[go: up one dir, main page]

WO2019219163A1 - Dispositif de nettoyage permettant d'attirer des particules dans un système de traitement de substrat, système de traitement permettant de traiter un substrat, et procédé de fonctionnement d'un dispositif de nettoyage - Google Patents

Dispositif de nettoyage permettant d'attirer des particules dans un système de traitement de substrat, système de traitement permettant de traiter un substrat, et procédé de fonctionnement d'un dispositif de nettoyage Download PDF

Info

Publication number
WO2019219163A1
WO2019219163A1 PCT/EP2018/062370 EP2018062370W WO2019219163A1 WO 2019219163 A1 WO2019219163 A1 WO 2019219163A1 EP 2018062370 W EP2018062370 W EP 2018062370W WO 2019219163 A1 WO2019219163 A1 WO 2019219163A1
Authority
WO
WIPO (PCT)
Prior art keywords
cleaning device
processing system
particles
substrate
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2018/062370
Other languages
English (en)
Inventor
Simon Lau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to PCT/EP2018/062370 priority Critical patent/WO2019219163A1/fr
Publication of WO2019219163A1 publication Critical patent/WO2019219163A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10P72/0406—
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4407—Cleaning of reactor or reactor parts by using wet or mechanical methods

Definitions

  • Embodiments of the present disclosure relate to a cleaning device for attracting particles in a substrate processing system, a processing system for processing a substrate, and a method of operation of a cleaning device.
  • Embodiments of the present disclosure particularly relate to a cleaning device for attracting particles for improving cleanliness in a substrate processing system.
  • Coated substrates may be used in several applications and in several technical fields.
  • substrates for displays can be coated by a PVD process, including substrates for high-density displays.
  • Some applications include insulating panels, substrates with TFTs, color filters or the like.
  • a coated substrate, such as a substrate for a display may include one or more layers of a material situated between two electrodes that are all deposited on a substrate.
  • the present disclosure particularly aims at providing an electrostatic surface for efficiently attracting particles in a vacuum processing system.
  • a cleaning device for attracting particles in a substrate processing system comprises a support base, a first electrode assembly supported by the support base at a first surface, and a first insulating element provided over the first electrode assembly.
  • a processing system for processing a substrate includes a vacuum chamber and the cleaning device of the first aspect, wherein the cleaning device is configured to be transported through the vacuum chamber.
  • a method of operation of a cleaning device for attracting particles in a substrate processing system comprises providing the cleaning device according to the first aspect in a substrate processing system comprising at least one vacuum chamber, and applying a voltage to a first electrode assembly of the cleaning device to generate an electrostatic field to have particles adhere to the cleaning device.
  • Embodiments are also directed at apparatuses for carrying out the disclosed method and include apparatus parts for performing each described method aspect. These method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments according to the disclosure are also directed at methods for operating the described apparatus. The methods for operating the described apparatus include method aspects for carrying out every function of the apparatus.
  • FIG. 1 shows a cross-sectional side view of a cleaning device according to embodiments described herein;
  • FIG. 2 shows a schematic view of an electrode arrangement according to embodiments described herein;
  • FIG. 3 shows a schematic view of an electrode arrangement according to further embodiments described herein;
  • FIG. 4 shows a cross-sectional side view of a two-sided cleaning device according to embodiments described herein;
  • FIG. 5A and 5B show schematic views of a transport arrangement for transporting a cleaning device in a processing system according to embodiments described herein;
  • FIG 6 shows a schematic view of a processing system for processing a substrate according to embodiments described herein.
  • FIG. 7 shows a flow chart of a method of operating a cleaning device according to embodiments described herein; DETAILED DESCRIPTION OF EMBODIMENTS
  • Carriers can be used in a processing system, such as a vacuum deposition system, for holding and transporting substrates within a vacuum chamber of the processing system.
  • a processing system such as a vacuum deposition system
  • one or more material layers can be deposited on the substrate while the substrate is supported by the carrier.
  • a high purity and uniformity of the material layers deposited on the substrate is beneficial.
  • the movement of carriers through a processing system, the processing of substrates mounted on carriers, and the operation of various components of the processing system may generate particles.
  • Particles may be produced by frictional movement of components in the processing system, by the deposition processes used for depositing layers of material on substrates, or introduced into the processing system during substrate loading and unloading, among others.
  • Particles inside the processing system may be agitated and may become airborne, for example during venting of vacuum chambers of the processing system.
  • Airborne particles may be attracted to the surfaces of the substrate during transport and/or deposition.
  • the presence of particles on the surface of a substrate can introduce defects and non-uniformities in the layers of material deposited on the substrate, resulting in reduced quality of the deposited layers.
  • carriers may comprise an electrostatic chuck for holding the substrate during transport and deposition, which may attract even more particles to the surface of the substrate. Therefore, a device for removing airborne particles from inside a processing system is beneficial.
  • a cleaning device for attracting particles includes a support base, a first electrode assembly supported by the support base at a first surface, and a first insulating element provided over the first electrode assembly.
  • the support base includes a rigid member providing support for the components disposed thereon.
  • First electrode assembly may comprise a plurality of electrodes, arranged to generate an electrostatic charge on at least a surface of the first insulating element.
  • the electrostatic charge on at least a surface of the first insulating element attracts particles towards itself, so that particles are collected and held to at least a surface of the first insulating element. Accordingly, the cleaning device attracts and collects particles so that the number of airborne particles inside the processing system may be reduced.
  • FIG. 1 shows a schematic view of a cleaning device 100 for attracting particles with a voltage polarity configuration according to embodiments described herein.
  • the voltage polarity configurations illustrated in FIG. 1 can be provided by, for example, the first electrode assembly illustrated in FIGs. 2 and 4.
  • the cleaning device 100 includes a support base 110, a first insulating element 140 with a particle collecting surface 141, an electrode arrangement 120 having a plurality of electrodes 122 configured to provide an attracting force for attracting particles to the particle collecting surface 141, and a controller 130.
  • the controller 130 is configured to apply a first voltage polarity configuration to electrode arrangement 120.
  • the controller 130 is configured to switch at least between the first voltage polarity configuration and the second voltage polarity configuration.
  • the plurality of electrodes 122 of the electrode arrangement 120 can be embedded in the first insulating element 140, or can be provided, e.g., placed, on the support base 110 or on the first insulating element 140.
  • the first insulating element 140 and/or the support base 110 may include a dielectric body, such as a dielectric plate.
  • the dielectric body can be fabricated from a dielectric material, preferably a high thermal conductivity dielectric material such as pyrolytic boron nitride, aluminum nitride, silicon nitride, alumina or an equivalent material, but may be made from such materials as polyimide.
  • the plurality of electrodes 122 such as a grid of fine metal strips, can be placed on the dielectric plate and covered with a thin dielectric layer.
  • the cleaning device 100 includes one or more voltage sources configured to apply one or more voltages to the plurality of electrodes 122.
  • the one or more voltage sources are configured to ground at least some electrodes of the plurality of electrodes 122.
  • the one or more voltage sources can be configured to apply a first voltage having a first polarity, a second voltage having a second polarity, and/or ground to the plurality of electrodes 122.
  • each electrode, every second electrode, every third electrode or every fourth electrode of the plurality of electrodes can be connected to a separate voltage source.
  • the controller 130 can be configured to control the one or more voltage sources for applying the one or more voltages and/or ground to the electrode arrangement 120.
  • the controller 130 can be integrated into the one or more voltage sources, or vice versa.
  • the controller 130 can be provided as a separate entity connected to the one or more voltage sources, for example, via a cable connection and/or a wireless connection.
  • the term“polarity” refers to an electric polarity, i.e., negative (-) and positive (+).
  • the first polarity can be the negative polarity and the second polarity can be the positive polarity, or the first polarity can be the positive polarity and the second polarity can be the negative polarity.
  • the term “voltage polarity configuration” refers to polarities of voltages applied to the first electrode assembly 120, and particularly to the plurality of electrodes 122. In other words, the voltage polarity configuration means that a positive and/or a negative polarity is applied to at least one electrode of the plurality of electrodes 122.
  • one or more electrodes of the plurality of electrodes 122 can be grounded. As long as at least one electrode of the plurality of electrodes 122 is provided with a positive or negative polarity to provide the attracting force, the first electrode assembly 120 has a defined voltage polarity configuration, such as the first voltage polarity configuration and the second voltage polarity configuration. If all electrodes of the plurality of electrodes are grounded, no voltage polarity configuration exists because there is no positive and/or negative polarity and thus no attracting force is exerted.
  • the plurality of electrodes 122 may have a spatial arrangement in the cleaning device 100, for example, the first insulating element 140. Accordingly, a spatial arrangement of the polarities may correspond to the spatial arrangement of the electrodes to which a voltage is applied.
  • the term“voltage polarity configuration” may also be understood in the sense that polarities are spatially distributed, for example, across the particle collection surface 141.
  • the first electrode assembly 120 and particularly the plurality of electrodes 122, are configured to provide the attracting force.
  • the attracting force can be an electrostatic force provided by the voltages applied to the plurality of electrodes 122, and particularly by the voltage polarity configuration.
  • a magnitude of the attracting force may be determined by the voltage polarity configuration and a voltage level.
  • the attracting force can be changed by altering the voltage polarity configuration and/or by altering the voltage level.
  • the voltage polarity configuration can be selected from the group consisting of unipolar and bipolar.
  • the unipolar configuration includes polarities of only one kind, i.e., either the first polarity or the second polarity, and optionally includes one or more grounded electrodes.
  • the bipolar configuration includes both kinds of polarities, i.e., the first polarity and the second polarity, and optionally includes one or more grounded electrodes.
  • the electrode arrangement 120 is shown with a voltage polarity configuration. Dashed squares indicate electrodes having e.g. the first polarity and open squares indicate electrodes having e.g. the second polarity.
  • the voltage polarity configuration provides a respective attracting force for attracting particles to the particle collection surface 141.
  • the plurality of electrodes 122 has alternating polarities in the voltage polarity configuration. In other words, adjacent electrodes have opposite polarities (e.g., H— I— h -).
  • the voltage polarity configuration is not limited as such.
  • the electrodes of each pair may have the same polarity, wherein adjacent pairs have different (alternating) polarities. In other words, adjacent pairs may have opposite polarities (e.g., + H - h +).
  • the cleaning device 100 is oriented in a substantially vertical orientation (with respect to the vertical direction 1), and in particular during transportation through a processing system.
  • substantially vertical is understood particularly when referring to the substrate orientation of the processing system, to allow for a deviation from the vertical direction or orientation of ⁇ 20° or below, e.g. of ⁇ 10° or below.
  • the orientation of the cleaning device 100, e.g., during the transportation through a processing system, is considered substantially vertical, which is considered different from the horizontal substrate orientation, which may be considered as horizontal ⁇ 20° or below.
  • the term“vertical direction” or“vertical orientation” is understood to distinguish over“horizontal direction” or“horizontal orientation”. That is, the“vertical direction” or “vertical orientation” relates to a substantially vertical orientation e.g. of the cleaning device 100, wherein a deviation of a few degrees, e.g. up to 10° or even up to 15°, from an exact vertical direction or vertical orientation is still considered as a“substantially vertical direction” or a “substantially vertical orientation”.
  • the vertical direction can be substantially parallel to the force of gravity.
  • First electrode assembly may include a plurality of electrodes arranged in an electrode arrangement.
  • FIGS. 2 to 4 three possible electrode arrangements for the plurality of electrodes of first electrode assembly are discussed.
  • FIG. 2 shows a schematic view of a first electrode assembly 220 according to embodiments described herein.
  • the plurality of electrodes 222 are arranged as a grid.
  • the plurality of electrodes 222 can be wires, lines or strips of a conductive material.
  • the conductive material can be selected from the group consisting of a metal, copper, aluminum, and any combination thereof.
  • the plurality of electrodes 222 can extend essentially parallel to each other in a first direction.
  • the first direction can correspond to a length extension of the wires, lines or strips.
  • the plurality of electrodes 222 can be spaced apart from each other in a second direction perpendicular to the first direction.
  • the distance between adjacent electrodes of the plurality of electrodes 222 in the second direction may be between 0.1 mm and 5 mm, specifically between 0.1 and 2 mm, and more specifically between 0.5 and 1 mm.
  • the controller is configured to selectively and/or individually apply at least one of the first voltage having the first polarity, the second voltage having the second polarity, and ground to the plurality of electrodes 222.
  • the cleaning device 100 can include a voltage source assembly 224 including one or more voltage sources configured to selectively and/or individually apply at least one of the first voltage having the first polarity, the second voltage having the second polarity, and ground to the plurality of electrodes 222.
  • each electrode of the plurality of electrodes 222 can be connected to a respective voltage source.
  • two or more electrodes of the plurality of electrodes 222 can be connected to the same voltage source.
  • every fourth electrode of the plurality of electrodes 222 can be connected to the same voltage source.
  • the voltage source assembly 224 can be configured to provide e.g. the voltage polarity configuration and as illustrated in FIG. 1.
  • FIG. 3 shows a schematic view of an electrode arrangement 320 according to further embodiments described herein.
  • the electrode arrangement 320 can be referred to as “single grid”.
  • the plurality of electrodes includes one or more first electrodes 322 and one or more second electrodes 324.
  • the one or more first electrodes 322 can form a first grid and/or a first electrode pattern.
  • the one or more second electrodes 324 can form a second grid and/or a second electrode pattern.
  • the plurality of electrodes can extend essentially parallel to each other in a first direction.
  • the first direction can correspond to a length extension of the electrodes, such as wires, lines or strips.
  • the one or more first electrodes 322 can be spaced apart from each other by a first distance in a second direction perpendicular to the first direction.
  • the one or more second electrodes 324 can be spaced apart from each other by a second distance in the second direction.
  • the first distance and the second distance can be essentially identical.
  • the first distance and/or the second distance can be between 0.1 mm and 5 mm, specifically between 0.1 and 2 mm, and more specifically between 0.5 and 1 mm.
  • the one or more first electrodes 322 and the one or more second electrodes 324 are alternately arranged.
  • the one or more first electrodes 322 and the one or more second electrodes 324 can be provided in an interleaved arrangement, as it is illustrated in FIG. 3.
  • an electrode of the one or more first electrodes 322 can be provided between two adjacent electrodes of the one or more second electrodes 324.
  • an electrode of the one or more second electrodes 324 can be provided between two adjacent electrodes of the one or more first electrodes 322.
  • a distance between an electrode of the one or more first electrodes 322 and an adjacent electrode of the one or more second electrodes 324 can be half the first distance and/or the second distance.
  • an electrode of the one or more first electrodes 322 can be provided at a center between two adjacent electrodes of the one or more second electrodes 324.
  • an electrode of the one or more second electrodes 324 can be provided at a center between two adjacent electrodes of the one or more first electrodes 322.
  • an electrode spacing (also referred to as“line spacing”) of the electrode arrangement 320 can be half the electrode spacing of the one or more first electrodes 322 and/or the one or more second electrodes 324.
  • the controller can be configured to apply the first voltage having the first polarity, the second voltage having the second polarity, and ground to the one or more first electrodes 322 and the one or more second electrodes 324.
  • the one or more first electrodes 322 can be connected to a first voltage source to apply the first voltage having the first polarity, the second voltage having the second polarity, or ground to the one or more first electrodes 322.
  • the one or more second electrodes 324 can be connected to a second voltage source to apply the first voltage having the first polarity, the second voltage having the second polarity, or ground to the one or more second electrodes 324.
  • the one or more first electrodes 322 and the one or more second electrodes 324 can be electrically insulated from each other.
  • the size of the cleaning device 100, 400 can be configured to be approximately the same size as a substrate carrier used in the processing system. Since substrate carriers including electrostatic chucks for retaining substrates can be manufactured in a similar way to the cleaning device 100, 400, sizing the cleaning device 100, 400 to be approximately the same size as a substrate carrier allows for the same or similar tooling to be used for manufacturing the cleaning device 100, 400, which reduces the cost of ownership. Further, additional components used in a substrate carrier, for example, components related to the contactless levitation or transport device, can be adapted for use in the cleaning device 100, 400. These features allow for reduced cost of manufacture and ownership.
  • the embodiments described herein can be utilized for processing systems for large area substrates, e.g., for display manufacturing.
  • the processing systems for which the structures and methods according to embodiments described herein are provided are for processing large area substrates having, for example, an area of 1 m or larger.
  • a large area substrate can be GEN 5, which corresponds to a surface area of about 1.4 m 2 (1.1 m x 1.3 m), GEN 7.5, which corresponds to a surface area of about 4.29 m 2 (1.95 m x 2.2 m), GEN 8.5, which corresponds to a surface area of about 5.7m 2 (2.2 m x 2.5 m), or even GEN 10, which corresponds to a surface area of about 8.7 m 2 (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding surface areas can similarly be implemented.
  • Configuring the size of the cleaning device 100, 400 to be approximately the same size as a substrate carrier allows for logistical handling of the cleaning device 100, 400 in a similar fashion as for a substrate carrier. Similar sizes allow for the cleaning device 100, 400 to be provided in a processing system in the same manner as for a substrate carrier. Processes such as cleaning, storing, inserting into the processing system and removal from the processing system can be performed in a similar manner for the cleaning device 100, 400 and a substrate carrier, which reduces costs associated with operating the processing system.
  • the cleaning device 100, 400 can be configured to be a different size as the substrate carrier used in the processing system.
  • the cleaning device 100, 400 can be configured to be as large as the processing system allows. Configuring the cleaning device 100, 400 to be as large as possible increases the effectiveness of attracting particles and binding particles to the particle collection surface 141.
  • the cleaning device 100 includes a housing 150 accommodating one or more electronic devices.
  • the housing 150 may include an enclosure or a recess surrounding a space.
  • the housing 150 may be sealable.
  • the housing 150 contains a gaseous environment even if the cleaning device 100 is located inside the vacuum chamber, i.e., in a vacuum environment.
  • the one or more electronic devices may include the controller 130, at least a voltage source, or a controller for autonomous movement of the cleaning device 100.
  • the cleaning device 100 of the present disclosure may be an autonomous entity that is not mechanically or electrically connected e.g. via wires or cables to the surroundings, for example, to the processing system.
  • the cleaning device 100 may include a wireless communications device for communicating with a control system of the processing system.
  • the atmosphere inside the processing system is not compromised because the housing 150, having the gaseous environment, is sealed. Moreover, the atmosphere inside the processing system can even be improved because there is no need to establish atmosphere conditions in a challenging region, i.e., the region having the one or more electronic components. Such regions may be problematic due to, for example, the mean free path of the atmosphere in the region reaching a critical value during an evacuation process, which may cause a short circuit event. Further, by keeping the housing 150 vacuum-tight closed, an outgassing of the one or more electronic devices, e.g. a failed capacitor, does not affect the vacuum environment inside the vacuum chamber.
  • the housing 150 provides protection for the electronic devices accommodated therein from processing gases, deposition of material in deposition processes, or accumulation of particles.
  • vacuum as used throughout the present disclosure can be understood in the sense of a technical vacuum having a vacuum pressure of less than, for example, 10 mbar.
  • the pressure in the vacuum chamber may be between 10 -5 mbar and about 10 -8 mbar, specifically between 10 -5 mbar and 10 -7 mbar, and more specifically between about 10 6 mbar and about 10 7 mbar.
  • One or more vacuum pumps, such as turbo pumps and/or cryo-pumps, connected to the vacuum chamber for generation of the vacuum inside the vacuum chamber can be provided.
  • a gas pressure of the gaseous environment i.e., the pressure inside the housing 150
  • the gas pressure of the gaseous environment is 10 mbar or more, specifically 10 -5 mbar or more, specifically 10 -3 mbar or more, specifically 1 mbar or more, specifically 10 mbar or more, and more specifically 100 mbar or more.
  • the gas pressure of the gaseous environment is approximately ambient pressure, i.e., approximately 1 bar at l5°C. It is to be understood that the gas pressure inside the housing can vary over time, e.g. due to elevated temperatures at various stages in the processing system.
  • the housing or enclosure can be provided by a recess in the support base 110 of the cleaning device.
  • the housing 150 can be provided as a separate element, such as a box, that is attached to (or mounted on) the cleaning device 100.
  • the housing 150 can be referred to as an“atmosphere box” or an“atmospheric box”.
  • the housing 150, and particularly the space enclosed by the housing 150 can have a volume of lcm 3 or more, specifically lOcm 3 or more, specifically 50cm 3 or more, specifically lOOcm 3 or more, and more specifically 200cm 3 or more.
  • the housing 150 may be openable e.g. for maintenance and/or replacement of the one or more electronic devices.
  • the housing 150 can be opened when the cleaning device 100 is outside the processing system, e.g., for maintenance or repair.
  • the housing 150 can be closed to seal the gas inside the housing.
  • one or more sealing devices can be provided to seal the housing 150.
  • the one or more sealing devices may be arranged between the housing 150 and the support base 110, or between the housing 150 and a housing lid.
  • the one or more sealing devices can for instance be O-rings or a copper sealing.
  • the one or more sealing devices can be configured to seal the housing 150 substantially air-tight or vacuum tight.
  • the one or more electronic devices can be selected from the group including a first control device for controlling a movement of the cleaning device 100, 400, a second control device for controlling one or more operation parameters of the cleaning device 100, 400, a wireless communication device, a pressure sensor, and a voltage source.
  • the voltage source can be a battery or battery system.
  • the first control device for controlling a movement of the cleaning device 100 can be configured to control the movement of the cleaning device 100 through the processing chamber, and in particular along a transportation path, such as the linear transportation path.
  • the second control device can be configured to control the electrostatic field generated by the cleaning device 100.
  • the one or more operation parameters can include, but are not limited to, a voltage applied to the at least one electrode.
  • the cleaning device 100 can be considered a“smart cleaning device”.
  • the one or more electronic devices can be configured to e.g. measure leakage current of the cleaning device 100, and/or to measure a failure of the battery.
  • the pressure sensor can be configured to measure a gas pressure inside the housing 150, particularly during the use of the cleaning device 100 in the processing system.
  • the pressure sensor can measure the gas pressure continuously or in predetermined time intervals.
  • the measured gas pressure can be transmitted to a monitoring device located remote from the cleaning device 100. As an example, if the pressure sensor determines a pressure drop in the housing 150 while the cleaning device 100 is in the processing environment provided by the processing chamber, it may be concluded that gas from the housing 150 may have leaked into the processing environment, and proper measures may be taken.
  • the wireless communication device can be configured to provide a wireless communication between the one or more electronic devices of the autonomous cleaning device 100 and its surroundings.
  • a wireless connection allows for particle generation inside the vacuum chamber e.g. due to movement of the cleaning device 100 to be reduced or even avoided.
  • the wireless communication device can include a wireless transmitter configured to transmit the gas pressure measured by the pressure sensor to the monitoring device.
  • the wireless communication device can include a wireless receiver configured to receive data, such as control commands, for controlling e.g. the movement, and/or the operation parameters of the cleaning device 100.
  • the power source included in the housing 150 can be a power source for the one or more electronic devices.
  • the power source can be a power source of the cleaning device 100 that is used to generate the electrostatic force for attracting particles.
  • the power source can provide power for operating the pressure sensor and/or the wireless communication device.
  • the power source can be a battery or battery system.
  • the cleaning device 400 can include a second electrode assembly 420’ including at least one second electrode 422’, wherein the second electrode assembly 420’ is supported by the support base 110 at a second surface opposite the first surface, and a second insulating element 440’ provided over the second electrode assembly 420’, wherein the second surface of the support base 110 is opposite the first surface of the support base 110.
  • the cleaning device 400 is a two-sided version of the cleaning device 100 as exemplarily shown in FIG. 1. This feature allows for a greater surface area of the cleaning device 400 for attracting and binding particles thereto, increasing the effectiveness of the cleaning device 400.
  • the second insulating element 440’ and second electrode assembly 420’ may be identical to the first insulating element 440 and first electrode assembly 420, respectively.
  • the first and second insulating elements 440, 440’ and first and second electrode assemblies 420, 420’ may be modular components. The modularity of these elements allows for lower manufacturing and maintenance costs.
  • the second insulating element 440’ and second electrode assembly 420’ may be different to the first insulating element 440 and first electrode assembly 420, respectively.
  • the second insulating element 440’ can comprise a different material to the first insulating element 440, and/or the second insulating element 440’ can have different dimensions to the first insulating element 440.
  • Different first and second insulating elements 440, 440’ and first and second electrode assemblies 420, 420’ can allow for different operational performance on each side of the cleaning device 100.
  • a heat source in a processing chamber may be positioned on one side of the processing chamber, and the cleaning device 400 may have a second insulating element 440’ which has a higher thermal resistance to the first insulating element 440.
  • the cleaning device 100, 400 may be configured for being transported along a transport arrangement 500 in a processing system.
  • the transport arrangement 500 may be arranged in the vacuum chamber of the processing system.
  • the vacuum chamber may be a vacuum deposition chamber.
  • the cleaning device 100, 400 can be configured for transportation through the processing system along a transportation path, such as a linear transportation path.
  • the cleaning device 100, 400 can be configured for transportation in a transport direction 2, which can be a horizontal direction.
  • FIGs. 5A and B exemplarily illustrate a transportation of the cleaning device using a mechanical contact between the cleaning device and the tracks of the transport arrangement 500.
  • the present disclosure is not limited thereto, and the cleaning device 100, 400 can be configured for contactless levitation and/or contactless transportation in the processing system using for instance magnetic forces.
  • the transport arrangement can be configured for contactless levitation of the carrier and/or contactless transportation of the carrier in the vacuum chamber.
  • the transport arrangement 500 for transportation of the cleaning device 100, 400 includes at least one track device, such as a first track device 510 and a second track device 520.
  • the first track device 510 and the second track device 520 can extend essentially parallel to each other in the transport direction 2, which may be an essentially horizontal direction.
  • the first track device 510 can be a lower track configured to support a lower portion of the cleaning device 100, 400, such as a first contact element 560 which may be provided at a first or lower end of the cleaning device 100, 400.
  • the second track device 520 can be an upper track configured to support and/or guide an upper portion of the cleaning device 100, 400, such as a second contact and/or guide element 550 which may be provided at a second or upper end of the cleaning device 100, 400.
  • the first contact element 560 and second contact and/or guide element 550 can be a rod that is connected to support base 110 of the cleaning device 100, 400.
  • the first contact element 560 and second contact and/or guide element 550 may also be integrally formed with the support base 110 of the cleaning device 100, 400.
  • the transport arrangement 500 may include a drive structure.
  • the drive structure can include the first track device 510.
  • the drive structure, and in particular the first track device 510 can include a plurality of rollers 530 rotatable around a rotational axis A.
  • the rotational axis A can be an essentially horizontal rotational axis.
  • the plurality of rollers 530 can be arranged along the transport direction 2.
  • the plurality of rollers 530 can contact and support the first contact element 560.
  • the plurality of rollers 530 can be actively driven by one or more motors to rotate around the rotational axis A for transportation of the cleaning device 100, 400 in the transport direction 2.
  • the plurality of rollers may have a cylindrical shape or a conical shape.
  • the plurality of rollers may have a groove shape, a vee shape or a step shape such that the groove, vee or step of the roller engages with the first and/or second contact elements 550, 560 of the cleaning device 100, 400.
  • the transport arrangement may be configured such that the plurality of rollers are provided on the cleaning device 100, 400.
  • the plurality of rollers include at least one active roller such that the cleaning device 100, 400 transports itself through the processing system.
  • the transport arrangement 500 can include a guiding structure extending in the transport direction 2, which can be a horizontal direction.
  • the guiding structure can include the second track device 520.
  • the cleaning device 100, 400 can be movable along the guiding structure.
  • the guiding structure can guide the movement of the cleaning device 100, 400 at the upper end of the cleaning device 100, 400 such that the cleaning device 100, 400 maintains the essentially vertical orientation.
  • the cleaning device 100, 400 may be configured for at least one of contactless levitation and contactless transportation in a processing system.
  • the transport arrangement 500 may be a contactless transport system for contactless transportation of the cleaning device 100, 400.
  • Guide element 550 of cleaning device 100, 400 may be configured to magnetically interact with a guiding structure of the transport arrangement 500 for providing a magnetic levitation force for levitating the cleaning device 100, 400.
  • guide element 550 of cleaning device 100, 400 can include a first passive magnetic element.
  • the first passive magnetic element can be a rod of a ferromagnetic material that is connected to support base 110 of the cleaning device 100, 400.
  • the rod or the first passive magnetic element, respectively, may also be integrally formed with the support base 110 of the cleaning device 100, 400.
  • Guiding structure can include a plurality of active magnetic units.
  • the cleaning device 100, 400 can be movable along the guiding structure.
  • the guide element 550 comprising the first passive magnetic element, e.g. a bar of ferromagnetic material, and the plurality of active magnetic units of the guiding structure can be configured for providing a first magnetic levitation force for levitating the cleaning device 100, 400.
  • the drive structure, including first track device 510 can include a plurality of further magnet units, such as further active magnetic units.
  • the cleaning device can include a second guide element comprising a second passive magnetic element configured to magnetically interact with the drive structure of the transport arrangement 500.
  • the cleaning device can include the second passive magnet element, e.g. a bar of ferromagnetic material to interact with the further active magnetic units of the drive structure.
  • a passive magnetic element may refer to an element with magnetic properties, which are not subject to active control or adjustment, at least not during operation of the transport arrangement 500.
  • the magnetic properties of a passive magnetic element e.g. a ferromagnetic rod of the cleaning device 100, 400, are not subject to active control during movement of the cleaning device 100, 400 through the vacuum chamber or processing system in general.
  • a controller of the transport arrangement 500 is not configured to control a passive magnetic element.
  • a passive magnetic element may be adapted for generating a magnetic field, e.g. a static magnetic field.
  • a passive magnetic element may not be configured for generating an adjustable magnetic field.
  • a passive magnetic element may be a magnetic material, such as a ferromagnetic material, a permanent magnet or may have permanent magnetic properties.
  • Embodiments described herein relate to contactless levitation and transportation of a cleaning device 100, 400.
  • the term“contactless” as used throughout the present disclosure can be understood in the sense that a weight of, e.g. the cleaning device 100, 400, is not held by a mechanical contact or mechanical forces, but is held by a magnetic force. Specifically, the cleaning device 100, 400 is held in a levitating or floating state using magnetic forces instead of mechanical forces.
  • the contactless levitation and transportation of the cleaning device 100, 400 may be beneficial in that fewer particles are generated due to a mechanical contact between the cleaning device and sections of the transport arrangement 500, such as mechanical rails, during the transport of the cleaning device 100, 400. Accordingly, embodiments described herein provide for an improved purity and uniformity of the layers deposited on the substrate being processed in the processing system, in particular since particle generation is minimized when using the contactless levitation and transportation.
  • FIG. 6 shows a schematic view of a processing system 600 for processing a substrate according to embodiments described herein.
  • the processing system 600 includes a vacuum chamber 602, one or more deposition material sources in the vacuum chamber 602, and the cleaning device 100, 400 according to the embodiments described herein, wherein the cleaning device 100, 400 is configured to be transported through the vacuum chamber 602.
  • the cleaning device 100, 400 is configured to attract particles which may have been generated inside the processing system 600.
  • the processing system 600 can be configured for CVD or PVD, such as sputter deposition.
  • the system can be configured for evaporation of e.g. an organic material for the manufacture of OLED devices.
  • the one or more material deposition sources 680 can be sources for sputter deposition or evaporation of one or more materials on a substrate.
  • the cleaning device 100, 400 can be transported into and through the vacuum chamber 602 along a transportation path, such as a linear transportation path.
  • further chambers can be provided adjacent to the vacuum chamber 602.
  • the processing system may include one or more further vacuum chambers 602’, one or more transfer chambers 603, and/or a cleaning chamber 610.
  • the vacuum chamber 602 can be separated from adjacent chambers by a valve having a valve housing 604 and a valve unit 606. After the cleaning device 100, 400 is inserted into the vacuum chamber 602 as indicated by the arrows, the valve unit 606 can be closed.
  • the atmosphere in the vacuum chamber 602 can be individually controlled by generating a technical vacuum, for example with vacuum pumps connected to the vacuum chamber 602.
  • the cleaning device 100, 400 are static or dynamic during attraction and collection of particles. For example, transporting the cleaning device 100, 400 through the vacuum chamber 602 at a constant velocity allows for a shorter cleaning time for cleaning particles from the processing system.
  • the cleaning device 100, 400 may be periodically stationary inside a vacuum chamber 602, allowing for a longer attraction time for attracting more particles, or for allowing various elements within the vacuum chamber 602, such as one or more material deposition sources 680, to be moved to dislodge particles or to uncover otherwise obscured areas of the vacuum chamber for more effective particle collection.
  • the processing system 600 can include one or more transportation paths extending through the vacuum chamber 602.
  • the cleaning device 100, 400 can be configured for transportation along the one or more transportation paths, for example, past the one or more material deposition sources 680.
  • one transportation path is exemplarily indicated by the arrows, it is to be understood that the present disclosure is not limited thereto and that two or more transportation paths can be provided.
  • at least two transportation paths can be arranged substantially parallel to each other for transportation of multiple substrate carriers and/or cleaning devices 100, 400.
  • the one or more material deposition sources 680 can be arranged between the two transportation paths.
  • the processing system 600 may include a cleaning chamber 610.
  • Cleaning chamber 610 may be configured for removing particles from a cleaning device 100, 400 such that the particles may be removed from the processing system.
  • Cleaning chamber 610 may be separated from adjacent chambers by a valve having a valve housing 604 and a valve unit 606, allowing for a cleaning device 100, 400 to be transported into the cleaning chamber 610.
  • Cleaning chamber 610 may have a particle removal apparatus 611 provided therein, configured for removing particles from the cleaning device 100, 400.
  • Particle removal apparatus 611 may be configured to remove particles by using a stream of gas, by suction, by using a fluid, or by using a brush or a scraper.
  • Particle removal apparatus 611 may include an electrostatic device configured to attract particles from the cleaning device 100, 400 to the particle removal apparatus 611.
  • Cleaning chamber 610 may be configured to shake or vibrate the cleaning device 100, 400 to dislodge or agitate particles collected on the surface of the cleaning device 100, 400, whereby shaking or vibrating is performed by rapidly moving the cleaning device 100, 400 by the transport arrangement.
  • Cleaning chamber 610 of the processing system 600 may have an atmosphere substantially the same as the atmosphere of the other processing chambers of the processing system.
  • cleaning chamber 610 may contain a vacuum, a partial vacuum or an atmosphere comprising a processing gas or mixture of processing gases.
  • the cleaning chamber 610 of the processing system 600 may have a different atmosphere as the atmosphere of the other processing chambers of the processing system 600.
  • the cleaning chamber 610 may be vented or purged prior to removing particles from the cleaning device 100, 400.
  • the cleaning chamber 610 may comprise a load lock chamber, and the cleaning device 100, 400 may be removed from the processing system prior to cleaning.
  • the atmosphere of the cleaning chamber 610 may be purged.
  • the particle removal apparatus 611 removes particles from the surface of the cleaning device 100, 400 by using a stream of gas, the particles become airborne in the atmosphere of the cleaning chamber 610. Purging the atmosphere from within the cleaning chamber 610 allows for these airborne particles to be easily removed from the cleaning chamber 610.
  • a method of operating of a cleaning device for attracting particles in a substrate processing system includes providing the cleaning device in a processing system comprising at least one vacuum chamber, and applying a voltage to a first electrode assembly of the cleaning device to generate an electrostatic field to have particles adhere to the cleaning device. Applying a voltage to the first electrode assembly causes an electrostatic charge to be generated at the particle collection surface of the cleaning device, which causes particles in the processing system to be attracted. Attracting particles to the cleaning device allows for the particles to be collected and removed from within the processing system, which improves the quality of deposited layers of material on substrates by reducing defects caused by particles.
  • the method may further include transporting the cleaning device between two or more vacuum chambers in the processing system.
  • the processing system may contain at least two vacuum chambers which are connected with a transport arrangement.
  • the transport arrangement may be the transport arrangement described previously, wherein the cleaning device is transported by a roller drive system or magnetic levitation so as to reduce the generation of particles in the processing system.
  • the cleaning device may be transported continuously at a constant velocity throughout the processing system.
  • the velocity at which the cleaning device is transported may be up to 100 m/min, particularly up to 80 m/min.
  • the cleaning device may be transported discontinuously such that the cleaning surface remains stationary in a vacuum chamber for a specified time.
  • the cleaning device may typically be held stationary in a vacuum chamber for up to 60 seconds, however the stationary time may be increased to up to 5 minutes, or even up to 10 minutes. Holding the cleaning device stationary in a vacuum chamber may allow for sufficient time for particles to be attracted to and adhere to the surface of the cleaning device.
  • various apparatus in the processing system may be moved or repositioned.
  • a valve between adjacent vacuum chambers may be opened and/or closed near the cleaning device so that surfaces of the valve which would otherwise be obscured can be exposed to the cleaning device for particle removal.
  • a material deposition source apparatus may, for example, be moved along a rail such that the portion of the rail which would otherwise be obscured by the material deposition source apparatus is exposed to the cleaning device for particle removal.
  • the cleaning device may be provided in the processing system by being loaded into a load lock.
  • the load lock may be arranged between the atmosphere and the one or more vacuum chambers such that the cleaning device may be brought into the processing system without interrupting the vacuum maintained in the vacuum chamber.
  • the method may further include transporting the cleaning device to a cleaning chamber and removing particles from the cleaning device.
  • the processing system may comprise a cleaning chamber for the purposes of cleaning particles from devices which are transported through the processing system.
  • the cleaning chamber may be provided for cleaning substrate carriers.
  • Such a cleaning chamber can be configured for cleaning particles from a cleaning device.
  • the cleaning chamber of the processing system may have an atmosphere substantially the same as the atmosphere of the other processing chambers of the processing system.
  • the cleaning chamber may contain a vacuum, a partial vacuum or an atmosphere comprising a processing gas or mixture of processing gases.
  • the cleaning chamber of the processing system may have a different atmosphere as the atmosphere of the other processing chambers of the processing system.
  • the cleaning chamber may be vented or purged prior to removing particles from the cleaning device.
  • the cleaning chamber may comprise a load lock chamber, and the cleaning device may be removed from the processing system prior to cleaning.
  • the voltage applied to the first electrode assembly is removed, such that an electrostatic field is no longer generated. Particles will no longer be attracted to the cleaning device, allowing for easier removal.
  • Collected particles may be removed from the cleaning device by wiping, by using a stream of compressed gas, by suction, by using a fluid, by using a brush or scraper, or by electrostatic attraction away from the cleaning device.
  • the voltage applied to the first electrode assembly may be variable. For example, it may be desirable to increase the voltage applied to the first electrode assembly in specific vacuum chambers where a higher amount of particles are generated. Alternatively, in specific vacuum chambers where particle generation is low, the voltage applied to the first electrode assembly may be reduced so that power, e.g. from a power supply mounted on board the cleaning device, can be conserved. Particularly, the voltage applied to the first electrode assembly may be reduced to a level wherein the cleaning device provides a minimum electrostatic charge to hold collected particles to the particle collection surface.
  • the cleaning device is provided in place of a substrate carrier for in-situ collection of particles in the processing system.
  • the size of the cleaning device can be configured to be approximately the same size and shape as a substrate carrier used in the processing system. This allows for a substrate carrier to be substituted for a cleaning device and loaded into the processing system at the same time as other substrate carriers, allowing for particle collection to be performed without substantially interrupting the normal operation of the processing system.
  • the cleaning device may be configured to follow a transport path that is the same as that of a substrate carrier being processed in the processing system.
  • the cleaning device will be provided into the system at a load lock where substrate carriers are loaded into the processing system, transported through the processing system to collect particles, and removed from a load lock where substrate carriers are unloaded from the processing system.
  • the cleaning device may have particles adhered to its particle collection surface.
  • the voltage applied to the cleaning device may be maintained during unloading, maintaining the electrostatic charge at the particle collection surface such that the particles collected by the cleaning device remain adhered to the particle collection surface.
  • the cleaning device including an on-board power supply so that the applied voltage can be maintained during loading and unloading of the cleaning device. After being unloaded from the load lock, the cleaning device can be deactivated and the particles adhered thereto can be removed from the particle collection surface outside of the processing system.
  • the cleaning device may be configured to follow a different transport path through the processing system.
  • the transport path for the cleaning device may follow a main transport path for transporting a substrate carrier, but may be diverted from the main transport path and be transported into a cleaning chamber.
  • the cleaning device may be cleaned of any particles collected. After the particles have been removed, the cleaning device may be re-inserted back into the same transport path as a substrate carrier.
  • the cleaning device may be diverted from the main transport path by a transfer chamber.
  • the method may further include partially venting at least one processing chamber of the processing system to dislodge and/or agitate particles prior to allowing the particles to bind to the cleaning device.
  • the processing chamber may be, for example, a vacuum chamber, a load lock chamber, a transfer chamber or a cleaning chamber. Partially venting the processing chamber causes particles which may have settled on or adhered to the walls of the processing chamber or components arranged therein to become airborne, increasing the chance of the particles to be attracted to the cleaning surface, thereby increasing the effectiveness of the cleaning surface in attracting and collecting particles.
  • the processing chamber may be partially vented at the same time as the cleaning device is positioned therein, or may alternatively be partially vented prior to the cleaning device being transported into the processing chamber.
  • the cleaning device may be a two-sided cleaning device including a first electrode assembly and a second electrode assembly, configured for collecting particles on both sides of the cleaning device.
  • the voltage applied to the first electrode assembly may be the same as the voltage applied to the second electrode assembly.
  • the operation of the first electrode assembly may be coupled to that of the second electrode assembly. Coupling the first and second electrode assemblies allows for consolidation of control devices for controlling the operation of the first and second electrode assemblies.
  • the voltage applied to the first electrode assembly may be different to the voltage applied to the second electrode assembly.
  • Independent operation of the first and second electrode assemblies allows for adapting the operation parameters and the electrostatic force generated on each side of the cleaning device in order to, for example, account for non-symmetry in processing chambers.
  • a vacuum chamber may have components which are sensitive to electrostatic charge on one side of the chamber, and the electrostatic charge provided by one side of the cleaning device may be reduced without compromising the performance of the particle collection on the other side of the cleaning device.

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention concerne un dispositif de nettoyage permettant d'attirer des particules dans un système de traitement de substrat, un système de traitement permettant de traiter un substrat et un procédé de fonctionnement d'un dispositif de nettoyage. Selon un premier aspect, l'invention concerne un dispositif de nettoyage permettant d'attirer des particules dans un système de traitement de substrat, le dispositif de nettoyage comprenant une base de support, un premier ensemble électrode supporté par la base de support au niveau d'une première surface et un premier élément isolant disposé sur le premier ensemble électrode. Selon un deuxième aspect, l'invention concerne un système de traitement permettant de traiter un substrat, le système de traitement comprenant une chambre à vide et le dispositif de nettoyage du premier aspect, le dispositif de nettoyage étant configuré pour être transporté à travers la chambre à vide. Selon un troisième aspect, l'invention concerne un procédé de fonctionnement d'un dispositif de nettoyage permettant d'attirer des particules dans un système de traitement de substrat, le procédé comprenant l'utilisation du dispositif de nettoyage selon le premier aspect dans un système de traitement de substrat comprenant au moins une chambre à vide, et l'application d'une tension à un premier ensemble électrode du dispositif de nettoyage pour générer un champ électrostatique afin que les particules adhèrent au dispositif de nettoyage.
PCT/EP2018/062370 2018-05-14 2018-05-14 Dispositif de nettoyage permettant d'attirer des particules dans un système de traitement de substrat, système de traitement permettant de traiter un substrat, et procédé de fonctionnement d'un dispositif de nettoyage Ceased WO2019219163A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/EP2018/062370 WO2019219163A1 (fr) 2018-05-14 2018-05-14 Dispositif de nettoyage permettant d'attirer des particules dans un système de traitement de substrat, système de traitement permettant de traiter un substrat, et procédé de fonctionnement d'un dispositif de nettoyage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2018/062370 WO2019219163A1 (fr) 2018-05-14 2018-05-14 Dispositif de nettoyage permettant d'attirer des particules dans un système de traitement de substrat, système de traitement permettant de traiter un substrat, et procédé de fonctionnement d'un dispositif de nettoyage

Publications (1)

Publication Number Publication Date
WO2019219163A1 true WO2019219163A1 (fr) 2019-11-21

Family

ID=62186437

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2018/062370 Ceased WO2019219163A1 (fr) 2018-05-14 2018-05-14 Dispositif de nettoyage permettant d'attirer des particules dans un système de traitement de substrat, système de traitement permettant de traiter un substrat, et procédé de fonctionnement d'un dispositif de nettoyage

Country Status (1)

Country Link
WO (1) WO2019219163A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113906549A (zh) * 2019-06-10 2022-01-07 科磊股份有限公司 通过清洁衬底的原位工艺腔室夹具清洁
US11456198B2 (en) * 2019-08-23 2022-09-27 Semes Co., Ltd. Transfer unit and substrate treating apparatus including ihe same
CN116635994A (zh) * 2020-12-17 2023-08-22 应用材料公司 用于载体运输组件的辊子、基板处理系统、维护基板处理系统的方法、以及制造装置的方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59181635A (ja) * 1983-03-31 1984-10-16 Toshiba Corp 静電集塵器付き搬送機構
US6526997B1 (en) * 2000-08-18 2003-03-04 Francois J. Henley Dry cleaning method for the manufacture of integrated circuits
EP1382714A2 (fr) * 2002-07-18 2004-01-21 Sharp Kabushiki Kaisha Dispositif d'élimination de particules
US20060008660A1 (en) * 2004-07-09 2006-01-12 Applied Materials, Inc. Cleaning of a substrate support
US20060011213A1 (en) * 2004-04-28 2006-01-19 Tokyo Electron Limited Substrate transfer device and cleaning method thereof and substrate processing system and cleaning method thereof
US20100050349A1 (en) * 2008-08-26 2010-03-04 Hitachi High-Technologies Corporation Cleaning apparatus and cleaning method
US20110108056A1 (en) * 2009-11-09 2011-05-12 Tokyo Electron Limited Cleaning method for transfer arm, cleaning method for substrate processing apparatus and substrate processing apparatus
WO2017194088A1 (fr) * 2016-05-09 2017-11-16 Applied Materials, Inc. Procédé et appareil pour traitement sous vide
US20180114701A1 (en) * 2016-04-27 2018-04-26 Lg Chem, Ltd. System and method for removing foreign substances by using electric field adsorption method

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59181635A (ja) * 1983-03-31 1984-10-16 Toshiba Corp 静電集塵器付き搬送機構
US6526997B1 (en) * 2000-08-18 2003-03-04 Francois J. Henley Dry cleaning method for the manufacture of integrated circuits
EP1382714A2 (fr) * 2002-07-18 2004-01-21 Sharp Kabushiki Kaisha Dispositif d'élimination de particules
US20060011213A1 (en) * 2004-04-28 2006-01-19 Tokyo Electron Limited Substrate transfer device and cleaning method thereof and substrate processing system and cleaning method thereof
US20060008660A1 (en) * 2004-07-09 2006-01-12 Applied Materials, Inc. Cleaning of a substrate support
US20100050349A1 (en) * 2008-08-26 2010-03-04 Hitachi High-Technologies Corporation Cleaning apparatus and cleaning method
US20110108056A1 (en) * 2009-11-09 2011-05-12 Tokyo Electron Limited Cleaning method for transfer arm, cleaning method for substrate processing apparatus and substrate processing apparatus
US20180114701A1 (en) * 2016-04-27 2018-04-26 Lg Chem, Ltd. System and method for removing foreign substances by using electric field adsorption method
WO2017194088A1 (fr) * 2016-05-09 2017-11-16 Applied Materials, Inc. Procédé et appareil pour traitement sous vide

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113906549A (zh) * 2019-06-10 2022-01-07 科磊股份有限公司 通过清洁衬底的原位工艺腔室夹具清洁
CN113906549B (zh) * 2019-06-10 2025-06-24 科磊股份有限公司 通过清洁衬底的原位工艺腔室夹具清洁
US11456198B2 (en) * 2019-08-23 2022-09-27 Semes Co., Ltd. Transfer unit and substrate treating apparatus including ihe same
CN116635994A (zh) * 2020-12-17 2023-08-22 应用材料公司 用于载体运输组件的辊子、基板处理系统、维护基板处理系统的方法、以及制造装置的方法

Similar Documents

Publication Publication Date Title
TWI773913B (zh) 磁性懸浮系統、真空系統、及在真空腔室中非接觸地支承及移動載體的方法
JP6602457B2 (ja) 減圧システム内でマスクデバイスを取り扱う方法、マスクハンドリング装置、及び減圧システム
US10734265B2 (en) Semiconductor process equipment
TWI679081B (zh) 載體、遮罩裝置、真空系統及操作一真空系統之方法
CN108138304A (zh) 用于在基板上真空沉积的设备和用于在真空沉积期间掩蔽基板的方法
US20180374732A1 (en) Apparatus for transportation of a substrate, apparatus for vacuum processing of a substrate, and method for maintenance of a magnetic levitation system
WO2019219163A1 (fr) Dispositif de nettoyage permettant d'attirer des particules dans un système de traitement de substrat, système de traitement permettant de traiter un substrat, et procédé de fonctionnement d'un dispositif de nettoyage
WO2019020166A1 (fr) Appareil et système de traitement d'un substrat dans une chambre à vide, et procédé d'alignement d'un support de substrat par rapport à un support de masque
TW201835365A (zh) 用於一基板之真空處理之設備、用於具有有機材料之裝置之製造的系統、及用以密封連接二壓力區域之一開孔之方法
WO2019081045A1 (fr) Appareil de transport sans contact d'un support dans un système de dépôt, système de transport sans contact d'un support, support pour transport sans contact dans un système de dépôt, et procédé de transport sans contact d'un support dans un système de dépôt
CN216435860U (zh) 载体运输系统和真空沉积系统
KR20200012825A (ko) 진공 챔버에서 캐리어 또는 컴포넌트를 홀딩하기 위한 홀딩 디바이스, 진공 챔버에서 캐리어 또는 컴포넌트를 홀딩하기 위한 홀딩 디바이스의 이용, 진공 챔버에서 캐리어를 핸들링하기 위한 장치, 및 진공 증착 시스템
US20200240008A1 (en) Apparatus for vacuum processing of a substrate, system for the manufacture of devices having organic materials, and method for sealing a processing vacuum chamber and a maintenance vacuum chamber from each other
JP6591657B2 (ja) 真空システムで使用するためのキャリア、真空処理のためのシステム、及び基板の真空処理のための方法
KR20190087996A (ko) 마스크 디바이스를 핸들링하는 방법들, 마스크 디바이스를 교환하기 위한 장치, 마스크 교환 챔버, 및 진공 시스템
KR20190005929A (ko) 진공 처리를 위한 방법 및 장치
WO2019192680A1 (fr) Appareil de manipulation d'un support dans une chambre à vide, système de dépôt sous vide, et procédé de manipulation d'un support dans une chambre à vide
KR102148474B1 (ko) 스퍼터링 장치의 이물 제거장치 및 이를 이용한 이물제거 방법
KR100825387B1 (ko) 기판이송장치 및 이를 이용한 기판이송방법

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18725173

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18725173

Country of ref document: EP

Kind code of ref document: A1