[go: up one dir, main page]

WO2019066014A1 - Composition de polissage, procédé de production d'une composition de polissage, et procédé de polissage - Google Patents

Composition de polissage, procédé de production d'une composition de polissage, et procédé de polissage Download PDF

Info

Publication number
WO2019066014A1
WO2019066014A1 PCT/JP2018/036406 JP2018036406W WO2019066014A1 WO 2019066014 A1 WO2019066014 A1 WO 2019066014A1 JP 2018036406 W JP2018036406 W JP 2018036406W WO 2019066014 A1 WO2019066014 A1 WO 2019066014A1
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
polishing composition
resin
acid
hard layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/036406
Other languages
English (en)
Japanese (ja)
Inventor
恭祐 天▲高▼
透 鎌田
翔太 菱田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimi Inc
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Priority to JP2019545162A priority Critical patent/JPWO2019066014A1/ja
Priority to TW108105052A priority patent/TW201938748A/zh
Publication of WO2019066014A1 publication Critical patent/WO2019066014A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives

Definitions

  • the present invention relates to a polishing composition, a method for producing a polishing composition, and a polishing method.
  • a polishing composition is interposed between the coated surface and the buff using a buff (abrasive wheel) and a polisher (abrasive machine) rotatably mounted with the buff as a method of increasing the gloss of the coated surface.
  • a buff abrasive wheel
  • a polisher abrasive machine
  • the polishing composition described in Patent Document 1 has a viscosity higher than that of other polishing compositions, and therefore, is a polishing composition produced when polishing an object to be polished having a three-dimensional shape such as a body of an automobile. There is little scattering. However, the polishing composition has a problem that its polishing performance (polishing efficiency) is insufficient.
  • the present invention has been made in view of the above problems, and an object thereof is to provide means for reducing the scattering of the polishing composition at the time of polishing while maintaining the polishing performance.
  • the present inventors accumulated earnest research. As a result, by using an abrasive, a first liquid having hydrophobicity, a surfactant, a layered silicate compound, a thickener, and a polishing composition containing a second liquid having hydrophilicity, It has been found that the above problem can be solved. And based on the above-mentioned knowledge, it came to complete the present invention.
  • means is provided for reducing the scattering of the polishing composition during polishing while maintaining the polishing performance.
  • FIG. 1 is a perspective view of an example of the polishing pad used by the polishing method using the polishing composition concerning embodiment of this invention
  • (b) is A of the polishing pad shown to (a) of FIG.
  • FIG. (A) is a top view of an example of the polishing pad used by the polishing method using the polishing composition which concerns on embodiment of this invention
  • (b) is A of the polishing pad shown to (a) of FIG.
  • FIG. (A) is sectional drawing of the 1st modification of the polishing pad shown to (a) of FIG.
  • (b) is sectional drawing of the 2nd modification of the polishing pad shown to (a) of FIG. (A) is a top view of the 3rd modification of the polishing pad shown to (a) of FIG. 3
  • (b) is AA sectional drawing of the polishing pad shown to (a) of FIG. (A) is a top view of the 4th modification of the polishing pad shown to (a) of FIG. 3
  • (b) is AA sectional drawing of the polishing pad shown to (a) of FIG.
  • FIG. 11 is a top view of the hard layer making up the polishing pad of FIG. 10; It is a top view of the hard layer which shows the modification of the planar shape of a notch.
  • FIG. 2 is a cross-sectional view of a polishing pad having linear grooves in a hard layer. It is sectional drawing of a polishing pad which has a water blocking layer. It is a top view of a hard layer in which an annular penetration which penetrates the polishing layer in a thickness direction is formed in a region inside the outer edge of the polishing layer.
  • One embodiment of the present invention is a polishing composition
  • a polishing composition comprising an abrasive, a first liquid having hydrophobicity, a surfactant, a layered silicate compound, a thickener, and a second liquid having hydrophilicity.
  • the polishing composition according to one aspect of the present invention having such a configuration can reduce the scattering of the polishing composition at the time of polishing while maintaining the polishing performance such as a high polishing rate, ie, a large removal amount. .
  • the object to be polished according to this embodiment is not particularly limited, but preferably contains at least one selected from the group consisting of an alloy material, a resin material, a material such as a metal, a metalloid or an oxide thereof, and a glass material. Furthermore, it may be a composite material of these materials. In particular, a resin material used for a paint surface such as a body of an automobile is preferable.
  • the alloy is a covalent material in which one metal element or more and one nonmetal element such as carbon, nitrogen, silicon, etc. are shared with one metal element, and the mechanical strength is to pure metal. It is manufactured for the purpose of improving the properties such as chemical resistance, corrosion resistance and heat resistance.
  • aluminum alloy is lightweight and has excellent strength, and therefore, is used for various applications such as structural materials such as building materials and containers, transportation equipment such as automobiles, ships, and aircrafts, various electric appliances, and electronic components. It is done.
  • titanium alloys are widely used for precision instruments, accessories, tools, sports goods, medical parts and the like because they are lightweight and excellent in corrosion resistance.
  • stainless steel and nickel alloys which are iron-based alloys have excellent corrosion resistance, they are used in various applications such as tools, machine tools, cookware, as well as structural materials and transport equipment.
  • copper alloys are widely used for decorative articles, dishes, parts of musical instruments and electric materials, etc. because of their beautiful finish. ing. Furthermore, in recent years, materials including resins have also been used in the above applications.
  • the alloy material contains a metal species which is a main component and a metal species which is different from the main component.
  • the alloy materials are named based on the metal species that are the main components.
  • Examples of alloy materials include aluminum alloys, iron alloys, titanium alloys, nickel alloys, and copper alloys. These alloy materials may be used alone or in combination of two or more. Among them, it is preferable to include at least one selected from the group consisting of an aluminum alloy and an iron alloy. In addition, it is preferable to use an alloy material in which the Vickers hardness (HV) of the metal species as the main component and the metal species different from the main component differ by 5 or more.
  • HV Vickers hardness
  • the aluminum alloy contains aluminum as a main component, and preferably contains at least one selected from the group consisting of magnesium, silicon, copper, zinc, manganese, chromium, and iron as metal species different from the main component.
  • the lower limit of the content of the metal species different from the above main component in the aluminum alloy is not particularly limited, but is preferably 0.1 mass% or more with respect to the entire aluminum alloy.
  • the upper limit of the content of the metal species different from the above main component in the aluminum alloy is not particularly limited, but is preferably 10% by mass or less with respect to the entire aluminum alloy.
  • the aluminum alloy examples include, for example, Al-Cu-based, Al-Cu-Mg-based alloy No. 2000, Al-Mn-based alloy No. 3000, Al as described in JIS H4000: 2006. Alloy number 4000 of Si-Si, alloy number 5000 of Al-Mg, Alloy number 6000 of Al-Mg-Si, alloy number Al-Zn-Mg of 7000, Al-Fe-Mn Alloy number 8000 series etc. are mentioned.
  • the iron alloy contains iron as a main component, and preferably contains at least one selected from the group consisting of chromium, nickel, molybdenum, and manganese as a metal species different from the main component.
  • the lower limit of the content of the metal species different from the above main component in the iron alloy is not particularly limited, but is preferably 10% by mass or more with respect to the entire iron alloy.
  • the upper limit of the content of the metal species different from the above main component in the iron alloy is not particularly limited, but is preferably 50% by mass or less with respect to the entire iron alloy.
  • the iron alloy is preferably stainless steel.
  • stainless steel for example, in the symbol of the type described in JIS G4303: 2005, SUS201, SUS303, 303Se, SUS304, SUS304L, SUS304NI, SUS305, SUS305 JI, SUS309S, SUS310S, SUS316, SUS316L, SUS321 SUS347, SUS384, SUSXM7, SUS303F, SUS303C, SUS430, SUS430F, SUS434, SUS410, SUS416, SUS420J1, SUS420J2, SUS420F, SUS420C, SUS631J1 and the like.
  • the titanium alloy contains titanium as a main component, and as metal species different from the main component, for example, aluminum, iron, vanadium and the like are contained.
  • the content of the metal species different from the main component in the titanium alloy is, for example, 3.5% by mass or more and 30% by mass or less with respect to the entire titanium alloy.
  • Examples of titanium alloys include 11 to 23, 50, 60, 61 and 80 of the types described in JIS H4600: 2012.
  • the nickel alloy contains nickel as a main component, and as a metal species different from the main component, for example, at least one selected from iron, chromium, molybdenum, and cobalt.
  • the content of the metal species different from the main component in the nickel alloy is, for example, 20% by mass or more and 75% by mass or less with respect to the entire nickel alloy.
  • a nickel alloy NCF600,601,625,750,800,800H, 825, NW0276,4400,6002,6022 etc. are mentioned, for example in the alloy number described in JIS H4551: 2000.
  • the copper alloy contains copper as a main component and as a metal species different from the main component, for example, at least one selected from iron, lead, zinc, and tin.
  • the content of the metal species different from the main component in the copper alloy is, for example, 3% by mass or more and 50% by mass or less with respect to the entire copper alloy.
  • a copper alloy for example, in the alloy numbers described in JIS H 3100: 2006, C2100, 2200, 2300, 2400, 2600, 2680, 2720, 2801, 3560, 3561, 3710, 3713, 4250, 4430, 4621, 4640 , 6140, 6161, 6280, 6301, 7060, 7150, 1401, 2051, 6711, 6712 and the like.
  • the type of the resin material is not particularly limited, and any of a thermosetting resin and a thermoplastic resin may be used.
  • a thermosetting resin an epoxy resin, a polyimide resin, a phenol resin, an amino resin, unsaturated polyester resin, a thermosetting polyurethane resin etc. are mentioned, for example.
  • thermoplastic resin examples include, for example, polystyrene resin, acrylonitrile-butadiene-styrene copolymer resin (ABS resin), (meth) acrylic resin (methacrylic and / or acrylic resin), organic acid vinyl ester resin or a derivative thereof, Vinyl resins, halogen-containing resins such as polyvinyl chloride, polyvinylidene chloride and polyvinylidene fluoride, olefin resins such as polyethylene and polypropylene, polycarbonate resins, saturated polyester resins such as polyethylene terephthalate and polyethylene naphthalate, polyamide resins, thermoplastic polyurethane resins , Polysulfone resin (polyether sulfone, polysulfone etc.), polyphenylene ether resin (polymer of 2,6-xylenol etc.), cellulose derivative (cellulose ester , Cellulose carbamates, cellulose ethers), silicone resin (polydimethylsilox
  • the above resins may be used alone or in combination of two or more.
  • thermoplastic resins are preferable from the viewpoint of impact resistance and weather resistance, and polycarbonate resins are more preferable.
  • the object to be polished containing a resin material may be, for example, in the form of a member (member made of resin) formed of a resin material, or in the form of a composite material having a resin coating film on the surface of a metal substrate etc. It is also good and not restricted.
  • resin used for a coating film a thermosetting polyurethane resin, a (meth) acrylic resin, etc. are mentioned.
  • the resin coating may be a clear clear coating.
  • the type of coating member (that is, the application of the resin coating film) is not particularly limited, but can be preferably used for a three-dimensional resin material, for example, a car body of a car, a railway car, an aircraft, a resin member It can be mentioned.
  • the resin coating film coated on the surface of the car body of the automobile has a large area and a curved surface, but the polishing composition of the present embodiment is suitable for polishing the outer surface of such a resin coating film. .
  • Metal and metalloids and their oxides examples include aluminum, iron, zirconium, copper, nickel, gold, silver, bismuth, manganese, zinc and the like.
  • the type of metalloid includes, for example, Group IV semiconductors such as silicon (Si) and germanium (Ge), II-VI compound semiconductors such as zinc selenide (ZnSe), cadmium sulfide (CdS) and zinc oxide (ZnO) , Group III-V compound semiconductors such as gallium arsenide (GaAs), indium phosphide (InP), and gallium nitride (GaN), Group IV compound semiconductors such as silicon carbide (SiC) and silicon germanium (SiGe), copper indium indium There may be mentioned chalcopyrite semiconductors such as selenium (CuInSe 2 ) and the like. Moreover, it can use suitably also to the oxide of these materials.
  • Glass material examples include blue plate glass, quartz glass, tempered glass, crystallized glass, aluminosilicate glass, glassy carbon and the like.
  • the polishing composition of the present embodiment contains an abrasive.
  • Abrasive grains have the function of mechanically polishing an object to be polished.
  • Specific examples of the abrasive used in the present embodiment include, for example, aluminum oxide (alumina), silicon oxide (silica), cerium oxide (ceria), zirconium oxide, titanium oxide (titania), tin oxide, manganese oxide Etc., metal carbides such as silicon carbide and titanium carbide, metal nitrides such as silicon nitride and titanium nitride, metal borides such as titanium boride and tungsten boride, silicate compounds such as zircon, diamond, etc. Can be mentioned.
  • the abrasive grains may be used alone or in combination of two or more. Moreover, a commercial item may be used for this abrasive grain, and a synthetic product may be used.
  • abrasives at least one selected from the group consisting of metal oxides and metal carbides is preferable, from the viewpoint that abrasives having various particle diameters can be easily obtained and an excellent polishing rate can be obtained, and carbonized Silicon, silicon dioxide or metal oxides are more preferred, and at least one of aluminum oxide, cerium oxide and zirconium oxide is more preferred. Also, a mixture of alumina and zircon can be preferably used.
  • the lower limit of the volume average particle diameter (average secondary particle diameter) of the abrasive grains may be 0.05 ⁇ m or more, preferably 0.1 ⁇ m or more, and more preferably 0.3 ⁇ m or more.
  • the upper limit of the volume average particle diameter (average secondary particle diameter) of the abrasive grains may be 50.0 ⁇ m or less, preferably 40.0 ⁇ m or less, and more preferably 15.0 ⁇ m or less. More preferably, it is 8.0 ⁇ m or less.
  • the volume average particle diameter of the abrasive grains decreases, it becomes easy to obtain a surface with low defects and small roughness. From the above, the volume average particle diameter of the abrasive grains is more preferably 0.2 ⁇ m or more and 15.0 ⁇ m or less, and particularly preferably 0.3 ⁇ m or more and 8.0 ⁇ m or less.
  • the volume average particle diameter of the abrasive grains is defined as an integrated 50% particle diameter (D 50 ) based on the volume-based particle size distribution.
  • D 50 of the abrasive grains can be measured by using a commercially available particle size measuring device.
  • a particle size measuring apparatus may be based on any technique such as a dynamic light scattering method, a laser diffraction method, a laser scattering method, or a pore electrical resistance method.
  • a measuring method and apparatus for D 50 include measuring method and apparatus of example.
  • the lower limit of the content of abrasive grains in the polishing composition is preferably 0.1% by mass or more, more preferably 5% by mass or more, and still more preferably 10% by mass or more. As the abrasive content increases, the polishing rate increases. Moreover, it is preferable that it is 50 mass% or less, and, as for the upper limit of content of the abrasive grain in polishing composition, it is more preferable that it is 35 mass% or less. As the content of abrasive grains decreases, in addition to the reduction of the manufacturing cost of the polishing composition, it becomes easy to obtain a surface with few defects such as scratches by polishing using the polishing composition.
  • the polishing composition according to the present embodiment includes a hydrophobic first liquid that can be a dispersoid or a dispersion medium.
  • the first liquid is not particularly limited as long as it is a solvent having hydrophobicity, but petroleum solvents such as petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha, solvent naphtha are preferable, and saturated hydrocarbons and non-hydrophobic solvents are preferable.
  • a solvent containing at least one of saturated hydrocarbons is more preferable, a paraffin-type, iso-paraffin-type, naphthene-type and terpene-type solvent is more preferable, and a solvent containing iso-paraffin-type hydrocarbon is particularly preferable.
  • the polishing composition according to the present embodiment includes a surfactant for dispersing or emulsifying a first liquid having hydrophobicity or a second liquid having hydrophilicity described later.
  • a surfactant for dispersing or emulsifying a first liquid having hydrophobicity or a second liquid having hydrophilicity described later.
  • the surfactant improves the cleaning efficiency of the surface to be polished after polishing by imparting hydrophilicity to the surface to be polished after polishing, it is possible to prevent the adhesion of dirt to the surface to be polished and the like.
  • the type of surfactant is not particularly limited, and it may be any of anionic surfactant, cationic surfactant, amphoteric surfactant and nonionic surfactant. These surfactants may be used alone or in combination of two or more.
  • anionic surfactants include polyoxyethylene alkyl ether acetic acid, polyoxyethylene alkyl sulfuric acid ester, alkyl sulfuric acid ester, polyoxyethylene alkyl ether sulfuric acid, alkyl ether sulfuric acid, alkyl benzene sulfonic acid, alkyl phosphoric acid ester, poly Examples thereof include oxyethylene alkyl phosphate, polyoxyethylene sulfosuccinic acid, alkyl sulfosuccinic acid, alkyl naphthalene sulfonic acid, alkyl diphenyl ether disulfonic acid, and salts thereof.
  • cationic surfactants include alkyl trimethyl ammonium salts, alkyl dimethyl ammonium salts, alkyl benzyl dimethyl ammonium salts, alkyl amine salts and the like.
  • amphoteric surfactants include alkyl betaines, alkyl amine oxides and the like.
  • nonionic surfactants include polyoxyethylene alkyl ether, polyoxyalkylene alkyl ether, sorbitan fatty acid ester, glycerin fatty acid ester, polyoxyethylene fatty acid ester, polyoxyethylene alkylamine, alkyl alkanolamide and the like .
  • HLB Hydrophilic-Lipophilic Balance
  • the content of the surfactant in the polishing composition is preferably 0.01% by mass or more, and more preferably 0.1% by mass or more.
  • the content of the surfactant in the polishing composition is preferably 3.0% by mass or less, and more preferably 1.0% by mass or less.
  • the polishing composition of the present embodiment contains a layered silicate compound as a dispersant.
  • the layered silicate compound can be present in a state where it becomes steric hindrance among the particles of the abrasive grains, so that the effect of improving the dispersibility and redispersion of the abrasive grains is obtained.
  • the layered silicate compound basically has a structure in which silicate tetrahedrons are connected in a plane, and includes one or two silicate tetrahedron sheets and one alumina octahedron sheet in a unit structure. It is a structure characterized by In the interlayer (between unit structures), cations such as sodium, potassium and calcium are present. Further, the layered silicate compound is a substance having a property that the crystal is peeled off thinly.
  • the layered silicate compound used in the present embodiment may be a natural product, a synthetic product, a commercially available product, or a mixture thereof.
  • Examples of the synthesis method of the layered silicate compound include, but are not limited to, a hydrothermal synthesis reaction method, a solid phase reaction method, a melt synthesis method and the like.
  • the layered silicate compound examples include talc, pyrophyllite, smectite (saponite, hectorite, sauconite, stevensite, bentonite, montmorillonite, beidellite, nontronite, etc.), vermiculite, mica (gold) Mica, biotite, chinwaldo mica, muscovite, paragonite, ceradonite, etc., chlorite (crinochlore, chamosite, nimite, peninite, sudoite, donbasite, etc.), brittle mica (clintite, margarite, etc.) And sourite, serpentine (antigorite, lizardite, chrysotile, amesite, clonsteadite, vercherin, grinalite, garnierite, etc.), kaolin (kaolinite, dickite, nacrite, halloysite, etc.), etc. .
  • layered silicate compounds may be used alone or in combination of two or more.
  • bentonite sodium bentonite
  • the interlayer ion is sodium ion
  • steven site sodium steven site
  • easier improvement of the dispersibility and redispersibility of the abrasive grains Hectorite (sodium hectorite) and mica (sodium tetrasilicon mica) are preferred.
  • the lower limit of the average primary particle diameter of the layered silicate compound may be 0.01 ⁇ m or more, and preferably 0.03 ⁇ m or more.
  • the upper limit of the average primary particle diameter of the layered silicate compound may be 15.0 ⁇ m or less, preferably 12.0 ⁇ m or less, and more preferably 10.0 ⁇ m or less, 5.0 ⁇ m or less Is more preferably 3.0 ⁇ m or less, still more preferably 1.0 ⁇ m or less, still more preferably 0.8 ⁇ m or less, still more preferably 0.5 ⁇ m or less And particularly preferably 0.3 ⁇ m or less.
  • the average primary particle diameter of the layered silicate compound is more preferably 0.01 ⁇ m or more and 15.0 ⁇ m or less, more preferably 0.03 ⁇ m or more and 3.0 ⁇ m or less, and 0.03 ⁇ m or more and 0.8 ⁇ m or less Is more preferable, and particularly preferably 0.03 ⁇ m or more and 0.3 ⁇ m or less.
  • the average primary particle size of the layered silicate compound can be measured, for example, using a scanning electron microscope (SEM).
  • the lower limit of the content of the layered silicate compound in the polishing composition is preferably 0.001% by mass or more, and more preferably 0.05% by mass or more.
  • the upper limit of the content of the layered silicate compound in the polishing composition is preferably 10% by mass or less, more preferably 5% by mass or less, and more preferably 2% by mass or less. It is more preferably 1% by mass or less, more preferably 0.8% by mass or less, still more preferably 0.5% by mass or less, particularly preferably 0.3% by mass or less preferable. If it is such a range, the effect of the said this embodiment is efficiently acquired.
  • the polishing composition according to this embodiment includes a hydrophilic second liquid that can be a dispersoid or a dispersion medium.
  • the second liquid is not particularly limited as long as it is a solvent having hydrophilicity, but water is typically preferable. From the viewpoint of suppressing inhibition of the action of other components, water which does not contain impurities as much as possible is preferable. Specifically, after removing impurity ions with an ion exchange resin, it is pure after removing foreign substances through a filter. Water, ultrapure water, or distilled water is preferred.
  • the volume ratio (L1 / L2) of the first liquid (L1) having hydrophobicity to the second liquid (L2) having hydrophilicity is appropriately changed.
  • the volume ratio may be less than 1, may be 0.7 or less, 0.5 or less, 0.3 or less, or 0.1 or less.
  • the volume ratio may be 1 or more, 1.5 or more, 2 or more, 3 or more, 5 or more, or 10 or more.
  • the emulsion type of the polishing composition may be an oil-in-water (O / W) emulsion, or a water-in-oil (W / O) emulsion.
  • the polishing composition tends to be an oil-in-water (O / W) emulsion.
  • the volume ratio (L1 / L2) is large (for example, 1 or more), the polishing composition tends to form a water-in-oil (W / O) type emulsion.
  • thickeners examples include polyacrylic acid, sodium polyacrylate (for example, completely neutralized product, partially neutralized product, alkali-soluble polyacrylic acid of association type (acrylic polymer), etc., acrylic compound, urethane Synthetic thickeners such as sodium compounds, cellulose thickeners (semi-synthetic thickeners) such as carboxymethyl cellulose and carboxyethyl cellulose, natural thickeners such as agar, carrageenan, layered silicate compounds, xanthan gum and gum arabic A viscosity etc. are mentioned.
  • polyacrylic acid and an alkali are used in combination.
  • alkali examples include inorganic alkalis such as sodium hydroxide, potassium hydroxide and ammonia, and organic alkalis such as triethanolamine.
  • inorganic alkalis such as sodium hydroxide, potassium hydroxide and ammonia
  • organic alkalis such as triethanolamine.
  • polyacrylic acid exhibits a thickening effect.
  • the thickener may be a Newtonian fluid or a non-Newtonian fluid.
  • the polishing composition according to the present embodiment preferably contains an additive.
  • the additive include, for example, an oil, an emulsion stabilizer, and a polymer material.
  • the additives may be used alone or in combination of two or more.
  • the addition of the additive improves the stability of the emulsion.
  • oil examples include liquid paraffin, polybutene, ⁇ -olefin oligomer, alkylbenzene, polyol ester, phosphoric acid ester, synthetic oil such as silicone oil, spindle oil, neutral oil, mineral oil such as bright stock, castor oil, soybean oil
  • vegetable oils and fats such as coconut oil, linseed oil, cottonseed oil, rapeseed oil, tung oil, olive oil and the like, animal fats and oils such as beef tallow, squalane and lanolin.
  • the emulsion stabilizer examples include glycerin, polyhydric alcohols such as ethylene glycol and propylene glycol, and aliphatic alcohols such as cetyl alcohol and stearyl alcohol.
  • the content of the additive in the polishing composition is preferably 0.1% by mass or more, and more preferably 1.0% by mass or more.
  • the content of the additive in the polishing composition is preferably 12.0% by mass or less, and more preferably 8.0% by mass or less. When the content of the additive is in the above range, the stability of the emulsion in the polishing composition is increased.
  • the polishing composition of the present embodiment is not particularly limited, but the pH can be adjusted by the addition of an acid or a salt thereof described below, or a base or a salt thereof.
  • the polishing composition of the present embodiment preferably contains an acid or a salt thereof.
  • the acid or a salt thereof serves to adjust the pH of the polishing composition.
  • any of inorganic acids and organic acids can be used.
  • the inorganic acid include, for example, hydrochloric acid, sulfuric acid, nitric acid, hydrofluoric acid, boric acid, carbonic acid, hypophosphorous acid, phosphorous acid, phosphoric acid and the like.
  • organic acid for example, formic acid, acetic acid, propionic acid, butyric acid, valeric acid, 2-methylbutyric acid, n-hexanoic acid, 3,3-dimethylbutyric acid, 2-ethylbutyric acid, 4-methylpentanoic acid, n -Heptanoic acid, 2-methylhexanoic acid, n-octanoic acid, 2-ethylhexanoic acid, benzoic acid, glycolic acid, salicylic acid, glyceric acid, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, Maleic acid, phthalic acid, malic acid, tartaric acid, citric acid, lactic acid, diglycolic acid, 2-furancarboxylic acid, 2,5-furancarboxylic acid, 3-furancarboxylic acid, 2-tetrahydrofuranic acid, methoxyacetic acid
  • salts Group 1 element salts, Group 2 element salts, aluminum salts, ammonium salts, amine salts, quaternary ammonium salts and the like can be mentioned. These acids or their salts may be used alone or in combination of two or more. Among these, nitric acid and citric acid are preferable.
  • a base or a salt thereof may be used to adjust the pH.
  • the base or a salt thereof include amines such as aliphatic amines and aromatic amines, organic bases such as quaternary ammonium hydroxide, hydroxides of alkali metals such as sodium hydroxide and potassium hydroxide, magnesium hydroxide, Examples thereof include hydroxides of Group 2 elements such as calcium hydroxide, and ammonia.
  • the polishing composition of the present embodiment suppresses the corrosion of the oxidizing agent that oxidizes the surface of the object to be polished, the water-soluble polymer acting on the surface of the object to be polished and the surface of the abrasive grain, and the object to be polished, if necessary.
  • the composition may further contain other components such as anticorrosion agents and chelating agents, preservatives having other functions, fungicides, polymer materials and the like.
  • the oxidizing agent include hydrogen peroxide, peracetic acid, percarbonate, urea peroxide, perchlorate, persulfate and the like.
  • water-soluble polymers examples include polycarboxylic acids such as polyacrylic acid, polysulfonic acids, polysulfonic acids such as polystyrene sulfonic acid, xanthan gum, polysaccharides such as sodium alginate, cellulose derivatives such as hydroxyethyl cellulose and carboxymethyl cellulose, polyethylene glycol Polyvinyl alcohol, polyvinyl pyrrolidone, alkylol ammonium salt, polyoxyethylene alkyl ether, polyoxyethylene alkyl phenyl ether, sorbitan monooleate, oxyalkylene polymer having one or more oxyalkylene units, and the like. .
  • salts of the above compounds can also be suitably used as the water-soluble polymer.
  • anticorrosive agent examples include amines, pyridines, tetraphenylphosphonium salts, benzotriazoles, triazoles, tetrazoles, benzoic acid and the like.
  • chelating agents include carboxylic acid type chelating agents such as gluconic acid, amine type chelating agents such as ethylenediamine, diethylenetriamine and trimethyltetraamine, ethylenediaminetetraacetic acid, nitrilotriacetic acid, hydroxyethylethylenediaminetriacetic acid, triethylenetetramine hexaacetic acid
  • Polyaminopolycarboxylic chelating agents such as diethylenetriaminepentaacetic acid, 2-aminoethylphosphonic acid, 1-hydroxyethylidene-1,1-diphosphonic acid, aminotri (methylenephosphonic acid), ethylenediaminetetrakis (methylenephosphonic acid), diethylenetriaminepenta ( Methylene phospho
  • preservatives include sodium hypochlorite and the like.
  • fungicides include oxazolines such as oxazolidine-2,5-dione.
  • alkylol ammonium salt of the copolymer which has an acidic radical, etc. are mentioned.
  • the method for producing the polishing composition of the present embodiment is not particularly limited.
  • a surfactant is dissolved in a second liquid having hydrophilicity, and the first liquid having hydrophobicity is stirred and mixed therein. Do.
  • the polishing composition of the present embodiment can be obtained by stirring and mixing the layered silicate compound, the abrasive grains, the thickener, and other components as needed.
  • the temperature at which each component is mixed is not particularly limited, but 10 ° C. or more and 40 ° C. or less is preferable, but by heating, the second liquid and the surfactant are stirred and mixed in the first liquid to perform phase inversion emulsification May be Also, the mixing time is not particularly limited.
  • the polishing composition of the present embodiment is suitably used for polishing an alloy material, a resin material, a metal, a metalloid or a metalloid thereof, an oxide thereof, an object to be polished including a glass material, and a composite material of these materials. Used.
  • the polishing composition of the present embodiment is suitable for polishing an object to be polished (for example, a painted surface of a vehicle such as an automobile) having a curved surface to be polished.
  • a method of polishing a resin-coated surface will be described.
  • the configuration of the polishing apparatus that performs polishing is not particularly limited, and general polishing apparatuses such as single-sided polishing machines, double-sided polishing machines, and lens polishing machines can be used.
  • general polishing apparatuses such as single-sided polishing machines, double-sided polishing machines, and lens polishing machines can be used.
  • the automatic polishing apparatus shown in FIG. It can be used.
  • the automatic polishing apparatus of FIG. 1 includes a robot arm 102, a polishing pad 10, a polishing tool 104, a pressing force detection unit 105, and a controller 107. Since the robot arm 102 has a plurality of joints 120, 121, 122, the tip portion 123 to which the polishing pad 10, the polishing tool 104, and the pressing force detection unit 105 are attached can be moved in a plurality of directions. .
  • the coated member, which is the object to be polished 90 is one in which the surface of the substrate is coated with a resin coating film, and the resin coated surface, which is the polished surface 90a of this coated member, has a large area and a curved surface. .
  • the polishing tool 104 is attached to the tip end portion 123 via the pressing force detection unit 105, and rotates the polishing pad 10 with a direction perpendicular to the polishing surface 30 of the polishing pad 10 as a rotation axis by a built-in drive means.
  • the driving means of the polishing tool 104 is not particularly limited, but in general, single action, double action, gear action and the like are used, and double action is preferred for polishing a painted member.
  • the controller 107 controls the behavior of the robot arm 102 and the rotation of the polishing pad 10 by the polishing tool 104.
  • the polishing composition is supplied between the polishing surface 30 of the polishing pad 10 and the resin-coated surface of the coating member from the polishing composition supply mechanism (not shown).
  • the controller 107 presses the polishing surface 30 of the polishing pad 10 against the resin-coated surface of the coating member by the robot arm 102 and rotates the polishing pad 10 to polish the resin-coated surface of the coating member.
  • the pressing force detection unit 105 detects the pressing force of the polishing surface 30 of the polishing pad 10 against the resin-coated surface of the coating member.
  • the controller 107 may adjust the force for pressing the polishing surface 30 against the resin-coated surface of the coating member based on the detection result of the pressing force by the pressing force detection unit 105.
  • the controller 107 controls the polishing pad 10 on the resin coated surface of the coating member while keeping the pressing force of the polishing surface 30 against the resin coated surface of the coating member constant based on the detection result of the pressing force by the pressing force detection unit 105.
  • the robot arm 102 may be controlled to move the robot arm 102.
  • the method of fixing the polishing pad 10 to the pad attachment part of the polishing tool 104 is not particularly limited, for example, a fixing method using a double-sided adhesive tape, an adhesive, a surface fastener or the like can be mentioned.
  • polishing tool 104 among the polishing pads 10 is not specifically limited, For example, linear shape, curvilinear shape, the shape that combined these, etc. are mentioned.
  • the outer peripheral shape of the portion of the polishing pad 10 in contact with the pad attachment portion of the polishing tool 104 is not particularly limited, and examples thereof include a circular shape, a polygonal shape, a petal shape, and a star shape.
  • the surface of the portion of the polishing pad 10 in contact with the pad attachment portion of the polishing tool 104 may be subjected to processing such as groove processing, hole processing, embossing processing or the like, but may be subjected to processing other than these. The details such as the configuration and the shape of the polishing pad 10 will be described later.
  • the material of the pad attachment portion of the polishing tool 104 is not particularly limited, but for example, resin, metal, ceramic, fiber reinforced resin, composite material, etc. can be used.
  • resin resin, metal, ceramic, fiber reinforced resin, composite material, etc.
  • fiber reinforced resin carbon fiber reinforced resin and glass fiber reinforced resin are mentioned, for example.
  • the kind of resin used for fiber reinforced resin is not specifically limited, For example, an epoxy resin is mentioned.
  • the composite material etc. which combined 2 or more types of materials, such as a metal which contained the inorganic particle intentionally, for example, are mentioned.
  • the polishing method of the present embodiment is not limited to the above-described automatic polishing apparatus.
  • the polishing method of the present embodiment may be applied to the case where a polishing pad is attached to the tip of a hand polisher and a polishing operator manually moves the hand polisher to polish a resin-coated surface.
  • the driving means of the hand polisher is not particularly limited, but in general, single action, double action, gear action and the like are used, and double action is preferred for polishing a painted member.
  • the polishing can be performed using an apparatus and conditions used for normal metal polishing.
  • a general polishing apparatus there is a single-side polishing apparatus or a double-side polishing apparatus.
  • an object to be polished (preferably a substrate-like object to be polished) is held and polished using a holder called a carrier.
  • One side of the object to be polished is polished by pressing the surface plate with the polishing cloth attached to one side of the object to be polished while rotating the surface plate while supplying the composition for polishing.
  • a holder called a carrier is used to hold an object to be polished, and while supplying a polishing composition from above, a platen having an abrasive cloth attached to the opposite surface of the object to be polished is pressed. Both sides of the object to be polished are polished by rotating in the relative direction. At this time, the polishing pad and the polishing composition, the physical action by the friction with the object to be polished, and the chemical action of the polishing composition on the object to be polished, it is polished.
  • a polishing load can be mentioned.
  • the lower limit of the polishing load in the polishing method according to the present embodiment is not particularly limited, but is preferably 20 g / cm 2 or more, and more preferably 50 g / cm 2 or more.
  • the upper limit of the polishing load is preferably 1000 g / cm 2 or less, more preferably 500 g / cm 2 or less. As the polishing load decreases, surface roughness of the polishing surface is suppressed.
  • a linear velocity (polishing linear velocity) in polishing can be mentioned.
  • the rotational speed of the polishing pad, the rotational speed of the carrier, the size of the object to be polished, the size of the object to be polished, etc. affect the linear velocity, but if the linear velocity is large, the frictional force applied to the object to be polished becomes large.
  • the object is likely to be mechanically polished.
  • friction heat may be generated by the friction, and the chemical action of the polishing composition may be increased.
  • the lower limit of the linear velocity of polishing in the polishing method according to the present embodiment is not particularly limited, but is preferably 10 m / min or more, and more preferably 20 m / min or more.
  • the upper limit of the polishing linear velocity is preferably 300 m / min or less, more preferably 150 m / min or less. Within this range, in addition to obtaining a sufficiently high polishing rate, an appropriate frictional force can be applied to the object to be polished. That is, in the present embodiment, the polishing linear velocity is preferably 10 m / min to 300 m / min, and more preferably 20 m / min to 150 m / min.
  • the polishing composition of the present embodiment may be used as a step completed in a single step, or may be used in one or more steps in a step having a plurality of steps of polishing. For example, when it is used in a process having three steps of polishing, it can be used in any one or more of the first step of rough polishing, the second step of middle polishing, and the third step of finish polishing.
  • the polishing composition once used for polishing can be recovered and used for polishing again.
  • the method of reusing the polishing composition there is a method of recovering the polishing composition discharged from the polishing apparatus into a tank and circulating it again into the polishing apparatus for use. Circulating use of the polishing composition reduces the environmental load by reducing the amount of the polishing composition discharged as waste liquid, and reduces the amount of the polishing composition to be used. It is useful in the point which can suppress the manufacturing cost concerning grinding
  • the polishing composition of the present embodiment When the polishing composition of the present embodiment is used in circulation, some or all of the abrasive grains, layered silicate compound, and other additives consumed or lost by polishing are recycled as a composition modifier. It can be added into. In this case, some or all of the abrasive grains, the layered silicate compound, and other additives may be mixed at an arbitrary mixing ratio as the composition modifier. By additionally adding a composition modifier, the polishing composition is adjusted to a composition suitable for reuse, and the polishing is suitably maintained.
  • the concentrations of the abrasive grains, the layered silicate compound, and the other additives contained in the composition modifier are arbitrary and not particularly limited, but may be appropriately adjusted according to the size of the circulation tank and the polishing conditions. preferable.
  • the polishing composition of the present embodiment may be a one-component type, or may be a multi-component type including a two-component type.
  • the polishing composition of the present embodiment may be prepared, for example, by diluting the stock solution of the polishing composition with a dilution liquid such as water or oil, for example, 10 times or more.
  • the polishing pad 10 used in the polishing method using the polishing composition of the present embodiment may be formed of, for example, a polyurethane type, a polyurethane foam type, a non-woven type, a suede type, or the like.
  • the details of the polishing pad 10 used in the polishing method using the polishing composition of the present embodiment will be described.
  • the configuration of the polishing pad 10 is not particularly limited as long as it has a polishing surface.
  • the polishing pad 10 may have a structure that causes the polishing surface of the polishing pad 10 to follow the resin-coated surface.
  • the structure for causing the polishing surface of the polishing pad 10 to follow the resin-coated surface has, for example, a two-layer structure including a hard layer forming the polishing surface and a soft layer supporting the hard layer. And may have a multilayer structure of two or more layers.
  • the polishing pad 10 As an example of the polishing pad 10, a configuration example of the polishing pad 10 having a two-layer structure including a hard layer forming a polishing surface and a soft layer supporting the hard layer will be described.
  • the hard layer forming the polishing surface is simply referred to as "hard layer”
  • the soft layer supporting the hard layer is simply referred to as "soft layer”.
  • the “hard layer” and the “soft layer” represent relative layer properties. That is, the above-mentioned hard means that the hardness of "the layer which forms the polished surface" which is one layer is higher than the hardness of the "the layer which supports the layer which has the polished surface" which is the other layer. It is.
  • the softness means that the hardness of the other layer "the layer supporting the layer having the polishing surface” is lower than the hardness of the one layer "the layer forming the polishing surface”. Is meant.
  • the polishing pad 10 may have a two-layer structure including a hard layer 40 and a soft layer 50.
  • the hard layer 40 may have the polishing surface 30 of the polishing pad 10.
  • the soft layer 50 supports the hard layer 40, and is distorted according to the curved surface when the polishing surface 30 is pressed against the curved surface of the resin-coated surface. Therefore, the hard layer 40 tends to bend along the curved surface, and the polishing surface 30 tends to follow the curved surface of the resin-coated surface.
  • the hardness of the hard layer 40 is preferably 60 or more, and more preferably 80 or more, in terms of A hardness measured by the method defined in JIS K 6253.
  • the A hardness of the hard layer 40 is preferably 99 or less.
  • the A hardness of the hard layer 40 is preferably 60 or more and 99 or less, and more preferably 80 or more and 99 or less. Within such a range, it becomes difficult to abrade the curved surface of the resin-coated surface by the polishing pad 10, and it becomes possible to remove the waviness of the surface of the resin-coated surface.
  • regulated to JISK6253 is 100.
  • the A hardness of the hard layer 40 can be measured in accordance with JIS K 6253, for example, by attaching an ASKER rubber hardness tester A type to a constant pressure loader CL-150L.
  • the material of the hard layer 40 is not particularly limited, and may be, for example, a non-woven fabric or a sheet containing resin fibers.
  • the non-woven fabric pad may be configured by impregnating only fibers or fibers with resin.
  • the material of the hard layer 40 may be a material containing a synthetic resin.
  • the synthetic resin contained in the hard layer 40 may be made of, for example, a material containing at least one of nylon resin, polyester resin, polyurethane resin, epoxy resin, aramid resin, polyimide resin, or polyethylene resin. If it is the above-mentioned material, a deep crack (scratch) can be reduced to a field to be polished.
  • Specific examples of the resin fiber of the hard layer 40 are preferably nylon resin, polyester resin, polyurethane resin, and polyethylene resin, and more preferably nylon resin and polyester resin.
  • hardening of the synthetic resin of the hard layer 40 may be performed by a curing agent or may be performed by heat.
  • the hard layer 40 may be made of a fiber material having a fiber density value of 0.08 g / cm 3 or more, and it may be made of a fiber material having a fiber density value of 0.09 g / cm 3 or more preferable.
  • the term "fiber density” refers to a value calculated by dividing the basis weight of the fiber material defined by grams per square meter by 10000 and further dividing it by the thickness defined by centimeters.
  • the hard layer 40 may be made of a fiber material having a fiber density value of 0.20 g / cm 3 or less, and is made of a fiber material having a fiber density value of 0.12 g / cm 3 or less Is preferable.
  • the hard layer 40 may be made of a fiber material having a fiber density value of 0.08 g / cm 3 or more and 0.20 g / cm 3 or less, and the fiber density value of 0.09 g preferred if configured by the fiber material is / cm 3 or more 0.12 g / cm 3 within the following range.
  • an abrasive comprising an emulsion comprising an abrasive, a first liquid having hydrophobicity, a surfactant, a layered silicate compound, and a second liquid having hydrophilicity.
  • a polishing composition comprising an emulsion further comprising at least one of an oil agent, an emulsion stabilizer, and a thickener as an additive to the composition or the polishing composition thereof is sufficiently improved. It is possible to obtain a polishing rate. If the fiber density value is less than 0.08 g / cm 3 , the durability of the hard layer 40 tends to decrease. When the fiber density value exceeds 0.20 g / cm 3 , the polishing rate tends to decrease.
  • the hard layer 40 has a sparse / dense structure and is made of a sheet material having a ratio of sparse portions of the polishing surface 30 (hereinafter, also referred to as area ratio of sparse portions) of 52% to 96%. It is preferable if it is composed of a sheet material having an area ratio of the sparse part of 54% to 96%, and more preferably if it is composed of a sheet material that is 60% to 96%. Within such a range, retention to the polishing interface of a polishing composition comprising an emulsion containing abrasive grains and at least one additive selected from an oil, an emulsion stabilizer, and a thickener, which will be described later.
  • the polishing interface of the polishing composition comprising an emulsion containing abrasive grains and at least one additive selected from an oil, an emulsion stabilizer, and a thickener is used. And the polishing rate tends to decrease.
  • the area ratio of the sparse portion of the polishing contact surface without the groove may be 52% or more and 96% or less.
  • the adjustment method of the area ratio of a sparse part is not specifically limited, For example, in the case of a nonwoven fabric sheet, even if it adjusts by the thickness of a fiber, content of fiber, the quantity of resin impregnated, patterning of the surface etc.
  • a mesh structure having a structure in which elongated materials are arranged side by side well it may be adjusted according to the diameter of the structure material, the interval of the structure, the lamination conditions, etc.
  • a foam structure it may be adjusted by the kind, amount, etc. of a foaming agent, and in the case of a suede formed by a wet film forming method, it may be adjusted by film forming conditions and buffing conditions.
  • the area ratio of the sparse portion of the hard layer 40 can be determined, for example, by image analysis of the surface of the polishing pad measured with a microscope. Specifically, using a VK-X200 manufactured by Keyence Corporation, the surface of the polishing pad has a viewing angle of 1.4 mm ⁇ 1.4 mm and a height direction of 0.1 mm at a magnification of 200 times (10 ⁇ objective, eyepiece) Measure any 10 points at 20x), and use the WinROOF 2018 manufactured by Mitani Corporation to monochrome the obtained image, and blank the entire area of the binarized image automatically It can obtain by calculating the ratio of the area of That is, the above-mentioned "sparse part" is a part in which the fiber etc.
  • the ratio of the area of the void in the range of 0.1 mm in thickness from the outermost surface may be 52% or more and 96% or less.
  • area refers to the area when the layer having the polishing surface 30 is viewed in the thickness direction.
  • the thickness of the resin fiber of the hard layer 40 is not particularly limited, but is preferably 1 denier or more, and 10 denier or less. Further, the type of thickness of the resin fiber may be one type, or two or more types of resin fibers having different types of thickness may be mixed.
  • the thickness of the hard layer 40 is not particularly limited, but is preferably 0.05 cm or more. Moreover, it is preferable if it is 0.5 cm or less.
  • the hard layer 40 easily bends along the curved surface of the resin-coated surface when the polishing surface 30 is pressed against the curved surface of the resin-coated surface, and polishing is performed There is a tendency for the followability of the polishing surface 30 to the curved surface of the object to be improved. For this reason, the waviness component of the surface shape of the object to be polished can be removed, and the contact area between the polishing surface 30 and the curved surface tends to increase and the polishing efficiency tends to be improved.
  • the soft layer 50 is a layer provided to support the hard layer 40 on the surface of the hard layer 40 opposite to the polishing surface 30, and may be a layer made of an elastic material. .
  • the elastic body constituting the soft layer 50 may be made of resin, for example.
  • the hardness of the soft layer 50 is preferably less than 60 in terms of A hardness measured by the method defined in JIS K 6253, and more preferably 30 or less. That is, it is preferable that the A hardness of the soft layer 50 be lower than the A hardness of the hard layer 40. Within such a range, the soft layer 50 is likely to be distorted when the polishing surface 30 is pressed against the curved surface of the resin-coated surface.
  • the A hardness of the soft layer 50 can be measured in accordance with JIS K 6253, for example, by attaching an ASKER rubber hardness tester A type to a constant pressure loader CL-150L.
  • the thickness of the soft layer 50 is not particularly limited, but is preferably 0.50 cm or more. Moreover, if the thickness of the soft layer 50 is 5.0 cm or less, it is preferable. With such a range, when the polished surface 30 is pressed against the curved surface of the resin-coated surface, the amount of distortion of the soft layer 50 and the amount of deflection of the hard layer 40 can be secured.
  • the material of the soft layer 50 is not particularly limited as long as it has the above-mentioned hardness.
  • the material of the soft layer 50 may be, for example, a resin foam such as polyurethane foam or polyethylene foam.
  • FIG. 2 illustrates the polishing pad 10 in which the polishing surface 30 is flat
  • the present invention is not limited to this.
  • the polishing pad 10 may have a groove on the polishing surface 30.
  • channel in the polishing surface 30 is demonstrated.
  • a first groove 31 and a second groove 32 are formed on the polishing surface 30 of the polishing pad 10.
  • the first groove 31 extends along a first direction on the polishing surface 30, and the second groove 32 extends along a second direction on the polishing surface 30 orthogonal to the first direction.
  • the grooves are formed in a lattice shape in the polishing surface 30.
  • channel is not specifically limited, For example, after forming the 2 layer structure containing the hard layer 40 and the soft layer 50, the layer of the part used as a groove by an etching etc. It may be formed by removing Alternatively, after forming the two-layer structure, it may be formed by scanning the surface while pressing a circular cutting blade rotating at high speed against a predetermined amount of the pad.
  • the depths of the first groove 31 and the second groove 32 are not particularly limited, but may be the same as the thickness of the hard layer 40. That is, the hard layer 40 may be divided into a plurality of parts by the first groove 31 and the second groove 32. Also, the first groove 31 and the second groove 32 are formed only in the hard layer 40 and not formed in the soft layer 50. Since the hard layer 40 is divided by the first groove 31 and the second groove 32, when the polishing surface 30 is pressed against the curved surface of the resin-coated surface, the hard layer 40 abuts according to the curved surface It becomes possible to displace in the direction. For this reason, the polished surface 30 can easily follow the curved surface of the resin-coated surface.
  • the groove widths of the first groove 31 and the second groove 32 are not particularly limited, but are preferably 0.5 mm or more, for example.
  • the groove widths of the first groove 31 and the second groove 32 are not particularly limited, but are preferably 5.0 mm or less, for example. Within such a range, the reduction of the contact area between the polished surface 30 and the resin-coated surface due to the formation of the groove is suppressed, and the hard layer 40 in the case where the polished surface 30 is pressed against the curved surface of the resin-coated surface The displacement amount can be secured to make the polishing surface 30 easy to bend.
  • the pitch of the first grooves 31 and the pitch of the second grooves 32 are not particularly limited, but are preferably 5.0 mm or more, for example.
  • the pitch of the first grooves 31 and the pitch of the second grooves 32 are not particularly limited, but preferably 50 mm or less, for example.
  • “pitch” refers to the distance between the first groove 31 and the second groove 32. Within such a range, the entire polished surface 30 when the polished surface 30 is pressed against the curved surface of the resin-coated surface while suppressing a decrease in the contact area between the polished surface 30 and the resin-coated surface due to the formation of grooves. It is possible to secure the amount of deflection of
  • the dimensions of the groove width and the pitch described above are the same as in the first to seventh modifications described below.
  • the depths of the first groove 31 and the second groove 32 are not particularly limited, but may be shallower than the thickness of the hard layer 40. That is, the hard layer 40 is not divided into a plurality by the first groove 31 and the second groove 32, and the thickness of the hard layer 40 in the portion of the first groove 31 and the second groove 32 is the thickness of the other portion Thinner than Since the rigidity of the portions of the first groove 31 and the second groove 32 is reduced, the hard layer 40 is easily bent. For this reason, the polished surface 30 can easily follow the curved surface of the resin-coated surface.
  • the depths of the first groove 31 and the second groove 32 are not particularly limited, but may be deeper than the thickness of the hard layer 40. That is, the first groove 31 and the second groove 32 may be formed in the hard layer 40 and the soft layer 50. Therefore, the support surface 51 of the soft layer 50 supporting the hard layer 40 may also be divided by the first groove 31 and the second groove 32. The plurality of divided hard layers 40 may be respectively supported by the plurality of divided support surfaces 51. Since the first groove 31 and the second groove 32 are also formed in the soft layer 50, the rigidity of the soft layer 50 is reduced, and the curved surface is obtained when the polishing surface 30 is pressed against the curved surface of the resin-coated surface.
  • the soft layer 50 is likely to be distorted.
  • the support surface 51 supporting the hard layer 40 is divided, the restraining force between the support surfaces 51 is reduced, and the divided hard layers 40 are easily displaced independently. Therefore, the displacement amount of the hard layer 40 in the contact direction becomes large, and the polished surface 30 can easily follow the curved surface of the resin-coated surface.
  • the first groove 31 is formed in the polishing surface 30, and the second groove 32 is not formed.
  • the grooves are formed in a stripe shape in the polishing surface 30.
  • the depth of the first groove 31 is not particularly limited, but may be deeper than the thickness of the hard layer 40. That is, the first groove 31 may be formed in the hard layer 40 and the soft layer 50. Therefore, the support surface 51 of the soft layer 50 supporting the hard layer 40 may also be divided by the first groove 31.
  • the plurality of divided hard layers 40 may be respectively supported by the plurality of divided support surfaces 51.
  • the depth of the first groove 31 may be the same as the thickness of the hard layer 40, or may be shallow.
  • the third groove 33 is formed in the polishing surface 30.
  • the groove is formed in a spiral shape in the polishing surface 30.
  • the depth of the third groove 33 is not particularly limited, but may be deeper than the thickness of the hard layer 40. That is, the third groove 33 may be formed in the hard layer 40 and the soft layer 50. The depth of the third groove 33 may be the same as or smaller than the thickness of the hard layer 40.
  • the fourth groove 34 is formed in the polishing surface 30.
  • the grooves are formed radially in the polishing surface 30.
  • the depth of the fourth groove 34 is not particularly limited, but may be deeper than the thickness of the hard layer 40. That is, the fourth groove 34 may be formed in the hard layer 40 and the soft layer 50. Therefore, the support surface 51 of the soft layer 50 supporting the hard layer 40 may also be divided by the fourth groove 34.
  • the plurality of divided hard layers 40 may be respectively supported by the plurality of divided support surfaces 51.
  • the depth of the fourth groove 34 may be the same as or smaller than the thickness of the hard layer 40.
  • a groove may be formed on the polishing surface of the polishing pad used for the secondary polishing as in the polishing pad 10 according to the second embodiment.
  • the fifth groove 35 is formed on the polishing surface 30.
  • the grooves are formed in a triangular shape in the polishing surface 30.
  • the depth of the fifth groove 35 is not particularly limited, but may be deeper than the thickness of the hard layer 40. That is, the fifth groove 35 may be formed in the hard layer 40 and the soft layer 50. Therefore, the support surface 51 of the soft layer 50 supporting the hard layer 40 may also be divided by the fifth groove 35.
  • the plurality of divided hard layers 40 may be respectively supported by the plurality of divided support surfaces 51.
  • the depth of the fifth groove 35 may be the same as the thickness of the hard layer 40 or may be shallow.
  • a groove may be formed on the polishing surface of the polishing pad used for the secondary polishing as in the polishing pad 10 according to the second embodiment.
  • the depth of the sixth groove 36 is not particularly limited, but may be deeper than the thickness of the hard layer 40. That is, the sixth groove 36 may be formed in the hard layer 40 and the soft layer 50. Therefore, the support surface 51 of the soft layer 50 supporting the hard layer 40 may also be divided by the sixth groove 36. The plurality of divided hard layers 40 may be respectively supported by the plurality of divided support surfaces 51.
  • the depth of the sixth groove 36 may be the same as the thickness of the hard layer 40, or may be shallow.
  • a groove may be formed on the polishing surface of the polishing pad used for the secondary polishing as in the polishing pad 10 according to the second embodiment.
  • the said modification demonstrated about each groove shape of a triangle, a square, and a hexagon, this invention is not limited to this.
  • the groove shape formed on the polishing surface 30 is not particularly limited, and may be, for example, a polygon.
  • each polishing pad 10 which concerns on this embodiment was demonstrated, this invention is not limited to this. For example, even in other embodiments described below, the same effects as those of the polishing pads 10 according to the present embodiment can be obtained.
  • the polishing pad 10 used in the polishing method of the present embodiment includes a hard layer 40 having a polishing surface 30, a soft layer 50 made of an elastic body and supporting the hard layer 40. , And may have a laminated structure.
  • the hard layer 40 three or more notches 40a radially extending from the outer edge toward the center are formed (in the example of FIGS. 11, 12 and 13, the number of notches 40a is three) , And the outer peripheral side portion of the hard layer 40 may be divided into a plurality of petal-like regions 40A, 40B, 40C,.
  • the central portion of the hard layer 40 disposed inside the outer peripheral side portion of the hard layer 40 is not divided by the notch 40 a.
  • the polishing surface 30 of the polishing pad 10 can be easily deformed in accordance with the curved surface shape of the surface of the object to be polished (object to be polished) 90. Therefore, when the surface of the curved object 90 is polished using such a polishing pad 10, the polishing surface 30 of the polishing pad 10 is three-dimensionally deformed and the surface of the curved object 90 is polished. It is possible to remove the waviness of the surface of the curved object 90 to be polished.
  • the polishing method of the present embodiment can be applied to various objects 90 having different curvatures. It is applicable to the surface of.
  • the polishing method of the present embodiment can be suitably applied to the surface of an object to be polished 90 having a plurality of curved surface portions having different curvatures, or to the surface of the object to be polished 90 having concave and convex portions. .
  • the polishing surface 30 In order for the polishing surface 30 to deform in accordance with the curved surface shape of the surface of the workpiece 90 and follow the surface of the workpiece 90, the notches 40a are adjacent to the petal-like region (for example, petal-like regions 40A, 40B) When the split ends of each other (for example, the split end 40Aa of the petal-like area 40A and the split end 40Ba of the petal-like area 40B) are joined, the polishing surface 30 is formed to be a convex curved surface or a concave curved surface. Preferably (see FIGS. 11, 12 and 13).
  • the surface of the soft layer 50 in contact with the hard layer 40 may have a convex curved surface or a concave curved surface.
  • the planar shape of the notch 40a (the shape of the notch 40a in the vertical projection when the notch 40a is viewed from the viewpoint perpendicular to the polishing surface 30) is not particularly limited, and FIG. Although it may be V-shaped as shown, it may be a strip shown in FIG. 12 or a trapezoidal shape shown in FIG.
  • the V-shaped notch 40a shown in FIG. 11 has a shape in which the outer edge side end is the widest and the width is gradually narrowed toward the center.
  • the central end of the V-shaped notch 40a may be sharp as shown in FIG. 11, but may be arc-shaped.
  • the strip-shaped notch 40a shown in FIG. 12 is shaped such that its width is constant from the outer edge side end to the center side edge.
  • the center side end of the strip-shaped notch 40a may have an arc shape as shown in FIG. 12 (that is, it may be a U-shaped notch 40a), but has a polygonal shape such as a rectangular shape. May be
  • the trapezoidal notch 40a shown in FIG. 13 has a shape in which the outer edge side end is the narrowest and the width gradually widens toward the center.
  • the center side end of the trapezoidal notch 40a may have a polygonal shape such as a rectangular shape as shown in FIG. 15, but may have an arc shape.
  • the shape of the plurality of petal-like regions 40A, 40B, 40C,... Formed by dividing the outer peripheral side portion of the hard layer 40 by the notches 40a is not particularly limited, but is as follows. May be That is, the distance A between the center side ends of the adjacent notches 40a (also referred to as the width at the center side end of the petal-like region) and the distance B between the outer side ends of the adjacent notches 40a
  • the shape may be such that the ratio B / A to (which can be said to be the width at the outer edge side end of the petal-like region) is 1 or more.
  • the ratio B / A is more preferably 1.3 or more.
  • the shapes of the plurality of petal-like regions 40A, 40B, 40C,... May be as follows. That is, the shape may be such that the ratio A / C of the width C at the outer edge side end of the notch 40a to the distance A described above satisfies the formula 0.8 ⁇ A / C ⁇ 32.3. It is more preferable that the ratio A / C satisfies the expression 1.2 ⁇ A / C ⁇ 15.7.
  • the shapes of the hard layer 40 and the polishing surface 30 are not particularly limited, but the hard layer 40 has a disk shape, and the outer surface of the hard layer 40 forming the polishing surface 30 (soft layer 50 and The surface opposite to the opposite surface, which is exposed to the outside, may be circular. When the polishing surface 30 is circular, the plurality of notches 40a may be formed equidistantly (at equal intervals) in the circumferential direction of the polishing surface 30.
  • the radial length (the length in the radial direction of the polishing surface 30) of the notch 40a is not particularly limited, as shown in FIG.
  • the length may be set to 2/3 or less of the radius of the polishing surface 30.
  • the radial length of the notch 40 a is more preferably 1/2 or less of the radius of the polishing surface 30.
  • the number of the notches 40a provided in the hard layer 40 is not particularly limited, and may be set to various numbers as shown in FIG. 14, but 3 or more and 6 or less are preferable.
  • the notches 40a may be formed by cutting only the hard layer 40, they may be formed by cutting the hard layer 40 and the soft layer 50.
  • the soft layer 50 includes the hard layer 40 of the soft layer 50.
  • a recess 50 a extending in the thickness direction of the soft layer 50 from the surface on the side of contact is formed continuously with the notch of the hard layer 40, and the notch of the hard layer 40 and the recess of the soft layer 50 are formed. 50a is united and constitutes notch 40a.
  • the recess 50a of the soft layer 50 may be a through hole penetrating from the surface of the soft layer 50 in contact with the hard layer 40 to the surface on the opposite side, as shown in FIG. As shown to, the recessed part 50a with a bottom may be sufficient.
  • the cross-sectional shape (the cross-sectional shape when cut in a plane orthogonal to the polishing surface 30) of the notch 40a in which the notch portion of the hard layer 40 and the recess 50a of the soft layer 50 are integrally formed is particularly limited. Although it may be V-shaped as shown in FIG. 15, it may be a polygonal shape such as a rectangle or an arc shape.
  • the type of material constituting the hard layer 40 is not particularly limited, but the hardness according to the test method specified in Annex 2 “Spring hardness test type C test method” of JIS K7312: 1996 It may be described as a material having a hardness of 40 or more and 80 or less). If the hardness of the material constituting the hard layer 40 is within the above range, the abrading surface 30 can easily follow the abraded surface 90 a having a curved surface, and it becomes easy to remove the waviness of the surface of the abraded object 90 .
  • the needle protruding from the hole at the center of the pressing surface is spring pressure.
  • the measurement surface of the test piece should be at least as large as the pressure surface of the tester.
  • a plurality of linear grooves 40 c having a width of 0.5 mm or more and 5 mm or less may be formed on the outer surface of the hard layer 40.
  • the polishing surface 30 can easily follow the surface of the curved object 90, and it becomes easy to remove the waviness of the surface of the object 90.
  • the polishing composition easily spreads along the linear grooves 40c to the central portion of the polishing surface 30, and foreign matter enters between the polishing surface 30 and the surface of the workpiece 90. Since foreign substances are easily discharged along the groove 40c, the generation of polishing scratches is suppressed even if the surface of the workpiece 90 is a relatively soft surface such as a coating film.
  • the plurality of linear grooves 40c may be linear or curved. Then, linear or curved linear grooves 40c may be arranged parallel to each other and formed in stripes, or may be formed to intersect in a lattice shape. Alternatively, circular or elliptical linear grooves 40c may be formed concentrically.
  • the linear groove 40c may be a groove having a depth penetrating from the outer surface of the hard layer 40 to the surface on the side in contact with the soft layer 50, or a groove with a bottom as shown in FIG. It is also good.
  • the cross-sectional shape of the linear groove 40c (the cross-sectional shape when cut in a plane orthogonal to the polishing surface 30) is not particularly limited, and may be rectangular as shown in FIG. It may be a shape, an arc shape or the like.
  • the water blocking layer 60 which suppresses the penetration of the slurry-like polishing composition into the soft layer 50 is a soft layer 50. It may be formed on the inner surface of the recess 50a (see FIG. 17).
  • the water blocking layer 60 made of a water blocking material (for example, foam rubber) having a low water absorption rate, the polishing composition does not easily penetrate into the soft layer 50 during polishing. Become. Therefore, the polishing composition which is not used for polishing is reduced, and the utilization efficiency of the polishing composition is increased, so that the polishing cost can be suppressed.
  • the type of the water blocking material is not particularly limited as long as it can suppress penetration of the polishing composition into the soft layer 50.
  • chloroprene rubber foam ethylene / propylene rubber foam, silicone rubber foam And foamed rubbers such as fluorine rubber foam, polyurethane foam, polyethylene foam and the like.
  • a water blocking layer may be provided on a portion of the surface of the soft layer 50 that is likely to be in contact with the polishing composition.
  • the polishing pad 10 used in the polishing method of the present embodiment has the penetrating portion 1a which is a hole penetrating the hard layer 40 in the thickness direction in the region (center side) inside the outer edge of the polishing surface 30. May be formed. That is, the opening of the penetrating portion 1 a is not open at the outer edge of the hard layer 40 but is a closed opening.
  • the through portion 1 a may be a hole extending in parallel to the thickness direction of the hard layer 40 as long as the through portion 1 a is formed in a region inside the outer edge of the polishing surface 30, or in the thickness direction of the hard layer 40. It may be a hole extending in the direction of inclination.
  • the penetrating portion 1a is continuously annular along the circumferential direction of the polishing surface 30, as shown in FIG. 18, and the polishing surface 30 is a portion of the penetrating portion 1a by the penetrating portion 1a. It may be shaped so as to be divided into an outer annular polishing surface 30c and a circular polishing surface 30d inside the through portion 1a. Alternatively, as shown in FIG. 19 and FIG. 20, the penetrating portion 1a is not continuous along the circumferential direction of the polishing surface 30, and the penetrating surface 1 is not divided into a plurality of portions by the penetrating portion 1a It may be described as "non-cyclic".
  • the planar shape of the opening of the penetrating portion 1a that is, the shape of the opening of the penetrating portion 1a in the vertical projection when the opening of the penetrating portion 1a is viewed from the viewpoint of a position perpendicular to the polishing surface 30, It is not particularly limited.
  • annular (refer to Drawing 18) and non-annular are mentioned, for example.
  • non-annular form circular (see FIG. 19), wedge-like (see FIG.
  • oval, polygonal triangular, quadrangular, pentagonal, hexagonal, octagonal, etc.
  • linear band-like
  • shape arcuate shape, C shape, U shape, S shape etc.
  • irregular shape etc. may be mentioned. If the opening of the penetrating portion 1a has a corner, breakage such as chipping is likely to occur in that portion, so it is preferable to have a shape that does not have a corner such as an annular shape or a circular shape.
  • the shapes of the openings of the plurality of through parts 1a may be all the same, or some or all of them may be different.
  • the size of the opening of the penetrating portion 1a and the number of the penetrating portions 1a are the penetrating portion with respect to the area of the polishing surface 30 (the total area of the region inside the outer edge of the polishing surface 30 including the opening of the penetrating portion 1a) It is preferable to set so that the ratio of the total area of the opening of 1a may be 3% or more and 35% or less. That is, the area of the polishing surface 30 and the area of the opening of the penetrating portion 1a are measured in a vertically projected view when the polishing surface 30 is viewed from the viewpoint of a position perpendicular to the polishing surface 30.
  • the areas of the openings of all the through parts 1a are summed, and the total area of the openings of the total through parts 1a is divided by the area of the polishing surface 30, and the opening of the through part 1a relative to the area of the polishing surface 30 Calculate the percentage of the total area of the department.
  • the ratio of the total area of the opening of the penetrating portion 1a to the area of the polishing surface 30 is 3% or more, the flexibility of the hard layer 40 becomes good, and it becomes easy to follow the curved surface 90a. .
  • the ratio of the total area of the openings of the penetrating portion 1a to the area of the polishing surface 30 is 35% or less, the polishing performance of the hard layer 40 becomes good and the waviness of the curved surface 90a is removed Cheap.
  • it is more preferable to set so that the ratio of the total area of the opening part of the penetration part 1a with respect to the area of the grinding surface 30 may be 6% or more and 20%.
  • the mode of the arrangement of the openings of the penetrating portion 1a in the polishing surface 30 is not particularly limited, but the distance from the outer edge of the polishing surface 30 so that the softness and polishing performance of the hard layer 40 become suitable. It is preferable to appropriately set the distance from the center of the polishing surface 30, the distance between the openings of the through portion 1a, and the like.
  • the polishing surface 30 is divided into an annular polishing surface 30c outside the through portion 1a and a circular polishing surface 30d inside the through portion 1a.
  • the shape of the through portion 1a at this time is not particularly limited, and may be a perfect circular shape or an elliptical shape.
  • polishing surface 30 may be 2.5% or more and 15% or less, and it is more preferable that it is 8% or more and 13% or less. Within this range, the polishing surface 30 easily follows the curved surface to be polished 90a, and the undulation of the curved surface 90a is easily removed.
  • the position of the annular through portion 1 a in the polishing surface 30 is not particularly limited as long as it is a region inside (central side) of the outer edge of the polishing surface 30, but the annular abrasive surface 30 c outside the through portion 1 a It is preferable to arrange the annular penetration part 1a in the position where the center of the center and the center of the circular polishing surface 30d inside the penetration part 1a are common.
  • the hard layer 40 having the annular polishing surface 30c outside the through portion 1a and the hard layer 40 having the circular polishing surface 30d inside the through portion 1a may be formed of the same material. , And may be formed of different materials. Compared with the A hardness of the hard layer 40 having the annular grinding surface 30c outside the penetration portion 1a, the hardness A of the hard layer 40 having the circular grinding surface 30d inside the penetration portion 1a is larger It is preferable because the undulation of the curved surface 90a can be removed efficiently.
  • the size of the opening of the penetrating portion 1a and the number of the penetrating portions 1a are not particularly limited, but the number of the penetrating portions 1a is 3 or more The number is preferably 16 or less, more preferably 5 or more and 10 or less. If the number of the penetrating portions 1a is three or more, the flexibility of the hard layer 40 becomes good, so it becomes easy to follow the curved surface 90a. On the other hand, if the number of penetrations 1a is 16 or less, the polishing performance of the hard layer 40 is good, and the undulation of the curved surface 90a is easily removed.
  • the sizes of the openings of the plurality of penetrations 1a may be all the same, or some or all of them may be different.
  • the mode of the arrangement of the non-annular penetrations 1a is not particularly limited.
  • the openings of the plurality of non-annular penetrations 1a may be arranged in a straight line on the polishing surface 30, or may be arranged in a curve. It may also be arranged in a ring.
  • the polishing surface 30 is an annular polishing surface 30c outside the penetration 1a divided by the annular penetration 1a, and the inside of the penetration 1a.
  • a plurality of openings may be regularly or irregularly formed in the polishing surface 30 such that the openings of the plurality of non-annular penetrations 1 a are arranged in a straight line, a curved line, or an annular line.
  • a plurality of opening groups in which the openings of the plurality of non-annular penetrations 1 a are arranged in a straight line or a curved line may be arranged in parallel to the polishing surface 30.
  • a plurality of opening groups in which the openings of the plurality of non-annular penetrations 1 a are annularly arranged may be arranged concentrically or in a row on the polishing surface 30.
  • the openings of the plurality of non-annular penetrations 1a are preferably arranged on the polishing surface 30 so as to have symmetry such as line symmetry or point symmetry as a whole.
  • the opening of the non-annular penetrating part 1a is such that a virtual straight line connecting the centers of the openings of the adjacent non-annular penetrating parts 1a sequentially forms a regular polygon such as a square, regular hexagon, or regular octagon. It is preferable that it is arrange
  • the centers of the openings of the plurality of non-annular penetrations 1 a be disposed at positions corresponding to the vertices of the regular polygon virtually disposed on the polishing surface 30. In this case, it is preferable that the center of the polishing surface 30 coincides with the center of the regular polygon.
  • the polishing pads 10 shown in FIG. 19 are arranged at positions corresponding to the apexes of a regular octagon, respectively, and the polishing pads 10 shown in FIG.
  • the openings of the non-annular penetrations 1a are arranged at positions corresponding to the apexes of a regular hexagon.
  • the soft layer 50 may be provided with a recess.
  • the concave portion of the soft layer 50 may be a penetrating portion penetrating the soft layer 50 in the thickness direction, or a bottomed hole formed on the surface of the soft layer 50 in contact with the hard layer 40. It may be.
  • the cross-sectional shape (the cross-sectional shape when cut in a plane perpendicular to the polishing surface 30) is not particularly limited, and may be V-shaped, It may be a polygonal shape such as a rectangle or an arc shape.
  • the recess of the soft layer 50 may be formed continuously with the annular or non-annular penetration portion 1a of the hard layer 40 (ie, may be arranged at the same position on the polishing surface 30) , And may be formed discontinuously.
  • the side surface of the soft layer 50 is a cylindrical surface or a conical surface when the soft layer 50 is cylindrical or frusto-conical, and a flat surface when the soft layer 50 is prismatic or truncated pyramidal, but these side surfaces are flat.
  • the invention is not limited to the surface, and it may be a convex surface protruding toward the outside of the soft layer 50 or a concave surface recessed toward the inside of the soft layer 50.
  • the shape of the soft layer 50 is a frustum shape
  • the inclination angle of the side surface of the soft layer 50 with respect to the central axis of the frustum is not particularly limited. You can adjust the sex.
  • the polishing surface 30 of the polishing pad 10 is three-dimensionally deformed to form a curved surface. Since it follows the polishing surface 90a, it is possible to sufficiently remove the waviness of the curved surface to be polished 90a, and it is preferable because breakage such as chipping does not easily occur in the polishing pad 10.
  • ⁇ Abrasive> As abrasive grains, any of the following was used.
  • Aluminum oxide 60 to 100% of alpha conversion rate, average secondary particle size (D 50 ) 0.3 ⁇ m, 7.5 ⁇ m, 12.7 ⁇ m or 37 ⁇ m ⁇
  • Ceria average secondary particle size (D 50 ) 1.6 ⁇ m ⁇
  • Mixture of alumina oxide and zircon average secondary particle size (D 50 ) 3.2 ⁇ m
  • the alpha conversion rate of the aluminum oxide particles was calculated from the integrated intensity ratio of (113) plane diffraction line by X-ray diffraction measurement using an X-ray analyzer (Ultima-IV, manufactured by Rigaku Corporation). Further, the average secondary particle diameter (D 50 ) of each abrasive grain was measured by a laser diffraction / scattering method using LA-950V2 (manufactured by Horiba, Ltd.).
  • ⁇ Dispersing agent> As a dispersant, any of the following was used.
  • Hectorite sodium (Na) hectorite, average primary particle size 0.08 ⁇ m or 3 ⁇ m (both measured by SEM), aspect ratio 80 (0.08 ⁇ m) or 1000 (3 ⁇ m), addition amount 0.
  • Bentonite Sodium (Na) bentonite, average primary particle diameter 1 ⁇ m (measured value by SEM), viscosity 300 mPa ⁇ s (measured value with 4 mass% water dispersion, BM type viscometer, 60 rpm, 25 ° C.), swelling power 63 ml / 2 g, addition amount 0.1 mass% or 1 mass% Na tetra silicon mica: sodium (Na) tetra silicon mica, average primary particle diameter 11 ⁇ m (measured value by laser diffractometer), aspect ratio 2000, addition amount 1 mass% -Other compounds Na polyacrylate Na: sodium polyacrylate, molecular weight 3000, addition amount 0.1 mass% Pyrophosphate Na: Sodium pyrophosphate decahydrate, molecular weight 446, addition amount 0.1% by mass
  • Emulsification stabilizer Glycerin (addition amount 2.0% by mass)
  • -Oil agent Spindle oil (addition amount 1.2 mass%) and castor oil (addition amount 0.3 mass%)
  • polishing was performed under the following polishing conditions, and the removal amount was determined.
  • the polishing apparatus used for polishing is an apparatus in which a double action polisher is attached to the tip of an arm of an industrial robot “M-20iA” manufactured by FANUC LTD.
  • a polishing pad (see FIG. 3) provided with grating grooves on the polishing surface is attached to this double action polisher, and the polishing surface of the polishing pad is applied to the surface to be polished of the polishing object by the pressing force applied to the arm. While pressing and supplying the polishing composition onto the surface to be polished, polishing was performed by rotating the double action polisher.
  • the specific polishing conditions are as follows.
  • polishing pad mounted on the double action polisher may be, for example, the polishing pad shown in FIGS. 2 and 4 to 17 described in the present embodiment, in addition to the polishing pad having the grating grooves on the polishing surface.
  • the polishing pad used is a suede pad and has a C hardness of 58.
  • the object to be polished was coated with a synthetic resin paint (a clear coating film for repair of automobile dealers in Japan), and the thickness of the coating film was 20 ⁇ m. That is, the surface to be polished is a coating film surface made of a synthetic resin.
  • the film thickness of each film before and after polishing was measured using an electromagnetic induction type film thickness measuring device. Then, the removal amount (polishing amount) was evaluated from the film thickness difference. The polishing performance was accepted when the machining allowance was 1.7 ⁇ m or more.
  • the scattering prevention performance of the polishing composition was regarded as “B”. Further, when no trace of scattering of the polishing composition was found around the polishing composition, the scattering prevention performance of the polishing composition was regarded as “A”.
  • Example 2-1 the method of preparing the polishing composition and the polishing conditions are the same as in the first embodiment except that the polishing pad attached to the double action polisher is a non-woven pad having a C hardness of 23 (see FIG. 3). Or the same in the criteria of each evaluation. Therefore, the description of the method for preparing the polishing composition and the polishing conditions in the second embodiment, the criteria for each evaluation, and the like will be omitted here.
  • the polishing composition of Example 2-1 the same composition as the polishing composition of Example 1-2 was used.
  • the polishing composition of Comparative Example 2-1 the same composition as the polishing composition of Comparative Example 1-1 was used.
  • Example 3-1 the method for preparing the polishing composition and the polishing composition according to the first embodiment and the polishing are employed except that the polishing pad attached to the double action polisher is a foamed polyurethane pad having a C hardness of 23 (see FIG. 3).
  • the conditions are the same or the criteria of each evaluation. Therefore, the description of the method of preparing the polishing composition, the polishing conditions, the criteria for each evaluation, and the like in the third embodiment will be omitted here.
  • the polishing composition of Example 3-1 the same composition as the polishing composition of Example 1-2 was used.
  • the polishing composition of Comparative Example 3-1 the same composition as the polishing composition of Comparative Example 1-1 was used.
  • Example 4-1 the same one as the polishing composition of Example 1-2 was used.
  • the same polishing composition as in Example 1-7 was used as the polishing composition in Example 4-2.
  • the polishing composition of Comparative Example 4-1 the same composition as the polishing composition of Comparative Example 1-1 was used.
  • polishing was performed under the following polishing conditions, and the front surface removability and the scattering were evaluated.
  • the polishing apparatus used for polishing is a hand polisher.
  • a polishing pad (see FIG. 3) having a grating groove on the polishing surface is attached to the hand polisher, and the pressing force applied to the hand polisher brings the polishing surface of the polishing pad to the surface to be polished of the object to be polished. While pressing and supplying the polishing composition onto the surface to be polished, polishing was performed by rotating the hand polisher.
  • the specific polishing conditions are as follows. Polisher speed: 650 rpm Flow rate of polishing composition: 2 ml / 15 sec Polishing time: 1 minute Polishing conditions such as polishing pressure, polishing rate, polishing time, etc. were the same for all tests.
  • the polishing pad attached to the hand polisher may be, for example, the polishing pad shown in FIGS. 2 and 4 to 17 described in the present embodiment, in addition to the polishing pad having the grating grooves on the polishing surface.
  • the polishing pad used is a foamed polyurethane buff and has a C hardness of 17.
  • the object to be polished used is aluminum alloy A6061. That is, the surface to be polished is a surface made of an alloy.
  • Example 5-1 the same composition as the polishing composition of Example 1-2 was used.
  • the polishing composition of Comparative Example 5-1 the same composition as the polishing composition of Comparative Example 1-1 was used.
  • Example 5-1 and Comparative Example 5-1 were used to polish the polishing conditions of the fourth example under the same polishing conditions as the rotation speed and polishing time of the polisher, etc. was evaluated.
  • the object to be polished is iron alloy SUS304. That is, the surface to be polished is a surface made of an alloy.
  • polishing performance such as the removal cost is improved as compared with the comparative examples (Comparative Examples 1-6, 1-7, 1-9 to 1-11) in which the layered silicate compound is not added.
  • anti-scattering performance was improved as compared with Comparative Examples (Comparative Examples 1-5, 1-8) in which no thickener was added.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

La présente invention concerne une composition de polissage qui fait preuve d'une excellente performance de polissage vis-à-vis des surfaces de matériaux tels que les alliages, les résines, les métaux, les semi-métaux, et les oxydes de métaux ou semi-métaux, et qui présente une diffusion réduite de la composition de polissage durant le polissage. Une composition de polissage selon un mode de réalisation de la présente invention contient des grains abrasifs, un premier liquide qui présente une hydrophobie, un tensioactif, un composé de silicate stratifié, un agent épaississant et un second liquide qui présente une hydrophilie.
PCT/JP2018/036406 2017-09-29 2018-09-28 Composition de polissage, procédé de production d'une composition de polissage, et procédé de polissage Ceased WO2019066014A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019545162A JPWO2019066014A1 (ja) 2017-09-29 2018-09-28 研磨用組成物、研磨用組成物の製造方法、および研磨方法
TW108105052A TW201938748A (zh) 2018-03-16 2019-02-15 研磨用組成物、研磨用組成物之製造方法及研磨方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2017191348 2017-09-29
JP2017-191348 2017-09-29
JP2018048888 2018-03-16
JP2018-048888 2018-03-16

Publications (1)

Publication Number Publication Date
WO2019066014A1 true WO2019066014A1 (fr) 2019-04-04

Family

ID=65903076

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/036406 Ceased WO2019066014A1 (fr) 2017-09-29 2018-09-28 Composition de polissage, procédé de production d'une composition de polissage, et procédé de polissage

Country Status (2)

Country Link
JP (1) JPWO2019066014A1 (fr)
WO (1) WO2019066014A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210332264A1 (en) * 2020-04-23 2021-10-28 Fujimi Corporation Novel polishing vehicles and compositions with tunable viscosity
WO2022210744A1 (fr) 2021-03-31 2022-10-06 株式会社フジミインコーポレーテッド Composition de polissage, procédé de fabrication de composition de polissage et procédé de polissage
CN115519438A (zh) * 2022-09-26 2022-12-27 湖南银山竹业有限公司 一种竹制餐具成型机
WO2024128192A1 (fr) * 2022-12-14 2024-06-20 ニッタ・デュポン株式会社 Composition de polissage
WO2025105368A1 (fr) * 2023-11-17 2025-05-22 株式会社フジミインコーポレーテッド Composition de polissage et procédé de polissage

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114227529B (zh) * 2021-12-06 2023-09-15 河南联合精密材料股份有限公司 一种蓝宝石晶片减薄加工用树脂研磨垫及其制备方法
CN114260815A (zh) * 2021-12-31 2022-04-01 华侨大学 基于机器人的高世代线玻璃基板抛光系统及其抛光方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000282011A (ja) * 1999-03-30 2000-10-10 Soft 99 Corporation:Kk バフ研摩用組成物
JP2004359831A (ja) * 2003-06-05 2004-12-24 Ishihara Chem Co Ltd 研磨組成物
JP2008255232A (ja) * 2007-04-05 2008-10-23 Soft99 Corporation 研磨剤組成物
JP6099067B1 (ja) * 2016-04-26 2017-03-22 株式会社フジミインコーポレーテッド 研磨用組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000282011A (ja) * 1999-03-30 2000-10-10 Soft 99 Corporation:Kk バフ研摩用組成物
JP2004359831A (ja) * 2003-06-05 2004-12-24 Ishihara Chem Co Ltd 研磨組成物
JP2008255232A (ja) * 2007-04-05 2008-10-23 Soft99 Corporation 研磨剤組成物
JP6099067B1 (ja) * 2016-04-26 2017-03-22 株式会社フジミインコーポレーテッド 研磨用組成物

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210332264A1 (en) * 2020-04-23 2021-10-28 Fujimi Corporation Novel polishing vehicles and compositions with tunable viscosity
WO2022210744A1 (fr) 2021-03-31 2022-10-06 株式会社フジミインコーポレーテッド Composition de polissage, procédé de fabrication de composition de polissage et procédé de polissage
CN115519438A (zh) * 2022-09-26 2022-12-27 湖南银山竹业有限公司 一种竹制餐具成型机
WO2024128192A1 (fr) * 2022-12-14 2024-06-20 ニッタ・デュポン株式会社 Composition de polissage
WO2025105368A1 (fr) * 2023-11-17 2025-05-22 株式会社フジミインコーポレーテッド Composition de polissage et procédé de polissage

Also Published As

Publication number Publication date
JPWO2019066014A1 (ja) 2020-11-26

Similar Documents

Publication Publication Date Title
WO2019066014A1 (fr) Composition de polissage, procédé de production d'une composition de polissage, et procédé de polissage
JP5935865B2 (ja) 炭化ケイ素単結晶基板の製造方法
US8398878B2 (en) Methods for producing and processing semiconductor wafers
JP6099067B1 (ja) 研磨用組成物
TWI481680B (zh) 用於鎳－磷記憶碟之拋光組合物
US20090045410A1 (en) GaN SUBSTRATE AND SEMICONDUCTOR DEVICE PREPARED BY USING METHOD AND APPARATUS OF POLISHING GaN SUBSTRATE
TW201313885A (zh) 研磨劑及研磨方法
CN104416450A (zh) 用于抛光蓝宝石表面的化学机械抛光组合物及其使用方法
TWI433903B (zh) 用於鎳－磷記憶碟之拋光組合物
TW201333176A (zh) 研磨用組成物
KR20150120980A (ko) 연마용 조성물
WO2022210744A1 (fr) Composition de polissage, procédé de fabrication de composition de polissage et procédé de polissage
JP7420728B2 (ja) 研磨パッド、及びそれを用いた研磨方法
TW201938748A (zh) 研磨用組成物、研磨用組成物之製造方法及研磨方法
WO2020054823A1 (fr) Tampon de polissage, outil de polissage, et procédé de polissage
JP7409820B2 (ja) ＩｎＰ半導体材料の研磨加工方法および研磨液
WO2018169041A1 (fr) Tampon de polissage, outil de polissage, et procédé de polissage
JP5024305B2 (ja) ＧａＮ基板の研磨方法
US20240227119A9 (en) Polishing pad and polishing method
JP2025082408A (ja) 研磨用組成物および研磨方法
WO2025105368A1 (fr) Composition de polissage et procédé de polissage
JP2022156010A (ja) 研磨装置及び研磨方法
JP5195966B2 (ja) ＧａＮ基板の研磨方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18863088

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2019545162

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18863088

Country of ref document: EP

Kind code of ref document: A1