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WO2019216292A1 - Substrat multicouche en résine, boîtier pour composants électroniques, et boîtier pour composants optiques - Google Patents

Substrat multicouche en résine, boîtier pour composants électroniques, et boîtier pour composants optiques Download PDF

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Publication number
WO2019216292A1
WO2019216292A1 PCT/JP2019/018177 JP2019018177W WO2019216292A1 WO 2019216292 A1 WO2019216292 A1 WO 2019216292A1 JP 2019018177 W JP2019018177 W JP 2019018177W WO 2019216292 A1 WO2019216292 A1 WO 2019216292A1
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WO
WIPO (PCT)
Prior art keywords
resin
multilayer substrate
layer
resin layer
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2019/018177
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English (en)
Japanese (ja)
Inventor
喜人 大坪
池田　哲也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to CN201990000600.4U priority Critical patent/CN213662042U/zh
Publication of WO2019216292A1 publication Critical patent/WO2019216292A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H10W70/60—

Definitions

  • the present invention relates to a resin multilayer substrate.
  • the present invention also relates to an electronic component package and an optical component package produced using the resin multilayer substrate of the present invention.
  • a resin multilayer substrate including a laminate in which a plurality of resin layers are laminated is widely used in various electronic devices.
  • irregularities may be formed on the main surface for the purpose of accommodating electronic components.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2007-59844 discloses a concavo-convex resin multilayer substrate in which a concave portion is formed on a main surface of a multilayer circuit board and an electronic component is mounted on the concave portion.
  • FIG. 12 shows an uneven multilayer circuit board module (resin multilayer substrate) 1000 disclosed in Patent Document 1.
  • the uneven multilayer circuit board module 1000 includes a multilayer circuit board 101. Circuits 102 are formed on both main surfaces of the multilayer circuit board 101.
  • a convex portion 103 and a concave portion (cavity) 104 are formed on the upper main surface of the multilayer circuit board 101.
  • the convex part 103 is formed of resin.
  • the circuit 102 formed on the multilayer circuit board 101 is exposed on the bottom surface of the recess 104.
  • a circuit 105 is formed on the surface of the convex portion 103.
  • Components (electronic components) 106 are mounted on the circuit 102 formed on the lower main surface of the multilayer circuit board 101 and the circuit 102 exposed from the recess 104, respectively.
  • the uneven multi-layer circuit board module 1000 is produced by the following method, for example.
  • a multilayer circuit board 101 having circuits 102 formed on both main surfaces is prepared.
  • a resin sheet and a metal layer are laminated on the multilayer circuit board 101.
  • the resin sheet and the metal layer are pressed by a mold having a convex molding portion formed on the lower surface, and the resin sheet and the metal layer are pressed against the upper main surface of the multilayer circuit board 101.
  • a depression is formed in the portion pressed by the convex molding portion of the mold, and the convex portion 103 is formed in the other portion.
  • the metal layer present in the recessed portion of the resin sheet is removed by etching.
  • a desmear process is performed to the resin sheet part exposed by removing the metal layer. That is, the resin of the unnecessary resin sheet remaining at the bottom of the depression is removed to form the recess (cavity) 104.
  • the desmear process is performed by, for example, plasma cleaning.
  • the circuit 102 formed on the multilayer circuit board 101 is exposed at the bottom of the recess 104.
  • the metal layer on the convex portion 103 is processed to form the circuit 105.
  • the component 106 is mounted on the circuit 102 to complete the uneven multilayer circuit board module 1000.
  • a resin sheet is laminated on the multilayer circuit board 101, a recess is formed on the mold, and the resin remaining on the bottom of the recess is removed by a desmear process.
  • a recess (cavity) 104 is formed in the circuit board 101.
  • the resin multilayer substrate of the present invention includes a laminate in which a plurality of resin layers are laminated, and at least one of the resin layers is provided. It is assumed that a first portion having a thickness that is partially different and a second portion having a thickness smaller than that of the first portion is provided. In this case, a cavity and a convex part can be easily formed in the laminate.
  • the resin layer is not limited to the first portion having a large thickness and the second portion having a small thickness, but includes a portion having an intermediate thickness between the first portion and the second portion. Furthermore, you may provide. Further, the thickness of the intermediate thickness portion is not limited to one, and a plurality of thicknesses having different thicknesses may include the intermediate portion.
  • the resin layer including the first portion and the second portion may include a third portion whose thickness changes between the first portion and the second portion.
  • At least one laminated resin layer includes the first portion and the second portion, but all laminated resin layers may include the first portion and the second portion.
  • the laminate has a pair of main surfaces, at least one main surface having an inner wall and an inner bottom surface, at least one cavity is formed, and the thickness of at least one resin layer is formed in the portion where the cavity is formed. A small part of may be arranged. In this case, a cavity can be easily formed in the laminate.
  • At least one wiring electrode may be formed from the main surface on the side where the cavity of the laminate is formed to the inner bottom surface of the cavity via the inner side wall of the cavity.
  • the electronic component can be accommodated in the cavity, and the formed wiring electrode can be used for electrical wiring to the electronic component.
  • a metal layer may be formed on at least a part of the inner wall of the cavity. In this case, for example, it is possible to suppress the noise from being radiated to the outside from the electronic component accommodated in the cavity, or to prevent the noise from entering the electronic component accommodated in the cavity from the outside.
  • a shield function may be provided. Further, for example, the metal layer may be provided with a heat radiating function for radiating heat generated by an electronic component accommodated in the cavity to the outside.
  • a through hole may be formed to connect the inner bottom surface of the cavity and the main surface on the side where the cavity of the laminate is not formed.
  • an optical component can be accommodated in the cavity, and the formed through hole can be used as a light path.
  • At least one of an electronic component and an optical component may be accommodated in the cavity.
  • the kind of electronic component accommodated is arbitrary, For example, chip components, such as a capacitor
  • the kind of optical component accommodated is arbitrary, a lens component etc. can be accommodated, for example.
  • the laminate has a pair of main surfaces, at least one convex portion is formed on at least one main surface, and at least one resin layer having a large thickness is formed in the portion where the convex portions are formed. It may be arranged. In this case, a convex part can be easily formed in a laminated body.
  • At least one of an electronic component and an optical component may be mounted on the convex portion.
  • an electronic component is mounted on the convex portion, generally, the distance between the mounted electronic component and the inner layer electrode formed in the laminated body can be increased. Mutual interference with the inner layer electrode can be suppressed.
  • the laminate is formed by laminating the lowermost resin layer, at least one intermediate resin layer, and the uppermost resin layer, and the lowermost layer, the intermediate layer, and the uppermost resin layer are respectively
  • the thickness of the first part of the resin layer of the intermediate layer is smaller than the thickness of the first part of the lowermost layer and the uppermost resin layer
  • the thickness of the second portion of the resin layer may be smaller than the thickness of the second portion of the lowermost layer and the uppermost resin layer.
  • the resin constituting the resin layer flows inside the resin layer, and a phenomenon called resin flow occurs. May occur.
  • the inner layer electrode formed around the resin layer may be displaced.
  • the circuit wiring inside the resin multilayer substrate may be disconnected or the reliability may be lowered.
  • the resin flow is less likely to occur as the thickness of the resin layer is smaller, and is more likely to occur as the thickness of the resin layer is greater.
  • the thickness of the resin layer of the intermediate layer is smaller than the thickness of the lowermost layer or the uppermost resin layer as described above, the resin flow of the intermediate resin layer can be suppressed, and the inner layer The positional deviation of the electrodes can be suppressed, and the disconnection of the circuit wiring inside the resin multilayer substrate and the deterioration of the reliability can be suppressed.
  • the resin layer may be made of a thermoplastic resin. In this case, a portion having a small thickness can be easily formed in the resin layer by applying pressure or heat to the resin layer.
  • At least one via electrode that establishes electrical continuity between both main surfaces may be formed.
  • at least one inner layer electrode may be formed between at least one of the resin layers of the laminate. In these cases, circuit wiring can be easily formed inside the multilayer body using via electrodes and inner layer electrodes.
  • an electronic component package for accommodating electronic components and an optical component package for accommodating optical components can be produced.
  • the resin multilayer substrate of the present invention since at least one resin layer has a thick portion and a thin portion, a cavity, a convex portion, and the like can be easily and accurately formed on a laminate without using unnecessary markings. Can be formed.
  • FIG. 1A is a plan view of a resin multilayer substrate 100 according to the first embodiment.
  • FIG. 1B is a cross-sectional view of the resin multilayer substrate 100.
  • 2A to 2C are cross-sectional views illustrating steps performed in an example of a method for manufacturing the resin multilayer substrate 100.
  • FIG. FIGS. 3D and 3E are continuations of FIG. 2C, and are cross-sectional views illustrating steps performed in an example of a method for manufacturing the resin multilayer substrate 100.
  • FIGS. 4F and 4G are continuations of FIG. 3E and are cross-sectional views illustrating steps performed in an example of the method for manufacturing the resin multilayer substrate 100, respectively. It is sectional drawing of the resin multilayer substrate 200 concerning 2nd Embodiment.
  • each embodiment shows an embodiment of the present invention by way of example, and the present invention is not limited to the content of the embodiment. Moreover, it is also possible to implement combining the content described in different embodiment, and the implementation content in that case is also included in this invention.
  • the drawings are for helping the understanding of the specification, and may be schematically drawn, and the drawn components or the ratio of dimensions between the components are described in the specification. There are cases where the ratio of these dimensions does not match.
  • the constituent elements described in the specification may be omitted in the drawings or may be drawn with the number omitted.
  • FIG. 1A and 1B show a resin multilayer substrate 100 according to the first embodiment.
  • 1A is a plan view of the resin multilayer substrate 100.
  • FIG. 1B is a cross-sectional view of the resin multilayer substrate 100, and shows a dot-dash line XX portion in FIG.
  • the resin multilayer substrate 100 includes a laminated body 4 in which a lowermost resin layer 1, an intermediate resin layer 2, and an uppermost resin layer 3 are laminated.
  • thermoplastic resin such as a liquid crystal polymer (LCP)
  • LCP liquid crystal polymer
  • thermoplastic resin other than the liquid crystal polymer may be used.
  • PEEK polyetheretherketone
  • PEI polyetherimide
  • PI polyimide
  • the resin layer 1 is partially different in thickness, and includes a first portion 1a having a large thickness and a second portion 1b having a smaller thickness than the first portion 1a having a large thickness. And the 3rd part 1c from which thickness changes is provided between the 1st part 1a with large thickness, and the 2nd part 1b with small thickness.
  • the second portion 1b is rectangular, and the first portion 1a surrounds the periphery of the second portion 1b.
  • the resin layer 2 is also partially different in thickness, and includes a first portion 2a having a large thickness and a second portion 2b having a smaller thickness than the first portion 2a having a large thickness. And the 3rd part 2c from which thickness changes is provided between the 1st part 2a with large thickness, and the 2nd part 2b with small thickness.
  • the second portion 2b is rectangular, and the first portion 2a surrounds the second portion 2b in an annular shape.
  • the resin layer 3 is also partially different in thickness, and includes a first portion 3a having a large thickness and a second portion 3b having a smaller thickness than the first portion 3a having a large thickness. And the 3rd part 3c from which thickness changes is provided between the 1st part 3a with large thickness, and the 2nd part 3b with small thickness.
  • the second portion 3b is rectangular, and the first portion 3a surrounds the second portion 3b in an annular shape.
  • the second portion 1b of the resin layer 1, the second portion 2b of the resin layer 2, and the second portion 3b of the resin layer 3 are arranged so as to overlap each other, and the cavity 5 is formed in that portion.
  • the cavity 5 has an open upper main surface of the laminate 4 and has an inner wall 5a and an inner bottom surface 5b.
  • the resin layer 2 and the resin layer 3 are respectively provided with via electrodes 6 for electrical conduction between both main surfaces.
  • the material of the via electrode 6 is arbitrary, but, for example, copper, silver, a copper alloy, a silver alloy, Sn—Ag solder, or the like can be used.
  • Inner layer electrodes 7 are formed between the resin layer 1 and the resin layer 2 and between the resin layer 2 and the resin layer 3, respectively.
  • the material of the inner layer electrode 7 is arbitrary, for example, copper, silver, a copper alloy, a silver alloy, or the like can be used.
  • a wiring electrode 8 is formed so as to reach the inner bottom surface 5b of the cavity 5 from the upper main surface of the multilayer body 4 via the inner wall 5a of the cavity 5.
  • the material of the wiring electrode 8 is arbitrary, for example, copper, a copper alloy, or the like can be used.
  • the material of the plating layer can be, for example, Ni / Sn, Ni / solder, Ni / Au, or the like.
  • the resin multilayer substrate 100 twelve wiring electrodes 8 that are continuous from the inner bottom surface 5 b of the cavity 5 to the inner side wall 5 a and the upper main surface of the multilayer body 4 are formed.
  • the number of wiring electrodes 8 is arbitrary and can be increased or decreased.
  • An inner layer electrode 7 formed between the resin layer 1 and the resin layer 2 and an inner layer electrode 7 formed between the resin layer 2 and the resin layer 3 are formed by the via electrode 6 formed in the resin layer 2. Electrically connected.
  • the inner layer electrode 7 and the wiring electrode 8 are electrically connected by a via electrode 6 formed in the resin layer 3.
  • the electronic component can be accommodated in the cavity 5 by mounting the electronic component on the portion formed on the inner bottom surface 5 b of the cavity 5 of the wiring electrode 8. That is, the resin multilayer substrate 100 can be used as an electronic component package.
  • the portion formed on the inner bottom surface 5b of the cavity 5 of the wiring electrode 8 functions as a mounting electrode.
  • the type of electronic component accommodated in the cavity 5 is arbitrary, but for example, a semiconductor integrated circuit component or a resin-encapsulated electronic module component can be accommodated. Alternatively, instead of these, chip components such as a capacitor, a coil, and a resistor may be accommodated.
  • the resin layer 1 is provided with the first part 1a and the second part 1b
  • the resin layer 2 is provided with the first part 2a and the second part 2b
  • the resin layer 3 is provided with the first part 3a and
  • the cavity 5 is easily formed in the laminated body 4 by providing the second portion 3b and arranging the second portions 1b, 2b, and 3b in an overlapping manner.
  • the resin layer is not limited to three layers, and may be one layer, two layers, or more than three layers.
  • Resin multilayer substrate 100 can be manufactured, for example, by the method shown in FIGS. 2 (A) to 4 (G).
  • FIGS. 2 (A) to 4 (G) a case where one resin multilayer substrate 100 is manufactured will be described as an example.
  • a mother resin layer in which a large number of resin layers are arranged in a matrix is used.
  • the resin multilayer substrate 100 may be manufactured in a lump, and may be divided into individual resin multilayer substrates 100 during the manufacturing process or after completion.
  • a resin layer 1, a resin layer 2, and a resin layer 3 are prepared.
  • Copper foils 17 for forming the inner layer electrode 7 and the wiring electrode 8 are attached in advance to the upper main surfaces of the resin layers 1 to 3, respectively.
  • the copper foil 17 is etched into a desired shape by a well-known etching technique, and the inner layer electrodes 7 are formed on the upper principal surfaces of the resin layer 1 and the resin layer 2, respectively.
  • a wiring electrode 8 is formed on the upper main surface of the layer 3. More specifically, first, resist patterns each having a desired pattern shape are formed on the surfaces of the copper foils 17 of the resin layer 1, the resin layer 2, and the resin layer 3. Next, the resin layer 1, the resin layer 2, and the resin layer 3 are each immersed in an etching solution to etch the copper foil 17, and the inner layer electrode 7 is formed on each of the resin layer 1 and the resin layer 2. A wiring electrode 8 is formed on the substrate. Next, unnecessary resist patterns are removed from the resin layer 1, the resin layer 2, and the resin layer 3, respectively.
  • the through hole 16 for forming the via electrode 6 is formed in the resin layer 2 by a method such as irradiating laser light. .
  • the through hole 16 reaches the inner layer electrode 7.
  • the through hole 16 for forming the via electrode 6 is formed in the resin layer 3 by a method such as irradiating a laser beam.
  • the through hole 16 reaches the wiring electrode 8.
  • the resin layer 1 is also drawn upside down.
  • the conductive paste 26 for forming the via electrode 6 is filled into the through holes 16 formed in the resin layer 2 and the resin layer 3 respectively.
  • the resin layer 1, the resin layer 2, and the resin layer 3 are superposed and integrated by heating and pressurizing to produce a laminate 4.
  • the conductive paste 26 filled in the through holes 16 formed in the resin layers 2 and 3 is cured and becomes the via electrode 6.
  • the laminate 4 is pressurized while being heated by a mold having a desired shape to form a cavity 5.
  • the resin layer 1 is plastically deformed to form a second portion 1b having a small thickness, and the resin portion 1 has a first portion 1a having a large thickness, a second portion 1b having a small thickness, and a third portion having a changed thickness. 1c.
  • the resin layer 2 is plastically deformed to form a second portion 2b having a small thickness, and the resin portion 2 has a first portion 2a having a large thickness, a second portion 2b having a small thickness, and a third portion having a varying thickness. 2c.
  • the resin layer 3 is plastically deformed to form a second portion 3b having a small thickness, and the resin layer 3 has a first portion 3a having a large thickness, a second portion 3b having a small thickness, and a third portion having a varying thickness. 3c is provided. And the part in which each 2nd part 1b, 2b, 3b in the laminated body 4 is piled up becomes the cavity 5. FIG. In addition, with the plastic deformation of the resin layer 3, the wiring electrode 8 formed on the upper main surface of the resin layer 3 is also deformed.
  • a plating layer is formed on the surface of the wiring electrode 8 as necessary, and the resin multilayer substrate 100 is completed.
  • FIG. 5 shows a resin multilayer substrate 200 according to the second embodiment. However, FIG. 5 is a cross-sectional view of the resin multilayer substrate 200.
  • the resin multilayer substrate 200 is obtained by housing electronic components in the cavity 5 of the resin multilayer substrate 100 according to the first embodiment described above. Specifically, a semiconductor integrated circuit component 21 as an electronic component was mounted on the wiring electrode 8 formed on the resin multilayer substrate 100 on the inner bottom surface 5 b of the cavity 5 using bumps 22.
  • the electronic component accommodated in the cavity is not limited to a semiconductor integrated circuit component, and may be a resin-encapsulated module, a chip component such as a capacitor, a coil, or a resistor.
  • the electronic component accommodated in the cavity may be a resin-encapsulated module, a chip component such as a capacitor, a coil, or a resistor.
  • optical components such as lens components may be accommodated.
  • FIG. 6 shows a resin multilayer substrate 300 according to the third embodiment. However, FIG. 6 is a cross-sectional view of the resin multilayer substrate 300.
  • Resin multilayer substrate 300 is characterized in that metal layer 36 is formed in cavity 5.
  • the resin multilayer substrate 300 includes a laminate 35 in which a lowermost resin layer 31, two intermediate resin layers 32 and 33, and an uppermost resin layer 34 are laminated.
  • the resin layer 31 includes a first portion 31a having a large thickness, a second portion 31b having a small thickness, and a third portion 31c having a varying thickness.
  • the resin layer 32 includes a first portion 32a having a large thickness, a second portion 32b having a small thickness, and a third portion 32c having a varying thickness.
  • the resin layer 33 includes a first portion 33a having a large thickness, a second portion 33b having a small thickness, and a third portion 33c having a varying thickness.
  • the resin layer 34 includes a first portion 34a having a large thickness, a second portion 34b having a small thickness, and a third portion 34c having a varying thickness.
  • the second portion 31b of the resin layer 31, the second portion 32b of the resin layer 32, the second portion 33b of the resin layer 33, and the second portion 34b of the resin layer 34 are overlapped.
  • the cavity 5 is formed in that portion.
  • the cavity 5 is opened at the upper main surface of the laminate 35 and has an inner wall 5a and an inner bottom surface 5b.
  • the via electrode 6 and the inner layer electrode 7 are formed in the laminated body 35 as necessary.
  • a wiring electrode 8 is formed on the inner bottom surface 5 b of the cavity 5. *
  • a metal layer 36 is formed on the upper main surface of the laminate 35 and on the inner wall 5 a in the cavity 5.
  • the material of the metal layer 36 is arbitrary, for example, copper, a copper alloy, or the like can be used.
  • Resin multilayer substrate 300 can accommodate electronic components in cavity 5.
  • the electronic component is mounted on the wiring electrode 8 formed on the inner bottom surface 5 b of the cavity 5.
  • the metal layer 36 can be used as a shield or a heat dissipation path.
  • the metal layer 36 on the inner wall 5a of the cavity 5 shields the side surface of the electronic component housed in the cavity 5, and suppresses noise from being radiated from the electronic component to the outside. Can be prevented from entering.
  • the heat can be absorbed by the metal layer 36 on the inner wall 5 a of the cavity 5, and the heat can be dissipated from the metal layer 36 on the upper main surface of the laminate 35. And it can suppress that an electronic component becomes abnormally high temperature.
  • FIG. 7 shows a resin multilayer substrate 400 according to the fourth embodiment. However, FIG. 7 is a cross-sectional view of the resin multilayer substrate 400.
  • the resin multilayer substrate 400 is obtained by housing electronic components in the cavity 5 of the resin multilayer substrate 300 according to the third embodiment described above. Specifically, a resin sealing module 41 as an electronic component was mounted on the wiring electrode 8 formed on the inner bottom surface 5 b of the cavity 5 of the resin multilayer substrate 300 with solder 42.
  • the resin sealing module 41 includes a substrate 43 inside. Various electronic components 44 are mounted on both main surfaces of the substrate 43. In addition, metal pins 45 for electrical connection are mounted on the lower main surface of the substrate 43. The substrate 43 is sealed with a sealing resin 46 together with the electronic component 44 and the metal pin 45. Although not shown, an electrode is formed on the bottom surface of the resin sealing module 41.
  • the side surface of the resin sealing module 41 accommodated in the cavity 5 is shielded by the metal layer 36 on the inner wall 5 a of the cavity 5. That is, the metal layer 36 prevents noise from being radiated from the resin sealing module 41 to the outside. Further, the metal layer 36 suppresses noise from entering the resin sealing module 41 from the outside.
  • the resin multilayer substrate 400 absorbs heat by the metal layer 36 on the inner wall 5a of the cavity 5 and dissipates the heat from the metal layer 36 on the upper main surface of the laminate 35. Can do. And it can suppress that the resin sealing module 41 becomes abnormally high temperature.
  • FIG. 8 shows a resin multilayer substrate 500 according to the fifth embodiment. However, FIG. 8 is a cross-sectional view of the resin multilayer substrate 500.
  • the thicknesses of the first portions 1a, 2a, and 3a having large thicknesses are mutually different in the three resin layers 1, 2, and 3 constituting the laminate 4.
  • the thicknesses of the second portions 1b, 2b, and 3b having the same and small thickness were equal to each other.
  • the resin multilayer substrate 500 according to the fifth embodiment is characterized in that the thickness of the first portion having a large thickness is not uniform between the resin layers, and the thickness of the second portion having a small thickness is not uniform between the resin layers. It is said.
  • the resin multilayer substrate 500 includes a laminate 56 in which a lowermost resin layer 51, three intermediate resin layers 52, 53, and 54 and an uppermost resin layer 55 are laminated.
  • the resin layer 51 includes a first portion 51a having a large thickness, a second portion 51b having a small thickness, and a third portion 51c having a varying thickness.
  • the resin layer 52 includes a first portion 52a having a large thickness, a second portion 52b having a small thickness, and a third portion 52c having a varying thickness.
  • the resin layer 53 includes a first portion 53a having a large thickness, a second portion 53b having a small thickness, and a third portion 53c having a varying thickness.
  • the resin layer 54 includes a first portion 54a having a large thickness, a second portion 54b having a small thickness, and a third portion 54c having a varying thickness.
  • the resin layer 55 includes a first portion 55a having a large thickness, a second portion 55b having a small thickness, and a third portion 55c having a varying thickness.
  • the second portion 51b of the resin layer 51, the second portion 52b of the resin layer 52, the second portion 53b of the resin layer 53, the second portion 54b of the resin layer 54, and the resin layer 55 The second portion 55b is overlapped and the cavity 5 is formed in that portion.
  • the cavity 5 is opened at the upper main surface of the laminate 56, and has an inner wall 5a and an inner bottom surface 5b.
  • the thickness of the first portion 52a of the intermediate resin layer 52, the first portion 53a of the resin layer 53, and the first portion 54a of the resin layer 54 is the first portion of the lowermost resin layer 51. 51a and the thickness of the first portion 55a of the uppermost resin layer 55 are smaller. Further, the thickness of the second portion 52b of the intermediate resin layer 52, the second portion 53b of the resin layer 53, and the second portion 54b of the resin layer 54 is set so that the second portion 51b of the lowermost resin layer 51 and the uppermost layer. The thickness of the second portion 55b of the resin layer 55 is smaller. That is, in the resin multilayer substrate 500, the thickness of the intermediate resin layers 52, 53, and 54 is smaller than the thickness of the lowermost resin layer 51 and the uppermost resin layer 55 over the entire area.
  • the via electrode 6 and the inner layer electrode 7 are formed in the laminated body 56 as needed.
  • a wiring electrode 8 is formed on the inner bottom surface 5 b of the cavity 5.
  • more inner layer electrodes 7 are concentrated and formed between the intermediate resin layers 52, 53, and 54.
  • the resin layers 51 to 55 are respectively sandwiched between molds of desired shapes, heated and pressurized to be plastically deformed, and the first portions 51a to 55a having a large thickness.
  • the second portions 51b to 55b having a small thickness and the third portions 51c to 55c having a varying thickness may be formed.
  • the resin constituting the resin layers 51 to 55 may flow inside the resin layers 51 to 55, causing a phenomenon of resin flow.
  • the inner layer electrode 7 formed around the resin layer may be displaced. If the inner layer electrode 7 is displaced, the circuit wiring inside the resin multilayer substrate may be disconnected or the characteristics may be deteriorated.
  • the resin flow is less likely to occur as the thickness of the resin layer is smaller, and more likely to occur as the thickness of the resin layer is greater.
  • the thickness of the intermediate resin layers 52, 53, 54 is made smaller than the thickness of the lowermost resin layer 51 and the uppermost resin layer 55, and the intermediate resin layer 52,
  • the inner layer electrode 7 By concentrating and forming the inner layer electrode 7 between the layers 53 and 54, the generation of the resin flow of the intermediate resin layers 52, 53 and 54 is suppressed, and the intermediate resin layers 52, 53 and 54 are formed around the intermediate resin layers 52, 53 and 54.
  • the positional deviation of the formed inner layer electrode 7 is suppressed, and disconnection of the internal circuit wiring and deterioration of characteristics are suppressed.
  • the resin flow of the intermediate resin layers 52, 53, and 54 is less likely to occur, and disconnection of internal circuit wiring and deterioration of characteristics due to the resin flow are less likely to occur.
  • FIG. 9 shows a resin multilayer substrate 600 according to the sixth embodiment. However, FIG. 9 is a cross-sectional view of the resin multilayer substrate 600.
  • the resin multilayer substrate 600 is obtained by omitting the via electrode 6, the inner layer electrode 7, and the wiring electrode 8 from the resin multilayer substrate 100 according to the first embodiment. That is, in the resin multilayer substrate of the present invention, the via electrode 6, the inner layer electrode 7, and the wiring electrode 8 are not essential components, and a resin multilayer substrate that does not include them can be configured like the resin multilayer substrate 600.
  • FIG. 10 shows a resin multilayer substrate 700 according to the seventh embodiment. However, FIG. 10 is a cross-sectional view of the resin multilayer substrate 700.
  • Resin multilayer substrate 700 is characterized in that convex portions 75 are formed on the upper main surface of laminate 74. Further, the resin sealing module 41 is mounted on the convex portion 75.
  • the resin multilayer substrate 700 includes a laminate 74 in which a lowermost resin layer 71, an intermediate resin layer 72, and an uppermost resin layer 73 are laminated.
  • the resin layer 71 includes a first portion 71a having a large thickness and a second portion 71b having a small thickness.
  • the resin layer 72 includes a first portion 72a having a large thickness, a second portion 72b having a small thickness, and a third portion 72c having a varying thickness.
  • the resin layer 73 includes a first portion 73a having a large thickness, a second portion 73b having a small thickness, and a third portion 73c having a varying thickness.
  • the first portion 71a of the resin layer 71, the first portion 72a of the resin layer 72, and the first portion 73a of the resin layer 73 are arranged so as to overlap with each other, and the convex portion 75 is formed in that portion. It is configured.
  • the resin layer 72 and the resin layer 73 are formed with via electrodes 6 for electrical conduction between the two main surfaces.
  • Inner layer electrodes 7 are formed between the resin layer 71 and the resin layer 72 and between the resin layer 72 and the resin layer 73, respectively.
  • the wiring electrode 8 is formed on the upper main surface of the first portion 73 a of the resin layer 73.
  • the inner layer electrode 7 formed between the resin layer 71 and the resin layer 72 and the inner layer electrode 7 formed between the resin layer 72 and the resin layer 73 are formed by the via electrode 6 formed in the resin layer 72. Electrically connected. Further, the inner layer electrode 7 and the wiring electrode 8 that are formed between the resin layer 72 and the resin layer 73 are electrically connected by the via electrode 6 formed in the resin layer 73.
  • a resin sealing module 41 is mounted as an electronic component by solder 42 on the wiring electrode 8 formed on the upper main surface of the first portion 73 a having a large thickness of the resin layer 73. That is, in the resin multilayer substrate 700, the resin sealing module 41 is mounted on the convex portion 75 formed on the upper main surface of the multilayer body 74.
  • the resin sealing module 41 includes a substrate 43 inside. Various electronic components 44 are mounted on both main surfaces of the substrate 43. In addition, metal pins 45 for electrical connection are mounted on the lower main surface of the substrate 43. The substrate 43 is sealed with a sealing resin 46 together with the electronic component 44 and the metal pin 45. Although not shown, an electrode is formed on the bottom surface of the resin sealing module 41. Instead of the metal pin 45, electrical connection may be achieved by vias or plating.
  • the resin sealing module 41 is mounted as an electronic component on the convex portion 75 formed on the upper main surface of the laminate 74, as can be seen from FIG. And the distance between the inner layer electrode 7 formed inside the stacked body 74 is large.
  • the distance between the electronic component (resin sealing module 41) and the inner layer electrode 7 formed in the laminated body 74 is large, the electronic component (resin sealing module 41) and the inner layer electrode Mutual interference with 7 is suppressed.
  • FIG. 11 shows a resin multilayer substrate 800 according to the eighth embodiment. However, FIG. 11 is a cross-sectional view of the resin multilayer substrate 800.
  • Resin multilayer substrate 800 is for mounting optical components such as lens components.
  • the resin multilayer substrate 800 includes a laminate 87 in which a lowermost resin layer 81, four intermediate resin layers 82 to 85, and an uppermost resin layer 86 are laminated.
  • the resin layer 81 includes a first portion 81a having a large thickness, a second portion 81b having a small thickness, and a third portion 81c having a varying thickness.
  • the resin layer 82 includes a first portion 82a having a large thickness, a second portion 82b having a small thickness, and a third portion 82c having a varying thickness.
  • the resin layer 83 includes a first portion 83a having a large thickness, a second portion 83b having a small thickness, and a third portion 83c having a varying thickness.
  • the resin layer 84 includes a first portion 84a having a large thickness, a second portion 84b having a small thickness, and a third portion 84c having a varying thickness.
  • the resin layer 85 includes a first portion 85a having a large thickness, a second portion 85b having a small thickness, and a third portion 85c having a varying thickness.
  • the resin layer 86 includes a first portion 86a having a large thickness and a second portion 86b having a small thickness.
  • the second portion 85b and the second portion 86b of the resin layer 86 are disposed so as to overlap each other, and a cavity 95 is formed in that portion.
  • the cavity 95 is opened at the lower main surface of the laminated body 87 and has an inner wall 95a and an inner bottom surface 95b.
  • a through hole 96 is formed through the upper main surface of the laminated body 87 and the inner bottom surface 95 b of the cavity 95.
  • a mounting electrode 97 used for mounting the resin multilayer substrate 800 on another large substrate or the like is formed on the lower main surface of the laminate 87. Further, an optical component mounting electrode 98 for mounting an optical component is formed on the inner bottom surface 95 b of the cavity 95.
  • the resin multilayer substrate 800 can mount an optical component such as a lens component on the upper surface or inside of the cavity 95 using the optical component mounting electrode 98. That is, the resin multilayer substrate 800 constitutes an optical component package.
  • the through hole 96 can be used as a light path.
  • the resin multilayer substrates 100, 200, 300, 400, 500, 600, 700, and 800 according to the first to eighth embodiments have been described above.
  • the present invention is not limited to the contents described above, and various modifications can be made in accordance with the spirit of the invention.
  • all the resin layers constituting the laminate were provided with a portion having a large thickness and a portion having a small thickness.
  • all the resin layers 1, 2, 3 constituting the laminated body 4 include the first portions 1 a, 2 a, 3 a having a large thickness and the second portions 1 b, 2 b, 3 b having a small thickness. I was prepared.
  • the first portion having a large thickness and the second portion having a small thickness may be provided.
  • each of the resin multilayer substrates is formed with either a cavity or a convex portion.
  • the cavities 5 (95) were formed in the resin multilayer substrates 100, 200, 300, 400, 500, 600, and 800, respectively.
  • the convex part 75 was formed in the resin multilayer substrate 700.
  • both the cavity and the convex portion may be formed on one resin multilayer substrate.
  • the number and shape of the cavities and projections are arbitrary and are not limited to the above-described contents.
  • the laminate 4 is formed by stacking and integrating the resin layers 1, 2, and 3, and then molding the laminate 4 into a desired shape.
  • the present invention is not limited to this method.
  • the resin layers 1, 2, 3 may be a method of producing the laminate 4 by integrating the three.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

Le but de la présente invention est de produire facilement un substrat multicouche en résine ayant une cavité ou une partie convexe. Le substrat multicouche en résine est pourvu d'un stratifié 4 dans lequel une pluralité de couches de résine 1, 2 et 3 sont stratifiées ensemble, la couche de résine 1 (2, 3) a des épaisseurs partiellement variables et est pourvue d'une première partie de grande épaisseur 1a (2a, 3a) et d'une deuxième partie d'épaisseur réduite 1b (2b, 3b) ayant une épaisseur inférieure à celle de la première partie de grande épaisseur 1a (2a, 3a). La couche de résine 1 (2, 3) peut être pourvue d'une troisième partie 1c (2c, 3c) dont l'épaisseur varie. Les deuxièmes parties d'épaisseur réduite 1b, 2b et 3b sont superposées pour former une cavité 5.
PCT/JP2019/018177 2018-05-10 2019-05-01 Substrat multicouche en résine, boîtier pour composants électroniques, et boîtier pour composants optiques Ceased WO2019216292A1 (fr)

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CN201990000600.4U CN213662042U (zh) 2018-05-10 2019-05-01 树脂多层基板、电子部件用封装件及光学部件用封装件

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JP2018-091153 2018-05-10
JP2018091153 2018-05-10

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WO2019216292A1 true WO2019216292A1 (fr) 2019-11-14

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CN114649693A (zh) * 2020-12-18 2022-06-21 泰连德国有限公司 电气元件、制备其的方法以及制备其的设备

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CN118553689A (zh) * 2023-02-24 2024-08-27 星科金朋私人有限公司 具有改进的空间利用的半导体封装及其制造方法

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WO1998049726A1 (fr) * 1997-04-30 1998-11-05 Hitachi Chemical Company, Ltd. Plaquette pour monter un element a semi-conducteur, procede permettant de la produire et dispositif a semi-conducteur
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WO2007069789A1 (fr) * 2005-12-16 2007-06-21 Ibiden Co., Ltd. Plaque de cablage imprime multicouche et son procede de fabrication
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JPS54156076A (en) * 1978-05-31 1979-12-08 Shin Kobe Electric Machinery Production of thermoplastic resin laminate
JPS63135433A (ja) * 1986-11-27 1988-06-07 Hitachi Chem Co Ltd 熱可塑性樹脂積層板
WO1998049726A1 (fr) * 1997-04-30 1998-11-05 Hitachi Chemical Company, Ltd. Plaquette pour monter un element a semi-conducteur, procede permettant de la produire et dispositif a semi-conducteur
JP2000077822A (ja) * 1998-06-17 2000-03-14 Katsurayama Technol:Kk 凹みプリント配線板およびその製造方法、ならびに電子部品
JP2004146411A (ja) * 2002-10-22 2004-05-20 Citizen Electronics Co Ltd 高輝度発光装置及びその製造方法
WO2007069789A1 (fr) * 2005-12-16 2007-06-21 Ibiden Co., Ltd. Plaque de cablage imprime multicouche et son procede de fabrication
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CN114649693A (zh) * 2020-12-18 2022-06-21 泰连德国有限公司 电气元件、制备其的方法以及制备其的设备
KR20220088353A (ko) * 2020-12-18 2022-06-27 티이 커넥티버티 저머니 게엠베하 전기 요소, 납땜 단계용 전기 요소를 제조하기 위한 방법, 및 납땜 단계용 전기 요소 제조를 위한 디바이스
JP2022097427A (ja) * 2020-12-18 2022-06-30 ティーイー コネクティビティ ジャーマニー ゲゼルシャフト ミット ベシュレンクテル ハフツンク 電気要素、はんだ付け工程のための電気要素を準備する方法、およびはんだ付け工程のための電気要素を準備する装置
JP7593714B2 (ja) 2020-12-18 2024-12-03 ティーイー コネクティビティ ジャーマニー ゲゼルシャフト ミット ベシュレンクテル ハフツンク 電気要素、はんだ付け工程のための電気要素を準備する方法、およびはんだ付け工程のための電気要素を準備する装置
KR102771548B1 (ko) * 2020-12-18 2025-02-20 티이 커넥티버티 저머니 게엠베하 전기 요소, 납땜 단계용 전기 요소를 제조하기 위한 방법, 및 납땜 단계용 전기 요소 제조를 위한 디바이스
CN114649693B (zh) * 2020-12-18 2025-03-07 泰连德国有限公司 电气元件、制备其的方法以及制备其的设备

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