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WO2019004439A1 - Produit équipé d'une puce rfic - Google Patents

Produit équipé d'une puce rfic Download PDF

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Publication number
WO2019004439A1
WO2019004439A1 PCT/JP2018/024848 JP2018024848W WO2019004439A1 WO 2019004439 A1 WO2019004439 A1 WO 2019004439A1 JP 2018024848 W JP2018024848 W JP 2018024848W WO 2019004439 A1 WO2019004439 A1 WO 2019004439A1
Authority
WO
WIPO (PCT)
Prior art keywords
coil conductor
rfic
electrode
ground electrode
metal surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/024848
Other languages
English (en)
Japanese (ja)
Inventor
加藤　登
哲平 三浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2018562272A priority Critical patent/JP6508441B1/ja
Publication of WO2019004439A1 publication Critical patent/WO2019004439A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Definitions

  • the present invention relates to an article provided with an RFIC chip in which an RFIC (Radio-Frequency Integrated Circuit) chip is provided on an article at least a part of which is made of a metal, and the metal surface of the article is used as an antenna.
  • RFIC Radio-Frequency Integrated Circuit
  • a wireless communication tag provided with an RFIC chip storing various information related to the article is attached to the article or a container (package) of the article, etc.
  • an RFID system Radio Frequency Identification System
  • Patent Documents 1 to 3 As an article management system using an RFID system using a metal surface of an article as an antenna, for example, there are configurations disclosed in Patent Documents 1 to 3.
  • a feeding circuit substrate provided with a wireless IC chip and incorporating a resonant circuit is electromagnetically coupled to a metal object, and the metal surface of the metal object is an antenna (radiation plate) It functions as
  • the printed circuit board with the wireless IC chip of Patent Document 3 has a configuration in which the resonant circuit of the feeding circuit board on which the wireless IC chip is mounted and the loop electrode are electrically connected by electromagnetic field coupling, power (energy Also in terms of the transmission efficiency of), it was not sufficient.
  • FIG. 17 is a perspective view schematically showing a configuration of a coil conductor and the like on a feed circuit substrate of the RFIC module in the fourth embodiment.
  • a perspective view showing an enlarged part of a printed circuit board with an RFIC chip of a modification of the fourth embodiment The figure which shows the state in which the RFIC module was mounted in the grand electrode in the modification of Embodiment 4.
  • FIG. 17 is a perspective view schematically showing a configuration of a coil conductor and the like on a feed circuit board of the RFIC module according to a seventh embodiment of the present invention
  • An article with an RFIC chip according to the first aspect of the present invention is An article having a metal surface; A coil conductor having a loop surface facing the metal surface; An RFIC chip having first and second input / output terminals respectively connected to one end and the other end of the coil conductor; and one point in the middle of the coil conductor and one point near the edge of the metal surface are DC
  • a magnetic flux passing portion through which the magnetic flux from the coil conductor passes is disposed in a region overlapping with the loop surface of the coil conductor in plan view.
  • the RFIC chip attached article according to the second aspect of the present invention is characterized in that one point in the middle of the coil conductor electrically connected directly to the metal surface in the first aspect is approximately the electrical length of the coil conductor. The position of the middle point may be used.
  • the RFIC chip attached article according to the third aspect of the present invention is characterized in that one point of the metal surface electrically connected directly to the coil conductor of the first or second aspect is the surface of the coil conductor in plan view. It may be located directly below.
  • the article with an RFIC chip according to the seventh aspect of the present invention may be made of a material through which magnetic flux passes, in the magnetic flux passing portion according to any one of the first to fifth aspects.
  • the RFIC chip attached article according to an eighth aspect of the present invention is the article according to any one of the first to seventh aspects, wherein the coil conductor includes a plurality of points including the middle point of the coil conductor.
  • the plurality of points near the edge of the metal surface, including one point near the edge of the metal surface, may be DC connected.
  • the coil conductor and the RFIC chip may be modularized as an RFIC module,
  • the RFIC module may include an electrode interposed between the coil conductor and the metal surface, and connecting the coil conductor and the metal surface in a direct current manner.
  • the article with an RFIC chip according to a tenth aspect of the present invention is configured such that the metal surface is an antenna and the UHF band is a communication frequency in any one of the first to ninth aspects. It is also good.
  • FIG. 1 is an enlarged perspective view showing a part (ground electrode portion) of a printed wiring board 100 which is an article with an RFIC chip according to a first embodiment of the present invention.
  • FIG. 2 is an equivalent circuit diagram of the RFIC module 10 in the printed wiring board 100 with an RFIC chip of the first embodiment.
  • FIG. 1 shows that the RFIC module 10 including the RFIC chip 1 is mounted on the ground electrode 3.
  • the ground electrode 3 is a metal and serves as an antenna.
  • the RFIC module 10 is an RFID device for performing wireless communication (transmission and reception) with the UHF band as a communication frequency (carrier frequency), and a feeding circuit board 2 having an RFIC chip 1 for processing RFID signals and a coil conductor 4 (see FIG. 2). And.
  • the feeder circuit board 2 is configured by laminating a plurality of sheets formed of dielectrics, and a conductor pattern is formed on each sheet.
  • the conductor patterns formed on the respective sheets are connected by via hole conductors penetrating the respective sheets, whereby a coil conductor 4 to be an inductor element is formed inside the feeder circuit board 2.
  • One end and the other end of the coil conductor 4 are connected to the first input / output terminal 1a and the second input / output terminal 1b provided in the RFIC chip 1, respectively.
  • the RFIC module 10 is provided at the edge of the metal surface (surface) 3 a of the ground electrode 3.
  • a slit 3 b and an opening 3 c connected to the slit 3 b are formed at the edge of the ground electrode 3 provided with the RFIC module 10.
  • the RFIC module 10 is disposed to cover the slit 3 b and the opening 3 c of the ground electrode 3.
  • a direct current connection is made to the ground electrode 3 at one point in the middle of the coil conductor 4 of the feed circuit board 2.
  • One point (connection point) of the coil conductor 4 connected to the ground electrode 3 in a direct current manner is a middle point of the coil conductor 4 (a point between these except for one end and the other end).
  • the middle one point of the coil conductor 4 is closer to the middle point of the electrical length of the coil conductor 4 which is the current maximum point in the coil conductor 4 than the one end and the other end of the coil conductor.
  • the middle point of the coil conductor 4 is preferably the middle point of the electrical length of the coil conductor 4 which is the maximum current point in the coil conductor 4.
  • the direct-current connection state refers to a connection state in which direct current can actually flow without connection via electrostatic capacitance or connection by electromagnetic field coupling.
  • electrically connected state includes not only direct current connection but also connection via electrostatic capacitance, and connection by electromagnetic field coupling.
  • the ground electrode 3 is connected to the coil conductor 4 in a direct current manner (DC connection)
  • one point near the edge of the ground electrode 3 is preferable. This is because the high frequency current has the property of flowing along the surface near the edge of the ground electrode 3. That is, in the vicinity of the edge of the ground electrode 3, in the ground electrode 3 functioning as an antenna by the RFIC module 10, a region in which a high frequency current substantially flows is provided.
  • FIG. 3A is an exploded perspective view showing the configuration of the RFIC module 10 in the first embodiment
  • FIG. 3B is a perspective view schematically showing the configuration of the coil conductor 4 and the like in the feed circuit board 2.
  • the RFIC chip 1 mounted on the feeder circuit substrate 2 has a structure in which various elements are incorporated in a semiconductor substrate made of a semiconductor such as silicon.
  • the RFIC chip 1 includes a clock circuit, a logic circuit, a memory circuit, etc., and necessary information is recorded, and a first input / output terminal provided on the back surface (the surface facing the feeding circuit board 2 in FIG. 3A) Signals indicating various information are input and output by 1a and the second input / output terminal 1b.
  • the feeder circuit board 2 on which the RFIC chip 1 is mounted is formed by laminating, pressing, and firing a plurality of sheets formed of dielectric materials.
  • a predetermined electrode pattern and a via hole conductor are formed on each sheet constituting the feeder circuit board 2, and the feeder circuit board 2 includes the front electrodes 8a and 8b, the coil conductor 4 serving as an inductor element, and the back electrodes 9a and 9b. , 9c, 9d.
  • a pair of front surface electrodes 8a and 8b are provided on the upper surface (a surface facing the RFIC chip 1) of the feeding circuit substrate 2, and the pair of first input / output of the RFIC chip 1 described above.
  • the terminal 1a and the second input / output terminal 1b are connected in a direct current manner (DC connection).
  • the coil conductor 4 is formed in the inside of the feeder circuit board 2 of multilayer structure.
  • the coil conductor 4 is an inductor element constituted by the first loop electrode 4a, the second loop electrode 4b and the third loop electrode 4c formed in each layer, and the via hole conductors 6a, 6b, 6c, 6d connected to these. .
  • One end (end of the via hole conductor 6a) of the coil conductor 4 is connected to one surface electrode 8a, and the other end (end of the via hole conductor 6d) is connected to the other surface electrode 8b.
  • Each of the loop electrodes 4a, 4b and 4c constituting the coil conductor 4 has a substantially square frame shape in a plan view, and has a substantially square loop surface.
  • the term "loop surface” as used herein refers to a plane that includes the loop electrode itself and an opening (loop opening) substantially surrounded by the loop electrode.
  • a planar view means the case where it sees from the upper direction in the direction orthogonal to the layer surface in the feeder circuit board 2 of the multilayer structure shown to FIG. 3B. Therefore, the loop shape of each of the loop electrodes 4a, 4b, and 4c is a substantially square frame shape in plan view, and the loop surfaces of the loop electrodes overlap in plan view.
  • surface electrodes 8a and 8b, loop electrodes 4a, 4b and 4c, and via hole conductors 6a, 6b, 6c and 6d are connected to first via hole conductor 6a from first surface electrode 8a.
  • the first loop electrode 4a, the second via hole conductor 6b, the second loop electrode 4b, the third via hole conductor 6c, the third loop electrode 4c, the fourth via hole conductor 6d, and the second surface electrode 8b are connected in this order.
  • the coil conductor 4 serving as an inductor element configured as described above is connected to the pair of surface electrodes 8a and 8b.
  • back surface electrodes 9a, 9b, 9c, and 9d are provided on the lower surface (back surface) of the feed circuit substrate 2.
  • the back surface electrodes 9a, 9b, 9c and 9d are formed independently at four corners of the feeder circuit board 2 which is a square in plan view.
  • the back surface electrodes 9a, 9b, 9c, 9d are disposed in regions immediately below the four corners of the coil conductor 4 having a square frame shape in a plan view, and the shape has an L-shape bent substantially at a right angle ing.
  • Each of back surface electrodes 9a, 9b, 9c, and 9d in the first embodiment is arranged symmetrically with respect to the center point of the back surface of feed circuit board 2. For this reason, when the RFIC module 10 is mounted on the ground electrode 3 of the printed wiring board, it is possible to ease the positional restriction on the direction (direction) of the RFIC module 10 with respect to the ground electrode 3.
  • back surface electrodes (9a, 9b, 9c, 9d) are provided. However, only one back surface electrode (9a) is connected to coil conductor 4 in a direct current manner. Because of this, the remaining three back electrodes (9b, 9c, 9d) are dummy electrodes. Therefore, in the configuration of the first embodiment, at least one back electrode (9a) may be provided.
  • the first back surface electrode 9 a is electrically connected to the position of the substantially middle point of the electrical length in the coil conductor 4 in a direct current manner.
  • FIGS. 4A to 4C are diagrams showing the positional relationship between the ground electrode 3 of the printed wiring board 100 on which the RFIC module 10 is mounted and the RFIC module 10.
  • FIG. 4A shows the slit 3 b and the opening 3 c in the ground electrode 3 on which the RFIC module 10 is mounted.
  • FIG. 4B shows the positional relationship between the coil conductor 4 and the back surface electrodes 9a to 9d in the RFIC module 10.
  • FIG. 4C shows a state in which the RFIC module 10 is mounted on the ground electrode 3.
  • the coil conductor 4 and the back surface electrodes 9a to 9d of the feeding circuit substrate 2 in the RFIC module 10 are shown, and the illustration of the RFIC chip 1 is omitted.
  • the slit part 3b and the opening part 3c are formed in the position where the RFIC module 10 of the metal surface 3a in the ground electrode 3 which is a metal surface of articles
  • the slit portion 3 b is a gap extending inward from the edge of the ground electrode 3, and an opening 3 c is formed at a tip portion inside the gap.
  • the opening 3 c has a shape disposed inside the coil conductor 4 of the feed circuit board 2, and is formed at a position through which a magnetic field (magnetic flux) generated by the excited coil conductor 4 passes. That is, the slit portion 3 b and the opening 3 c in the ground electrode 3 are magnetic flux passing portions which are non-metal portions.
  • a resist pattern 7 is formed on the metal surface 3a of the ground electrode 3, and the resist openings 7a, 7b, 7c are removed only at positions facing the back surface electrodes 9a to 9d of the feed circuit substrate 2. 7d is formed. That is, the back surface electrodes 9a to 9d of the feeder circuit board 2 are connected to the ground electrode 3 in a direct current manner reliably through the resist openings 7a, 7b, 7c, 7d.
  • the RFIC module 10 is disposed such that the edge portion thereof is in contact with the edge of the ground electrode 3, and the slit portion 3 b and the opening 3 c of the ground electrode 3 are feed circuit boards of the RFIC module 10. It is almost covered by 2. That is, a magnetic flux passing portion (3b, 3c) through which a magnetic field (magnetic flux) generated by the excited coil conductor 4 passes is disposed in a region overlapping the loop surface of the coil conductor 4 of the feed circuit board 2 in plan view.
  • the resist openings 7a, 7b, 7c, 7d formed in the metal surface 3a of the ground electrode 3 are surely provided to the back surface electrodes 9a to 9d disposed immediately below the coil conductor 4 of the feed circuit board 2 in plan view. It is in the state of being positioned. Therefore, the magnetic field (magnetic flux) generated by the coil conductor 4 passes through the opening 3 c which is a magnetic flux passing portion disposed inside the coil conductor 4. In the metal surface 3a of the ground electrode 3, since the edge of the opening 3c is divided by the slit 3b, the generation of the loop current around the opening 3c is suppressed.
  • the magnetic flux passing portion of the slit portion 3b and the opening 3c formed in the ground electrode 3 is described as the opening portion, but as described above, the magnetic flux passing portion has a configuration in which the magnetic field (magnetic flux) passes through.
  • the magnetic flux passing portion (slit portion 3b and the opening 3c) may be made of a material (for example, a resin material) through which a magnetic field (magnetic flux) passes.
  • the first back surface electrode 9 a of the feeder circuit substrate 2 of the RFIC module 10 is connected through the connection line 5 at one point of the second loop electrode 4 b located in the middle of the coil conductor 4.
  • the first back surface electrode 9a is connected to the metal surface 3a of the ground electrode 3 exposed through one resist opening (first resist opening 7a) in a direct current manner via a conductive paste.
  • the middle point of the coil conductor 4 in the feeder circuit board 2 of the RFIC module 10 is located directly below the coil conductor 4 in the ground electrode 3 via the first back electrode 9a.
  • the position directly below the coil conductor in the ground electrode 3 means immediately below the loop electrode of the coil conductor and immediately below the loop opening. That is, the middle point of the coil conductor 4 in the feed circuit board 2 is connected in a direct current manner in a region near the edge of the ground electrode 3.
  • the area in the vicinity of the edge of the ground electrode 3 means the module mounting surface area in which the RFIC module is disposed in the ground electrode 3 or the ground in the state where the RFIC module 10 is mounted on the edge portion of the ground electrode 3 This refers to the area from the edge of the electrode 3 to the module mounting surface area.
  • the RFIC module 10 can receive signals by the high frequency current flowing through the edge thereof.
  • the coil conductor 4 of the feeder circuit board 2 in the first embodiment includes one coil-shaped portion, and the central axis of the coil is disposed in the vertical direction (vertical direction in FIG. 3B).
  • the coil conductor according to the embodiment of the present invention is not limited to such a configuration.
  • FIG. 5 is a schematic diagram which shows the modification of the coil conductor (40) in a feed circuit board (20).
  • the coil conductor 40 of the feed circuit board 20 is composed of two coiled parts 4A and 4B.
  • the two coiled parts 4A, 4B are juxtaposed and electrically connected in series.
  • the coil central axes of the two coiled parts 4A and 4B are parallel to each other and extend in the longitudinal direction.
  • the series connection position where the two coil-shaped portions 4A and 4B are connected in series with each other is DC-connected to the back surface electrode 9a via the connection wire 5, that is, the coil The middle point of the conductor 40 and the back electrode 9a are connected.
  • the other coiled part is formed in one coiled part so that the respective coil central axes overlap. It may be arranged. That is, in the configuration of the present invention, as the configuration of the coil conductor (4, 40) in the feed circuit substrate (2, 20), the coil conductor (4, 40) in the feed circuit substrate (2, 20) of the laminated structure It is sufficient if it has a configuration in which the substantially midpoint of the electrical length and the back surface electrode (9a) can be connected in a direct current manner via the connection line (5).
  • the approximate midpoint of the coil conductor (more preferably, the midpoint of the electrical length) of the coil conductor of the feeding circuit board 2 of the RFIC module 10 is used as an antenna.
  • Direct current connection (DC connection) is made at a specific position (one point) of the ground electrode 3 to be the radiation plate).
  • the printed wiring board 100 according to the first embodiment is configured to have a high degree of freedom of attachment and a high power transfer efficiency, and can be configured to be further reduced in size, weight and cost.
  • the printed wiring board which is an article with an RFIC chip of Embodiment 2 concerning the present invention is explained.
  • the printed wiring board of the second embodiment will be described focusing on differences from the printed wiring board 100 of the first embodiment.
  • elements having the same configurations, operations and functions as the first embodiment described above are denoted by the same reference numerals, and the description may be omitted to avoid redundant description.
  • the difference between the printed wiring board with the RFIC chip of the second embodiment and the printed wiring board 100 of the first embodiment is that the RFIC module (10A) including the RFIC chip 1 with respect to the ground electrode (3A) of the printed wiring board. It is a setting position.
  • the RFIC module (10A) in the second embodiment has substantially the same configuration as the RFIC module 10 in the first embodiment, the back electrode (19A) formed on the back surface of the feeder circuit board (12) is It is different in that it is one and its shape is quadrangular (substantially square).
  • the printed wiring board of the second embodiment is a radio frequency signal having a communication frequency (carrier frequency) in the UHF band by the RFIC module (10A) using the ground electrode (3A) as an antenna. It is configured to communicate, and configured to be capable of wireless communication in a wide frequency band.
  • FIG. 6 is a perspective view showing a mounting position of an RFIC module 10A mounted on the ground electrode 3A by enlarging a part of the printed wiring board with the RFIC chip of the second embodiment.
  • the article is a printed wiring board, and the metal in the article is the ground electrode 3A.
  • the RFIC module 10A is mounted on the edge of the metal surface 3Aa of the flat ground electrode 3A.
  • FIG. 7 is a plan view showing a state in which the RFIC module 10A is mounted on the edge of the metal surface 3Aa of the ground electrode 3A.
  • the coil conductor 4 and the back surface electrode 19A of the feeder circuit substrate 12 in the RFIC module 10A are shown, and the illustration of the RFIC chip 1 is omitted.
  • the coil conductor 4 of the feed circuit board 12 is disposed so as to protrude from the edge of the ground electrode 3A. In other words, a part of the coil conductor 4 of the feed circuit board 12 is disposed on the ground electrode 3A, and the remaining part of the coil conductor 4 is disposed at a position deviated from the ground electrode 3A.
  • the magnetic field (magnetic flux) generated by the excited coil conductor 4 passes through the region out of the metal surface 3Aa of the ground electrode 3A. That is, the loop surface of the coil conductor 4 is disposed so as to overlap the edge of the metal surface 3Aa in plan view, and a part of the loop surface of the coil conductor 4 overlaps the magnetic flux passing portion in plan view.
  • the remaining portion of the coil conductor 4 disposed at a position deviated from the ground electrode 3A may be configured to protrude from the ground electrode 3A, but a material (for example, a resin material) through which a magnetic field (magnetic flux) passes.
  • the remaining portion of the coil conductor 4 may be supported by a member made of a material through which a magnetic field (magnetic flux) passes, provided so as to be flush with 3A.
  • the back surface electrode formed on the back surface of feed circuit board 12 may be provided at the four corners of the back surface of feed circuit board 12 as in the configuration of the first embodiment described above.
  • the portion through which the magnetic field (magnetic flux) of the excited coil conductor 4 passes is the magnetic flux passing portion which is a nonmetal portion.
  • the approximate midpoint of the coil conductor 4 of the feed circuit board 12 (more preferably, the midpoint of the electrical length) is DC near the edge of the ground electrode 3A. Connected. For this reason, the high frequency current from the excited coil conductor 4 flows along the edge of the ground electrode 3A, and the ground electrode 3A functions as a transmission antenna. On the contrary, in the ground electrode 3A functioning as a receiving antenna, the RFIC module 10A can receive signals by the high frequency current flowing through the edge of the metal surface 3Aa.
  • connection line 5 In the configuration of coil conductor 4 of feed circuit substrate 12 in the second embodiment, two coil-shaped portions juxtaposed as shown in FIG. 5 described above are connected in series, and the serial connection point and back surface electrode 9A May be connected in a direct current manner by the connection line 5.
  • the approximate midpoint (more preferably, the midpoint of the electrical length) of the coil conductor 4 of the feeding circuit board 2 of the RFIC module 10A is used as an antenna It is a structure connected in a direct-current manner (DC connection) at one place near the edge of the ground electrode 3A to be a radiation plate).
  • the printed wiring board of the second embodiment has a configuration with high degree of freedom of attachment and power transfer efficiency, and can achieve further downsizing, weight reduction and cost reduction.
  • the printed wiring board with RFIC chip of the third embodiment differs from the printed wiring board of the first embodiment in the shape of the ground electrode (3B) of the printed wiring board and the RFIC chip 1 corresponding to the ground electrode (3B). It is an arrangement position of the RFIC module (10A) provided.
  • the RFIC module (10A) in the third embodiment has substantially the same configuration as the RFIC module 10A in the second embodiment.
  • the printed wiring board of the third embodiment has the communication frequency (carrier frequency) in the UHF band by the RFIC module (10A) using the ground electrode (3B) as an antenna, as in the configurations of the first embodiment and the second embodiment. It is configured to perform wireless communication with a high frequency signal that it has, and is configured to enable wireless communication in a wide frequency band.
  • FIG. 8 is a perspective view showing a mounting position of an RFIC module 10A mounted on a ground electrode 3B by enlarging a part of the printed wiring board with an RFIC chip of the third embodiment.
  • the article is a printed wiring board, and the metal in the article is the ground electrode 3B.
  • the RFIC module 10A is mounted on the edge of the metal surface 3Ba of the flat ground electrode 3B.
  • a slit portion 3Bb as a magnetic flux passing portion is formed on the metal surface 3Ba of the ground electrode 3B on which the RFIC module 10A is mounted.
  • the slit portion 3Bb has a gap shape extending inward from the edge of the ground electrode 3B, and the RFIC module 10A is mounted so as to straddle the slit portion 3Bb.
  • FIG. 9 is a plan view showing a state in which the RFIC module 10A is mounted on the edge of the metal surface 3Ba of the ground electrode 3B.
  • the coil conductor 4 and the back surface electrode 19A of the feeder circuit substrate 12 in the RFIC module 10A are shown, and the illustration of the RFIC chip 1 is omitted.
  • the coil conductor 4 of the feed circuit board 12 is disposed so as to protrude from the edge of the ground electrode 3B.
  • a part of the coil conductor 4 of the feeding circuit board 12 is disposed on the ground electrode 3B, and the remaining part of the coil conductor 4 is disposed at a position deviated from the ground electrode 3B.
  • the magnetic field (magnetic flux) generated by the excited coil conductor 4 passes through the region out of the metal surface 3Ba of the ground electrode 3B. That is, the loop surface of the coil conductor 4 is disposed so as to overlap the edge of the metal surface 3Ba in plan view, and a part of the loop surface of the coil conductor 4 overlaps the magnetic flux passing portion in plan view.
  • the feeder circuit board 12 of the RFIC module 10A is disposed so as to straddle the slit portion 3Bb formed on the metal surface 3Ba of the ground electrode 3B. That is, a part of the slit including the edge portion of the slit portion 3Bb extended from the edge of the ground electrode 3B intersects with the coil conductor 4 of the feed circuit substrate 12 in a plan view. Therefore, the region of the tip portion (inner portion) of the slit portion 3Bb extended from the edge of the ground electrode 3B is a region out of the module mounting surface region of the RFIC module 10A.
  • connection point connected in a direct current manner to the approximate midpoint of coil conductor 4 of feed circuit board 12 via connection line 5 and back surface electrode 19A is slit portion 3Bb at ground electrode 3B. It is near the edge of the area of one side divided by. That is, the substantially middle point of the coil conductor 4 is connected in a direct current manner via the connection line 5 and the back surface electrode 19A in the module mounting surface area near the edge of the ground electrode 3B.
  • the magnetic field (magnetic flux) generated by the excited coil conductor 4 in the feed circuit board 12 passes through the region out of the metal surface 3Ba of the ground electrode 3B in plan view. Since the slit portion 3Bb is formed in the module mounting surface area of the RFIC module 10A in the ground electrode 3B, the flow of current that degrades the power transfer efficiency in the module mounting surface area is suppressed.
  • the substantially middle point of the coil conductor 4 of the feeding circuit board 12 is DC connected near the edge of the ground electrode 3B and is connected to the ground electrode 3B. It has the structure which provided slit part 3Bb. Therefore, the high frequency current from the excited coil conductor 4 flows along the edge of the ground electrode 3B, and the ground electrode 3B functions as a transmitting antenna. On the contrary, in the ground electrode 3B functioning as a receiving antenna, the RFIC module 10A can receive signals by the high frequency current flowing through the edge portion of the metal surface 3Ba.
  • substantially the middle point of the coil conductor 4 of the feeding circuit board 12 of the RFIC module 10A (more preferably, middle point of electrical length) Are connected in a direct current manner (DC connection) at one place near the edge of the ground electrode 3B to be an antenna (radiation plate).
  • the printed wiring board of the third embodiment has a high degree of freedom of attachment, and has a configuration with higher power transfer efficiency, and can achieve downsizing, weight reduction, and cost reduction.
  • a metal is described as a ground electrode using a printed wiring board as an article with an RFIC chip, but a metal is used as an antenna as an article with an RFIC chip of the present invention. It is possible to apply to various articles which can
  • FIG. 10 shows an example of application of the article with an RFIC chip according to the present invention, which is an example used for the forceps 100 which is a metallic surgical tool which is a small accessory made of steel as the article.
  • a mounting surface 100a on which the RFIC module 101 is mounted is provided on one of the handles of the forceps 100 in which finger holes are formed.
  • the mounting surface 100a which becomes a metal surface provided in the insulator 100 is flat-plate circular [planar view], and the slit part 100b is formed in the part.
  • FIG. 10 shows a part of the forceps 100 and is a plan view showing a state in which the RFIC module 101 is mounted on the forceps 100. Further, FIG. 10 shows a state in which the RFIC module 101 having a circular plan view is mounted on the mounting surface 100 a of the forceps 100.
  • a dotted circle P indicates that the middle point of the coil conductor 102 provided in the RFIC module 101 is connected to the mounting surface 100a in a direct current manner.
  • the mounting position of the mounting surface 100a to which the middle point of the coil conductor 102 is connected in a direct current manner is directly below the module mounting surface area of the coil conductor 102 in plan view and near the outer edge of the mounting surface 100a. Position of the
  • the coil conductor 102 in the RFIC module 101 is disposed to intersect the slit portion 100 b which is a magnetic flux passing portion in plan view. As a result, the magnetic field (magnetic flux) generated by the excited coil conductor 102 passes through the slit portion 100 b.
  • a circular RFIC module 101 having a diameter smaller than that of the mounting surface 100a is concentrically mounted on the circular mounting surface 100a.
  • the configuration described in 3 is also applicable. That is, as described in the first embodiment, in addition to the slit portion (3b), the opening portion (3c) is formed, and the coil conductor (102) is disposed to surround the opening portion in plan view. (See FIG. 1). Further, as described in the second embodiment, as a configuration in which a part of the mounting surface (100a) is a metal surface, a magnetic field (magnetic flux) generated in the excited coil conductor (102) passes through the mounting surface (100a) (See FIG. 7). Furthermore, as described in the third embodiment, a part of the attachment surface (100a) may be formed of a metal surface, and a slit portion (3Bb) may be provided on the metal surface (see FIG. 9).
  • the magnetic flux passing portion formed on the ground electrode in the printed wiring board and through which the magnetic flux generated from the coil conductor of the RFIC module passes may be in a form other than the magnetic flux passing portion in the first to third embodiments described above.
  • FIG. 11 is an enlarged perspective view of a part of the printed wiring board with an RFIC chip of the fourth embodiment and a mounting position of the RFIC module mounted on the ground electrode.
  • FIG. 12 is a diagram showing the RFIC module mounted on the ground electrode.
  • FIG. 13 is a perspective view schematically showing the configuration of a coil conductor and the like on the feed circuit board of the RFIC module.
  • the ground electrode 3C in the printed wiring board is recessed inwardly from an end face 3Cb of the ground electrode 3C as a magnetic flux passing portion, and has a V-shaped notch 3Cc in plan view. Further, an L-shaped resist opening 17 provided along the notch 3Cc is formed in the ground electrode 3C.
  • the RFIC module 10B is mounted on the metal surface 3Ca (a resist pattern on the metal surface 3Ca) of the ground electrode 3C so that a part of the RFIC module 10B covers the notch 3Cc.
  • the feeder circuit board 22 of the RFIC module 10B is provided with a back electrode 29 different from the above-described first to third embodiments.
  • the feeder circuit board 22 includes two L-shaped back surface electrodes 29a and 29b having different sizes.
  • the back surface electrode 29 a has a size larger than that of the back surface electrode 29 b, and is connected to a substantially middle point of the coil conductor 4 via the connection line 5.
  • the smaller back electrode 29b is a dummy electrode.
  • the back surface electrodes 29a and 29b face each other in the diagonal direction of the feed circuit board 22 in plan view.
  • the back surface electrode 29a of the feeding circuit substrate 22 is connected to the metal surface 3Ca of the ground electrode 3C exposed through the resist opening 17 in a direct current manner via a conductive paste.
  • Such an RFIC module 10B can also be mounted on a ground electrode different from the ground electrode 3C provided with the V-shaped notch 3Cc.
  • FIG. 14 is an enlarged perspective view showing a part of a printed wiring board with an RFIC chip of a modification of the fourth embodiment.
  • FIG. 15 is a diagram showing the RFIC module mounted on the ground electrode.
  • the ground electrode 3D of the printed wiring board is provided with a slit portion 3Db and an opening 3Dc in the same manner as the ground electrode 3 of the first embodiment described above.
  • Two L-shaped resist openings 27a and 27b having different sizes are formed to face each other with the opening 3Dc interposed therebetween.
  • the back surface electrode 29a of the feeder circuit board 22 of the RFIC module 10B is connected to the metal surface 3Da of the ground electrode 3D exposed through the larger resist opening 27a in a direct current manner via the conductive paste.
  • one back surface electrode connected to the coil conductor of the feeding circuit substrate of the RFIC module is DC connected to the metal surface of the ground electrode exposed through one resist opening Being connected to the ground electrode at one point.
  • the embodiment of the present invention is not limited to this.
  • FIG. 16 is a perspective view showing a mounting position of an RFIC module mounted on a ground electrode by enlarging a part of a printed wiring board with an RFIC chip of the fifth embodiment.
  • the RFIC module is the RFIC module 10B of the fourth embodiment described above, and the ground electrode is the ground of the first embodiment described above. It is an electrode 3.
  • the larger back electrode 29a (see FIG. 13) of the feeding circuit substrate 22 of the RFIC module 10B is formed on the metal surface 3a of the ground electrode 3 exposed through the three resist openings 7a, 7c and 7d. It is connected in direct current. That is, the back surface electrode 29 a is connected to the coil conductor 4 at one point, and is connected to the ground electrode 3 at three points.
  • the back surface electrode 29a is connected to the ground electrode 3 at multiple points, a larger current can flow more reliably between the ground electrode 3 and the back surface electrode 29a as compared with the case where the connection is made at one point.
  • the contact resistance is increased due to manufacturing variations, the current flowing between the ground electrode 3 and the back electrode 29a decreases. That is, as the variation in contact resistance increases, the variation in current also increases.
  • the ground electrode 3 and the back surface electrode 29a are connected at many points, even if the contact resistance at some points is increased, the current is not changed through the remaining points. It can flow. Therefore, even if the variation in the contact resistance at some points becomes large, the variation in the current flowing between the ground electrode 3 and the back surface electrode 29a is small.
  • FIG. 17 is a perspective view showing a part of the printed circuit board with an RFIC chip of the modification of the fifth embodiment in an enlarged manner.
  • the ground electrode 3E has a V-shaped notch, like the ground electrode 3C of the fourth embodiment shown in FIG. A unit 3Ec is provided.
  • the ground electrode 3E is formed with three resist openings 27a, 27b and 27c provided along the notch 3Ec.
  • the resist opening 27a is provided in the vicinity of the top of the V-shaped notch 3Ec.
  • the remaining resist openings 27b and 27c are provided between the end face 3Eb of the notch 3Ec.
  • the larger back electrode 29a (see FIG. 13) of the feeder circuit substrate 22 of the RFIC module 10B is connected in a direct current manner to the metal surface 3Ea of the ground electrode 3E exposed through the three resist openings 27a, 27b and 27c. That is, the back surface electrode 29a is connected to the coil conductor 4 at one point, and is connected to the ground electrode 3E at three points.
  • the coil conductor of the feed circuit substrate of the RFIC module is DC-connected to the ground electrode through the back surface electrode at its substantially middle point (preferably the middle point of the electrical length). It is connected.
  • the embodiment of the present invention is not limited to this.
  • FIG. 20 is a perspective view schematically showing a configuration of a coil conductor and the like on a feeder circuit board of the RFIC module according to a modification of the seventh embodiment. This is also a modification of the above-described first embodiment shown in FIG.
  • the bracket-shaped back surface electrode 49 is connected in a direct current manner to the metal surface 3Fa of the ground electrode 3F exposed through the bracket-shaped resist opening 37.
  • the resist opening 37 is formed so as to partially surround the opening 3Fc.
  • the coil conductor of the feed circuit substrate of the RFIC module is connected to the ground electrode through one back surface electrode. It is connected in direct current.
  • the embodiment of the present invention is not limited to this.
  • FIG. 22 is a perspective view schematically showing a configuration of a coil conductor and the like on a feeder circuit board of the RFIC module according to the eighth embodiment.
  • the loop electrode 14c of the coil conductor 14 is connected to the back surface electrode 59a via the connecting wire 45a and via the connecting wire 45b. Is connected to the back electrode 59b. That is, each of the plurality of points (connection points) of the coil conductor 14 is connected to different back surface electrodes 59a and 59b.
  • connection points are one end and the other end of the coil conductor 14 in consideration of the power transfer efficiency. It is preferable to be provided at a position separated by a distance equal to or more than a quarter of the electrical length, ie, a position near the midpoint.
  • FIG. 23 is a perspective view showing a part of the printed wiring board with an RFIC chip of the eighth embodiment in an enlarged manner.
  • one back electrode 59a is connected to metal surface 3Ga of ground electrode 3G exposed through one resist opening 47a in a direct current manner.
  • the other back surface electrode 59b is connected in a direct current manner to the metal surface 3Ga exposed through the other resist opening 47b.
  • the resist openings 47a and 47b are formed to face each other across the opening 3Gc.
  • the printed wiring boards according to the above-described fourth to eighth embodiments and their variations are also configured to have high degree of freedom of installation and power transfer efficiency. Further, the configuration can be achieved to achieve miniaturization, weight reduction and cost reduction.
  • the RFIC chip-attached article of the present invention is simple in various articles which can use a metal surface such as a printed wiring board or a metal tool as an antenna as described in each embodiment. It is possible to construct an RFID system with the configuration.
  • the communication device has a high degree of freedom of attachment to an article, a simple configuration and high power transfer efficiency, and can achieve miniaturization, weight reduction, and cost reduction. .
  • the present invention can be applied to a variety of articles having a metal surface as an article with an RFIC chip, and therefore, the configuration is useful in expanding an article management system using an RFID system.
  • RFIC chip 1 RFIC chip 2 Feed circuit board 3 Ground electrode (metal) 3a Metal surface 3b Slit portion (flux passing portion) 3c opening (magnetic flux passing part) 3d resist opening 4 coil conductor (inductor element) 4a 1st loop electrode 4b 2nd loop electrode 4c 3rd loop electrode 5 connecting wire 6 via conductor 7 resist pattern 7a 1st resist opening 7b 2nd resist opening 7c 3rd resist opening 7d 4th resist opening 8 front surface electrode 8a 1st Surface electrode 8b Second surface electrode 9 Back surface electrode 9a First back surface electrode 9b Second back surface electrode 9c Third back surface electrode 9d Fourth back surface electrode 10 RFIC module 100 Article (printed wiring board, insulator) 101 RFIC module 102 coil conductor

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)

Abstract

L'invention concerne un produit équipé d'une puce RFIC qui est équipé d'un produit (100) ayant une surface métallique, un conducteur de bobine (4) ayant une surface de boucle qui fait face à la surface métallique, et une puce RFIC (1) ayant des première et seconde bornes d'entrée/sortie qui sont respectivement connectées à une extrémité et à l'autre extrémité du conducteur de bobine, un point intermédiaire le long du conducteur de bobine étant connecté en courant continu à un point proche du bord de la surface métallique, et une section de passage de flux magnétique à travers laquelle passe le flux magnétique provenant du conducteur de bobine est située dans une région qui chevauche la surface de boucle du conducteur de bobine lorsqu'elle est vue dans une vue en plan.
PCT/JP2018/024848 2017-06-30 2018-06-29 Produit équipé d'une puce rfic Ceased WO2019004439A1 (fr)

Priority Applications (1)

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JP2018562272A JP6508441B1 (ja) 2017-06-30 2018-06-29 Ｒｆｉｃチップ付き物品

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JP2017-129076 2017-06-30
JP2017129076 2017-06-30

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WO2019004439A1 true WO2019004439A1 (fr) 2019-01-03

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PCT/JP2018/024848 Ceased WO2019004439A1 (fr) 2017-06-30 2018-06-29 Produit équipé d'une puce rfic

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WO2021044930A1 (fr) * 2019-09-05 2021-03-11 株式会社村田製作所 Dispositif médical métallique à étiquette à circuit intégré sans fil
WO2021044931A1 (fr) * 2019-09-05 2021-03-11 株式会社村田製作所 Outil métallique à usage médical pourvu d'une étiquette ic sans fil
WO2021075159A1 (fr) * 2019-10-18 2021-04-22 株式会社村田製作所 Instrument médical métallique avec étiquette à ci sans fil
JPWO2021229857A1 (fr) * 2020-05-15 2021-11-18

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WO2012014939A1 (fr) * 2010-07-28 2012-02-02 株式会社村田製作所 Dispositif d'antenne et dispositif de terminal de communications
JP2015211421A (ja) * 2014-04-30 2015-11-24 Tdk株式会社 アンテナ装置
WO2018079718A1 (fr) * 2016-10-29 2018-05-03 株式会社フェニックスソリューション Unité ci de communication montée sur antenne et unité ci de communication montée sur antenne équipée d'un conducteur

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WO2012014939A1 (fr) * 2010-07-28 2012-02-02 株式会社村田製作所 Dispositif d'antenne et dispositif de terminal de communications
JP2015211421A (ja) * 2014-04-30 2015-11-24 Tdk株式会社 アンテナ装置
WO2018079718A1 (fr) * 2016-10-29 2018-05-03 株式会社フェニックスソリューション Unité ci de communication montée sur antenne et unité ci de communication montée sur antenne équipée d'un conducteur

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CN116341602A (zh) * 2019-09-05 2023-06-27 株式会社村田制作所 带有无线ic标签的医疗用金属制器具
WO2021044930A1 (fr) * 2019-09-05 2021-03-11 株式会社村田製作所 Dispositif médical métallique à étiquette à circuit intégré sans fil
CN112930151A (zh) * 2019-09-05 2021-06-08 株式会社村田制作所 带有无线ic标签的医疗用金属制器具
CN112955990A (zh) * 2019-09-05 2021-06-11 株式会社村田制作所 带有无线ic标签的医疗用金属制器具
WO2021044931A1 (fr) * 2019-09-05 2021-03-11 株式会社村田製作所 Outil métallique à usage médical pourvu d'une étiquette ic sans fil
JP6912024B1 (ja) * 2019-09-05 2021-07-28 株式会社村田製作所 無線ｉｃタグ付き医療用金属製器具
US11714988B2 (en) 2019-09-05 2023-08-01 Murata Manufacturing Co., Ltd. Wireless IC tag-attached metal medical instrument
JP6912022B1 (ja) * 2019-09-05 2021-07-28 株式会社村田製作所 無線ｉｃタグ付き医療用金属製器具
CN112955990B (zh) * 2019-09-05 2023-03-10 株式会社村田制作所 带有无线ic标签的医疗用金属制器具
WO2021075159A1 (fr) * 2019-10-18 2021-04-22 株式会社村田製作所 Instrument médical métallique avec étiquette à ci sans fil
JP6912023B1 (ja) * 2019-10-18 2021-07-28 株式会社村田製作所 無線ｉｃタグ付き医療用金属製器具
US11701200B2 (en) 2019-10-18 2023-07-18 Murata Manufacturing Co., Ltd. Wireless IC tag-attached metal medical instrument
WO2021229857A1 (fr) * 2020-05-15 2021-11-18 株式会社村田製作所 Module rfic, étiquette rfid et article
JP7060180B2 (ja) 2020-05-15 2022-04-26 株式会社村田製作所 Ｒｆｉｃモジュール、ｒｆｉｄタグ及び物品
JPWO2021229857A1 (fr) * 2020-05-15 2021-11-18
US11714989B2 (en) 2020-05-15 2023-08-01 Murata Manufacturing Co., Ltd. RFIC module, RFID tag, and article

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