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WO2018036883A8 - Optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements - Google Patents

Optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements Download PDF

Info

Publication number
WO2018036883A8
WO2018036883A8 PCT/EP2017/070780 EP2017070780W WO2018036883A8 WO 2018036883 A8 WO2018036883 A8 WO 2018036883A8 EP 2017070780 W EP2017070780 W EP 2017070780W WO 2018036883 A8 WO2018036883 A8 WO 2018036883A8
Authority
WO
WIPO (PCT)
Prior art keywords
optoelectronic component
producing
silicone
siloxane
alternation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2017/070780
Other languages
English (en)
French (fr)
Other versions
WO2018036883A1 (de
Inventor
Patrick WENDEROTH
Ulf BETKE
Guido KICKELBICK
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Priority to JP2019508194A priority Critical patent/JP2019528349A/ja
Priority to US16/328,680 priority patent/US10910531B2/en
Priority to DE112017004289.5T priority patent/DE112017004289A5/de
Publication of WO2018036883A1 publication Critical patent/WO2018036883A1/de
Publication of WO2018036883A8 publication Critical patent/WO2018036883A8/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

Die Erfindung betrifft ein optoelektronisches Bauelement (100), das zur Emission von Strahlung eingerichtet ist, aufweisend ein optisches Element (50), das ein Silikon als Polymermaterial umfasst, wobei das Silikon Wiederholeinheiten aus einem cyclischen Siloxan und einem linearen Siloxan aufweist, die abwechselnd angeordnet sind.
PCT/EP2017/070780 2016-08-26 2017-08-16 Optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements Ceased WO2018036883A1 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2019508194A JP2019528349A (ja) 2016-08-26 2017-08-16 光電子部品、および光電子部品を製造するための方法
US16/328,680 US10910531B2 (en) 2016-08-26 2017-08-16 Optoelectronic component and method for producing an optoelectronic component
DE112017004289.5T DE112017004289A5 (de) 2016-08-26 2017-08-16 Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016115907.7 2016-08-26
DE102016115907.7A DE102016115907A1 (de) 2016-08-26 2016-08-26 Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements

Publications (2)

Publication Number Publication Date
WO2018036883A1 WO2018036883A1 (de) 2018-03-01
WO2018036883A8 true WO2018036883A8 (de) 2018-06-14

Family

ID=59738310

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2017/070780 Ceased WO2018036883A1 (de) 2016-08-26 2017-08-16 Optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements

Country Status (4)

Country Link
US (1) US10910531B2 (de)
JP (1) JP2019528349A (de)
DE (2) DE102016115907A1 (de)
WO (1) WO2018036883A1 (de)

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19638667C2 (de) 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
US5978206A (en) 1997-09-30 1999-11-02 Hewlett-Packard Company Stacked-fringe integrated circuit capacitors
AU2001275302A1 (en) * 2000-06-06 2001-12-17 Board Of Trustees Of The University Of Illinois Cross-coupling reaction of organosilicon nucleophiles
US20020017652A1 (en) 2000-08-08 2002-02-14 Stefan Illek Semiconductor chip for optoelectronics
AU2003256433A1 (en) * 2002-08-16 2004-03-03 Joseph P. Kennedy Poly(cyclosiloxane) composiiton and method of synthesis thereof
JP4648099B2 (ja) * 2005-06-07 2011-03-09 信越化学工業株式会社 ダイボンディング用シリコーン樹脂組成物
WO2009119841A1 (ja) * 2008-03-28 2009-10-01 三菱化学株式会社 硬化性ポリシロキサン組成物、並びに、それを用いたポリシロキサン硬化物、光学部材、航空宇宙産業用部材、半導体発光装置、照明装置、及び画像表示装置
JP2010202801A (ja) * 2009-03-04 2010-09-16 Nitto Denko Corp 熱硬化性シリコーン樹脂用組成物
US9299896B2 (en) * 2010-01-25 2016-03-29 Lg Chem, Ltd. Curable composition
KR101805218B1 (ko) * 2010-02-19 2017-12-05 보드 오브 리전츠, 더 유니버시티 오브 텍사스 시스템 분지쇄형 실록산 및 합성 방법
CN102971383B (zh) * 2010-06-11 2014-11-12 株式会社艾迪科 含硅固化性组合物、该含硅固化性组合物的固化物及由该含硅固化性组合物形成的引线框基板
KR101432601B1 (ko) * 2010-07-29 2014-08-21 제일모직주식회사 변성 실록산 중합체 조성물, 상기 변성 실록산 중합체 조성물로부터 얻어진 봉지재 및 상기 봉지재를 포함하는 전자 소자
JP2012162704A (ja) * 2010-07-29 2012-08-30 Cheil Industries Inc 変性シロキサン重合体組成物、変性シロキサン重合体組成物から得られた封止材および封止材を含む電子デバイス
DE102010062244A1 (de) * 2010-12-01 2012-06-06 Evonik Goldschmidt Gmbh Verfahren zur Umsetzung von Hydroxy-Verbindungen mit linearen, verzweigten oder cyclischen Polyalkysiloxanen
US9169359B2 (en) * 2011-06-17 2015-10-27 Ndsu Research Foundation Functionalized silicones with polyalkylene oxide side chains
WO2013051600A1 (ja) * 2011-10-04 2013-04-11 株式会社カネカ 硬化性樹脂組成物、硬化性樹脂組成物タブレット、成形体、半導体のパッケージ、半導体部品及び発光ダイオード
DE102012104363A1 (de) * 2012-05-21 2013-11-21 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu dessen Herstellung
KR101518497B1 (ko) * 2012-06-12 2015-05-11 제일모직주식회사 복합시트, 그 제조방법 및 이를 포함하는 디스플레이 기판
US20150038220A1 (en) * 2013-05-31 2015-02-05 Yury Kuznetsov On-line picture/video voting

Also Published As

Publication number Publication date
US10910531B2 (en) 2021-02-02
JP2019528349A (ja) 2019-10-10
WO2018036883A1 (de) 2018-03-01
DE112017004289A5 (de) 2019-05-29
US20190207067A1 (en) 2019-07-04
DE102016115907A1 (de) 2018-03-01

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