normal temperature and normal pressure (for example, 25 ° C. and atmospheric pressure).
  • the shape when the sealing resin composition is a solid is not particularly limited, and examples thereof include powder, granules, and tablets.
  • the resin composition for sealing is in the form of a tablet, it is preferable from the viewpoint of handleability that the dimensions and the mass be such as to match the molding conditions of the package.
  • An electronic component device includes a support member, an element disposed on the support member, and a sealing resin composition of the present disclosure that fills a narrow path around the element. And a cured product.
  • the electronic component device has a narrow path filled with the sealing resin composition of the present disclosure.
  • the narrow path include a gap between the support member and the element, a gap between adjacent elements, and the like.
  • An electronic component device may be partially or entirely sealed with the sealing resin composition of the present disclosure except for a narrow path.
  • Electronic component devices include supporting members such as lead frames, wired tape carriers, wiring boards, glass, silicon wafers, and organic substrates, as well as active elements such as semiconductor chips, transistors, diodes, and thyristors, capacitors, and resistors.
  • a passive element such as a coil
  • a sealing resin composition More specifically, after fixing an element on a lead frame, connecting a terminal part of the element such as a bonding pad and a lead part by wire bonding, a bump or the like, and then performing transfer molding or the like using a sealing resin composition.
  • BGA Bit Grid Array
  • CSP Chip Size Package
  • MCP Multi Chip Package
  • the method for manufacturing an electronic component device includes a step of disposing an element on a support member and a step of filling a narrow path around the element with the sealing resin composition of the present disclosure.
  • the method of performing each of the above steps is not particularly limited, and can be performed by a general method. Further, the types of the support members and the elements used for manufacturing the electronic component device are not particularly limited, and the support members and the elements generally used for manufacturing the electronic component device can be used.
  • the step of filling a narrow path around the element with the sealing resin composition of the present disclosure is performed at the same time as filling the narrow path around the element, and a part of the space other than the narrow path in the electronic component device or the electronic component. It may be a step of sealing the entire device.
  • a low-pressure transfer molding method As a method of filling a narrow path around the element using the sealing resin composition of the present disclosure, a low-pressure transfer molding method, an injection molding method, a compression molding method and the like can be mentioned. Among these, the low pressure transfer molding method is common.
  • sealing resin composition ⁇ Preparation of sealing resin composition> The components shown below were mixed in the mixing ratios shown in Table 1 to prepare sealing resin compositions of Examples and Comparative Examples. This sealing resin composition was solid at normal temperature and normal pressure.
  • Epoxy resin 1 biphenyl aralkyl type epoxy resin, epoxy equivalent 274 g / eq (Nippon Kayaku Co., Ltd., product name "NC-3000”) -Epoxy resin 2: triphenylmethane type epoxy resin, epoxy equivalent 167 g / eq (Mitsubishi Chemical Corporation, product name "1032H60”)
  • Epoxy resin 3 Biphenyl type epoxy resin, epoxy equivalent 192 g / eq (Mitsubishi Chemical Corporation, product name "YX-4000”)
  • Active ester compound 1 DIC Corporation, product name “EXB-8”
  • Active ester compound 2 DIC Corporation, product name “EXB-9425”
  • Phenol curing agent 1 phenol aralkyl resin, hydroxyl equivalent 175 g / eq (Meiwa Kasei Co., Ltd., product name "MEH7800SS”)
  • Curing accelerator 1 triphenylphosphine / 1,4-benzoquinone adduct Curing accelerator 2: imidazole compound (Shikoku Chemicals Co., Ltd., product name "Curesol 2E4MZ”)
  • Filling material 1 Fused silica (DENKA, product name “FB-310MDC”) -Filler 2: fused silica (Micron, product name “ST7010-2") ⁇ Filling material 3: Fused silica (Admatex, product name “SO-25R”) Filler 4: Fused silica (DENKA, product name "FB-9454FC”) -Filler 5: fused silica (Micron, product name "ST7010-3")
  • Coupling agent 1 N-phenyl-3-aminopropyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd., product name "KBM-573")
  • Coupling agent 2 3-mercaptopropyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd., product name "KBM-803")
  • Release agent montanic acid ester wax (Clariant Japan K.K., product name “HW-E”)
  • Colorant carbon black (Mitsubishi Chemical Corporation, product name "MA600”)
  • ⁇ Performance evaluation of sealing resin composition> Average particle size and maximum particle size of inorganic filler
  • the major axis ( ⁇ m) of 100 randomly selected inorganic fillers was measured, and the arithmetic average was taken as the average particle diameter.
  • the maximum value of the 100 major diameters ( ⁇ m) was defined as the maximum particle diameter.
  • a test chip having the form shown in FIGS. 1 and 2 was prepared. That is, a die 3 (10 mm long ⁇ 10 mm long) obtained by dicing a silicon wafer on a substrate 1 (50 mm long ⁇ 250 mm wide ⁇ 0.2 mm thick) via a die attach tape 6 (1.0 mm wide and 40 ⁇ m thick). Three pieces (width 10 mm ⁇ thickness 250 ⁇ m) were arranged and pressed at 200 ° C. for 10 seconds. Next, the sealing resin composition was charged into a transfer molding machine, molded under the conditions of a mold temperature of 180 ° C., a molding pressure of 6.9 MPa, and a curing time of 150 seconds, and post-curing was performed at 180 ° C.
  • the dimensions of the molding were 50 mm long ⁇ 250 mm wide ⁇ 0.5 mm thick on the substrate 1.
  • the area of a void of 1 mm 2 or more visually observed between the die 3 and the substrate 1 was measured from the surface opposite to the device mounting surface, and the total area was determined.
  • the resin composition for sealing is charged into a vacuum hand press, and molded under the conditions of a mold temperature of 175 ° C., a molding pressure of 6.9 MPa, and a curing time of 600 seconds.
  • a product (length 12.5 mm, width 25 mm, thickness 0.2 mm) was obtained.
  • the relative dielectric constant and the dielectric loss tangent at about 60 GHz at a temperature of 25 ⁇ 3 ° C. were measured using a dielectric constant measuring apparatus (Agilent Technology, product name “Network Analyzer N5227A”). It was measured.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Wire Bonding (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

L'invention concerne une composition de résine pour encapsulation, laquelle est utilisée pour le remplissage de conduits étroits, et laquelle contient une résine époxyde, un agent durcissant et une matière de charge minérale, la charge minérale contenant un composé ester actif et la taille moyenne de grain de la matière de charge minérale étant inférieure à 10μm.
PCT/JP2018/036100 2018-09-27 2018-09-27 Composition de résine pour encapsulation, dispositif à composant électronique et procédé de fabrication de dispositif à composant électronique Ceased WO2020065873A1 (fr)

Priority Applications (8)

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PCT/JP2018/036100 WO2020065873A1 (fr) 2018-09-27 2018-09-27 Composition de résine pour encapsulation, dispositif à composant électronique et procédé de fabrication de dispositif à composant électronique
CN202510225573.2A CN120025658A (zh) 2018-09-27 2018-09-27 密封用树脂组合物、电子部件装置及电子部件装置的制造方法
JP2020547759A JPWO2020065873A1 (ja) 2018-09-27 2018-09-27 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
CN201880098074.XA CN112752795A (zh) 2018-09-27 2018-09-27 密封用树脂组合物、电子部件装置及电子部件装置的制造方法
CN202411608903.8A CN119371775A (zh) 2018-09-27 2018-09-27 密封用树脂组合物、电子部件装置及电子部件装置的制造方法
TW108134688A TWI816889B (zh) 2018-09-27 2019-09-25 密封用樹脂組成物、電子零件裝置及電子零件裝置的製造方法
JP2023017064A JP7537540B2 (ja) 2018-09-27 2023-02-07 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP2024129178A JP2024149696A (ja) 2018-09-27 2024-08-05 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法

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CN116806232A (zh) * 2021-01-08 2023-09-26 株式会社力森诺科 热硬化性树脂组合物及电子零件装置
KR20240034802A (ko) 2021-07-16 2024-03-14 스미또모 베이크라이트 가부시키가이샤 반도체 봉지용 수지 조성물 및 반도체 장치

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CN103328531B (zh) * 2011-01-28 2017-05-17 住友电木株式会社 密封用环氧树脂组合物和电子部件装置
JPWO2012157529A1 (ja) * 2011-05-13 2014-07-31 日立化成株式会社 封止用エポキシ樹脂成形材料及び電子部品装置
WO2013145608A1 (fr) 2012-03-29 2013-10-03 住友ベークライト株式会社 Composition de résine et dispositif à semi-conducteur
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JP2018058959A (ja) * 2016-10-03 2018-04-12 味の素株式会社 樹脂組成物
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CN116806232A (zh) * 2021-01-08 2023-09-26 株式会社力森诺科 热硬化性树脂组合物及电子零件装置
KR20240034802A (ko) 2021-07-16 2024-03-14 스미또모 베이크라이트 가부시키가이샤 반도체 봉지용 수지 조성물 및 반도체 장치

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JPWO2020065873A1 (ja) 2021-08-30
TWI816889B (zh) 2023-10-01
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CN120025658A (zh) 2025-05-23
JP2023059892A (ja) 2023-04-27

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