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WO2018006855A1 - 激光切割装置 - Google Patents

激光切割装置 Download PDF

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Publication number
WO2018006855A1
WO2018006855A1 PCT/CN2017/092072 CN2017092072W WO2018006855A1 WO 2018006855 A1 WO2018006855 A1 WO 2018006855A1 CN 2017092072 W CN2017092072 W CN 2017092072W WO 2018006855 A1 WO2018006855 A1 WO 2018006855A1
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WO
WIPO (PCT)
Prior art keywords
pipe
laser cutting
suction
laser beam
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2017/092072
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English (en)
French (fr)
Inventor
朱海彬
李晓虎
王路
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to US15/580,892 priority Critical patent/US10702949B2/en
Publication of WO2018006855A1 publication Critical patent/WO2018006855A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/147—Features outside the nozzle for feeding the fluid stream towards the workpiece

Definitions

  • Embodiments of the present invention relate to the field of laser cutting and, more particularly, to a laser cutting apparatus.
  • the laser cutting process is used to divide the film product.
  • some flexible materials will escape in the form of vaporized soot. Some materials will be sprayed as smelting fly slag from the cutting line, causing a lot of pollution around the cutting line. Particles. If these contaminated particles are not removed in time, the surface of the film will be deposited immediately, causing large pieces on the surface of the film to be difficult to remove clean stains, which will cause serious defects in the subsequent fabrication process of thin film products (such as flexible OLED organic light emitting semiconductors). Impact, reducing production yield.
  • Embodiments of the present invention are directed to a laser cutting apparatus to solve at least one of the above technical problems.
  • a laser cutting device provided by an embodiment of the present invention includes: a main body, a main body for emitting a laser beam; a laser beam intersecting the material to be cut to form a cutting point; and a blowing pipe for blowing the air blowing port for blowing relative to the laser a slanted airflow, and the airflow can be aligned with the cutting point;
  • the suction port of the suction pipe is located downstream of the cutting point with respect to the flow direction of the air flow; the air blowing pipe and the air suction pipe are respectively attached to the main body through the adjusting mechanism, so that the positions of the air blowing pipe and the air suction pipe can be adjusted to adapt
  • the laser beam cuts the course of the change.
  • the gas blown by the blowing pipe is an inert gas.
  • suction port of the suction pipe is aligned with the cutting point.
  • the adjusting mechanism includes a turntable sleeved on an outer circumference of the main body, and the air blowing pipe and the air suction pipe are respectively connected to the turntable.
  • the air blowing pipe includes: a tilt pipe provided with a blow port, and an intake pipe connecting the inclined pipe and the turntable; the center line of the intake pipe is parallel to the laser beam.
  • the air suction pipe includes: an air suction cover provided with an air suction port, and an exhaust pipe connecting the air suction cover and the rotating disk; the center line of the exhaust pipe is parallel to the laser beam.
  • the laser cutting device further includes: a driving device for driving the rotation of the turntable, and a controller communicably connected to the driving device, wherein the controller is configured to control the driving device according to the preset laser beam cutting route.
  • the driving device includes: a reduction motor mounted to the turntable; a first gear mounted on the output shaft of the reduction motor; and a second gear mounted on the main body and meshingly engaged with the first gear.
  • an angle adjusting device is disposed between the inclined pipe and the intake pipe.
  • the cutting direction of the laser beam is opposite to the flow direction of the airflow blown by the air blowing tube.
  • a metal probe is disposed at the air blowing port of the air blowing pipe, and the metal probe is connected to the power source through the wire.
  • brackets are disposed at the air blowing port of the air blowing pipe, and the outer end of the bracket is mounted with a supporting sleeve, and the metal probe is disposed in the central hole of the supporting sleeve.
  • the absolute value of the gas pressure in the blow pipe is smaller than the absolute value of the gas pressure in the intake pipe.
  • the diameter of the air blowing port of the air blowing pipe is smaller than the diameter of the air inlet of the air suction pipe.
  • the outer circumference of the main body is provided with an annular groove; the adjusting mechanism comprises: sliding with the annular groove The first slider is matched, the blow pipe is connected with the first slider; the second slider is slidably engaged with the annular groove, and the suction pipe is connected with the second slider.
  • FIG. 1 is a perspective view showing the working state of a laser cutting device according to an embodiment of the present invention
  • Figure 2 is a schematic view showing an intake pipe and a tilt pipe in an embodiment of the present invention
  • Fig. 3 is a perspective view showing a metal probe and a tilt tube in an embodiment of the present invention.
  • FIG. 1 is a perspective view of a laser cutting apparatus according to an embodiment of the present invention.
  • the laser cutting device comprises a main body 1, a turntable 2, a blowing pipe, an air suction pipe and the like.
  • the laser cutting device is particularly suitable for cutting flexible film materials used in optoelectronics, display, semiconductor and other industries, and of course for cutting other materials.
  • the main body 1 is used to emit the laser beam 11.
  • the main body 1 is, for example, a focus lens outer cylinder, and a passage through which the laser beam 11 passes is usually provided inside the main body 1, and the center line of the passage can be considered to substantially coincide with the center line of the laser beam 11.
  • the laser beam 11 is vertically passed through the passage and intersects the cut flexible film material (hereinafter also referred to as the film 6), and the intersecting position forms a cutting point.
  • the turntable 2 (corresponding to the adjustment mechanism) is rotatably sleeved on the outer circumference of the main body 1.
  • the rotational axis of the turntable 2 is largely coincident with the center line of the laser beam 11.
  • the rotation of the turntable 2 can be manually controlled, or can be controlled by the mechanism to achieve automatic adjustment of the rotational position of the turntable 2.
  • the turntable 2 can be fixedly mounted to the main body 1 in an axial position, for example, under the action of an axial stop structure.
  • a blow tube having a blow port 30 is typically used to fluidly communicate with a source of high pressure gas.
  • a blow pipe is located on the left side of the laser beam 11, and is attached to the main body 1 by being mounted to the turntable 2.
  • the blowing port 30 of the blowing pipe blows a high-pressure airflow to a cutting point position located at the lower right side of the blowing port 30, that is, the airflow blown by the blowing port 30 of the blowing pipe is inclined with respect to the laser beam 11 and can be aligned with the cutting point.
  • the air blowing port 30 is equivalent to blowing air from the side to the cutting point, so that the smoke and the slag generated by the laser cutting process are quickly separated from the film material 6, and the film material 6 is quickly dissipated.
  • the air blowing pipe includes a tilt pipe 3 provided with a blow port 30, and an intake pipe 31 connecting the inclined pipe 3 and the turntable 2; the center line of the intake pipe 31 is parallel to the laser beam 11.
  • the inclined pipe 3, the intake pipe 31 and the high-pressure gas source are in fluid communication, and the high-pressure gas is introduced into the inclined pipe 3 by the intake pipe 31 and then blown out.
  • the air flow passage in the inclined tube 3 preferably has a truncated cone which gradually contracts in the direction of the air flow.
  • the air blowing tube may have other configurations as long as the airflow can be blown from the side of the laser beam 11 at the cutting point.
  • the suction duct having the suction port 40 is located on the right side of the laser beam 11, and is attached to the main body 1 by being attached to the turntable 2.
  • the suction port 40 of the intake pipe is located downstream of the cutting point with respect to the flow direction of the air flow blown by the blow pipe.
  • the suction pipe 4 is generally used for fluid communication with the negative pressure system, and is used for quickly sucking away the high-pressure gas blown by the blow pipe, the vaporized smoke generated by the cutting process, and the pulverized fly slag.
  • the cutting point area cools down and prevents the deposition of contaminating particles onto the membrane 6.
  • the blowing pipe and the suction pipe are arranged at substantially 180 degrees with respect to the circumferential direction of the turntable 2 such that the blowing pipe and the suction pipe are distributed substantially on opposite sides of the laser beam 11.
  • the suction tube and its suction port 40 can take any suitable configuration, and a preferred configuration of the suction tube is shown in this embodiment.
  • the suction pipe includes: a suction hood 4 provided with an intake port 40, and an exhaust pipe 41 connecting the suction hood 4 and the turntable 2; a center line of the exhaust pipe 41 and a laser
  • the bundles 11 are parallel. It can be understood that the suction hood 4, the exhaust pipe 41 and the negative pressure system are in fluid communication, and the gas and pollutant particles sucked by the suction hood 4 are discharged into the negative pressure system through the exhaust pipe 41.
  • the air flow passage in the suction hood 4 preferably tapers in the direction of the air flow.
  • the shape of the suction port 40 can be To take a square shape (as shown in Figure 1), a circle or other geometric shape. It can be understood that the configuration of the air blowing pipe and the air suction pipe provided by the embodiment is advantageous for compactness of the overall structure of the laser cutting device.
  • the blowing airflow formed between the air blowing pipe and the air suction pipe disposed on opposite sides of the laser beam 11 can always be adapted.
  • the change of the laser beam cutting route is such that the projection of the flow direction of the blowing airflow on the film 6 is as large as possible with the linear cutting line S on the film 6, and the cutting process is generated by the blowing airflow.
  • the forced guiding action of the vaporized soot and the smelting fly slag enables the gasified soot and the smelting fly slag to be introduced into the suction port 40 of the suction pipe along the cutting line S, thereby effectively reducing the pollution particles generated by the cutting process.
  • the membrane 6 cuts the contamination on both sides of the line S.
  • the air blowing port is generally disposed coaxially with the laser beam, the air inlet port is arranged around the cutting point, and the blowing airflow formed between the air blowing port and the air inlet port is radiated outwardly around the laser beam.
  • This causes the circular contaminant strip around the cutting point to appear on the film 6, which causes the two sides of the cutting line of the film 6 to be easily contaminated by the contaminating particles carried by the blowing airflow, and the laser provided by the embodiment
  • the cutting device can effectively prevent the above-mentioned circular contamination zone from appearing on the film 6. It will be appreciated that the laser cutting apparatus of the present embodiment is particularly useful for cutting film products having straight cut edges.
  • the air blowing pipe is disposed such that the blowing airflow is blown from the side of the laser beam 11 toward the cutting point, and the airflow blown by the air blowing pipe in the current laser cutting device is blown coaxially with the laser beam.
  • the phenomenon of dent deformation and detachment from the focus caused by the vertical force can be reduced, and the film 6 can be smoothly cut, thereby ensuring the cutting effect of the film 6.
  • the gas of the high-pressure gas source is an inert gas, so that the gas blown by the blow pipe is an inert gas, and the blow point of the blow pipe is aligned with the cutting point, so that the cutting point can be made.
  • the membrane 6 at the location is substantially in an oxygen-free environment isolated from oxygen, which can reduce the slag generated by the polymer film material during cutting from the root.
  • the inert gas can be selected A gas that is flammable or non-combustible, and preferably the gas density of the inert gas is greater than the gas density of the air.
  • the suction port 40 of the suction pipe is also substantially aligned with the cutting point.
  • the absolute value of the gas pressure flowing in the blowing pipe can be made smaller than the absolute value of the gas pressure flowing in the suction pipe (the gas in the suction pipe)
  • the air pressure is a negative pressure
  • the diameter of the suction port 40 can be made much larger than the diameter of the air blowing port 30.
  • the gas pressure in the blow pipe and the gas pressure in the suction pipe are adjustable to suit different cutting requirements.
  • the suction port is generally far away from the cutting point, and the suction effect of the vaporized soot is poor, and the vaporized soot is easily removed due to the timely removal. It falls on the film 6.
  • the suction pipe by arranging the suction pipe on the side of the laser beam 11 and aligning the suction port 40 of the suction pipe with the cutting point, the distance between the suction port 40 of the suction pipe and the cutting point can be minimized (for example)
  • the suction port 40 of the suction pipe is located at a position downstream of the airflow close to the cutting point, so that the vaporized soot can be quickly sucked into the intake pipe in a direction close to the horizontal direction, thereby significantly increasing the suction of the vaporized soot.
  • the contamination marks caused by the deposition of vaporized soot on both sides of the cutting line of the film 6 can be greatly reduced.
  • the rotation of the turntable 2 is preferably driven by a driving device, and the driving device is communicably connected with the controller, and the controller is configured to control the driving device according to the preset laser beam cutting route, so that the cutting path can be cut according to the laser beam at any time.
  • the rotation angle of the turntable 2 is automatically adjusted (for example, the laser beam cutting path is rectangular) so that the blowing airflow can always coincide with the cutting line S, and the blowing airflow is prevented from intersecting the cutting line S as much as possible.
  • the rotation range of the turntable 2 can be set to 0-360°, and when the cutting is completed, the turntable 2 can be controlled to automatically return to the initial angle to prepare for the next cutting.
  • a preferred embodiment of the driving device is further provided in the embodiment, the driving device comprising a reduction motor mounted on the turntable 2, a first gear mounted on the output shaft of the reduction motor, and mounted on the main body 1 and The first gear meshes with the second gear that is mated, wherein the second gear can be, for example, an outer ring gear that is sleeved on the outer circumference of the body 1.
  • the controller controls the starting and reverse rotation of the geared motor, and then the meshing of the first gear and the second gear With the cooperation, the automatic adjustment of the rotational position of the turntable 2 can be achieved.
  • an angle adjusting device is disposed between the inclined tube 3 and the intake pipe 31, so that the inclination angle of the inclined tube 3 can be adjusted, so that even if the distance of the main body 1 with respect to the film 6 is changed, the inclined tube 3 can always Align the cutting point.
  • the angle adjusting means may adopt a known structure such that the inclined tube 3 is preferably adjustable between a first position perpendicular to the laser beam 11 and a second position parallel to the laser beam 11. In Fig. 2, a positional state of the inclined tube 3 is shown by a solid line, and another positional state of the inclined tube 3 is shown by a broken line.
  • the cutting direction F of the laser beam is opposite to the flow direction of the airflow blown by the air blowing pipe, that is, the blowing port 30 of the blowing pipe is in the uncut region of the film 6, and the suction port 40 of the suction pipe is in the film.
  • the cut area of the material 6 can avoid the deposition of contaminating particles on the predetermined cutting line of the uncut area of the film 6, resulting in uneven material thickness at the predetermined cutting line of the uncut area of the film 6, affecting the cutting The problem of the effect.
  • a metal probe 5 may be disposed at the air blowing port 30 of the air blowing pipe, and the metal probe 5 is connected to the power source through the wire 51 for generating ion wind by discharge, thereby eliminating static electricity during laser cutting.
  • the preferred mounting structure of the metal probe 5 is as shown in FIG. 3.
  • a plurality of outwardly extending brackets 71 are provided at the air blowing port 30 of the air blowing pipe, and the outer end of the bracket 71 is provided with a supporting sleeve for supporting the metal probe 5. 72, the metal probe 5 passes through the central hole of the support sleeve 72.
  • an air blowing pipe and an air suction pipe are disposed on the turntable 2, and the air blowing pipe and the air suction pipe are distributed on opposite sides of the laser beam 11 to achieve side blowing side suction of the cutting point.
  • the driving device and the controller automatically adjust the rotation angle of the turntable 2 according to the laser beam cutting route, so that the blowing inert gas protection action of the blowing pipe and the smoking dust action of the suction pipe can always be performed along the cutting line S, so that Under the forced guiding action of the blowing and suction airflow, the high temperature gasification soot and the smelting fly slag generally flow along the cutting line, and preferably the cut area behind the cutting point is promptly sucked out.
  • the inert shielding gas is blown from the blowing pipe to the cutting point, which can block the oxygen at the cutting point, can reduce the splashing and slag generated by the rapid exothermic heat of the film 6 due to oxidation or even burning, and can reduce the vertical exposure of the film 6
  • the phenomenon of deformation and defocusing It has been experimentally proved that the laser cutting device provided by the preferred embodiment of the present invention not only has a good cutting effect, but also significantly improves the problem of contamination on both sides of the film cutting line, compared with the current laser cutting device.
  • the air blowing pipe and the air suction pipe are respectively attached to the main body 1 through the turntable 2, and the position of the air blowing pipe and the air suction pipe can be changed by rotating the turntable 2 to make the air blowing.
  • the airflow can always adapt to the change of the laser beam cutting route, and reduce the phenomenon that the pollution particles generated during the cutting process spread to the two sides of the cutting line.
  • other adjustment mechanisms can be used to change the position of the air blowing pipe and the air suction pipe on the main body 1 so as to achieve the same total blowing energy between the air blowing pipe and the air suction pipe. Adapt to the effects of changes in the laser beam cutting path.
  • an annular groove may be disposed on an outer circumference of the main body 1, and the adjustment mechanism includes a first slider and a second slider slidably engaged with the annular groove, wherein the air blowing pipe and the first A slider is connected, and the suction pipe is connected to the second slider.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

一种激光切割装置，包括：主体（1），主体（1）用于发射出激光束（11）；激光束（11）与被切割材料相交的位置形成切割点；吹气管，吹气管的吹气口（30）用于吹出相对于激光束（11）倾斜的气流，且气流能够对准切割点；吸气管，吸气管的吸气口（40）相对于气流的流动方向位于切割点的下游；吹气管和吸气管分别通过调整机构附接至主体（1）上，使得吹气管和吸气管的位置能够调整以适应激光束（11）切割路线的变化。该激光切割装置既能保证切割效果又能有效降低膜材（6）切割线两侧区域污染情况，尤其适用于切割柔性薄膜材料（6）。

Description

激光切割装置
本申请要求于2016年7月8日递交的中国专利申请第201610537743.1号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本发明的实施例涉及激光切割领域，更具体地，涉及一种激光切割装置。
背景技术
薄膜产品在制作后一般需要进行分割处理才会得到所需的后续产品，目前多采用激光切割加工方法对薄膜产品进行分割。柔性薄膜材料(以下也简称膜材)在激光切割过程中，部分材料会以气化烟尘的形式逸出，部分材料会作为燃熔飞渣从切割线迸溅喷出，造成切割线周边产生大量污染颗粒。这些污染颗粒若不及时除去，遇到膜材表面就会即刻沉积，在膜材表面造成大片难以去除干净的污染斑痕，从而对薄膜产品(例如柔性OLED有机发光半导体)的后续制作工艺产生严重不良影响，降低生产良率。
因此，对于应用于光电子、显示、半导体等行业的柔性薄膜材料而言，亟需一种在激光切割过程中，既能保证切割效果又能有效降低膜材切割线两侧区域的污染情况的激光切割除尘净化装置。
发明内容
本发明的实施例旨在提供一种激光切割装置，以解决上述技术问题中的至少一个。
本发明的实施例提供的激光切割装置，包括：主体，主体用于发射出激光束；激光束与被切割材料相交的位置形成切割点；吹气管，吹气管的吹气口用于吹出相对于激光束倾斜的气流，且气流能够对准切割点；吸气 管，吸气管的吸气口相对于气流的流动方向位于切割点的下游；吹气管和吸气管分别通过调整机构附接至主体上，使得吹气管和吸气管的位置能够调整以适应激光束切割路线的变化。
进一步地，由吹气管吹出的气体为惰性气体。
进一步地，吸气管的吸气口对准切割点。
进一步地，调整机构包括套设在主体的外周上的转盘，吹气管和吸气管分别与转盘连接。
进一步地，吹气管包括：配置有吹气口的斜管，和将斜管与转盘连接在一起的进气管；进气管的中心线与激光束相平行。
进一步地，吸气管包括：配置有吸气口的吸气罩，和将吸气罩与转盘连接在一起的排气管；排气管的中心线与激光束相平行。
进一步地，该激光切割装置还包括：用于驱动转盘转动的驱动装置，以及与驱动装置通信连接的控制器，控制器用于根据预设的激光束切割路线控制驱动装置动作。
进一步地，驱动装置包括：安装至转盘上的减速电机；安装在减速电机的输出轴上的第一齿轮；安装在主体上并与第一齿轮啮合配合的第二齿轮。
进一步地，斜管与进气管之间设置有角度调节装置。
进一步地，激光束的切割运动方向与吹气管吹出的气流的流动方向相反。
进一步地，吹气管的吹气口处设置金属探针，金属探针通过导线与电源连接。
进一步地，吹气管的吹气口处设置有多个向外伸出的支架，支架的外端安装有支撑套，金属探针穿设在支撑套的中心孔中。
进一步地，吹气管内的气体气压的绝对值小于吸气管内的气体气压的绝对值。
进一步地，吹气管的吹气口的口径小于吸气管的吸气口的口径。
进一步地，主体的外周配置有环形槽；调整机构包括：与环形槽滑动 配合的第一滑块，吹气管与第一滑块连接；与环形槽滑动配合的第二滑块，吸气管与第二滑块连接。
附图说明
下文将参考附图进一步描述本发明的实施例的技术方案。明显地，以下附图中的结构示意图不一定按比例绘制，而是以简化形式呈现各特征。而且，下面描述中的附图仅仅涉及本发明的一些实施例，而并非对本发明进行限制。
图1示出了本发明的实施例提供的一种激光切割装置工作状态的立体示意图；
图2示出了本发明的实施例中进气管和斜管的示意图；以及，
图3示出了本发明的实施例中金属探针和斜管的立体示意图。
具体实施方式
图1示出了本发明的实施例提供的激光切割装置的立体示意图。该激光切割装置包括主体1、转盘2、吹气管、吸气管等组件。该激光切割装置尤其适用于切割应用于光电子、显示、半导体等行业的柔性薄膜材料，当然也可以用于切割其他材料。
具体地，主体1用于发射出激光束11。主体1例如为聚焦透镜外筒，通常在主体1的内部设置有供激光束11穿出的通道，该通道的中心线可以认为与激光束11的中心线基本重合。参见图1，激光束11竖直地从通道穿出后与被切割的柔性薄膜材料(以下也简称膜材6)相交，该相交的位置形成切割点。
转盘2(相当于调整机构)能够转动地套设于主体1的外周上，结合图1可以理解，转盘2的转动轴线与激光束11的中心线大体重合。转盘2的转动可以是手动控制，也可以是通过机构控制以实现转盘2转动位置的自动调节。转盘2例如可以在轴向限位结构的作用下，轴向位置固定地安装于主体1上。
具有吹气口30的吹气管通常用于和高压气体源流体地相通。参见图1，吹气管位于激光束11的左侧，并通过安装到转盘2上的方式附接至主体1上。吹气管的吹气口30向位于吹气口30右下方的切割点位置吹出高压气流，也即，吹气管的吹气口30吹出的气流相对于激光束11倾斜并能够对准切割点。本领域技术人员可以理解，吹气口30相当于从侧面向切割点吹气，以使激光切割过程产生的烟尘和燃熔飞渣快速脱离膜材6，并使膜材6迅速散热。
本实施例中示出了吹气管的一种优选构型。如图1所示，吹气管包括：配置有吹气口30的斜管3，和将斜管3与转盘2连接在一起的进气管31；进气管31的中心线与激光束11相平行。可以理解，斜管3、进气管31和高压气体源流体地相通，高压气体由进气管31导入斜管3后吹出。斜管3内的气流通道优选地沿气流方向呈逐渐收缩的截锥形。当然，在其他实施例中，吹气管还可以具有其他的构型，只要能够从激光束11的侧面对准切割点吹出气流即可。
再来参见图1，具有吸气口40的吸气管位于激光束11的右侧，并通过安装到转盘2上的方式附接至主体1上。吸气管的吸气口40相对于由吹气管吹出的气流的流动方向而言，位于切割点的下游。可以理解，吸气管4通常用于和负压系统流体地连通，用于快速将吹气管吹出的高压气体、切割过程产生的气化烟尘和燃熔飞渣等污染颗粒吸走，起到对切割点区域降温和避免污染颗粒沉积到膜材6上的作用。可以理解，吹气管与吸气管相对于转盘2的周向大体间隔180度地布置，使吹气管和吸气管大体分布于激光束11的相对两侧。
吸气管及其吸气口40可以采用任何合适的构型，本实施例中示出了吸气管的一种优选构型。如图1所示，吸气管包括：配置有吸气口40的吸气罩4，和将吸气罩4与转盘2连接在一起的排气管41；排气管41的中心线与激光束11相平行。可以理解，吸气罩4、排气管41和负压系统流体地连通，吸气罩4吸入的气体和污染颗粒通过排气管41排入负压系统。吸气罩4内的气流通道优选地沿气流方向逐渐收缩。吸气口40的形状可 以采用方形(如图1所示出的)、圆形或其他几何形状。可以理解，采用本实施例提供的吹气管和吸气管的构型，有利于该激光切割装置整体结构的紧凑。
本实施例提供的激光切割装置在切割膜材6时，通过转动转盘2，可以使布置于激光束11的相对两侧的吹气管和吸气管之间所形成的吹吸气流总能适应激光束切割路线的变化，使吹吸气流的流动方向在膜材6上的投影尽量与膜材6上的直线型切割线S有大体重合的部分，利用吹吸气流对切割过程产生的气化烟尘及燃熔飞渣的强制导向作用，使得气化烟尘及燃熔飞渣能够沿着切割线S导入到吸气管的吸气口40内，有效减少了切割过程产生的污染颗粒对膜材6切割线S两侧区域的污染。而目前的激光切割装置因吹气口普遍与激光束同轴地设置，吸气口绕切割点布置一圈，吹气口和吸气口之间形成的吹吸气流以激光束为中心向外辐射，这会导致膜材6上呈现以切割点为中心的圆形污染带，导致膜材6的切割线两侧区域容易被吹吸气流所携带的污染颗粒污染，而本实施例提供的激光切割装置则可以有效避免膜材6上出现上述的圆形污染带。可以理解，本实施例的激光切割装置尤其适用于切割出具有直线型切割边缘的薄膜产品。
另外，本实施例中将吹气管配置成使吹出气流从激光束11的侧面吹向切割点的构型，相对于目前的激光切割装置中吹气管吹出的气流与激光束同轴地吹向切割点的构型来说，可以减少膜材6因垂直受力所造成的凹陷变形、脱离焦点的现象，能够保证膜材6被顺利切割，进而保证膜材6的切割效果。
目前的激光切割装置普遍在空气环境下切割材料，切割时，高分子薄膜材料容易因氧气的作用发生氧化甚至燃烧，导致急剧放热，这会大幅加剧燃熔飞渣的产生，造成切割线S周边产生大量污染颗粒。为改善这一现象，本实施例中优选地，高压气体源的气体为惰性气体，使得吹气管吹出的气体为惰性气体，又因吹气管的吹气口30对准切割点，这样能够使切割点处的膜材6基本处于与氧气隔离的无氧环境，这样能从根源上减少高分子薄膜材料在切割时产生的燃熔飞渣。优选地，惰性气体可以选择不可 燃或不助燃的气体，且优选地惰性气体的气体密度大于空气的气体密度。
为使吹吸气流携带的因切割产生的污染颗粒尽快且少障碍地进入到吸气管内，优选地，如图1所示，吸气管的吸气口40也基本对准切割点。另外，为取得更好的吸除效果以降低膜材6上的污染，一方面可以使吹气管内流动的气体气压的绝对值小于吸气管内流动的气体气压的绝对值(吸气管内的气体气压为负压)，另一方面可以使吸气口40的口径远大于吹气口30的口径。另外，吹气管内的气体气压和吸气管内的气体气压均可调，以便适应不同的切割要求。
另外，目前的激光切割装置中的上吸式集尘罩因为结构的限制，吸气口普遍距离切割点较远，对于气化烟尘的吸除效果较差，气化烟尘容易因未及时吸除而落在膜材6上。本实施例通过将吸气管布置于激光束11的侧面，使吸气管的吸气口40对准切割点，可以尽量降低吸气管的吸气口40与切割点之间的距离(例如使吸气管的吸气口40处于紧挨着切割点的气流下游位置)，使得气化烟尘能以接近于水平方向地快速吸入到吸气管中，从而显著地提升了气化烟尘的吸除效果，能够大幅减少因气化烟尘沉积在膜材6切割线两侧区域所造成的污染斑痕。
此外，本实施例中转盘2的转动优选地由驱动装置驱动，驱动装置与控制器通信连接，控制器用于根据预设的激光束切割路线控制驱动装置动作，这样可以实现随时根据激光束切割路线(例如激光束切割路线呈矩形)的改变而自动调整转盘2的转动角度，使得吹吸气流总能自动与切割线S一致，尽量避免吹吸气流与切割线S交叉。优选地，转盘2的转动范围可以设置为0‐360°，当在完成一次切割后还可以控制转盘2自动转回到初始角度，以便为下一次切割做准备。
本实施例中还提供了驱动装置的一种优选实施方式，该驱动装置包括安装至转盘2上的减速电机，安装在减速电机的输出轴上的第一齿轮，以及安装于主体1上并与第一齿轮啮合配合的第二齿轮，其中，该第二齿轮例如可以是套设在主体1外周上的外齿圈。激光切割过程中，通过控制器控制减速电机的启动以及正反转动作，再通过第一齿轮和第二齿轮的啮合 配合，可以实现转盘2的转动位置的自动调节。
优选地，在斜管3与进气管31之间设置有角度调节装置，使得斜管3的倾斜角度可以调整，这样，即便主体1相对于膜材6的距离发生变化，斜管3也总能对准切割点。该角度调节装置可以采用已知结构，使得斜管3优选地可以在与激光束11相垂直的第一位置和与激光束11相平行的第二位置之间进行调整。图2中通过实线示出了斜管3的一种位置状态，通过虚线示出了斜管3的另一种位置状态。
优选地，激光束的切割运动方向F与吹气管吹出的气流的流动方向相反，也即，使吹气管的吹气口30处于膜材6的未切割区域，吸气管的吸气口40处于膜材6的已切割区域，这样可以避免因污染颗粒沉积在膜材6的未切割区域的预设切割线上，造成膜材6未切割区域的预设切割线处的材料厚度不均，影响切割效果的问题。
另外，还可以在吹气管的吹气口30处设置金属探针5，金属探针5通过导线51与电源连接，用于通过放电产生离子风，消除激光切割过程中的静电。金属探针5的优选安装结构如图3所示，在吹气管的吹气口30处设置有多个向外伸出的支架71，支架71的外端安装有用于支承金属探针5的支撑套72，金属探针5从支撑套72的中心孔穿过。
综上，本发明的优选实施例的方案，在转盘2上设置一个吹气管和一个吸气管，吹气管和吸气管分布于激光束11相对的两侧实现对切割点的侧吹侧吸，并由驱动装置和控制器根据激光束切割路线来自动调节转盘2的旋转角度，使吹气管的吹惰性保护气动作与吸气管的吸烟尘动作总能沿切割线S进行，这样，在吹吸气流的强制导向作用下，高温气化烟尘及燃熔飞渣大体沿着切割线流动，并优选地在切割点后方的已切割区域被及时吸除。另外，由吹气管向切割点吹出惰性保护气，可以阻隔切割点处的氧气，可以减少膜材6因氧化甚至燃烧导致急剧放热后产生的迸溅飞渣，并能够降低膜材6因垂直受力而变形离焦的现象。经过实验证明，本发明的优选实施例提供的激光切割装置，相对于目前的激光切割装置而言，不仅切割效果好，还显著改善了膜材切割线两侧区域被污染的问题。
需要说明的是，本发明的上述实施例中，吹气管和吸气管分别通过转盘2附接到主体1上，通过转动转盘2可以实现吹气管、吸气管位置的改变，以使吹吸气流总能适应激光束切割路线的变化，降低切割过程中产生的污染颗粒向切割线两侧区域扩散的现象。可以理解，在其他实施例中，还可以采用其他的调整机构来改变吹气管和吸气管在主体1上的位置，以同样达到使吹气管和吸气管之间的吹吸气流总能适应激光束切割路线的变化的效果。例如，在一种未示出的实施例中，可以在主体1的外周配置有环形槽，调整机构包括与该环形槽滑动配合的第一滑块和第二滑块，其中，吹气管与第一滑块连接，吸气管与第二滑块连接。通过调整第一滑块和第二滑块在环形槽内的位置，可以使吹气管和吸气管的位置发生变化，使得吹吸气流适应激光束切割线的变化。
以上仅为本发明的优选实施例，并不用于限制本发明，对本领域的技术人员而言，可以在不偏离本发明的范围的情况下对本发明的装置做出多种改良和变型。本领域的技术人员通过考虑本说明书中公开的内容也可得到其它实施例。本说明书和示例仅应被视为示例性的，本发明的真实范围由所附权利要求以及等同方案限定。

Claims (15)

  1. 一种激光切割装置，包括：
    主体(1)，所述主体(1)用于发射出激光束(11)；激光束(11)与被切割材料相交的位置形成切割点；
    吹气管，所述吹气管的吹气口(30)用于吹出相对于所述激光束(11)倾斜的气流，且所述气流能够对准所述切割点；
    吸气管，所述吸气管的吸气口(40)相对于所述气流的流动方向位于所述切割点的下游；
    所述吹气管和所述吸气管分别通过调整机构附接至所述主体(1)上，使得所述吹气管和所述吸气管的位置能够调整以适应激光束切割路线的变化。
  2. 根据权利要求1所述的激光切割装置，其中，由所述吹气管吹出的气体为惰性气体。
  3. 根据权利要求1所述的激光切割装置，其中，所述吸气管的吸气口(40)对准所述切割点。
  4. 根据权利要求1所述的激光切割装置，其中，所述调整机构包括套设在所述主体(1)的外周上的转盘(2)，所述吹气管和所述吸气管分别与所述转盘(2)连接。
  5. 根据权利要求4所述的激光切割装置，其中，所述吹气管包括：配置有所述吹气口(30)的斜管(3)，和将所述斜管(3)与所述转盘(2)连接在一起的进气管(31)；所述进气管(31)的中心线与所述激光束(11)相平行。
  6. 根据权利要求5所述的激光切割装置，其中，所述吸气管包括：配置有所述吸气口(40)的吸气罩(4)，和将所述吸气罩(4)与所述转盘(2)连接在一起的排气管(41)；所述排气管(41)的中心线与所述激光束(11)相平行。
  7. 根据权利要求4所述的激光切割装置，其中，该激光切割装置还包括：用于驱动所述转盘(2)转动的驱动装置，以及与所述驱动装置通信 连接的控制器，所述控制器用于根据预设的激光束切割路线控制驱动装置动作。
  8. 根据权利要求7所述的激光切割装置，其中，所述驱动装置包括：安装至所述转盘(2)上的减速电机；安装在所述减速电机的输出轴上的第一齿轮；安装在所述主体(1)上并与所述第一齿轮啮合配合的第二齿轮。
  9. 根据权利要求5所述的激光切割装置，其中，所述斜管(3)与所述进气管(31)之间设置有角度调节装置。
  10. 根据权利要求1所述的激光切割装置，其中，所述激光束(11)的切割运动方向(F)与所述吹气管吹出的气流的流动方向相反。
  11. 根据权利要求1所述的激光切割装置，其中，所述吹气管的吹气口(30)处设置金属探针(5)，所述金属探针(5)通过导线(51)与电源连接。
  12. 根据权利要求11所述的激光切割装置，其中，所述吹气管的吹气口(30)处设置有多个向外伸出的支架(71)，所述支架(71)的外端安装有支撑套(72)，所述金属探针(5)穿设在所述支撑套(72)的中心孔中。
  13. 根据权利要求1所述的激光切割装置，其中，所述吹气管内的气体气压的绝对值小于所述吸气管内的气体气压的绝对值。
  14. 根据权利要求1所述的激光切割装置，其中，所述吹气管的吹气口(30)的口径小于所述吸气管的吸气口(40)的口径。
  15. 根据权利要求1所述的激光切割装置，其中，
    所述主体(1)的外周配置有环形槽；
    所述调整机构包括：与所述环形槽滑动配合的第一滑块，所述吹气管与所述第一滑块连接；与所述环形槽滑动配合的第二滑块，所述吸气管与所述第二滑块连接。
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