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WO2019013120A1 - Procédé de fabrication de dispositif d'affichage, procédé de transfert de composant de puce et élément de transfert - Google Patents

Procédé de fabrication de dispositif d'affichage, procédé de transfert de composant de puce et élément de transfert Download PDF

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Publication number
WO2019013120A1
WO2019013120A1 PCT/JP2018/025672 JP2018025672W WO2019013120A1 WO 2019013120 A1 WO2019013120 A1 WO 2019013120A1 JP 2018025672 W JP2018025672 W JP 2018025672W WO 2019013120 A1 WO2019013120 A1 WO 2019013120A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
transfer
chip component
chip
drive circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/025672
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English (en)
Japanese (ja)
Inventor
梶山　康一
貴文 平野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
V Technology Co Ltd
Original Assignee
V Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by V Technology Co Ltd filed Critical V Technology Co Ltd
Priority to KR1020197036200A priority Critical patent/KR20200019133A/ko
Priority to CN201880044616.5A priority patent/CN110832572A/zh
Publication of WO2019013120A1 publication Critical patent/WO2019013120A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

  • the present invention relates to a method of manufacturing a display device, a method of transferring chip components, and a transfer member.
  • the micro LED display is a display device in which each pixel is a fine light emitting diode (hereinafter referred to as LED) chip, and this LED chip is densely spread on the surface of the display substrate.
  • LED fine light emitting diode
  • the transfer tool comprises an electrostatic transfer head array for capturing chip components.
  • a transfer method with less influence such as electrostatic breakdown is required for an LED chip which is an electronic component.
  • a method including the following steps (1) to (4) has been proposed.
  • a TFT (Thin Film Transistor) substrate is prepared. An anisotropic conductive film is disposed on the surface of the TFT substrate on which the LED chip is mounted.
  • the transfer plate and the TFT substrate are brought close to contact the LED chip with the anisotropic conductive film.
  • thermocompression bonding is performed with the transfer plate and the TFT substrate interposed, and the LED chip is conducted to the drive circuit on the TFT substrate side, and then the transfer adhesive layer of the transfer plate is peeled off from the LED chip . In this process, the LED chip is transferred from the transfer substrate to the drive circuit substrate.
  • the relative adhesive strengths between the three adhesive layers of the temporary substrate-side adhesive layer, the transfer adhesive layer, and the anisotropic conductive film are set as follows: There is a need to. That is, the adhesion between the transfer adhesive layer and the LED chip needs to be set larger than the adhesion between the temporary substrate-side adhesive layer and the LED chip. The adhesion between the anisotropic conductive film and the LED chip needs to be set larger than the adhesion between the transfer adhesive layer and the LED chip.
  • the LED chip is successfully transferred. There is a problem that it does not take place.
  • the variation in the adhesive strength of the adhesive material is caused by the fluctuation of the performance of each production lot of the adhesive, the film formation state of the adhesive layer, the change with time, and the like. Therefore, in the case of manufacturing a display device using the above-described transfer method, there is a problem that the yield is low.
  • the LED chip is detached from the anisotropic conductive film when the adhesive force of the transfer adhesive layer has an adhesive force equivalent to that of the anisotropic conductive film. And problems such as displacement of the LED chip on the anisotropic conductive film.
  • the present invention has been made in view of the above problems, and it is an object of the present invention to provide a method of manufacturing a display device capable of reliably transferring a chip component to a desired position of a drive circuit substrate and having a high yield.
  • An object of the present invention is to provide a transfer method capable of reliably transferring a chip part to a desired position of a drive circuit board.
  • Another object of the present invention is to provide a transfer member capable of reliably transferring chip components.
  • a first aspect of the present invention is a method of manufacturing a display device, comprising the steps of: arranging a chip component constituting a pixel on a temporary substrate;
  • the transfer substrate having a transfer member layer formed of a transfer member in which thermally expandable particles are dispersed in an adhesive is provided along the substrate surface, and the temporary substrate close to each other to adhere the transfer member layer to the chip component.
  • the thermally expandable particle is a capsule-like sphere in which an outer shell is formed of a thermoplastic resin, and a low boiling point material is sealed inside.
  • the thermally expandable particle is a capsule-like sphere in which an outer shell is formed of a thermoplastic resin, and a gas is sealed inside.
  • the chip component is preferably a micro LED chip.
  • a protective resin layer made of a thermoplastic resin on the anisotropic conductive film it is preferable to laminate a protective resin layer made of a thermoplastic resin on the anisotropic conductive film.
  • a second aspect of the present invention is a method for transferring a chip, comprising the steps of disposing a chip component on a temporary substrate, and a transfer member layer comprising a transfer member having thermally expandable particles dispersed in a thermoplastic adhesive. Bonding the transfer substrate provided along the substrate surface and the temporary substrate to adhere the transfer member layer to the chip component, separating the transfer substrate and the temporary substrate from each other, and A step of peeling from the temporary substrate side and transferring it to the transfer substrate side, a driving circuit substrate on which an anisotropic conductive film having thermoplasticity is disposed on the surface, and the transfer substrate close to each other.
  • the thermally expandable particle is a capsule-like sphere in which an outer shell is formed of a thermoplastic resin, and a low boiling point material is sealed inside.
  • the thermally expandable particle is a capsule-like sphere in which an outer shell is formed of a thermoplastic resin, and a gas is sealed inside.
  • a third aspect of the present invention is a transfer member used for transfer of the chip part by performing adhesion of the chip part and peeling of the chip part, wherein thermally expandable particles are dispersed in a thermoplastic adhesive.
  • the thermally expandable particle is a capsule-like sphere in which an outer shell is formed of a thermoplastic resin, and a gas or low boiling point material is sealed inside.
  • the method of manufacturing a display device it is possible to realize a method of manufacturing a display device in which chip components are reliably transferred to a desired position of a drive circuit substrate, pixel placement accuracy is high, and manufacturing yield is high.
  • the chip component transfer method of the present invention it is possible to realize a transfer method capable of reliably transferring the chip component to a desired position of the drive circuit board.
  • the transfer member according to the present invention it is possible to reliably transfer the chip component.
  • FIG. 1 is an explanatory process cross-sectional view showing a state in which a temporary substrate and a transfer substrate are opposed to each other in the method of manufacturing a display device according to the embodiment of the present invention.
  • FIG. 2 is an explanatory process cross-sectional view showing a state in which the transfer member layer of the transfer substrate is adhered to the upper surface of the chip component on the temporary substrate side in the method of manufacturing a display device according to the embodiment of the present invention.
  • FIG. 3 shows a method of manufacturing a display device according to an embodiment of the present invention, in which the transfer member layer of the transfer substrate is adhered to the upper surface of the chip component on the temporary substrate side, and then the transfer substrate and the temporary substrate are separated.
  • FIG. 4 is an explanatory process cross-sectional view showing a state in which the transfer substrate on which the chip component is transferred and the drive circuit substrate are opposed in the method of manufacturing a display device according to the embodiment of the present invention.
  • FIG. 5 is a cross-sectional view showing the state in which the chip component transferred to the transfer substrate and the drive circuit substrate are in contact with each other through the anisotropic conductive film in the method of manufacturing a display device according to the embodiment of the present invention.
  • FIG. 6 is an explanatory process cross-sectional view showing a state in which the transfer substrate and the drive circuit substrate are stacked and thermocompression-bonded in the method of manufacturing a display device according to the embodiment of the present invention.
  • FIG. 7 is a manufacturing method of a display device according to an embodiment of the present invention, in which after the transfer substrate and the drive circuit substrate are stacked and thermocompression bonded, the transfer substrate and the drive circuit substrate are separated to separate chip components It is process cross-sectional explanatory drawing which shows the state which peeled the transfer member layer and transferred the chip component to the drive circuit board side.
  • FIG. 8 is a process sectional view showing a state in which the temperature of the transfer substrate peeled from the chip part is lowered and the thermally expandable particles are shrunk in the method of manufacturing a display device according to the embodiment of the present invention.
  • FIG. 9 is a cross-sectional explanatory view showing a change in the state of the thermally expandable particles contained in the transfer member in the method of manufacturing a display device according to the embodiment of the present invention.
  • FIG. 10 is a cross-sectional explanatory view showing the change of the state of the modified example of the thermally expandable particles contained in the transfer member in the method of manufacturing a display device according to the embodiment of the present invention.
  • FIG. 11 is a method of manufacturing a display device according to another embodiment of the present invention, including: a drive circuit substrate in which a protective layer is laminated on an anisotropic conductive film; and a transfer substrate on which chip components are transferred. It is process sectional explanatory drawing which shows the state which opposed.
  • FIG. 12 is an explanatory process cross-sectional view showing a state in which the transfer substrate and the drive circuit substrate are overlapped and thermocompression-bonded in the method of manufacturing a display device according to another embodiment of the present invention.
  • the present embodiment is a method for transferring a chip part according to the present invention and a method for manufacturing a display device to which a transfer member is applied.
  • a micro LED display is applied as the display device.
  • a temporary substrate 1 is prepared.
  • substrate 1 is provided with the temporary board
  • a large number of chip components 3 are arranged on the temporary substrate 1 so as to be arranged at a predetermined arrangement interval.
  • the chip component 3 used in the present embodiment is a micro LED chip that constitutes a pixel of a display device.
  • the arrangement area for arranging a large number of chip components 3 on the surface thereof is set to have the same vertical and horizontal dimensions as the display area of the micro LED display.
  • the electrodes 31 and 32 are formed on the lower surface of the chip part 3 so as to project downward.
  • the electrodes 31 and 32 are bonded to the temporary substrate-side adhesive layer 2 with a small adhesive force.
  • the electrodes of the chip part 3 are not limited to the arrangement positions of the electrodes 31 and 32 shown in the drawings as long as they are exposed on the lower surface of the chip part 3.
  • a transfer substrate 5 is prepared.
  • the transfer substrate 5 is provided with a transfer member layer 4 along one substrate surface.
  • the transfer member layer 4 is made of a transfer member 43 in which the thermally expandable particles 42 are dispersed in the thermoplastic adhesive 41.
  • the thermoplastic adhesive 41 is set to have a sufficiently large adhesive strength as compared with the adhesive constituting the temporary substrate side adhesive layer 2 provided on the temporary substrate 1 side.
  • FIG. 9 is a cross-sectional explanatory view showing a normal state and an expanded state of the thermally expandable particle 42 according to the present embodiment.
  • the thermally expandable particles 42 are spherical bodies, and the outer shell 44 is formed in a capsule shape with a thermoplastic resin. Air 45 is sealed inside the outer shell 44.
  • the air 45 is sealed inside the outer shell 44, but a gas other than air or a low boiling point solvent may be sealed.
  • a gas other than air or a low boiling point solvent may be sealed.
  • a small amount of the low boiling point solvent may be sealed inside the outer shell 44.
  • the thermally expandable particles 42 When the thermally expandable particles 42 are heated, as shown on the right side of the thick arrow in FIG. 9, the air 45 inside the outer shell 44 or the low boiling point solvent expands to increase the diameter size. When the thermally expandable particles 42 are heated and cooled from the expanded state, they shrink and return to the original small diameter thermally expandable particles 42 state.
  • the chip component 3 on the temporary substrate 1 is transferred using the transfer substrate 5 described above.
  • the transfer member layer 4 of the transfer substrate 5 is adhered to the upper surface of the chip component 3 on the temporary substrate 1 by bringing the transfer substrate 5 and the temporary substrate 1 close to each other.
  • the chip component 3 is peeled from the temporary substrate-side adhesive layer 2 by separating the transfer substrate 5 and the temporary substrate 1.
  • the adhesive force of the transfer member layer 4 is significantly stronger than the adhesive force of the temporary substrate side adhesive layer 2, the chip component 3 is easily peeled off from the temporary substrate side adhesive layer 2.
  • the proximity and separation of the transfer substrate 5 and the temporary substrate 1 may be either moving the temporary substrate 1 with respect to the transfer substrate 5 or moving the transfer substrate 5 with respect to the temporary substrate 1. Good.
  • a TFT (Thin Film Transistor) substrate 6 as a drive circuit substrate is prepared.
  • a drive circuit (not shown) is formed on the TFT substrate 6.
  • the TFT substrate 6 is provided with pads 61 and 62 on the surface on which the chip component 3 is to be mounted.
  • the pads 61 and 62 are arranged so as to allow connection with the electrodes 31 and 32 of the chip part 3.
  • An anisotropic conductive film 7 is disposed on the surface of the TFT substrate 6 on the side where the pads 61 and 62 are provided.
  • the transfer substrate 5 is moved to face the TFT substrate 6.
  • thermocompression bonding hot press is performed on the transfer substrate 5 and the TFT substrate 6 under appropriate pressure conditions and temperature conditions.
  • conductive particles (not shown) of the anisotropic conductive film 7 are pressed and bonded between the electrode 31 and the pad 61 and between the electrode 32 and the pad 62.
  • conductive regions 71 and 72 are formed. Therefore, the drive circuit side and the chip component 3 side are conducted.
  • the thermoplastic adhesive 41 constituting the transfer member layer 4 is plasticized and the thermally expandable particles 42 are thermally expanded and become large.
  • the transfer member layer 4 can be easily peeled off from the top surface of the chip part 3. Therefore, as shown in FIG. 7, by separating the transfer substrate 5 and the TFT substrate 6, the chip component 3 can be easily peeled off from the transfer member layer 4 of the transfer substrate 5, and the transfer is successful. You can do it well.
  • the thermally expandable particles 42 shrink and return to the original volume as the temperature decreases.
  • the thermoplastic adhesive 41 also returns to the state before heating as the temperature decreases. Therefore, the transfer substrate 5 can be used repeatedly.
  • the chip component 3 can be reliably transferred to a desired position of the TFT substrate 6 to enhance the accuracy of the pixel arrangement of the micro LED display. Further, according to the method of manufacturing a display device according to the present embodiment, since the chip component 3 can be transferred successfully, the manufacturing yield can be increased.
  • the method for transferring chip components according to the present invention is applied to the method for manufacturing a display device according to the present embodiment.
  • the chip component transfer method according to the present embodiment is as follows.
  • the chip component transfer method includes a process of disposing the chip component 3 on the temporary substrate 1, and a transfer member layer comprising the transfer member 43 in which the thermally expandable particles 42 are dispersed in the thermoplastic adhesive 41.
  • the chip component transfer method according to the present embodiment is not limited to the light emitting element constituting the pixel of the display device as the chip component, and can also be applied to substrate mounting of various semiconductor chips.
  • the arrangement area of the chip component 3 on the temporary substrate 1 is set to have the same vertical and horizontal dimensions as the display area of the micro LED display. Therefore, a large number of chip components 3 constituting all the pixels can be transferred at one time.
  • the chip components 3 may be transferred to the display area of the TFT substrate 6 by the plurality of transfer substrates 5. That is, as long as the display area of the TFT substrate 6 can be covered with the chip component 3 using a plurality of transfer substrates 5, the transfer substrate 5 may not be one transfer substrate 5.
  • the thermally expandable particles 42 constituting the transfer member 43 have a configuration in which air or a low boiling point solvent is sealed inside the outer shell 44, but even if a gas other than air is sealed. Good.
  • the outer shell 44 may be filled with a solid substance 46 such as a metal having a large thermal expansion coefficient.
  • a porous structure having stretchability may be formed inside the outer shell, and the porous structure may contain a gas or a low boiling point solvent.
  • the anisotropic conductive film 7 is provided on the TFT substrate 6, but as shown in FIG. 11, it has a passivation function on the anisotropic conductive film 7.
  • the protective resin layer 8 may be laminated. As shown in FIG. 12, when the protective resin layer 8 is laminated, when the transfer substrate 5 and the TFT substrate 6 are stacked and thermocompression bonded, the lower surface of the chip component 3 is covered by the protective resin layer 8. The effect is to suppress deterioration of the lower surfaces of the electrodes 31 and 32 and the chip component 3.
  • the TFT substrate 6 is applied as the drive circuit substrate, but according to the present invention, the TFT is not used as the switching element according to the drive system of the display device. It goes without saying that the present invention can also be applied to a drive circuit board having a drive circuit.
  • thermocompression bonding is performed in a state where the TFT substrate 6 is placed on the transfer substrate 5 to which the chip component 3 is transferred. May be performed to raise the
  • the temporary substrate 1 is provided with the temporary substrate side adhesive layer 2, but the chip component 3 is provided on the temporary substrate 1 without providing the temporary substrate side adhesive layer 2. It may be arranged at

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un dispositif d'affichage dans lequel un composant de puce est transféré de manière fiable à une position souhaitée sur une carte de circuit d'attaque, la précision de la configuration de pixels est élevée, et le rendement de fabrication est élevé. La présente invention comprend les étapes consistant : à amener une carte de circuit d'attaque (6) pourvue d'un film conducteur anisotrope (7) et un substrat (5) de transfert auquel un composant de puce (3) a été transféré plus près l'un de l'autre, et amener le film conducteur anisotrope (7) à entrer en contact avec le composant de puce (3) ; par la suite, à assembler par thermocompression le substrat (5) de transfert et la carte de circuit d'attaque (6) et amener des particules thermiquement expansibles (42) à se dilater thermiquement ; puis à séparer une couche d'élément de transfert (5) du composant de puce (3) et à transférer le composant de puce (3) à la carte de circuit d'attaque (6).
PCT/JP2018/025672 2017-07-10 2018-07-06 Procédé de fabrication de dispositif d'affichage, procédé de transfert de composant de puce et élément de transfert Ceased WO2019013120A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020197036200A KR20200019133A (ko) 2017-07-10 2018-07-06 표시 장치의 제조 방법, 칩 부품의 전사 방법, 및 전사 부재
CN201880044616.5A CN110832572A (zh) 2017-07-10 2018-07-06 显示装置的制造方法、芯片零件的转印方法及转印部件

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017134409A JP2019015899A (ja) 2017-07-10 2017-07-10 表示装置の製造方法、チップ部品の転写方法、および転写部材
JP2017-134409 2017-07-10

Publications (1)

Publication Number Publication Date
WO2019013120A1 true WO2019013120A1 (fr) 2019-01-17

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PCT/JP2018/025672 Ceased WO2019013120A1 (fr) 2017-07-10 2018-07-06 Procédé de fabrication de dispositif d'affichage, procédé de transfert de composant de puce et élément de transfert

Country Status (5)

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JP (1) JP2019015899A (fr)
KR (1) KR20200019133A (fr)
CN (1) CN110832572A (fr)
TW (1) TW201919104A (fr)
WO (1) WO2019013120A1 (fr)

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WO2021025201A1 (fr) * 2019-08-06 2021-02-11 엘지전자 주식회사 Procédé de fabrication de dispositif d'affichage et substrat de transfert pour fabrication de dispositif d'affichage
US11430770B2 (en) 2019-09-11 2022-08-30 Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. LED substrate and method for manufacturing LED display panel
WO2022197489A1 (fr) * 2021-03-16 2022-09-22 Applied Materials, Inc. Matériaux de transfert de del et processus
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US11855050B2 (en) 2020-10-08 2023-12-26 Samsung Electronics Co., Ltd. Micro-LED displays, micro-led transferring substrates, and methods of transferring micro-LEDs using the micro-LED transferring substrates
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KR102321518B1 (ko) 2021-02-08 2021-11-04 (주)라이타이저 감광성 수지를 이용한 led칩 전사 장치
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CN113555473B (zh) * 2021-07-27 2022-10-11 深圳市思坦科技有限公司 Micro-LED芯片巨量转移方法与系统、以及显示装置
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JP7219373B1 (ja) * 2021-09-06 2023-02-07 積水化学工業株式会社 半導体装置製造用粘着テープ
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