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WO2019081045A1 - Appareil de transport sans contact d'un support dans un système de dépôt, système de transport sans contact d'un support, support pour transport sans contact dans un système de dépôt, et procédé de transport sans contact d'un support dans un système de dépôt - Google Patents

Appareil de transport sans contact d'un support dans un système de dépôt, système de transport sans contact d'un support, support pour transport sans contact dans un système de dépôt, et procédé de transport sans contact d'un support dans un système de dépôt

Info

Publication number
WO2019081045A1
WO2019081045A1 PCT/EP2017/077644 EP2017077644W WO2019081045A1 WO 2019081045 A1 WO2019081045 A1 WO 2019081045A1 EP 2017077644 W EP2017077644 W EP 2017077644W WO 2019081045 A1 WO2019081045 A1 WO 2019081045A1
Authority
WO
WIPO (PCT)
Prior art keywords
carrier
deposition system
deposition
transportation
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2017/077644
Other languages
English (en)
Inventor
Christian Wolfgang Ehmann
Timo ADLER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to KR1020197000067A priority Critical patent/KR20190058443A/ko
Priority to JP2018566408A priority patent/JP2020500257A/ja
Priority to PCT/EP2017/077644 priority patent/WO2019081045A1/fr
Priority to CN201780042940.9A priority patent/CN109983153A/zh
Publication of WO2019081045A1 publication Critical patent/WO2019081045A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • H10P72/3204—
    • H10P72/3206—
    • H10P72/3208—
    • H10P72/3314—

Definitions

  • Embodiments of the present disclosure relate to an apparatus for contactless transportation of a carrier in a deposition system, a system for contactless transportation of a carrier, a carrier for contactless transportation in a deposition system, and a method for contactless transportation of a carrier in a deposition system.
  • Embodiments of the present disclosure particularly relate to an electrostatic chuck (E-chuck) for holding substrates and/or masks used in the manufacture of organic light-emitting diode (OLED) devices.
  • E-chuck electrostatic chuck
  • Coated substrates may be used in several applications and in several technical fields.
  • coated substrates may be used in the field of organic light emitting diode (OLED) devices.
  • OLEDs can be used in the manufacture of television screens, computer monitors, mobile phones, other hand-held devices, and the like for displaying information.
  • An OLED device, such as an OLED display may include one or more layers of an organic material situated between two electrodes that are all deposited on a substrate.
  • the substrate can be supported on a carrier configured to hold the substrate and an optional mask.
  • the carrier can be contactlessly transported inside a deposition system, such as a vacuum deposition system, using magnetic forces.
  • a deposition system such as a vacuum deposition system
  • a purity and uniformity of the organic layers deposited on the substrate should be high. Further, handling and transportation of the carriers supporting substrates and masks using contactless transportation without sacrificing the throughput due to substrate breakage is challenging.
  • an apparatus for contactless transportation of a carrier in a deposition system includes a drive structure for moving the carrier in a transport direction, and a position detection device at the drive structure.
  • a system for contactless transportation of a carrier is provided. The system includes the apparatus for contactless transportation of a carrier according to the present disclosure and the carrier.
  • a carrier for contactless transportation in a deposition system includes a magnet structure configured to magnetically interact with a drive structure of the deposition system for moving the carrier in a transport direction, and a position detection device.
  • a method for contactless transportation of a carrier in a deposition system includes generating at least one signal indicating at least one of a position and a speed of the carrier using a position detection device at a drive structure or on the carrier, and controlling at least one active magnet unit of one or more first active magnet units of the deposition system based on the at least one signal.
  • an apparatus for contactless transportation of a carrier in a deposition system includes at least one guide unit.
  • the at least one guide unit includes an active magnet unit and two or more distance sensors.
  • the active magnet unit is arranged between the two or more distance sensors.
  • Embodiments are also directed at apparatuses for carrying out the disclosed methods and include apparatus parts for performing each described method aspect. These method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments according to the disclosure are also directed at methods for operating the described apparatus. The methods for operating the described apparatus include method aspects for carrying out every function of the apparatus.
  • FIG. 1 shows a schematic view of a carrier and a guiding structure
  • FIG. 2 shows a schematic view of an apparatus for contactless transportation and a carrier according to embodiments described herein;
  • FIG. 3 show schematic views of an apparatus for contactless transportation and a carrier according to further embodiments described herein;
  • FIGs. 4A and B show schematic views of an apparatus for contactless transportation and a carrier according to embodiments described herein;
  • FIG. 5 shows a schematic view of a system for substrate processing according to embodiments described herein;
  • FIG. 6 shows a schematic view of a system for substrate processing according to further embodiments described herein.
  • FIG. 7 shows a flow chart of a method for contactless transportation of a carrier in a deposition system according to embodiments described herein.
  • Carriers can be used in a deposition system, such as a vacuum deposition system, for holding and transporting substrates and/or masks within a deposition chamber of the deposition system.
  • a deposition system such as a vacuum deposition system
  • one or more material layers can be deposited on the substrate while the substrate is supported on the carrier.
  • a high purity and uniformity of the organic layers deposited on the substrate can be beneficial.
  • a smooth transportation of the carrier inside the deposition system is beneficial e.g. in order to reduce substrate breakage.
  • a position detection device such as an encoder or a resolver, is used to determine a position and/or a speed of the carrier in the deposition system.
  • the position detection device can be provided at a drive structure of a transport arrangement of the deposition system. In further examples, the position detection device can be provided at the carrier so as to be transported together with the carrier. The position and/or a speed of the carrier can be used to selectively control the transport arrangement, such as active magnet units used to levitate the carrier. A smoot transportation of the carrier can be achieved.
  • FIG. 1 shows a schematic view of a carrier 100 and a portion of a transport arrangement configured for contactless transportation of the carrier 100 in a transport direction 1, which can be a horizontal direction.
  • the transport arrangement includes a guiding structure 110, which can be an active guiding structure.
  • the guiding structure 110 includes a plurality of guide units 111, which are arranged along the transport direction 1.
  • Each guide unit 111 includes an (e.g. electromagnetic) actuator, such as an active magnet unit 112, and a controller 114 configured to control the actuator, and a distance sensor (not shown) configured to measure a gap to the carrier 100.
  • the guiding structure 110 can be configured to contactlessly levitate the carrier 100 using magnetic forces.
  • a levitation accuracy and/or levitation stability can be affected.
  • a considerable and/or pulse-like force which may lead to a sudden acceleration or deceleration of the carrier 100, can be generated when the carrier 100 approaches or leaves a guide unit 111.
  • the force may depend on the geometrical arrangement and configuration of the components of the guiding structure 110, and particularly of the plurality of guide units 111 (e.g. the electromagnetic actuator(s) and the distance sensor(s)).
  • the force can lead to unwanted and sudden movements of the carrier 100, and may even lead to an accidental mechanical contact between the carrier 100 and the guiding structure 110.
  • the carrier 100, the substrate and/or the guiding structure 110 can be damaged. Further, particles may be generated, which deteriorate a quality of a deposition process.
  • the pulse-like force or change of force in the direction of the levitating force, and particularly in the direction (e.g., the vertical direction 3) of a magnetic force provided by the actuator, may occur when the carrier 100 suddenly disappears e.g. from below the distance sensor. This may result in a signal value at the distance sensor which is the same as if the carrier would perform a fast movement away from the distance sensor in the distance (or measurement) direction, such as the vertical direction 3. In other words, the distance sensor indicates a gap enlargement.
  • the signal change can make the controller to strongly change the actuator force to bring the "moving" carrier 100 back to a set distance between the guiding structure 110 and the carrier 100.
  • FIG. 2 shows a schematic view of an apparatus for contactless transportation of a carrier 220 in a deposition system according to embodiments described herein.
  • the apparatus includes a drive structure 210 for moving the carrier 220 in a transport direction 1 and a position detection device, such as an encoder device 215.
  • the position detection device is provided at the drive structure 210 and can be a stationary part of the transport arrangement of the deposition system.
  • the carrier 220 includes the position detection device.
  • the position detection device can be mounted on the carrier 220 so as to move together with the carrier 220.
  • the carrier 220 can have a first end 201 and an a second end 202. The first end can be a leading edge of the carrier 220, and the second end can be a trailing edge of the carrier 220.
  • the position detection device can be configured to provide information about a position and/or a speed of the carrier.
  • the position detection device can be an encoder or resolver.
  • the terms "position detection device”, “encoder”, “encoder device”, and “resolver” as used throughout the present disclosure are to be understood in the sense of a device capable of providing positional information about the carrier, such as an absolute position in the deposition system, a relative position e.g. with respect to the guiding structure, and/or a speed of the carrier.
  • the position of the carrier such as the absolute position and/or the relative position, can be obtained using a speed or speed profile and a reference point, such as a start point of the carrier.
  • the position detection device may use one or more operation parameters of the drive structure to obtain e.g. additional information about the position and/or the speed of the carrier.
  • the one or more operation parameters can include, but are not limited to, an operating power, such as a current flowing through one or more second active magnet units of the drive structure.
  • the carrier 220 is configured for contactless transportation through one or more chambers, such as vacuum chamber, of the deposition system, and in particular through at least one deposition area, along a transportation path such as a linear transportation path.
  • the carrier 220 can be configured for contactless transportation in the transport direction 1, which can be a horizontal direction.
  • the deposition system may include the transport arrangement configured for contactless levitation and/or contactless transportation of the carrier 220 in the deposition system.
  • the apparatus and in particular the transport arrangement, includes a guiding structure 230 for levitating the carrier 220 and the drive structure 210 for moving the carrier 220 in the transport direction 1.
  • the guiding structure 230 can have one or more first active magnet units 112 configured to magnetically interact with a first magnet structure 222 of the carrier 220.
  • the first magnet structure 222 may be comprised of one or more first magnet units configured to magnetically interact with the guiding structure 230.
  • the one or more first magnet units can be passive magnet units, such as permanent magnets unit and/or ferromagnetic parts.
  • the carrier 220 includes a second magnet structure comprised of one or more second magnet units (not shown) configured to magnetically interact with the drive structure 210 for moving the carrier 220 in the transport direction 1.
  • the one or more second magnet units can be passive magnet units, such as ferromagnets.
  • the guiding structure 230 and the drive structure 210 can be arranged at opposite ends or end portions of the carrier 220.
  • the one or more first magnet units and the one or more second magnet units can be arranged at opposite ends or end portions of the carrier 220.
  • the deposition system can include the guiding structure 230 having the plurality of guide units 111.
  • Each guide unit 111 may include an actuator, such as a first active magnet unit 112, a unit controller 114 configured to control the actuator, and optionally a distance sensor 118 configured to sense or measure the gap between the magnet structure, and in particularly the one or more first magnet units thereof, and the actuator.
  • the gap can be measured in a direction perpendicular to the transport direction 1, such as the vertical direction 3 or a horizontal direction 2.
  • the distance sensor 118 can be arranged to face the one or more first magnet units e.g. when the carrier 220 is at the distance sensor 118 to sense or measure the gap between the one or more first magnet units and the first active magnet unit 112.
  • the unit controller 114 can be configured to control the first active magnet unit 112 to adjust the magnetic force provided by the first active magnet unit 112 based on information provided by the encoder device 215 and optionally based on information provided by the distance sensor 118.
  • the unit controller 114 can be configured to control the first active magnet unit 112 such that the distance between the one or more first magnet units and the active magnet unit 112 is essentially constant while the carrier 220 is transported through the deposition system.
  • FIG. 2 exemplarily illustrates that each guide unit 111 has a unit controller, it is to be understood that the present disclosure is not limited thereto and that a unit controller can be allocated to two or more guide units. For example, one single unit controller can be provided for all guide units.
  • the apparatus includes a controller 240 (also referred to as "system controller” or “main controller”) configured to control the guiding structure 230 and/or the drive structure 210.
  • the controller 240 can be wirelessly or wiredly connected to the drive structure 210, and particularly to the encoder device 215.
  • the controller 240 can be connected to the guiding structure 230, for example, via a bus 242.
  • the controller 240 can be connected to each of the unit controllers 114 of the guide units 111.
  • the controller 240 can be configured to provide control signals or instructions to the unit controllers 114 of the guide units 111 for controlling the guiding structure 230.
  • the bus 242 can be wire-based or can be wireless.
  • the controller 240 can be configured to selectively control the one or more first active magnet units 112 based on one or more input signals.
  • the controller 240 can send control signals to the unit controllers 114 to control the one or more first active magnet units 112.
  • the one or more input signals can be provided by the encoder device 215 and/or the distance sensor(s) 118.
  • the encoder device 215 can be configured to provide at least one first input signal of the one or more input signals.
  • the at least one first input signal can indicate at least one of a position and a speed of the carrier 220 in the deposition system.
  • the one or more distance sensors 118 can be configured to provide at least one second input signal of the one or more input signals.
  • the at least one second input signal can indicate the gap between the one or more first active magnet units 112 and the carrier 220.
  • the unit controller 114 of a guide unit 111 can deactivate the first active magnet unit 112 before the first active magnet unit 112 and/or the distance sensor 118 "leaves" the respective trail on the carrier 220 based on positional information provided by the encoder device 215 and optionally based on gap information provided by the distance sensor 118.
  • the unit controller 114 of a guide unit 111 can activate the first active magnet unit 112 only after the first active magnet unit 112 and/or the distance sensor 118 face the respective trails on the carrier 220 based on positional information provided by the encoder device 215 and optionally based on gap information provided by the distance sensor 118.
  • a first active magnet unit 112 is deactivated before the carrier 220 "leaves" the first active magnet unit 112.
  • a deactivated first active magnet unit 112 is only activated after the first active magnet unit 112 and the magnet structure of the carrier overlap.
  • the activation and/or deactivation of first active magnet unit(s) 112 can be stepwise, continuously, or abrupt.
  • the selective activation and/or deactivation can be provided because the encoder device 215 provides information about the position of the carrier 220 in the transport direction 1 in the deposition system.
  • the carrier includes the encoder.
  • the encoder is not integrated in the transport arrangement but is part of the carrier. The functionalities are essentially the same as described above.
  • the encoder can be configured to provide at least one signal indicating at least one of a position and a speed of the carrier.
  • the at least one signal may correspond to the at least one first input signal described above.
  • the carrier can include a communication device configured to transmit the at least one signal to the deposition system.
  • the communication device can be configured to transmit the at least one signal to the controller 240, e.g., wirelessly or via cables.
  • the carrier 220 can be configured to hold a substrate and/or a mask (not shown) used during substrate processing, such as vacuum processing. In some implementations, the carrier 220 can be configured to support both the substrate and the mask. In further implementations, the carrier 220 can be configured to support either the substrate or the mask. In such a case the carrier 220 can be referred to as "substrate carrier” and "mask carrier", respectively.
  • the carrier 220 can include a support structure or body 225 providing a support surface, which can be an essentially flat surface configured for contacting e.g. a back surface of the substrate.
  • the substrate can have a front surface (also referred to as "processing surface”) opposite the back surface and on which a layer is deposited during the processing, such as a vacuum deposition process.
  • the first magnet structure 222 can be provided at the body 225.
  • the term "vacuum” as used throughout the present disclosure can be understood in the sense of a technical vacuum having a vacuum pressure of less than, for example, 10 mbar.
  • the pressure in the vacuum chamber may be between 10 - " 5 mbar and about 10 - " 8 mbar, specifically between 10 - " 5 mbar and 10 - “ 7 mbar, and more specifically between about 10 "6 mbar and about 10 "7 mbar.
  • One or more vacuum pumps, such as turbo pumps and/or cryo-pumps, connected to the vacuum chamber for generation of the vacuum inside the vacuum chamber can be provided.
  • the carrier 220 can be an electrostatic chuck (E-chuck) providing an electrostatic force for holding the substrate and/or the mask at the carrier 220.
  • the carrier 220 includes an electrode arrangement configured to provide an attracting force acting on at least one of the substrate and the mask.
  • the electrode arrangement can be embedded in the body 225, or can be provided, e.g., placed, on the body 225.
  • the body 225 is a dielectric body, such as a dielectric plate.
  • the dielectric body can be fabricated from a dielectric material, preferably a high thermal conductivity dielectric material such as pyrolytic boron nitride, aluminum nitride, silicon nitride, alumina or an equivalent material, but may be made from such materials as polyimide.
  • the electrode arrangement includes a plurality of electrodes, such as a grid of fine metal strips, placed on the dielectric plate and covered with a thin dielectric layer.
  • the electrode arrangement and particularly the plurality of electrodes, can be configured to provide the attracting force, such as a chucking force.
  • the attracting force can be a force acting on the substrate and/or the mask at a certain relative distance between the plurality of electrodes (or the support surface) and the substrate and/or the mask.
  • the attracting force can be an electrostatic force provided by voltages applied to the plurality of electrode arrangement.
  • the substrate can be attracted by the attracting force provided by the carrier 220, which can be an E-chuck, towards the support surface (e.g. in a direction perpendicular to the transport direction).
  • the attracting force can be strong enough to hold the substrate e.g. in a vertical position by frictional forces.
  • the attracting force can be configured to fix the substrate on the support surface essentially immoveable.
  • an attracting pressure of about 50 to 100 N/m (Pa) can be used, depending on the friction coefficient.
  • the carrier 220 is configured for holding or supporting the substrate and/or mask in a substantially vertical orientation.
  • the carrier can be configured for transportation in a vertical orientation.
  • substantially vertical is understood particularly when referring to the substrate orientation, to allow for a deviation from the vertical direction or orientation of ⁇ 20° or below, e.g. of ⁇ 10° or below. This deviation can be provided for example because a substrate support with some deviation from the vertical orientation might result in a more stable substrate position. Further, fewer particles reach the substrate surface when the substrate is tilted forward.
  • the substrate orientation e.g., during the deposition process, is considered substantially vertical, which is considered different from the horizontal substrate orientation, which may be considered as horizontal ⁇ 20° or below.
  • the term "vertical direction” or “vertical orientation” is understood to distinguish over “horizontal direction” or “horizontal orientation”. That is, the "vertical direction” or “vertical orientation” relates to a substantially vertical orientation e.g. of the carrier and the substrate, wherein a deviation of a few degrees, e.g. up to 10° or even up to 15°, from an exact vertical direction or vertical orientation is still considered as a “substantially vertical direction” or a “substantially vertical orientation”.
  • the vertical direction can be substantially parallel to the force of gravity.
  • the embodiments described herein can be utilized for evaporation on large area substrates, e.g., for OLED display manufacturing.
  • the substrates for which the structures and methods according to embodiments described herein are provided are large area substrates.
  • a large area substrate or carrier can be GEN 4.5, which corresponds to a surface area of about 0.67 m 2 (0.73 x 0.92m), GEN 5, which corresponds to a surface area of about 1.4 m 2 (1.1 m x 1.3 m), GEN 7.5, which corresponds to a surface area of about 4.29 m 2 (1.95 m x 2.2 m), GEN 8.5, which corresponds to a surface area of about 5.7m 2 (2.2 m x 2.5 m), or even GEN 10, which corresponds to a surface area of about 8.7 m 2 (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding surface areas can similarly be implemented. Half sizes of the GEN generations may also be provided in OLED display manufacturing.
  • the substrate thickness can be from 0.1 to 1.8 mm.
  • the substrate thickness can be about 0.9 mm or below, such as 0.5 mm.
  • the term "substrate” as used herein may particularly embrace substantially inflexible substrates, e.g., a wafer, slices of transparent crystal such as sapphire or the like, or a glass plate.
  • the present disclosure is not limited thereto and the term “substrate” may also embrace flexible substrates such as a web or a foil.
  • substantially inflexible is understood to distinguish over “flexible”.
  • a substantially inflexible substrate can have a certain degree of flexibility, e.g. a glass plate having a thickness of 0.9 mm or below, such as 0.5 mm or below, wherein the flexibility of the substantially inflexible substrate is small in comparison to the flexible substrates.
  • the substrate may be made of any material suitable for material deposition.
  • the substrate may be made of a material selected from the group consisting of glass (for instance soda-lime glass, borosilicate glass, and the like), metal, polymer, ceramic, compound materials, carbon fiber materials or any other material or combination of materials which can be coated by a deposition process.
  • FIG. 3 shows a schematic view of an apparatus for contactless transportation of a carrier in a deposition system according to another aspect of the present disclosure.
  • the apparatus includes at least one guide unit 311.
  • a plurality of guide units can be arranged along the transport direction 1 of the carrier 320.
  • the at least one guide unit 311 includes an active magnet unit 312 and two or more distance sensors 318 configured to measure a gap between the active magnet unit 312 and the carrier 320.
  • the active magnet unit 312 is arranged between the two or more distance sensors 318.
  • the active magnet unit 312 and the two or more distance sensors 318 can be sequentially arranged along the transport direction 1 of the carrier 320.
  • the two or more distance sensors 318 can be essentially identical.
  • the active magnet unit 312 can be controlled based on a comparison of the measurement signals of both sensors.
  • the active magnet unit 312 can be deactivated if the two or more distance sensors 318 give different signals, i.e., if the two or more distance sensors 318 indicate different gaps. Additionally or alternatively, the active magnet unit 312 can be activated if the two or more distance sensors 318 give essentially the same signals, i.e., if the two or more distance sensors 318 indicate essentially identical gaps. In some implementations, it can be determined that the measured gaps are essentially the same when a difference between the measured gaps is equal to or less than a predetermined threshold. It can be determined that the measured gaps are different when a difference between the measured gaps is greater than the predetermined threshold.
  • an active magnet unit 312 which the carrier approaches can be activated if the two or more distance sensors 318 give different signals, i.e., if the two or more distance sensors 318 indicate different gaps.
  • the apparatus can further include the position detection device, such as the encoder or resolver.
  • the active magnet units can be further controller based on the information provided by the position detection device such that a smooth transportation of the carrier in the transport direction can be achieved.
  • FIGs. 4A and B show schematic views of an apparatus 400 for contactless transportation of a carrier 410 according to embodiments described herein.
  • the apparatus and the carrier 410 can be configured according to the embodiments described herein.
  • the apparatus 400 includes the transport arrangement having the guiding structure 470, which includes the one or more first active magnetic units 475, and the carrier 410 according to the present disclosure.
  • the apparatus 400 may further include a controller configured to selectively control at least one first active magnet unit of the one or more first active magnet units 475 based on data obtained using the encoder.
  • the transport arrangement may be arranged in the vacuum chamber of the vacuum system.
  • the vacuum chamber may be a vacuum deposition chamber.
  • the present disclosure is not limited to vacuum systems and the carriers and transport arrangements described herein can be implemented in atmospheric environments.
  • the carrier 410 can include the magnet structure having the one or more first magnet units configured to magnetically interact with the guiding structure 470 of the vacuum system for providing a magnetic levitation force for levitating the carrier 410.
  • the one or more first magnet units can be a first passive magnetic unit 450.
  • the guiding structure 470 may extend in the transport direction 1 of the carrier 410, which can be a horizontal direction.
  • the guiding structure 470 can include the one or more first active magnetic units 475.
  • the carrier 410 can be movable along the guiding structure 470.
  • the first passive magnetic unit 450 e.g.
  • the devices for levitating as described herein are devices for providing a contactless force to levitate e.g. the carrier 410.
  • the transport arrangement may further include the drive structure 480.
  • the drive structure 480 can include a plurality of further magnet units, such as one or more second active magnetic units.
  • the carrier 410 can include one or more second magnet units configured to magnetically interact with the drive structure 480.
  • the one or more second magnet units can be a second passive magnetic unit 460, e.g. a bar of ferromagnetic material, to interact with the one or more second active magnetic units 485 of the drive structure 480.
  • FIG. 4B shows a side view of the transport arrangement. In FIG. 4B, an active magnetic unit of the plurality of one or more first active magnetic units 475 is shown.
  • the active magnetic unit provides a magnetic force interacting with the first passive magnetic unit 450 of the carrier 410.
  • the first passive magnetic unit 450 can be a rod of a ferromagnetic material.
  • a rod can be a portion of the carrier 410 that is connected to a support structure 412.
  • the support structure 412 can be provided by the body of the carrier 410.
  • the rod or the first passive magnetic unit, respectively, may also be integrally formed with the support structure 412 for supporting the substrate 10.
  • the carrier 410 can further include the second passive magnetic unit 460, for example a further rod.
  • the further rod can be connected to the carrier 410.
  • the rod or the second passive magnetic unit, respectively, may also be integrally formed with the support structure 412.
  • a passive magnetic unit may refer to an element with magnetic properties, which are not subject to active control or adjustment, at least not during operation of the transport arrangement.
  • the magnetic properties of a passive magnetic unit e.g. the rod or the further rod of the carrier, are not subject to active control during movement of the carrier through the vacuum chamber or vacuum system in general.
  • a controller of the transport arrangement is not configured to control a passive magnetic unit.
  • a passive magnetic unit may be adapted for generating a magnetic field, e.g. a static magnetic field.
  • a passive magnetic unit may not be configured for generating an adjustable magnetic field.
  • a passive magnetic unit may be a magnetic material, such as a ferromagnetic material, a permanent magnet or may have permanent magnetic properties.
  • the one or more first active magnetic units 475 provide for a magnetic force on the first passive magnetic unit 450 and thus, the carrier 410.
  • the one or more first active magnetic units 475 levitate the carrier 410.
  • the one or more second active magnetic units 485 can drive the carrier 410 within the vacuum chamber, for example along the transport direction 1.
  • the one or more second active magnetic units 485 form the drive structure for moving the carrier 410 in the transport direction 1 while being levitated by the one or more first active magnetic units 475 located above the carrier 410.
  • the one or more second active magnetic units 485 can interact with the second passive magnetic unit 460 to provide a force along the transport direction 1.
  • the second passive magnetic unit 460 can include a plurality of permanent magnets arranged with an alternating polarity. The resulting magnetic fields of the second passive magnetic unit 460 can interact with the one or more second active magnetic units 485 to move the carrier 410 while being levitated.
  • an active magnetic unit In order to levitate the carrier 410 with the one or more first active magnetic units 475 and/or to move the carrier 410 with the one or more second active magnetic units 485, the active magnetic units can be controlled to provide adjustable magnetic fields.
  • the adjustable magnetic field may be a static or a dynamic magnetic field.
  • an active magnetic unit is configured for generating a magnetic field for providing a magnetic levitation force extending along a vertical direction 3 (e.g. for a vertically oriented carrier) or a horizontal direction 2 (e.g. for a horizontally oriented carrier).
  • an active magnetic unit may be configured for providing a magnetic force extending along a transversal direction.
  • An active magnetic unit as described herein, may be or include an element selected from the group consisting of an electromagnetic device, a solenoid, a coil, a superconducting magnet, or any combination thereof.
  • Embodiments described herein relate to contactless levitation, transportation and/or alignment of a carrier, a substrate and/or a mask.
  • the disclosure refers to a carrier, which may include one or more elements of the group consisting of: a carrier supporting a substrate, a carrier without a substrate, a substrate, or a substrate supported by a support.
  • the term "contactless” as used throughout the present disclosure can be understood in the sense that a weight of e.g. the carrier and the substrate is not held by a mechanical contact or mechanical forces, but is held by a magnetic force. Specifically, the carrier is held in a levitating or floating state using magnetic forces instead of mechanical forces.
  • the transport arrangement described herein may have no mechanical devices, such as a mechanical rail, supporting the weight of the carrier.
  • levitating or levitation refers to a state of an object, wherein the objects floats without mechanical contact or support.
  • moving an object refers to providing a driving force, e.g. a force in a direction different to that of a levitation force, wherein the object is moved from one position to another, different position.
  • a driving force e.g. a force in a direction different to that of a levitation force
  • an object such as a carrier can be levitated, i.e. by a force counteracting gravity, and can be moved in a direction different then a direction parallel to gravity while being levitated.
  • the contactless levitation and transportation of the carrier according to embodiments described herein is beneficial in that no particles are generated due to a mechanical contact between the carrier and sections of the transport arrangement, such as mechanical rails, during the transport or alignment of the carrier. Accordingly, embodiments described herein provide for an improved purity and uniformity of the layers deposited on the substrate, in particular since a particle generation is minimized when using the contactless levitation, transportation and/or alignment. Further, a shock-less and smooth transport of the carrier can be provided and for instance a glass breakage can be reduced or even avoided.
  • FIG. 5 shows a system 500 for substrate processing according to embodiments described herein.
  • the system 500 which can be a vacuum system, can be configured for depositing one or more layers, e.g. of an organic material, on the substrate 10 using, for example, a mask 20.
  • the system 500 includes a deposition chamber, such as a vacuum chamber 502, the carrier 520 according to the embodiments described herein, and a transport arrangement 510 configured for transportation of the carrier 520 in the deposition chamber.
  • the system 500 includes one or more material deposition sources 580 in the deposition chamber.
  • the carrier 520 can be configured to hold the substrate 10 during a deposition process, such as a vacuum deposition process.
  • the system 500 can be configured for evaporation of e.g. an organic material for the manufacture of OLED devices.
  • the system 500 can be configured for CVD or PVD, such as sputter deposition.
  • the one or more material deposition sources 580 can be evaporation sources, particularly evaporation sources for depositing one or more organic materials on a substrate to form a layer of an OLED device.
  • the carrier 520 for supporting the substrate 10 e.g. during a layer deposition process can be transported into and through the deposition chamber, and in particular through a deposition area, along a transportation path, such as a linear transportation path.
  • the material can be emitted from the one or more material deposition sources 580 in an emission direction towards the deposition area in which the substrate 10 to be coated is located.
  • the one or more material deposition sources 580 may provide a line source with a plurality of openings and/or nozzles which are arranged in at least one line along the length of the one or more material deposition sources 580.
  • the material can be ejected through the plurality of openings and/or nozzles.
  • further chambers can be provided adjacent to the vacuum chamber 502.
  • the vacuum chamber 502 can be separated from adjacent chambers by a valve having a valve housing 504 and a valve unit 506. After the carrier 520 with the substrate 10 thereon is inserted into the vacuum chamber 502 as indicated by the arrow, the valve unit 506 can be closed.
  • the atmosphere in the vacuum chamber 502 can be individually controlled by generating a technical vacuum, for example with vacuum pumps connected to the vacuum chamber 502.
  • the carrier 520 and the substrate 10 are static or dynamic during deposition of the deposition material.
  • a dynamic deposition process can be provided, e.g., for the manufacture of OLED devices.
  • the system 500 can include one or more transportation paths extending through the vacuum chamber 502.
  • the carrier 520 can be configured for transportation along the one or more transportation paths, for example, past the one or more material deposition sources 580.
  • one transportation path is exemplarily indicated by the arrow, it is to be understood that the present disclosure is not limited thereto and that two or more transportation paths can be provided.
  • at least two transportation paths can be arranged substantially parallel to each other for transportation of respective carriers.
  • the one or more material deposition sources 580 can be arranged between the two transportation paths.
  • FIG. 6 shows a schematic view of a system 600 for processing, such as vacuum processing, of a substrate 10 according to further embodiments described herein.
  • the system 600 includes two or more processing regions and a transport arrangement 660 according to the present disclosure configured for sequentially transporting a carrier 601 supporting a substrate 10 and optionally a mask to the two or more processing regions.
  • the transport arrangement 660 can be configured for transporting the carrier 601 along the transport direction 1 through the two or more processing regions for substrate processing.
  • the same carrier is used for transportation of the substrate 10 through multiple processing regions.
  • the substrate 10 is not removed from the carrier 601 between substrate processing in a processing region and substrate processing a subsequent processing region, i.e., the substrate stays on the same carrier for two or more substrate processing procedures.
  • the carrier 601 can be configured according to the embodiments described herein.
  • the transport arrangement 660 can be configured as described with respect to, for example, FIGs. 4A and B.
  • the two or more processing regions can include a first deposition region 608 and a second deposition region 612.
  • a transfer region 610 can be provided between the first deposition region 608 and the second deposition region 612.
  • the plurality of regions such as the two or more processing regions and the transfer region, can be provided in one vacuum chamber.
  • the plurality of regions can be provided in different vacuum chambers connected to each other.
  • each vacuum chamber can provide one region.
  • a first vacuum chamber can provide the first deposition region 608, a second vacuum chamber can provide the transfer region 610, and a third vacuum chamber can provide the second deposition region 612.
  • the first vacuum chamber and the third vacuum chamber can be referred to as "deposition chambers”.
  • the second vacuum chamber can be referred to as a "processing chamber”.
  • Further vacuum chambers or regions can be provided adjacent to the regions shown in the example of FIG. 6.
  • the vacuum chambers or regions can be separated from adjacent regions by a valve having a valve housing 604 and a valve unit 605. After the carrier 601 with the substrate 10 thereon is inserted into a region, such as the second deposition region 612, the valve unit 605 can be closed.
  • the atmosphere in the regions can be individually controlled by generating a technical vacuum, for example, with vacuum pumps connected to the regions and/or by inserting one or more process gases, for example, in the first deposition region 608 and/or the second deposition region 612.
  • a transportation path such as a linear transportation path, can be provided in order to transport the carrier 601, having the substrate 10 thereon, into, through and out of the regions.
  • the transportation path can extend at least in part through the two or more processing regions, such as the first deposition region 608 and the second deposition region 612, and optionally through the transfer region 610.
  • the system 600 can include the transfer region 610. In some embodiments, the transfer region 610 can be omitted.
  • the transfer region 610 can be provided by a rotation module, a transit module, or a combination thereof.
  • FIG. 6 illustrates a combination of a rotation module and a transit module. In the rotation module, the track arrangement and the carrier(s) arranged thereon can be rotated around a rotational axis, such as a vertical rotation axis.
  • the carrier(s) can be transferred from the left side of the system 600 to the right side of the system 600, or vice versa.
  • the transit module can include crossing tracks such that carrier(s) can be transferred through the transit module in different directions, e.g., directions perpendicular to each other.
  • one or more deposition sources can be provided within the deposition regions, such as the first deposition region 608 and the second deposition region 612.
  • a first deposition source 630 can be provided in the first deposition region 608.
  • a second deposition source 650 can be provided in the second deposition region 612.
  • the one or more deposition sources can be evaporation sources configured for deposition of one or more organic layers on the substrate 10 to form an organic layer stack for an OLED device.
  • FIG. 7 shows a flow chart of a method 700 for contactless transportation of a carrier in a deposition system, such as a vacuum system, according to embodiments described herein.
  • the method 700 can utilize the carriers, apparatuses, and systems according to the present disclosure.
  • the method 700 includes in block 710 a generating of at least one signal indicating at least one of a position and a speed of the carrier using an encoder, and in block 720 a controlling of at least one active magnet unit of one or more first active magnet units of the deposition system based on the at least one signal.
  • the one or more first active magnet units can be included in the guiding structure which is configured to levitate the carrier.
  • the method 700 can determine a position e.g. of ends of the carrier in the deposition system based on the positional information provided by the encoder.
  • the method 700 further includes measuring a gap between the one or more first active magnet units and the carrier using e.g. a distance sensor, and controlling at least one active magnet unit of the one or more first active magnet units of the deposition system based on the measured gap.
  • the active magnet units can be selectively controlled based on at least one of the encoder signals and the signals from the distance sensor to provide a smooth movement of the carrier.
  • a current flowing through the at least one active magnet unit of the guiding structure can be changed according to the encoder signals. For example, the current can be abruptly or continuously decreased to zero for an active magnet unit which the carrier "leaves”. Further, the current can be abruptly or continuously increased from zero to a set value for an active magnet unit which the carrier "approaches" or "enters”.
  • the method for contactless transportation of a carrier in a deposition system can be conducted using computer programs, software, computer software products and the interrelated controllers, which can have a CPU, a memory, a user interface, input and output devices, and bus systems being in communication with the corresponding components of the carrier, apparatus and/or system.
  • the bus system can be wire -based or can be wireless.
  • an encoder is used to determine a position and/or a speed of the carrier in the depositions system.
  • the encoder can be provided at a drive structure of a transport arrangement of the deposition system.
  • the encoder can be provided at the carrier so as to be transported together with the carrier.
  • the position and/or a speed of the carrier can be used to selectively control the transport arrangement, such as active magnet units used to levitate the carrier. A smoot transportation of the carrier can be achieved.

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  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

La présente invention concerne un appareil pour le transport sans contact d'un support (220) dans un système de dépôt. L'appareil comprend une structure d'entraînement (210) pour déplacer le support (220) dans une direction de transport (1), et un dispositif de détection de position (215) au niveau de la structure d'entraînement (210).
PCT/EP2017/077644 2017-10-27 2017-10-27 Appareil de transport sans contact d'un support dans un système de dépôt, système de transport sans contact d'un support, support pour transport sans contact dans un système de dépôt, et procédé de transport sans contact d'un support dans un système de dépôt Ceased WO2019081045A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020197000067A KR20190058443A (ko) 2017-10-27 2017-10-27 증착 시스템에서의 캐리어의 비접촉식 이송을 위한 장치, 캐리어의 비접촉식 이송을 위한 시스템, 증착 시스템에서의 비접촉식 이송을 위한 캐리어, 및 증착 시스템에서의 캐리어의 비접촉식 이송을 위한 방법
JP2018566408A JP2020500257A (ja) 2017-10-27 2017-10-27 堆積システムにおいてキャリアを非接触搬送するための装置、キャリアを非接触搬送するためのシステム、堆積システムにおいて非接触搬送されるキャリア、及び堆積システムにおいてキャリアを非接触搬送するための方法
PCT/EP2017/077644 WO2019081045A1 (fr) 2017-10-27 2017-10-27 Appareil de transport sans contact d'un support dans un système de dépôt, système de transport sans contact d'un support, support pour transport sans contact dans un système de dépôt, et procédé de transport sans contact d'un support dans un système de dépôt
CN201780042940.9A CN109983153A (zh) 2017-10-27 2017-10-27 用于载体在沉积系统中的非接触运输的设备、用于载体的非接触运输的系统、用于在沉积系统中的非接触运输的载体和用于载体在沉积系统中的非接触运输的方法

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PCT/EP2017/077644 WO2019081045A1 (fr) 2017-10-27 2017-10-27 Appareil de transport sans contact d'un support dans un système de dépôt, système de transport sans contact d'un support, support pour transport sans contact dans un système de dépôt, et procédé de transport sans contact d'un support dans un système de dépôt

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210002087A1 (en) * 2019-07-05 2021-01-07 Century Technology (Shenzhen) Corporation Limited Adsorption device, method for making same, and transferring system having same
WO2022101468A3 (fr) * 2020-11-16 2022-07-07 Applied Materials, Inc. Système de traitement sous vide, structure de support et procédé de transport d'un substrat
WO2024226120A1 (fr) * 2023-04-27 2024-10-31 Applied Materials, Inc. Procédés et mécanismes permettant d'amortir des vibrations dans des systèmes de transfert de substrat

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102228145B1 (ko) 2019-08-07 2021-03-17 세메스 주식회사 캐리어 반송 장치 및 이를 구비하는 반송체 제어 시스템
CN110670028A (zh) * 2019-11-12 2020-01-10 谢曲坚 磁性材料表面蒸发镝的设备
JP7595466B2 (ja) * 2021-01-08 2024-12-06 キヤノントッキ株式会社 搬送装置及びキャリア

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120058478A (ko) * 2012-04-20 2012-06-07 세메스 주식회사 기판 처리 장치
US20140014918A1 (en) * 2012-07-10 2014-01-16 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light emitting display device using the apparatus, and organic light emitting display device manufactured using the method
DE102013011873A1 (de) * 2013-07-17 2015-01-22 Mecatronix Ag Positioniervorrichtung zum Bewegen eines Substrats
DE102014003882A1 (de) * 2014-03-19 2015-09-24 Mecatronix Ag Transportvorrichtung zum Bewegen und/oder Positionieren von Objekten

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014005897B3 (de) * 2014-04-25 2015-09-17 Mecatronix Ag Vorrichtung zum Halten, Positionieren und/oder Bewegen eines Objekts
KR20160063969A (ko) * 2014-11-27 2016-06-07 한국알박(주) 기판 이송 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120058478A (ko) * 2012-04-20 2012-06-07 세메스 주식회사 기판 처리 장치
US20140014918A1 (en) * 2012-07-10 2014-01-16 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light emitting display device using the apparatus, and organic light emitting display device manufactured using the method
DE102013011873A1 (de) * 2013-07-17 2015-01-22 Mecatronix Ag Positioniervorrichtung zum Bewegen eines Substrats
DE102014003882A1 (de) * 2014-03-19 2015-09-24 Mecatronix Ag Transportvorrichtung zum Bewegen und/oder Positionieren von Objekten

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210002087A1 (en) * 2019-07-05 2021-01-07 Century Technology (Shenzhen) Corporation Limited Adsorption device, method for making same, and transferring system having same
US11498779B2 (en) * 2019-07-05 2022-11-15 Century Technology (Shenzhen) Corporation Limited Adsorption device, method for making same, and transferring system having same
WO2022101468A3 (fr) * 2020-11-16 2022-07-07 Applied Materials, Inc. Système de traitement sous vide, structure de support et procédé de transport d'un substrat
WO2024226120A1 (fr) * 2023-04-27 2024-10-31 Applied Materials, Inc. Procédés et mécanismes permettant d'amortir des vibrations dans des systèmes de transfert de substrat
US20240363382A1 (en) * 2023-04-27 2024-10-31 Applied Materials, Inc. Methods and mechanisms for damping vibrations in substrate transfer systems

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