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WO2018069068A1 - Dispositif capteur de pression micromécanique et procédé de fabrication correspondant - Google Patents

Dispositif capteur de pression micromécanique et procédé de fabrication correspondant Download PDF

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Publication number
WO2018069068A1
WO2018069068A1 PCT/EP2017/074831 EP2017074831W WO2018069068A1 WO 2018069068 A1 WO2018069068 A1 WO 2018069068A1 EP 2017074831 W EP2017074831 W EP 2017074831W WO 2018069068 A1 WO2018069068 A1 WO 2018069068A1
Authority
WO
WIPO (PCT)
Prior art keywords
micromechanical
pressure sensor
sensor device
circuit carrier
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2017/074831
Other languages
German (de)
English (en)
Inventor
Andreas Kugler
Alexander Lux
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to CN201780063438.6A priority Critical patent/CN109843789A/zh
Priority to EP17778255.4A priority patent/EP3526159A1/fr
Publication of WO2018069068A1 publication Critical patent/WO2018069068A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G01L9/0048—Details about the mounting of the diaphragm to its support or about the diaphragm edges, e.g. notches, round shapes for stress relief
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0154—Moulding a cap over the MEMS device

Definitions

  • the present invention relates to a micromechanical
  • micromechanical pressure sensor device The micromechanical pressure sensor device.
  • Low-pressure sensors are typically used as components in molded, molded and / or molded plastic parts as Aufsteck- or
  • Pressure sensor module for screw-on metal threaded pieces, costly soldered, bonded and / or welded.
  • Pressure sensors continue to face increasing miniaturization, increasing the requirements for vertical integration.
  • the document WO 03/005784 relates to printed conductor structures on an electrically nonconducting carrier material, which consist of metal nuclei and a subsequently applied to this metallization. It is thus desirable, in particular, to provide circuit carriers on which, in particular, components of a micromechanical
  • Pressure sensor device in particular in the vertical direction can be easily arranged to each other.
  • the invention provides a micromechanical pressure sensor device according to claim 1 and a corresponding manufacturing method according to claim 9.
  • the idea underlying the present invention is in particular to provide a circuit carrier for a micromechanical component, which is designed to be flexible.
  • the circuit carrier allows in particular by its flexibility both a circuit, in particular an integrated circuit, with a three-dimensional structure of a micromechanical
  • micromechanical pressure sensor device through a hardened
  • Spray mass can be a reliability of micromechanical
  • Pressure sensor device can be improved. This results
  • the micromechanical pressure sensor device described here can, in particular, have a small installation volume due to an integrated construction.
  • further sensor elements in particular additional temperature sensors, can be easily integrated or plugged into the micromechanical pressure sensor devices in a simple manner.
  • the micromechanical pressure sensor device in this case comprises a
  • Micromechanical component is arranged on a mounting surface of the circuit substrate and is formed on the micromechanical component at least one pressure-sensitive bending structure or membrane.
  • micromechanical component described here may be any micromechanical component.
  • a low pressure sensor in particular, a low pressure sensor, medium pressure sensor or a
  • one or more contact connections and / or plug connections for a number of micromechanical components can be provided on the circuit carrier, whereby a space-saving arrangement of the micromechanical components is possible.
  • number is understood in the present
  • the microelectronic component and / or the circuit carrier are at least partially surrounded by at least one cured spray mass such that at least the at least one pressure-sensitive bending structure is exposed and the circuit carrier described here is designed to be flexible.
  • the microelectronic component can be easily arranged, plugged in or in contact with the flexible circuit carrier.
  • further components can be arranged on a side of the circuit carrier opposite the micromechanical component, for example clamping contacts, on the flexible circuit carrier.
  • the clamping contacts can be provided for arranging the micromechanical pressure sensor device in a housing, in particular a plastic housing.
  • the present invention relates to a method for producing the micromechanical pressure sensor device.
  • step A of the method a micromechanical component with at least one pressure-sensitive
  • step B of the method the microelectronic component and / or the circuit carrier are at least partially surrounded by at least one injection molding compound before or after the arrangement of the micromechanical component on the mounting surface of the circuit carrier.
  • the at least one pressure-sensitive bending structure is at least partially kept free during encapsulation with the at least one injection molding compound, and the micromechanical component is arranged on the flexibly formed circuit carrier. That is, if the micromechanical component and the circuit carrier are surrounded by the at least one injection molding compound, the at least one pressure-sensitive bending structure or membrane is at least partially kept free by the at least one injection molding compound.
  • the pressure-sensitive bending structure can be completely free of the at least one injection molding compound.
  • the circuit carrier is a foil with an integrated conductor pattern structure.
  • electronic components in particular the micromechanical component, can be simply arranged on the circuit carrier on the circuit carrier.
  • the components to be integrated are arranged by mounting and connection technologies in and / or on the flexible circuit carrier formed tracks. Examples of assembly and connection technologies are in particular gluing, soldering, flip chip mounting or wire bonding.
  • the circuit carrier comprises an application-specific integrated circuit.
  • Application specific integrated circuit can be understood as an ASIC.
  • an application-specific micromechanical pressure sensor device can be provided in a simple manner.
  • micromechanical component arranged micromechanical component.
  • flip-chip mounting the micromechanical component is easy on the
  • Plug in, connect or contact the application-specific integrated circuit is an electrical
  • the hardened injection composition described here can be inexpensively and simply attached to the microelectronic component and / or the circuit carrier. In other words, by means of the here described
  • Circuit carrier be largely surrounded or encapsulated.
  • the micromechanical pressure sensor device can in particular be mechanically stabilized.
  • additional mechanical functionality for example by
  • Fasteners are added to or in the cured spray mass.
  • thermoset Spray mass a thermoset. This type of polymer material can be combined particularly well with the injection molding process.
  • Pressure sensor device to a housing realized by an injection molding tool.
  • a later form of the micromechanical pressure sensor device can be produced simply and inexpensively.
  • the partial surrounding of the microelectronic component and / or of the circuit carrier takes place before or after arranging the micromechanical component with the at least one injection molding compound by injection molding.
  • injection molding can be a later form or geometric configuration of the cured
  • Spray mass of the micromechanical pressure sensor device by a corresponding injection molding tool simply predetermine.
  • Injection molding tool may in particular be designed such that the micromechanical pressure sensor device can be inserted easily into the housing, in particular into the plastic housing.
  • micromechanical pressure sensor device described here can be produced inexpensively, in particular in an integrated Reel to Reel (abbreviated: R2 R) production line.
  • Pressure sensor device are also disclosed for the corresponding manufacturing method and vice versa.
  • Figure 1 is a schematic plan view for explaining a
  • micromechanical pressure sensor device according to a first embodiment of the present invention
  • FIG. 2 is a schematic cross-sectional view for explaining a micromechanical pressure sensor device according to the first embodiment of the present invention
  • FIG. 3 shows a flowchart for explaining a method for producing a micromechanical pressure sensor device according to an embodiment of the invention.
  • Figure 4 is a schematic cross-sectional view for explaining the
  • FIG. 1 is a schematic plan view for explaining a micromechanical pressure sensor apparatus according to a first embodiment
  • reference numeral 100 denotes a micromechanical
  • the micromechanical pressure sensor device 100 comprises a circuit carrier 10.
  • the circuit carrier 10 has a flexible design.
  • the circuit carrier 10 may be formed in particular as a film Fl having an integrated circuit pattern structure comprising contact pads PI and lines LI or circuits.
  • the micromechanical pressure sensor device 100 further comprises a micromechanical component 10, wherein the micromechanical component 20 is arranged on a mounting surface 11 of the circuit substrate 10 and at least one pressure-sensitive bending structure 15 is formed on the micromechanical component 20, wherein the microelectronic component 20 and / or the
  • Circuit carrier 10 at least partially with at least one
  • FIG. 2 is a schematic cross-sectional view for explaining a micromechanical pressure sensor device according to the first embodiment of the present invention.
  • FIG. 2 is based on the micromechanical illustrated in FIG.
  • the micromechanical component 20 is arranged on the mounting surface 11 of the circuit carrier 10, wherein the micromechanical component 20 has the at least one pressure-sensitive
  • Bending structure 15 is formed.
  • FIG. 2 shows the at least one hardened spray mass 30, the at least one hardened spray mass 30 surrounding or enclosing the microelectronic component 20 and / or the circuit carrier 10 in such a way that at least the pressure-sensitive bending structure 15 is exposed and the circuit carrier 10 is flexible ,
  • the at least one hardened spray mass 30 protects the components mentioned here, for example the contact pads PI and the lines LI, of the flexible one
  • the circuit carrier 10 may include an application-specific integrated circuit 17, which may be arranged, for example, between the circuit carrier 10 and the micromechanical component 20.
  • FIG. 3 is a flow chart for explaining a method of manufacturing a micromechanical pressure sensor device according to an embodiment of the invention.
  • step A the micromechanical component 20 with the at least one pressure-sensitive bending structure 15 is applied to the mounting surface 11 of FIG.
  • Circuit carrier 10 is arranged.
  • the microelectronic component 20 and / or the circuit carrier 10 is at least partially surrounded by the at least one injection molding compound 30 before or after arranging the micromechanical component 20 on the mounting surface 11 of the circuit substrate 10.
  • Spray mass 30 the at least one pressure-sensitive bending structure 15 of the at least one injection molding compound 30 at least partially kept and the micromechanical component 20 is formed on the flexible
  • Circuit board 10 is arranged.
  • FIG. 4 is a schematic cross-sectional view for explaining the method step B.
  • FIG. 4 schematically shows an injection molding tool Wl.
  • Injection molding tool Wl is designed such that during the
  • the at least one pressure-sensitive bending structure 15 of the at least one spray mass 30 is at least partially kept free.
  • the injection molding tool Wl may be formed such that the microelectronic component 20 after the at least partially surrounding the circuit substrate 10 with the at least one injection molding compound 30 on the
  • Circuit carrier 10 is arranged. In other words, that rejects
  • Circuit substrate 10 after surrounding, enclosing or encapsulation on a recess in which the micromechanical component 10 can be arranged or mounted on the flexibly formed circuit carrier 10.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

La présente invention concerne un dispositif capteur de pression micromécanique et un procédé de fabrication correspondant. Ce dispositif capteur de pression micromécanique comprend un support de circuit et un composant micromécanique, le composant micromécanique étant disposé sur une surface de montage du support de circuit, et au moins une structure de flexion ou une membrane sensible à la pression étant formée sur le composant micromécanique. En outre, le composant microélectronique et/ou le support de circuit sont entourés, au moins par endroits, d'au moins une matière injectée durcie de telle sorte qu'au moins ladite au moins une structure de flexion sensible à la pression est dégagée au moins par endroits, le support de circuit étant conçu de manière flexible.
PCT/EP2017/074831 2016-10-14 2017-09-29 Dispositif capteur de pression micromécanique et procédé de fabrication correspondant Ceased WO2018069068A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201780063438.6A CN109843789A (zh) 2016-10-14 2017-09-29 微机械的压力传感器装置和用于制造微机械的压力传感器装置的相应的方法
EP17778255.4A EP3526159A1 (fr) 2016-10-14 2017-09-29 Dispositif capteur de pression micromécanique et procédé de fabrication correspondant

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016220055.0A DE102016220055A1 (de) 2016-10-14 2016-10-14 Mikromechanische Drucksensorvorrichtung und entsprechendes Verfahren zum Herstellen einer mikromechanischen Drucksensorvorrichtung
DE102016220055.0 2016-10-14

Publications (1)

Publication Number Publication Date
WO2018069068A1 true WO2018069068A1 (fr) 2018-04-19

Family

ID=60009614

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2017/074831 Ceased WO2018069068A1 (fr) 2016-10-14 2017-09-29 Dispositif capteur de pression micromécanique et procédé de fabrication correspondant

Country Status (4)

Country Link
EP (1) EP3526159A1 (fr)
CN (1) CN109843789A (fr)
DE (1) DE102016220055A1 (fr)
WO (1) WO2018069068A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022201160A1 (de) * 2022-02-03 2023-08-03 Robert Bosch Gesellschaft mit beschränkter Haftung Montagevorrichtung für ein Gehäuse sowie Herstellungsverfahren

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003005784A2 (fr) 2001-07-05 2003-01-16 Lpkf Laser & Electronics Ag Structures de traces conducteurs et procede permettant de les produire
DE102011004577A1 (de) * 2011-02-23 2012-08-23 Robert Bosch Gmbh Bauelementträger und Bauteil mit einem MEMS-Bauelement auf einem solchen Bauelementträger
DE102014200512A1 (de) * 2014-01-14 2015-07-16 Robert Bosch Gmbh Mikromechanische Drucksensorvorrichtung und entsprechendes Herstellungsverfahren

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007060931A1 (de) * 2006-12-21 2008-08-28 Continental Teves Ag & Co. Ohg Verkapselungsmodul, Verfahren zu dessen Herstellung und Verwendung
JP5045769B2 (ja) * 2009-03-04 2012-10-10 株式会社デンソー センサ装置の製造方法
TWI538113B (zh) * 2014-02-14 2016-06-11 南茂科技股份有限公司 微機電晶片封裝及其製造方法
US20160282212A1 (en) * 2015-03-25 2016-09-29 Infineon Technologies Ag Molded semiconductor package having enhanced local adhesion characteristics

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003005784A2 (fr) 2001-07-05 2003-01-16 Lpkf Laser & Electronics Ag Structures de traces conducteurs et procede permettant de les produire
DE102011004577A1 (de) * 2011-02-23 2012-08-23 Robert Bosch Gmbh Bauelementträger und Bauteil mit einem MEMS-Bauelement auf einem solchen Bauelementträger
DE102014200512A1 (de) * 2014-01-14 2015-07-16 Robert Bosch Gmbh Mikromechanische Drucksensorvorrichtung und entsprechendes Herstellungsverfahren

Also Published As

Publication number Publication date
EP3526159A1 (fr) 2019-08-21
DE102016220055A1 (de) 2018-04-19
CN109843789A (zh) 2019-06-04

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