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WO2018143189A9 - 層間熱接合部材、層間熱接合方法、層間熱接合部材の製造方法 - Google Patents

層間熱接合部材、層間熱接合方法、層間熱接合部材の製造方法 Download PDF

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Publication number
WO2018143189A9
WO2018143189A9 PCT/JP2018/002956 JP2018002956W WO2018143189A9 WO 2018143189 A9 WO2018143189 A9 WO 2018143189A9 JP 2018002956 W JP2018002956 W JP 2018002956W WO 2018143189 A9 WO2018143189 A9 WO 2018143189A9
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WIPO (PCT)
Prior art keywords
thermal
interface material
thermal interface
interface
production method
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Ceased
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PCT/JP2018/002956
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English (en)
French (fr)
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WO2018143189A1 (ja
Inventor
村上　睦明
篤 多々見
正満 立花
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Kaneka Corp
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Kaneka Corp
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Priority to US16/483,395 priority Critical patent/US20200024496A1/en
Priority to JP2018565559A priority patent/JP7181093B2/ja
Priority to CN201880009996.9A priority patent/CN110249424A/zh
Priority to EP18747717.9A priority patent/EP3579269A4/en
Publication of WO2018143189A1 publication Critical patent/WO2018143189A1/ja
Publication of WO2018143189A9 publication Critical patent/WO2018143189A9/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02—Materials undergoing a change of physical state when used
    • C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
    • C09K5/063—Materials absorbing or liberating heat during crystallisation; Heat storage materials
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/20—Graphite
    • C01B32/205—Preparation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02—Materials undergoing a change of physical state when used
    • C09K5/04—Materials undergoing a change of physical state when used the change of state being from liquid to vapour or vice versa
    • C09K5/048—Boiling liquids as heat transfer materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/10—Solid density
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/32—Thermal properties
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Thermal Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Wood Science & Technology (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Laminated Bodies (AREA)

Abstract

凹凸のある部材間で用いても優れた熱抵抗特性を示すようなグラファイトを用いた層間熱接合部材、および層間熱接合部材の製造方法を実現する。 柔軟性もしくは流動性物質（Ａ）とグラファイト膜（Ｂ）とからなる構成の熱接合部材とし、グラファイト膜の厚さを１００ｎｍ～１５μｍの範囲、密度を１．２０～２．２６ｇ／ｃｍ3の範囲、膜面方向の熱伝導率を５００Ｗ／ｍＫ以上とし、（Ａ）と（Ｂ）の重量比（Ａ／Ｂ）を０．０８～２５の範囲とする事で前記課題が解決する。
PCT/JP2018/002956 2017-02-02 2018-01-30 層間熱接合部材、層間熱接合方法、層間熱接合部材の製造方法 Ceased WO2018143189A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US16/483,395 US20200024496A1 (en) 2017-02-02 2018-01-30 Thermal interface material, method for thermally coupling with thermal interface material, and method for preparing thermal interface material
JP2018565559A JP7181093B2 (ja) 2017-02-02 2018-01-30 層間熱接合部材、層間熱接合方法、層間熱接合部材の製造方法
CN201880009996.9A CN110249424A (zh) 2017-02-02 2018-01-30 层间热接合构件、层间热接合方法、层间热接合构件的制造方法
EP18747717.9A EP3579269A4 (en) 2017-02-02 2018-01-30 THERMAL INTERFACE MATERIAL, THERMAL INTERFACE COUPLING PROCESS AND THERMAL INTERFACE MATERIAL PRODUCTION PROCESS

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017017696 2017-02-02
JP2017-017696 2017-02-02

Publications (2)

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WO2018143189A1 WO2018143189A1 (ja) 2018-08-09
WO2018143189A9 true WO2018143189A9 (ja) 2019-07-11

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PCT/JP2018/002956 Ceased WO2018143189A1 (ja) 2017-02-02 2018-01-30 層間熱接合部材、層間熱接合方法、層間熱接合部材の製造方法

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US (1) US20200024496A1 (ja)
EP (1) EP3579269A4 (ja)
JP (1) JP7181093B2 (ja)
CN (1) CN110249424A (ja)
WO (1) WO2018143189A1 (ja)

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US11615297B2 (en) 2017-04-04 2023-03-28 Hailo Technologies Ltd. Structured weight based sparsity in an artificial neural network compiler
US11238334B2 (en) 2017-04-04 2022-02-01 Hailo Technologies Ltd. System and method of input alignment for efficient vector operations in an artificial neural network
US12430543B2 (en) 2017-04-04 2025-09-30 Hailo Technologies Ltd. Structured sparsity guided training in an artificial neural network
US11544545B2 (en) 2017-04-04 2023-01-03 Hailo Technologies Ltd. Structured activation based sparsity in an artificial neural network
US11551028B2 (en) 2017-04-04 2023-01-10 Hailo Technologies Ltd. Structured weight based sparsity in an artificial neural network
US10387298B2 (en) 2017-04-04 2019-08-20 Hailo Technologies Ltd Artificial neural network incorporating emphasis and focus techniques
JP7324974B2 (ja) * 2018-06-28 2023-08-14 パナソニックＩｐマネジメント株式会社 電子装置およびその製造方法
US20200114622A1 (en) * 2018-10-10 2020-04-16 Nanotek Instruments, Inc. Process for highly conductive graphitic thick films
CN111211059B (zh) * 2018-11-22 2023-07-04 矽品精密工业股份有限公司 电子封装件及其制法与散热件
US11237894B1 (en) 2020-09-29 2022-02-01 Hailo Technologies Ltd. Layer control unit instruction addressing safety mechanism in an artificial neural network processor
US12248367B2 (en) 2020-09-29 2025-03-11 Hailo Technologies Ltd. Software defined redundant allocation safety mechanism in an artificial neural network processor
US11811421B2 (en) 2020-09-29 2023-11-07 Hailo Technologies Ltd. Weights safety mechanism in an artificial neural network processor
US11874900B2 (en) 2020-09-29 2024-01-16 Hailo Technologies Ltd. Cluster interlayer safety mechanism in an artificial neural network processor
US11221929B1 (en) 2020-09-29 2022-01-11 Hailo Technologies Ltd. Data stream fault detection mechanism in an artificial neural network processor
KR102565178B1 (ko) * 2020-11-12 2023-08-08 성균관대학교산학협력단 연성-강성-연성 다층 구조 열 계면 소재, 이의 제조 방법 및 이를 포함하는 방열 장치 또는 시스템
JPWO2022210419A1 (ja) * 2021-03-31 2022-10-06
CN114479757A (zh) * 2022-03-02 2022-05-13 深圳市美宝昕新材料有限公司 一种电子元件固定用的环保型硫化硅橡胶及其制备方法
CN114714687B (zh) * 2022-03-30 2023-09-29 安徽碳华新材料科技有限公司 一种不含卤素残留的石墨散热膜的制备方法
CN115895262B (zh) * 2022-05-19 2023-07-18 华中科技大学 一种竖直取向结构热界面材料及其制备方法

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Also Published As

Publication number Publication date
US20200024496A1 (en) 2020-01-23
WO2018143189A1 (ja) 2018-08-09
JPWO2018143189A1 (ja) 2019-11-21
CN110249424A (zh) 2019-09-17
EP3579269A1 (en) 2019-12-11
JP7181093B2 (ja) 2022-11-30
EP3579269A4 (en) 2020-11-18

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