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WO2019158130A1 - Filtre passe-bande de type feuille empilée - Google Patents

Filtre passe-bande de type feuille empilée Download PDF

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Publication number
WO2019158130A1
WO2019158130A1 PCT/CN2019/079889 CN2019079889W WO2019158130A1 WO 2019158130 A1 WO2019158130 A1 WO 2019158130A1 CN 2019079889 W CN2019079889 W CN 2019079889W WO 2019158130 A1 WO2019158130 A1 WO 2019158130A1
Authority
WO
WIPO (PCT)
Prior art keywords
order
strip line
resonator
pass filter
band pass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/079889
Other languages
English (en)
Chinese (zh)
Inventor
黎燕林
肖倩
朱建华
刘季超
周丽洁
王志华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN ZHENHUA FU ELECTRONICS CO Ltd
Original Assignee
SHENZHEN ZHENHUA FU ELECTRONICS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHENZHEN ZHENHUA FU ELECTRONICS CO Ltd filed Critical SHENZHEN ZHENHUA FU ELECTRONICS CO Ltd
Priority to JP2019524398A priority Critical patent/JP6793829B2/ja
Publication of WO2019158130A1 publication Critical patent/WO2019158130A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/203—Strip line filters
    • H01P1/20327—Electromagnetic interstage coupling
    • H01P1/20336—Comb or interdigital filters
    • H01P1/20345—Multilayer filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P7/00—Resonators of the waveguide type
    • H01P7/08—Strip line resonators

Definitions

  • the present invention is in the field of filters and, more particularly, to a laminated chip band pass filter.
  • the band pass filter directly affects the signal transmission quality of the whole system in microwave and millimeter wave systems such as communication and radar.
  • PCBs and integrated passive devices (IPD)) and lamination techniques such as low temperature co-fired ceramics (LTCC) can greatly reduce filter volume.
  • the former has high frequency loss and low quality factor (Q value) of the filter, which limits its application in high frequency and high performance to a certain extent; the latter has many advantages in its three-dimensional (3D) integration and excellent material properties. Widely used in chip components and microwave millimeter wave systems.
  • the laminated chip structure of the multilayer strip line resonator is favored for its advantages of simple structure, high design freedom, and relatively easy processing.
  • Current multilayer chip bandpass filters typically align multi-layer stripline resonators on the same horizontal plane, the so-called "coplanar integration.”
  • the structure uses a multi-layer stripline to increase the loading capacitance, thereby realizing a quarter-wavelength resonator with a shorter stripline, which greatly reduces the filter size.
  • the technical solution adopted by the present invention is to provide a laminated chip type band pass filter, comprising a ceramic substrate, a sixth-order resonator disposed in the ceramic substrate, and two ceramic resonators respectively disposed on the ceramic substrate.
  • each of the resonators extending along a width direction of the ceramic substrate, each of the resonators is a three-layer strip line resonator; and the sixth-order resonator includes a length along the ceramic substrate First-order stripline resonator, second-order stripline resonator, third-order stripline resonator, fourth-order stripline resonator, fifth-order stripline resonator, and a sixth-order stripline resonator, wherein the first-order stripline resonator, the third-order stripline resonator, and the fifth-order stripline resonator are located in a lower plane, the second order a strip line resonator, the fourth-order strip line resonator, and the sixth-order strip line resonator are located in an upper plane, the lower plane being below the upper plane along a height direction of the ceramic substrate,
  • the first-order strip line resonator is connected to the input end, a sixth-order strip
  • the interlayer spacing of the three strip lines of each of the resonators is the same, and the strip line of the top layer and the strip line of the bottom layer are mirror-symmetrically disposed with respect to the strip line of the middle layer, and the middle layer is One end of the strip line is grounded, and the other end of the strip line of the intermediate layer is suspended.
  • the strip line of the top layer is suspended near the grounded end of the strip line of the intermediate layer, and the other end of the strip line of the top layer is grounded.
  • the strip line of the bottom layer is suspended near one end of the ground of the strip line of the intermediate layer, and the other end of the strip line of the bottom layer is grounded.
  • each of the resonators further includes a protruding strip corresponding to the suspended ends of the strip lines of each layer, the protruding strips are spaced apart from the corresponding floating ends, and each of the protruding strips is grounded .
  • the laminated chip band pass filter further includes two grounding straps respectively disposed on the left and right sides of the ceramic base, and each of the grounding straps is connected to the protruding strips, each of the strips The ground terminal of the line is connected to the ground strap adjacent to the ground.
  • the laminated chip band pass filter further includes an upper ground plate disposed on an upper side of the ceramic base body and a lower ground plate disposed on a lower side of the ceramic base body, the lower plane to the The distance of the lower ground plate is substantially equal to the distance from the upper plane to the upper ground plate.
  • the two sides of the upper grounding plate are respectively provided with upper notches for forming a medium region, and the edges of the two sides of the lower grounding plate are respectively provided with lower notches for forming a medium region.
  • first-order strip line resonator is spaced apart from the input end
  • sixth-order strip line resonator is spaced apart from the output end
  • laminated chip band pass filter further A first tap connecting the first-order stripline resonator to the input terminal and a second tap connecting the sixth-order stripline resonator to the output terminal are included.
  • a width of the first tap connected to the input end is tapered from the input end to a direction away from the input end; a width at which the second tap is connected to the output end is outputted by the output end It is tapered toward the direction away from the output end.
  • first tap is a single-layer folded strip line
  • second tap is a single-layer folded strip line
  • each of the resonators has a different length.
  • the beneficial effect of the laminated chip band pass filter provided by the present invention is that, compared with the prior art, the present invention forms a six-order three-layer strip line resonator, so that three layers of strip lines of each resonator form two
  • An additional flat-plate loading capacitor makes the resonator length much smaller than 1/4 wavelength; the sixth-order resonator is placed on two planes of different heights to make full use of the longitudinal space, and the lateral spacing is shortened while ensuring the same coupling amount.
  • the laminated chip band pass filter has the characteristics of higher integration, small volume, small insertion loss of the pass band, high resistance of the stop band, high reliability, and the like, and the processing process is simple when using the low temperature co-fired ceramic technology. The cost is lower.
  • FIG. 1 is a perspective perspective structural view of a laminated chip type band pass filter according to an embodiment of the present invention
  • FIG. 2 is a schematic top plan view of a laminated chip band pass filter according to an embodiment of the present invention
  • FIG. 3 is a front elevational view showing a laminated chip band pass filter according to an embodiment of the present invention.
  • FIG. 4 is a schematic diagram showing an equivalent circuit structure of a laminated chip type band pass filter according to an embodiment of the present invention.
  • FIG. 5 is a schematic diagram showing simulation results of a laminated chip band pass filter used in an embodiment of the present invention.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” and “second” may include one or more of the features either explicitly or implicitly.
  • the meaning of “a plurality” is two or more unless specifically and specifically defined otherwise.
  • the meaning of "a number” is one or more unless specifically defined otherwise.
  • connection In the description of the present invention, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; may be mechanically connected or electrically connected; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or an interaction relationship of two elements. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.
  • three coordinate axes that are spatially perpendicular to each other are defined as an X-axis, a Y-axis, and a Z-axis, wherein the X-axis and the Y-axis are two coordinate axes perpendicular to each other in the same horizontal plane, and the Z-axis is a coordinate in the vertical direction.
  • the axis; the X-axis, the Y-axis, and the Z-axis are located perpendicular to each other in three planes: an XY plane, a YZ plane, and an XZ plane, and the length direction of the laminated chip bandpass filter is defined as an X-axis and a width direction is Y.
  • the axis, the height direction is the Z axis; and the left and right direction is parallel to the Y axis direction, and the up and down direction is parallel to the Z axis direction.
  • the laminated chip band pass filter comprises a ceramic substrate 11, a sixth-order resonator 20, an input terminal 12, an output terminal 13 and a Z-type coupling line 31; the input terminal 12 and the output terminal 13 are respectively disposed on the ceramic substrate 11
  • the sixth-order resonator 20 and the Z-type coupling line 31 are both disposed in the ceramic base 11; each of the resonators 20 extends along the width direction of the ceramic base 11, and each of the resonators 20 is a three-layer stripline resonator, thereby
  • the three-layer stripline 200 of the resonator 20 forms two additional plate-loading capacitors such that the length of the resonator 20 is much less than 1/4 wavelength, which in turn allows the laminated chip-band filter to operate in the C-band (working)
  • the frequency is in the frequency band of 4-8 GHz).
  • the sixth-order resonator 20 includes a first-order strip line resonator 21, a second-order strip line resonator 22, a third-order strip line resonator 23, a fourth-order strip line resonator, and a fifth-order strip shape.
  • a line resonator and a sixth-order strip line resonator a first-order strip line resonator 21, a second-order strip line resonator 22, a third-order strip line resonator 23, and a fourth-order strip line resonance
  • the second-order stripline resonator 25 and the sixth-order stripline resonator 26 are sequentially disposed along the length direction of the ceramic substrate 11, and the first-order stripline resonator 21 is connected to the input terminal 12, and the sixth-order strip The line resonator 26 is connected to the output terminal 13; the first order strip line resonator 21, the third order strip line resonator 23 and the fifth order strip line resonator 25 are located in the lower plane 42, the second order strip line
  • the resonator 22, the fourth-order strip line resonator 24, and the sixth-order strip line resonator 26 are located on the upper plane 41, and the lower plane 42 is located below the upper plane 41 in the height direction of the ceramic base 11 to make full use of the longitudinal
  • the Z-type coupling line 31 is for cross-coupling the second-order strip line resonator 22 and the fourth-order strip line resonator 24, and the Z-type coupling line 31 includes a first section 311 extending along the width direction of the ceramic base 11. And the second segment 312 and the third segment 313 extending along the length direction of the ceramic substrate 11, the second segment 312 and the first segment 311 are respectively connected to the two ends of the third segment 313, and the second segment 312 and the first segment 311 are respectively Located on either side of the third segment 313, the second segment 312 is located above the second-order stripline resonator 22, and the first segment 311 is located above the fourth-order stripline resonator 24. Therefore, the amount of coupling can be controlled by adjusting the length and width of the second segment 312, the first segment 311, and the third segment 313. This structure can ensure that the sixth-order resonator 20 has the same coupling amount.
  • each resonator 20 is equivalent to a strip line resonator and its load capacitance, that is, the first-order strip line resonator 21, etc.
  • the strip line resonator R1 is added to the capacitor C1
  • the second-order strip line resonator 22 is equivalent to the strip line resonator R2 plus the capacitor C2
  • the third-order strip line resonator 23 is equivalent to the strip line resonance R3 plus capacitor C3
  • fourth-order stripline resonator 24 is equivalent to stripline resonator R4 plus capacitor C4
  • fifth-order stripline resonator 25 is equivalent to stripline resonator R5 plus capacitor C5
  • the sixth-order strip line resonator 26 is equivalent to the strip line resonator R6 plus the capacitor C6, and the filtering function of the laminated chip band pass filter is realized by the resonance and coupling mechanism, wherein: M 12 , M 23 , M 34 , M 45 and M 56 are adjacent coup
  • the laminated chip type band pass filter provided by the present invention compares the prior art to form a sixth-order three-layer strip line 200 resonator, so that the three-layer strip line 200 of each resonator 20 forms two
  • the additional plate loading capacitor makes the resonator 20 much shorter than 1/4 wavelength; the sixth-order resonator 20 is placed on two planes of different heights to make full use of the longitudinal space, and the lateral direction is shortened while ensuring the same coupling amount.
  • the spacing enables the laminated chip band pass filter to have higher integration, small volume, low passband insertion loss, high stop band rejection, high reliability, and the like, and the processing process is simple when processed by low temperature co-fired ceramic technology. The cost is lower.
  • the interlayer spacing of the three strip lines 200 of each resonator 20 is the same.
  • the top strip line 202 and the bottom strip line 203 are mirror-symmetrically disposed with respect to the intermediate strip line 201; in each resonator 20: one end of the intermediate layer strip line 201 is grounded, and the other end of the intermediate layer strip line 201 is suspended.
  • the top strip line 202 is suspended near the grounded end of the intermediate strip line 201, and the other end of the top strip line 202 is grounded.
  • the bottom strip line 203 is near the grounded end of the intermediate strip line 201, and the bottom strip line is suspended.
  • the other end of 203 is grounded. Not only is it convenient to process and manufacture, but it is easy to design, and at the same time, the symmetry of each resonator 20 can be ensured, and the insertion loss of the pass band can be reduced.
  • the intermediate layer strip line 201 of the first-order strip line resonator 21, the intermediate layer strip line 201 of the third-order strip line resonator 23, and the intermediate layer strip of the fifth-order strip line resonator 25 The line 201 is located on the lower plane 42; the top strip line 202 of the first-order strip line resonator 21, the top strip line 202 of the third-order strip line resonator 23, and the fifth-order strip line resonator 25
  • the top strip lines 202 are located on the same plane; the bottom strip line 203 of the first order strip line resonator 21, the bottom strip line 203 of the third order strip line resonator 23, and the fifth order strip line resonator 25
  • the bottom strip line 203 is located on the same plane; at the same time, the intermediate layer strip line 201 of the second-order strip line resonator 22, the intermediate layer strip line 201 of the fourth-order strip line resonator 24, and the sixth-order strip
  • each resonator 20 the width of the intermediate layer strip line 201 is smaller than the top layer strip.
  • the line 202, and the width of the intermediate layer strip line 201 is smaller than the underlying strip line 203, so as to ensure the symmetry of each resonator 20 and reduce the passband insertion loss.
  • each resonator 20 further includes a floating end respectively connected to each layer strip line 200.
  • Corresponding protruding strips 204, each protruding strip 204 is spaced apart from the corresponding floating end, and each protruding strip 204 is grounded to enhance the consistency of the stripline lines 200 of each layer and reduce the insertion loss of the passband.
  • the laminated chip band pass filter further includes a ceramic base 11 respectively.
  • Two grounding straps 14 on the left and right sides, each grounding strap 14 is connected to the adjacent protruding strip 204, and the grounding end of each stripline 200 is connected to the adjacent grounding strap 14, that is, each protruding strip 204 in each resonator 20 is Adjacent to the grounding strap 14, the grounding ends of the striplines 200 of each of the resonators 20 are connected to the adjacent ground straps 14.
  • the ground straps 14 are provided to ground the respective protruding strips 204 while facilitating grounding of one end of each strip line 200.
  • each ground strap 14 and the input end 12 are in a non-through form, that is, the input end 12
  • the grounding strips 14 are offset from each other.
  • the two grounding strips 14 are respectively located on the left and right sides of the ceramic base 11, and the input end 12 is disposed along the height direction of the ceramic base 11.
  • the grounding strips 14 and the output end 13 are non- The through-out form, that is, the output end 13 is offset from the grounding strips 14, wherein the two grounding strips 14 are respectively located on the left and right sides of the ceramic base 11 in FIG. 1, and the output end 13 is disposed along the height direction of the ceramic base 11;
  • the probability of short circuit due to the distance between the input terminal 12, the output terminal 13 and the corresponding ground strap 14 is too small.
  • the lengths of the resonators 20 are different in length to realize the asynchronous tuning mode, thereby reducing Passband insertion loss improves stopband rejection and reliability.
  • the intermediate layer strip line 201 of the first-order strip line resonator 21 is The input terminals 12 are connected, and the intermediate layer strip line 201 of the sixth-order strip line resonator 26 is connected to the output terminal 13 to reduce the pass band insertion loss.
  • the laminated chip band pass filter further includes a ceramic base 11
  • substantially equal means that the distance from the lower plane 42 to the lower ground plate 32 is as equal as possible to the distance from the upper plane 41 to the upper ground plate 33, of course, allowing a certain manufacturing error.
  • edges on both sides of the upper ground plate 33 are respectively opened for forming a medium region.
  • the notch 331 and the edge on both sides of the lower ground plate 32 are respectively provided with a lower notch 321 for forming a dielectric region to reduce the insertion loss of the pass band.
  • the length of each of the upper notches 331 on the upper ground plate 33 is 0.75 mm, and the width of each of the upper notches 331 is 0.2 mm; the length of each of the lower notches 321 on the lower ground plate 32 is 0.75 mm, and the width of each of the lower notches 321 It is 0.2mm.
  • the first-order strip line resonator 21 is spaced apart from the input end 12,
  • the sixth-order stripline resonator 26 is spaced from the output terminal 13 to suppress unnecessary pattern.
  • the laminated chip band pass filter further includes a first tap 34 connecting the first-order strip line resonator 21 to the input terminal 12 and a second connecting the sixth-order strip line resonator 26 to the output terminal 13. Tap 35.
  • the external quality factor (external Q value) is mainly determined by the position at which the first tap 34 overlaps with the first-order strip line resonator 21 and the position at which the second tap 35 overlaps with the sixth-order strip line resonator 26, so that To improve external quality factors.
  • the width of the first tap 34 connected to the input end 12 is determined by the input end 12 .
  • the direction away from the input end 12 is tapered; the width of the second tap 35 connected to the output end 13 is tapered from the output end 13 to the direction away from the output end 13; thereby ensuring reliable connection of the end electrodes sexuality reduces the effects of parasitic parameters.
  • the first tap 34 is a single-layer folded strip line
  • the second tap 35 is The single-layer folded strip line further ensures the reliability of the terminal electrode connection while reducing the influence of parasitic parameters.
  • the length of the ceramic base 11 is 3.2 mm, and the width of the ceramic base 11 is 1.6 mm.
  • the height of the ceramic base 11 is 0.9 mm so that the laminated chip type band pass filter is small in volume.
  • the two ends of the ceramic base 11 are respectively provided with an input end 12 and an output end 13 respectively.
  • the grounding strips 14 are respectively disposed on the left and right sides of the ceramic base 11, and the two grounding strips 14 respectively form two grounding ends.
  • the length of the input end 12 along the Y-axis direction is 0.4 mm, that is, the input end 12
  • the width of the output end 13 in the Y-axis direction is 0.4 mm, that is, the width of the output end 13 is 0.4 mm
  • the length of the ground strap 14 in the X direction is 2.7 mm, that is, the length of the ground strap 14 is 2.7 mm.
  • the dielectric constant of the ceramic material in the ceramic substrate 11 is 11.0-15.0, and the dielectric loss factor is used. Tan ⁇ 0.002; that is, the ceramic material of the fabricated ceramic substrate 11 has a dielectric constant of 11.0-15.0 and a dielectric loss factor tan ⁇ 0.002 to improve reliability and reduce passband insertion loss.
  • each of the resonators 20 is made of metallic silver to improve the electrical conductivity.
  • the strip lines 200 of the respective resonators 20 are made of metallic silver.
  • the thickness of the silver layer of each layer strip line 200 of each resonator 20 is 10 ⁇ 3 ⁇ m.
  • each of the protruding strips 204 of each of the resonators 20 is made of metallic silver.
  • the thickness of the silver layer of each of the protruding strips 204 of each resonator 20 is 10 ⁇ 3 ⁇ m.
  • the first taps 34 are all made of metallic silver to improve the electrical conductivity. Further, the thickness of the silver layer of the first tap 34 is 10 ⁇ 3 ⁇ m.
  • the second taps 35 are all made of metallic silver to improve the electrical conductivity. Further, the thickness of the silver layer of the second tap 35 is 10 ⁇ 3 ⁇ m.
  • the upper ground plate 33 and the lower ground plate 32 are both made of metal silver to improve the electrical conductivity. Further, the thickness of the silver layer of the upper ground plate 33 is 10 ⁇ 3 ⁇ m. The thickness of the silver layer of the lower ground plate 32 is 10 ⁇ 3 ⁇ m.
  • the input end 12 is made of metal silver to improve the electrical conductivity.
  • the thickness of the silver layer at the input end 12 is 15 ⁇ 3 ⁇ m.
  • the output end 13 is made of metallic silver to improve the electrical conductivity.
  • the silver layer thickness of the output end 13 is 15 ⁇ 3 ⁇ m.
  • each ground strap 14 is made of metal silver to improve the electrical conductivity.
  • the thickness of the silver layer of each of the ground straps 14 is 15 ⁇ 3 ⁇ m.
  • the working frequency of the laminated chip band pass filter is in the range of 5500 ⁇ 500MHz, that is, the laminated chip band pass filter has an operating frequency ranging from 5000MHz to 6000MHz.
  • the laminated chip type band pass filter can be fabricated by using the LTCC process, for example, from bottom to top during molding: first stacking a blank layer with a blank dielectric film, and sequentially printing each layer of metal pattern from bottom to top, The lower ground plate 32, the respective resonators 20, the first taps 34, the second taps 35, and the upper ground plate 33 are formed, and then a portion of the blank dielectric film is stacked. After sintering, the external ports are printed using screen printing techniques to make each of the ground straps 14, input 12 and output 13.
  • FIG. 1 to FIG. 5 together as a simulation result diagram of the laminated chip type band pass filter provided by the present invention, in which S 11 is a return loss curve at each frequency in the simulation; S 21 is a simulation. Insertion loss curve at each frequency; the simulation results show that the passband range of the laminated chip bandpass filter is 5000MHz ⁇ 6000MHz, the insertion loss is less than 2.5dB in the passband range, and the return loss is less than 19dB; It is greater than 33dB in the DC-4600MHz band and greater than 32dB in the 6400-12000MHz band.
  • the laminated chip band pass filter of the present invention can be applied to the field of C-band front-end components, and can also be applied to fields such as microwave communication, radar systems, and electronic countermeasures.

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  • Electromagnetism (AREA)
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Abstract

L'invention concerne un filtre passe-bande de type feuille empilée, comprenant un substrat céramique et six résonateurs, les résonateurs étant tous des résonateurs à ligne triplaque à trois couches, les résonateurs à ligne triplaque de premier, troisième et cinquième ordre parmi les six résonateurs sont situés sur un plan inférieur, et des résonateurs à ligne triplaque de deuxième, quatrième et sixième ordre sont situés sur un plan supérieur. Le filtre passe-bande de type feuille empilée comprend également une ligne de couplage en forme de Z qui couple de manière croisée les résonateurs à ligne triplaque de deuxième et quatrième ordre. Les ligne triplaques à trois couches des six résonateurs à ligne triplaque à trois couches forment deux capacités de charge plates supplémentaires, de telle sorte que la longueur du résonateur est bien inférieure à 1/4 de la longueur d'onde. Les six résonateurs sont disposés sur les deux plans à différentes hauteurs, de manière à utiliser l'espace vertical et à raccourcir la distance horizontale tout en assurant une même quantité de couplage, de sorte que le filtre passe-bande de type feuille empilée présente un degré d'intégration plus élevé, une petite taille, une faible perte d'insertion de bande passante, un rejet de bande d'arrêt élevé et une bonne fiabilité.
PCT/CN2019/079889 2018-10-22 2019-03-27 Filtre passe-bande de type feuille empilée Ceased WO2019158130A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2019524398A JP6793829B2 (ja) 2018-10-22 2019-03-27 積層チップバンドパスフィルタ

Applications Claiming Priority (2)

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CN201811231219.7 2018-10-22
CN201811231219.7A CN109301407A (zh) 2018-10-22 2018-10-22 叠层片式带通滤波器

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WO2019158130A1 true WO2019158130A1 (fr) 2019-08-22

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CN110034368A (zh) * 2019-04-24 2019-07-19 南京理工大学 Ltcc改进型分层螺旋式巴伦功分器
CN111952702B (zh) * 2020-09-16 2025-02-25 深圳振华富电子有限公司 一种带通滤波器及电子设备
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WO2022209122A1 (fr) * 2021-03-29 2022-10-06 株式会社村田製作所 Filtre diélectrique
CN117157826A (zh) 2021-03-29 2023-12-01 株式会社村田制作所 介质滤波器
CN113708027A (zh) * 2021-08-23 2021-11-26 成都频岢微电子有限公司 一种基于多层pcb结构的电容加载式小型化5g滤波器
CN113612459B (zh) * 2021-08-30 2024-08-02 深圳振华富电子有限公司 小型化低损耗ltcc带通滤波器
WO2023090039A1 (fr) * 2021-11-17 2023-05-25 株式会社村田製作所 Résonateur diélectrique et filtre diélectrique
CN115036661A (zh) * 2022-06-24 2022-09-09 安徽蓝讯通信科技有限公司 一种应用于n41频段的ltcc带通滤波器
CN115332744A (zh) * 2022-06-24 2022-11-11 安徽蓝讯通信科技有限公司 一种交指型带通滤波器

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