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WO2018128005A1 - Condensateur, unité de condensateur, procédé de production de condensateur et procédé de production d'unité de condensateur - Google Patents

Condensateur, unité de condensateur, procédé de production de condensateur et procédé de production d'unité de condensateur Download PDF

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Publication number
WO2018128005A1
WO2018128005A1 PCT/JP2017/038627 JP2017038627W WO2018128005A1 WO 2018128005 A1 WO2018128005 A1 WO 2018128005A1 JP 2017038627 W JP2017038627 W JP 2017038627W WO 2018128005 A1 WO2018128005 A1 WO 2018128005A1
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WIPO (PCT)
Prior art keywords
capacitor
resin
case
surface portion
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2017/038627
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English (en)
Japanese (ja)
Inventor
竹岡　宏樹
藤井　浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
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Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Priority to JP2018560323A priority Critical patent/JPWO2018128005A1/ja
Publication of WO2018128005A1 publication Critical patent/WO2018128005A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation

Definitions

  • the present invention relates to a capacitor, a capacitor unit, a capacitor manufacturing method, and a capacitor unit manufacturing method.
  • a case mold type capacitor in which a capacitor element is housed in a resin case and the case is filled with a mold resin.
  • a case mold type capacitor in which a capacitor element is housed in a resin case and the case is filled with a mold resin.
  • ordinary mold resin filled in the case generally has low thermal conductivity and poor heat dissipation.
  • an object of the present invention is to provide a capacitor and a capacitor unit having excellent heat dissipation.
  • the capacitor according to the first aspect of the present invention includes a capacitor element, a case in which the capacitor element is accommodated, and a mold resin filled in the case.
  • the case has a side surface portion and a bottom surface portion, and at least a part of the side surface portion or the bottom surface portion is a high thermal conductivity portion having higher thermal conductivity than other portions of the case.
  • the capacitor unit according to the second aspect of the present invention includes a capacitor and a metal plate.
  • the capacitor includes a capacitor element, a case in which the capacitor element is accommodated, and a mold resin filled in the case.
  • the case has a side surface portion and a bottom surface portion, and at least a part of the side surface portion or the bottom surface portion is a high thermal conductivity portion having a higher thermal conductivity than other portions of the case.
  • the metal plate is in contact with the high thermal conductivity portion outside the case.
  • the capacitor according to the third aspect of the present invention includes a capacitor and a metal plate.
  • the capacitor is formed of a capacitor element and a resin and has a cylindrical shape with both ends open, and an exterior body that surrounds the capacitor element, a mold resin that covers the capacitor element in the exterior body, including.
  • the metal plate closes one end of the exterior body and is bonded to the mold resin.
  • a fourth aspect of the present invention includes a capacitor element, a case in which the capacitor element is accommodated, and a mold resin filled in the case, wherein the case is formed of the first resin, and both ends are
  • the present invention relates to a method of manufacturing a capacitor having an open cylindrical side surface portion and a bottom surface portion that is formed of a thermosetting second resin having a higher thermal conductivity than the first resin and closes one end of the side surface portion.
  • the side part is installed on the installation surface so that one end of the side part is closed, the second resin before curing is injected into the side part, and the inside of the side part is filled.
  • the second resin is cured by heating, the capacitor element is accommodated in the side surface portion, the mold resin before curing is injected, and the inside of the side surface portion is heated to cure the mold resin.
  • a fifth aspect of the present invention includes a capacitor element, a case in which the capacitor element is accommodated, and a mold resin filled in the case, wherein the case is formed of the first resin, and both ends are
  • the present invention relates to a method of manufacturing a capacitor having an open cylindrical side surface portion and a bottom surface portion that is formed of a thermosetting second resin having a higher thermal conductivity than the first resin and closes one end of the side surface portion.
  • the second resin before curing whose viscosity is increased by installing the side surface portion on the installation surface and mixing the filler so that one end of the side surface portion is blocked, Arranged on the installation surface in the side surface so as not to have a gap with the side surface, and injecting the mold resin before curing and containing the capacitor element into the side surface where the second resin is disposed. Then, the inside of the side surface portion is heated to cure the second resin and the mold resin.
  • a sixth aspect of the present invention includes a capacitor element, a case in which the capacitor element is accommodated, and a mold resin filled in the case.
  • the case is formed of the first resin, and both ends are
  • the present invention relates to a method of manufacturing a capacitor having an open cylindrical side surface portion and a bottom surface portion that is formed of a thermosetting second resin having a higher thermal conductivity than the first resin and closes one end of the side surface portion.
  • the second resin before curing whose viscosity is increased by installing the side surface portion on the installation surface and mixing the filler so that one end of the side surface portion is blocked, It arrange
  • the said side part is heated, the said 2nd resin is hardened, and the said capacitor element is accommodated in the said side part, and is hardened
  • the previous mold resin is injected, and the inside of the side surface is heated to cure the mold resin.
  • a seventh aspect of the present invention includes a capacitor and a metal plate, and the capacitor includes a capacitor element, a case in which the capacitor element is accommodated, and a mold resin filled in the case.
  • the case is formed of a first side resin and is formed of a cylindrical side surface portion having both ends opened, and a thermosetting second resin having a higher thermal conductivity than the first resin, and one end of the side surface portion. And a bottom surface portion that covers the bottom surface of the capacitor unit, wherein the metal plate is in contact with the bottom surface portion.
  • the side part is placed on the metal plate so that one end of the side part is closed, the second resin before curing is injected into the side part, and the side part is injected.
  • the inside of the part is heated to cure the second resin, the capacitor element is accommodated in the side part and the mold resin before curing is injected, and the inside of the side part is heated to cure the mold resin.
  • An eighth aspect of the present invention includes a capacitor and a metal plate, and the capacitor includes a capacitor element, a case in which the capacitor element is accommodated, and a mold resin filled in the case.
  • the case is formed of a first side resin and is formed of a cylindrical side surface portion having both ends opened, and a thermosetting second resin having a higher thermal conductivity than the first resin, and one end of the side surface portion. And a bottom surface portion that covers the bottom surface of the capacitor unit, wherein the metal plate is in contact with the bottom surface portion.
  • the second resin before curing whose viscosity is increased by installing the side surface portion on the metal plate and mixing the filler so that one end of the side surface portion is closed.
  • a ninth aspect of the present invention includes a capacitor and a metal plate, and the capacitor includes a capacitor element, a case in which the capacitor element is accommodated, and a mold resin filled in the case.
  • the case is formed of a first side resin and is formed of a cylindrical side surface portion having both ends opened, and a thermosetting second resin having a higher thermal conductivity than the first resin, and one end of the side surface portion. And a bottom surface portion that covers the bottom surface of the capacitor unit, wherein the metal plate is in contact with the bottom surface portion.
  • the second resin before curing whose viscosity is increased by installing the side surface portion on the metal plate and mixing the filler so that one end of the side surface portion is closed.
  • the inside of the side surface is heated to cure the second resin, and the capacitor element is accommodated in the side surface.
  • the mold resin before curing is injected and the inside of the side surface is heated to cure the mold resin.
  • FIG. 1A is a plan view of the capacitor according to the first embodiment
  • FIG. 1B is a capacitor cut along the line AA ′ of FIG. 1A according to the first embodiment.
  • FIG. FIG. 2 is a cross-sectional view of the capacitor unit according to the first embodiment.
  • FIG. 3 is a diagram for explaining the method of manufacturing the capacitor according to the first embodiment.
  • FIG. 4 is a diagram for explaining a method of manufacturing a capacitor according to the second embodiment.
  • FIG. 5 is a diagram for explaining a method of manufacturing a capacitor according to the third embodiment.
  • FIG. 6 is a diagram for explaining a method of manufacturing a capacitor according to the fourth embodiment.
  • FIG. 7A is a plan view of a capacitor according to the second embodiment, and FIG.
  • FIG. 1B is a capacitor cut along the line BB ′ of FIG. 7A according to the second embodiment.
  • FIG. 8A is a plan view of the capacitor according to the third embodiment, and FIG. 8B is a capacitor cut along the line CC ′ of FIG. 8A according to the third embodiment.
  • FIG. FIGS. 9A to 9C are cross-sectional views of capacitors according to modifications of the third embodiment.
  • FIG. 10A is a plan view of the capacitor unit according to the fourth embodiment, and FIG. 10B is a cross-sectional view taken along the line DD ′ of FIG. 10A according to the fourth embodiment. It is sectional drawing of a capacitor
  • FIG. 11 is a diagram for explaining a method of manufacturing a capacitor unit according to the fourth embodiment.
  • FIG. 12A is a plan view of a capacitor according to the first modification
  • FIG. 12B is a capacitor cut along the line EE ′ of FIG. 12A according to the first modification
  • FIG. FIG. 13A is a plan view of a capacitor according to the second modified example
  • FIG. 13B is a capacitor cut along the line FF ′ of FIG. 13A according to the second modified example
  • FIG. 14A is a plan view of a capacitor according to the third modification
  • FIG. 14B is a capacitor cut along the line GG ′ of FIG. 14A according to the third modification.
  • case side surface portion 31 corresponds to the “side surface portion” recited in the claims.
  • case bottom surface portion 32 corresponds to a “bottom surface portion” recited in the claims.
  • FIG. 1A is a plan view of the capacitor 10 according to the first embodiment
  • FIG. 1B is a cross-sectional view taken along line AA ′ of FIG. 1A according to the first embodiment.
  • 1 is a cross-sectional view of a capacitor 10.
  • the capacitor 10 includes a capacitor element 20, a case 30 in which the capacitor element 20 is accommodated, and a mold resin 40 filled in the case 30.
  • the capacitor element 20 is formed by stacking two metallized films on which aluminum is vapor-deposited on a dielectric film, winding or stacking the stacked metallized films, and pressing them flatly.
  • the capacitor element 20 has a columnar shape with an oval cross section. End face electrodes are formed on both end faces of the capacitor element 20 by spraying a metal such as zinc, and a bus bar (not shown) made of a conductive material such as copper is connected to each end face electrode.
  • the capacitor element 20 of the present embodiment is formed of a metallized film in which aluminum is vapor-deposited on a dielectric film, but in addition to this, metallization in which other metals such as zinc and magnesium are vapor-deposited. It may be formed by a film. Or the capacitor
  • the case 30 has a rectangular parallelepiped box shape whose upper surface (upper end) is open.
  • the case 30 includes a square cylindrical case side surface portion 31 whose both ends are open, and a rectangular case bottom surface portion 32 that closes one end (lower end) of the case side surface portion 31.
  • the case side part 31 is formed of the first resin P1.
  • the entire case bottom surface portion 32 is a high thermal conductivity portion, and is formed of the second resin P2 having a higher thermal conductivity than the first resin P1.
  • the first resin P1 is polyphenylene sulfide (PPS).
  • the second resin P2 is a crystalline epoxy in which a filler that increases the thermal conductivity of at least one of alumina, boron nitride, and aluminum nitride is mixed. Although the thermal conductivity is lower than that of the crystalline epoxy mixed with the filler, the second resin P2 may be an amorphous epoxy mixed with the above filler (hereinafter referred to as epoxy), Crystalline epoxy that is not mixed with a filler may be used.
  • the capacitor element 20 is disposed in the case 30 such that a flat portion of the peripheral surface thereof is in contact with the case bottom surface portion 32 of the case 30. Since the case bottom surface portion 32 is made of resin, it has high insulation. For this reason, even if the capacitor element 20 is brought into contact with the case bottom surface portion 32, there is no need to worry about a short circuit of the capacitor element 20 due to the case bottom surface portion 32. If there is a concern about short-circuiting of the capacitor element 20, a distance may be provided between the capacitor element 20 and the case bottom surface portion 32, or insulating paper may be interposed.
  • the mold resin 40 is a thermosetting resin, for example, epoxy.
  • the mold resin 40 may be urethane.
  • the thermal conductivity of the case bottom surface portion 32, that is, the second resin P ⁇ b> 2 is higher than the thermal conductivity of the mold resin 40.
  • the mold resin 40 covers the capacitor element 20 and protects the capacitor element 20 from moisture and impact.
  • FIG. 2 is a cross-sectional view of the capacitor unit 1 according to the first embodiment.
  • the capacitor unit 1 includes a capacitor 10 and a metal plate 50.
  • the metal plate 50 is preferably formed of a metal having excellent heat dissipation such as aluminum.
  • the metal plate 50 has an area larger than the area of the case bottom surface portion 32 and contacts the case bottom surface portion 32 outside the case 30.
  • a part of the metal casing to which the inverter circuit unit is attached can be the metal plate 50.
  • the capacitor element 20 generates heat when energized. Since the case bottom surface portion 32 has a higher thermal conductivity than the case side surface portion 31, the heat generated in the capacitor element 20 is easily released to the metal plate 50 through the case bottom surface portion 32. Further, since the case bottom surface portion 32 has higher thermal conductivity than the mold resin 40, the heat of the capacitor element 20 is not accumulated in the mold resin 40 and easily flows to the case bottom surface portion 32, and the metal plate passes through the case bottom surface portion 32. 50 is more likely to be released. Further, the capacitor element 20 is in contact with the case bottom surface portion 32, and the heat of the capacitor element 20 is easily transmitted to the case bottom surface portion 32, and is more easily released to the metal plate 50 through the case bottom surface portion 32.
  • the heat released to the metal plate 50 is released from the metal plate 50 to the outside. In this way, the temperature rise of the capacitor element 20, that is, the capacitor 10 during energization is suppressed.
  • the capacitor 10 is manufactured by, for example, the manufacturing method of Examples 1 to 4 below. Can be manufactured.
  • the manufacturing method of Example 2 and Example 4 can be paraphrased as the manufacturing method of the capacitor unit 1 because the capacitor 10 is mounted on the metal plate 50 simultaneously with the manufacture of the capacitor 10.
  • FIG. 3 is a diagram for explaining a method of manufacturing the capacitor 10 according to the first embodiment.
  • the viscosity of the second resin P2 before curing changes depending on the amount of filler such as alumina mixed with the crystalline epoxy.
  • the second resin P2 before curing has a low viscosity and a high fluidity.
  • the manufacturing method of this embodiment can be used. In the manufacturing method of the present embodiment, an installation table 100 which is a manufacturing jig is used. The capacitor element 20 and the case side surface portion 31 are manufactured in advance in another manufacturing process.
  • the case side surface portion 31 is installed on the installation surface 100a of the installation table 100 so that one end (lower end) thereof is closed. Then, the uncured second resin P ⁇ b> 2 in a molten state is injected into the installed case side surface portion 31 to a height position at which the case bottom surface portion 32 becomes thick. At this time, by using a fixture or the like (not shown), the case side surface portion 31 is in a state of being in close contact with the installation surface 100a so strong that the molten second resin P2 does not leak.
  • the inside of the case side surface 31 is heated and the second resin P2 is cured.
  • the case bottom face part 32 is formed and the case 30 is completed.
  • the case bottom surface portion 32 is bonded to the inner surface of the case side surface portion 31 when the second resin P2 is cured.
  • a release agent is applied to the installation surface 100a in advance so that the case bottom surface portion 32 and the installation surface 100a of the installation table 100 are not bonded.
  • a release film As the releasing agent, fluorine-based and silicon-based are preferable.
  • the release film a film using a fluorine-based or silicon-based resin having a release property itself, or a film having a release agent layer formed on the surface of a PET film or the like can be used.
  • the capacitor element 20 is accommodated in the case side surface 31, that is, in the case 30.
  • a bus bar is often connected to the capacitor element 20.
  • the mold resin 40 before being cured is poured into the case 30.
  • the inside of the case side surface 31, that is, the inside of the case 30 is heated, and the mold resin 40 is cured.
  • the capacitor 10 is completed as shown in FIG.
  • the case bottom surface portion 32 can be formed from the second resin P2 in the case side surface portion 31. Therefore, the case bottom surface portion 32 is formed using a dedicated mold or the like. Thus, the capacitor 10 can be efficiently manufactured without using a process of combining with the capacitor 10.
  • FIG. 4 is a diagram for explaining a method of manufacturing the capacitor 10 according to the second embodiment.
  • the manufacturing method of this example can be used when the viscosity of the second resin P2 before curing is equal to or lower than the viscosity of the mold resin 40 before curing. Further, when the manufactured capacitor 10 is mounted on the metal plate 50 to constitute the capacitor unit 1 and the size of the metal plate 50 is not too large and it is difficult to manufacture the capacitor 10, this embodiment is performed. An example manufacturing method may be used.
  • the case side surface portion 31 is installed on the metal plate 50 so that one end (lower end) thereof is closed. Then, the uncured second resin P ⁇ b> 2 in a molten state is injected into the installed case side surface portion 31 to a height position at which the case bottom surface portion 32 becomes thick. At this time, by using a fixture (not shown) or the like, the case side surface portion 31 is brought into a state of being in close contact with the surface of the metal plate 50 to such an extent that the molten second resin P2 does not leak.
  • the inside of the case side surface 31 is heated and the second resin P2 is cured.
  • the case bottom face part 32 is formed and the case 30 is completed.
  • the case bottom surface portion 32 is adhered to the inner surface of the case side surface portion 31 and to the metal plate 50 by curing the second resin P2.
  • the capacitor element 20 is accommodated in the case 30. Thereafter, the mold resin 40 before being cured is poured into the case 30. Next, as shown in FIG. D, the inside of the case 30 is heated and the mold resin 40 is cured. Thus, the capacitor 10 mounted on the metal plate 50, that is, the capacitor unit 1 is completed as shown in FIG.
  • the case bottom surface portion 32 can be formed from the second resin P2 in the case side surface portion 31. Therefore, the case bottom surface portion 32 is formed using a dedicated mold or the like. Thus, the capacitor 10 can be efficiently manufactured without using a process of combining with the capacitor 10.
  • the metal plate 50 on which the capacitor 10 is mounted can be used as a manufacturing jig for installing the case side surface portion 31, a dedicated jig (installation table 100 or the like) is not required.
  • FIG. 5 is a diagram for explaining a method of manufacturing the capacitor 10 according to the third embodiment.
  • the manufacturing method of this embodiment can be used.
  • the installation table 100 is used as in the first embodiment.
  • the case side surface portion 31 is installed on the installation surface 100a of the installation table 100 so that one end (lower end) thereof is closed. Then, the second resin P ⁇ b> 2 that is in a semi-cured state is put into the installed case side surface portion 31.
  • the semi-cured second resin P2 in the case side surface portion 31 is pressed and expanded from above so that there is no gap between the case side surface portion 31 and the installation surface 100a. Laid down.
  • the capacitor element 20 is accommodated in the case side surface 31.
  • the mold resin 40 before being cured is poured into the case 30.
  • the second resin P2 since the second resin P2 is in a semi-cured state and has a higher viscosity than the mold resin 40 before curing, the molten mold resin 40 does not mix with the second resin P2, and the second resin P2 is mixed. Accumulated on the top. Further, since the second resin P2 is viscous, the adhesiveness between the second resin P2 and the case side surface portion 31 is high, and the mold resin 40 in a molten state is between the second resin P2 and the case side surface portion 31. It is difficult to leak onto the installation surface 100a.
  • the inside of the case side surface 31 is heated.
  • the second resin P2 is cured to form the case bottom portion 32, and the case 30 is completed.
  • the mold resin 40 is cured.
  • the capacitor 10 is completed as shown in FIG.
  • the second resin P2 in a semi-cured state is laid in the case side surface portion 31, the second resin P2 in a molten state is injected into the case side surface portion 31.
  • high adhesion is not required between the case side surface portion 31 and the installation surface 100a, and the installation of the case side surface portion 31 on the installation surface 100a is simplified.
  • both the second resin P2 and the mold resin 40 are cured by one heating. Can be made. Thereby, the capacitor 10 can be efficiently manufactured.
  • FIG. 6 is a diagram for explaining a method of manufacturing the capacitor 10 according to the fourth embodiment.
  • the manufacturing method can be used.
  • the manufactured capacitor 10 is mounted on the metal plate 50 to constitute the capacitor unit 1, and the size of the metal plate 50 is not too large, and the capacitor 10 is manufactured.
  • the manufacturing method of the present embodiment can be used.
  • the case side surface portion 31 is installed on the metal plate 50 so that one end (lower end) thereof is closed. Then, the second resin P ⁇ b> 2 that is in a semi-cured state is put into the installed case side surface portion 31.
  • the semi-cured second resin P2 in the case side surface portion 31 is pressed and expanded from above so that there is no gap between the case side surface portion 31 and the metal plate 50. Laid down.
  • the capacitor element 20 is accommodated in the case side surface 31. Thereafter, the mold resin 40 before being cured is poured into the case 30. Next, as shown in FIG. D, the inside of the case side surface 31 is heated. The second resin P2 is cured to form the case bottom portion 32, and the case 30 is completed. At this time, the case bottom surface portion 32 and the metal plate 50 are bonded. At the same time, the mold resin 40 is cured. Thus, the capacitor 10 mounted on the metal plate 50, that is, the capacitor unit 1 is completed as shown in FIG.
  • the second resin P2 in a semi-cured state is laid in the case side surface portion 31, the second resin P2 in a molten state is injected into the case side surface portion 31.
  • high adhesion between the case side surface portion 31 and the metal plate 50 is not required, and the installation of the case side surface portion 31 on the metal plate 50 is simplified.
  • both the second resin P2 and the mold resin 40 are cured by one heating. Can be made. Thereby, the capacitor 10 can be efficiently manufactured.
  • the metal plate 50 on which the capacitor 10 is mounted can be used as a manufacturing jig for installing the case side surface portion 31, a dedicated jig (installation table 100 or the like) is not required.
  • the manufacturing method of the said Example 1 and the said Example 2 is also a case where the 2nd resin P2 is the epoxy with which fillers, such as an alumina, were mixed, and the viscosity is low, and also when it is a crystalline epoxy single-piece
  • the manufacturing method of the said Example 3 and the said Example 4 can be used also when the 2nd resin P2 is the epoxy with which fillers, such as an alumina, were mixed, and the viscosity is high.
  • the adhesive force between the two is obtained using an adhesive. You may raise or fix both with fixing means, such as a screw.
  • Example 4 the second resin P2 in a semi-cured state is pressed and expanded from above so that there is no gap with the case side surface portion 31 (see FIG. It was laid down on a metal plate 50).
  • the semi-cured second resin P2 is formed in the shape of the case bottom surface portion 32 in a mold having the same size as the case bottom surface portion 32, and the semi-cured second resin P2 taken out from the mold is You may make it lay on the installation surface 100a (metal plate 50) in the case side part 31.
  • FIG. 1 the installation surface 100a (metal plate 50) in the case side part 31.
  • case bottom surface portion 32 of the case 30 is a high thermal conductivity portion having higher thermal conductivity than the case side surface portion 31, the heat generated in the capacitor element 20 can be effectively released through the case bottom surface portion 32.
  • the capacitor element 20, that is, the entire capacitor 10 is efficiently cooled.
  • the case bottom portion 32 has a higher thermal conductivity than the mold resin 40, the heat of the capacitor element 20 easily flows to the case bottom portion 32. Thereby, the heat of the capacitor element 20 is more easily released through the case bottom surface portion 32.
  • the capacitor element 20 can be brought into contact with the case bottom surface portion 32 in the case 30. Thereby, the heat of the capacitor element 20 is easily transmitted to the case bottom surface portion 32, and is more easily released through the case bottom surface portion 32.
  • the case bottom surface portion 32 contacts the metal plate 50 outside the case 30, the heat of the capacitor element 20 can be further released from the case bottom surface portion 32 to the metal plate 50, and heat is further radiated from the inside of the case 30. It becomes easy.
  • case side surface portion 31A corresponds to the “side surface portion” recited in the claims.
  • case bottom surface portion 32 ⁇ / b> A corresponds to a “bottom surface portion” recited in the claims.
  • FIG. 7A is a plan view of the capacitor 10A according to the second embodiment
  • FIG. 1B is a cross-sectional view taken along the line BB ′ of FIG. 7A according to the second embodiment. It is sectional drawing of the capacitor
  • the capacitor 10A of the present embodiment includes a case 30A different from the case 30 of the capacitor 10 of the first embodiment.
  • Capacitor element 20 is accommodated in case 30 ⁇ / b> A and covered with mold resin 40.
  • the case 30A includes a square cylindrical case side surface portion 31A having both ends opened, and a rectangular case bottom surface portion 32A that closes one end (lower end) of the case side surface portion 31A.
  • the case side surface portion 31A is formed of a resin such as PPS.
  • the entire case bottom surface portion 32 ⁇ / b> A is a high heat conductive portion, is formed of a metal such as aluminum, and has a higher thermal conductivity than the case side surface portion 31 ⁇ / b> A and the mold resin 40.
  • An attachment portion 311 is formed at the lower end portion of the case side surface portion 31A.
  • the attachment portion 311 is formed in a rectangular frame shape, and has attachment holes 311a at four corners.
  • Bolt holes 321 corresponding to the attachment holes 311a are formed at the four corners of the case bottom surface portion 32A.
  • the bolt 33 is passed through the attachment hole 311a and is fixed to the bolt hole 321, so that the attachment portion 311 of the case side surface portion 31A is fixed to the case bottom surface portion 32A by the bolt 33.
  • the capacitor element 20 is arranged in the case 30A in a state of being separated from the case bottom surface portion 32A.
  • the case bottom surface portion 32A is conductive because it is made of metal, but since a distance is provided between the capacitor element 20 and the case bottom surface portion 32A, a short circuit of the capacitor element 20 by the case bottom surface portion 32A is prevented.
  • the capacitor unit may be configured by mounting the capacitor 10A on a metal plate such that the case bottom surface portion 32A contacts the metal plate.
  • the case bottom surface portion 32A is a high thermal conductivity portion having a higher thermal conductivity than the case side surface portion 31A, and therefore the heat generated in the capacitor element 20 can be effectively released through the case bottom surface portion 32A. Further, when the case bottom surface portion 32A is cooled, the capacitor element 20, that is, the entire capacitor 10A is efficiently cooled.
  • case bottom portion 32A has higher thermal conductivity than the mold resin 40, the heat of the capacitor element 20 tends to flow to the case bottom portion 32A. Thereby, the heat of the capacitor element 20 is more easily released through the case bottom surface portion 32A.
  • case bottom portion 32A is made of metal, the strength of the case 30 as a whole can be increased.
  • case 30A is configured such that the attachment portion 311 of the case side surface portion 31A is fixed to the case bottom surface portion 32A, the case side surface portion 31A can be firmly fixed to the case bottom surface portion 32A.
  • case side surface portion 31B corresponds to the “side surface portion” recited in the claims.
  • case bottom surface portion 32B corresponds to a “bottom surface portion” recited in the claims.
  • metal plate 34 corresponds to a “metal part” recited in the claims.
  • FIG. 8A is a plan view of the capacitor 10B according to the third embodiment
  • FIG. 8B is a cross-sectional view taken along the line CC ′ of FIG. 8A according to the third embodiment. It is sectional drawing of the capacitor
  • the capacitor 10B of the present embodiment includes a case 30B that is different from the case 30 of the capacitor 10 of the first embodiment.
  • Capacitor element 20 is accommodated in case 30 ⁇ / b> B and covered with mold resin 40.
  • the case 30B has a rectangular parallelepiped shape whose upper surface is open, and includes a case side surface portion 31B having a rectangular tube shape and a case bottom surface portion 32B having a square shape.
  • the case side surface portion 31B is formed of a resin such as PPS.
  • the case bottom surface portion 32B includes a peripheral portion 322 integrally formed with the case side surface portion 31B from a resin such as PPS, and a metal plate 34 insert-molded in the case 30B so as to be disposed inside the peripheral portion 322.
  • the metal plate 34 is made of aluminum or the like, is a high heat conduction portion, occupies most of the case bottom surface portion 32B, and has a higher thermal conductivity than the case side surface portion 31A and the mold resin 40. The metal plate 34 is exposed inside and outside the case 30B.
  • the capacitor element 20 is in contact with the case bottom surface portion 32B through a sheet-like insulator 60 such as insulating paper. Thereby, a short circuit of the capacitor element 20 due to the metal plate 34 is prevented. Note that a short circuit of the capacitor element 20 may be prevented by providing a distance between the capacitor element 20 and the metal plate 34.
  • the case 30B is generated in the capacitor element 20 because most of the case bottom surface portion 32B is constituted by the insert-molded metal plate 34 and is a high heat conductive portion having higher thermal conductivity than the case side surface portion 31A. Heat can be effectively released through the case bottom surface portion 32B. Further, when the case bottom surface portion 32B is cooled, the capacitor element 20, that is, the entire capacitor 10B is efficiently cooled.
  • case bottom surface portion 32B metal plate 34
  • the heat of the capacitor element 20 easily flows to the case bottom surface portion 32B. Thereby, the heat of the capacitor element 20 is more easily released through the case bottom surface portion 32B.
  • the metal plate 34 is exposed inside the case 30B, the heat inside the case 30B can be transferred well to the metal plate 34.
  • the case 30B may be configured as shown in FIGS. 9 (a) to 9 (c).
  • the outer side of the metal plate 34 is coated with resin so that the metal plate 34 is exposed inside the case 30B but not outside the case 30B. In this way, it is possible to prevent the metal plate 34 from being corroded by moisture existing outside the case 30B.
  • the inner side of the metal plate 34 is coated with resin so that the metal plate 34 is exposed to the outside of the case 30B but not to the inside of the case 30B. In this way, even if the insulator 60 is not provided, a short circuit of the capacitor element 20 due to the metal plate 34 can be prevented.
  • the inside and outside of the metal plate 34 are covered with resin so that the metal plate 34 is not exposed inside or outside the case 30B. In this way, short circuit of the capacitor element 20 due to the metal plate 34 can be prevented, and corrosion of the metal plate 34 can be prevented.
  • case side surface portion 31 corresponds to the “exterior body” recited in the claims.
  • FIG. 10A is a plan view of the capacitor unit 1A according to the fourth embodiment
  • FIG. 10B is a cross-sectional view taken along the line DD ′ of FIG. 10A according to the fourth embodiment. It is sectional drawing of the capacitor
  • the case bottom surface portion 32 is removed from the capacitor 10 of the capacitor unit 1 of the first embodiment, and one end (lower end) of the case side surface portion 31 is a metal plate instead of the case bottom surface portion 32. 50.
  • the metal plate 50 has higher thermal conductivity than the case side surface portion 31 and the mold resin 40.
  • the capacitor element 20 covered with the mold resin 40 in the case side surface portion 31 is separated from the metal plate 50.
  • the metal plate 50 is bonded to the mold resin 40. The adhesion between the metal plate 50 and the mold resin 40 occurs when the mold resin 40 is heated and cured in the process of manufacturing the capacitor unit 1.
  • FIG. 11 is a diagram for explaining a method of manufacturing the capacitor unit 1A according to the fourth embodiment.
  • the case side surface portion 31 is installed on the metal plate 50 so that one end (lower end) thereof is closed. Thereafter, the capacitor element 20 is accommodated in the case side surface portion 31. At this time, the capacitor element 20 is held so as to be separated from the metal plate 50 by a manufacturing holder (not shown).
  • the mold resin 40 before being cured in a molten state is injected into the case side surface portion 31.
  • the case side surface portion 31 is in close contact with the surface of the metal plate 50 to such an extent that the molten mold resin 40 does not leak.
  • the inside of the case side surface 31 is heated and the mold resin 40 is cured.
  • the contact surface of the mold resin 40 with the metal plate 50 is bonded to the metal plate 50 when the mold resin 40 is cured.
  • the capacitor unit 1A is completed as shown in FIG.
  • the capacitor unit 1A When the capacitor unit 1A is manufactured as described above, it is not necessary to take a process of manufacturing the capacitor 10 using a dedicated jig or the like and then bonding the mold resin 40 and the metal plate 50 with heat radiation grease or the like. The manufacture of the capacitor unit 1A is facilitated.
  • the heat generated in the capacitor element 20 can be released through the metal plate 50 having a higher thermal conductivity than that of the resin case side surface portion 31, and effective heat dissipation can be achieved. Yes.
  • the case bottom surface portions 32, 32A, 32B are the high heat conductive portions in the cases 30, 30A, 30B.
  • the case 30, 30A, 30B even if a part (one surface) of the case side surface parts 31, 31A, 31B is a high thermal conductive part. Good.
  • FIG. 12A is a plan view of the capacitor 10C according to the first modification
  • FIG. 12B is a cross-sectional view taken along the line EE ′ of FIG. 12A according to the first modification. It is sectional drawing of the capacitor
  • the capacitor 10 ⁇ / b> C includes a rectangular parallelepiped box-shaped case 70 whose upper surface is open, and the capacitor element 20 is accommodated in the case 70 and covered with the mold resin 40.
  • the case 70 of the four wall surface portions of the case side surface portion 71, three wall surface portions 71a are integrally formed by the case bottom surface portion 72 and the first resin P1, and the remaining one wall surface portion 71b is formed by the second resin P2.
  • the wall surface portion 71b has higher thermal conductivity than the wall surface portion 71a, the case bottom surface portion 72, and the mold resin 40.
  • Capacitor element 20 is arranged in case 70 such that a flat portion of the peripheral surface thereof contacts wall surface portion 71 b of case side surface portion 71.
  • FIG. 13A is a plan view of the capacitor 10D according to the second modification
  • FIG. 13B is a cross-sectional view taken along the line FF ′ of FIG. 13A according to the second modification. It is sectional drawing of capacitor
  • the capacitor 10D according to this modification includes a rectangular parallelepiped box-shaped case 80 whose upper surface is open, and the capacitor element 20 is accommodated in the case 80 and covered with the mold resin 40.
  • the case 80 of the four wall surface portions of the case side surface portion 81, three wall surface portions 81a are integrally formed with the case bottom surface portion 82 and a resin such as PPS, and the remaining one wall surface portion 81b is formed of a metal such as aluminum.
  • the wall surface portion 81 b has higher thermal conductivity than the wall surface portion 81 a, the case bottom surface portion 82, and the mold resin 40.
  • Capacitor element 20 is arranged in case 80 so as to be separated from wall surface portion 81 b of case side surface portion 81.
  • FIG. 14A is a plan view of the capacitor 10E according to the third modified example
  • FIG. 14B is a cross-sectional view taken along the line GG ′ of FIG. 14A according to the third modified example. It is sectional drawing of the capacitor
  • the capacitor 10E according to the present modification includes a rectangular parallelepiped box-shaped case 90 whose upper surface is open, and the capacitor element 20 is accommodated in the case 90 and covered with the mold resin 40.
  • the three wall surface portions 91a of the case side surface portion 91 and the case bottom surface portion 92 are formed of only a resin such as PPS, and the metal plate 35 is insert-molded on the remaining one wall surface portion 91b of the case side surface portion 91.
  • the metal plate 35 is formed of aluminum or the like, and has a higher thermal conductivity than the wall surface portion 91a, the case bottom surface portion 92, and the mold resin 40.
  • Capacitor element 20 is arranged in case 90 so as to be separated from wall surface portion 91 b of case side surface portion 91.
  • the metal plate 35 is exposed inside and outside the case 30B.
  • the metal plate 35 is exposed inside and outside the case 90.
  • the metal plate 35 may be prevented from being exposed to at least one of the inside and the outside of the case 90.
  • the capacitor element 20 may be in contact with the wall surface portions 81b and 91b via insulating paper (insulator).
  • the molten mold resin 40 is injected into the case side surface portion 31 before the second resin P2 in the semi-cured state is cured, and then the case The inside of the side part 31 was heated to cure the second resin P2 and the mold resin 40 at the same time.
  • the case side portion 31 is heated before the molten mold resin 40 is poured into the case side portion 31, so that the second resin P2 is heated. May be cured (see FIG. 3B).
  • the curing temperature of the second resin P2 is set higher than the curing temperature of the mold resin 40, and after the injection of the mold resin 40, the curing temperature of the mold resin 40 is reached.
  • the mold resin 40 is cured by heating the inside of the case side surface portion 31, the second resin P2 may be left in a semi-cured state to form the case bottom surface portion 32 of the semi-cured resin.
  • the case bottom surface portion 32 has viscosity, when the case bottom surface portion 32 is brought into contact with the metal plate 50, the adhesion to the metal plate 50 is improved, and the case bottom surface portion 32 and the metal plate 50 are improved. Heat is easily transmitted.
  • the curing temperature can be controlled relatively easily by changing the type of the main agent and the type of the curing agent, or changing the type and amount of the curing accelerator.
  • the number of capacitor elements 20 included in the capacitors 10, 10A, 10B is not limited to that in the first to fourth embodiments, and can be changed as appropriate according to the required electric capacity.
  • the capacitor element 20 is formed by stacking two metallized films obtained by vapor-depositing aluminum on a dielectric film, and winding or laminating the stacked metallized films.
  • the capacitor element 20 may be formed by stacking a metallized film in which aluminum is vapor-deposited on both sides of the dielectric film and an insulating film and winding or laminating them.
  • condenser element 20 is not restricted to the structure of the above film capacitors.
  • the present invention is useful for capacitors and capacitor units used in various electronic devices, electrical devices, industrial devices, vehicle electrical equipment, and the like, and methods for manufacturing such capacitors and capacitor units.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

L'invention concerne un condensateur (10) comprenant : un élément de condensateur (20); un boîtier (30) dans lequel l'élément de condensateur (20) est logé; et une résine moulée (40) remplie dans le boîtier (30). Le boîtier (30) comprend une section de surface latérale de boîtier (31) et une section de surface inférieure de boîtier (32), et au moins une partie de la section de surface latérale de boîtier (31) ou une partie de la section de surface inférieure de boîtier (32) est une section à conductivité thermique élevée ayant une conductivité thermique supérieure à celle d'autres parties du boîtier (30).
PCT/JP2017/038627 2017-01-06 2017-10-26 Condensateur, unité de condensateur, procédé de production de condensateur et procédé de production d'unité de condensateur Ceased WO2018128005A1 (fr)

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JP2019121736A (ja) * 2018-01-10 2019-07-22 株式会社デンソー コンデンサモジュール
JPWO2021014927A1 (fr) * 2019-07-23 2021-01-28
US20220115183A1 (en) * 2019-08-29 2022-04-14 Murata Manufacturing Co., Ltd. Film capacitor
JP2023059750A (ja) * 2021-10-15 2023-04-27 パナソニックＩｐマネジメント株式会社 ケースレスコンデンサの製造方法
JP2023068544A (ja) * 2021-11-02 2023-05-17 パナソニックＩｐマネジメント株式会社 ケースレスコンデンサ
JP2023090425A (ja) * 2021-12-17 2023-06-29 株式会社指月電機製作所 コンデンサ

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JP2023090425A (ja) * 2021-12-17 2023-06-29 株式会社指月電機製作所 コンデンサ

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