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WO2019035385A1 - Film conducteur pour panneau tactile, élément tactile et panneau tactile - Google Patents

Film conducteur pour panneau tactile, élément tactile et panneau tactile Download PDF

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Publication number
WO2019035385A1
WO2019035385A1 PCT/JP2018/029490 JP2018029490W WO2019035385A1 WO 2019035385 A1 WO2019035385 A1 WO 2019035385A1 JP 2018029490 W JP2018029490 W JP 2018029490W WO 2019035385 A1 WO2019035385 A1 WO 2019035385A1
Authority
WO
WIPO (PCT)
Prior art keywords
external connection
protective layer
connection terminal
substrate
touch panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/029490
Other languages
English (en)
Japanese (ja)
Inventor
清都　尚治
健介 片桐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2018093893A external-priority patent/JP2020194196A/ja
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of WO2019035385A1 publication Critical patent/WO2019035385A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes

Definitions

  • the present invention relates to a conductive member.
  • the invention also relates to a conductive film for a touch panel in which a protective layer is formed on a substrate, and a touch panel.
  • a touch panel for performing an input operation to an electronic device is in widespread use by being brought into proximity.
  • the touch panel has an input area for detecting a touch operation by a member having a thin tip such as a finger and a stylus pen, and an outer area located outside the input area, and detects the touch operation in the input area.
  • a detection electrode to be formed is formed, and in the outer region, a lead-out wiring whose one end is connected to the detection electrode and an external connection terminal connected to the other end of the lead-out wiring are formed.
  • the substrate connection terminal of the external wiring substrate is connected to the external connection terminal.
  • the external connection terminals and the substrate connection terminals of the external wiring board are connected to each other while securing the insulation between the adjacent external connection terminals.
  • various devices have been made.
  • Patent Document 1 has a plurality of detection electrodes, a lead-out wiring whose one end is connected to the detection electrode, and an external connection terminal connected to the other end of the lead-out wiring.
  • a touch panel in which a covering carbon layer is formed is disclosed.
  • the plurality of external connection terminals are made of silver, but are completely covered by the carbon layer, so oxidation and migration of the external connection terminals occur even under high temperature and high humidity conditions, in particular. The short circuit between adjacent external connection terminals is prevented.
  • Patent Document 2 discloses that in the touch panel, partition walls are formed between external connection terminals adjacent to each other.
  • the present invention provides a conductive film for a touch panel, a conductive member, and a touch panel, which can easily perform reliable connection with an external wiring substrate and can suppress the occurrence of migration in an external connection terminal.
  • the purpose is to
  • the conductive film for a touch panel comprises a substrate, a plurality of detection electrodes formed on the surface of the substrate, and a plurality of lead wires formed on the surface of the substrate and having one end electrically connected to the detection electrode. And a plurality of external connection terminals formed on the surface of the substrate and electrically connected to the other end of the lead-out wiring, the top surface of the plurality of detection electrodes and the top surface of the plurality of lead-out wiring And a protective layer is formed between the plurality of external connection terminals adjacent to each other, and at least a portion of the top surface of the external connection terminal is exposed from the protective layer.
  • the upper surface of the protective layer is located farther from the surface of the substrate than the upper surface of the external connection terminal, and the height difference between the upper surface of the protective layer and the upper surface of the external connection terminal is 15 ⁇ m or less.
  • the height difference between the upper surface of the protective layer and the upper surface of the external connection terminal is preferably 1 ⁇ m or more.
  • the height difference between the upper surface of the protective layer and the upper surface of the external connection terminal is preferably 1 ⁇ m or more and 10 ⁇ m or less.
  • the protective layer is preferably filled without gaps between the plurality of adjacent external connection terminals.
  • the protective layer is preferably formed to partially cover the upper surface of the external connection terminal.
  • the difference in height between the upper surface of the protective layer and the upper surface of the external connection terminal is preferably 2 ⁇ m or more and 8 ⁇ m or less.
  • the lead wires and the external connection terminals are preferably made of a material containing silver or copper.
  • the protective layer is preferably an organic film containing at least one selected from the group consisting of an epoxy resin, an acrylic resin and a urethane resin.
  • the substrate is preferably tempered glass.
  • a touch panel according to the present invention includes the above-described conductive film for a touch panel or a conductive member. It is preferable that the substrate connection terminal of the external wiring substrate and the external connection terminal are electrically connected via an anisotropic conductive film.
  • the conductive film for touch panel has the external connection terminal, and the protective layer formed on the surface of the substrate so as to cover the plurality of detection electrodes and the plurality of lead wires, and the surface of the external connection terminal Is exposed from the protective layer, and the upper surface of the protective layer is farther from the surface of the substrate than the upper surface of the external connection terminal exposed from the protective layer, and the external surface exposed from the upper surface of the protective layer and the protective layer. Since the height difference with the upper surface of the connection terminal is 15 ⁇ m or less, reliable connection with the external wiring board can be easily performed, and the occurrence of migration in the external connection terminal can be suppressed.
  • FIG. 5 is a partial plan view of the conductive film in Embodiment 1.
  • FIG. It is sectional drawing which cut
  • FIG. 6 is a diagram showing an example of connecting the conductive film and the external wiring board via the first external connection terminal in the first embodiment.
  • FIG. 13 is a cross-sectional view of the conductive film in the second embodiment, taken across a plurality of first external connection terminals.
  • Transparent means that the light transmittance is at least 40% or more, preferably 75% or more, more preferably 80% or more, and still more preferably in the visible light wavelength range of 400 to 800 nm. It is 90% or more.
  • the light transmittance is measured using "plastic-how to determine total light transmittance and total light reflectance” defined in JIS K 7375: 2008.
  • the “upper surface of the detection electrode” refers to the surface of the detection electrode opposite to the surface with respect to the substrate or the insulating member.
  • the “upper surface of the lead-out wiring” refers to the surface of the lead-out wiring opposite to the surface with respect to the substrate or the insulating member.
  • the “upper surface of the protective layer” refers to the surface of the protective layer opposite to the surface with respect to the substrate or the insulating member.
  • the “upper surface of the external connection terminal” refers to the surface of the external connection terminal opposite to the surface with respect to the substrate or the insulating member.
  • FIG. 1 shows a configuration of a touch panel 1 according to Embodiment 1 of the present invention.
  • the touch panel 1 has a front surface 1A and a back surface 1B, and is used in a state where a display device (not shown) such as a liquid crystal display device is disposed on the back surface 1B side.
  • the surface 1A of the touch panel 1 is a touch detection surface, and the operator of the touch panel 1 is on the viewing side where the image of the display device is observed through the touch panel 1.
  • the touch panel 1 has a transparent insulating cover panel 2 disposed on the surface 1A side and having a flat plate shape, and a conductive film 3 which is a conductive member on the surface of the cover panel 2 opposite to the surface 1A. Are bonded by a transparent adhesive 4.
  • the conductive film 3 is obtained by forming metal thin wires 6A and metal thin wires 6B on both surfaces of a substrate 5 which is a transparent insulating member.
  • the substrate 5 has a first surface 5A directed to the front surface 1A side of the touch panel 1 and a second surface 5B directed to the opposite side to the first surface 5A.
  • the thin metal wire 6A is formed on the first surface 5A
  • the thin metal wire 6B is formed on the second surface 5B.
  • transparent protective layers 7 and 8 are disposed on the first surface 5A and the second surface 5B of the substrate 5 so as to cover the fine metal wires 6A and 6B.
  • the conductive film 3 of the touch panel 1 is divided into an input area S1 for detecting a touch operation by a member having a thin tip such as a finger and a stylus pen, and an outer side of the input area S1.
  • the substrate 5 is assumed to extend along the XY plane, and the direction perpendicular to the XY plane is taken as the Z direction.
  • the protective layer 7 is abbreviate
  • a plurality of second detection electrodes 21 each formed of a metal thin wire 6 B, extending along the Y direction and connected in parallel in the X direction are formed.
  • the plurality of first detection electrodes 11 and the plurality of second detection electrodes 21 are disposed via the substrate 5. That is, the plurality of first detection electrodes 11 and the plurality of second detection electrodes 21 are disposed to face each other in a state of being insulated from each other.
  • the first detection electrode 11 formed on the first surface 5A that is the surface on the viewing side of the substrate 5 and the second detection electrode 21 that is formed on the second surface 5B that is the surface on the display device side of the substrate 5 They are arranged to intersect and overlap each other in plan view in the input area S1.
  • first lead wirings 12 each having one end connected to the plurality of first detection electrodes 11 are formed on the first surface 5A of the substrate 5 in the outer region S2.
  • the first external connection terminals 13 are formed in an array, and the first connector portions 14 are formed at the end portions of the respective first detection electrodes 11.
  • One end of the corresponding first lead-out wiring 12 is connected to the first connector portion 14, and the other end of the first lead-out wiring 12 is connected to the corresponding first external connection terminal 13.
  • the first connector portion may be formed at the other end of the first detection electrode 11 to which the first lead-out wiring 12 is not connected.
  • the first connector portion formed at the other end of the first detection electrode 11 can be used as a terminal for connecting the first lead wire 12, and can also be used as a terminal for a continuity test of the first detection electrode 11.
  • a plurality of second lead wirings 22 each having one end connected to the plurality of second detection electrodes 21 are formed on the second surface 5B of the substrate 5 in the outer region S2.
  • the second external connection terminals 23 are formed in an array, and the second connector portions 24 are formed at the end portions of the respective second detection electrodes 21.
  • One end of the corresponding second lead-out wiring 22 is connected to the second connector portion 24, and the other end of the second lead-out wiring 22 is connected to the corresponding second external connection terminal 23.
  • the second connector portion may be formed at the other end of the second detection electrode 21 to which the second lead wire 22 is not connected.
  • the second connector portion formed at the other end of the second detection electrode 21 can be used as a terminal for connecting the second lead wire 22, and can also be used as a terminal for a continuity test of the second detection electrode 21.
  • the protective layer 7 is formed on the first surface 5 A of the substrate 5 so as to cover the upper surfaces of the plurality of first detection electrodes 11 and the upper surfaces of the plurality of first lead wirings 12.
  • the upper surfaces 13A of the plurality of first external connection terminals 13 are exposed from the protective layer 7 (see FIG. 3).
  • the protective layer 8 is formed on the second surface 5 B of the substrate 5 so as to cover the upper surfaces of the plurality of second detection electrodes 21 and the upper surfaces of the plurality of second lead wirings 22. Further, the upper surfaces (the back surface 1B side of the touch panel) of the plurality of second external connection terminals 23 are exposed from the protective layer 8.
  • FIG. 3 shows a partial cross-sectional view of the conductive film 3 cut along the Y direction so as to cross the plurality of first external connection terminals 13.
  • the protective layer 7 is formed between the plurality of adjacent first external connection terminals 13 and formed in contact with the respective side surfaces of the adjacent first external connection terminals 13. It is done.
  • the protective layer 7 is formed between the plurality of first external connection terminals 13 adjacent to each other, and in contact with the first surface 5 A of the substrate 5 and the side surfaces of the adjacent first external connection terminals 13.
  • it is formed. That is, it is preferable that the protective layer 7 be formed to be filled without gaps between the plurality of first external connection terminals 13 adjacent to each other.
  • the fact that the protective layer 7 is formed between the plurality of first external connection terminals 13 adjacent to each other means that the plurality of first external connection terminals 13 adjacent to each other as shown in FIG. It means that there are a plurality of gaps separating the plurality, and the protective layer 7 is formed in the plurality of gaps. Further, the position of the upper surface 7A of the protective layer which is the end surface of the protective layer 7 in the + Z direction is farther from the first surface 5A of the substrate 5 than the upper surface 13A of the first external terminal which is the end surface of the first external connection terminal 13 in the + Z direction. It is designed to be Generally, when a metal connection terminal or the like is energized for a long time, migration may occur in the connection terminal.
  • the protective layer 7 in the first embodiment surrounds the periphery of the first external connection terminal 13 without a gap, and the protective layer upper surface 7A of the protective layer 7 is the first external terminal of the first external connection terminal 13. Since it is located on the + Z direction side of the upper surface 13A, the occurrence of migration in the first external connection terminal 13 can be suppressed.
  • the protective layer 8 formed on the second surface 5B of the substrate 5 is formed between the plurality of adjacent second external connection terminals 23 similarly to the protective layer 7, And, it is formed in contact with the respective side surfaces of the adjacent second external connection terminals 23.
  • the protective layer 8 is formed between the plurality of second external connection terminals 23 adjacent to each other, and in contact with the second surface 5B of the substrate 5 and the respective side surfaces of the adjacent second external connection terminals 23.
  • it is formed. That is, it is preferable that the protective layer 8 be formed to be filled without gaps between the plurality of second external connection terminals 23 adjacent to each other.
  • the protective layer 8 is formed between the plurality of the plurality of second external connection terminals 23 adjacent to each other means that there are a plurality of gaps separating the plurality of second external connection terminals 23 adjacent to each other. It means that the protective layer 8 is formed in the plurality of gaps. Further, the position of the upper surface of the protective layer which is the end surface of the protective layer 8 in the -Z direction is farther from the second surface 5B of the substrate 5 than the upper surface of the second external terminal which is the end surface of the second external connection terminal 23 in the -Z direction. It is designed to be Therefore, similar to the protective layer 7 formed on the first surface 5A of the substrate 5, the protective layer 8 can suppress the occurrence of migration in the second external connection terminal 23.
  • the plurality of first external connection terminals 13 formed on the first surface 5A of the substrate 5 and the plurality of second external connection terminals 23 formed on the second surface 5B of the substrate 5 respectively correspond to an external wiring substrate It can be connected.
  • an example of an aspect which electrically connects the conductive film 3 and an external wiring board through several 1st external connection terminals 13 is demonstrated using FIG.
  • the external wiring board 31 electrically connected to the conductive film 3 has a plurality of substrate connection terminals 31A formed of a metal layer.
  • an anisotropic conductive film F can be used.
  • the anisotropic conductive film F is not shown, a plurality of fine conductive particles are dispersed in a binder made of a thermosetting resin.
  • the diameter of the conductive particles contained in the anisotropic conductive film F is, for example, about 10 ⁇ m to 20 ⁇ m.
  • the anisotropic conductive film F is used as the external wiring substrate It arrange
  • heat is applied to the region of the external wiring board 31 in which the plurality of substrate connection terminals 31A are formed and the region in which the plurality of first external connection terminals 13 is formed in the conductive film 3 through the anisotropic conductive film F. Crimp. Thereby, the substrate connection terminal 31A of the external wiring board 31 and the first external connection terminal 13 of the conductive film 3 are electrically connected to each other through the conductive particles contained in the anisotropic conductive film F.
  • the substrate connection terminal 31A of the external wiring substrate 31 when connecting the substrate connection terminal 31 A of the external wiring substrate 31 to the first external connection terminal 13 of the conductive film 3, the upper surface 7 A of the protective layer of the protective layer 7 formed on the first surface 5 A of the substrate 5
  • the substrate connection terminal 31A of the external wiring board 31 and the first external connection terminal 13 of the conductive film 3 are anisotropic. It becomes difficult for conductive particles (not shown) contained in the conductive conductive film F to contact with a sufficient contact pressure, and the reliability in connection between the substrate connection terminal 31A of the external wiring substrate 31 and the first external connection terminal 13 of the conductive film 3 There is a risk that the sex may decline.
  • the height difference H1 is preferably 15 ⁇ m or less, more preferably 10 ⁇ m or less, and still more preferably 8 ⁇ m or less.
  • the height difference H1 between the protective layer upper surface 7A of the protective layer 7 formed on the first surface 5A of the substrate 5 and the first external terminal upper surface 13A of the first external connection terminal 13 is too small, the first external connection terminal Since the sensor 13 is easily influenced by the temperature and humidity of the outside world, migration is likely to occur in the first external connection terminal 13. Therefore, it is preferable to set an appropriate range for the lower limit value of the height difference H1 between the protective layer upper surface 7A of the protective layer 7 and the first external terminal upper surface 13A of the first external connection terminal 13. Specifically, the height difference H1 is larger than 0 ⁇ m, preferably 1 ⁇ m or more, more preferably 2 ⁇ m or more, and still more preferably 5 ⁇ m or more.
  • the substrate connection terminal 31A of the external wiring board 31 and Reliable connection with the first external connection terminal 13 of the conductive film 3 can be easily performed.
  • the conductive film 3 of the first embodiment reliable connection between the plurality of substrate connection terminals 31A of the external wiring substrate 31 and the plurality of first external connection terminals 13 is easily performed. As a result, the occurrence of migration in the plurality of first external connection terminals 13 can be suppressed.
  • the step of electrically connecting a wiring board having the same configuration as the external wiring board 31 to the conductive film 3 through the plurality of second external connection terminals 23 formed on the second surface 5B of the substrate 5 is as follows.
  • the step is similar to the step of connecting the plurality of substrate connection terminals 31 A of the external wiring substrate 31 to the plurality of first external connection terminals 13.
  • the anisotropic conductive film F is used as an example, but at the time of manufacture Connecting the plurality of substrate connection terminals 31A of the external wiring substrate 31 to the plurality of first external connection terminals 13 of the conductive film 3 under a temperature of 200 ° C. or lower in order to prevent the conductive film 3 from being affected If it is possible, it is not limited to using anisotropic conductive film F.
  • the conductive when connecting the plurality of substrate connection terminals 31 A of the external wiring substrate 31 to the plurality of first external connection terminals 13 of the conductive film 3, instead of the anisotropic conductive film F, the conductive as described above Even when the connection material is used, the height difference H1 between the protective layer upper surface 7A of the protective layer 7 formed on the first surface 5A of the substrate 5 and the first external terminal upper surface 13A of the first external connection terminal 13 is By setting to a preferable range, reliable connection between the plurality of substrate connection terminals 31A of the external wiring substrate 31 and the plurality of first external connection terminals 13 can be easily performed, and the plurality of first external connections can be made. The occurrence of migration at the terminal 13 can be suppressed.
  • a conductive connection material other than the anisotropic conductive film F is used. Even in the case where there is a difference in height between the upper surface of the protective layer (not shown) of the protective layer 8 formed on the second surface 5B of the substrate 5 and the upper surface of the second external terminal (not shown) of the second external connection terminal 23 By setting, reliable connection between the plurality of substrate connection terminals 31A of the external wiring board 31 and the plurality of second external connection terminals 23 can be easily performed, and the plurality of second external connection terminals 23 The occurrence of migration can be suppressed.
  • the configuration in which the first detection electrode 11 and the second detection electrode 21 made of metal fine wires are arranged on both surfaces of the substrate 5 is described, but the configuration is limited to such a configuration is not.
  • the detection electrodes 11 and 21, the lead wires 12 and 22 connected to the detection electrodes 11 and 21 at one end, and the external connection terminals 13 and 23 connected to the other ends of the lead wires 12 and 22 are substrates 5.
  • two electrode substrates may be bonded via a transparent adhesive layer, as shown in FIG.
  • FIG. 11 of JP-A-2016-126731 two electrode substrates may be bonded via a transparent adhesive layer, as shown in FIG.
  • FIG. 11 of JP-A-2016-126731 two electrode substrates may be bonded via a transparent adhesive layer, as shown in FIG.
  • a structure may be employed in which column wiring and row wiring are provided on a transparent substrate via an interlayer insulating film.
  • the electrode substrate and the transparent adhesive layer constitute a transparent insulating member
  • the interlayer insulating layer corresponds to the transparent insulating member.
  • the external wiring board 31 electrically connected to the plurality of external connection terminals 13 and 23 of the conductive film 3 is not particularly limited as long as it has the board connection terminal 31A, and, for example, flexible printing Substrates, rigid printed substrates, rigid flexible printed substrates and the like can be used.
  • Embodiment 2 Although the first external terminal upper surface 13A of the first external connection terminal 13 formed on the first surface 5A of the substrate 5 in Embodiment 1 is completely exposed from the protective layer 7, it is partially covered by the protective layer. It may be included. In other words, at least a portion of the first external terminal upper surface 13A of the first external connection terminal 13 may be exposed from the protective layer. Similarly, the upper surface of the second external terminal of the second external connection terminal 23 formed on the second surface 5B of the substrate 5 is completely exposed from the protective layer 8, but partially covered by the protective layer It is also good. In other words, at least a part of the upper surface of the second external terminal of the second external connection terminal 23 may be exposed from the protective layer.
  • the protective layer 47 in the second embodiment formed on the first surface 5A of the substrate 5 is formed on the upper surface 13A of the first external terminal of the two first external connection terminals 13 adjacent to the protective layer 47. It is formed to cover the edge. Therefore, compared with the first external connection terminal 13 in the first embodiment, the first external connection terminal 13 in the second embodiment has a larger area covered by the protective layer 47, and the first external connection terminal 13 has a larger area. The occurrence of migration can be suppressed more effectively.
  • the protective layer 47 covers the edge of the first external terminal upper surface 13A of the first external connection terminal 13, the central portion of the first external terminal upper surface 13A of the first external connection terminal 13 is a protective layer. It is exposed from 47. Therefore, similarly to the protective layer 7 in the first embodiment, by setting the height difference H2 between the protective layer upper surface 47A of the protective layer 47 and the first external terminal upper surface 13A of the first external connection terminal 13 to an appropriate range. The reliable connection between the substrate connection terminal of the external wiring substrate (not shown) and the first external connection terminal 13 can be easily performed.
  • a preferable range of the height difference H2 between the protective layer upper surface 47A of the protective layer 47 and the first external terminal upper surface 13A of the first external connection terminal 13 is the first external connection with the protective layer upper surface 7A of the protective layer 7 in the first embodiment.
  • the upper limit value of the height difference H2 is preferably 15 ⁇ m or less, more preferably 10 ⁇ m or less, and 8 ⁇ m or less Is more preferred.
  • the lower limit value of the height difference H2 is more than 0 ⁇ m and preferably 1 ⁇ m or more, more preferably 2 ⁇ m or more, and still more preferably 3 ⁇ m or more.
  • the protective layer 47 of the second embodiment reliable connection between the substrate connection terminal of the external wiring substrate (not shown) and the plurality of first external connection terminals 13 can be easily performed, and The occurrence of migration at the external connection terminal 13 can be suppressed more effectively.
  • the protective layer formed on the second surface 5B of the substrate 5 also has the same configuration as the protective layer 47 formed on the first surface 5A of the substrate 5 to provide a plurality of second external connections. The occurrence of migration at the terminal 23 can be suppressed more effectively.
  • the protective layer 47 in the second embodiment covers the edge portion of the first external terminal upper surface 13A of the first external connection terminal 13 in the Y direction (the width direction of the first external connection terminal 13),
  • the external terminal upper surface 13A may be partially covered, and the first external terminal upper surface 13A may be easily connected to a substrate connection terminal of an external wiring substrate (not shown) via an anisotropic conductive film or the like.
  • the protective layer 47 can entirely cover the edge of the first external terminal upper surface 13A, or can partially cover the edge of the first external terminal upper surface 13A.
  • the protective layer 47 is in the width direction of the first external connection terminal 13.
  • the protective layer 47 may cover from both ends of the first external connection terminal 13 in the Y direction to 1/50 or more and 1/10 or less of the width of the first external connection terminal. It is possible to cover from both ends in the Y direction of the external connection terminal 13 to 1/20 or more and 1/10 or less of the width of the first external connection terminal 13.
  • each member which comprises the conductive film 3 which concerns on Embodiment 1, and the conductive film which concerns on Embodiment 2 is demonstrated.
  • the member is not particularly limited as long as the conductive film is in the form of a sheet.
  • the conductive film which is a conductive member is one aspect of the conductive sheet which is a conductive member.
  • the substrate 5 is not particularly limited as long as it is transparent and has electrical insulating properties, but as a material constituting the substrate 5, for example, glass, tempered glass, non-alkali glass, polyethylene terephthalate (PET: Polyethylene Terephthalate ), Polyethylene naphthalate (PEN), cyclo-olefin polymer (COP: Cyclo-Olefin Polymer), cyclic olefin copolymer (COC: Cyclic Olefin Copolymer) , Polycarbonate (PC: Polycarbonate), acrylic resin, polyethylene (PE: Polyethylene), polypropylene (PP: Polypropylene), polystyrene (PS: Polystylene), polyvinyl chloride (PVC: Polyvinyl Chloride), polyvinylidene chloride (PVDC: Polyvinylidene Chloride) ), Triacetyl cellulose (TAC: Cellulose Triacetate), etc.
  • PET Polyethylene Terephthalate
  • PEN Polyethylene
  • the thickness of the substrate 5 is, for example, 20 to 1000 ⁇ m, and preferably 30 to 100 ⁇ m.
  • the total light transmittance of the substrate 5 is preferably 40% to 100%. The total light transmittance is measured, for example, using "plastic-how to determine total light transmittance and total light reflectance" defined in JIS K 7375: 2008.
  • the lead wires 12 and 22 are made of metal, the material for forming the lead wires 12 and 22 is not particularly limited, and, for example, silver, copper, aluminum or the like can be used.
  • the external connection terminals 13 and 23 are made of metal in the same manner as the lead wirings 12 and 22, but the metal material constituting the external connection terminals 13 and 23 is not particularly limited, and, for example, silver, copper And aluminum etc. can be used.
  • the thickness of the external connection terminals 13 and 23 is preferably 0.1 ⁇ m to 5.0 ⁇ m, and more preferably 0.1 ⁇ m to 1.0 ⁇ m.
  • the distance between the adjacent external connection terminals 13 and the distance between the adjacent external connection terminals 23 are not particularly limited, but can be, for example, more than 0 ⁇ m and not more than 100 ⁇ m, and not less than 10 ⁇ m and not more than 50 ⁇ m. You can also. According to the present invention, even when the distance between adjacent external connection terminals is within such a narrow range, the occurrence of migration can be effectively suppressed.
  • protective layers 7 and 8 in the first embodiment and protective layer 47 in the second embodiment detection electrodes 11 and 22 formed on substrate 5 and lead wires 12 and 22 are covered, and external connection terminals 13 are formed. There is no particular limitation as long as the circumference of and 23 can be enclosed without gaps.
  • materials for the protective layers 7, 8 and 47 organic films such as epoxy resin, acrylic resin and urethane resin, and inorganic films such as silicon dioxide can be used.
  • the thickness of each of the protective layers 7, 8 and 47 is preferably 0.1 ⁇ m to 20 ⁇ m, and more preferably 0.1 ⁇ m to 14 ⁇ m.
  • Example 1 Preparation of silver halide emulsion
  • An amount corresponding to 90% each of the following solutions 2 and 3 was simultaneously added to the following solution 1 maintained at 30 ° C. and pH 4.5 while stirring for 20 minutes to form 0.12 ⁇ m core particles .
  • the following solutions 4 and 5 were added over 8 minutes, and the remaining 10% of the solutions 2 and 3 below were added over 2 minutes to grow core particles to 0.15 ⁇ m.
  • 0.15 g of potassium iodide was added and aged for 5 minutes to complete particle formation.
  • gelatin when simply referred to as gelatin, it refers to both high molecular weight gelatin and low molecular weight gelatin in one solution.
  • 1st liquid Water ... 750 ml High molecular weight gelatin (molecular weight; 300,000) ... 9 g Low molecular weight gelatin (molecular weight; 15,000) ... 4.5 g Sodium chloride ⁇ ⁇ ⁇ 3g 1,3-Dimethylimidazolidine-2-thione-20 mg Sodium benzenethiosulfonate ... 10 mg Citric acid ... 0.7 g 2nd liquid: Water ... 300 ml Silver nitrate ⁇ ⁇ ⁇ 150g 3rd liquid: Water ... 300 ml Sodium chloride ⁇ ⁇ ⁇ 38g Potassium bromide ...
  • chemical sensitization is performed to obtain optimum sensitivity at 55 ° C., 100 mg of 1,3,3a, 7-tetraazaindene as a stabilizer, and Proxel as a preservative (trade name, manufactured by ICI Co., Ltd.) 100 mg was added.
  • the emulsion finally obtained contains 0.08 mol% of silver iodide, and the proportion of silver chlorobromide is 70 mol% of silver chloride and 30 mol% of silver bromide, and the average particle size is 0.15 ⁇ m, fluctuation It was a silver iodochlorobromide cubic grain emulsion with a coefficient of 10%.
  • a polymer containing a polymer represented by the following (P-1) (hereinafter, also simply referred to as “polymer”), a dialkylphenyl PEO sulfate as a dispersant, and water, in the coating solution, relative to the gelatin contained:
  • the ratio R1 (polymer / silver halide) of the mass of the polymer to the mass of silver halide was 0.024.
  • EPOXY RESIN DY 022 (trade name, manufactured by Nagase ChemteX Co., Ltd.) was added as a crosslinking agent.
  • the addition amount of the crosslinking agent was adjusted so that the amount of the crosslinking agent in the photosensitive layer described later was 0.09 g / m 2 .
  • a silver halide-containing coating solution was prepared as described above.
  • the polymer represented by the above (P-1) was synthesized with reference to Japanese Patent No. 3305 459 and Japanese Patent No. 3754745.
  • Photosensitive layer formation process (1) A composition for forming an undercoat layer described later is coated on one side of a 40 ⁇ m biaxially oriented PET support so that the film thickness after drying becomes 60 nm, and dried at 90 ° C. for 1 minute to obtain a support with an undercoat layer. Was produced.
  • the film thickness of the undercoat layer was measured with an electronic micro film thickness meter manufactured by Anritsu Corporation.
  • composition for forming undercoat layer curable composition
  • the following components were mixed to prepare a primer layer-forming composition.
  • Acrylic polymer 66.4 parts by mass (AS-563A, manufactured by Daicel Finechem Co., Ltd., solid content: 27.5% by mass)
  • Carbodiimide-based crosslinking agent 16.6 parts by mass (Carbodilite V-02-L2, Nisshinbo Co., Ltd., solid content: 10% by mass)
  • Colloidal silica 4.4 parts by mass (Snowtex XL, manufactured by Nissan Chemical Industries, Ltd., solid content: 10% by mass water dilution)
  • Slip agent Carnauba wax: 27.7 parts by mass (Cerosol 524, manufactured by Chukyo Yushi Co., Ltd., solid content: 3% by mass water dilution)
  • Anionic surfactant 23.3 parts by mass (Lapisol A-90, manufactured by NOF Corporation, solid content: 1% by mass aqueous solution)
  • Nonionic surfactant 14.6 parts by mass (Naroacty CL 95, manufactured by Sanyo Chemical Industries, Ltd., solid content:
  • the polymer latex and gelatin are mixed at a mixing mass ratio (mass of polymer / mass of gelatin) 3/1, and further, the optical density is about 1.0 and the developer is It is a composition comprising a mixture containing a dye which is decolorized by alkali. Further, the concentration of the first composition adjustment coating solution was adjusted so that the amount of the polymer (coating amount) in the layer formed from the first composition adjustment coating solution was 0.65 g / m 2 .
  • the layer formed of the first composition adjustment coating solution contains a dye and thus has an antihalation function.
  • the second composition-adjusting coating solution contains the above polymer latex and gelatin, and further, colloidal silica (Snowtex ST-C) in solid content mixing mass ratio (polymer / gelatin / silica) 0.5 / 1/1. 5 is the composition mixed.
  • the amount of gelatin in the layer formed from the second composition adjustment coating solution is 0.10 g / m 2 (the amount of polymer latex is 0.05 g / m 2 ).
  • the concentration was adjusted to In the layer formed of the silver halide-containing coating solution, the amount of silver was 7.4 g / m 2 , the amount of polymer was 0.26 g / m 2 , and the amount of gelatin was 1.02 g / m 2 .
  • a photomask was placed on the side of the film A on which the silver halide-containing photosensitive layer was formed, and exposure was performed using parallel light with a high pressure mercury lamp as a light source.
  • the photomask used in this exposure has five square mesh patterns of 2 cm square arranged at an opening line width of 1.0 ⁇ m and a pitch of 300 ⁇ m, and arranged with a wiring interval of 100 ⁇ m and one end of each of the above-mentioned square types.
  • the external connection terminal is a terminal for bonding to a substrate connection terminal of a flexible printed circuit which is an external wiring substrate.
  • a support having a conductive mesh consisting of fine lines with a line width of 3 ⁇ m containing Ag, a lead wire, an external connection terminal, and a layer containing gelatin and a polymer I got The layer containing gelatin and the polymer was formed between thin wires containing Ag. The obtained film is referred to as film B.
  • the thickness of each of the conductive mesh, the lead wire, and the external connection terminal was 1 ⁇ m.
  • composition of developer The following compounds are contained in 1 liter (L) of the developer. Hydroquinone ... 0.037 mol / L N-methylaminophenol ... 0.016 mol / L Sodium metaborate ... 0.140 mol / L Sodium hydroxide ⁇ 0.360 mol / L Sodium bromide ⁇ 0.031 mol / L Potassium metabisulfite ... 0.187 mol / L
  • the film B was immersed in an aqueous solution of a proteolytic enzyme (Bioplase AL-15FG manufactured by Nagase ChemteX Corp.) (concentration of proteolytic enzyme: 0.5% by mass, solution temperature: 40 ° C.) for 120 seconds.
  • the film B was taken out of the aqueous solution, immersed in warm water (liquid temperature: 50 ° C.) for 120 seconds, and washed to obtain a film C (corresponding to a conductive film) subjected to gelatin decomposition treatment.
  • the film C is subjected to calendering at a pressure of 30 kN using a calendering apparatus comprising a combination of metal rollers and resin rollers, and then passed through a 150 ° C. superheated steam tank for 120 seconds. , Heat treatment was performed.
  • the film after heat treatment is referred to as film D.
  • a photoresist solution (SR7300G manufactured by Hitachi Chemical Co., Ltd.) is coated on the surface of the film D on which the conductive mesh, the lead wiring and the external connection terminal are formed so that the thickness after drying becomes 6 ⁇ m, and the oven at 150 ° C. Dried for 5 minutes.
  • ultraviolet light with an irradiation amount of 100 mJ / cm 2 is exposed to the portions of the film D other than the external connection terminals, and the concentration 1 mass kept the exposed film D at 25 ° C. It developed for 2 minutes using 10% sodium carbonate aqueous solution.
  • a protective layer is formed between the mutually adjacent external connection terminals in the film D, the upper surface of the external terminal of the external connection terminal is not covered by the protective layer, and the upper surface of the protective layer of the protective layer and the upper surface of the external terminal of the external connection terminal A film having a height difference of 5 ⁇ m was obtained.
  • 3M OCA On one side (bottom side) of the film D obtained by the above process, 3M OCA (# 8146-4: 100 micrometers thick) and Kimoto company hard coat film (G1 SBF: 50 micrometers thick) Were sequentially laminated. Further, on the other surface (top surface) of the film D, 3M OCA (# 8146-4: 100 micrometers thick) was attached. Further, the OCA and the hard coat layer laminated in the region where the plurality of external connection terminals are formed in the film D are cut out so that the substrate connection terminal of the flexible printed board can be crimped to the external connection terminals in the film D. The outer shape of the laminate was adjusted, and a substrate connection terminal of a flexible printed substrate manufactured by Taiyo Kogyo Co., Ltd.
  • the wiring portion of the flexible printed circuit board in the evaluation sample obtained by the above process is connected to a function generator, and under the environment of a temperature of 85 ° C. and a humidity of 85%, While continuously applying a DC voltage of 15 V for 24 hours to the connection portion, the electrical resistance value of the connection portion of the external connection terminal of the film D and the substrate connection terminal of the flexible printed board was measured. With respect to this electrical resistance value, the rate of increase of the electrical resistance value 24 hours after the start of the application of the voltage to the electrical resistance value before the voltage application is calculated, and the environmental durability of the film D is evaluated according to the following evaluation criteria. Was evaluated. A: The rate of increase in resistance is less than 10%, and has excellent environmental durability.
  • B The rate of increase in resistance is 10% or more and less than 20%, and has good environmental durability.
  • C Resistance increase rate is 20% or more and less than 30%, and there is no problem in practical use.
  • D The rate of increase in resistance is 30% or more, and there is a problem in practical use.
  • Example 2 A photoresist solution, which is a material of the protective layer, is applied to the film D so that the thickness after drying is 2 ⁇ m, and the height difference between the upper surface of the protective layer of the protective layer and the upper surface of the external connection terminal is 1 ⁇ m. Except for the above, this embodiment is the same as the first embodiment.
  • Example 3 A photoresist solution, which is a material of the protective layer, is applied to the film D so that the thickness after drying is 4 ⁇ m, and the height difference between the upper surface of the protective layer of the protective layer and the upper surface of the external terminal of the external connection terminal is 3 ⁇ m. Except for the above, this embodiment is the same as the first embodiment.
  • Example 4 A photoresist solution, which is a material of the protective layer, is applied to the film D so that the thickness after drying is 9 ⁇ m, and the height difference between the upper surface of the protective layer of the protective layer and the upper surface of the external terminal of the external connection terminal is 8 ⁇ m. Except for the above, this embodiment is the same as the first embodiment.
  • Example 5 A photoresist solution, which is a material of the protective layer, is applied to the film D so that the thickness after drying is 12 ⁇ m, and the height difference between the upper surface of the protective layer of the protective layer and the upper surface of the external connection terminal is 11 ⁇ m. Except for the above, this embodiment is the same as the first embodiment.
  • Example 6 A photoresist solution, which is a material of the protective layer, is applied to the film D so that the thickness after drying is 15 ⁇ m, and the height difference between the upper surface of the protective layer of the protective layer and the upper surface of the external terminal of the external connection terminal is 14 ⁇ m. Except for the above, this embodiment is the same as the first embodiment.
  • Example 7 A photoresist solution, which is a material of the protective layer, is applied to the film D so that the thickness after drying is 3 ⁇ m, and a protective layer having the same shape as the protective layer 47 in the second embodiment is formed. This embodiment is the same as the embodiment 1 except that the external connection terminal is partially exposed in the film D to which the photoresist solution which is the material of the protective layer is applied.
  • Example 7 the protective layer is a portion of 5 ⁇ m from the end of the external connection terminal in the Y direction shown in FIG. 5, that is, the width direction of the external connection terminal shown in FIG. Covering along the widthwise end.
  • Example 8 Example 7 is the same as Example 7 except that a photoresist solution, which is a material of the protective layer, is applied to the film D so that the thickness after drying is 1 ⁇ m.
  • Example 9 Example 7 is the same as Example 7 except that a photoresist solution, which is a material for the protective layer, is applied to the film D so that the thickness after drying is 2 ⁇ m.
  • Example 10 is the same as Example 7 except that a photoresist solution, which is a material of the protective layer, is applied to the film D so as to have a dry thickness of 6 ⁇ m.
  • Example 11 is the same as Example 7 except that a photoresist solution, which is a material of the protective layer, is applied to the film D so that the thickness after drying is 8 ⁇ m.
  • Example 12 Example 7 is the same as Example 7 except that a photoresist solution, which is a material for the protective layer, is applied to the film D so that the thickness after drying is 11 ⁇ m.
  • Comparative Example 1 The film D coated with a photoresist solution, which is a material of the protective layer, was also exposed to ultraviolet light with an irradiation amount of 100 mJ / cm 2 also in the region between the plurality of external connection terminals adjacent to each other. It is the same. Comparative Example 2 A photoresist solution, which is a material of the protective layer, is applied to the film D so that the thickness after drying is 18 ⁇ m, and the height difference between the upper surface of the protective layer of the protective layer and the upper surface of the external terminal of the external connection terminal is 17 ⁇ m. Except for the above, this embodiment is the same as the first embodiment.
  • Example 1 As shown in Table 1, in Examples 1 to 12, good results were obtained in both of the environmental durability evaluation and the migration resistance evaluation, and the reliability in the electrical connection between the flexible printed circuit and the film D was ensured. While, the occurrence of migration at the external connection terminal of the film D could be suppressed.
  • the environmental durability evaluation and the migration resistance evaluation are all “A” or “B”, and the flexible printed circuit board and the film D It was possible to sufficiently suppress the occurrence of migration in the external connection terminal of the film D while sufficiently securing the reliability in the electrical connection with the above.
  • Example 1 Example 4, Example 7 and Example 9 to Example 11
  • the environmental durability evaluation and the migration resistance evaluation are all “A”
  • the electrical characteristics of the flexible printed board and the film D are obtained. It was possible to achieve excellent reliability in connection and sufficiently suppress the occurrence of migration in the external connection terminal of the film D.
  • Example 1 and Example 4 in which both the environmental durability evaluation and the migration resistance evaluation were “A” the height difference between the upper surface of the external terminal of the external connection terminal in the film D and the upper surface of the protective layer of the protective layer was All are 5 micrometers or more and 10 micrometers or less. Thus, the difference in height between the external terminal upper surface of the external connection terminal and the upper surface of the protective layer of the protective layer is not too large, that is, 10 ⁇ m or less. It can be considered that the environmental durability evaluation in Example 1 and Example 4 became “A” because it can be well contacted via the conductive particles contained in the anisotropic conductive film.
  • the difference in height between the upper surface of the external connection terminal and the upper surface of the protection layer is not too small, that is, 5 ⁇ m or more, so the external connection terminal in the film D is affected by the temperature and humidity of the external environment. Because of the difficulty, it is considered that the migration resistance evaluation in Example 1 and Example 4 became “A”.
  • Example 7 and Example 9 The environmental durability evaluation in Examples 7 to 11 is considered to be “A” for the same reason as in Examples 1 and 4.
  • the height difference between the upper surface of the external terminal of the external connection terminal in film D and the upper surface of the protective layer of the protective layer is 3 ⁇ m and 2 ⁇ m, respectively, and is out of the range of 5 ⁇ m or more.
  • the upper surface of the external terminal of the external connection terminal is partially covered by the protective layer, and the area exposed to the outside is small. Therefore, it is considered that the external connection terminal in Example 7 and Example 9 is not easily influenced by the temperature and humidity of the outside world, and the migration resistance evaluation in Example 7 and Example 9 becomes “A”.
  • Example 2 the height difference between the upper surface of the external terminal of the external connection terminal and the upper surface of the protective layer of the protective layer in the film D is 1 ⁇ m, and the external connection terminal is affected by external temperature, humidity, etc. As a result, the migration resistance evaluation is considered to be “C”. However, the environmental durability evaluation is “A” for the same reason as in Example 1, Example 4 and Examples 7 to 11. When the film D in Example 2 is used for a touch panel, it is practically useful. An excellent touch panel free of problems can be obtained.
  • Example 6 the height difference between the upper surface of the external connection terminal in the film D and the upper surface of the protective layer of the protective layer is 14 ⁇ m, and compared with Example 1, the external connection terminal in the film D and the flexible printed wiring board It is considered that the environmental durability evaluation became “C” because the substrate connection terminal did not easily come in contact with the substrate via the conductive particles contained in the anisotropic conductive film. However, when the migration resistance evaluation is “A” and the film D in Example 6 is used for a touch panel, an excellent touch panel having no practical problems can be obtained.
  • the comparative example 1 does not have a protective layer covering at least a part of the external connection terminal in the film D, and the external connection terminal is exposed, thereby suppressing the occurrence of migration in the external connection terminal. I can not do it. As a result, it is considered that the migration resistance evaluation in Comparative Example 1 became "D". As described above, when the film D in Comparative Example 1 is used for a touch panel, the touch panel has a problem in practical use.
  • the height difference between the upper surface of the external connection terminal of the film D and the upper surface of the protection layer of the protective layer is 17 ⁇ m, and the height difference between the upper surface of the external connection terminal and the upper surface of the protective layer of the protection layer Since the difference is too large, it is considered that it has become difficult for the external connection terminal in the film D and the substrate connection terminal in the flexible printed wiring board to contact via the conductive particles contained in the anisotropic conductive film. As a result, it is considered that the environmental durability evaluation in Comparative Example 2 became “D”. As described above, when the film D in Comparative Example 2 is used as a touch panel, the touch panel has a problem in practical use.
  • the conductive film of the present invention for a touch panel, reliable connection with an external wiring board can be easily performed, and the occurrence of migration in the external connection terminal can be suppressed. It turns out that you can do it.
  • An insulating member A plurality of detection electrodes formed on the surface of the insulating member; A plurality of lead wires formed on the surface of the insulating member and having one end electrically connected to the detection electrode; A plurality of external connection terminals formed on the surface of the insulating member and electrically connected to the other end of the lead wire, respectively; A protective layer formed on the surface of the insulating member so as to cover the upper surfaces of the plurality of detection electrodes and the upper surfaces of the plurality of lead wires; The protective layer is formed between a plurality of the plurality of external connection terminals adjacent to each other, At least a portion of the top surface of the external connection terminal is exposed from the protective layer, The upper surface of the protective layer is located farther from the surface of the insulating member than the upper surface of the external connection terminal, The conductive member whose height difference between the upper surface of the protective layer and the upper surface of the external connection terminal is 15 ⁇ m or less.
  • the insulating member is not particularly limited as long as it has electrical insulating properties, but is preferably transparent when the conductive member is used for a display device.
  • the material constituting the insulating member include glass, rubber, plastic and the like, and examples of transparent materials include glass, tempered glass, non-alkali glass, polyethylene terephthalate (PET), polyethylene naphthalate (PEN: Polyethylene phthalate (PEN), cycloolefin polymer (COP: Cyclo-Olefin Polymer), cyclic olefin copolymer (COC: Cyclic Olefin Copolymer), polycarbonate (PC: Polycarbonate), acrylic resin, polyethylene (PE: Polyethylene), polypropylene (PP) : Polypropylene, polystyrene (PS: Polystylene), polyvinyl chloride (PVC: Polyvinyl Chloride), polyvinylidene chloride (PVDC: Polyvinylidene Chloride
  • the surface of the insulating member may have any shape as long as it can constitute a surface such as a flat surface, a curved surface or a spherical surface.
  • the shape of the said electroconductive member which has an insulation member is not limited, It can take various three-dimensional shapes, such as spherical shape, cylindrical shape, rectangular solid shape, and a film shape.
  • the thickness of the insulating member is, for example, 20 to 1000 ⁇ m, and particularly preferably 30 to 100 ⁇ m.
  • the total light transmittance of the insulating member is preferably 40% to 100%. The total light transmittance is measured, for example, using "plastic-how to determine total light transmittance and total light reflectance" defined in JIS K 7375: 2008.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)

Abstract

L'invention concerne : un film conducteur pour un panneau tactile, le film conducteur étant apte à faciliter une connexion fiable avec une carte de câblage externe et à supprimer l'apparition de migration dans une borne de connexion externe ; un élément conducteur ; et un panneau tactile. Le film conducteur pour un panneau tactile comprend : un substrat (5) ; une pluralité d'électrodes de détection (11) formées sur une surface de substrat (5A) ; une pluralité de fils de sortie (12) formés sur la surface de substrat (5A) et connectés respectivement aux électrodes de détection (11) par l'intermédiaire d'une extrémité ; une pluralité de bornes de connexion externes (13) formées sur la surface de substrat (5A) et connectées respectivement aux autres extrémités des fils de sortie (12) ; et une couche de protection (7) formée sur la surface de substrat (5A), au moins une partie de la surface supérieure (13A) de la borne de connexion externe (13) étant laissée exposée par la couche protectrice (7), la surface supérieure (7A) de la couche de protection (7) étant située plus loin de la surface de substrat (5A) que la surface supérieure (13A) de la borne de connexion externe (13), et la différence de hauteur entre la surface supérieure (7A) de la couche de protection (7) et la surface supérieure (13A) de la borne de connexion externe (13) étant inférieure ou égale à 15 µm.
PCT/JP2018/029490 2017-08-16 2018-08-06 Film conducteur pour panneau tactile, élément tactile et panneau tactile Ceased WO2019035385A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2017157040 2017-08-16
JP2017-157040 2017-08-16
JPPCT/JP2018/008853 2018-03-07
JP2018008853 2018-03-07
JP2018-093893 2018-05-15
JP2018093893A JP2020194196A (ja) 2017-08-16 2018-05-15 タッチパネル用導電性フィルム、導電性部材およびタッチパネル

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008233471A (ja) * 2007-03-20 2008-10-02 Nippon Telegr & Teleph Corp <Ntt> 平面型光回路における電極端子の接続構造
JP2011081538A (ja) * 2009-10-06 2011-04-21 Sony Corp 実装構造体、電気光学装置およびタッチパネル
JP2013542509A (ja) * 2010-09-27 2013-11-21 エルジー イノテック カンパニー リミテッド タッチスクリーンパネル及びこれを含むタッチスクリーンアセンブリー
WO2016002279A1 (fr) * 2014-06-30 2016-01-07 富士フイルム株式会社 Panneau tactile et son procédé de production
WO2016038940A1 (fr) * 2014-09-08 2016-03-17 富士フイルム株式会社 Film conducteur pour panneau tactile, et panneau tactile

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008233471A (ja) * 2007-03-20 2008-10-02 Nippon Telegr & Teleph Corp <Ntt> 平面型光回路における電極端子の接続構造
JP2011081538A (ja) * 2009-10-06 2011-04-21 Sony Corp 実装構造体、電気光学装置およびタッチパネル
JP2013542509A (ja) * 2010-09-27 2013-11-21 エルジー イノテック カンパニー リミテッド タッチスクリーンパネル及びこれを含むタッチスクリーンアセンブリー
WO2016002279A1 (fr) * 2014-06-30 2016-01-07 富士フイルム株式会社 Panneau tactile et son procédé de production
WO2016038940A1 (fr) * 2014-09-08 2016-03-17 富士フイルム株式会社 Film conducteur pour panneau tactile, et panneau tactile

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