WO2018143506A1 - Transfer location-measuring test dummy used in semiconductor or display system field and precise transfer measuring method using transfer location-measuring test dummy used in semiconductor or display system field - Google Patents

Abstract

A disclosed transfer location-measuring test dummy used in a semiconductor or display system field comprises a dummy body, a pinhole image measuring member, a slot image measuring member, and a central processing member. Therefore, the test dummy is advantageous in that the same can measure the height of a slot inside a storage case so as to prevent an object to be sensed from colliding against the slot, and can determine whether the object to be sensed is transferred normally to a location to which the object is to be transferred in a manufacturing device by using a lift pinhole even when a separate reference point is not formed.

Description

Precision transfer measuring method using a test dummy for measuring the transfer position used in the semiconductor or display system field and a test dummy for measuring the transfer position used in the semiconductor or display system field

The present invention relates to a test transfer for measuring the transfer position used in the field of semiconductor or display system and a precision transfer measuring method using the test dummy for measuring the transfer position used in the field of semiconductor or display system.

In semiconductor devices, tens of thousands to billions of electronic components are formed on very small and thin chips.

It is a wafer that is used as an important material for making such a semiconductor device. Here, a wafer is a disk-shaped board which sliced the single crystal pillar obtained by growing silicon (Si), gallium arsenide (GaAs), etc.

Such wafers are subjected to various manufacturing processes for manufacturing semiconductor devices, and devices such as transistors and diodes are formed on the surface thereof, and hundreds of IC chips may be arranged.

In this manufacturing process, a transfer robot is applied to transfer the wafer to each manufacturing step.

Here, in the related art, a method or apparatus for determining whether a wafer can be transferred to an appropriate position by using a test wafer has been developed. For example, Korean Patent Publication No. 10-2010-0054908 (Invention: Through Camera Vision Auto-teaching origin measuring method) and Korean Patent Publication No. 10-2003-00806976 (name of the invention: jig for measuring the chuck height used in the wafer test) and the like can be presented.

However, according to the conventional method or apparatus for transferring a wafer including the patent documents, a reference point for whether the wafer is properly transferred to the apparatus to which the wafer is to be transferred must be separately formed.

In this case, a separate reference point had to be manufactured in the apparatus in which the reference point was not formed, and thus there was a problem in that a manufacturing cost and time were required.

In addition, in the related art, there has been a method of confirming whether a jig provided according to a type of wafer is properly positioned at a normal position. However, in this method, a jig corresponding to a type of wafer has to be produced separately.

In addition, when the wafer is stored in the transport container for the wafer divided into the same slots, for example, when the stored wafer is removed by the transfer robot, the side of the wafer should not be damaged. Has not been developed.

In addition, in the process of transferring the wafer, there is a case where a vibration applied to the manufacturing apparatus or a temperature / humidity condition around the manufacturing apparatus should be sensed. Conventionally, a means for sensing such conditions is provided in the manufacturing apparatus. Since it was not made, such sensing means must be provided separately from the manufacturing apparatus, resulting in a cost increase and spatial inefficiency caused by the separate provision.

In addition, in the above apparatus and method, a Bluetooth communication-based system has been generally applied, which is not only short-range communication, but also cannot transmit a large amount of data compared to a wide facility environment.

In addition, the above description is limited to the wafer, but the transfer of other manufacturing process that uses a rectangular photo mask, LCD panel, etc., test equipment that can check whether the transfer is normally performed Was needed.

The present invention is a test device to check whether the sensing object can be moved normally by using the image measurement process, the height of the slot can be measured so that the sensing object does not hit the slot in the storage box, even if no separate reference point is formed A test dummy and a test dummy for measuring a transfer position used in a semiconductor or display system field that can be used in a semiconductor or display system field that can determine whether a sensing object is normally transferred to a position to be transferred in manufacturing equipment by using a pin hole. It is an object of the present invention to provide a method for measuring precision feed using a test dummy for measuring a feed position used in the system field.

The test dummy for measuring the transfer position used in the semiconductor or display system field according to an aspect of the present invention includes an object holding device including a storage box for holding a sensing object, a fixing means for fixing the sensing object, and the A transfer robot for transferring a sensing object to the fixing means is applied to a facility used in a semiconductor or display system field prepared by the transfer robot, the dummy body having the same size as that of the sensing object; A pinhole image measuring member capable of recognizing or photographing a plurality of guide pin holes formed in the fixing means; In the state where the dummy body is stored in the storage box, the slot of the storage box disposed on the dummy body is recognized or photographed so that a gap between the slot of the storage box disposed on the dummy body and the dummy body is measured. A slot image measuring member; And a central processing member capable of transmitting the information measured by the pinhole image measuring member or the slot image measuring member to an image processing computer prepared in advance.

An accurate transport measurement method using a test dummy for transport position measurement used in a semiconductor or display system field according to an aspect of the present invention includes an object holding device including a storage box holding a sensing object and a fixing means for fixing the sensing object. And a dummy body formed to have a size equal to that of the sensing object, wherein the transfer robot for transferring the sensing object of the storage box to the fixing means is applied to a facility used in a semiconductor or display system field. A pinhole image measuring member capable of recognizing or photographing a plurality of guide pin holes formed in the at least one guide hole, and the dummy body between the slot of the storage box disposed on the dummy body and the dummy body, when the dummy body is stored in the storage box. On the dummy body so that the gap is measured A central processing unit capable of transmitting a slot image measuring member capable of recognizing or photographing the slot of the storage box and a pinhole image measuring member or information measured by the slot image measuring member to a pre-prepared image processing computer. A precision transfer position measuring method using a test dummy for transfer position measurement used in the field of semiconductor or display systems, comprising a member, comprising: (1) transfer used in the field of semiconductor or display systems stored in the storage box; Placing a test dummy for position measurement on the transfer robot; (2) transferring, by the transfer robot, a test dummy for measuring a transfer position used in the semiconductor or display system field to the upper end of the fixing means in step (1); (3) In the test dummy for measuring the transfer position used in the field of the display system transferred to the upper end of the fixing means in the step (2), the pinhole image measuring member recognizes the guide pin hole of the fixing means. Or photographing; (4) transmitting the image recognized or photographed in step (3) to the central processing member; (5) transmitting the image transmitted to the central processing member to the image processing computer in step (4); (6) With the image transmitted to the image processing computer in step (5), it is determined whether or not a test dummy for measuring a transfer position used in the display system field can be seated at a predetermined position of the fixing means. By including, it is possible to determine the position of the center of the test dummy for measuring the transfer position used in the display system field exactly matches the center of the guide pin hole.

The precision transfer measurement method using the test dummy for transfer position measurement used in the field of semiconductor or display system and the test dummy for transfer position measurement used in the field of semiconductor or display system according to the present invention is a storage box containing the sensing object, and The object fixing device including a fixing means for fixing the sensing object, and a transfer robot for transferring the sensing object of the storage box to the fixing means is applied to the equipment used in the field of semiconductor or display system prepared, the sensing object A dummy body formed equal to the size of the dummy body; A pinhole image measuring member capable of recognizing or photographing a plurality of guide pin holes formed in the fixing means; In the state where the dummy body is stored in the storage box, the slot of the storage box disposed on the dummy body is recognized or photographed so that a gap between the slot of the storage box disposed on the dummy body and the dummy body is measured. A slot image measuring member; And a central processing member capable of transmitting the information measured by the pinhole image measuring member or the slot image measuring member to an image processing computer prepared in advance. With the test equipment to check, the height of the slot can be measured so that the sensing object does not hit the slot in the storage box, and the lift pin hole is used to make the sensing object normally move to the position where the sensing object should be transported in the manufacturing equipment even though no reference point is formed. There is an effect that can determine whether the transfer.

1 is a perspective view schematically showing an environment in which a transfer robot and a process chamber are prepared for using a test dummy for measuring a transfer position used in a semiconductor or display system field according to a first embodiment of the present invention;

2 is a view from above of a test dummy for measuring a transfer position used in the field of semiconductor or display systems according to a first embodiment of the invention;

3 is a front view of a test dummy for measuring a transfer position used in a semiconductor or display system field according to a first embodiment of the present invention;

4 is a view from above of the inside of a process chamber according to a first embodiment of the present invention;

FIG. 5 illustrates a guide pin hole in which a pinhole image measuring member according to a first embodiment of the present invention recognizes a guide pin hole, but a center of a test dummy for measuring a transfer position used in a semiconductor or display system field is formed in a fixing means. Schematic illustration of the center and not coincident.

6 is a hole image measuring member according to a first embodiment of the present invention recognizes a guide pin hole, the center of the guide pin hole formed in the fixing means the center of the test dummy for measuring the transfer position used in the field of semiconductor or display system A schematic representation of the appearance of mismatch.

FIG. 7 is a view schematically illustrating how a test dummy for measuring a transfer position used in a semiconductor or display system field according to a first embodiment of the present invention recognizes a guide pin hole at an appropriate position; FIG.

8 is a view schematically showing how a slot image measuring member recognizes one slot and the other slot according to the first embodiment of the present invention.

FIG. 9 illustrates precisely measuring a position of a test dummy for measuring a transport position used in a display system field of a storage box by using a transport robot according to the first embodiment of the present invention to safely remove or insert the test dummy out of the storage box. Flowchart on how to.

FIG. 10 shows that the center of the test dummy for transport position measurement used in the semiconductor or display system field transferred to the fixing means by the transfer robot according to the first embodiment of the present invention exactly matches the center of the guide pin hole formed in the fixing means. A flowchart on how to measure its position.

FIG. 11 is an enlarged view of FIG. 8A according to the first embodiment of the present invention; FIG.

FIG. 12 is a front view of a test dummy for transport position measurement used in a semiconductor or display system field in which a pollution sensing camera according to a second embodiment of the present invention is formed; FIG.

FIG. 13 is an enlarged view illustrating an enlarged state of a state in which a fixing unit is in contact with a pinhole photographing image sensor according to a third exemplary embodiment of the present invention; FIG.

14 is an enlarged view illustrating an enlarged view of a state in which a fixing means is in contact with a screen member according to a fourth embodiment of the present invention;

FIG. 15 is a view from above of a test dummy for measuring a transfer position used in the field of semiconductor or display systems comprising a front camera member in accordance with a fifth embodiment of the present invention; FIG.

Hereinafter, with reference to the drawings a precision transfer measurement method using a test dummy for measuring the transfer position used in the field of semiconductor or display system according to embodiments of the present invention and a test dummy for measuring the position of transfer used in the field of semiconductor or display system It demonstrates.

1 is a perspective view schematically showing an environment in which a transfer robot and a process chamber are used for using a test dummy for measuring a transfer position used in a semiconductor or display system field according to a first embodiment of the present invention, and FIG. 3 is a view of a test dummy for measuring a transfer position used in a semiconductor or display system field according to a first embodiment of the present invention, and FIG. 3 is a transfer position used in a semiconductor or display system field according to a first embodiment of the present invention. 4 is a front view of the measurement test dummy from the front, and FIG. 4 is a top view of the inside of the process chamber according to the first embodiment of the present invention, and FIG. 5 is a pinhole image measuring member according to the first embodiment of the present invention. Recognizes guide pin holes, but transfer positions used in semiconductor or display system applications FIG. 6 is a diagram schematically illustrating a state in which the center of the test dummy for measurement does not coincide with the center of the guide pin hole formed in the fixing means, and FIG. However, the center of the test dummy for measuring the transfer position used in the field of semiconductor or display system is a view schematically showing a state that does not coincide with the center of the guide pin hole formed in the fixing means, Figure 7 is a first embodiment of the present invention According to the present invention, a test dummy for measuring a transfer position used in a semiconductor or display system field is a view schematically showing a guide pin hole recognized at an appropriate position, and FIG. 8 is a slot image measuring member according to a first embodiment of the present invention. Is a view schematically illustrating a state in which one slot and the other slot are recognized, and FIG. 9 A method for accurately measuring the position of the test dummy for measuring the transfer position used in the field of the display system of the storage box using the transfer robot according to the first embodiment of the present invention can be safely removed from the inside or inside the storage box. FIG. 10 is a flow chart, and FIG. 10 is a center of the guide pin hole in which a center of a test dummy for measuring a transfer position used in a semiconductor or display system field transferred to a fixing means by a transfer robot according to a first embodiment of the present invention is formed in the fixing means. FIG. 11 is an enlarged view of portion A of FIG. 8 according to the first embodiment of the present invention.

Referring to FIGS. 1 to 11, the test dummy 100 for measuring a transfer position used in a semiconductor or display system field includes a storage box 10 holding a sensing object 50 and a fixing of the sensing object 50. The semiconductor or display system is provided with an object fixing device 25 including a fixing means 27, and a transfer robot 30 for transferring the sensing object 50 of the storage box 10 to the fixing means 27. Applied to a facility used in the field, the dummy body 110 and the plurality of guide pin holes 22 formed in the fixing means 27, the same as the size of the sensing object 50 is recognized, or And a pinhole image measuring member 120 capable of capturing an image, and a central processing member 140 capable of transmitting the information measured by the pinhole image measuring member 120 to an image processing computer 60 prepared in advance.

The test dummy 100 for measuring a transfer position used in a semiconductor or display system field includes an object including a storage box 10 holding a sensing object 50 and a fixing means 27 for fixing the sensing object 50. The fixing device 25 and the transfer robot 30 for transferring the sensing object 50 of the storage box 10 to the fixing means 27 are applied to the equipment used in the field of the semiconductor or display system. The dummy body 110 formed to be the same size as the sensing object 50 and the dummy body 110 while the dummy body 110 is stored in the storage box 10, the storage box disposed on the dummy body 110. Recognize the slots 11 and 12 of the storage box 10 disposed on the dummy body 110 so that the gap between the slots 11 and 12 of the 10 and the dummy body 110 is measured, or Slot image measuring member which we can photograph And a central processing member 140 capable of transmitting the information measured by the slot image measuring member 130 to the image processing computer 60 prepared in advance.

The test dummy 100 for measuring a transfer position used in the semiconductor or display system field includes a dummy body 110, a pinhole image measuring member 120, and a central processing member 140, or a dummy body ( 110, the slot image measuring member 130, and the central processing member 140 may be implemented. The dummy body 110, the pinhole image measuring member 120, and the slot image measuring member ( 130 and the central processing member 140 may be implemented. Hereinafter, for convenience of description, in the field of the semiconductor or display system including the dummy body 110, the pinhole image measuring member 120, the slot image measuring member 130, and the central processing member 140, all of them will be described. The test dummy 100 for measuring the transfer position to be used will be described as an example.

Referring to FIGS. 1 to 11, the test dummy 100 for measuring a transfer position used in the semiconductor or display system field according to the present embodiment includes the dummy body 110 and the pinhole image measuring member 120. ), The slot image measuring member 130, and the central processing member 140.

The test dummy 100 for measuring a transfer position used in the semiconductor or display system field may further include a sensing member 150.

The test dummy 100 for measuring the transfer position used in the semiconductor or display system field is a test device that checks whether the sensing object 50 can be normally moved using an image measuring processing method. The sensing object 50 This is a test device to check if the feed is normally performed.

Although the sensing object 50 has been exemplified in the form of a wafer generally formed in a circular thin plate in the present embodiment, it may be a rectangular photo mask or an LCD panel depending on the purpose.

The test dummy 100 for measuring the transfer position used in the semiconductor or display system field includes a storage box 10 holding the sensing object 50 and a fixing means 27 for fixing the sensing object 50. Applied to the equipment used in the field of the semiconductor or display system prepared by the object fixing device 25 and the transfer robot 30 for transferring the sensing object 50 of the storage box 10 to the fixing means 27 do.

The storage box 10 is divided into slots 11 and 12 having the same width, and each of the slots 11 and 12 of one width is stored with only one sensing object 50, and the sensing object 50 Is a transport container (FOUP, Front Opening Unified Pod) that is stored before being transferred to other equipment.

The object fixing device 25 is disposed in the process chamber 20, which is a space in which the sensing object 50 is mounted to perform a process, and the fixing means 27 for fixing the sensing object 50 is formed. .

The fixing means 27 may be, for example, an electrostatic chuck (ESC) capable of fixing the sensing object 50 with an electrostatic force when the sensing object 50 is provided as a wafer, or It may be formed by a clamping device or the like using a fixing method by the engagement.

A guide pin hole 22 is formed at a lower portion of the fixing means 27, and the fixing means 27 is stretched by a predetermined length in the guide pin hole 22 to contact the bottom surface of the sensing object 50. To support the sensing object 50.

Generally, three or more of the fixing means 27 exist, and the center of the plurality of fixing means 27 must coincide with the center of the sensing object 50 on which the fixing means 27 is placed. 50 is seated in a normal position, and defective products can be reduced in the process.

However, when the centers of the plurality of fixing means 27 do not coincide with the centers of the sensing object 50 mounted on the fixing means 27, the sensing object 50 is seated at an abnormal position. It can generate a large amount of defective products in the process.

The dummy body 110 is formed to have the same size as that of the sensing object 50 in order to check whether the sensing object 50 is normally moved in place of the sensing object 50. If the object 50 is provided as a wafer and formed into a circular thin plate, the dummy body 110 may also be formed into a circular thin plate.

The edge of the dummy body 110 may be mounted on the slots 11 and 12 when stored in the storage box 10.

The pinhole image measuring member 120 may recognize or photograph the plurality of guide pin holes 22 formed in the object fixing device 25, and measure the plurality of guide pin holes 22, respectively. And a plurality of pinhole cameras 121, 122, and 123.

In the pinhole photographing cameras 121, 122, and 123, a recognition range or a photographing range of the guide pinhole 22 is set in advance, and reference numerals 124, 125, and 126 shown in FIG. 5 denote the pinholes. The photographing cameras 121, 122, and 123 are recognition ranges or photographing ranges for recognizing the guide pin holes 22 corresponding thereto, respectively.

In the present exemplary embodiment, the guide pin hole 22 is formed in three, and the pin hole image measuring member 120 includes the first pin hole photographing camera 121 to recognize the guide pin hole 22. And a second pinhole photographing camera 122 and a third pinhole photographing camera 123. However, since the guide pin hole 22 may be formed in a plurality of other pieces, the pin hole photographing cameras 121, 122, and 123 may also be formed in a plurality of other pieces.

In detail, the first pinhole photographing camera 121 recognizes or photographs a portion corresponding to the first range 124, and the second pinhole photographing camera 122 is a portion corresponding to the second range 125. The third pin hole photographing camera 123 recognizes or photographs a portion corresponding to the third range 126.

When the test dummy 100 for measuring the transfer position used in the semiconductor or display system field is transferred to the upper end of the object fixing device 25 by the transfer robot 30 in the state formed as described above, Cameras 121, 122, and 123 capture the first range 124, the second range 125, and the third range 126.

Here, each of the ranges 124, 125, and 126 is a position close to the guide pin hole 22 corresponding thereto.

When the image photographed as described above is transmitted from the central processing member 140 to the image processing computer 60, the image processing computer 60 calculates a position value of the guide pin hole 22, and the guide. The center 23 of the guide pin hole is calculated using the position value of the pin hole 22.

Here, recognizing the guide pin hole 22 in the image captured by the first range 124, the second range 125, and the third range 126 may be a vision capable of distinguishing color contrast. (Vision) technology.

Since the guide pin hole 22 has a relatively darker contrast than its periphery, the guide pin hole 22 is relatively relative to an image captured in each of the first range 124, the second range 125, and the third range 126. The dark portion may be determined as the position of the guide pin hole 22.

Here, the position of the guide pin hole 22 photographed in each of the first range 124, the second range 125, and the third range 126 is output as a position value, and each of the positions The center 23 of the guide pin hole is calculated using the value.

The transfer position used in the semiconductor or display system field if the center 23 of the guide pin hole obtained as described above is the same as the center 127 of the test dummy 100 for measuring the transfer position used in the field of the semiconductor or display system field. It is determined that the measurement test dummy 100 is correctly transferred to the fixing means 27.

However, as shown in Fig. 5 or 6, the center 23 of the guide pin hole obtained using the vision technique is the center 127 of the test dummy for transfer position measurement used in the semiconductor or display system field. If not, it is determined that the test dummy 100 for measuring the transfer position used in the semiconductor or display system field is incorrectly transferred to the fixing means 27. Furthermore, the image processing computer 60 obtains a line segment connecting two points, which is the center 127 of the transfer dummy measuring test dummy used in the semiconductor or display system field and the center 23 of the guide pin hole. By obtaining the inclination, it is possible to calculate the position value to be corrected so that the test dummy 100 for measuring the transfer position used in the semiconductor or display system field is accurately transferred to the fixing means 27.

으로 구한다. 상기의 식을 사용하여 상기 가이드 핀 홀(22)의 위치 값을 구하면,

으로, (0,2)의 값이 나오게 되어 상기 가이드 핀 홀의 중심(23)을 구할 수 있게 된다. 나아가, 상기 반도체 또는 디스플레이 시스템 분야에서 사용되는 이송 위치 측정용 테스트 더미(100)의 중심(127)의 좌표 값인 (0,0)과 계산된 상기 가이드 핀 홀의 중심(23)의 좌표 값인 (0,2)을 선분으로 이어 그 기울기를 구하고 그 거리를 구하게 되면, 상기 반도체 또는 디스플레이 시스템 분야에서 사용되는 이송 위치 측정용 테스트 더미(100)가 상기 고정 수단(27)에 정확하게 이송되기 위한 수정될 위치 값을 계산할 수 있다.In detail, for example, when the coordinate value of the center 127 of the test dummy 100 for measuring the transfer position used in the semiconductor or display system field is designated as (0,0), the first range 124 may be used. (X1, y1), which is the position value of the guide pin hole 22 measured at (-2.3), is measured as (-2.3), and (x2, which is the position value of the guide pin hole 22, measured at the second range 125, When y2) is measured as (2,5) and the position value (x3, y3) of the guide pin hole 22 measured in the third range 126 is (0, -2), the guide The position value (x0, y0) of the pin hole 22 is a method of obtaining the center of gravity

Obtain as When the position value of the guide pin hole 22 is obtained using the above equation,

As a result, a value of (0, 2) is obtained to obtain the center 23 of the guide pin hole. Further, (0,0), which is the coordinate value of the center 127 of the test dummy 100 for measuring the transfer position used in the semiconductor or display system field, and (0, 0, which is the coordinate value of the center 23 of the guide pin hole, calculated. 2) by the line segment, and the inclination and the distance are determined, the position value to be corrected so that the test dummy 100 for measuring the transfer position used in the semiconductor or display system field is accurately transferred to the fixing means 27. Can be calculated.

In the present exemplary embodiment, the guide pin holes 22 are three, and the pinhole photographing cameras 121, 122, and 123 are limited to three, but the center of the guide pin holes 22 is recognized even when two or more guide pin holes 22 are recognized. Since it can be calculated, the guide pin hole 22 and the pinhole photographing cameras 121, 122, and 123 are present in plural numbers different from each other, and the center of the guide pin hole 22 and the pin hole photographing camera 121 can be calculated.

The slot image measuring member 130 may include the slots 11 and 12 of the storage box 10 disposed on an upper side of the dummy body 110 while the dummy body 110 is stored in the storage box 10. The slots 11 and 12 of the storage box 10 disposed on the dummy body 110 may be recognized or photographed so that the gap between the dummy bodies 110 may be measured. It is formed on the diameter line.

In detail, the slot image measuring member 130 may recognize one slot 11 and the other slot 12 disposed at both upper ends of the dummy body 110, respectively. Including the camera 132, the one slot camera 131 and the other slot camera 132, the recognition range, or the shooting range of the one slot 11 and the other slot 12, respectively, is set in advance. .

In general, a pair of the one slot 11 and the other slot 12 is located on the horizontal line, so that the corresponding one slot camera 131 and the other slot camera 132 is present on the same horizontal line do.

In this embodiment, one side direction is a side where the one side slot camera 131 is formed based on the center 127 of the test dummy 100 for measuring the transfer position used in the semiconductor or display system field shown in FIG. 8. Say.

Reference numeral 133 denotes one side recognition range that the one slot camera 131 can recognize or photograph, and reference numeral 134 denotes another recognition range that the other slot camera 132 can recognize or photograph.

When formed as described above, the transfer robot 30 is located at the bottom of the test dummy 100 for the transfer position measurement used in the semiconductor or display system field stored in the storage box 10 as shown in FIG. When the test dummy 100 for measuring the transfer position used in the semiconductor or display system field is inserted to a certain height while being inserted, the one slot camera 131 is disposed on the upper side of one side of the dummy body 110. 11) recognize or photograph, and transmits the captured image to the central processing member 140. In addition, the other slot camera 132 also recognizes or photographs the other slot 12 disposed on the other upper end of the dummy body 110, and transmits the captured image to the central processing member 140.

Then, the image is transmitted to the image processing computer 60 by using Wi-Fi communication of the central processing member 140.

Then, the test dummy 100 for measuring the transfer position used in the slots 11 and 12 and the semiconductor or display system field using the slot image measuring member 130 using the calculation method to be described later using the image. Find the interval of).

Then, the image is transmitted to the image processing computer 60 using Wi-Fi communication of the central processing member 140.

Then, the test dummy 100 for measuring the transfer position used in the slots 11 and 12 and the semiconductor or display system field using the slot image measuring member 130 using the calculation method to be described later using the image. Find the interval of).

FIG. 11 is a value calculated as follows using the values measured using the slot image measuring member 130, and a transport position used in the slots 11 and 12 and the semiconductor or display system field. The interval value of the test dummy 100 for measurement is compared with a normal comparison value H ′ input to the image processing computer 60 in advance.

That is, the semiconductor device of the storage box 10 is determined by using the transfer robot 30 by determining whether the value of H, which is the height value measured and calculated as described above, corresponds to the value of H ′ previously input as described above. Alternatively, it is to determine whether the test dummy 100 for measuring the transfer position used in the field of the display system can be safely removed from the outside or the inside of the storage box 10.

h1 is a bottom surface of the one side slot 11 and the dummy body extracted by processing the image of the one side recognition range 133 photographed by the one side slot camera 131 using the vision technology of the image processing computer 60. The vertical spacing value between 110.

d1 is a horizontal distance from the inner wall surface of the storage box 10 to the slot camera 131 on one side, and this value is previously input to the image processing computer 60.

h4 is a half value of the height of the one slot 11, which is a value previously input to the image processing computer 60.

h5 is a vertical distance from the upper end of the dummy body 110 to the center of the one-side measuring camera 131, which is a value previously input to the image processing computer 60.

θ is an arithmetic value excluding the photographing angle from the virtual centerline in the direction in which the one-side measuring camera 131 is photographed at 90 ° to the dummy body 110, and this value is previously described in the image processing computer 60. The value entered.

h2 is a height value to be removed from the h1, and is an interval obtained by a formula of h2 = d1 * tan (180-θ) using a previously inputted θ, and the d1 and the θ used in the formula are input in advance. Since the value is h2, the pre-calculated value can also be pre-input.

h3 is the value from which h2 is removed from h1, and it is calculated | required by the formula of h3 = h1-h2.

The H value is calculated by substituting the values defined above into the following equation.

H = h3 + h4 + h5

When the H value calculated as described above is compared with the previously inputted H 'value, the transfer position measuring test dummy 100 is removed from the storage box 10 by the transfer robot 30 or the storage box ( 10), you can determine if safe work is done.

In the present exemplary embodiment, a measurement method using the one slot camera 131 is exemplified, but the other slot camera 132 also uses the same measurement method as that of the one slot camera 131.

When formed as described above, when the H value measured and calculated at the one slot camera 131 side and the H value measured and calculated at the other slot camera 132 side are compared, the semiconductor or display system field It is possible to determine whether the inclination of one side and the other side of the test dummy 100 for measuring the transfer position used is horizontal.

In addition, a difference between the H value measured and calculated by the one slot camera 131 and the H value measured and measured by the other slot camera 132 may also be calculated, and thus used in the semiconductor or display system field. Of course, it can be determined whether the test dummy 100 for measuring the transfer position can be accurately transferred.

The central processing member 140 may transmit the information measured by the pinhole image measuring member 120 or the slot image measuring member 130 to the image processing computer 60 prepared in advance. A storage space for storing is provided, and a Wi-Fi communication module (not shown) for transmitting the information to the image processing computer 60 is embedded.

As described above, when the information is transmitted to the image processing computer 60, the Wi-Fi communication can be performed, and thus it is possible to communicate a long distance and communicate a large amount of data faster than the conventional Bluetooth based communication. have.

In the present exemplary embodiment, the image captured by the pinhole image measuring member 120 or the slot image measuring member 130 and the measured value measured by the sensing member 150 are transmitted to the central processing member 140. Is transmitted to the image processing computer 60. However, for each camera 121, 122, 123 of the pinhole image measuring member 120, each camera 131, 132 of the slot image measuring member 130, and each sensor of the sensing member 150. The built-in Wi-Fi chip capable of individually communicating with Wi-Fi may be configured to transmit the measured or photographed information to the image processing computer 60 independently without passing through the central processing unit 140. Of course.

In addition, in the present embodiment, the operation for confirming whether the transfer dummy measurement test dummy 100 used in the semiconductor or display system field is normally moved is formed to be calculated in the image processing computer 60, but the central processing member The operation 140 may be performed on its own, and only the calculated value may be transmitted to the image processing computer 60.

In this embodiment, although the Wi-Fi communication is formed in the communication between the central processing member 140 and the image processing computer 60, it may be formed to communicate by other wireless communication such as Bluetooth, RF (RF). Of course.

The sensing member 150 is a change of the surrounding environment of the test dummy 100 for transfer position measurement used in the semiconductor or display system field and the test dummy 100 itself for transfer position measurement used in the semiconductor or display system field The slope of can be measured.

Here, the inclination of the transfer dummy measurement test dummy 100 itself used in the semiconductor or display system field may be defined as the inclination degree of the transfer dummy measurement test dummy 100 used in the semiconductor or display system field. .

The sensing member 150 is formed in the dummy body 110, a vibration sensor that can measure the vibration of the dummy body 110 itself, a test dummy for measuring the transfer position used in the semiconductor or display system field (100) a tilt sensor for measuring its own tilt, a temperature / humidity sensor capable of measuring temperature and humidity around the dummy body 110, and a test dummy 100 for measuring a transfer position used in the semiconductor or display system field Various sensors such as a gas sensor for measuring the gas of the gas, a barometric pressure sensor for measuring the air pressure around the test dummy 100 for measuring the transfer position used in the semiconductor or display system field is formed as one module and the sensing member 150 ), And the measured values measured by each of these sensors are transmitted to the central processing member 140 to May be transmitted to the wound computer 60, or other communication device.

When formed as described above, in the transfer process of the transfer position measuring test dummy 100 used in the semiconductor or display system field, the transfer pile measurement test dummy 100 used in the semiconductor or display system field or In order to measure vibrations in contacted equipment or to measure the ambient temperature and humidity of the test dummy 100 for measuring the transfer position used in the semiconductor or display system field, whether the environmental conditions are kept constant or a sudden impact. However, you can determine if changes in the external environment have occurred.

Hereinafter, a precise transfer measuring method using the test dummy 100 for measuring a transfer position used in the semiconductor or display system field will be described. In carrying out this description, the description overlapping with the above-described information in the above-described present invention will be replaced with the description thereof and omitted herein.

Hereinafter, the position of the test dummy sensing object 50 for measuring the transport position of the storage box 10 by using the transport robot 30 may be safely measured outside of the storage box 10 or may be accurately measured in its position. The method S100 for doing this is demonstrated.

First, the transfer robot 30 lifts the test dummy 100 for measuring the transfer position used in the semiconductor or display system field stored in the storage box 10 (S110).

Then, the dummy body 110 and the slot 11 on the dummy body 110 of the transfer dummy measurement test dummy 100 used in the semiconductor or display system field lifted in the step (S110). 12) the slot image measuring member 130 recognizes or photographs (S120).

Here, the image recognized or photographed in step S120 is transmitted to the central processing member 140 (S130).

Then, the image transmitted to the central processing member 140 in the step (S130) is transmitted to the image processing computer 60 (S140).

Then, the position of the dummy body 110 is calculated by calculating the distance between the dummy body 110 and the slots 11 and 12 with the image transmitted to the image processing computer 60 in step S140. Measure (S150).

By measuring the position of the dummy body 110 by calculating the distance between the dummy body 110 and the slots (11, 12) as described above, the test dummy for measuring the transfer position used in the semiconductor or display system field ( When the 100 is removed from the storage box 10 by the transfer robot 30, the gap between the slots 11 and 12 may be measured so as not to hit the slots 11 and 12 in the storage box 10. have.

That is, the slots 11 and 12 to prevent the test dummy 100 for measuring the transfer position used in the semiconductor or display system field from hitting the slots 11 and 12 in the storage box 10 instead of the sensing object 50. By measuring the interval between the, and when the sensing object 50 in the storage box 10 is later removed to the transport robot 30, whether it can be stably pulled out of the storage box 10 or put into it It can be measured.

Hereinafter, the center 127 of the test dummy 100 for measuring the transfer position used in the semiconductor or display system field transferred to the fixing means 27 by the transfer robot 30 is the fixing means 27. A method (S200) of measuring the position of the guide pin hole formed at the same position as that of the center 23 will be described.

First, a test dummy 100 for measuring a transfer position used in the semiconductor or display system field stored in the storage box 10 is placed on the transfer robot 30 to be transferred to the process chamber 20 (S210). ).

Then, in step S210, the test dummy 100 for measuring the transfer position used in the semiconductor or display system field mounted on the transfer robot 30 is transferred to the upper end of the fixing means 27 (S220). .

Then, in the test dummy 100 for measuring the transfer position used in the semiconductor or display system field transferred to the upper end of the fixing means 27 in the step (S220), the pinhole image measuring member 120 Recognizes or photographs the guide pin hole 22 of the fixing means 27 (S230).

In operation S230, the recognition or photographed image is transmitted to the central processing member 140 (S240).

 Then, in operation S240, the image transmitted to the central processing member 140 is transmitted to the image processing computer 60 (S250).

Then, the test dummy 100 for measuring the transfer position, which is used in the semiconductor or display system field, as the image transmitted to the image processing computer 60 in the step S250, in advance of the fixing means 27. It is determined whether or not it can be seated at the designated position (S260).

Conventionally, a reference point is separately formed to confirm whether the test dummy 100 for measuring a transfer position used in the semiconductor or display system field is transferred to an appropriate position of the fixing means 27, but the pinhole image measurement as described above. The member 120 recognizes the guide pin hole 22 that is generally formed in the fixing means 27 to test the center 23 of the guide pin hole and the transfer position measurement used in the semiconductor or display system field. It is possible to determine whether or not the center of the dummy 100 127 coincides and the transfer position of the test dummy 100 for measuring the transfer position used in the semiconductor or display system field. It has the advantage of being.

Hereinafter, a test dummy for measuring a transfer position used in a semiconductor or display system field according to other embodiments of the present invention will be described with reference to the accompanying drawings. In carrying out this description, the description overlapping with the contents already described in the above-described first embodiment of the present invention will be replaced with, and will be omitted herein.

FIG. 12 is a front view of a test dummy for measuring a transfer position used in a semiconductor or display system field in which a pollution detecting camera according to a second embodiment of the present invention is formed.

Referring to FIG. 12, a contamination detection camera may be formed on an upper end of a dummy body 210 of a test dummy 200 for measuring a transfer position used in a semiconductor or display system field according to the present embodiment. 260 is formed.

The pollution detection camera 260 is not limited to a range photographed by the pinhole image measuring member 220 and the slot image measuring member 230, and is formed at an upper end of the dummy body 210, and, during operation, the dummy The front of the upper end of the body 210 may be photographed, and the photographed image may be transmitted to the central processing member, or may be transmitted to the image processing computer.

When formed as described above, by reading the image taken by the contamination detection camera 260 can check the contaminated material around the test dummy 200 for transport position measurement used in the semiconductor or display system field. For example, when the chamber is photographed with the pollution detecting camera 260, it is possible to check whether contaminated material is buried therein.

FIG. 13 is an enlarged view illustrating an enlarged state of a state in which a fixing unit is in contact with a pinhole photographing image sensor according to a third exemplary embodiment of the present invention.

Referring to FIG. 13, a pinhole image measuring member 328 is formed on a pinhole image measuring member of a test dummy for transferring position measurement used in a semiconductor or display system field according to the present embodiment.

The pinhole photographing image sensor 328 is formed on the bottom surface of the dummy body 310 and is capable of capturing a state in which the fixing means 27 is in contact, and is an optical sensor capable of converting light into an electrical signal.

As shown in FIG. 13, when the pinhole photographing image sensor 328 photographs the state in which the fixing means 27 is in surface contact with the pinhole photographing image sensor 328, the pinhole photographing image sensor ( The light may not enter the pinhole photographing image sensor 328 at the portion where the fixing means 27 is in contact with the surface 328, and light may enter only around its periphery. Therefore, the portion where the fixing means 27 is in surface contact is photographed relatively darkly. Then, the dark imaged portion is output as a position value using vision technology, and the value is determined as the position of the fixing means 27.

In the same manner as described above, the other plurality of the fixing means 27 also outputs position values, and using the position values, the center of the guide pin hole identical to the center of the fixing means 27 can be calculated and the calculated values By using this, it is possible to determine whether the transfer dummy measuring test dummy used in the semiconductor or display system field is correctly transferred to the fixing means 27.

14 is an enlarged view illustrating an enlarged view of a state in which a fixing means is in contact with a screen member according to a fourth exemplary embodiment of the present invention.

Referring to FIG. 14, the pinhole image measuring member of the test dummy for transferring position measurement used in the field of semiconductor or display system according to the present exemplary embodiment is formed on the bottom of the dummy body 410 so that the fixing means 27 is formed on the bottom of the dummy body 410. And a screen member 429 that can be contacted and can output the contacted portion as coordinate values.

 The screen member 429 may be formed as a touch screen. When the plurality of fixing means 27 at different positions touch the screen member 429, the screen members 429 may output the portions as coordinate values, respectively. The center of the fixing means 27 can be calculated using the calculated coordinate values, and the calculated center of the fixing means 27 coincides with the center of the transfer dummy measuring test dummy used in the semiconductor or display system field. It may be determined whether the test dummy for measuring the transfer position used in the semiconductor or display system field is accurately transferred to the fixing means 27.

FIG. 15 is a top view of a test dummy for measuring a transfer position used in a semiconductor or display system field including a front camera member according to a fifth embodiment of the present invention.

Referring to FIG. 15, the test dummy 500 for measuring a transfer position used in the semiconductor or display system field according to the present embodiment includes a dummy body 510, a pinhole image measuring member 520, and a slot image measurement. The member 530, the central processing member 540, and the front camera member 560 are included.

The front camera member 560 is mounted on the dummy body 510 to observe the movement path of the test dummy 500 for measuring the transfer position used in the semiconductor or display system field. As shown in, the dummy body 510 is mounted at both ends on the diameter.

The front camera member 560 photographs the front of the test dummy 500 for measuring the transfer position used in the semiconductor or display system field, and transmits the captured image to an image system prepared in advance for the operator to confirm. Here, the video system may be an application of a smart phone or a system equipped with a monitor capable of checking a captured image.

When formed as described above, since the front camera member 560 can observe the moving path of the test dummy 500 for measuring the transfer position used in the semiconductor or display system field in real time, the semiconductor or display system It is possible to check in real time whether the test dummy 500 for measuring the transfer position used in the field is moving properly. Therefore, whether the transfer robot on which the transfer position measurement test stack 500 used in the semiconductor or display system field is also operating properly moves the test dummy 500 for transfer position measurement used in the semiconductor or display system field. There is an effect that can be judged by path measurement.

While the invention has been shown and described with respect to specific embodiments thereof, those skilled in the art can variously modify the invention without departing from the spirit and scope of the invention as set forth in the claims below. And that it can be changed. Nevertheless, it will be clearly understood that all such modifications and variations are included within the scope of the present invention.

According to the precision transfer measurement method using the test dummy for transfer position measurement used in the field of semiconductor or display system and the test dummy for transfer position measurement used in the field of semiconductor or display system according to an aspect of the present invention, the image measurement processing The test equipment checks whether the sensing object can be moved normally by using the test equipment. The height of the slot can be measured so that the sensing object does not collide with the slot in the storage box, and the manufacturing equipment can be manufactured by using a lift pin hole even if a separate reference point is not formed. Since it can be determined whether the sensing object is normally transferred to the position to be transported, it will be said that the industrial applicability is high.

Claims (11)

Equipment for use in the field of semiconductor or display systems provided with a storage container for holding a sensing object, a fixing means for fixing the sensing object, and a transport robot for transporting the sensing object of the storage box to the fixing means. In applying to A dummy body formed to be the same as the size of the sensing object; A pinhole image measuring member capable of recognizing or photographing a plurality of guide pin holes formed in the fixing means; And And a central processing member capable of transmitting the information measured by the pinhole image measuring member to an image processing computer prepared in advance. The method of claim 1, The pinhole image measuring member A plurality of pin hole photographing cameras for measuring each of the plurality of guide pin holes formed by the fixing means, The pin hole photographing camera is a test dummy for a transfer position measurement used in the field of semiconductor or display systems, characterized in that the recognition range, or the shooting range of the guide pin hole is set in advance. The method of claim 2, The pinhole camera is Is formed on the bottom of the dummy body, is formed in accordance with the predetermined shooting range of the guide pin hole, The test dummy for transfer position measurement used in the field of semiconductor or display system, characterized in that the pin hole photographing camera in the state that the fixing means is in contact with the camera. The method of claim 1, The pinhole image measuring member Test dummy for transfer position measurement used in the field of semiconductor or display system, characterized in that it comprises a screen member which is formed on the bottom surface of the dummy body and the fixing means can be contacted, and that part is output as a coordinate value . Equipment for use in the field of semiconductor or display systems provided with a storage container for holding a sensing object, a fixing means for fixing the sensing object, and a transport robot for transporting the sensing object of the storage box to the fixing means. In applying to A dummy body formed to be the same as the size of the sensing object; In the state where the dummy body is stored in the storage box, the slot of the storage box disposed on the dummy body is recognized or photographed so that a gap between the slot of the storage box disposed on the dummy body and the dummy body is measured. A slot image measuring member; And And a central processing member capable of transmitting the information measured by the slot image measuring member to a pre-prepared image processing computer. The method of claim 5, wherein The slot image measuring member It includes a one side slot camera and the other slot camera that can recognize the one side slot and the other slot disposed on the upper side of both sides of the dummy body, The one slot camera and the other slot camera, respectively, the recognition range, or the shooting range of the one slot and the other slot is set in advance, the test dummy for the transfer position measurement used in the field of semiconductor or display system. The method of claim 1, The test dummy for measuring the transfer position used in the semiconductor or display system field And a sensing member capable of measuring a change in the surrounding environment of the transfer dummy measuring test dummy used in the semiconductor or display system field and the inclination of the transfer dummy measuring test dummy itself used in the semiconductor or display system field. Test dummy for transfer position measurement used in the field of semiconductor or display systems, characterized in that. The method of claim 5, wherein The test dummy for measuring the transfer position used in the semiconductor or display system field And a sensing member capable of measuring a change in the surrounding environment of the transfer dummy measuring test dummy used in the semiconductor or display system field and the inclination of the transfer dummy measuring test dummy itself used in the semiconductor or display system field. Test dummy for transfer position measurement used in the field of semiconductor or display systems, characterized in that. Equipment for use in the field of semiconductor or display systems provided with a storage container for holding a sensing object, a fixing means for fixing the sensing object, and a transport robot for transporting the sensing object of the storage box to the fixing means. In applying to A dummy body formed to be the same as the size of the sensing object; A pinhole image measuring member capable of recognizing or photographing a plurality of guide pin holes formed in the fixing means; In the state where the dummy body is stored in the storage box, the slot of the storage box disposed on the dummy body is recognized or photographed so that a gap between the slot of the storage box disposed on the dummy body and the dummy body is measured. A slot image measuring member; And For the transfer position measurement used in the field of semiconductor or display system comprising a; central processing member for transmitting the pinhole image measuring member or information measured by the slot image measuring member to a pre-prepared image processing computer Test dummy. Equipment for use in the field of semiconductor or display systems provided with a storage container for holding a sensing object, a fixing means for fixing the sensing object, and a transport robot for transporting the sensing object of the storage box to the fixing means. In applying to, the dummy body formed in the same size as the sensing object, a pinhole image measuring member capable of recognizing or photographing a plurality of guide pin holes formed in the fixing means, and the dummy body in the storage box In the stored state, the slot image measuring member capable of recognizing or photographing the slot of the storage box disposed on the dummy body so that the gap between the slot of the storage box and the dummy body disposed on the dummy body is measured; The pinhole image measuring member or the slot image side In the precision transfer position measuring method using a test dummy for transfer position measurement used in the field of semiconductor or display system, characterized in that it comprises a central processing member capable of transmitting the information measured in the positive member to a pre-prepared image processing computer, (1) a test dummy for transport position measurement used in the semiconductor or display system field stored in the storage box is mounted on the transport robot; (2) transferring, by the transfer robot, a test dummy for measuring a transfer position used in the semiconductor or display system field to the upper end of the fixing means in step (1); (3) In the test dummy for transfer position measurement used in the field of the semiconductor or display system transferred to the upper end of the fixing means in the step (2), the pin hole image measuring member is the guide pin hole of the fixing means Recognizing, or photographing; (4) transmitting the image recognized or photographed in step (3) to the central processing member; (5) transmitting the image transmitted to the central processing member to the image processing computer in step (4); (6) Whether the test dummy for transport position measurement used in the semiconductor or display system field can be seated at a predetermined position of the fixing means with the image transmitted to the image processing computer in step (5). Determining; by including, Transfer position measurement test used in the field of semiconductor or display system, characterized in that it is possible to determine the position of the center of the transfer position measurement test dummy used in the field of semiconductor or display system exactly match the center of the guide pin hole Precise feed position measurement method using a dummy. The method of claim 10, (a) the transfer robot lifting the test dummy for measuring the transfer position stored in the storage box; (b) the slot image measuring member recognizing or photographing the dummy body and the slot at the upper end of the dummy body of the transfer position measuring test dummy lifted in step (a); (c) transmitting the image recognized or photographed in step (b) to the central processing member; (d) transmitting the image transmitted to the central processing member in step (c) to the image processing computer; (e) calculating the distance between the dummy body and the slot and measuring the position of the dummy body as the image transmitted to the image processing computer in step (d). Transfer robot used in the field of the semiconductor or display system, characterized in that by using the transfer robot can accurately measure the location of the test dummy for measuring the transfer position of the storage box can be safely pulled out or placed inside the storage box Precision feed position measurement method using a test dummy for position measurement.

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