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WO2018145234A1 - Dispositif de reconnaissance d'empreintes digitales - Google Patents

Dispositif de reconnaissance d'empreintes digitales Download PDF

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Publication number
WO2018145234A1
WO2018145234A1 PCT/CN2017/073021 CN2017073021W WO2018145234A1 WO 2018145234 A1 WO2018145234 A1 WO 2018145234A1 CN 2017073021 W CN2017073021 W CN 2017073021W WO 2018145234 A1 WO2018145234 A1 WO 2018145234A1
Authority
WO
WIPO (PCT)
Prior art keywords
collar
sensor chip
cover plate
support frame
fingerprint recognition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2017/073021
Other languages
English (en)
Chinese (zh)
Inventor
许炜添
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Goodix Technology Co Ltd
Original Assignee
Shenzhen Huiding Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Huiding Technology Co Ltd filed Critical Shenzhen Huiding Technology Co Ltd
Priority to PCT/CN2017/073021 priority Critical patent/WO2018145234A1/fr
Priority to CN201780005767.5A priority patent/CN108701212B/zh
Publication of WO2018145234A1 publication Critical patent/WO2018145234A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition

Definitions

  • the smallest package sensor chip is commonly used in existing fingerprint modules.
  • the size of the smallest package sensor chip often cannot meet the user's requirements for appearance, it is necessary to fill other spaces through the support frame 4 as shown in FIG. 1; since the material of the support frame is usually metal, and the minimum package sensor chip The material is resin, and the thermal expansion coefficient of the two is different during the assembly process, and the bonding of the cover plate is easily pulled by the stress to cause deformation.
  • the technical solutions adopted by the embodiments of the present invention include:
  • a fingerprint identification device includes a circuit board, a conductive component, a sensor chip, a collar and a cover plate; the sensor chip is mounted on the circuit board through a conductive component, and the collar is disposed around the outer side of the sensor chip, A cover plate covers the sensor chip and the collar.
  • the technical solution adopted by the embodiment of the present invention further includes a support frame, and the support frame is disposed around the outer side of the collar.
  • the technical solution adopted by the embodiment of the present invention further includes: the support frame is an L-shaped structure, an inner edge of the vertical surface of the L-shaped structure is in contact with an outer edge of the collar, and a horizontal plane of the L-shaped structure passes through the second fixing component. Fixed to the board.
  • the technical solution adopted by the embodiment of the present invention further includes a bonding component, and the cover plate is bonded by the bonding component and covers the sensor chip and the collar.
  • Another technical solution adopted by the embodiment of the present invention is: a mobile terminal, including the fingerprint identification device described above.
  • the beneficial effect of the embodiment of the present invention is that the fingerprint identification device of the embodiment of the present invention solves the minimum package sensor by adding a collar with a color and a material close to the outer side of the smallest package sensor chip.
  • the size of the chip can not meet the appearance requirements, and avoids the problem that the use of the support frame causes the deformation of the cover to be easily pulled by the stress after the cover is attached, and the chromatic aberration occurs after the cover is attached, and the module cost is reduced.
  • FIG. 1 is a schematic structural view of a conventional fingerprint module
  • FIG. 2 is a schematic structural diagram of a fingerprint identification device according to a first embodiment of the present invention
  • FIG. 6 is a schematic view of a cover plate provided with a blind hole according to a third embodiment of the present invention.
  • Fig. 7 is a view showing an application effect of the fingerprint recognition apparatus of the third embodiment of the present invention.
  • FIG. 2 is a schematic structural diagram of a fingerprint identification apparatus according to a first embodiment of the present invention.
  • the fingerprint identification device of the first embodiment of the present invention comprises a circuit board 1, a conductive component 2, a sensor chip 3, a collar 4, a support frame 5, a cover plate 6, and a bonding assembly 7; wherein the sensor chip 3 is mounted by the conductive component 2 Set in electricity
  • the circuit board 1 is electrically connected to the circuit board 1.
  • the collar 4 is disposed around the outer side of the sensor chip 3.
  • the bottom of the collar 4 is fixed to the circuit board 1 by the first fixing component 8.
  • the support frame 5 is disposed on the outer side of the collar 4, and the support frame 5 has a stepped shape, the stepped corner of the inner edge overlaps the collar 4, and the bottom is fixed to the circuit board 1 by the second fixing component 9;
  • the collar 4 is pressed by the support frame 5 to fix the collar 4.
  • the cover plate 6 is bonded by the bonding member 7 and covers the sensor chip 3 and the collar 4, and the bonding surface of the cover plate 6 and the bonding member 7 is provided with an ink layer 10.
  • the top ends of the support frame 5 and the cover plate 6 may be in the same plane or may not be in the same plane, and may be disposed according to assembly requirements.
  • the conductive member 2 includes solder or conductive paste or the like.
  • the collar 4 is a ring structure
  • the sensor chip 3 is a minimum package sensor chip
  • the collar 4 corresponds to the size of the sensor chip 3.
  • the collar 4 is made of high molecular weight synthetic resin or The natural resin is similar to the color and material of the sensor chip 3. Therefore, the size of the sensor chip can not meet the appearance requirements, and the deformation of the cover is easy to be deformed by the stress after the cover is attached, and the cover is attached. After the problem of chromatic aberration.
  • the first fixing component 8 is a curing gel such as an underfill or a structural adhesive.
  • the second fixing component 9 is a structural adhesive or a conductive silver adhesive, and the bottom of the support frame 5 can also be fixed on the circuit board 1 by soldering.
  • the collar 4 is a ring structure
  • the sensor chip 3 is a minimum package sensor chip
  • the collar 4 corresponds to the size of the sensor chip 3
  • the collar 4 is made of a high molecular weight synthetic resin or The natural resin is similar to the color and material of the sensor chip 3. Therefore, the size of the sensor chip can not meet the appearance requirements, and the deformation of the cover is easy to be deformed by the stress after the cover is attached, and the cover is attached. After the problem of chromatic aberration.
  • the bonding member 7 is an epoxy group, a silica gel system, an adhesive of an acrylic system, or an adhesive film.
  • the first fixing component 8 is a curing gel such as an underfill or a structural adhesive.
  • the second fixing component 9 is a structural adhesive or a conductive silver paste, and the bottom of the support frame 5 can also be fixed on the circuit board 1 by soldering.
  • FIG. 4 is an application effect diagram of the fingerprint identification device according to the first embodiment and the second embodiment of the present invention.
  • a collar 4 having a color and a material close to the outside of the sensor chip 3 of the smallest package by adding a collar 4 having a color and a material close to the outside of the sensor chip 3 of the smallest package, and fixing the collar 4 through the outer support frame 5, Resolving the size of the smallest package sensor chip can not meet the appearance requirements, and avoids the problem that the use of the support frame causes the deformation of the cover plate to be easily pulled by the stress after the cover is attached, and the chromatic aberration occurs after the cover plate is attached.
  • FIG. 5 is a schematic structural diagram of a fingerprint identification apparatus according to a third embodiment of the present invention.
  • a fingerprint identification device includes a circuit board 1, a conductive component 2, a sensor chip 3, a collar 4, a cover plate 6, and a bonding assembly 7; wherein the sensor chip 3 is mounted on the circuit board through the conductive component 2 1 and electrically connected to the circuit board 1; the collar 4 is disposed around the outer side of the sensor chip 3, and the bottom of the collar 4 is fixed to the circuit board 1 by the first fixing component 8.
  • the cover plate 6 is bonded and covered by the bonding assembly 7 Above the sensor chip 3 and the collar 4, an ink layer 10 is provided on the bonding surface of the cover 6 and the bonding assembly 7.
  • a blind hole 11 is disposed on the cover plate 6 at a position relative to the sensor chip 3 and the collar 4, as shown in FIG. 6, which is a schematic view of a cover plate provided with a blind hole according to the third embodiment of the present invention.
  • the conductive member 2 includes solder or conductive paste or the like.
  • the bonding member 7 is an epoxy group, a silica gel system, an adhesive of an acrylic system, or an adhesive film.
  • the first fixing component 8 is a curing gel such as an underfill or a structural adhesive.
  • FIG. 7 is a view showing an application effect of the fingerprint recognition apparatus according to the third embodiment of the present invention.
  • the fingerprint recognition device is used on the IFS by providing the blind hole 11 on the cover 6, and the penetration of the sensor chip 3 is ensured.
  • the fingerprint identification device of the embodiment of the invention adds a collar and a material close to the outer side of the smallest package sensor chip, and the size of the minimum package sensor chip cannot meet the appearance requirement, and the use of the support frame is avoided. After the cover is attached, it is easily pulled by stress and deformed. And the problem of chromatic aberration after the cover is attached, and the cost of the module is reduced.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Data Mining & Analysis (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Evolutionary Biology (AREA)
  • Evolutionary Computation (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Artificial Intelligence (AREA)
  • Image Input (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)

Abstract

L'invention concerne un dispositif de reconnaissance d'empreinte digitale, comprenant : une carte de circuit imprimé (1), un composant conducteur (2), une puce de capteur (3), un collier (4) et une plaque de recouvrement (6); la puce de capteur (3) étant disposée sur la carte de circuit imprimé (1) au moyen du composant conducteur (2), le collier (4) entourant le côté extérieur de la puce de capteur (3), la plaque de recouvrement (6) recouvrant la puce de capteur (3) et le collier (4) par le dessus. En ajoutant, sur le côté extérieur de la puce de capteur (3) ayant un emballage minimal, un collier (4) dont la couleur et le matériau sont proches de ceux de la puce de capteur (3), ledit dispositif de reconnaissance d'empreintes digitales résout le problème selon lequel les dimensions de la puce de capteur (3) ayant un emballage minimal ne peuvent pas satisfaire aux exigences d'apparence, évite le problème de déformation de la plaque de recouvrement (6), provoqué par le fait que la plaque de recouvrement (6) est sujette à une traction de contrainte après que la plaque de recouvrement (6) a été liée dans le cas d'une utilisation d'un cadre de support, et le problème de différence de couleur après que la plaque de recouvrement (6) a été lié, et réduit les coûts de module.
PCT/CN2017/073021 2017-02-07 2017-02-07 Dispositif de reconnaissance d'empreintes digitales Ceased WO2018145234A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2017/073021 WO2018145234A1 (fr) 2017-02-07 2017-02-07 Dispositif de reconnaissance d'empreintes digitales
CN201780005767.5A CN108701212B (zh) 2017-02-07 2017-02-07 一种指纹识别装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/073021 WO2018145234A1 (fr) 2017-02-07 2017-02-07 Dispositif de reconnaissance d'empreintes digitales

Publications (1)

Publication Number Publication Date
WO2018145234A1 true WO2018145234A1 (fr) 2018-08-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/073021 Ceased WO2018145234A1 (fr) 2017-02-07 2017-02-07 Dispositif de reconnaissance d'empreintes digitales

Country Status (2)

Country Link
CN (1) CN108701212B (fr)
WO (1) WO2018145234A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101681216A (zh) * 2007-05-31 2010-03-24 日本写真印刷株式会社 嵌入成型用层叠物及其制造方法、嵌入成型品及其制造方法
KR101431566B1 (ko) * 2014-04-08 2014-08-21 (주)드림텍 베젤 내부에 부품 실장이 가능한 지문인식 모듈 제조방법 및 그 지문인식 모듈
CN204009947U (zh) * 2014-08-26 2014-12-10 南昌欧菲生物识别技术有限公司 指纹识别装置及终端设备
CN104700083A (zh) * 2015-03-06 2015-06-10 南昌欧菲生物识别技术有限公司 指纹识别装置及其制造方法、触摸屏、终端设备
CN204557433U (zh) * 2015-02-03 2015-08-12 宸鸿科技(厦门)有限公司 触控装置
CN205318404U (zh) * 2015-11-02 2016-06-15 魅族科技（中国）有限公司 一种指纹模组及终端

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8957868B2 (en) * 2011-06-03 2015-02-17 Microsoft Corporation Multi-touch text input
CN106095195B (zh) * 2016-08-16 2018-03-30 广东欧珀移动通信有限公司 输入组件及终端
CN206489588U (zh) * 2017-02-07 2017-09-12 深圳市汇顶科技股份有限公司 一种指纹识别装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101681216A (zh) * 2007-05-31 2010-03-24 日本写真印刷株式会社 嵌入成型用层叠物及其制造方法、嵌入成型品及其制造方法
KR101431566B1 (ko) * 2014-04-08 2014-08-21 (주)드림텍 베젤 내부에 부품 실장이 가능한 지문인식 모듈 제조방법 및 그 지문인식 모듈
CN204009947U (zh) * 2014-08-26 2014-12-10 南昌欧菲生物识别技术有限公司 指纹识别装置及终端设备
CN204557433U (zh) * 2015-02-03 2015-08-12 宸鸿科技(厦门)有限公司 触控装置
CN104700083A (zh) * 2015-03-06 2015-06-10 南昌欧菲生物识别技术有限公司 指纹识别装置及其制造方法、触摸屏、终端设备
CN205318404U (zh) * 2015-11-02 2016-06-15 魅族科技（中国）有限公司 一种指纹模组及终端

Also Published As

Publication number Publication date
CN108701212B (zh) 2021-08-31
CN108701212A (zh) 2018-10-23

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