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WO2019064385A1 - Composition de résine durcissable, dispositif d'affichage d'image, et procédé de production d'un dispositif d'affichage d'image - Google Patents

Composition de résine durcissable, dispositif d'affichage d'image, et procédé de production d'un dispositif d'affichage d'image Download PDF

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Publication number
WO2019064385A1
WO2019064385A1 PCT/JP2017/035008 JP2017035008W WO2019064385A1 WO 2019064385 A1 WO2019064385 A1 WO 2019064385A1 JP 2017035008 W JP2017035008 W JP 2017035008W WO 2019064385 A1 WO2019064385 A1 WO 2019064385A1
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WO
WIPO (PCT)
Prior art keywords
curable resin
image display
resin composition
group
meth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2017/035008
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English (en)
Japanese (ja)
Inventor
高木　俊輔
祐樹 宮本
中西　良一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to PCT/JP2017/035008 priority Critical patent/WO2019064385A1/fr
Priority to TW107132858A priority patent/TW201925390A/zh
Publication of WO2019064385A1 publication Critical patent/WO2019064385A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/81—Unsaturated isocyanates or isothiocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/14—Unsaturated oxiranes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/442—Block-or graft-polymers containing polysiloxane sequences containing vinyl polymer sequences
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods

Definitions

  • the present invention relates to a curable resin composition, an image display device, and a method of manufacturing the image display device.
  • An image display device used in an information terminal such as a smart phone or a portable terminal includes an image display unit (including a liquid crystal panel, a cover glass, etc.) having an image display surface, and a frame unit for supporting the same. Conventionally, it is manufactured by bonding and fixing the image display unit and the frame unit with a pressure sensitive adhesive tape.
  • a black pressure-sensitive adhesive tape having a light-shielding property is generally used in order to prevent deterioration of the image quality due to light leakage from between the image display unit and the frame unit (for example, patent Literature 1). Further, also in an image display apparatus provided with a large display such as a large OLED (organic EL) television, the above-described pressure-sensitive adhesive tape is used for bonding the image display unit and the frame unit.
  • Patent No. 5658072 gazette
  • An image display device such as a large OLED (organic EL) television has, for example, an image display unit made of glass and a frame unit made of metal, but there is a difference between the thermal expansion coefficients of the two, and the drive temperature is reached. Then, due to the difference in thermal expansion between the image display portion and the frame portion, stress is concentrated on the resin cured layer using the curable resin composition as described above, and there is a disadvantage that adhesion may not be maintained.
  • the present invention has been made in view of the problems of the above-mentioned prior art, and when manufacturing an image display device, the image display portion and the frame portion can be efficiently bonded to each other even in a narrow region, and A curable resin composition that can be used to form a cured resin layer capable of maintaining adhesion even if there is a thermal expansion difference between a display unit and a frame unit, an image display device and an image using the same It aims at providing a manufacturing method of a display.
  • the first aspect of the present invention comprises a radical photopolymerization initiator, a monomer component, a photoacid generator and a filler, and the above monomer component comprises one radically polymerizable group
  • the present invention relates to a curable resin composition containing a monomer having a cyclic ether group.
  • the second aspect of the present invention comprises a radical photopolymerization initiator, a monomer component, a photoacid generator, a compound having a cyclic ether group, and a filler, and the above monomer component contains
  • the present invention relates to a curable resin composition containing a monomer having one radically polymerizable group.
  • the third aspect of the present invention contains a photoinitiator, a monomer component, and a filler, and the photoinitiator is a radical photopolymerization initiator, or radical photopolymerization initiator and photobase generation.
  • the present invention relates to a curable resin composition containing an agent, wherein the monomer component comprises a monomer having one radically polymerizable group and a silanol group and / or an alkoxysilyl group.
  • a fourth aspect of the present invention comprises a photoinitiator, a monomer component, a compound having a silanol group and / or an alkoxysilyl group, and a filler, and the above-mentioned photoinitiator initiates photo radical polymerization
  • the present invention relates to a curable resin composition comprising an agent, or a radical photopolymerization initiator and a photobase generator, wherein the monomer component comprises a monomer having one radically polymerizable group.
  • a single radical which comprises a radical photopolymerization initiator, a monomer component and a filler, and the monomer component has one radically polymerizable group and an isocyanate group.
  • the present invention relates to a curable resin composition containing a monomer.
  • a sixth aspect of the present invention contains a radical photopolymerization initiator, a monomer component, a compound having two or more isocyanate groups, and a filler, and the above monomer component contains one radical polymerization.
  • the present invention relates to a curable resin composition containing a monomer having a functional group.
  • the composition is applied to the image display portion or frame portion of the image display device to form a frame-shaped curable resin layer, and the curable resin layer is activated with respect to the curable resin layer.
  • the image display unit and the frame unit can be efficiently bonded to each other even in a narrow area by a simple method of bonding the image display unit and the frame unit together, and the image display unit and the frame It is possible to form a cured resin layer capable of maintaining adhesion even if there is a difference in thermal expansion between it and the part.
  • the present inventors consider the reason why the above effect is exerted as follows.
  • the formation of the polymer chain by the photoradical polymerization of the radically polymerizable group is followed by the cationic reaction of the cyclic ether group
  • the curing reaction of the curable resin layer can be advanced.
  • the curable resin layer can achieve both the elastic modulus suitable for bonding by irradiation of active energy rays and a sufficient curing rate after bonding, even if it is a fine bonding surface It is possible to form a resin cured layer capable of obtaining an adhesive force capable of suppressing the dropping impact and the peeling and floating due to the repulsive force of a member (for example, a flexible printed circuit (FPC)) constituting the image display device.
  • a member for example, a flexible printed circuit (FPC)
  • a curable resin composition having a delayed curing property that can be further cured after bonding to improve adhesion as described above has a high aspect ratio coating because it is flexible at the initial stage. It tends to be difficult to form a film. Therefore, when the image display portion and the frame portion are pasted together using a curable resin composition having a delayed curing property, the resin cured layer can not absorb the difference in thermal expansion between the two, and the image display portion and the frame portion The present inventors have found that peeling may occur in between.
  • the curable resin composition which concerns on said 1st and 2nd side can form the coating film of a high aspect ratio on an image display part or a flame
  • the resin cured layer formed by curing the coating film has a high aspect ratio, it is possible to absorb the difference in thermal expansion between the image display portion and the frame portion and maintain the adhesion.
  • the filler in the curable resin composition having the specific composition having the delayed curing property the image display portion and the frame portion can be efficiently bonded to each other even in a narrow region, and an image Even if there is a thermal expansion difference between the display portion and the frame portion, it is possible to achieve both the effect of being able to maintain the adhesive strength.
  • FIG. 9 is a view for explaining the case where the image display unit and the frame unit are adhered using the curable resin composition containing no filler.
  • a curable resin composition is applied onto the image display unit 70 to form a curable resin layer 90.
  • the curable resin composition is flexible, a curable resin layer 90 with a low aspect ratio is formed.
  • the aspect ratio of the curable resin layer 90 is the height when the height is h and the width is w in the cross section of the curable resin layer 90 perpendicular to the direction in which the curable resin layer 90 extends. It is a ratio (h / w) of h and width w. In addition, h and w are the same units, for example, are mm.
  • the curable resin layer 90 is irradiated with the active energy ray hv to advance the curing reaction.
  • the image display unit 70 and the frame unit 80 are attached to each other while interposing the curable resin layer 92 in which the curing reaction has proceeded.
  • the curing reaction proceeds in the curable resin layer 92, whereby the resin cured layer 94 is formed.
  • the fabrication of the image display device is finally completed.
  • the obtained image display device reaches the driving temperature, thermal expansion occurs in the image display unit 70 and the frame unit 80, and thermal expansion of the image display unit 70 and the frame unit 80 as shown in (e) of FIG. From the difference, stress concentrates on the resin cured layer 94.
  • the adhesion state between the image display unit 70 and the frame unit 80 can not be maintained, and peeling occurs.
  • FIG. 8 is a view for explaining the case where the image display unit and the frame unit are adhered using the curable resin composition of the present invention.
  • a curable resin composition is applied onto the image display unit 70 to form a curable resin layer 90.
  • the curable resin composition contains a filler, a curable resin layer 90 having a high aspect ratio (h / w) obtained from the height h and the width w shown in FIG. 8A is formed. Be done.
  • the curable resin layer 90 is irradiated with the active energy ray hv to advance the curing reaction.
  • the image display unit 70 and the frame unit 80 are attached to each other while interposing the curable resin layer 92 in which the curing reaction has proceeded. Thereafter, as shown in (d) of FIG. 8, the curing reaction proceeds in the curable resin layer 92 to form a resin cured layer 94.
  • the fabrication of the image display device is finally completed.
  • the obtained image display device reaches the driving temperature, thermal expansion occurs in the image display unit 70 and the frame unit 80, and thermal expansion of the image display unit 70 and the frame unit 80 as shown in (e) of FIG. From the difference, stress concentrates on the resin cured layer 94.
  • the cured resin layer 90 formed using the curable resin composition of the present invention has a high aspect ratio of the curable resin layer 90 and the curable resin layer 92 in which the curing reaction has proceeded, the image display portion The difference in thermal expansion between the frame 70 and the frame 80 can be absorbed, and the adhesive state can be maintained.
  • the curable resin composition which concerns on the said 3rd and 4th side, it can be accelerated
  • the curing reaction of the curable resin layer can be advanced by the ionic reaction (hydrolysis reaction) of the silanol group and / or the alkoxysilyl group with moisture (moisture). And, the ion reaction proceeds at a relatively slower reaction rate than the radical polymerization reaction.
  • the curable resin layer can achieve both the elastic modulus suitable for bonding by irradiation of active energy rays and a sufficient curing rate after bonding, even if it is a fine bonding surface It is possible to form a resin cured layer capable of obtaining an adhesive force capable of suppressing the dropping impact and the peeling and floating due to the repulsive force of a member (for example, a flexible printed circuit (FPC)) constituting the image display device.
  • a member for example, a flexible printed circuit (FPC) constituting the image display device.
  • the curable resin composition contains a filler
  • the cured resin layer absorbs the difference in thermal expansion between the image display portion and the frame portion to maintain the adhesive strength for the same reason as described above. it can.
  • the curable resin composition according to the fifth and sixth aspects by having the above-described configuration, due to moisture (moisture) following formation of a polymer chain by photo radical polymerization of a radically polymerizable group
  • the curing reaction of the curable resin layer can be advanced by the ionic reaction of the isocyanate group. And, the ion reaction proceeds at a relatively slower reaction rate than the radical polymerization reaction.
  • the curable resin layer can achieve both the elastic modulus suitable for bonding by irradiation of active energy rays and a sufficient curing rate after bonding, even if it is a fine bonding surface It is possible to form a resin cured layer capable of obtaining an adhesive force capable of suppressing the dropping impact and the peeling and floating due to the repulsive force of a member (for example, a flexible printed circuit (FPC)) constituting the image display device.
  • a member for example, a flexible printed circuit (FPC) constituting the image display device.
  • the curable resin composition contains a filler
  • the cured resin layer absorbs the difference in thermal expansion between the image display portion and the frame portion to maintain the adhesive strength for the same reason as described above. it can.
  • the content of the filler may be 1 to 50% by mass with respect to the total amount of the curable resin composition.
  • the content of the filler is in the above range, a resin cured layer having a sufficiently high aspect ratio can be formed while having sufficient adhesive strength.
  • the said curable resin composition can further contain a coloring agent. According to such a curable resin composition, it is possible to efficiently form the light shielding layer having excellent light leakage prevention even in a narrow region.
  • the curable resin composition may further contain a polymer.
  • the curable resin composition contains a polymer
  • the curable resin layer after being irradiated with an active energy ray has pressure-sensitive adhesiveness that facilitates the bonding of the image display portion and the frame portion. You can easily.
  • the said curable resin composition can express pressure-sensitive adhesiveness, when an active energy ray is irradiated.
  • the curable resin composition according to the present invention can be used for forming a light shielding layer.
  • the present invention relates to the application of the curable resin composition according to the first to sixth aspects to form a light shielding layer.
  • Another aspect of the present invention is an image display unit having an image display surface, a frame unit provided around the image display unit and supporting the image display unit, and between the frame unit and the image display unit
  • the present invention relates to an image display device including the formed resin cured layer, wherein the resin cured layer is a cured product of a curable resin layer made of the curable resin composition according to the present invention.
  • Another aspect of the present invention is an image display unit having an image display surface, a frame unit provided around the image display unit and supporting the image display unit, and between the frame unit and the image display unit A method of manufacturing an image display device including the formed resin cured layer, wherein the curable resin composition according to the present invention is applied to the image display portion or the frame portion, and a frame-like curing is performed.
  • a step of forming a conductive resin layer, a step of advancing a curing reaction of the curable resin layer by irradiating the curable resin layer with an active energy ray, and interposing the curable resin layer The present invention relates to a method including the step of bonding an image display unit and the frame unit in this order, and the resin cured layer is the curable resin layer in which a curing reaction has proceeded.
  • an image display device According to the method of manufacturing an image display device according to the present invention, even in a narrow region, light leakage from between the image display unit and the frame unit can be sufficiently suppressed, and the image display unit and the frame unit It is possible to efficiently manufacture an image display device provided with a resin cured layer capable of maintaining adhesion even if there is a thermal expansion difference between them.
  • the aspect ratio (h / w) determined from the height h (unit: mm) and the width w (unit: mm) in the cross section perpendicular to the extending direction of the curable resin layer is It may be 0.3 to 1.0. If the aspect ratio (h / w) is within the above range, a cured resin layer can be formed which can maintain adhesion sufficiently even if there is a difference in thermal expansion between the image display portion and the frame portion. it can.
  • the image display unit and the frame unit may be bonded to each other such that the aspect ratio represented by the following equation is 0.4 or more.
  • Aspect ratio B '/ A' [Wherein, A ′ represents the width (unit: mm) at a predetermined portion of the frame-shaped curable resin layer applied to one of the image display portion and the frame portion, and B ′ represents The width (unit: mm) in contact with the other of the image display portion and the frame portion at the predetermined portion of the curable resin layer after the image display portion and the frame portion are attached to each other Show. ]
  • the thickness of the resin cured layer may be 0.3 to 1.5 mm. If the thickness of the resin cured layer is within the above range, the adhesive strength can be maintained more sufficiently even if there is a thermal expansion difference between the image display portion and the frame portion.
  • the above method may further include the step of further advancing the curing reaction of the curable resin layer after the step of bonding the image display portion and the frame portion.
  • the resin cured layer can bond the image display portion and the frame portion with higher adhesive force, and further, it is possible to obtain an image display device provided with the resin cured layer excellent in light leakage prevention.
  • the present invention it is possible to efficiently bond the image display unit and the frame unit even in a narrow area, and maintain adhesion even if there is a thermal expansion difference between the image display unit and the frame unit. It is possible to provide a curable resin composition that can be used to form a cured resin layer that can be used, an image display using the same, and a method of manufacturing the image display.
  • FIG. 1 is a cross-sectional view showing an embodiment of an image display device.
  • FIG. 7 is a perspective view of an embodiment of a method of manufacturing an image display device.
  • FIG. 7 is a perspective view of an embodiment of a method of manufacturing an image display device.
  • FIG. 7 is a perspective view of an embodiment of a method of manufacturing an image display device.
  • FIG. 7 is a perspective view of an embodiment of a method of manufacturing an image display device. It is a figure for demonstrating the method to measure the pressure sensitive adhesive force of a curable resin layer. It is a figure for demonstrating the method to measure the aspect ratio in bonding of a curable resin layer.
  • (meth) acrylate means “acrylate” and the corresponding "methacrylate”.
  • (meth) acrylic means “acrylic” and the corresponding "methacrylic”
  • (meth) acryloyl means “acryloyl” and the corresponding "methacryloyl”.
  • the term “layer” includes the structure of a shape formed in part, in addition to the structure of a shape formed on the entire surface when observed as a plan view.
  • the term “process” is not limited to an independent process, but may be used in this term if the intended function of the process is achieved even if it can not be clearly distinguished from other processes. included.
  • a numerical range indicated by using “to” indicates a range including numerical values described before and after “to” as the minimum value and the maximum value, respectively.
  • “A or B” should just contain either A and B, and may contain both.
  • each component in the composition is the total of the plurality of substances present in the composition unless a plurality of substances corresponding to each component are present in the composition. Means quantity.
  • an exemplary material may be used independently and may be used in combination of 2 or more type.
  • the upper limit or the lower limit of the numerical range of one step may be replaced with the upper limit or the lower limit of the numerical range of another step.
  • the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the example.
  • the curable resin composition of the present embodiment is any of the following (1-1), (1-2), (2-1), (2-2), (3-1) or (3-2)
  • Photoradical polymerization initiator hereinafter, also referred to as "(1-A) component
  • monomer component hereinafter, also referred to as “(1-B) component
  • photoacid generator hereinafter, also referred to as “(1-C) component
  • filler hereinafter, “(X) component”
  • the monomer component contains one radically polymerizable group and a cyclic ether group
  • a first curable resin composition comprising a monomer having the following formula (hereinafter, also referred to as "component (1-B1)").
  • Photo radical polymerization initiator hereinafter, also referred to as "(1-A) component
  • monomer component hereinafter, also referred to as “(1-B) component
  • photo acid generator hereinafter also referred to as “(1-C) component”
  • a compound having a cyclic ether group hereinafter also referred to as “(1-D) component
  • filler hereinafter “(X) component
  • a second curable resin composition containing a monomer having one radically polymerizable group hereinafter, also referred to as “(1-B2) component
  • Photoinitiator hereinafter, also referred to as “(2-A) component”
  • monomer component hereinafter, also referred to as “(2-B) component”
  • filler hereinafter, “( Component X)
  • the photoinitiator is a photo radical polymerization initiator (hereinafter also referred to as “(2-A1) component”), or a photo radical polymerization initiator and a photo base generator (hereinafter A monomer (also referred to as “(2-A2) component”), and the monomer component has one radically polymerizable group and a silanol group and / or an alkoxysilyl group (hereinafter referred to as “(2- B1) A third curable resin composition containing "component”.
  • Photoinitiator (hereinafter also referred to as "(2-A) component"), monomer component (hereinafter also referred to as “(2-B) component”), silanol group and / or alkoxy
  • a compound having a silyl group (hereinafter, also referred to as “(2-C) component”) and a filler (hereinafter, “(X) component”) is contained, and a photoinitiator is a photo radical polymerization initiator (hereinafter Or “(2-A1) component” or a photo radical polymerization initiator and a photo base generator (hereinafter also referred to as “(2-A2) component”), and the monomer component is one.
  • a fourth curable resin composition comprising a monomer having a radically polymerizable group (hereinafter also referred to as "(2-B2) component”).
  • (3-1) Photoradical polymerization initiator hereinafter, also referred to as “(3-A) component
  • monomer component hereinafter, also referred to as “(3-B) component
  • filler hereinafter, "(3) A monomer (hereinafter, also referred to as “(3-B1) component”) which contains “(X) component” and the monomer component has one radically polymerizable group and an isocyanate group 5th curable resin composition containing.
  • (3-2) Photo radical polymerization initiator hereinafter also referred to as “(3-A) component”
  • monomer component hereinafter also referred to as “(3-B) component”
  • isocyanate group The compound (hereinafter, also referred to as “(3-C) component”) having the above and a filler (hereinafter, “(X) component”) are contained, and the monomer component contains one radically polymerizable group.
  • the 6th curable resin composition containing the monomer to have hereeafter, it is also mentioned "(3-B2) component").
  • Photo Radical Polymerization Initiator is a component that generates free radicals by irradiation of active energy rays and promotes the curing reaction (polymerization reaction) by radical polymerization of monomer components.
  • the active energy ray can be selected from ultraviolet rays, electron beams, alpha rays, beta rays and the like.
  • photo radical polymerization initiators include benzophenone, N, N'-tetramethyl-4,4'-diaminobenzophenone (Michler's ketone), N, N-tetraethyl-4,4'-diaminobenzophenone, 4-methoxy- 4,4'-Dimethylaminobenzophenone, ⁇ -hydroxyisobutylphenone, 2-ethylanthraquinone, tert-butylanthraquinone, 1,4-dimethylanthraquinone, 1-chloroanthraquinone, 2,3-dichloroanthraquinone, 3-chloro-2-chloroanthraquinone Methylanthraquinone, 1,2-benzoanthraquinone, 2-phenylanthraquinone, 1,4-naphthoquinone, 9,10-phenanthraquinone, thioxanth
  • a radical photopolymerization initiator may be used individually by 1 type, and may be used in combination of 2 or more type.
  • the photoradical polymerization initiator may be selected from aromatic ketone compounds, ⁇ -hydroxyalkylphenone compounds, and phenylglyoxylic acid methyl esters from the viewpoints of curability, reactivity, and surface curability.
  • the photo radical polymerization initiator may be a compound which generates both a free radical and a base (for example, a secondary amino group, a tertiary amino group) by irradiation of active energy rays.
  • a free radical and a base for example, a secondary amino group, a tertiary amino group
  • photo radical polymerization initiators include (4-morpholinobenzoyl) -1-benzyl-1-dimethylaminopropane ("IRGACURE 369", manufactured by BASF Japan Ltd.), 4- (methylthiobenzoyl) -1-methyl-1-morpholinoethane (“IRGACURE 907”, manufactured by BASF Japan Ltd.), 2- (dimethylamino) -2-[(4-methylphenyl) methyl] -1- [4- (4-) ⁇ -Aminoacetophenone compounds such as morpholinyl) phenyl] -1-butanone (“IRGACURE 379”, manufactured by BASF Japan Ltd
  • the content of the radical photopolymerization initiator in the first and second curable resin compositions is curable from the viewpoints of pressure-sensitive adhesion, reliability, and curability, and from the viewpoint of efficiently promoting the curing reaction. It may be 2 mass% or more, 4 mass% or more, or 6 mass% or more, 14 mass% or less, 12 mass% or less, or 10 mass% or less based on the total amount of the resin composition. .
  • Component (1-B) Monomer Component
  • Examples of the radically polymerizable group of component (1-B1) include (meth) acryloyl group, vinyl group, ethynyl group, isopropenyl group, vinyl ether group and vinyl thioether group.
  • the component (1-B1) examples include glycidyl (meth) acrylate, 3,4-epoxycyclohexylmethyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate glycidyl ether, propylene oxide (PO) -modified bisphenol A diglycidyl Ether diacrylate, novolak partial epoxy acrylate, acrylic acid adduct of bisphenol A diglycidyl ether, 3-oxetanyl methyl (meth) acrylate, 3-methyl-3-oxetanyl methyl (meth) acrylate, 3-ethyl-3-oxetanyl methyl (Meth) acrylate, 3-butyl-3-oxetanylmethyl (meth) acrylate, 3-hexyl-3-oxetanylmethyl (meth) acrylate.
  • the component (1-B1) may be allyl glycidyl ether.
  • the (1-B1) components can be used alone or in combination of two or more.
  • the content of the component (1-B1) is relative to the total amount of the curable resin composition from the viewpoint of reactivity, the viewpoint of improving the adhesive strength, and the stability when the curable resin composition is a solution.
  • the amount may be 0.1 mass% or more, 1 mass% or more, or 3 mass% or more, or 15 mass% or less, 10 mass% or less, or 5 mass% or less.
  • Examples of the component (1-B2) include monofunctional monomers having one radically polymerizable group.
  • Examples of the radically polymerizable group of the component (1-B2) include (meth) acryloyl, vinyl, ethynyl, isopropenyl, vinyl ether and vinyl thioether groups.
  • the monofunctional monomer may be a compound having a (meth) acryloyl group.
  • the monofunctional monomer having a (meth) acryloyl group may be an alkyl (meth) acrylate, and the carbon number of the alkyl group in that case is 4 from the viewpoint of imparting flexibility to the curable resin composition.
  • the number may be 6 or more, or 8 or more, or 20 or less, 18 or less, or 16 or less.
  • the alkyl group of the alkyl (meth) acrylate may have a substituent such as a hydroxyl group.
  • the monofunctional monomer having a (meth) acryloyl group include n-butyl (meth) acrylate, tert-butyl (meth) acrylate, isobutyl (meth) acrylate, n-pentyl (meth) acrylate and n- Octyl (meth) acrylate, isooctyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isodecyl (meth) acrylate, n-hexyl (meth) acrylate, stearyl (meth) acrylate, lauryl (meth) acrylate, tridecyl (meth) Alkyl (meth) acrylates such as acrylate; 2-hydroxyethyl (meth) acrylate, 1-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate
  • hydroxyl group-containing (meth) acrylamides such as hydroxyethyl (meth) acrylamide; diethylene glycol, triethylene Polyethylene glycol mono (meth) acrylates such as glycol; dipropylene glycol mono (meth) acrylate, tripropylene glycol mono (meth) acrylate Polypropylene glycol mono (meth) acrylates; polybutylene glycol mono (meth) acrylates such as dibutylene glycol mono (meth) acrylate and tributylene glycol mono (meth) acrylate; morpholine group-containing (meth) acrylates such as acryloyl morpholine; Examples thereof include cyclopentanyl (meth) acrylate, dicyclopentenyl oxyethyl (meth) acrylate, dicyclopentenyl oxyethyl methacrylate, and isobornyl (meth) acrylate.
  • monofunctional monomers are dicyclopentanyl (meth) acrylate and dicyclopentenyl (meth) acrylate And compounds selected from isobornyl (meth) acrylates, or compounds selected from dicyclopentenyl (meth) acrylates and isobornyl (meth) acrylates.
  • one type may be used alone, or two or more types may be used in combination.
  • the component (1-B) can include one or more components (1-B2) in addition to the component (1-B1).
  • the component (1-B2) is a compound other than the component (1-B1).
  • the content of the component (1-B2) is from the viewpoint of obtaining a curable resin composition having an appropriate viscosity, from the viewpoint of curing shrinkage and adjustment of the modulus of elasticity of a cured product, and dissolution of the coloring agent blended if necessary. It may be 10 mass% or more, 15 mass% or more, or 20 mass% or more, 80 mass% or less, 70 mass% or less, or 60 mass% of the total amount of the curable resin composition from the viewpoint of elasticity. It may be% or less.
  • the content of the component (1-B2) is 10% by mass or more, a curable resin composition having an appropriate viscosity which contributes to good coatability can be easily obtained, and a coloring agent to be blended if necessary It tends to improve the solubility of When the content of the component (1-B2) is 80% by mass or less, the cure shrinkage tends to be low. When the cure shrinkage rate is low, it is possible to suppress the decrease in adhesion due to stress.
  • the monomer component of the component (1-B) may further contain a polyfunctional monomer having two or more radically polymerizable groups.
  • the content of the polyfunctional monomer may be 5% by mass or less based on the total amount of the monomer components (component (1-B)).
  • the component (1-C) can be a compound that changes its molecular structure or is cleaved by irradiation with active energy rays to form one or more acidic substances that can function as a curing catalyst for ionic reaction .
  • the (1-C) component can function as a curing catalyst for the cationic reaction of the (1-B1) component and the (1-D) component.
  • Examples of the component (1-C) include onium salt compounds, sulfone compounds, sulfonic acid ester compounds, sulfoneimide compounds, disulfonyldiazomethane compounds, disulfonylmethane compounds, oxime sulfonate compounds, hydrazine sulfonate compounds, triazine compounds, nitrobenzyl compounds Compounds, organic halides and disulfones can be mentioned.
  • Examples of commercial products of photoacid generators include trade names “Cyracure UVI-6970”, “Cyracure UVI-6974”, “Cyracure UVI-6990”, and “Cyracure UVI-950” (above, manufactured by Union Carbide Corporation of the United States) “IRGACURE 250”, “IRGACURE 261”, “IRGACURE 264”, “IRGACURE 270”, “IRGACURE 290” (above, made by BASF Japan Ltd.), “CG-24-61” (made by Ciba Geigy), “Adeka Optomer SP-150", “Adeka Optomer SP-151”, “Adeka Optomer SP-170", “Adeka Optomer SP-171” (above, made by ADEKA), “DAICAT II” (Made by Daicel Co., Ltd.), “UVAC 1590”, “UVAC 1591” Cell Ornex Co., Ltd.
  • the (1-C) component can be used alone or in combination of two or more.
  • the content of the component (1-C) is 2% by mass with respect to the total amount of the curable resin composition from the viewpoints of pressure-sensitive adhesiveness, reliability, and curability, and from the viewpoint of efficiently promoting the curing reaction. %, 4 mass% or more, or 6 mass% or more may be sufficient, 14 mass% or less, 12 mass% or less, or 10 mass% or less.
  • the compound which has an epoxy group and / or an oxetane group is mentioned, for example.
  • Specific examples of these compounds include glycidyl ether, butyl glycidyl ether, 2-ethylhexyl glycidyl ether, stearyl glycidyl ether, lauryl glycidyl ether, butoxy polyethylene glycol glycidyl ether, phenol polyethylene glycol glycidyl ether, phenyl glycidyl ether, p-methylphenyl Monofunctional epoxy compounds such as glycidyl ether, p-ethylphenyl glycidyl ether, p-sec-butylphenyl glycidyl ether, p-tert-butylphenyl glycidyl; bisphenol A diglycidyl ether, bisphenol F dig
  • the (1-D) components can be used alone or in combination of two or more.
  • the content of the component (1-D) in the second curable resin composition of the present embodiment is from the viewpoint of reactivity, the viewpoint of improving the adhesive strength, and the stability when the curable resin composition is a solution. From the viewpoint of the total amount of the curable resin composition, it may be 1 mass% or more, 5 mass% or more, or 10 mass% or more, 70 mass% or less, 50 mass% or less, or 30 mass% It may be the following.
  • the first curable resin composition of the present embodiment can further include a (1-D) component.
  • the content of the component (1-D) is 0.1% by mass or more, 1% by mass or more, or 3% by mass or more based on the total amount of the curable resin composition from the viewpoint of curability. From the viewpoint of storage stability, it may be 15% by mass or less, 10% by mass or more, or 5% by mass or less based on the total amount of the curable resin composition.
  • a coating film having a high aspect ratio can be formed.
  • cured material of a curable resin composition, etc. can be controlled by a filler.
  • filler inorganic fillers, whiskers, resin fillers and the like can be used. Moreover, a filler may be used individually by 1 type, and may use 2 or more types together.
  • the inorganic filler may be an insulating inorganic filler.
  • the material of the insulating inorganic filler include glass, silica, alumina, titanium oxide, carbon black, mica and boron nitride. Among these, silica, alumina, titanium oxide and boron nitride are preferable, and silica, alumina and boron nitride are more preferable.
  • the average primary particle diameter of the inorganic filler is preferably 100 nm or less, more preferably 80 nm or less, and still more preferably 50 nm or less. If the average primary particle size is 100 nm or less, the UV curing of the curable resin composition is not inhibited, and it tends to be advantageous for imparting thixotropy.
  • the inorganic filler is preferable because the smaller the average primary particle size, the more the UV curability and thixotropy of the curable resin composition can be improved, but from the viewpoint of productivity, the average primary particle size is 1 nm or more, 10 nm or more, or , 20 nm or more.
  • the thermal expansion coefficient of silica is preferably 5.0 ⁇ 10 ⁇ 6 / ° C. or less.
  • the silica is preferably silica such as fused spherical silica, fumed silica, sol-gel silica, and more preferably fumed silica or sol-gel silica.
  • the silica is preferably silica (nano silica) having an average primary particle diameter of 5 to 100 nm.
  • a well-known particle size distribution analyzer When measuring the particle diameter of an inorganic filler, a well-known particle size distribution analyzer can be used.
  • a particle size distribution analyzer a laser diffraction scattering type particle size distribution analyzer which obtains particle size distribution by calculation from the intensity distribution pattern of diffracted light and scattered light emitted from the particle group by irradiating the particle group with laser light; by dynamic light scattering method The particle size distribution meter etc. of the nanoparticle which ask for particle size distribution using frequency analysis are mentioned.
  • the whiskers include, for example, aluminum borate, aluminum titanate, zinc oxide, calcium silicate, magnesium sulfate and boron nitride.
  • the filler which consists of resin, such as a polyurethane and a polyimide, is mentioned, for example.
  • the resin filler it is possible to easily adjust the viscosity of the curable resin composition. Moreover, the resin filler is excellent in the function which relieves stress compared with an inorganic filler.
  • the inorganic filler has a smaller coefficient of thermal expansion than the resin filler, according to the inorganic filler, the thermal expansion coefficient of the curable resin composition can be reduced.
  • many of the inorganic fillers are general-purpose products whose particle size is controlled, and therefore are preferable for viscosity adjustment.
  • the inorganic filler is more likely to form a coating film having a high aspect ratio as compared to the resin filler.
  • each of the resin filler and the inorganic filler has an advantageous effect, and either one may be used according to the application, or both may be mixed and used in order to exhibit both functions.
  • the filler may be one whose physical properties have been appropriately adjusted by surface treatment.
  • the content of the filler is 1% by mass or more, 10% by mass or more, or 20% by mass or more from the viewpoint of facilitating formation of a coating film having a high aspect ratio with respect to the total amount of the curable resin composition It may be 70% by mass or less, 50% by mass or less, or 30% by mass or less from the viewpoints of pressure-sensitive adhesiveness, reliability, and curability, and a viewpoint of efficiently promoting the curing reaction.
  • Photoinitiator is a photo radical polymerization initiator (hereinafter, also referred to as "(2-A1) component”), or a photo radical polymerization initiator and a photo base generator (hereinafter, It can also include "(2-A2) component”.
  • component (2-A1) the same components as the components (1-A) described above can be used.
  • the content of the component (2-A1) in the third and fourth curable resin compositions is cured from the viewpoints of pressure-sensitive adhesiveness, reliability, and curability, and from the viewpoint of efficiently promoting the curing reaction. % Or more, 4% by mass or more, or 6% by mass or more, 14% by mass or less, 12% by mass or less or 10% by mass or less based on the total amount of the functional resin composition Good.
  • a photobase generator which is a component (2-A2)
  • the molecular structure is changed or the molecule is cleaved by irradiation of active energy rays, and it functions as a curing catalyst for ion reaction by silanol group and / or alkoxysilyl group.
  • generates one or more types of basic substances which can be mentioned is mentioned.
  • a photobase generator As such a photobase generator, a Co-amine complex photobase generator; a carbamic acid ester photobase generator; a quaternary ammonium salt photobase generator; an acyloxyimino group, an N-formylated aromatic amino acid It can also be selected from compounds having a group, N-acylated aromatic amino group, nitrobenzyl carbamate group, alkoxy benzyl carbamate group and the like.
  • the photobase generator include 9-anthrylmethyl N, N-diethylcarbamate, (E) -1- [3- (2-hydroxyphenyl) -2-propenoyl] piperidine, guanidinium 2- (3- (3-) Benzoylphenyl) propionate, 1- (anthraquinone-2-yl) ethyl imidazole carboxylate, 2-nitrophenylmethyl 4-methacryloyloxypiperidine-1-carboxylate, 1- (anthraquinone-2-yl) -ethyl N, N- Dicyclohexylcarbamate, dicyclohexylammonium 2- (3-benzoylphenyl) propionate, cyclohexylammonium 2- (3-benzoylphenyl) propionate, 9-anthrylmethyl N, N-dicyclohexylcarbamate, 1 2-Diisopropyl-3- [bis (dimethylamin
  • the content of the component (2-A2) in the third and fourth curable resin compositions is 2 mass% with respect to the total amount of the curable resin composition from the viewpoint of efficiently promoting the curing reaction by the ion reaction. %, 4 mass% or more, or 6 mass% or more may be sufficient, 14 mass% or less, 12 mass% or less, or 10 mass% or less.
  • the monomer component has one radically polymerizable group and a silanol group and / or an alkoxysilyl group. It can contain monomers.
  • the curing reaction can be advanced by the ionic reaction (hydrolysis reaction) in which the silanol group and the alkoxysilyl group involve moisture. This reaction can be promoted, for example, by a photobase generator or a base generated from a photoradical polymerization initiator that generates a base.
  • Examples of the radical polymerizable group possessed by the component (2-B1) include (meth) acryloyl group, vinyl group, ethynyl group, isopropenyl group, vinyl ether group and vinyl thioether group.
  • the component (2-B1) for example, 3-acryloxypropyltrimethoxysilane (trade name: KBM5103, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-methacryloxypropyltrimethoxysilane (trade name: KBM 503, Shin-Etsu Chemical Co., Ltd.)
  • the compound which has the (meth) acryloyl group and trialkoxy silyl groups, such as methacryloxy octyl trimethoxysilane (brand name: KBM5803, Shin-Etsu Chemical Co., Ltd. make), etc. are mentioned.
  • the component (2-B1) may be a compound having a (meth) acryloyl group and a dialkoxysilyl group
  • the (2-B1) components can be used alone or in combination of two or more.
  • the content of the component (2-B1) is relative to the total amount of the curable resin composition from the viewpoint of reactivity, the viewpoint of improving the adhesive strength, and the stability when the curable resin composition is a solution.
  • the amount may be 0.1 mass% or more, 1 mass% or more, or 3 mass% or more, or 15 mass% or less, 10 mass% or less, or 5 mass% or less.
  • component (2-B2) the same components as the components (1-B2) described above can be used.
  • the component (2-B) can include one or more components (2-B2) in addition to the component (2-B1).
  • the component (2-B2) is a compound other than the component (2-B1).
  • the content of the component (2-B2) is from the viewpoint of obtaining a curable resin composition having an appropriate viscosity, from the viewpoint of curing shrinkage and adjustment of the elastic modulus of the cured product, and dissolution of the coloring agent blended as necessary. It may be 10 mass% or more, 15 mass% or more, or 20 mass% or more, 80 mass% or less, 70 mass% or less, or 60 mass% of the total amount of the curable resin composition from the viewpoint of elasticity. It may be% or less.
  • the content of the component (2-B2) is 10% by mass or more, a curable resin composition having an appropriate viscosity which contributes to good coatability is easily obtained, and a coloring agent to be blended according to need It tends to improve the solubility of When the content of the component (2-B2) is 80% by mass or less, the cure shrinkage tends to be low. When the cure shrinkage rate is low, it is possible to suppress the decrease in adhesion due to stress.
  • the monomer component of the component (2-B) may further contain a polyfunctional monomer having two or more radically polymerizable groups.
  • the content of the polyfunctional monomer may be 5% by mass or less based on the total amount of the monomer components (component (2-B)).
  • a compound having a carboxylic acid anhydride group and a trimethoxysilyl group for example, “X-12-967C”, manufactured by Shin-Etsu Chemical Co., Ltd.), an isocyanurate group and a trimethoxy group
  • Compounds having a silyl group for example, "KBM 9659", manufactured by Shin-Etsu Chemical Co., Ltd.
  • compounds having an epoxy group and a trimethoxysilyl group for example, "KBM 403, manufactured by Shin-Etsu Chemical Co., Ltd.
  • mercapto group and tri Compounds having a trialkoxysilyl group such as compounds having a methoxysilyl group (for example, “KBM 803”, manufactured by Shin-Etsu Chemical Co., Ltd.); Dimethyldimethoxysilane, 3-glycidoxypropyldimethoxysilane, 3-mercaptopropylmethyldimethoxymethane
  • tetraalkoxysilane or their oligomers such tetrabutoxy silane.
  • the compound which has a silanol group and / or an alkoxy silyl group may be used individually by 1 type, and may be used in combination of 2 or more types.
  • a compound having a trialkoxysilyl group, a tetraalkoxysilane or an oligomer thereof may be selected.
  • a compound having a trialkoxysilyl group, a tetraalkoxysilane or an oligomer thereof, and a compound having a dialkoxysilyl group may be combined.
  • a partial hydrolyzate of at least one compound selected from a compound having a trialkoxysilyl group, a compound having a dialkoxysilyl group, and tetraalkoxysilane and its oligomer For example, partial hydrolyzate of tetramethoxysilane oligomer, partial hydrolyzate of tetraethoxysilane and dimethyldimethoxysilane); compound having trialkoxysilyl group, compound having dialkoxysilyl group, and tetraalkoxysilane and its oligomer
  • the reaction product of at least one selected with tetraalkoxytitanium and / or tetraalkoxyzirconium for example, the reaction product of tetramethoxysilane oligomer and tetrabutoxytitanium, tetraethoxysilane and tetrabutoxytitanium Reactant, a
  • a partial hydrolyzate of at least one compound selected from a compound having a trialkoxysilyl group, a compound having a dialkoxysilyl group, and tetraalkoxysilane and an oligomer thereof is selected. May be.
  • the component (2-C) may be an oligomer having a silanol group and / or an alkoxysilyl group.
  • one type may be used alone, or two or more types may be used in combination.
  • the content of the component (2-C) in the fourth curable resin composition of the present embodiment is the reactivity, the viewpoint of improving the adhesive strength, and the stability when the curable resin composition is a solution. From the viewpoint of the total amount of the curable resin composition, it may be 1 mass% or more, 5 mass% or more, or 10 mass% or more, 70 mass% or less, 50 mass% or less, or 30 mass% It may be the following.
  • the third curable resin composition of the present embodiment can further include a (2-C) component.
  • the content of the component (2-C) is 0.1% by mass or more, 1% by mass or more, or 3% by mass or more based on the total amount of the curable resin composition from the viewpoint of curability. From the viewpoint of storage stability, it may be 15% by mass or less, 10% by mass or more, or 5% by mass or less based on the total amount of the curable resin composition.
  • the third and fourth curable resin compositions contain the same fillers as those used for the first and second curable resin compositions.
  • component (3-A) the same components as the components (1-A) described above can be used.
  • the photo radical polymerization initiator may be a compound which generates both a free radical and a base (for example, a secondary amino group, a tertiary amino group) by irradiation of active energy rays.
  • the photo radical polymerization initiator may double as the photo base generator.
  • the generated base can accelerate the curing reaction of the curable resin composition by the ionic reaction of the isocyanate group with moisture (moisture).
  • Specific examples of the radical photopolymerization initiator that generates a base include the same ones as described for the component (1-A) described above.
  • a radical photopolymerization initiator may be used individually by 1 type, and may be used in combination of 2 or more type.
  • the content of the component (3-A) in the fifth and sixth curable resin compositions is cured from the viewpoints of pressure-sensitive adhesiveness, reliability, and curability, and from the viewpoint of efficiently promoting the curing reaction. % Or more, 4% by mass or more, or 6% by mass or more, 14% by mass or less, 12% by mass or less or 10% by mass or less based on the total amount of the functional resin composition Good.
  • Component (3-B) Monomer Component
  • Examples of the radically polymerizable group possessed by the component (3-B1) include (meth) acryloyl, vinyl, ethynyl, isopropenyl, vinyl ether and vinyl thioether groups.
  • Be Examples of the component (B1) include isocyanatomethyl (meth) acrylate and 2-isocyanatoethyl (meth) acrylate. Such a compound can cause a curing reaction to proceed by the formation of a polymer chain by radical polymerization and the reaction of an isocyanate group involving water.
  • the components (3-B1) can be used alone or in combination of two or more.
  • the content of the component (3-B1) is relative to the total amount of the curable resin composition from the viewpoint of reactivity, the viewpoint of improving the adhesive strength, and the stability when the curable resin composition is a solution.
  • the amount may be 0.1 mass% or more, 1 mass% or more, or 3 mass% or more, or 15 mass% or less, 10 mass% or less, or 5 mass% or less.
  • component (3-B2) the same components as the components (1-B2) described above can be used.
  • the component (3-B) can include one or more components (3-B2) in addition to the component (3-B1).
  • the component (3-B2) is a compound other than the component (3-B1).
  • the content of the component (3-B2) is from the viewpoint of obtaining a curable resin composition having an appropriate viscosity, from the viewpoint of curing shrinkage and adjustment of the elastic modulus of the cured product, and dissolution of the coloring agent blended as necessary. It may be 10 mass% or more, 15 mass% or more, or 20 mass% or more, 80 mass% or less, 70 mass% or less, or 60 mass% of the total amount of the curable resin composition from the viewpoint of elasticity. It may be% or less.
  • the content of the component (3-B2) is 10% by mass or more, a curable resin composition having an appropriate viscosity which contributes to good coatability is easily obtained, and a coloring agent to be blended according to need It tends to improve the solubility of When the content of the component (3-B2) is 80% by mass or less, the cure shrinkage tends to be low. When the cure shrinkage rate is low, it is possible to suppress the decrease in adhesion due to stress.
  • the monomer component of the component (3-B) may further contain a polyfunctional monomer having two or more radically polymerizable groups.
  • the content of the polyfunctional monomer may be 5% by mass or less based on the total amount of the monomer components (component (3-B)).
  • polyfunctional isocyanates examples include 1,3-phenylene diisocyanate, 4,4'-diphenyl diisocyanate, 1,4-phenylene diisocyanate, 4,4'-diphenylmethane diisocyanate (alias: 4,4'-MDI), 2 2,4-tolylene diisocyanate (alias: 2,4-TDI), 2,6-tolylene diisocyanate, 4,4'-toluidine diisocyanate, 2,4,6-triisocyanate toluene, 1,3,5-triisocyanate Aromatic polyisocyanates such as benzene, dianisidine diisocyanate, 4,4'-diphenylether diisocyanate, 4,4 ', 4 "-triphenylmethane triisocyanate; trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate Alipha
  • one type may be used alone, or two or more types may be used in combination.
  • the content of the component (3-C) in the sixth curable resin composition of the present embodiment is the reactivity, the viewpoint of improving the adhesive strength, and the stability when the curable resin composition is a solution. From the viewpoint of the total amount of the curable resin composition, it may be 1 mass% or more, 5 mass% or more, or 10 mass% or more, 70 mass% or less, 50 mass% or less, or 30 mass% It may be the following.
  • the sixth curable resin composition of the present embodiment can further include a (3-C) component.
  • the content of the component (3-C) is 0.1% by mass or more, 1% by mass or more, or 3% by mass or more based on the total amount of the curable resin composition from the viewpoint of curability. From the viewpoint of storage stability, it may be 15% by mass or less, 10% by mass or more, or 5% by mass or less based on the total amount of the curable resin composition.
  • the fifth and sixth curable resin compositions can contain monofunctional isocyanate.
  • monofunctional isocyanates include methyl isocyanate, ethyl isocyanate, propyl isocyanate, butyl isocyanate, octyl isocyanate, decyl isocyanate, octadecyl isocyanate, stearyl isocyanate, cyclohexyl isocyanate, phenyl isocyanate, benzyl isocyanate, p-chlorophenyl isocyanate, p-nitro Phenyl isocyanate, 2-chloroethyl isocyanate, 2,4-dichlorophenyl isocyanate, 3-chloro-4-methylphenyl isocyanate, trichloroacetyl isocyanate, chlorosulfonyl isocyanate, (R)-(+)- ⁇ -methylbenzyl isocyanate, (S )-
  • the fifth and sixth curable resin compositions contain the same fillers as those used for the first and second curable resin compositions.
  • the first to sixth curable resin compositions according to the present embodiment may further contain a colorant (hereinafter, also referred to as “component (E)”).
  • component (E) a colorant
  • the colorant is a component that colors the curable resin composition and the resin cured layer.
  • the resin cured layer can be used as a light shielding layer, and an appropriate light shielding property can be imparted to the light shielding layer.
  • the hue of the colorant is not particularly limited, and colorants having various hues can be used, but the colorant typically exhibits a black color.
  • the colorant can include, for example, a dye and / or a pigment. From the viewpoint of obtaining a uniform curable resin composition, a colorant to be dissolved in the monomer component may be selected.
  • the dissolution of the colorant in the monomer component can be confirmed by the following method.
  • 10 mL of monomer component temperature 25 ° C.
  • 10 mg of colorant masses of solid content
  • the average light transmittance of visible light of the colorant may be 50% or less, 45% or less, or 40% or less.
  • the average light transmittance of visible light refers to the average light transmittance of light having a wavelength of 400 to 700 nm.
  • the average light transmittance of visible light is the light transmittance of a colorant solution consisting of 100 parts by mass of a solvent in which the colorant is dissolved and 0.1 parts by mass of the colorant, using a spectrophotometer (eg, Konica Minolta (CM-3700A)), and measurement is made every 1 nm in the range of 400 to 700 nm, and the average value of the obtained measurement values is determined to obtain an average light transmittance.
  • the dissolution of the colorant in the solvent can be confirmed by the same method as the above-mentioned "dissolution of the colorant in the monomer component".
  • the light transmittance (hereinafter also referred to as “irradiation transmittance”) of the colorant at the peak wavelength of the light (active energy ray) irradiated to advance the curing reaction is 10, which is more than the average light transmittance of visible light. % Or more, 20% or more, or 30% or more.
  • the irradiation transmittance may be 60% or more, 65% or more, or 70% or more.
  • the irradiation transmittance of the coloring agent is the light (active energy ray) irradiated to advance the curing reaction of the coloring agent solution consisting of 100 parts by mass of the solvent in which the coloring agent is dissolved and 0.1 parts by mass of the coloring agent
  • the radiation transmittance of the colorant at the peak wavelength of can be determined by the method of measuring the decomposition wavelength under the condition of 1 nm.
  • a visible ultraviolet spectrophotometer for example, "UV-2400 PC" manufactured by Shimadzu Corporation
  • the measurement range is set to, for example, 300 to 780 nm.
  • the colorant may include, for example, at least one selected from the group consisting of phthalocyanine blue, phthalocyanine green, iodine green, diazo yellow, aniline black, perylene black, and fluoran.
  • the content of the colorant is 0.1% by mass or more, 0.3% by mass or more, or 0.5% by mass or more based on the total amount of the curable resin composition from the viewpoint of obtaining the effect of shielding visible light 10 mass% or less, 7.5 mass% or less, or 5 mass% or less.
  • the first to sixth curable resin compositions according to the present embodiment may further contain a polymer (hereinafter also referred to as “component (F)”).
  • the polymer contained in the curable resin composition may be an oligomer.
  • oligomer as used herein means a polymer having a weight average molecular weight of 1 ⁇ 10 4 or more.
  • weight average molecular weight means a value in terms of standard polystyrene, which is measured by gel permeation chromatography.
  • the “polymer” as the component (F) is the above-mentioned components (1-A) to (1-D), components (2-A) to (2-C), components (3-A) to It is an ingredient except 3-C).
  • polymer examples include butadiene rubber, isoprene rubber, silicone rubber, styrene butadiene rubber, chloroprene rubber, nitrile rubber, butyl rubber, ethylene propylene rubber, urethane rubber, acrylic rubber, chlorosulfonated polyethylene rubber, fluororubber, Liquids or solids of various rubbers such as hydrogenated nitrile rubber and epichlorohydrin rubber; poly ⁇ -olefins such as polybutene; hydrogenated ⁇ -olefin oligomers such as hydrogenated polybutene; polyvinyl oligomers such as atactic polypropylene; Aromatic oligomers such as phenyl; hydrogenated polyene oligomers such as hydrogenated liquid polybutadiene; paraffin oligomers such as paraffin oil and chlorinated paraffin oil; cycloparaffin oligomers such as naphthenic oil; both Polyester-based oligomers that can be
  • the (meth) acrylic acid-based polymer is a polymer containing one or more monomer units derived from a monomer having one (meth) acryloyl group.
  • the (meth) acrylic acid-based polymer is a compound having two or more (meth) acryloyl groups, a polymerizable compound having no (meth) acryloyl group (eg, acrylonitrile, etc.) as long as the effects of the present invention are not significantly impaired.
  • the (meth) acrylic acid-based polymer may be a homopolymer or a copolymer containing these monomers as monomer units.
  • the (meth) acrylic acid-based polymer may be a homopolymer or a copolymer containing a monofunctional monomer having one (meth) acryloyl group as a monomer unit.
  • the (meth) acrylic acid-based polymer may contain (meth) acrylate having an alkyl group as a monomer unit, or (meth) acrylate having an alkyl group having 4 to 18 carbon atoms as a monomer unit May be included.
  • the proportion of the (meth) acrylate having an alkyl group contained as a monomer unit per molecule of the (meth) acrylic acid-based polymer is 5% by mass or more with respect to the mass of the (meth) acrylic acid-based polymer, 10 mass% or more may be sufficient, 95 mass% or less, and 90 mass% or less may be sufficient.
  • the proportion of (meth) acrylate having an alkyl group is within the above range, the adhesion of the curable resin layer (light shielding layer) after curing to adherends such as glass, plastic, polarizing plate and polycarbonate is improved. Tend.
  • a (meth) acrylic acid-based polymer is a polar group such as a hydroxyl group, a morpholino group, an amino group, a carboxy group, a cyano group, a carbonyl group or a nitro group, from the viewpoint of improving pressure-sensitive adhesion to a substrate such as plastic.
  • the copolymer which has the (meth) acrylate which it has as a monomer unit may be sufficient.
  • the weight average molecular weight of the (meth) acrylic acid based polymer (oligomer) may be 1 ⁇ 10 4 to 1 ⁇ 10 7 .
  • the weight average molecular weight is in the above range, particularly in the environment of high temperature (for example, 80 ° C. or more) and high humidity (for example, 90% or more), the pressure-sensitive adhesive force does not occur particularly easily You can get it.
  • a curable resin composition having a viscosity suitable for coating and good processability can be easily obtained.
  • the (meth) acrylic acid-based polymer can be prepared using known polymerization methods such as solution polymerization, emulsion polymerization, suspension polymerization and bulk polymerization.
  • a compound which generates a radical by heat may be used as a polymerization initiator in these polymerization methods.
  • a compound which generates a radical by heat include benzoyl peroxide, tert-butyl perbenzoate, cumene hydroperoxide, diisopropyl peroxy dicarbonate, di-n-propyl peroxy dicarbonate, di (2-ethoxyethyl) peroxy dicarbonate, Organic peroxides such as tert-butyl peroxy neodecanoate, t-butyl peroxy pivalate, (3,5,5-trimethylhexanoyl) peroxide, dipropionyl peroxide, diacetyl peroxide, didodecyl peroxide, etc.
  • 2,2'-azobisisobutyronitrile 2,2'-azobis (2-methylbutyronitrile), 1,1'-azobis (cyclohexane-1-carbonitrile), 2.2'-azobis ( 2,4-Dimethylvaleronitrile), 2,2'-azobis 2,4-Dimethyl-4-methoxyvaleronitrile), dimethyl 2,2'-azobis (2-methylpropionate), 4,4'-azobis (4-cyanovaleric acid), 2,2'-azobis Azo compounds such as (2-hydroxymethylpropionitrile), 2,2′-azobis [2- (imidazolin-2-yl) propane] and the like can be mentioned.
  • the content of the component (E) may be 1 mass% or more, 5 mass% or more, 10 mass% or more, 90 mass% or less, 80 mass% or less, based on the total amount of the curable resin composition. 70 mass% or less may be sufficient.
  • a curable resin composition having a viscosity suitable for coating and good processability is easily obtained.
  • the pressure-sensitive adhesion of the cured resin layer to the adherend such as glass, plastic, polarizing plate, and polycarbonate after light irradiation tends to be particularly good.
  • the curable resin composition may contain a gelling agent such as 1,2-hydroxystearic acid or a thixotropic agent instead of or together with the polymer.
  • a gelling agent such as 1,2-hydroxystearic acid or a thixotropic agent instead of or together with the polymer.
  • the curable resin composition may further contain other additives, if necessary.
  • additives include adhesion improvers such as silane coupling agents, thermal polymerization initiators, antioxidants, chain transfer agents, stabilizers, and photosensitizers.
  • the curable resin composition may not substantially contain an organic solvent from the viewpoint of moisture heat resistance and from the viewpoint of suppressing the generation of bubbles in the cured product.
  • the "organic solvent” means an organic compound having no radically polymerizable group, being liquid at 25 ° C, and having a boiling point of 250 ° C or less at atmospheric pressure.
  • substantially free of organic solvent means that it does not contain an intentionally added organic solvent, and an embodiment in which a trace amount of organic solvent is present in the curable resin composition Do not eliminate.
  • the content of the organic solvent in the curable resin composition is 1.0 ⁇ 10 3 ppm or less, 5.0 ⁇ 10 2 ppm or less, or 1 with respect to the total amount of the curable resin composition. It may be less than 0 ⁇ 10 2 ppm.
  • the curable resin composition may not contain any organic solvent.
  • the viscosity of the curable resin composition at a temperature at least partially in the range of 25 ° C. to 70 ° C. is 10 mPa ⁇ s or more, 4.0 ⁇ 10 2 mPa ⁇ s or more, 5.0 ⁇ from the viewpoint of processability.
  • the viscosity at temperatures above 25 ° C. can be measured according to the method for measuring the viscosity at 25 ° C.
  • a curable resin composition can be manufactured by mixing each component mentioned above by stirring. Stirring may be performed by a known method using a stirrer, a stirring blade or the like. The temperature at the time of stirring can be, for example, 20 to 80.degree.
  • the curable resin composition of the present embodiment has a light shielding property to suppress light leakage from between the image display portion and the frame portion in manufacturing the image display device, and is efficient even in a narrow region. It can be used to form a light shielding layer that can be formed into Further, the curable resin composition of the present embodiment adheres the image display unit to the frame unit when manufacturing the image display device provided with a large display such as a large OLED (organic EL) television, and It can be used to form a resin cured layer capable of maintaining adhesion even if there is a thermal expansion difference with the frame portion.
  • the image display apparatus provided with the light shielding layer formed from a curable resin composition and its manufacturing method are demonstrated.
  • a resin cured layer is a light shielding layer
  • it is not limited to this, It may replace with a light shielding layer and may provide the resin cured layer which does not have a light shielding property.
  • FIG. 1 is a cross-sectional view showing an embodiment of the image display apparatus.
  • the image display device 100 shown in FIG. 1 supplies light to the liquid crystal panel 41 and the image display unit 1 including the liquid crystal panel 41 having the image display surface 41S, the cover member 20, and the light transmitting pressure sensitive adhesive layer 42.
  • a backlight unit 43, a frame unit 5 supporting the image display unit 1 and accommodating the liquid crystal panel 41 and the backlight unit 43, and a light shielding layer 3 formed between the frame unit 5 and the image display unit 1 Prepare.
  • the cover member 20 has a cover glass 21 having a light transmitting portion 25 facing the image display surface 41S, and a frame portion 22 provided on the peripheral portion of the main surface of the cover glass 21 on the image display surface 41S side.
  • the light transmitting pressure-sensitive adhesive layer 42 joins these while being interposed between the liquid crystal panel 41 and the cover member 20.
  • the light transmitting pressure sensitive adhesive layer 42 may be generally referred to as OCA (Optical clear adhesive).
  • the backlight unit 43 has a light source 45 and an optical sheet unit 46 for supplying the light of the light source 45 to the liquid crystal panel 41.
  • the frame unit 5 accommodates the resin frame 51 provided around the liquid crystal panel 41 and the backlight unit 43, the backlight frame 52 that accommodates the backlight unit 43 outside the resin frame 51, and the backlight frame 52. And a housing frame 53.
  • the resin frame 51 supports the image display unit 1 by adhering the peripheral portion of the liquid crystal panel 41 and the frame portion 22 of the cover member 20 while interposing the light shielding layer 3.
  • the backlight frame 52 supports the image display unit 1 by adhering to the frame 22 while interposing the light shielding layer 3.
  • the housing frame 53 supports the image display unit 1 by adhering to the frame 22 while interposing the light shielding layer 3.
  • the image display apparatus 100 of FIG. 1 has four light shielding layers 3, which are respectively provided between the liquid crystal panel 41 or the cover member 20 (frame portion 22) and the frame portion 5.
  • the light shielding layer 3 can have light transmittance to such an extent that light leakage from the backlight unit 43 becomes substantially invisible.
  • the average light transmittance at 400 to 700 nm of the light shielding layer 3 may be less than 10%.
  • the average light transmittance may be, for example, a value measured under the condition that light is irradiated in the thickness direction of the light shielding layer 3.
  • the light shielding layer 3 may form a closed frame-like body that completely surrounds the periphery of the backlight portion 43, or surrounds a part of the periphery of the backlight portion 43 in a range where light leakage can be sufficiently suppressed. It may form an open frame. As described later, the light shielding layer 3 between the image display unit 1 and at least one selected from the resin frame 51, the backlight frame 52, and the housing frame 53, the application of the curable resin composition and the active energy ray It can be formed by a method that includes irradiation. A part of the light shielding layer of the image display device may be formed of a pressure sensitive adhesive tape.
  • the width W of each light shielding layer 3 in the direction perpendicular to the direction in which the light shielding layer 3 extends may be 1.5 mm or less.
  • the width W is narrow, it is possible to obtain an image display device having a narrower frame portion and excellent in design.
  • the lower limit of the width W is not particularly limited, but may be about 0.2 mm.
  • the optical sheet unit 46 of the backlight unit 43 generally includes a lens sheet, a diffusion sheet, a light guide plate, a reflection sheet, and the like.
  • the configuration of the optical sheet type image display apparatus is not limited to the configuration of FIG. 1, and the number and shape of the frames, the portion where the light shielding layer is provided, and the like can be changed as appropriate.
  • the frame portion 22 may not be provided, and the peripheral portion of the cover glass 21 and the frame portion 5 may be bonded with the light shielding layer 3 interposed therebetween.
  • FIGS. 2 and 3 are perspective views showing one embodiment of a method of manufacturing an image display device.
  • the curable resin composition is applied to a predetermined portion (peripheral portion of the main surface on the back side) of the image display unit 1 (for example, the cover member) to form a frame shape
  • the step of forming the resin layer 3A (FIG. 2) and the step of advancing the curing reaction of the curable resin layer 3A by irradiating the curable resin layer 3A with the active energy ray h ⁇ ((b) in FIG. 2)
  • the step of bonding the image display unit 1 and the frame unit 5 while interposing the curable resin layer 3A in which the curing reaction has proceeded (FIG. 3) in this order.
  • the curing reaction proceeds in the curable resin layer 3A, whereby the light shielding layer 3 is formed.
  • FIGS. 4 and 5 are also perspective views showing an embodiment of a method of manufacturing an image display device.
  • the curable resin composition is applied to the frame portion 5 to form a frame-shaped curable resin layer 3A.
  • the other points are the same as the methods of FIGS. 2 and 3.
  • the curable resin composition of the present embodiment described above is applied to the peripheral portion of the main surface of the image display unit 1 to form a frame-shaped curable resin layer 3A.
  • the curable resin layer can be efficiently formed in a narrow area.
  • the curable resin composition can be applied efficiently and with high accuracy by a method of discharging the liquid curable resin composition from the opening.
  • the curable resin layer 3A can be provided, for example, by applying a liquid curable resin composition on the peripheral portion of the main surface of the image display unit 1.
  • a liquid curable resin composition examples include potting method, dipping method, spray method, roll coating method, slit coating method, ink jet method, screen printing method and the like.
  • dispensers such as a syringe type dispenser and a jet type dispenser, for application.
  • Aspect ratio (h) obtained from height h (unit: mm) and width w (unit: mm) in a cross section perpendicular to the extending direction of the frame-shaped curable resin layer 3A in the coating step / W) is preferably 0.3 to 1.5, more preferably 0.5 to 1.0, and still more preferably 0.6 to 0.8.
  • the height h and the width w are the same as the height h and the width w shown in FIG. If the aspect ratio (h / w) is within the above range, a cured resin layer is formed which can maintain adhesion sufficiently even if there is a thermal expansion difference between the image display unit 1 and the frame unit 5 be able to.
  • the curable resin layer 3A is irradiated with the active energy ray hv to advance the curing reaction of the curable resin layer 3A.
  • a curing reaction mainly by a radical polymerization reaction proceeds immediately after the irradiation of the active energy ray.
  • the curable resin layer 3A can be provided with appropriate pressure-sensitive adhesiveness. It can also be said that the curable resin layer 3A is semi-cured by radical polymerization reaction at the stage of irradiation with active energy rays.
  • Examples of the frame portion 5 include metal plates made of iron, aluminum, stainless steel or the like, and metal frames made of thin metal plates.
  • Examples of a method of bonding the image display unit 1 and the frame unit 5 include a manual operation, a semiautomatic operation with a bonding machine (press machine, a laminating machine, etc.) and an automatic operation.
  • the curable resin layer 3A is preferably a layer formed of a curable resin composition in which the pressure-sensitive adhesive force measured by the following method and the aspect ratio after bonding satisfy the following conditions: .
  • the curable resin composition preferably has a pressure-sensitive adhesive force of 10 N / cm 2 or more, more preferably 20 N / cm 2 or more, and 40 N / cm 2 or more, as determined by the following method. Is more preferred. Measurement of pressure sensitive adhesive force is performed by the following method and conditions.
  • a curable resin composition is applied on a first glass substrate having a width of 25 mm, a length of 75 mm and a thickness of 1 mm, and a curable resin layer having a width of 0.6 mm, a length of 25 mm and a film thickness of 50 ⁇ m is cured.
  • the test force when the first glass substrate and the second glass substrate of the measurement sample were peeled off in the opposite long side direction from each other was measured, and this test force was used as a curability.
  • the value divided by the contact area between the resin layer and the second glass substrate is taken as the pressure-sensitive adhesive force.
  • 101 indicates a first glass substrate
  • 102 indicates a second glass substrate
  • 103 indicates a curable resin layer
  • D indicates a peeling direction.
  • the curable resin layer preferably has resin properties such that the aspect ratio after bonding becomes high.
  • the specific aspect ratio is preferably 0.4 or more, more preferably 0.6 or more, and still more preferably 0.8 or more.
  • the measurement of the value of the aspect-ratio of a curable resin layer is performed by the following method and conditions.
  • a curable resin composition is applied on a first glass substrate having a width of 25 mm, a length of 75 mm and a thickness of 1 mm, and a curable resin layer having a width of 0.6 mm, a length of 25 mm and a film thickness of 50 ⁇ m is cured.
  • B / 0.6 is an aspect ratio.
  • 104 shows a 1st glass base material
  • 106 shows a 2nd glass base material
  • 105 shows a curable resin layer
  • A is 0.6 (width of a curable resin layer)
  • the storage elastic modulus at 25 ° C. of the curable resin layer at the time of bonding is 10,000 to 500,000 Pa from the viewpoint of balancing the step absorptivity, pressure sensitive adhesive strength (adhesive strength), and wettability for adhesive strength expression. Is preferably, 30000 to 250000 Pa is more preferable, and 50000 to 2000000 Pa is still more preferable.
  • a ′ indicates the width (unit: mm) at a predetermined portion of the frame-shaped curable resin layer 3A applied to the image display unit 1
  • B ′ indicates the image display unit 1 and the frame unit 5 Shows a width (unit: mm) in contact with the frame portion 5 at a predetermined portion of the curable resin layer 3A after being bonded.
  • a ′ and B ′ indicate widths at the same positions as A and B shown in FIG.
  • the width of A ′ and B ′ was obtained by cutting the curable resin layer 3A before and after bonding of the image display unit 1 and the frame unit 5 in the same plane perpendicular to the direction in which the curable resin layer 3A extends.
  • the line width at which the curable resin layer 3A before bonding and the image display unit 1 are in contact with each other in the cut surface is A '
  • the line at which the curable resin layer 3A after bonding and the frame unit 5 are in contact The width is B '.
  • the line width at which the curable resin layer 3A and the frame portion 5 are in contact before bonding in the cut surface is A ', after bonding
  • the line width at which the curable resin layer 3A and the image display unit 1 are in contact with each other is B ′. If the aspect ratio (B '/ A') is within the above range, a resin cured layer capable of maintaining the adhesive force sufficiently even if there is a thermal expansion difference between the image display unit 1 and the frame unit 5 It can be formed.
  • the curing reaction of the curable resin layer 3A may be further cured in the state of a laminate having the image display unit 1 and the frame unit 5 and being bonded to each other.
  • the curing reaction that proceeds after lamination is sometimes referred to as "delayed curing".
  • the delayed curing can proceed, for example, in an environment of 10 ° C. or more, 15 ° C. or more, or 20 ° C. or more for 12 hours or more.
  • the temperature of the environment for advancing the delayed curing may be 80 ° C. or less. While advancing the delayed curing, other necessary steps may be performed, such as a step of further processing the image display device and / or a step of inspecting the image display device.
  • the curing of the curable resin layer 3A in the curing step is appropriately set according to the type of the curable resin composition.
  • the curable resin composition is a photocurable resin composition
  • ultraviolet light (UV) is preferably used.
  • the light source to be used is not particularly limited, and examples thereof include an LED lamp, a mercury lamp (low pressure, high pressure, ultra high pressure etc.), a metal halide lamp, an excimer lamp, a xenon lamp, etc. It is a metal halide lamp etc.
  • the curable resin composition is a thermosetting resin composition
  • a high temperature reactor is preferably used for curing.
  • the first to sixth curable resin compositions described above When the first to sixth curable resin compositions described above are used, they can be delayed cured by irradiation of active energy rays in step (II), and irradiation or heating of active energy rays is performed after step (III) Even if it does not exist, the curing reaction of the curable resin layer 3A can be further advanced. Even in this case, the curing reaction may be promoted by the method described above.
  • the thickness d of the resin cured layer 3 may be 0.2 to 1.5 mm, 0.3 to 1.0 mm, or 0.4 to 0.8 mm. .
  • the said thickness d is synonymous with the thickness d shown to (d) of FIG. Even if there is a thermal expansion difference between the image display unit 1 and the frame unit 5 when the thickness d of the resin cured layer is within the above range, the adhesive strength can be maintained more sufficiently.
  • the manufacturing method of the present embodiment can be applied to the manufacture of a joined body other than the image display device 100 described above.
  • various changes can be made to the manufacturing method of the present embodiment.
  • Examples of the image display device include a liquid crystal display and a flat panel display (FPD). Specifically, a plasma display panel (PDP), an organic electroluminescence panel (OELP), a field emission display (FED) , A cathode ray tube (CRT), electronic paper and the like.
  • PDP plasma display panel
  • OELP organic electroluminescence panel
  • FED field emission display
  • CRT cathode ray tube
  • the image display apparatus according to the present invention can be applied to a large display such as a large OLED, a portable terminal or the like.
  • a large display such as a large OLED, a portable terminal or the like.
  • mobile terminals include mobile phones, smart phones, personal computers, electronic dictionaries, calculators, game machines and the like.

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Abstract

L'invention concerne une composition de résine durcissable qui contient un initiateur de polymérisation photoradicalaire, un composant monomère, un générateur photoacide, et une charge, le composant monomère comprenant un monomère ayant un groupe polymérisable par voie radicalaire et un groupe éther cyclique.
PCT/JP2017/035008 2017-09-27 2017-09-27 Composition de résine durcissable, dispositif d'affichage d'image, et procédé de production d'un dispositif d'affichage d'image Ceased WO2019064385A1 (fr)

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PCT/JP2017/035008 WO2019064385A1 (fr) 2017-09-27 2017-09-27 Composition de résine durcissable, dispositif d'affichage d'image, et procédé de production d'un dispositif d'affichage d'image
TW107132858A TW201925390A (zh) 2017-09-27 2018-09-18 硬化性樹脂組成物、圖像顯示裝置及圖像顯示裝置的製造方法

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