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PH12017500284A1 - Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating - Google Patents

Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating

Info

Publication number
PH12017500284A1
PH12017500284A1 PH12017500284A PH12017500284A PH12017500284A1 PH 12017500284 A1 PH12017500284 A1 PH 12017500284A1 PH 12017500284 A PH12017500284 A PH 12017500284A PH 12017500284 A PH12017500284 A PH 12017500284A PH 12017500284 A1 PH12017500284 A1 PH 12017500284A1
Authority
PH
Philippines
Prior art keywords
protective coating
protective
coating
forming sheet
semiconductor chip
Prior art date
Application number
PH12017500284A
Other versions
PH12017500284B1 (en
Inventor
Daisuke Yamamoto
Naoya Saiki
Hiroyuki Yoneyama
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of PH12017500284A1 publication Critical patent/PH12017500284A1/en
Publication of PH12017500284B1 publication Critical patent/PH12017500284B1/en

Links

Classifications

    • H10P72/7402—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H10P54/00—
    • H10W74/01—
    • H10W72/073—

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laser Beam Processing (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Paints Or Removers (AREA)
  • Formation Of Insulating Films (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

A protective-coating-forming sheet (3) provided with a first support sheet (4) and a protective-coating formation film (1) layered on a first surface side of the first support sheet (4), the protective-coating formation film (1) comprising a curable material, and the protective-coating formation film (1) having the following characteristics: when the protective-coating formation film (1) is cured and a protective coating is obtained, the breaking strain of the protective coating at 50oC is 20 pcnt or less, and the breaking stress thereof at 50oC is 2.0x107 Pa or less.
PH12017500284A 2014-08-22 2017-02-16 Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating PH12017500284B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014169267 2014-08-22
JP2014169266 2014-08-22
PCT/JP2015/073545 WO2016027888A1 (en) 2014-08-22 2015-08-21 Protective-coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating

Publications (2)

Publication Number Publication Date
PH12017500284A1 true PH12017500284A1 (en) 2017-07-03
PH12017500284B1 PH12017500284B1 (en) 2019-11-06

Family

ID=55350823

Family Applications (2)

Application Number Title Priority Date Filing Date
PH12017500285A PH12017500285B1 (en) 2014-08-22 2017-02-16 Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating
PH12017500284A PH12017500284B1 (en) 2014-08-22 2017-02-16 Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PH12017500285A PH12017500285B1 (en) 2014-08-22 2017-02-16 Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating

Country Status (8)

Country Link
JP (2) JP6589209B2 (en)
KR (2) KR102376017B1 (en)
CN (2) CN106660333B (en)
MY (2) MY186759A (en)
PH (2) PH12017500285B1 (en)
SG (2) SG11201701272UA (en)
TW (4) TWI668290B (en)
WO (2) WO2016027883A1 (en)

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KR102625473B1 (en) * 2015-10-29 2024-01-15 린텍 가부시키가이샤 Film for forming a protective film and composite sheet for forming a protective film
JP6573841B2 (en) * 2016-03-04 2019-09-11 リンテック株式会社 Semiconductor processing sheet
JP6617056B2 (en) * 2016-03-04 2019-12-04 リンテック株式会社 Semiconductor processing sheet, winding body thereof, and method for manufacturing the winding body
SG11201805895XA (en) * 2016-03-04 2018-09-27 Lintec Corp Protective film-forming composite sheet
WO2017149808A1 (en) * 2016-03-04 2017-09-08 リンテック株式会社 Protective film-forming composite sheet
WO2017149926A1 (en) * 2016-03-04 2017-09-08 リンテック株式会社 Semiconductor processing sheet
WO2017149925A1 (en) * 2016-03-04 2017-09-08 リンテック株式会社 Semiconductor processing sheet
TWI721158B (en) * 2016-04-28 2021-03-11 日商琳得科股份有限公司 Protective film forming film and composite sheet for forming protective film
CN109071845B (en) * 2016-04-28 2024-08-09 琳得科株式会社 Film for forming protective film and composite sheet for forming protective film
TWI731964B (en) * 2016-04-28 2021-07-01 日商琳得科股份有限公司 Complex sheet for forming protective film
TWI796297B (en) * 2016-04-28 2023-03-21 日商琳得科股份有限公司 Composite sheet for forming protective film
TWI778960B (en) * 2016-04-28 2022-10-01 日商琳得科股份有限公司 Film for forming protective film, composite sheet for forming protective film, and method of manufacturing semiconductor chip having protective film
CN109328219B (en) * 2016-05-12 2020-04-28 住友电木株式会社 Adhesive tape for semiconductor substrate processing
JP6776081B2 (en) * 2016-09-28 2020-10-28 リンテック株式会社 Manufacturing method of semiconductor chip with protective film and manufacturing method of semiconductor device
WO2018212171A1 (en) * 2017-05-17 2018-11-22 リンテック株式会社 Semiconductor device and mehtod for producing same
CN111051455B (en) * 2017-08-28 2022-05-03 琳得科株式会社 Film-like transparent adhesive and infrared sensor module
JP7402052B2 (en) * 2018-01-24 2023-12-20 リンテック株式会社 Long laminated sheets and their rolls
KR102487552B1 (en) 2018-02-05 2023-01-11 삼성전자주식회사 Composition for protective film against sawing process and method of manufacturing semiconductor package using the composition
WO2019172439A1 (en) * 2018-03-09 2019-09-12 リンテック株式会社 Protective film-forming composite sheet and method for manufacturing semiconductor chip provided with protective film
WO2019182001A1 (en) * 2018-03-23 2019-09-26 リンテック株式会社 Film-like adhesive and sheet for semiconductor processing
WO2019187010A1 (en) * 2018-03-30 2019-10-03 リンテック株式会社 Composite sheet for protective film formation and method for producing same
CN111587472B (en) * 2018-03-30 2024-04-30 琳得科株式会社 Composite sheet for forming support sheet and protective film
CN112839767A (en) * 2019-02-26 2021-05-25 琳得科株式会社 Manufacturing method of workpiece with first protective film
KR102740654B1 (en) * 2019-02-26 2024-12-06 린텍 가부시키가이샤 Sheet for forming thermosetting resin film and first protective film
TWI839508B (en) * 2019-04-26 2024-04-21 日商琳得科股份有限公司 Method for manufacturing a third laminate, method for manufacturing a fourth laminate, method for manufacturing a semiconductor device with an inner surface protective film, and method for manufacturing a third laminate
JP7453879B2 (en) * 2020-08-12 2024-03-21 リンテック株式会社 Protective film forming sheet roll and protective film forming sheet roll manufacturing method
JP7484557B2 (en) * 2020-08-18 2024-05-16 三菱ケミカル株式会社 Adhesive composition, adhesive sheet and laminate
JP7084972B2 (en) * 2020-10-06 2022-06-15 リンテック株式会社 Composite sheet for forming a protective film
JP2025014782A (en) * 2023-07-19 2025-01-30 Ｔｏｗａ株式会社 Cutting method, method for manufacturing cut product, and cutting device

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CN100485902C (en) 2002-03-12 2009-05-06 浜松光子学株式会社 Substrate dividing method
JP3857953B2 (en) * 2002-05-16 2006-12-13 株式会社巴川製紙所 Adhesive sheet for semiconductor device manufacturing
TWI289155B (en) * 2002-04-03 2007-11-01 Tomoegawa Paper Co Ltd Adhesive sheet for producing semiconductor devices
JP4364508B2 (en) * 2002-12-27 2009-11-18 リンテック株式会社 Protective film forming sheet for chip back surface and manufacturing method of chip with protective film
KR101177251B1 (en) * 2003-06-06 2012-08-24 히다치 가세고교 가부시끼가이샤 Adhesive sheet, dicing tape integrated type, adhesive sheet, and semiconductor device producing method
WO2005004216A1 (en) * 2003-07-08 2005-01-13 Lintec Corporation Hardenable pressure sensitive adhesive sheet for dicing/die-bonding and method for manufacturing semiconductor device
JP4846406B2 (en) * 2006-03-28 2011-12-28 リンテック株式会社 Chip protection film forming sheet
EP2360013A4 (en) * 2008-11-27 2013-01-16 Mitsui Du Pont Polychemical PROTECTIVE FILM FOR ELECTRONIC COMPONENT, METHOD OF MANUFACTURING SAME, AND USE OF SAID PROTECTIVE FILM
JP5335483B2 (en) * 2009-02-27 2013-11-06 リンテック株式会社 Method for producing polarizing plate with adhesive layer
JP5603757B2 (en) * 2009-12-04 2014-10-08 リンテック株式会社 Laser dicing adhesive sheet and method for manufacturing semiconductor device
JP2011151362A (en) 2009-12-24 2011-08-04 Nitto Denko Corp Dicing tape-integrated film for semiconductor back surface
JP2012033637A (en) 2010-07-29 2012-02-16 Nitto Denko Corp Dicing tape integrated semiconductor rear face film, and method of manufacturing semiconductor device
JP5580701B2 (en) * 2010-09-13 2014-08-27 日東電工株式会社 Dicing die bond film
JP5449622B2 (en) * 2011-07-01 2014-03-19 古河電気工業株式会社 Adhesive film, dicing die bonding film, and semiconductor processing method using the same
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JP6001273B2 (en) * 2012-02-13 2016-10-05 信越化学工業株式会社 Protective film for semiconductor wafer and method for manufacturing semiconductor chip
TWI565591B (en) * 2012-05-14 2017-01-11 琳得科股份有限公司 A sheet having a subsequent resin layer, and a method for manufacturing the semiconductor device
JP6427791B2 (en) * 2012-11-30 2018-11-28 リンテック株式会社 Resin film forming sheet for chip and manufacturing method of semiconductor device
JP6554738B2 (en) * 2014-03-24 2019-08-07 リンテック株式会社 Protective film-forming film, protective film-forming sheet, workpiece or workpiece manufacturing method, inspection method, workpiece judged to be non-defective, and workpiece judged to be non-defective
SG11201606470RA (en) * 2014-03-24 2016-10-28 Lintec Corp Protective film forming film, protective film forming sheet and work product manufacturing method

Also Published As

Publication number Publication date
JPWO2016027883A1 (en) 2017-06-01
CN106660333B (en) 2018-11-06
KR20170044652A (en) 2017-04-25
MY182846A (en) 2021-02-05
CN106660332B (en) 2020-08-07
TWI668290B (en) 2019-08-11
PH12017500284B1 (en) 2019-11-06
PH12017500285B1 (en) 2021-04-16
TW201940622A (en) 2019-10-16
CN106660333A (en) 2017-05-10
KR102368140B1 (en) 2022-02-25
WO2016027888A1 (en) 2016-02-25
TW201938728A (en) 2019-10-01
KR20170044108A (en) 2017-04-24
PH12017500285A1 (en) 2017-06-28
JP6589209B2 (en) 2019-10-16
TWI712670B (en) 2020-12-11
TWI672354B (en) 2019-09-21
SG11201701270QA (en) 2017-03-30
TWI706023B (en) 2020-10-01
KR102376017B1 (en) 2022-03-17
JPWO2016027888A1 (en) 2017-06-01
CN106660332A (en) 2017-05-10
SG11201701272UA (en) 2017-04-27
MY186759A (en) 2021-08-18
TW201614024A (en) 2016-04-16
TW201614023A (en) 2016-04-16
WO2016027883A1 (en) 2016-02-25

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