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WO2018079718A1 - Unité ci de communication montée sur antenne et unité ci de communication montée sur antenne équipée d'un conducteur - Google Patents

Unité ci de communication montée sur antenne et unité ci de communication montée sur antenne équipée d'un conducteur Download PDF

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Publication number
WO2018079718A1
WO2018079718A1 PCT/JP2017/038927 JP2017038927W WO2018079718A1 WO 2018079718 A1 WO2018079718 A1 WO 2018079718A1 JP 2017038927 W JP2017038927 W JP 2017038927W WO 2018079718 A1 WO2018079718 A1 WO 2018079718A1
Authority
WO
WIPO (PCT)
Prior art keywords
antenna
unit
conductor
coil
sub
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2017/038927
Other languages
English (en)
Japanese (ja)
Inventor
久夫 金岡
詩朗 杉村
達次 庭田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Phoenix Solution Co Ltd
Original Assignee
Phoenix Solution Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Solution Co Ltd filed Critical Phoenix Solution Co Ltd
Priority to JP2018547787A priority Critical patent/JPWO2018079718A1/ja
Publication of WO2018079718A1 publication Critical patent/WO2018079718A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
    • H01Q19/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
    • H04B5/40—Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by components specially adapted for near-field transmission
    • H04B5/48—Transceivers

Definitions

  • An object of the present invention is to provide an antenna-mounted communication IC unit and a conductor-mounted antenna-mounted communication IC unit that exhibit high communication performance when attached to a conductor.
  • RFID Radio Frequency Identification
  • the RF tag used in the RFID system contains an antenna and an IC chip.
  • the carrier wave transmitted from the reader / writer antenna is received by the RF tag antenna and the identification data recorded on the IC chip is reflected. It communicates in a non-contact manner by returning it to the reader / writer on the wave.
  • the prior art has the following problems. That is, since the communication distance is short, it is necessary to bring the reader / writer close to the vicinity of the IC unit. In addition, if the IC unit is brought closer to a conductor (metal object, etc.), the resonance frequency will shift and this will interfere with communication, or communication will not be possible if radio waves are irradiated on the back side of the surface where the IC unit is attached. There's a problem.
  • the present invention provides an antenna-mounted communication IC unit that exhibits high communication performance when mounted on a conductor and a conductor-mounted antenna-mounted communication IC unit.
  • An antenna-mounted communication IC unit is an antenna-mounted communication IC unit including at least an antenna portion formed by stacking substrates on which coils are formed, and an IC chip connected to the antenna portion.
  • the antenna unit includes a main element in which a plurality of coils are connected in series so that the generation directions of magnetic flux coincide with each other, and a sub-element including a coil of less than one turn having an open portion.
  • the element is electromagnetically coupled.
  • the sub-element is installed on the conductor. Further, the planar outer dimension of the substrate is 5 mm ⁇ 5 mm or less.
  • the antenna-mounted communication IC unit of the present invention further includes a conductor in the antenna-mounted communication IC unit, the conductor has a cutout portion, and the cutout portion is open.
  • the main element and the sub-element are electromagnetically connected so that the generation direction of the magnetic flux of the main element and the generation direction of the sub-element coincide with each other.
  • the step of combining is provided. Further, in the invention of the antenna-mounted communication IC unit, it is preferable that the center of the magnetic flux of the main element and the center of the magnetic flux of the sub-element are formed so as to coincide with each other.
  • the main element preferably includes a plurality of substrates made of an insulator and a plurality of coils.
  • the open portion of the sub element preferably forms an equivalent capacity.
  • the planar outer dimension of the substrate is preferably 5 mm ⁇ 5 mm or less.
  • the antenna-mounted communication IC unit includes at least an antenna portion and an IC chip connected to the antenna portion, and the antenna portion includes an insulating substrate and a coil having one or more turns formed on the insulating substrate.
  • the antenna unit includes at least an antenna unit formed by stacking substrates on which coils are formed, an IC chip connected to the antenna unit, and a conductor.
  • the open portion of the sub-element is overlapped with the notch portion formed in the conductor.
  • the cutout width of the cutout portion of the conductor is preferably equal to or larger than the width of the open portion of the sub-element.
  • the antenna unit includes at least an antenna unit formed by stacking a plurality of substrates on which coils are formed, an IC chip connected to the antenna unit, and a conductor. Includes a main element in which a plurality of coils are connected in series so that magnetic flux generation directions coincide with each other, and the conductor includes a circular hole and an open portion communicating with the circular hole, and the coil of the main element and the circular hole It is preferable that the coil formed by the surrounding conductors is electromagnetically coupled.
  • both the main element and the sub-element constituting the antenna unit are constituted by coils, and the coil shape of the sub-element installed on the conductor is less than one turn. Then, by connecting the main element and the sub-element so that the magnetic flux generation directions of the two elements coincide with each other, the entire conductor functions as an antenna.
  • the carrier wave of the reader / writer is transmitted from a position away from the IC unit, the carrier wave may not reach the IC unit.
  • the conductor functions as an antenna in the present invention, as long as the carrier wave reaches a part of the conductor, the carrier wave propagates through the conductor to the sub-element and the main element, the power supply voltage is generated in the IC chip, the communication circuit, etc.
  • the antenna-mounted communication IC unit of the present invention can exhibit high communication performance when attached to a conductor.
  • the term “conductor” is “generic name for substances having a relatively large electrical conductivity” (Kojien), as well as the general meaning. For example, metal, carbon fiber, human body, animal body, vegetation, Although water, the ground, etc. are mentioned, it is not necessarily limited to these.
  • the conductor there is a conductor used for a portable article such as a small portable communication terminal or a non-contact type IC card.
  • the conductor includes a metal plate.
  • the main element is constituted by connecting a plurality of coils in series, it is possible to reduce the size, and it is also possible to manufacture a small IC unit having a planar external dimension of 5 mm ⁇ 5 mm or less.
  • FIG. 3 is an equivalent circuit diagram of an antenna-mounted communication IC unit. It is a perspective view which shows the modification of an IC mounting unit for antenna mounting. It is a perspective view which shows the structure of the conductor which is an IC chip and the main element of an antenna part, and a subelement among communication IC units of an antenna mounting type.
  • the antenna-mounted communication IC unit 1 includes at least an IC chip 10 and an antenna unit 20.
  • the IC chip 10 is disposed on the upper surface of the uppermost substrate 31.
  • the IC chip 10 rectifies a part of the carrier wave transmitted from the reader / writer and generates a power supply voltage necessary for operation.
  • a memory in which a control logic circuit or the like in the IC chip 10 is stored and a communication circuit or the like for transmitting / receiving data to / from the reader / writer are operated by the generated power supply voltage.
  • Two lines 11 are drawn from the side surface of the IC chip 10.
  • the surface of the uppermost substrate 31 and the IC chip 10 may be covered with a protective layer.
  • the antenna unit 20 includes a main element 30 and a sub element 40.
  • the main element 30 is configured by laminating a plurality of substrates 31.
  • the number of stacked substrates 31 can be adjusted as appropriate. For example, two or more substrates 31 can be used, and three or four or more substrates can be used. In the present embodiment, three sheets are used.
  • a coil 32 is formed on the back surface (lower surface) of each substrate 31.
  • the substrate 31 in the present embodiment is configured by laminating the intermediate layer substrate 31 and the lowermost layer substrate 31 on the uppermost layer substrate 31 described above.
  • the substrate 31 can be laminated by a known method such as a method using an adhesive or a fusion of a resin contained in the substrate 31.
  • the uppermost first coil 32 is formed between the intermediate substrate 31 and the uppermost substrate 31, and the intermediate layer first coil 32 is formed between the intermediate substrate 31 and the lowermost substrate 31.
  • Two coils 32 are formed.
  • an insulating plate such as ceramics, mica and glass, an insulating film, an insulating sheet, an insulating film, etc. are used in addition to any generally used insulating plastic resin including epoxy resin and polyimide resin. be able to. Ceramics are suitable from the viewpoints of insulation, miniaturization, and high temperature resistance.
  • substrate 31 are not specifically limited.
  • the shape of the substrate 31 can be a rectangular shape such as a square or a rectangle, a circle, an ellipse, or the like.
  • the dimension of one side (or the maximum outer shape) of the substrate 31 can be 0.5 mm or more, and preferably 1 mm or more.
  • the dimension of one side (or the maximum outer shape) of the substrate 31 can be 8 mm or less, preferably 6 mm or less, more preferably 5 mm or less, and most preferably 3 mm or less.
  • the planar outer dimensions are 5 mm ⁇ 5 mm or less.
  • an insulating film may be disposed between the substrates 31 as necessary.
  • the coil 32 is a so-called planar coil that is spiral in a plane.
  • the outermost end of the uppermost coil 32 is connected to one line 11 of the IC chip 10 through one of the connection points 33 (through holes) of the uppermost substrate 31. From the outer peripheral end, it turns counterclockwise in a spiral shape, and the inner peripheral end is connected to the inner peripheral end of the intermediate layer coil 32 via a connection point of the intermediate layer substrate 31.
  • the coil 32 of the intermediate layer is spirally counterclockwise from the inner peripheral end thereof, and the outer peripheral end is connected to the other line 11 via the other of the connection points 33 of the intermediate layer and the uppermost substrate 31.
  • the coils 32 are connected in series so that the magnetic flux generated by a common current is generated in the same direction.
  • the number, formation area, and number of turns of each coil 32 can be arbitrarily set according to the required inductance of the IC unit 1.
  • the number of turns of the coil 32 of the uppermost layer and the intermediate layer is preferably 2 or more, and can be 3 or 4 or more.
  • the winding direction and connection form of each coil 32 may be any form other than that shown in the drawing as long as the magnetic field generation direction from each coil 32 is the same direction.
  • the coil 32 is formed on the back surface (lower surface) of the substrate 31, but may be formed on the front surface (upper surface) of the substrate 31.
  • the coil 32 is made of any conductive material including metal, and can be formed on the substrate 31 by a technique such as plating, printing, etching, or vapor deposition.
  • the sub element 40 is installed on the conductor 50 and is constituted by a coil 41 having less than one turn.
  • the coil 41 having less than one turn has an open portion 42 that forms between one end and the other end. That is, by forming the open portion 42, the coil 41 having less than one turn is formed.
  • the interval between the open portions 42 is set so that an equivalent capacity described later can be set to a desired value.
  • the coil 41 of less than one turn includes a thin plate-shaped coil main body, a circular hole formed at substantially the center of the coil main body, and a rectangular opening 42 communicating with the hole. Have. As shown in FIG.
  • a notch 51 is provided in a part of the metal plate, and the notch 51 and the open portion 42 of the coil 41 of less than one turn are vertically moved.
  • the conductor 50 and the sub element 40 are brought into electrical contact connection by being superimposed on each other.
  • a hole and a notch 51 communicating with the hole are also formed in the conductor 50 as in the case of the coil 41 having an I turn of less.
  • the coil 41 having less than one turn may be attached to a position that is electrically connected to the wiring of the printed board.
  • the coil 41 having less than one turn is made of any conductive material including metal.
  • the formation method of the coil 41 of less than one turn can be variously selected according to the type of the conductor 50. For example, when the conductor 50 is a metal plate or a printed board, plating, printing, etching, vapor deposition, etc. are performed on these. May be formed. Alternatively, a coil 41 having less than one turn may be formed by cutting out a thin metal plate.
  • both elements are electromagnetically coupled so that the magnetic flux generation directions of the main element 30 and the sub-element 40 coincide as shown in FIG. Since the coil 41 constituting the sub-element 40 is configured with less than one turn, the cutout portion 51 with less than one turn is provided in the portion of the conductor 50 that faces the coil 41 with less than one turn. That is, the notch 51 having the same shape and the same size as the opening 42 is provided at the edge portion of the conductor 50 so that the opening 42 formed in the coil 41 having less than one turn and the notch 51 are matched. .
  • the notch width of the notch 51 of the conductor 50 is preferably equal to the width of the open part 42 of the sub element 40 or larger than the width of the open part 42.
  • the cutout portion 51 includes a rectangular cutout, and may have a width larger than the width of the opening portion 42. And what is necessary is just to fix the subelement 40 to the conductor 50 in the state which match
  • the fixing method for example, a known fixing method such as a method using a conductive adhesive or fixing by soldering can be employed.
  • the conductor 50 whole can be utilized as an antenna by connecting the main element 30 and the subelement 40 so that both magnetic flux generation directions may coincide.
  • Examples of the conductor 50 include, but are not limited to, conductors used for portable articles such as small portable communication terminals and non-contact type IC cards.
  • FIG. 4 is an equivalent circuit diagram of the IC unit 1 of the present embodiment.
  • the main element 30 and the sub element 40 constitute a resonance circuit with the equivalent capacitor 100 in the IC chip 10 and the equivalent capacitor 101 including the gap of the open portion 42 of the coil 41 of less than one turn.
  • a capacitor may be separately provided outside the IC chip 10 as necessary.
  • the inductance is proportional to the number of turns of the coil. Under the condition that the total number of turns of the coil 32 constituting the main element 30 is n (where n >> 1), the change in inductance is very much before and after the main element 30 and the sub-element 40 are electromagnetically joined. There are few.
  • the present invention is not limited to this, and as shown in FIG.
  • both the coil 32 and the coil 41 of less than one turn or Either one may be attached to the alignment member 60.
  • the plate-like (or belt-like) alignment member 60 is attached to both ends of the lowermost substrate 31 in a leg shape, and the lower end portion of the alignment member is one turn.
  • the lowermost substrate 31 may be fixed to the conductor 50 so as to match the outer edge of the lower coil 41.
  • the plate-like alignment member 60 is fixed to the upper surface of the coil 41 of less than one turn, and the lowermost substrate 31 is placed so that the outer edge of the lowermost substrate 31 matches the periphery of the alignment member 60. It may be fixed to the conductor 50.
  • These alignment members 60 are made of an electrically insulating material.
  • FIG. 6 is a perspective view showing a structure of a conductor which is an IC chip and a main element and a sub-element of the antenna portion of the antenna-mounted communication IC unit.
  • the coil 41 with less than one turn in which the open portion 42 is formed is overlapped and fixed on the conductor 50 in which the cutout portion 51 is formed, but the coil 41 with less than one turn is omitted.
  • the conductor 50 in which the notch 51 is formed may be used. That is, as shown in FIG. 6, the role of the coil 41 of less than one turn of the sub element 40 may be formed by the conductor 50 and the cutout portion 51 of the conductor 50.
  • a hole and a notch 51 communicating with the hole are formed in the conductor 50 in the same manner as the coil 41 with less than I turn.
  • the main element 30 which comprises the antenna part 20 is piled up on this conductor 50.
  • the coil 32 of the main element 30 and the coil formed by the portion of the conductor 50 existing around the circular hole are electromagnetically coupled.
  • an equivalent capacitance is generated by the notch 51 formed in the conductor 50.
  • the open portion 42 of the sub element 40 has the same shape as the cutout portion 51 of the conductor 50, but the cutout portion 51 formed in the conductor 50 may be formed wider than the open portion 42. .
  • the present invention is an antenna-mounted communication IC unit that exhibits high communication performance when mounted on a conductor and a conductor-mounted antenna-mounted communication IC unit, and has industrial applicability.
  • the conductor include a conductor used for a small portable communication terminal or a non-contact type IC card.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Near-Field Transmission Systems (AREA)
  • Aerials With Secondary Devices (AREA)

Abstract

Le problème abordé par la présente invention est de fournir une unité CI de communication montée sur une antenne qui présente une performance de communication élevée lorsqu'elle est attachée à un conducteur, et une unité CI de communication montée sur une antenne équipée d'un conducteur. La solution de l'invention concerne une puce CI de communication (1) montée sur une antenne qui est équipée d'au moins une unité antenne (20) formée en empilant des substrats (31) sur lesquels des bobines (32) sont formées, et une puce CI (10) connectée à l'unité antenne, l'unité antenne étant équipée d'un élément principal (30) formé en connectant de multiples bobines en série de sorte que les directions dans lesquelles elles produisent un flux magnétique coïncident, et d'un élément auxiliaire comprenant une bobine (41) ayant une section ouverte (42) et ayant moins d'un tour, et l'élément principal et l'élément auxiliaire étant accouplés électromagnétiquement. En reliant l'élément principal et l'élément auxiliaire de sorte que les directions dans lesquelles ils produisent un flux magnétique coïncident, on peut faire fonctionner tout le conducteur (50) comme une antenne.
PCT/JP2017/038927 2016-10-29 2017-10-27 Unité ci de communication montée sur antenne et unité ci de communication montée sur antenne équipée d'un conducteur Ceased WO2018079718A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2018547787A JPWO2018079718A1 (ja) 2016-10-29 2017-10-27 アンテナ搭載形の通信用ｉｃユニット及び導体付きアンテナ搭載形の通信用ｉｃユニット

Applications Claiming Priority (2)

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JP2016-212366 2016-10-29
JP2016212366 2016-10-29

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WO2018079718A1 true WO2018079718A1 (fr) 2018-05-03

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019004439A1 (fr) * 2017-06-30 2019-01-03 株式会社村田製作所 Produit équipé d'une puce rfic
JP2019097168A (ja) * 2017-11-21 2019-06-20 台湾東電化股▲ふん▼有限公司 無線システムおよび無線装置
JPWO2021100315A1 (ja) * 2019-11-21 2021-12-09 株式会社フェニックスソリューション 耐熱ｉｃタグ
JP2021193493A (ja) * 2020-06-08 2021-12-23 凸版印刷株式会社 デュアルｉｃカード
JP2022099099A (ja) * 2020-12-22 2022-07-04 富士フイルム株式会社 非接触式通信媒体
CN115104102A (zh) * 2019-12-28 2022-09-23 艾利丹尼森零售信息服务有限公司 有多层式电抗型连接带的射频识别器件及相关系统和方法
US11714989B2 (en) 2020-05-15 2023-08-01 Murata Manufacturing Co., Ltd. RFIC module, RFID tag, and article

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009142114A1 (fr) * 2008-05-21 2009-11-26 株式会社村田製作所 Dispositif ci sans fil

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104752813B (zh) * 2010-07-28 2018-03-02 株式会社村田制作所 天线装置及通信终端设备

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009142114A1 (fr) * 2008-05-21 2009-11-26 株式会社村田製作所 Dispositif ci sans fil

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019004439A1 (fr) * 2017-06-30 2019-01-03 株式会社村田製作所 Produit équipé d'une puce rfic
JP6508441B1 (ja) * 2017-06-30 2019-05-08 株式会社村田製作所 Ｒｆｉｃチップ付き物品
JP2019097168A (ja) * 2017-11-21 2019-06-20 台湾東電化股▲ふん▼有限公司 無線システムおよび無線装置
JP7169172B2 (ja) 2017-11-21 2022-11-10 台湾東電化股▲ふん▼有限公司 無線システムおよび無線装置
JPWO2021100315A1 (ja) * 2019-11-21 2021-12-09 株式会社フェニックスソリューション 耐熱ｉｃタグ
CN115104102A (zh) * 2019-12-28 2022-09-23 艾利丹尼森零售信息服务有限公司 有多层式电抗型连接带的射频识别器件及相关系统和方法
JP2023509910A (ja) * 2019-12-28 2023-03-10 エイヴェリー デニソン リテール インフォメーション サービシズ リミテッド ライアビリティ カンパニー 多層反応性ストラップを有するｒｆｉｄ装置及び関連システム並びに方法
US11989610B2 (en) 2019-12-28 2024-05-21 Avery Dennison Retail Information Services Llc RFID devices having multi-layer reactive straps and related systems and methods
JP2025000816A (ja) * 2019-12-28 2025-01-07 エイヴェリー デニソン リテール インフォメーション サービシズ リミテッド ライアビリティ カンパニー 多層反応性ストラップを有するｒｆｉｄ装置及び関連システム並びに方法
US11714989B2 (en) 2020-05-15 2023-08-01 Murata Manufacturing Co., Ltd. RFIC module, RFID tag, and article
JP2021193493A (ja) * 2020-06-08 2021-12-23 凸版印刷株式会社 デュアルｉｃカード
JP7463858B2 (ja) 2020-06-08 2024-04-09 Ｔｏｐｐａｎホールディングス株式会社 デュアルｉｃカード
JP2022099099A (ja) * 2020-12-22 2022-07-04 富士フイルム株式会社 非接触式通信媒体
JP7577531B2 (ja) 2020-12-22 2024-11-05 富士フイルム株式会社 非接触式通信媒体

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