TWI665749B - Test dummy for precision transfer position measurement using the semiconductor system or disply system and precision transfer positon measurement method using the test dummy - Google Patents

Abstract

The invention discloses a test model for measuring a transfer position used in the field of a semiconductor or a display system, and a precise transfer measurement method using the test model for measuring the transfer position. The test model for measuring the transfer position of the present invention is applicable to equipment used in the field of semiconductors or display systems including the following devices: a storage box for loading a test object body; and an object body fixing device including a device for fixing the test object body. A fixed unit; and a transfer robot for transferring the detection object body in the storage box to the fixed unit. The test model for measuring the transfer position includes: a model body having the same size as that of the object to be detected; a pinhole image measuring component that can recognize or photograph a plurality of guiding pinholes formed in the fixed unit; a slit image measuring component, The upper end of the model main body disposed in the slit of the storage box can be identified or photographed to measure the narrowness of the storage box disposed at the upper end of the model main body in a state where the model main body is stored in the storage box. The space between the seam and the model body; and the central processing unit, which can transmit the information measured by the pinhole image measuring unit to a previously prepared image processing computer. According to the present invention, the precision transfer measurement method using the transfer position measurement test model is applicable to equipment used in the field of semiconductor or display systems including the following devices: a storage box for loading detection An object body; an object body fixing device comprising a fixing unit for fixing the detection object body; and a transfer robot for transferring the detection object body in the storage box to the fixing unit. The test model for measuring the transfer position includes: a model body having the same size as that of the object to be detected; a pinhole image measuring component that can recognize or photograph a plurality of guiding pinholes formed in the fixed unit; a slit image measuring component, An upper end of the model body disposed in a slit of the storage box, and in a state where the model body is stored in the storage box, the storage box disposed at the upper end of the model body can be identified or photographed to be measurable. The gap between the slit and the model body; and the central processing unit, which can transmit information measured by the pinhole image measuring unit or the slit image measuring unit to a pre-prepared image processing computer. The method for measuring a precise transfer position of a test model includes the following steps: (1) placing the test model for measuring the transfer position stored in the storage box on the transfer robot; and step (2), in step (1) The transfer robot transfers the test model for measuring the transfer position to the upper end of the fixed unit; step (3), in response to the test model for measuring the transfer position to the upper end of the fixed unit in step (2), the The pinhole image measuring part recognizes or shoots the guide pinhole of the fixed unit; step (4), transmits the image identified or shot in step (3) to the central processing part; step (5), sends to the image processing computer Transmitting the image transmitted to the central processing unit in step (4); and step (6), determining the transfer position measurement based on the image transmitted to the image processing computer in step (5) Test whether the model can be placed in a pre-designated position of the fixing unit, the position of the transfer master can be measured accurately aligned with the centers of the experimental model with whether the guide pin holes. According to the test model for measuring a transfer position in the field of a semiconductor or a display system and the precision transfer measurement method using the test model for measuring the transfer position of the present invention, a test apparatus for detecting whether an object is normally moving is confirmed by using an image measuring apparatus, so that The height of the slit is measured in a manner that prevents the detection object from colliding with the slit in the storage box. Even if a reference point is not formed, the pinhole is raised to determine whether the detection object is normally transferred to a position to be transferred in the manufacturing apparatus.

Description

Test model for measurement of transfer position used in semiconductor or display system field and precision transfer measurement method using the test model for measurement of transfer position

The present invention relates to a test model for measuring a transfer position used in the field of a semiconductor or a display system, and a precision transfer measurement method using the test model for measuring the transfer position.

Tens to tens of billions of electronic component semiconductor elements are formed on extremely small wafers.

An important material for forming such a semiconductor element is a wafer. Among them, the wafer is a disc-shaped plate such as a single crystal obtained by growing silicon, gallium arsenide (GaAs), or the like.

This wafer undergoes various processes for manufacturing semiconductor elements to form materials such as transistors and diodes on the surface, and can arrange hundreds of wafers.

In such a process, a transfer robot is used in order to transfer a wafer according to each manufacturing step.

Among them, a method or an apparatus for judging whether to use a test wafer to move a wafer to an appropriate position has been developed in the past, and a document proposed as such an example is a patent document proposed below.

However, according to a method or an apparatus for transferring a conventional wafer including a patent document proposed below, a reference point for whether or not the wafer is appropriately transferred to the transfer apparatus is separately formed.

Among them, an additional reference point needs to be manufactured in a device where the reference point is not formed, thereby increasing manufacturing cost and time.

In addition, conventionally, there is a method for confirming whether the jig provided according to the type of the wafer is accurately located at an appropriate position. However, in this method, it is necessary to first produce an additional jig corresponding to the type of the wafer.

In addition, for example, in a state where wafers are stored by a wafer running container divided by the same slit, the side of the wafer is prevented from being damaged when the stored wafer is taken out of the transfer robot, but it has not been developed to prevent this. A device that detects the side of a wafer.

In addition, in the process of transferring wafers, when it is necessary to detect vibrations applied to the manufacturing apparatus, or temperature and humidity around the manufacturing apparatus, conventionally, a unit that can detect such conditions is not formed in the manufacturing apparatus, so it is necessary to Forming the detection unit separately from the manufacturing apparatus results in cost increase and space efficiency due to the separate formation.

In addition, the device and method are generally applicable to a system based on Bluetooth communication. Compared with a wide device environment, short-range communication cannot be performed, and a large amount of data cannot be transmitted.

In addition, only the wafers are described in this content, but it is necessary to have a test device for whether or not the transfer is normally performed in other processes such as a quadrangular photo mask or a liquid crystal panel (LCD Panel).

Know-how

Patent Literature

Korean Published Patent No. 10-2010-0054908, Publication Date: May 26, 2010, Title of Invention: Method for Measuring the Origin of Automotive Teaching Through the Field of View of the Camera

Korean Laid-Open Patent No. 10-2003-00806976, Publication Date: October 17, 2003, Title of Invention: Jig for measuring chuck height for wafer testing

The present invention is a test device that uses an image measuring device to confirm whether a detected object is moving normally. The height of the slit is measured in a manner that prevents the detected object from colliding with the slit in the storage box. In the manufacturing device, a test model for measuring a transfer position used in the field of a semiconductor or a display system for detecting whether an object is normally transferred to a position to be transferred and a precision transfer measurement method using the test model for measuring the transfer position are determined.

The test model for measuring the transfer position according to an embodiment of the present invention is applicable to a device used in the field of semiconductor or display system including the following devices: a storage box for loading a test object body; and an object body fixing device including a device for fixing the test A fixed unit of an object body; and a transfer robot for transferring the test object body in the storage box to the fixed unit, which includes: a model body having the same size as the detection object body; a pinhole image measurement A component for recognizing or photographing a plurality of guide pinholes formed in the fixing unit; a slit image measuring component disposed at an upper end of the model body in a slot of the storage box, and storing the model body in the storage box In the state, the gap between the slit of the storage box and the model body that is arranged on the upper end of the model body can be identified or photographed; and the central processing unit can transmit the needle to the image processing computer prepared in advance. Information measured by the hole image measuring unit.

According to the present invention, the precision transfer measurement method using the transfer position measurement test model is applicable to equipment used in the field of semiconductor or display systems including the following devices: a storage box for loading detection An object body; an object body fixing device comprising a fixing unit for fixing the detection object body; and a transfer robot for transferring the detection object body in the storage box to the fixing unit. The test model for measuring the transfer position includes: a model body having the same size as that of the object to be detected; a pinhole image measuring component that can recognize or photograph a plurality of guiding pinholes formed in the fixed unit; a slit image measuring component, The upper end of the model body disposed in the slit of the storage box, and in a state where the model body is stored in the storage box, the slit of the storage box disposed at the upper end of the model body can be identified or photographed to measure And the central processing unit, which can transmit information measured by the pinhole image measuring unit or the slit image measuring unit to a previously prepared image processing computer. The precision transfer position measuring method is characterized in that it includes: step (1), placing the test model for measuring the transfer position stored in the storage box on the transfer robot; step (2), the transfer in step (1) The robot transfers the test model for measuring the transfer position to the upper end of the fixed unit; step (3) is directed to the fixed unit in step (2). The test model for measuring the transfer position of the end part, the pinhole image measuring part identifies or photographs the guide pinhole of the fixed unit; step (4), transmits to the central processing part the identification or photographing in step (3) Step (5), the image processing computer is transmitted to the central processing unit in step (4) The image; and step (6), based on the image transmitted to the image processing computer in step (5), determining whether the test model for the transfer position measurement can be placed at a predetermined position of the fixed unit, and the transfer can be grasped Whether the center of the position measurement test model is accurately aligned with the center of the guide pinhole.

The test model for transfer position measurement in the field of semiconductor or display system and the precision transfer measurement method using the test model for transfer position measurement of the present invention are applicable to equipment used in the field of conductor or display system including the following devices: storage box For loading a detection object body; an object body fixing device including a fixing unit for fixing the detection object body; and a transfer robot for transferring the detection object body in the storage box to the fixing unit, and the transfer position is measured The test model used includes: the model body, which is the same size as the object to be detected; a pinhole image measuring component that can identify or photograph a plurality of guiding pinholes formed in the fixed unit; a slot image measuring component arranged in the storage The upper end of the model body in the slit of the box is identified or photographed in a state where the model body is stored in the storage box to measure the slit of the storage box and the model body disposed at the upper end of the model body. Interval; and a central processing unit that transmits the pinhole image to a pre-prepared image processing computer The information measured by the measuring unit or the slit image measuring unit; the test device that uses the image measuring device to confirm whether the object is moving normally, and measures the height of the slit to prevent the object from colliding with the slit in the storage box, even if The reference point is not formed, and the pinhole is lifted to determine whether the object is normally transferred to the position where it needs to be transferred in the manufacturing apparatus.

100‧‧‧ Test model for measuring the transfer position

110‧‧‧model body

120‧‧‧ Pinhole Image Measurement Unit

121, 122, 123‧‧‧ camera for pinhole shooting

124‧‧‧First range (shooting range)

125‧‧‧Second range (shooting range)

126‧‧‧Third range (shooting range)

127‧‧‧ Center of test model for measurement of transfer position

130‧‧‧Slit image measurement unit

131‧‧‧Slit camera on one side

132‧‧‧Slit camera on the other side

133‧‧‧ side recognition range

134‧‧‧ Identification range on the other side

140‧‧‧Central Processing Unit

150‧‧‧Testing parts

200‧‧‧ Test model for measuring the transfer position

210‧‧‧ Model Ontology

220‧‧‧ pinhole image measuring unit

230‧‧‧Slit Image Measurement Unit

260‧‧‧Pollution detection camera

310‧‧‧ Model Ontology

328‧‧‧ Image Sensor for Pinhole Shooting

410‧‧‧model body

429‧‧‧Screen parts

500‧‧‧ Test model for measurement of transfer position

510‧‧‧model body

520‧‧‧ pinhole image measuring unit

530‧‧‧Slit image measurement unit

540‧‧‧Central Processing Unit

560‧‧‧Front camera head

10‧‧‧Safety Box

11‧‧‧ slit

12‧‧‧ slit

20‧‧‧Processing chamber

22‧‧‧Guide Pinhole

23‧‧‧ guide the center of the pinhole

25‧‧‧ Object body fixing device

27‧‧‧Fixed unit

30‧‧‧ transfer robot

50‧‧‧ Detection object

60‧‧‧Image Processing Computer

H‧‧‧ calculated value

H’‧‧‧normal comparison value

h1‧‧‧Vertical interval value

h2‧‧‧height

h3‧‧‧ removes the value of h2 from h1

h4‧‧‧half of the slit height

h5‧‧‧Vertical distance

d1‧‧‧horizontal distance

S100 ~ S150‧‧‧step

S200 ~ S260‧‧‧step

FIG. 1 is a perspective view schematically showing the environment of a transfer robot and a processing chamber in which a test model for a transfer position measurement according to the first embodiment of the present invention is to be used; FIG. 2 is a view from the top of the test for the transfer position measurement according to the first embodiment of the present invention A schematic view of the model; FIG. 3 is a top view of a test model for measuring a transfer position of the first embodiment of the present invention viewed from the front; FIG. 4 is a schematic view of the interior of the processing chamber of the first embodiment of the present invention viewed from above; FIG. 6 is a schematic diagram showing a state in which the pinhole image measuring part of the first embodiment of the present invention recognizes a guide pinhole and the center of the test model for measuring the transfer position is different from the center of the guide pinhole formed in the fixed unit; FIG. 7 is a schematic view showing a state in which the pinhole image measuring part of the first embodiment of the present invention recognizes a guide pinhole and the center of the test model for measuring the transfer position is different from the center of the guide pinhole formed in the fixed unit; Schematic diagram showing the state of the guide pinhole identified by the test model for measuring the transfer position in the first embodiment of the present invention at an appropriate position ; FIG. 8 is a schematic diagram showing a state in which the slit image measuring unit of the first embodiment of the present invention recognizes a slit on one side and a slit on the other side; FIG. 9 is a diagram illustrating a storage box using a transfer robot according to the first embodiment of the present invention. A flow chart of a method for accurately confirming a position where a test model for measuring a transfer position is safely pulled out of the storage box or inserted inward; FIG. 10 is a measurement of a transfer position transferred to a fixed unit by a transfer robot according to the first embodiment of the present invention A flowchart of a method for determining whether the center of the test model for measurement is exactly the same as the center of the guide pinhole formed in the fixed unit; FIG. 11 is an enlarged view of part A of FIG. 8 of the first embodiment of the present invention; FIG. 12 is a plan view of a test model for measuring a transfer position of a pollution detection camera according to a second embodiment of the present invention, as viewed from the front; FIG. 13 is an image sensor for pinhole imaging and fixing the third embodiment of the present invention An enlarged view of a state where the units are in contact; FIG. 14 is an enlarged view of a state where a screen member is in contact with a fixed unit according to a fourth embodiment of the present invention; and FIG. 15 is from above The side view is a view including a test model for measuring a transfer position of a front camera member according to a fifth embodiment of the present invention.

Hereinafter, a test model for measuring a transfer position used in the field of a semiconductor or a display system and a precision transfer measurement method using the test model for measuring a transfer position will be described with reference to the drawings.

1 is a perspective view schematically showing a transfer robot and a processing chamber environment prepared to use a test model for measurement of a transfer position according to an embodiment of the present invention; FIG. 2 is a schematic view of a test model for measurement of a transfer position of a first embodiment as viewed from above; 3 is a plan view of a test model for measuring a transfer position according to the first embodiment of the present invention; FIG. 4 is a schematic view of the inside of a processing chamber according to the first embodiment of the present invention; FIG. 5 is a schematic view of the first embodiment of the present invention; A pinhole image measuring part according to an embodiment is a schematic diagram of a state in which a guide pinhole is recognized and a center of a test model for measuring a transfer position is different from a center of the guide pinhole formed in a fixed unit; FIG. 6 is a schematic view showing the first A pinhole image measuring part according to an embodiment is a schematic diagram of a state in which a guide pinhole is identified and a center of a test model for measuring a transfer position is different from a center of the guide pinhole formed in a fixed unit; FIG. FIG. 8 is a schematic diagram for identifying a state of a guide pinhole at an appropriate position by a test model for measuring a transfer position of an embodiment; A schematic view showing a state in which the slit image measuring unit of the first embodiment of the present invention recognizes a slit on one side and a slit on the other side; FIG. 9 is a diagram for measuring the transfer position of the storage box by the transfer robot of the first embodiment of the present invention. A flowchart of a method for accurately confirming a position where the test model is safely pulled out of the storage box or placed inward; FIG. 10 is a test model for measuring a test position of a transfer position measured by the transfer robot of the first embodiment of the present invention to a fixed unit A flowchart of a method of determining whether the center is exactly the same as the center of the guide pinhole formed in the fixing unit; and FIG. 11 is an enlarged view of FIG. 8A of the first embodiment of the present invention.

The test model 100 for measuring the transfer position is applicable to equipment used in the field of semiconductors or display systems including the following devices: a storage box 10 for a user to load a test object 50; an object body fixing device 25 including a device for fixing a test object A fixing unit 27 of the body 50; and a transfer robot 30 for transferring the detection object body 50 of the storage box 10 to the fixing unit 27. It includes: the model body 110, which is the same size as the detection object body 50; a pinhole image measuring unit 120, which can recognize or photograph a plurality of guide pinholes 22 formed in the fixing unit 27; and a central processing unit 140, which provides an image prepared in advance The processing computer 60 transmits information measured by the pinhole image measuring unit 120.

The test model 100 for measuring the transfer position is suitable for equipment used in the field of semiconductors or display systems including the following devices: a storage box 10 for loading a test object 50; an object fixing device 25 including a device for fixing the test object 50 A fixed unit 27; and a transfer robot 30 for transferring the detection object body 50 of the storage box 10 to the fixed unit 27; characterized in that it includes: a model body 110 having the same size as the detection object body 50; a slit image measuring part 130. The upper end of the model body 110 disposed in the slits 11 and 12 of the storage box 10 is stored in the model body 110 In the state of the tube box 10, it is recognized or photographed so that the space between the slits 11, 12 of the storage box 10 disposed on the upper end of the model body 110 and the model body 110 can be measured; and a central processing unit 140 for The image processing computer 60 transmits information measured by the pinhole image measuring unit 120.

The test model 100 for measuring the transfer position may include a model body 110, a pinhole image measurement unit 120, and a central processing unit 140; or a model body 110, a slit image measurement unit 130, and a central processing unit 140; or may include a model body 110, The pinhole image measurement unit 120, the slit image measurement unit 130, and the central processing unit 140. Hereinafter, for convenience of explanation, the test model 100 for measuring the transfer position including the model body 110, the pinhole image measuring unit 120, the slit image measuring unit 130, and the central processing unit 140 will be described as an example.

1 to 11, the test model 100 for measuring the transfer position in this embodiment includes a model body 110, a pinhole image measuring unit 120, a slit image measuring unit 130, and a central processing unit 140.

The test model 100 for measuring the transfer position may further include a detection unit 150.

The test model 100 for measuring the transfer position is a test device for confirming whether the detection object 50 is normally moved by using the image measurement device and method, and can detect whether the detection object 50 is normally transferred.

The detection object body 50 is generally a wafer shape formed of a circular thin plate in this embodiment, but may be a rectangular photomask or a liquid crystal panel according to the purpose.

The test model 100 for measuring the transfer position is suitable for equipment used in the field of semiconductors or display systems including the following devices: a storage box 10 for loading a test object 50, and an object fixing device 25 for fixing the test object 50 A fixed unit 27; and a transfer robot 30 for transferring the detection object body 50 of the storage box 10 to the fixed unit 27.

The storage box 10 has slits 11 and 12 of the same width, and each of the slits 11 and 12 of the same width stores a single test object body 50, and the storage box 10 is a transfer for storing the test object body 50 before it is transferred to another device. Container (FOUP, Front Opening Unified Pod).

The object body fixing device 25 is installed in the processing chamber 20 in a space where the detection object body 50 is processed, and a fixing unit 27 for fixing the detection object body 50 is formed.

For example, when the detection object body 50 is a wafer, the fixing unit 27 may be an electrostatic chuck (ESC, Electrostatic chuck) or a clamping (Clamping) device based on a meshing method for fixing the detection object body 50 by an electrostatic force. .

A guide pin hole 22 is formed in the lower portion of the fixing unit 27, and the guide pin hole 22 extends a predetermined length in the fixing unit 27, thereby contacting the bottom surface of the detection object body 50 to support the detection object body 50.

Generally, there are more than three fixed units 27, and the centers of the plurality of fixed units 27 need to be the same as the centers of the test object bodies 50 placed on the fixed units 27, so that the test object bodies 50 can be accurately formed, thereby reducing the number of manufacturing processes. Defective.

Moreover, if the centers of the plurality of fixed units 27 are not the same as the centers of the test object bodies 50 placed on the fixed unit 27, the test object bodies 50 are abnormally formed, and a large number of defective products occur during the manufacturing process.

The model body 110 replaces the detection object body 50 to confirm whether the detection object body 50 moves normally and has the same size as the detection object body 50. For example, if the detection object body 50 is a wafer and a circular thin plate, the model body 110 also becomes Round sheet.

When the edge of the model body 110 is stored in the storage box 10, it can be placed in the slits 11 and 12.

The pinhole image measuring part 120 can recognize or photograph a plurality of guide pinholes 22 formed in the object fixing device 25, and is formed by a plurality of pinhole photographing cameras 121, 122, and 123 that measure a plurality of the guide pinholes 22, respectively. .

The recognition range or shooting range of the guide pinhole 22 is set in advance in the pinhole photography cameras 121, 122, and 123; the component symbols 124, 125, and 126 shown in FIG. 5 are the pinhole photography cameras 121, 122, and 123 identifies the recognition range or shooting range of the corresponding guide pinholes 22 respectively.

In this embodiment, three guide pinholes 22 are formed. In order to identify the guide pinholes 22, the pinhole image measuring component 120 may include a first pinhole photography camera 121, a second pinhole photography camera 122, and a first Three pinhole shooting camera 123. However, a plurality of guide pinholes 22 may be formed, and a plurality of pinhole imaging cameras 121, 122, and 123 may be formed.

In detail, the first pinhole photography camera 121 recognizes or captures a portion corresponding to the first range 124, the second pinhole photography camera 122 recognizes or captures a portion corresponding to the second range 125, and the third The camera 123 for pinhole shooting recognizes or captures a portion corresponding to the third range 126.

In the formed state, if the transfer robot 30 is used to transfer the test model 100 for measuring the position to the upper end of the object fixing device 25, the camera 121, 122, and 123 for the pinhole image capture the first range 124, The second range 125 and the third range 126.

Each of the ranges 124, 125, and 126 is a position adjacent to the corresponding guide pinhole 22.

As described above, when the captured image is transmitted from the central processing unit 140 to the image processing computer 60, the image processing computer 60 calculates the position value of the guide pinhole 22 and uses the position value of the guide pinhole 22 to calculate the center 23 of the guide pinhole.

Among them, the first range 124, the second range 125, and the third range 126 identify the guide pinholes 22 in the captured image by using a vision technology that distinguishes between light and dark colors.

The guide pinhole 22 has a relatively darker color than the periphery. Therefore, in the images captured in each of the first range 124, the second range 125, and the third range 126, the relatively dark portion can be determined as the position of the guide pinhole 22. .

The position of the guide pinhole 22 photographed in each of the first range 124, the second range 125, and the third range 126 is output as a position value, and the center 23 of the guide pinhole is calculated using each position value.

When the center 23 of the guide pinhole as described above is the same as the center 127 of the test model 100 for the transfer position measurement, the test model 100 for the transfer position measurement is accurately transferred to the fixed unit 27.

However, as shown in FIG. 5 or FIG. 6, if the center 23 of the guide pinhole obtained by using this vision technology is not the same as the center 127 of the test model for transfer position measurement, the test model 100 for transfer position measurement is determined to be inaccurate. The ground is transferred to the fixed unit 27. Furthermore, the inclination of the line segment connecting the center 127 of the test model for transfer position measurement and the center 23 of the guide pinhole is determined by the image processing computer 60, and the test model 100 for transfer position measurement can be calculated accurately. The corrected position value transferred by the fixing unit 27.

Specifically, for example, when the coordinate value of the center 127 of the transfer position measurement test model 100 is set to (0, 0), the position value (x1, y1) of the guide pinhole 22 measured in the first range 124 is changed. The measurement is (-2.3), the position value (x2, y2) of the guide pinhole 22 measured in the second range 125 is measured as (2, 5), and the position value of the guide pinhole 22 measured in the third range 126 ( When x3, y3) is (0, -2), the position value (x0, y0) of the guide pinhole 22 is determined by determining the center of gravity ( ) To find out. If the position value of the guide pinhole 22 is obtained using this method, then ( ) Finds (0, 2), so that the center 23 of the guide pinhole can be obtained. Furthermore, if (0,0) of the coordinate value of the center 127 of the test model 100 for position measurement is transferred and (0,2) of the calculated coordinate value of the center 23 of the guide pinhole, the inclination is obtained by line segment connection and obtained The distance can be used to calculate the corrected position value that the test model 100 for measurement of the transfer position accurately transfers to the fixed unit 27.

In this embodiment, there are three guide pinholes 22, and the camera 121, 122, and 123 for pinhole shooting are also limited to three. Even if two or more guide pinholes 22 are recognized, the center can be calculated. Therefore, There may be different numbers of the guide pinhole 22 and the camera for pinhole shooting to calculate the center.

The slit image measuring unit 130 is formed on the model to measure the distance between the slits 11 and 12 of the storage box 10 arranged on the upper end of the model body 110 and the model body 110 in a state where the model body 110 is stored in the storage box 10. The diameter line of the main body 110 identifies or photographs the slits 11 and 12 of the storage box 10 arranged at the upper end of the model main body 110.

In detail, the slit image measuring unit 130 includes a one-side slit camera 131 and another side slit that can identify the one-side slit 11 and the other-side slit 12 disposed on the upper ends of both sides of the model body 110, respectively. In the camera 132, the recognition range or shooting range of the one-side slit 11 and the other-side slit 12 are set in the one-side slit camera 131 and the other-side slit camera 132, respectively.

Generally, a pair of the one-side slit 11 and the other-side slit 12 are located on a horizontal line, and correspondingly, one-side slit camera 131 and the other-side slit camera 132 exist on the same horizontal line.

In this embodiment, the side direction is based on the center 127 of the test model 100 for measuring the transfer position shown in FIG. 8, and the side of the one-side slit camera 131 is formed.

The component symbol 133 is an identification range of one side that the slit camera 131 can recognize or photograph, and the component symbol 134 is an identification range of the other side that the slit camera 132 can recognize or photograph.

As described above, as shown in FIG. 8, when the transfer robot 30 is inserted into the bottom surface of the transfer position measurement test model 100 stored in the storage box 10, the transfer position measurement test model 100 is lifted to a predetermined height and one side is narrow. The slot camera 131 recognizes or captures the side slit 11 arranged on the upper end of the side of the model body 110 and transmits the captured image to the central processing unit 140. In addition, the other slit camera head 132 recognizes or captures the other slit 12 arranged on the upper end of the other side of the model body 110, and transmits the captured image to the central processing unit 140.

Next, the image is transmitted to the image processing computer 60 using the wireless fidelity communication (Wifi) of the central processing unit 140.

Next, using this image, the gap between the slits 11 and 12 and the test model 100 for measuring the transfer position is determined by the subsequent calculation method and the slit image measuring unit 130.

Next, the image is transmitted to the image processing computer 60 using the wireless fidelity communication of the central processing unit 140.

Then, using this image, the gap between the slits 11 and 12 and the test model 100 for measuring the transfer position is determined by the subsequent calculation method and the slit image measuring unit 130.

H shown in FIG. 11 is a value calculated by using the value measured by the slit image measuring unit 130, and the interval value between the slits 11, 12 and the test model 100 for measuring the transfer position and the value stored in the image processing computer in advance The normal comparison value H 'of 60 is compared.

That is, it is determined whether the value of H, which is the height value of the measurement calculation, is the same as the value of H ′ input in advance, and it is determined whether or not the transfer robot 30 is used to safely remove the transfer box measurement test model 100 from the storage box 10. Outside or inside the storage box 10.

h1 is the use of the vision processing computer 60's vision technology to process the image of the side recognition range 133 captured in the side slit camera 131 to extract the vertical between the bottom surface of the side slit 11 and the model body 110 Interval value.

d1 is a horizontal distance from the inner surface of the storage box 10 to the slit camera 131 on one side, and this value is a value input in the image processing computer 60 in advance.

h4 is a half value of the height of the slit 11 on one side, and this value is a value entered in the image processing computer 60 in advance.

h5 is a vertical distance measured from the upper end of the model body 110 toward the center of the camera 131, and is a value input to the image processing computer 60 in advance.

Θ is a calculated value other than the angle measured from the virtual center line of the direction of the camera 131 to the shooting of the model body 110 at 90 °, and this value is input to the image processing computer 60 in advance.

h2 is the height value removed from h1, the interval obtained by the formula of h2 = d1 * tan (180-θ) using the previously input θ, and d1 and θ used in the formula are the values previously input, Therefore, this h2 is also a value input in advance.

h3 is a value obtained by subtracting h2 from h1, and is obtained by the formula h3 = h1-h2.

This value is calculated by substituting the above-mentioned value into the following mathematical formula.

H = h3 + h4 + h5

When the calculated H value is compared with the value entered in advance, when the test model 100 for transfer position measurement is removed from the storage box 10 by the transfer robot 30 or placed in the storage box 10, it is determined to perform a safe operation.

In the present embodiment, an example of the measurement method using the one-side slit camera 131 is described. However, the other method can be applied to the other slit camera 132.

As described above, if the H value calculated on the slit camera side on one side and the calculated value H measured on the slit camera head on the other side are compared, it can be judged that one side of the test model 100 for transfer position measurement and the other Whether the inclination of one side is parallel.

In addition, the difference between the H value measured and calculated by the slit camera 131 on one side and the H value measured and calculated by the slit camera 132 on the other side can also be calculated. Based on this, it can be judged whether the test model 100 for measuring the transfer position is Move accurately.

The central processing unit 140 can transmit the information measured by the pinhole image measuring unit 120 or the slit image measuring unit 130 to the image processing computer 60 prepared in advance. It provides a storage space capable of storing the information, and has a built-in storage unit capable of storing the information to the image processing computer 60. A wireless fidelity communication module (not shown) that transmits the information.

As described above, when information is transmitted to the image processing computer 60, wireless fidelity can be used for communication. Compared with conventional Bluetooth communication, remote communication can be performed and a large amount of data can be transmitted quickly.

In this embodiment, the image captured by the pinhole image measurement unit 120 or the slit image measurement unit 130 and the measurement value measured by the detection unit 150 are transmitted to the central processing unit 140 and to the image processing computer 60. However, each of the camera heads 121, 122, and 123 of the pinhole image measurement unit 120, each of the camera heads 131 and 132 of the slot image measurement unit 130, and each sensor of the detection unit 150 are built-in to enable wireless fidelity communication individually. The wireless fidelity chip can be transmitted to the image processing computer 60 in an independent form even without passing through the central processing unit 140.

Moreover, in this embodiment, the calculation for confirming whether the test position 100 for the transfer position measurement is normally moved is implemented in the image processing computer 60; however, the central processing unit 140 performs the calculation itself, and only the calculated value is transmitted to the image processing computer 60. send.

In this embodiment, during the communication process between the central processing unit 140 and the image processing computer 60, wireless fidelity communication may be performed, but other wireless communication such as Bluetooth and radio frequency (RF) may also be used.

The detection unit 150 can measure changes in the surrounding environment of the test model 100 for the transfer position measurement and the inclination of the test model 100 for the transfer position measurement itself.

However, the inclination of the test model 100 for measuring the transfer position itself may be the inclination of the test model 100 for measuring the transfer position.

The detection member 150 is formed in the model body 110. A vibration sensor capable of measuring the vibration of the model body 110 itself, an inclination sensor measuring the inclination of the test model 100 for measuring the transfer position, a temperature and humidity sensor capable of measuring the temperature and humidity around the model body 110, measurement Various sensors such as a gas sensor for measuring the gas surrounding the test model 100 for the transfer position, and a gas pressure sensor for measuring the gas pressure around the test model 100 for the transfer position measurement are integrated into the detection module 150 as an integrated module. The measured values measured in each sensor are transmitted to the central processing unit 140 to be transmitted to the image processing computer 60 or other communication devices.

As described above, during the transfer of the transfer position measurement test model 100, it is possible to measure the vibration of the transfer position measurement test model 100 or a contacting device, and to measure the surrounding temperature and humidity of the transfer position measurement test model 100. Therefore, Sudden impacts or external environmental changes can be detected to maintain constant ambient environmental conditions.

Hereinafter, a precise transfer measurement method using the test model 100 for transfer position measurement will be described. In performing such a description, descriptions overlapping with those already described in the present invention will be omitted.

Hereinafter, a method of accurately measuring the test object 50 for the transfer position measurement by using the transfer robot 30 from the storage box 10 to the outside or the position of the jig inward (step S100) will be described.

First, the transfer robot 30 lifts up the transfer position measurement test model 100 stored in the storage box 10 (step S110).

Thereafter, in step S110, the slit image measuring unit 130 recognizes or captures the model body 110 of the lifted transfer position measurement test model 100 and the slits 11 and 12 at the upper end of the model body 110 (step S120).

Among them, in step S120, the recognized or captured image is transmitted to the central processing unit 140 (step S130).

Next, in step S130, the image transmitted to the central processing unit 140 is transmitted to the image processing computer 60 (step S140).

Next, in step S140, the space between the model body 110 and the slits 11 and 12 is transmitted to the image processing computer 60 to measure the position of the model body 110 (step S150).

As described above, the position of the model body 110 is measured by calculating the interval between the model body 110 and the slits 11 and 12. When the test model 100 for transfer position measurement is taken out of the storage box 10 by the transfer robot 30, it prevents collision and storage The manner of the slits 11 and 12 in the case 10 measures the interval between the slits 11 and 12.

That is, the test model 100 for transfer position measurement replaces the detection object body 50 and measures the interval between the slits 11 and 12 so as not to collide with the slits 11 and 12 in the storage box 10. Then, when the transfer robot 30 removes the storage When detecting the object 50 in the case 10, the storage case 10 is stably taken out to the outside or placed inward for measurement.

Hereinafter, a method of measuring the position of the center of the center 127 of the test position model 100 for the transfer position measurement by the transfer robot 30 to the fixed unit 27 and the center 23 of the guide pin hole formed in the fixed unit 27 will be described (step S200).

First, the transfer position measurement test model 100 stored in the storage box 10 is transferred to the processing chamber 20 and placed on the transfer robot 30 (step S210).

Thereafter, in step S210, the test model 100 for measuring the transfer position placed on the transfer robot 30 is transferred to the upper end portion of the fixed unit 27 (step S220).

After that, in step S220, the pinhole image measuring unit 120 recognizes or photographs the guide pinhole 22 of the fixing unit 27 in the test model 100 for measuring the transfer position that is transferred to the upper end portion of the fixing unit 27 (step S230).

In step S230, the recognized or captured image is transmitted to the central processing unit 140 (step S240).

Then, in step S240, the image transmitted to the central processing unit 140 is transmitted to the image processing computer 60 (step S250).

Thereafter, in step S250, it is determined whether or not the test model 100 for measuring the transfer position is placed at a predetermined position of the fixed unit 27 based on the image transmitted from the image processing computer 60 (step S260).

Conventionally, in order to confirm whether or not the test model 100 for transfer position measurement is transferred to an appropriate position of the fixed unit 27, a reference point is additionally formed. As described above, the pinhole image measuring unit 120 recognizes the guide pinhole 22 generally formed in the fixed unit 27 to determine Since the center 23 of the guide pinhole coincides with the center 127 of the test model 100 for measuring the transfer position and the transfer position of the test model 100 for measuring the transfer position is measured, it is not necessary to form an additional reference point.

Hereinafter, a test model for measuring a transfer position according to another embodiment of the present invention will be described with reference to the drawings. In performing such a description, descriptions that overlap with those previously described in the first embodiment of the present invention will be omitted.

12 is a plan view of a test model for measuring a transfer position of a pollution detection camera head according to a second embodiment of the present invention, as viewed from the front.

Referring to FIG. 12, a contamination detection camera 260 is formed on the upper end of the model body 210 of the test model 200 for measuring the transfer position of the present embodiment.

The pollution detection camera 260 is formed on the upper end of the model body 210 so as not to block the range captured by the pinhole image measuring member 220 and the slit image measuring member 230. When the work is performed, the upper part of the model body 210 can be photographed in front of The central processing unit transmits or transmits the captured images to the image processing computer.

As described above, the image captured by the pollution detection camera 260 is read to confirm the contaminants around the test model 100 for measuring the transfer position. For example, if the chamber is imaged by the pollution detection camera 260, it can be confirmed whether or not a pollutant has entered the interior.

FIG. 13 is an enlarged view of a state where the image sensor for pinhole shooting according to the third embodiment of the present invention is in contact with the fixing unit.

Referring to FIG. 13, the pinhole image measuring unit of the test model for measuring the transfer position in this embodiment forms a pinhole image sensor 328.

An image sensor 328 for pinhole shooting is formed on the bottom surface of the model body 310 to capture the contact state of the fixed unit 27 and convert light into electrical signals.

As shown in FIG. 13, if the pinhole shooting image sensor 328 captures the fixing unit 27 and the pinhole shooting image sensor 328 are in surface contact with each other, the light cannot be directed to the pinhole shooting image sensor 328 and the fixing unit. The image sensor 328 for pinhole shooting of the part in contact with the surface of the unit 27 projects, and light can be projected only to the periphery. Therefore, the surface-contacting portion of the fixing unit 27 is relatively darkened. Therefore, a visual technique is used to output the dark portion as a position value, and this value is determined as the position of the fixed unit 27.

In this way, a plurality of other fixed units 27 can also output a position value, and use this position value to calculate the center of the guide pinhole that is the same as the center of the fixed unit 27, and use the calculated value to determine whether the test model for measuring the transfer position is Transfer to the fixed unit 27 accurately.

FIG. 14 is an enlarged view of a state where a screen member is in contact with a fixing unit according to a fourth embodiment of the present invention.

Referring to FIG. 14, the pinhole image measuring part of the test model for measuring the transfer position in this embodiment includes: a bottom surface formed on the model body 410, the bottom surface being in contact with the fixing unit 27; and the contacted portion may be output as a coordinate value. Screen component 429.

The screen component 429 may be a touch screen. If a plurality of fixed units 27 at different positions touch the screen component 429, this portion is output as a coordinate value, and the center of the fixed unit 27 is calculated using the output coordinate value. It is determined whether the center of the fixed unit 27 and the center of the transfer position measurement test model agree with each other to determine whether the transfer position measurement test model is accurately transferred to the fixed unit 27.

15 is a schematic view of a test model for measuring a transfer position including a front camera member according to a fifth embodiment of the present invention, as viewed from above.

Referring to FIG. 15, a test model 500 for measuring a transfer position in this embodiment includes a model body 510, a pinhole image measurement unit 520, a slit image measurement unit 530, a central processing unit 540, and a front camera unit 560.

The front camera member 560 is mounted on the model body 510 so that the movement path of the test model 500 for measuring the transfer position can be observed. Preferably, as shown in FIG. 15, the front camera member 560 is mounted on both ends of the model body 510 in diameter.

The front camera unit 560 captures the front of the test model 500 for measuring the transfer position, and allows the worker to confirm that the captured image is transmitted to a previously prepared image system. The imaging system may be an application of a smart phone or a monitor system capable of confirming a captured image.

As described above, the moving path of the transfer position measurement test model 500 can be observed in real time by using the front camera member, and thus it is possible to instantly confirm whether the transfer position measurement test model 500 is accurately moved. Therefore, it is determined by the movement path measurement of the test model 500 for the transfer position measurement whether the robot in which the test model 500 for the transfer position measurement is placed is operating normally.

The above is the display and description of the present invention and specific embodiments. As long as it is a person of ordinary skill in the technical field to which the present invention pertains, the invention may be modified and modified within a range not exceeding the scope of the inventive ideas described in the patent application scope of the above invention. Variety. However, such modifications, changes, and structures all fall within the protection scope claimed by the present invention.

Industrial availability

According to an embodiment of the present invention, a test model for measuring a transfer position used in the field of a semiconductor or a display system, and a precision transfer measurement method using the test model for measuring the transfer position, determine whether or not a test object is moving normally by using an image measuring device. The test device adjusts the height of the slit in such a way that the detection object does not collide with the slit in the storage box. Even if no additional reference point is formed, the pinhole is lifted to determine whether the detection object is normally needed in the manufacturing device Since the transfer position is transferred, it has high industrial applicability.

Claims (10)

A test model for measuring a transfer position is suitable for equipment used in the field of semiconductors or display systems of the following devices: a storage box for loading a test object body; an object body fixing device including a device for fixing the test object body A fixed unit; and a transfer robot for transferring the test object body in the storage box to the fixed unit, comprising: a model body, the same size as the test object body; a pinhole image The measurement unit can recognize or photograph a plurality of guide pinholes formed in the fixed unit; and a central processing unit for transmitting information measured by the pinhole image measurement unit to an image processing computer prepared in advance. The test model for measuring the transfer position according to item 1 of the scope of patent application, wherein the pinhole image measuring means is a plurality of pinhole photographs for respectively measuring a plurality of the guide pinholes formed in the fixing unit. The head is constituted, and a recognition range or a shooting range of the guide pinhole is set in advance in the pinhole shooting camera. According to the test model for measuring the transfer position according to item 2 of the scope of the patent application, the pinhole photographing camera is formed on a bottom surface of the model body and is formed to photograph the preset pinhole in advance. Corresponds to the range, and can capture the state where the pinhole shooting camera is in contact with the fixed unit. According to the test model for measuring the transfer position according to item 1 of the scope of the patent application, wherein the pinhole image measuring part includes a screen part, the screen part is formed on a bottom surface of the model body, and can contact the fixed unit. , Output the part touched by the coordinate value. A test model for measuring the transfer position is suitable for equipment used in the field of semiconductor or display system including the following devices: a storage box for loading a test object body; a object body fixing device including a device for fixing the test object body A fixed unit; and a transfer robot for transferring the test object body in the storage box to the fixed unit, comprising: a model body, the same size as the test object body; a slit The image measurement unit is arranged on the upper end of the model body in the slit of the storage box, so that the model body can be recognized or photographed in a state where the model body is stored in the storage box, and can measure the position of the model body. A gap between the slit of the storage box and the model body; and a central processing unit capable of transmitting information measured by the slit image measuring unit to an image processing computer prepared in advance. According to the test model for measuring the transfer position according to item 5 of the scope of the patent application, the slit image measuring unit includes a one-side slit and an other-side slit that can identify the upper and lower sides of the model body, respectively. The slit camera on one side and the slit camera on the other side, and the identification of the slit on the other side and the slit on the other side are preset in the slit camera on the other side and the slit camera on the other side Range or shooting range. The test model for measuring the transfer position according to item 1 or 5 of the scope of the patent application, wherein the test model for measuring the transfer position includes a detection unit capable of measuring the periphery of the test model for measuring the transfer position. Changes in the environment and the inclination of the test model for measuring the transfer position itself. A test model for measuring a transfer position is suitable for equipment used in the field of semiconductors or display systems including the following devices: a storage box for loading a test object body; an object body fixing device including a device for fixing the test object A fixed unit of the body; and a transfer robot for transferring the test object body in the storage box to the fixed unit, which is characterized by comprising: a model body, the same size as the size of the test object body; a needle A hole image measuring component can recognize or photograph a plurality of guide pinholes formed in the fixing unit; a slit image measuring component is arranged on the upper end of the model body in a slot of the storage box so as to be positioned on the model body In the state of being stored in the storage box, it can be identified or photographed to be able to measure the gap between the slit of the storage box disposed on the upper end of the model body and the model body; and a central processing unit, An image processing computer transmits information measured by the pinhole image measurement unit or the slit image measurement unit. A precise transfer position measurement method using a test model for transfer position measurement. The test model for transfer position measurement is suitable for equipment used in the field of semiconductor or display systems including the following devices: a storage box for loading a test object body An object body fixing device including a fixing unit for fixing the detection object body; and a transfer robot for transferring the detection object body in the storage box to the fixing unit, and the test model for measuring the transfer position includes : A model body, the same size as the object to be detected; a pinhole image measuring component, which can identify or photograph multiple guide pinholes formed in the fixed unit; a slot image measuring component, arranged in the storage The upper end of the model body in the slit of the box can be identified or photographed in a state where the model body is stored in the storage box, so that the slit of the storage box and the model can be measured at the upper end of the model body. The interval between the bodies; and a central processing unit, which can be transmitted to an image processing computer prepared in advance The information measured by the pinhole image measuring unit or the slit image measuring unit, and the precise transfer position measurement method using a test model for transfer position measurement, includes the following steps: (1) storing the The test model for transfer position measurement is placed on the transfer robot; step (2), the transfer robot in step (1) transfers the test model for transfer position measurement to the upper end of the fixed unit; step (3), for In the step (2) of the test model for measuring the transfer position transferred to the upper end of the fixed unit, the pinhole image measuring part recognizes or photographs the guide pinhole of the fixed unit; step (4), moves toward the center The processing unit transmits the image identified or captured in step (3); step (5), transmits the image transmitted to the central processing unit in step (4) to the image processing computer; and step (6), According to the image transmitted to the image processing computer in step (5), it is determined whether the test model for measuring the transfer position can be placed at a predetermined position of the fixed unit, and the movement can be grasped. Position measurement center is aligned with the guide pin holes accurately model with trials. The precise transfer position measurement method using the test model for transfer position measurement according to item 9 of the scope of the patent application, comprising: step (a), the transfer robot lifts up the transfer position measurement test stored in the storage box Step; (b), the slit image measuring part recognizes or photographs the model body of the test model for the transfer position measurement lifted in step (a), and the slit on the upper end of the model body; step ( c) transmitting the image identified or shot in step (b) to the central processing unit; step (d) transmitting the image transmitted to the central processing unit in step (c) to the image processing computer; and In step (e), the distance between the model body and the slit can be calculated from the image transmitted to the image processing computer in step (d), and the position of the model body can be measured, so that the available measurement can be accurately measured. The transfer robot securely removes the storage box from the outside or puts the storage box in the storage box at the position of the test model for measuring the transfer position.