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WO2018108757A1 - Procédé pour assembler un élément porte-composant et une carte de circuit imprimé et assemblage composé d'une carte de circuit imprimé et d'un élément porte-composant - Google Patents

Procédé pour assembler un élément porte-composant et une carte de circuit imprimé et assemblage composé d'une carte de circuit imprimé et d'un élément porte-composant Download PDF

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Publication number
WO2018108757A1
WO2018108757A1 PCT/EP2017/082105 EP2017082105W WO2018108757A1 WO 2018108757 A1 WO2018108757 A1 WO 2018108757A1 EP 2017082105 W EP2017082105 W EP 2017082105W WO 2018108757 A1 WO2018108757 A1 WO 2018108757A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
component carrier
sensor
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2017/082105
Other languages
German (de)
English (en)
Inventor
Jürgen RIETSCH
Andreas Plach
Stephan Bandermann
Bernhard Schuch
Andreas Albert
Jens Menke
Mathias Strecker
Hassene Bel Haj Said
Johannes Bock
Klaus Scharrer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aumovio Microelectronic GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Publication of WO2018108757A1 publication Critical patent/WO2018108757A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Definitions

  • the invention relates to a method for connecting a component carrier with a printed circuit board and a composite of a printed circuit board and a component carrier.
  • the invention has for its object to provide a comparison with the prior art improved method for connecting a component carrier to a printed circuit board and compared to the prior art improved composite of a printed circuit board and a component carrier.
  • the object is achieved by a method for connecting a component carrier with a circuit board having the features of claim 1 and a composite of a conductor ⁇ plate and a component carrier with the features of claim 9.
  • the component carrier is connected to the printed circuit board by means of at least one connecting element.
  • the component carrier is formed as a component ⁇ parent circuit board.
  • a sensor device is arranged on the component carrier as a printed circuit board formed out ⁇ component carrier, so that the component carrier circuit board is designed as a sensor carrier circuit board.
  • this sensor carrier circuit board forms, together with the component configured thereon as a sensor, a so-called sensor dome or printed circuit sensor family, which is connected to the circuit board designed as a main circuit board by means of the method according to the invention.
  • Such main circuit boards with one or more printed circuit board sensor diodes are used, for example, in vehicles, for example in control devices, in particular in transmission control devices.
  • the component can also be designed as a component deviating from a sensor, in particular an electrical or electronic component.
  • the component carrier is conveniently arranged on the circuit board that it is perpendicular to the circuit board ⁇ directed.
  • a longitudinal direction of the component carrier ie the direction of its elongation, runs parallel to a normal vector of the printed circuit board, in particular a flat side of the printed circuit board.
  • the component ⁇ carrier thus stands with one of its transverse sides on a flat side of the circuit board.
  • the device, particularly the sensor is arranged advantageously in the region of the opposite and thus facing away from the circuit board side of the cross Bauele ⁇ ment carrier.
  • the component in particular the sensor, is thus positioned by means of the component carrier, in particular the sensor carrier printed circuit board spaced from the particular designed as a main circuit board ⁇ plate, in particular positioned in a predetermined manner spaced, ie in a predetermined position relative to the main circuit board formed circuit board.
  • the inventive method it is ensured that this position of the component, in particular ⁇ sondere of the sensor is secured, and thus remains unchanged, in particular during subsequent production steps, for example during a subsequent assembly, soldering and / or Plastic injection process, in particular Duroplastum- spraying process or Thermoplastumspritzungsluies.
  • the inventive method improves the connection of the component carrier with the printed circuit board by the use of one or more connecting elements.
  • some advantageous embodiments of joining methods for joining the component carrier to the circuit board by means of one Ver connecting element or more connecting elements are described in more detail.
  • the inventive method in particular ensures that a position of the connected to the circuit board by means of the inventive process the component carrier on the circuit board during one or more subsequent stages of production remains unchanged, for example, during one or more assembly steps and during a Kunststoffum ⁇ spraying process, in which at least the component carrier is partially or completely absorbed in a Kunststoffumspritzungs- tool and partially or completely with a plastic, in particular with a thermoset plastic or thermoplastic resin, is encapsulated.
  • the at least one connecting element or the plurality of connecting elements or one or more connec tion ⁇ elements of a plurality for connecting the component with the printed circuit board Ver ⁇ stattsele used Gebsele ⁇ further elements for electrical connection of the component carrier with the PCB can be used.
  • the at least one connecting element is arranged or formed on the component carrier and is introduced into a correspondingly formed connecting element recess, for example a bore receptacle, in the printed circuit board.
  • the at least one connecting element is designed as a connecting bolt, in particular as a rectangular pin, ie with a rectangular cross section.
  • connection element ⁇ is advantageously achieved in the connecting element receiving.
  • the position of the component carrier with the component, in particular the printed circuit board sensor dome with the sensor can be maintained through various production steps, game as umspritzungsvones at ⁇ during mounting, soldering and / or plastic, in particular Duroplastumspritzungs- process or Thermoplastumspritzungsvones.
  • At least one designed as a soldering angle connecting element is so soldered to the component carrier that an outer side of a free leg of the respective Lötwinkels flush with an edge of the component carrier, the component carrier is so positioned on the Lei ⁇ terplatte that the at least one soldering angle on a soldering surface, also referred to as solder pad, the circuit board rests and wherein the at least one soldering angle with the
  • Soldering surface is soldered.
  • both sides of the component carrier in particular soldered to both flat sides of the component carrier as a printed circuit board, in particular the sensor circuit board carrier, formed Bauele ⁇ ment carrier in each case one or more such soldering angle and soldered after the positioning of the component carrier on the circuit board with corresponding lands on the circuit board.
  • the respective soldering angle is geometrically dimensioned so that it can absorb occurring mechanical forces in subsequent production steps, in particular assembly, soldering and / or plastic extrusion steps.
  • one or more connecting bolts or positioning bolts also referred to as positioning pins, may also be arranged on the component carrier, in particular on the sensor carrier printed circuit board.
  • a pre-positioning of the component carrier on the printed circuit board for the subsequent soldering of the respective soldering angle to the respective soldering surface on the printed circuit board is ensured, i. H. a position accuracy is further increased.
  • the printed circuit board expediently has corresponding corresponding recesses, as already described above.
  • At least one connecting element designed as a soldering shoe is soldered to the printed circuit board and the component carrier is introduced into the soldering shoe.
  • the soldering shoe surrounds the component carrier, in particular the printed circuit sensor family or. its sensor carrier circuit board, in a lower area, d. H. in the region of the side facing away from the component and provided for connection to the printed circuit board transverse side of the component carrier.
  • the assembly with the following contact closure on the component carrier, in particular on PCB sensor dome or At the sensor carrier circuit board, can be ensured with positionally defined pads, ie solder pads.
  • a contact surface of the soldering shoe is soldered to a contact surface of the printed circuit board.
  • an electrical contact closure can be produced via a defined clamping geometry on the soldering shoe to the contact surface on the printed circuit board.
  • a corresponding, in particular geometric shape of the soldering shoe is si ⁇ cherhog that a parallel to the flat side of the circuit board extending leg of Lötschuhs, also referred to as spring legs, is pressed by a spring action of this leg with a sufficient clamping force to the contact surface on the circuit board so that there is no break in contact.
  • the clamp ⁇ force is so large dimensions of the dimensioning of the Lötschuhs that the leg during later stages of production, in particular during the Art ⁇ stoffumspritzungsraties, such as the thermal or Duroplastumspritzungsvons, does not lift off from the circuit board, but no damage to the PCB instead ⁇ finds.
  • At least one designed as a press-in connection element each with an area in the component carrier, particularly in the Porterplattensens ⁇ ordom or in the sensor carrier circuit board, and the printed circuit board, in particular in the main board, Scheme- pressed.
  • a plurality of such Einpres- are pressed elements in the manner described.
  • the electrical contacting of the component carrier may also by means of this Einpressiatas or dedicated ⁇ effected by means of a plurality of such clinch fasteners via the conductor terplatte done.
  • the press-in element is also referred to as contact pin.
  • the component carrier is pre-equipped with the respective press-in element.
  • the number of press-fit elements is expediently dependent on a required number of electrical contact guides from the component carrier to the printed circuit board and vice versa.
  • the clinch fasteners are advantageously so arranged ⁇ that there is no one-sided assembly and / or tilting of the component carrier. Therefore expedient ⁇ ßigerweise be positioned on both flat sides of the device carrier respectively, one or more clinch fasteners to the posi tion ⁇ accuracy of the device, particularly the sensor, si ⁇ cherrier.
  • An arrangement of the press-in elements on a front side should be such that equal distances to the left and right, ie to the longitudinal sides of the component carrier, are given.
  • the areas to be pressed in, ie the press-fit pins, of the press-in elements can be designed, for example, in each case as a so-called pressfit contact pin or as a longitudinally knurled contact pin.
  • the pre-assembled component carrier can be pressed with the same Einpresspinaus Installation in the circuit board. A press-in force is selected so that subsequent processes can be carried out, in particular the assembly, soldering and / or plastic extrusion process described above.
  • the pre-assembled component carrier is expediently extrusion-coated with the printed circuit board in a further process step, ie in the plastic extrusion process, with thermoset or thermosetting plastic.
  • At least one connecting element designed as a press-in soldering element or a plurality of such press-in soldering elements is pressed into the component carrier, the component carrier is mounted on the printed circuit board. orders and the respective Einpresslötelement is soldered to the circuit board.
  • This embodiment thus represents a combination of pressed-in pins of the component carrier and soldered contact pins in the printed circuit board.
  • these press-in soldering elements are also used for electrically connecting the component carrier to the printed circuit board.
  • a press-in solder element is added to the component carrier per required electrical contact guidance.
  • the press-in pin part of the respective Einspresslötiatas may for example be designed as a PressfitWalletpin or as a lekssgerändelter contact pin.
  • the respective Einpresslötelement is or is angled at 90 ° and thus allows a vertical mounting on the circuit board and is accurately positioned to ensure a sensor signal for each ⁇ specific execution specification.
  • the respective Einpresslötelement can be arranged so that the soldering in the circuit board is given a uniform distance image for the following soldering process.
  • At least one connecting element designed as a bolt is fastened to the printed circuit board and at least one further connecting element designed as a pinch terminal receptacle is fastened to the component carrier and the component carrier is fastened to the at least one pin by attaching the at least one pin clamp receptacle
  • the pinch terminal receptacle is also referred to as a contact cage, in particular if the electrical connection of the component carrier with the printed circuit board via these corresponding connecting elements.
  • a plurality of bolts and a plurality of pin clamp receptacles are provided.
  • the respective pinch clamp receptacle, ie the contact cage, is soldered to the component carrier.
  • the connection of the component carrier with the PCB is a powerless tolerance compensation in the X and Y direction allows, ie in the transverse direction and thickness direction of the component carrier.
  • the tolerance compensation can be used for the inclusion in Kunststoffumspritzungswerkmaschinemaschine so that only small forces are exerted on the electrical contact points.
  • the bolts are pressed as press-in elements into the electrical contact positions for a preassembled component carrier.
  • the pre-assembled component carrier which already has the component, for example, the sensor so that it is designed as a printed circuit sensor, and which also already has the Bolzenklemmingn, ie is completely pre-assembled, is manually, semi-automatically or fully automated on block at the intended position on the circuit board joined, ie put on the bolt on ⁇ .
  • the component carrier suitably encapsulated, including the device, to the circuit board with thermoset or thermoplastic.
  • the component carrier is expediently extrusion-coated with a plastic, for example with a thermoset plastic or thermoplastic plastic, at least in some areas after connecting the component carrier to the conductor bar.
  • a plastic for example with a thermoset plastic or thermoplastic plastic
  • the component carrier with the component thereon in the case of the formation of the device as a sensor thus the entire printed circuit sensor, and expediently also the circuit board, which is for example designed as a main circuit board, with the plastic from ⁇ cut way, or preferably completely encapsulated ,
  • Bauele- is ment carrier to the device, ie in particular the printed circuit ⁇ plattensensordom formed such that they Supportgeo ⁇ geometries, ie corresponding formations have an exact positioning in the Kunststoffumspritzungswerkmaschine to during the plastic extrusion process to secure the position of the device, in particular of the sensor, and thereby to avoid position changes which could affect a subsequent function of the device, in particular a sensing means of the sensor.
  • the component carrier is connected by means of at least one connecting element to the circuit board, for example by means of one or more of the above-described connecting elements, wherein also different connecting elements can be provided.
  • the component carrier is designed, for example, as a component carrier circuit board.
  • the device is in particular designed as a sensor, so that the component carrier is then formed as a sensor support circuit board ⁇ forming a conductor plattensensordom together with the sensor.
  • Such main boards are plate-sensor domes with one or more wire used for example in vehicles, for example in control devices, in particular in Ge ⁇ gearbox control units.
  • control devices for example in vehicles, for example in control devices, in particular in Ge ⁇ gearbox control units.
  • Ge ⁇ gearbox control units there are also a variety of other uses conceivable.
  • At least the component carrier is at least partially encapsulated with a plastic, in ⁇ example, with a thermoset or thermoplastic resin.
  • the component carrier with the component disposed thereon in the case of the formation of the component as a sensor thus the entire printed circuit sensor, and expediently also the circuit board, which is for example designed as a main circuit board, with the plastic from ⁇ cut way, or preferably completely encapsulated.
  • FIG. 1 shows schematically an embodiment of a composite of a printed circuit board and a component carrier
  • Figure 2 schematically a further embodiment of a
  • FIG. 3 shows schematically a further embodiment of a
  • FIG. 5 schematically shows a further embodiment of a
  • FIG. 6 shows schematically a further embodiment of a
  • FIG. 7 schematically shows a further view of the embodiment from FIG. 6.
  • Figures 1 to 7 show various embodiments of a composite 1 of a printed circuit board 2 and a component ⁇ carrier 3, wherein the circuit board 2 is not shown in Figure 1.
  • a component 4 is arranged, in particular an electrical or electronic component 4, so that a component unit 6 is formed.
  • the composite 1 of printed circuit board 2 and component carrier 3 with component 4 is formed in a method for connecting the component carrier 3 to the printed circuit board 2 by the component carrier 3 is connected by means of at least one Kirsele ⁇ mentes 5 with the circuit board 2.
  • Figures 1 to 7 show different embodiments of connection elements are shown 5, by means of which the component carrier 3 arranged thereon member 4 and the printed board 2 are connected to each other ⁇ .
  • the component carrier 3 is designed in particular as a sensor carrier circuit board for a sensor 4 designed as a sensor and forms together with the component 4 arranged thereon a so-called printed circuit sensor, which is connected by means of one or more connecting elements 5 with the printed circuit board formed as a main circuit board 2.
  • the illustrated embodiments each show this advantageous embodiment of the component carrier 3 as a sensor ⁇ carrier printed circuit board, the component 4 as a sensor and the circuit board 2 as the main circuit board. Therefore, the component carrier 3 is referred to as Sensordovplatte 3, the component 4 as a sensor 4, the component unit 6 from Sen ⁇ sor dileiterplatte 3 and the sensor 4 as printed circuit board ⁇ sensordom 6 and the circuit board 2 as the main circuit board 2 below.
  • the illustrated composite 1 is used for example in a vehicle, for example in a transmission control unit.
  • the sensor 4 is positioned at a distance from the main circuit board 2 by means of the sensor carrier circuit board 3, since it is arranged in the region of a transverse side of the sensor carrier circuit board 3 facing away from the main circuit board 2, which is positioned perpendicular to the main circuit board 2. Ie. a longitudinal ⁇ direction of the sensor carrier circuit board 3 is parallel to a normal vector of the main circuit board 2, more precisely parallel to a normal vector of a flat side of the main circuit board 2, on which the sensor carrier circuit board 3 is arranged.
  • the longitudinal direction of the sensor carrier circuit board 3 is the direction in which a length, ie, a largest dimension, of the sensor carrier circuit board 3 extends. This makes it possible, respectively, to bring to a housing of the transmission or usher in the housing of the gear unit or to arrange the sensor 4, at least at or in an opening of the housing of the transmission control unit.
  • a joining process ie the joining of the sensor carrier circuit board 3 to the main circuit board 2 can take place, for example, via a clamping of at least one connecting element 5 designed as a rectangular pin and shown in FIG. 1 in a connecting element recess designed as a bore receptacle in the main circuit board 2.
  • a Facultyeckpin is a connecting pin having a rectangular cross section, which at the sensor support circuit board 3, that is remote from a from the sensor 4 and thus the main circuit board 2 facing transverse side of the sensor carrier board 3 is ⁇ arranged or formed.
  • the position of the assembled sensor 4 is held in an assembly, soldering and later Duroplastum- spitzungsrea.
  • the printed circuit board sensor dome 6 is completely encapsulated with plastic 7, here thermoset, which extends to the main circuit board 2 so that it is also coated or encapsulated in the surrounding area of the printed circuit sensor 6 with the plastic 7, here with the thermosetting plastic ,
  • a further variant for connecting a vertical PCB sensor dome 6 may be soldering angles soldered on both sides as a connecting element 5, as shown in FIG. 2, it being expedient to provide a plurality of soldering angles of this kind.
  • the respective soldering angle ends with its legs on the sensor carrier circuit board 3 and is pre-assembled by a soldering process.
  • the soldering angles can thus be soldered in a positionally accurate manner on soldering surfaces of the main circuit board 2 designed as soldering pads.
  • FIG. 2 shows such a positioning pin as an additional connecting element 5.
  • the soldering angle is geometrically dimensioned such that it can absorb the mechanical forces of the following assembly steps until the later thermo-plastic or thermoset extrusion-coating process.
  • plastic 7, here thermoplastic or thermosetting plastic which extends up to the main circuit board 2, so that it is also coated or in the surrounding area of the printed ⁇ least ensor dome 6 with the plastic 7 encapsulated.
  • the Verbin ⁇ dung element 5 is formed as a Lötschuh which encloses the conductor ⁇ plattensensordom 6 in the lower area, ie facing in the area of the main board 2 lateral side.
  • several soldering shoes can be mounted on the main circuit board 2.
  • the assembly with the following electrical contact closure on the printed circuit sensor family 6 can be ensured with positionally defined soldering pads, ie soldering surfaces.
  • a contact surface of the soldering shoe is soldered to a contact surface of the main circuit board 2, as illustrated by a schematically illustrated solder joint 8.
  • Another electrical contact closure can also be produced via a defined clamping geometry on the soldering shoe to the contact surface on the main printed circuit board 2.
  • a required clamping ⁇ force which must be applied to a pressing of spring legs of the soldering shoes to the contact surfaces of
  • Main circuit board 2 without interruption to ensure contact is achieved by an appropriate training, in particular geo ⁇ metric shape, the respective soldering shoe.
  • the clamping force is chosen so large that the spring legs do not lift off as a result of the subsequent process of the later thermo-plastic or thermoset molding process, but no damage to the main circuit board 2 takes place either.
  • the printed circuit sensor family 6 is completely encapsulated with plastic 7, in this case thermoset or thermosetting plastic, which extends to the main circuit board 2, so that it is also coated or encapsulated with the plastic 7 in the surrounding area of the circuit board sensor dome 6.
  • FIG. 4 shows a further embodiment in order to withstand especially occurring process forces and to ensure reliable electrical contacting in every situation.
  • the connecting elements 5 are formed as an ⁇ press elements. Since they are also used are used, they are also referred to as contact pins. These trained as contact pins Einpressele ⁇ elements are pressed into the printed circuit sensor array 6 and the main circuit board 2.
  • the printed circuit sensor system 6 is pre-equipped with the respective press-in element.
  • the number of gleichsele ⁇ formed as a press-in elements 5 is dependent on the required number of electrical contact guides of the main circuit board 2 in the sensor carrier circuit board 3 and vice versa.
  • the arrangement of the press-fit elements should be selected such that no one-sided assembly and no tilting of the printed circuit sensor dome 6 occurs.
  • the front side is the flat side of the sensor carrier circuit board 3, on which the sensor 4 is arranged.
  • the press-in elements in particular press-fit pins, ie the connecting elements 5, can each be designed as a press fit contact pin or as a longitudinally knurled contact pin.
  • the pre-assembled printed circuit sensor array 6 can be pressed into the main printed circuit board 2 with the same press-pin design, ie the two sides of the press-in elements which are provided for pressing into the sensor substrate 3 or into the main printed circuit board 2 can have the same design. Alternatively, they can also be designed differently.
  • a press-in force is chosen so that subsequent processes can be Runaway ⁇ leads.
  • the preassembled Leiterplattensensordom 6 is connected to the main circuit board 2 in a further process step with plastic ⁇ 7, ie, with thermoplastic or thermosetting plastic, injection-molded, as shown in Figure 4 and described above.
  • FIG. 5 a variant of the combination of pressed-in pins in the printed circuit sensor family 6 and soldered contact pins in the main printed circuit board 2 is possible, as in FIG. 5 shown.
  • the respective Einpresslötelement has a press-in pin and a solder pin, wherein the press-in pin, as already described, in the printed circuit sensor sensor 6, more precisely in the sensor carrier circuit board 3, is pressed and the solder pin is soldered into the main ⁇ printed circuit board 2.
  • the press-in pin can be designed as a PressfitWalletpin or as a longitudinally knurled contact pin.
  • the Einpresslötelement is angled 90 °, ie its A ⁇ presspin and Lötpin are arranged at right angles to each other. It thus allows vertical mounting on the main circuit board 2 and is accurately positioned to ensure the sensor signal for the particular design specification.
  • the Einpresslötelement can be arranged so that the soldering in the main circuit board 2 is given a uniform distance image for the following soldering process.
  • the printed circuit sensor array 6 with the main circuit board 2 is overmoulded with the corresponding plastic 7 in a thermo-plastic or thermoset extrusion coating process, as shown in FIG. 5 and already described above.
  • FIGS. 6 and 7 shows the composite 1 rotated relative to FIG.
  • 3 connecting elements 5 are provided on the main circuit board 2 and on the sensor carrier circuit board, which also serve the electrical contacting of main circuit board 2 and sensor carrier circuit board 3.
  • the connecting elements 5 on the main circuit board 2 are each formed as a bolt, also referred to as a contact pin.
  • the connecting elements 5 on the sensor carrier circuit board 3 are each pin clamp receptacle, also referred to as a contact cage, designed to receive a respective bolt of the main circuit board 2.
  • the Bolzenklemmingn are soldered to the printed circuit sensor sensor 6, more precisely to the sensor carrier circuit board 3.
  • the tolerance compensation can be used for recording in Umspritz- ungswerkmaschine, so that exerted only small forces on the contact points become.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

L'invention concerne un procédé pour assembler un élément porte-composant (3) et une carte de circuit imprimé (2), l'élément porte-composant (3) et la carte de circuit imprimé (2) étant assemblés l'un à l'autre au moyen d'au moins un élément d'assemblage (5). L'invention concerne en outre un assemblage (1) composé d'une carte de circuit imprimé (2) et d'un élément porte-composant (3).
PCT/EP2017/082105 2016-12-12 2017-12-08 Procédé pour assembler un élément porte-composant et une carte de circuit imprimé et assemblage composé d'une carte de circuit imprimé et d'un élément porte-composant Ceased WO2018108757A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016224657.7 2016-12-12
DE102016224657.7A DE102016224657A1 (de) 2016-12-12 2016-12-12 Verfahren zum Verbinden eines Bauelementträgers mit einer Leiterplatte und Verbund aus einer Leiterplatte und einem Bauelementträger

Publications (1)

Publication Number Publication Date
WO2018108757A1 true WO2018108757A1 (fr) 2018-06-21

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Application Number Title Priority Date Filing Date
PCT/EP2017/082105 Ceased WO2018108757A1 (fr) 2016-12-12 2017-12-08 Procédé pour assembler un élément porte-composant et une carte de circuit imprimé et assemblage composé d'une carte de circuit imprimé et d'un élément porte-composant

Country Status (2)

Country Link
DE (1) DE102016224657A1 (fr)
WO (1) WO2018108757A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020501377A (ja) * 2016-12-12 2020-01-16 シー・ピー・ティー ツヴァイ ゲー・エム・ベー・ハーＣＰＴ Ｚｗｅｉ ＧｍｂＨ プリント基板複合体およびプリント基板複合体を製造する方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4230530B1 (fr) * 2022-02-18 2025-05-21 Goodrich Lighting Systems GmbH & Co. KG Lumière d'aéronef et aéronef la comprenant

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3522485A (en) * 1967-11-21 1970-08-04 Automatic Radio Mfg Co Modular circuit construction
DE2441209A1 (de) * 1974-08-28 1976-03-11 Erie Elektronik Gmbh Elektrische anschlusskontaktierung
EP0148461A1 (fr) * 1983-12-20 1985-07-17 Siemens Aktiengesellschaft Methode de production d'un circuit électrique multi-couches avec des bornes de raccordement
US20070178729A1 (en) * 2006-01-31 2007-08-02 Sharp Kabushiki Kaisha Electronic circuit module and method for fabrication thereof
JP2007194160A (ja) * 2006-01-23 2007-08-02 Matsushita Electric Ind Co Ltd プリント基板接続方法
US20090197435A1 (en) * 2008-01-31 2009-08-06 Fred Jessup Printed circuit board direct connection and method of forming the same
DE102016101757A1 (de) * 2015-02-04 2016-08-04 Cyntec Co., Ltd Schaltungsmodul mit oberflächenmontierbaren unterlagsblöcken zum anschliessen einer leiterplatte

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3522485A (en) * 1967-11-21 1970-08-04 Automatic Radio Mfg Co Modular circuit construction
DE2441209A1 (de) * 1974-08-28 1976-03-11 Erie Elektronik Gmbh Elektrische anschlusskontaktierung
EP0148461A1 (fr) * 1983-12-20 1985-07-17 Siemens Aktiengesellschaft Methode de production d'un circuit électrique multi-couches avec des bornes de raccordement
JP2007194160A (ja) * 2006-01-23 2007-08-02 Matsushita Electric Ind Co Ltd プリント基板接続方法
US20070178729A1 (en) * 2006-01-31 2007-08-02 Sharp Kabushiki Kaisha Electronic circuit module and method for fabrication thereof
US20090197435A1 (en) * 2008-01-31 2009-08-06 Fred Jessup Printed circuit board direct connection and method of forming the same
DE102016101757A1 (de) * 2015-02-04 2016-08-04 Cyntec Co., Ltd Schaltungsmodul mit oberflächenmontierbaren unterlagsblöcken zum anschliessen einer leiterplatte

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020501377A (ja) * 2016-12-12 2020-01-16 シー・ピー・ティー ツヴァイ ゲー・エム・ベー・ハーＣＰＴ Ｚｗｅｉ ＧｍｂＨ プリント基板複合体およびプリント基板複合体を製造する方法

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